JP2015153807A - Component transfer device and component soldering method using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component transfer device which properly performs soldering while accurately setting a position of a component, and to provide a component soldering method using the component transfer device.SOLUTION: A component transfer device 1 transfers a component 40 on a circuit board 45 with a movable arm 10 and includes: a holding part 20 which is provided at the movable arm 10 and holds the component 40; and a spray port 31 which is provided near the holding part 20 of the movable arm 10 and sprays a reduction gas so that at least a part of the reduction gas flows toward the circuit board 45.

Description

  The present invention relates to a component conveying device used in a soldering apparatus for soldering a component to a circuit board, and a component soldering method using the same.

  The mounting board in which the electronic component is soldered on the circuit board is manufactured by soldering the electronic component on the circuit board on which the circuit pattern is formed. One of these electronic components is a chip-type component. Generally, in order to solder a chip-type component, first, the chip-type component is arranged on the circuit board in a state where the solder is arranged on the terminal of the circuit board or the terminal of the chip-type component. Thereafter, the circuit board on which the chip-type components are arranged is passed through a reflow furnace, and the chip-type parts are soldered onto the circuit board.

  At this time, if the terminals and solder of the circuit board are oxidized, the solder wettability of the terminals of the circuit board is poor, and the chip-type component and the circuit board may not be properly soldered. For this reason, a technique has been proposed in which soldering is performed by reducing a terminal or solder oxide film.

  Patent Document 1 below describes a solder reflow apparatus that performs such soldering. In this solder reflow apparatus, a reducing chemical solution is sprayed into a heated reflow furnace and nitrogen gas is supplied. An oxide film such as solder is reduced by the reducing chemical solution.

JP2011-134894A

  By the way, there is a flip chip type component in which solder bumps are formed on the side arranged on the circuit board. Flip chip type parts are close to each other in solder bumps, and precise positioning is required for soldering. However, even when the flip chip type component is arranged at an accurate position on the circuit board, when the solder reflow furnace is passed as described in Patent Document 1, the solder is melted to cause the flip chip type component to be melted. The position holding force is reduced, and the position of the flip chip type component may be shifted.

  For this reason, when soldering a flip chip type component, the flip chip type component is held on the circuit board by a component conveying device that conveys the flip chip type component onto the circuit board. In this case, since the circuit board cannot be passed through the solder reflow furnace while holding the flip chip type component in the component conveying device, the circuit board is heated by the heater while the flip chip type component is held by the component conveying device. Perform soldering.

  In the component conveying device, an arm moves between a tray or conveyor on which components are arranged and a circuit board, catches the components on the tray or conveyor, and conveys them onto the circuit board. Therefore, the place where the circuit board is disposed cannot be a closed space, and it is difficult to spray the reducing chemical solution as described above. For this reason, even when mounting a chip component that requires precise positioning, such as a flip-chip type component, a technique that can appropriately perform soldering by removing an oxide film such as solder is required. .

  SUMMARY OF THE INVENTION An object of the present invention is to provide a component conveying apparatus capable of performing appropriate soldering in a state where the position of the component is accurately determined, and a component soldering method using the component conveying device.

  In order to solve the above-described problems, the present invention provides a component conveying apparatus that conveys a component onto a circuit board by a movable arm, the holding unit being provided on the movable arm and holding the component, and the movable arm. And a spraying port through which the reducing gas is sprayed so that at least a part of the reducing gas is directed toward the circuit board.

  Since the component transport device holds the component by the holding unit, it can continue to hold the component even after the component placed on the tray or the like is transported by the movable arm and placed on the circuit board. Therefore, the position of the component can be accurately determined even when the circuit board is heated and the solder that connects the substrate and the component is melted. Further, a spray port is provided in the movable arm. Thereby, the reducing gas can be sprayed toward the circuit board immediately before the parts are arranged on the circuit board or in a state where the parts arranged on the circuit board are held. The reducing gas sprayed toward the circuit board drifts around the circuit board. Therefore, the oxide film on the circuit board and the oxide film on the solder surface connecting the circuit board and the components can be reduced without setting the entire apparatus to a reducing gas atmosphere. This solder may be disposed on a circuit board or a component. When the circuit board is heated and the solder is melted, the oxide film formed on the surface of the melted solder is reduced. Since the oxide film can be removed in this way, soldering can be performed appropriately.

  Moreover, it is preferable that the said holding | maintenance part has a suction port which hold | maintains the said component by attracting | sucking the said component.

  The airflow toward the component holding part can be easily flowed by the suction by the suction port. Therefore, a part of the reducing gas sprayed toward the circuit board is more likely to drift in the vicinity of the component held by the component holding unit. For this reason, an oxide film such as solder can be reduced more efficiently.

  Moreover, it is preferable that the said suction port is provided in the said circuit board side rather than the said spraying port. Or it is preferable that the said suction port and the said spraying port are provided in the same plane in the surface parallel to the surface where the said components of the said circuit board are arrange | positioned.

  By providing the suction port and the spray port in the positional relationship as described above, the spray port can be used when holding the component from a tray or the like or when placing the component on the circuit board, even if the component is thin. It can prevent that the site | part formed is obstructive.

  Or it is preferable that the said spraying opening is provided in the said circuit board side rather than the said suction opening.

  By providing the spray port in this manner, the reducing gas can be sprayed from a place closer to the connection portion between the component and the circuit board. Therefore, the oxide film can be reduced more appropriately.

  Moreover, it is preferable that the said spraying opening opens in the direction away from the said holding | maintenance part.

  By forming the spray port in this way, the reducing gas can be sprayed in the direction away from the holding portion while being sprayed in the direction toward the circuit board, and the air in the vicinity of the connection portion between the component and the circuit board can be sprayed. Can be reduced by the flow of reducing gas. As the air in the vicinity of the connection portion decreases in this way, reducing gas tends to drift near the connection portion. Therefore, the site to be reduced can be prevented from oxidizing again.

  Or it is preferable that the said spraying opening opens in the direction which approaches the said holding | maintenance part.

  By forming the spray port in this way, the reducing gas can be sprayed in the direction approaching the holding part while spraying in the direction toward the circuit board, and the vicinity of the connection part between the component and the circuit board can be concentrated. A high reducing gas atmosphere can be obtained. Therefore, the oxide film can be removed more quickly.

  Moreover, it is preferable to further provide a frame portion that surrounds the spray port and a portion where the component held by the holding portion is to be located.

  With such a frame portion, the concentration of the reducing gas in the frame can be increased. Therefore, the oxide film can be removed more quickly.

  Moreover, it is preferable that the said spraying port sprays inert gas with the said reducing gas.

  The inert gas can reduce the air in the vicinity of the connection between the component and the circuit board. Therefore, the site to be reduced can be prevented from oxidizing again.

  Moreover, it is preferable to further comprise a heater for heating the reducing gas, and the reducing gas is sprayed in a state heated by the heater.

  The reduction reaction time can be shortened by heating the reducing gas. Moreover, it can suppress that the temperature of a circuit board falls at the time of soldering, or the melted solder solidifies unreasonably.

  The component soldering method of the present invention includes a conveying step of conveying the component by holding the component by a holding portion provided in a movable arm of the component conveying device, and arranging the component on a circuit board and An arrangement step for maintaining the state in which the holding unit holds the component, and in a state in which the component on the circuit board is held by the holding unit, at least a part of the reducing gas is directed to the circuit board. A spraying step of spraying the reducing gas from a spray port provided in the movable arm, and soldering for soldering the component and the circuit board in a state where the component on the circuit board is held by the holding unit And a step.

  According to such a component soldering method, since the soldering is performed in a state where the component arranged on the circuit board is held, even in a state where the solder for connecting the circuit board and the component is melted, The position can be determined accurately. In addition, since the reducing gas is sprayed toward the circuit board from the spray port provided in the movable arm in a state where the components are held on the circuit board, the entire apparatus can be placed on the circuit board without using a reducing gas atmosphere. The oxide film of the solder which connects an oxide film or a circuit board and components can be reduced. Therefore, appropriate soldering can be performed.

  In addition, according to another method of soldering a component of the present invention, a conveyance step of conveying the component by holding the component by a holding portion provided on a movable arm of the component conveyance device, and a circuit board and the component are separated. A spraying step of spraying the reducing gas from a spraying port provided in the movable arm so that at least a part of the reducing gas is directed to the circuit board when the distance is equal to or less than a predetermined distance; Placing the component on the circuit board and maintaining the state in which the holding unit holds the component, and soldering the component and the circuit board in a state in which the component on the circuit board is held by the holding unit. And a soldering step for attaching.

  In this component soldering method, reducing gas is sprayed before the component is placed on the circuit board. Therefore, it is possible to remove the oxide film at a portion that is not exposed after a part such as a contact portion between the solder and the circuit board is arranged on the circuit board.

  Further, the apparatus further includes a stop step of temporarily stopping the conveyance of the component in a state where the predetermined distance is between the component held by the holding unit and the circuit board. The spraying step is preferably performed.

  By spraying the reducing gas in the stopped state as described above, the reducing gas atmosphere can be more appropriately formed between the component and the circuit board. Therefore, it is possible to more appropriately reduce the oxide film at a portion that is not exposed after the component is placed on the circuit board.

  Moreover, it is good also as performing the said spraying step until after the said components are arrange | positioned on the said circuit board.

  By spraying the reducing gas until after the components are arranged on the circuit board, the reducing gas can be sprayed from a position closer to the circuit board. Therefore, the oxide film formed on the terminal of the circuit board can be removed more efficiently.

  Moreover, it is preferable that at least a part of the spraying step and at least a part of the soldering step are simultaneously performed.

  By spraying the reducing gas even during the soldering step, the melted oxide film of the solder can be more appropriately removed. Moreover, since the temperature is such that the solder melts, the time for the reduction reaction can be shortened and the oxide film can be efficiently removed. Further, since the soldering and the reduction of the oxide film are performed at the same time, the parts can be soldered efficiently.

  Alternatively, the spraying step may be terminated before the arranging step. Depending on the type of reducing gas and the state of the oxide film, it may be possible to sufficiently remove the oxide film simply by spraying the reducing gas before placing the components. Therefore, in such a case, the reducing gas can be efficiently used without spraying the reducing gas until after the parts are arranged.

  In addition, it is preferable that the circuit board is heated before the component is arranged on the circuit board until halfway through the soldering step.

  By heating the circuit board before component placement, the time required for the solder to start melting in the soldering step can be shortened. Further, since the substrate is heated when the oxide film is reduced by the sprayed reducing gas, at least the oxide film formed on the terminal on the substrate can be efficiently reduced.

  As described above, according to the present invention, it is possible to provide a component conveying apparatus capable of performing appropriate soldering in a state where the position of the component is accurately determined, and a component soldering method using the component conveying device. .

It is a figure which shows the components conveying apparatus which concerns on 1st Embodiment of this invention. It is a figure which shows the mode of the front-end | tip of the movable arm of FIG. It is a flowchart which shows the 1st procedure of the soldering method of the components of this invention. It is a figure which shows the mode of a conveyance step. It is a figure which shows the mode of a spraying step. It is a flowchart which shows the 2nd procedure of the soldering method of the components of this invention. It is a figure which shows the mode of a spraying step. It is a figure which shows the mode of the holding | maintenance part periphery of the components conveying apparatus which concerns on 2nd Embodiment of this invention, and the mode of the reducing gas sprayed. It is a figure which shows the mode of the holding | maintenance part periphery of the components conveying apparatus which concerns on 3rd Embodiment of this invention, and the mode of the reducing gas sprayed. It is a figure which shows the mode of the holding | maintenance part periphery of the components conveying apparatus which concerns on 4th Embodiment of this invention, and the mode of the reducing gas sprayed. It is a figure which shows the mode of the holding | maintenance part periphery of the components conveying apparatus which concerns on 5th Embodiment of this invention, and the mode of the reducing gas sprayed.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, a preferred embodiment of a component conveying device according to the invention and a method of soldering components using the same will be described in detail with reference to the drawings.

(First embodiment)
FIG. 1 is a diagram illustrating a component conveying apparatus according to a first embodiment of the present invention. As shown in FIG. 1, the component conveying apparatus 1 of this embodiment includes a movable arm 10, a drive unit 51, a guide 52, a suction pump SP, a reducing gas supply unit RG, and an inert gas supply unit IG. And a heater 53 as main components.

  The movable arm 10 has a columnar appearance and extends in the vertical direction, and has a plurality of through holes provided along the longitudinal direction inside as described later. The movable arm 10 is connected to the drive unit 51 and is movable along the vertical direction. The movement of the movable arm 10 is performed by a mechanism (not shown) in the drive unit 51. The drive unit 51 is connected to a guide 52 that extends in the horizontal direction, and can be moved along the guide 52 by a mechanism (not shown) that is different from the mechanism that moves the movable arm in the drive unit 51. ing. Therefore, the distal end portion of the movable arm 10 can be moved in the vertical direction and the horizontal direction by the movement of the movable arm 10 and the movement of the driving unit 51 and can be moved two-dimensionally.

  The suction pump SP is connected to the suction pipe 22P, and can switch between a suction state in which the gas in the suction pipe 22P is sucked and a non-suction state in which suction is not performed. The suction tube 22P is connected to one of the through holes in the movable arm 10 as will be described later.

  The reducing gas supply unit RG is a part that supplies the reducing gas, and can switch between a supply state in which the reducing gas is supplied and a non-supply state in which the reducing gas is not supplied. Moreover, the inert gas supply part IG is a site | part which supplies an inert gas, and can switch the supply state which supplies an inert gas, and the non-supply state which does not supply an inert gas. The reducing gas supply unit RG and the inert gas supply unit IG are connected to the supply pipe 32P, and the reducing gas and the inert gas are supplied into the supply pipe 32P.

  Examples of the reducing gas include carboxylic acids (formic acid, acetic acid, acrylic acid, propionic acid, butyric acid, valeric acid, caproic acid, enanthic acid, caprylic acid, pelargonic acid, capric acid, lauric acid, myristic acid, palmitic acid. , Margaric acid, stearic acid, oleic acid, linoleic acid, linolenic acid, arachidonic acid, docosahexaenoic acid, britic acid, valetic acid, oxalic acid, malonic acid, succinic acid, benzoic acid, phthalic acid, isophthalic acid, terephthalic acid, salicylic acid , Gallic acid, melicic acid, cinnamic acid, pyruvic acid, lactic acid, capric acid, malic acid, citric acid, fumaric acid, maleic acid, aconitic acid, glutaric acid, adipic acid, nitrocarboxylic acid) be able to. Moreover, as inert gas, nitrogen gas and argon gas can be mentioned, for example.

  The heater 53 is provided so as to heat the supply pipe 32P. Therefore, when the heater 53 is in the ON state, the reducing gas and the inert gas flowing through the supply pipe 32P are heated. The temperature at which the heater 53 heats the reducing gas and the inert gas is preferably set to a temperature at which the reducing gas can reduce the metal oxide film most quickly.

  FIG. 2 is a diagram illustrating a state of the distal end of the movable arm 10 of FIG. Specifically, it is a diagram showing a state where the movable arm 10 holds the component 40. The component 40 held in this example is a flip chip component, and has a component main body 41 and a solder bump 42 formed on the lower surface of the component main body 41.

  As shown in FIG. 2, a plurality of through holes are formed in the movable arm 10 along the longitudinal direction of the movable arm 10. Among these through holes, the central through hole is a suction hole 22, and the opening of the suction hole 22 at the tip of the movable arm 10 is a suction port 21. The suction hole 22 is connected to the suction tube 22P. Therefore, the movable arm 10 can suck the gas in the vicinity of the distal end of the movable arm 10 from the suction port 21 by setting the suction pump SP to the suction state. As shown in FIG. 2, the movable arm 10 uses the suction force to suck the component 40 through the suction port 21, attracts the component 40 to the distal end surface 11 of the movable arm 10, and holds the component 40. be able to. Therefore, in the present embodiment, the holding portion 20 is a portion where the parts on the suction port 21 and the tip surface 11 of the movable arm 10 are to be adsorbed.

  A pair of through holes formed so as to sandwich the suction hole 22 is a supply hole 32, and an opening at the tip of the movable arm 10 of the supply hole 32 is a spray port 31. Each supply hole 32 is connected to a supply pipe 32P shown in FIG. Therefore, the movable arm 10 can spray the mixed gas of the reducing gas and the inert gas from the spray port 31 by setting the reducing gas supply unit RG and the inert gas supply unit IG to the supply state. Further, each spray port 31 is formed at a position away from the portion where the holding portion 20 should hold the component 40. Therefore, the movable arm 10 can spray the mixed gas of the reducing gas and the inert gas from the spray port 31 in a state where the holding unit 20 holds the component 40. Further, in the present embodiment, each spray port 31 is formed flush with a surface perpendicular to the direction in which the suction port 21 sucks the component 40.

  Next, a component soldering method using the component conveying apparatus 1 will be described.

<< First procedure for soldering parts >>
First, the first procedure of the component soldering method in this embodiment will be described. FIG. 3 is a flowchart showing a first procedure of the component soldering method of the present embodiment. As shown in FIG. 3, the method includes a transport step S11, an arrangement step S12, a spraying step S13, and a soldering step S14.

<Conveyance step S11>
FIG. 4 is a diagram illustrating the state of the transport step. As shown in FIG. 4, a soldering box 70 in which the circuit board 45 is arranged and a tray 61 in which a plurality of components 40 are arranged are arranged in the movable range of the movable arm 10.

  The soldering box 70 is surrounded by the side wall 71 in the lateral direction, and a part of the upper part is covered with the upper wall 72. And a part of upper side is opening. A heater 77 is provided in the soldering box 70, and the circuit board 45 is disposed on the heater 77. Since the upper wall 72 is open above the circuit board 45, the circuit board 45 can be viewed in the vertical direction from the opening. The circuit board 45 is arranged such that the surface on which the component 40 is arranged is perpendicular to the longitudinal direction of the movable arm 10. Accordingly, the suction port 21 sucks and holds the component 40 in a direction perpendicular to the surface on which the component 40 of the circuit board 45 is disposed.

  As indicated by a broken line in FIG. 4, the drive unit 51 moves to above the component 40 that is arranged on the tray 61 and is to be held and stops. Next, the movable arm 10 moves downward and stops when the distance between the upper surface of the component 40 and the tip of the movable arm 10 becomes a predetermined distance or less. The predetermined distance is preferably as small as possible, and is a distance at which the component 40 can be sucked by the suction force from the suction port 21. Next, the suction pump SP starts suction, and the component 40 is held by the holding unit 20 by the suction force of the suction port 21. Next, the movable arm 10 moves upward while holding the component 40. When the movable arm 10 moves up to a predetermined position, the drive unit 51 moves horizontally and stops above the position where the component 40 should be placed on the circuit board 45. Then, the movable arm 10 moves downward.

  In this way, the component 40 is conveyed by the movable arm 10.

<Arrangement step S12>
As the movable arm 10 moves downward, the solder bumps 42 of the component 40 are arranged on terminals (not shown) on the circuit board 45, and the movable arm 10 stops. In this way, the component 40 is disposed on the circuit board 45. Thereafter, the movable arm 10 maintains the state where the component 40 is held.

  In the present embodiment, since each spray port 31 is formed flush with the suction port 21 as described above, the spray port 31 is formed even if the component 40 is a low-profile component with a small thickness. Therefore, the component 40 can be appropriately arranged on the circuit board 45 without obstructing the component arrangement.

<Spraying step S13>
FIG. 5 is a diagram showing the state of the spraying step S13. When the component 40 is disposed on the circuit board 45, the reducing gas is supplied from the inert gas supply unit IG and the inert gas is supplied from the reducing gas supply unit RG. For this reason, as shown by a solid line arrow in FIG. 5, a mixed gas of reducing gas and inert gas is sprayed from the spray port 31. At least a part of the mixed gas is sprayed toward the circuit board 45. In this way, the spray port 31 is preferably provided in the vicinity of the holding unit 20 so that the mixed gas can be sprayed. By spraying the inert gas, the oxygen concentration in the soldering box 70 can be lowered as compared with the case where the inert gas is not sprayed. Then, by spraying the reducing gas, at least a part of the oxide film formed on the solder bumps 42 of the component 40 and at least the oxide film formed on the terminal (not shown) on the circuit board 45. Part is reduced.

  At this time, the inside of the soldering box 70 is preferably heated. For example, a mixed gas of reducing gas and inert gas is preferably heated and sprayed by the heater 53. Alternatively, it may be heated by a heater 77 or a heater (not shown) provided on the side wall 71.

For example, when formic acid is used as the reducing gas, the temperature in the soldering box 70 is preferably 150 degrees or higher. In this case, the following reaction is likely to occur.
MeO + 2HCOOH → Me (COOH) ₂ + H ₂ O
(However, Me represents a metal element.)
Furthermore, when the temperature in the soldering box is set to 200 ° C. or higher, the following reaction easily occurs.
Me (COOH) ₂ → Me + CO ₂ + H ₂
H ₂ + MeO → Me + H ₂ O
Thus, the oxide film is reduced. Further, even when a reducing gas that does not require heating is used for reduction, the reducing reaction time is reduced by heating the reducing gas or heating the interior of the soldering box 70 using a heater. Can be shortened. However, it is not essential that the inside of the soldering box 70 is heated. Therefore, heating of the mixed gas by the heater 53 is not essential.

  In this embodiment, since the soldering box 70 is provided with the upper wall 72 as described above, the sprayed reducing gas and inert gas tend to stay in the soldering box 70. Further, since the holding unit 20 holds the component 40 by suction, the gas around the holding unit 20 tends to flow toward the suction port 21 by the suction. Therefore, the sprayed reducing gas tends to drift around the part 40 held by the holding unit 20.

<Soldering step S14>
When the component 40 is disposed at a predetermined position on the circuit board 45, the heater 77 heats the circuit board 45. The solder bumps 42 of the component 40 are melted by the heat of the circuit board 45, and solder is connected to terminals (not shown) of the circuit board 45. At this time, since the periphery of the solder is a mixed gas atmosphere of a reducing gas and an inert gas, the melted oxide film of the solder is reduced. Since the solder is heated in this state, the reduction reaction of the oxide film of the solder is performed in a shorter time than in the state where the solder is not melted. Thereafter, the heating by the heater 77 is completed, the solder is solidified, and the component 40 is soldered onto the circuit board 45.

  The heating of the circuit board 45 for soldering is preferably performed before the component 40 is disposed on the circuit board 45. By heating the circuit board 45 in advance, the time required for the solder to start melting in the soldering step S14 can be shortened. Further, when the oxide film is reduced by the sprayed reducing gas, the circuit board 45 is already heated. Thereby, the oxide film formed on the terminal on the circuit board 45 can be efficiently reduced. Moreover, the reduction reaction can be accelerated | stimulated because the inside of the soldering box 70 is heated by the heater 77 as mentioned above.

  In addition, it is preferable that at least a part of the spraying step S13 and at least a part of the soldering step S14 are simultaneously performed by performing the spraying step S13 at least halfway through the soldering step S14. Even during the soldering step S14, the reducing gas is sprayed, so that the oxide film of the molten solder can be more appropriately removed. In addition, since the solder is in a heated state, the reduction reaction time can be shortened and the oxide film can be efficiently removed.

  Even when the heating to the circuit board 45 is performed before the component 40 is disposed on the circuit board 45, or even when the spraying step S13 is performed at least halfway through the soldering step S14, the heater 53 is used. It is preferable that the mixed gas of the reducing gas and the inert gas is heated. By heating the gas, it is possible to suppress the temperature of the circuit board 45 from being lowered during soldering, and the molten solder from being solidified improperly.

  According to the soldering method of the component 40 according to such a procedure using the component conveying apparatus 1, since the soldering is performed in a state where the component 40 arranged on the circuit board 45 is held, the circuit board 45 and the component 40 are connected to each other. Even in the state where the solder to be connected is melted, the position of the component 40 can be accurately determined. Further, since the reducing gas is sprayed toward the circuit board 45 from the spray port 31 provided in the movable arm 10 in a state where the component 40 is held on the circuit board 45, the entire apparatus is not required to be in a reducing gas atmosphere. The oxide film on the circuit board 45 and the oxide film of the solder can be reduced. Therefore, appropriate soldering can be performed.

<< Second procedure for soldering parts >>
Next, a second procedure of the component soldering method according to this embodiment will be described. In addition, about the component which is the same as that of a 1st procedure, or the equivalent, unless otherwise demonstrated, the same referential mark is attached | subjected and the overlapping description is abbreviate | omitted.

  FIG. 6 is a flowchart showing a second procedure of the component soldering method of the present embodiment. As shown in FIG. 6, the method includes a transport step S21, a stop step S22, a spraying step S23, an arrangement step S24, and a soldering step S25. Also in this procedure, as in the first procedure, the component 40 on the tray 61 is soldered onto the circuit board 45 by using the component conveying apparatus 1 as shown in FIG.

<Conveyance step S21>
The transport step S21 of this procedure is performed in the same manner as the transport step S11 of the first procedure, except that a stop step S22 described later is performed on the way.

<Stop step S22>
In the middle of the conveyance step S21, the conveyance of the component 40 is temporarily stopped in a state where the distance between the component 40 held by the holding unit 20 and the circuit board 45 is a predetermined distance. This stop position is, for example, a position where the spray port 31 enters the soldering box 70.

<Spraying step S23>
FIG. 7 is a diagram showing the state of the spraying step of this procedure. As shown in FIG. 7, this step is started in a state where the component 40 is stopped at a predetermined distance from the circuit board 45 in the stop step S22. The spraying step S23 of this procedure is performed in the same manner as the spraying step S13 of the first procedure, except that the component 40 is not placed on the circuit board 45. Therefore, a mixed gas of at least a part of the reducing gas and the inert gas is sprayed on the circuit board 45 as shown by solid line arrows in FIG. As a result, the oxygen concentration in the soldering box 70 decreases, and an atmosphere of reducing gas and inert gas is obtained. Therefore, at least a part of the oxide film formed on the solder bumps 42 and the terminals of the circuit board is reduced. At this time, since the component 40 is not disposed on the circuit board 45, it contacts with an oxide film formed on a portion of the solder bump 42 that contacts the circuit board or a solder bump at a terminal (not shown) of the circuit board 45. At least a portion of the oxide film formed at the site is reduced and removed.

  In the soldering method according to this procedure, the inside of the soldering box 70 is preferably heated for the same reason as in the first procedure. Therefore, for example, it is preferable that the reducing gas heated by the heater 53 is sprayed or the inside of the soldering box 70 is heated by using a heater such as the heater 77.

<Arrangement step S24>
The arrangement step S24 of this procedure is performed in the same manner as the arrangement step S12 of the first procedure. That is, the spraying step S23 is performed during the stop step S22, the movable arm 10 moves downward again, the component 40 is disposed on the circuit board 45, and the movable arm 10 continues to hold the component 40.

<Soldering step S25>
The soldering step S25 of this procedure is performed in the same manner as the soldering step S14 of the first procedure, and the component 40 is soldered onto the circuit board 45.

  The heating of the circuit board 45 for soldering is preferably performed before the component 40 is placed on the circuit board 45 for the same reason as in the first procedure.

  Further, in this procedure, the spraying step S23 is performed during the stop step S22, but the spraying step S23 is preferably performed until after the stop step S22 is completed, and is performed until after the component 40 is disposed on the circuit board 45. It is preferable. By spraying the reducing gas until after the component 40 is disposed on the circuit board 45, the reducing gas can be sprayed from a position closer to the circuit board 45. Therefore, the oxide film formed on the terminal of the circuit board 45 can be removed more efficiently.

  In this case, for the same reason as in the first procedure, it is preferable that the spraying step S23 is performed at least halfway through the soldering step S25 in this procedure.

  The spraying step S23 may be ended before the arranging step S24. Depending on the type of reducing gas and the state of the oxide film, the oxide film may be sufficiently removed by spraying the reducing gas before the component 40 is placed on the circuit board 45 in some cases. In this case, the reducing gas can be efficiently used by not spraying the reducing gas until after the component 40 is disposed on the circuit board 45.

  According to the soldering method of the component 40 according to the procedure of this procedure using the component conveying apparatus 1, the soldering can be appropriately performed in a state where the position of the component 40 is accurately determined as in the first procedure. it can. In addition, since the reducing gas is sprayed before the component 40 is placed on the circuit board 45, after the component 40 such as a contact portion between the solder bump 42 and the circuit board 45 is placed on the circuit board 45. Can remove the oxide film at the unexposed portion.

  In this procedure, the movable arm 10 is temporarily stopped in the stop step S22. However, the stop step S22 is not always necessary. For example, the holding unit 20 is moving while the movable arm 10 is moving downward. The spraying step S23 may be performed in a state where the distance between the component 40 held on the circuit board 45 and the circuit board 45 is a predetermined distance. In this case as well, the spraying step S23 is preferably performed until after the component 40 is disposed on the circuit board 45, and is preferably performed at least halfway through the soldering step S25. Or spraying step S23 is good also as ending before arrangement step S24.

(Second Embodiment)
Next, a second embodiment of the present invention will be described in detail with reference to FIG. In addition, about the component which is the same as that of 1st Embodiment, or equivalent, except the case where it demonstrates especially, the same referential mark is attached | subjected and the overlapping description is abbreviate | omitted.

  FIG. 8 is a diagram illustrating a state around the holding unit and a state of the reducing gas sprayed in the component conveying device according to the present embodiment. FIG. 8 shows a state where the mixed gas of reducing gas and inert gas is sprayed in a state where the component 40 is disposed on the circuit board 45. As shown in FIG. 8, the component conveying device of the present embodiment is configured such that the tip of the movable arm 10 has a different shape from the tip of the movable arm 10 of the first embodiment. And different. Specifically, the spray port 31 in the movable arm 10 of the present embodiment is located closer to the circuit board 45 than the suction port 21.

  The component soldering method by the component conveying apparatus of this embodiment can be performed in the same manner as the first and second procedures of the component soldering method in the first embodiment.

  According to the component conveying apparatus of the present embodiment, the reducing gas can be sprayed from a place closer to the solder of the component 40 or the circuit board 45 by providing the spray port 31 at the protruding position as shown in FIG. it can. Therefore, compared with the case where the component conveying apparatus of 1st Embodiment is used, the oxide film of the terminal on the solder or the circuit board 45 can be reduced more appropriately.

(Third embodiment)
Next, a third embodiment of the present invention will be described in detail with reference to FIG. In addition, about the component which is the same as that of 1st Embodiment, or equivalent, except the case where it demonstrates especially, the same referential mark is attached | subjected and the overlapping description is abbreviate | omitted.

  FIG. 9 is a diagram illustrating a state around the holding unit and a state of the reducing gas sprayed in the component conveying device according to the present embodiment. FIG. 9 shows a state in which the mixed gas of reducing gas and inert gas is sprayed in a state where the component 40 is disposed on the circuit board 45. As shown in FIG. 9, in the component conveying apparatus of this embodiment, the movable arm 10 has a tapered shape at the tip, and the spray port 31 is formed at the tapered position. Different from the movable arm 10 of the embodiment. For this reason, the suction port 21 is located closer to the circuit board 45 than the spray port 31. The spray port 31 opens obliquely in a direction away from the holding unit 20 while facing the circuit board 45. For this reason, the mixed gas of the reducing gas and the inert gas sprayed from the spray port 31 flows in a direction away from the holding unit 20 while at least a part thereof faces the circuit board 45.

  The component soldering method by the component conveying apparatus of this embodiment can be performed in the same manner as the first and second procedures of the component soldering method in the first embodiment.

  According to the component transport device of this embodiment, the reducing gas can be sprayed in the direction toward the circuit board 45 and in the direction away from the holding unit 20, and the atmosphere in the vicinity of the connection part between the component 40 and the circuit board 45 can be sprayed. It can be reduced by the flow of reducing gas. As the air in the vicinity of the connection portion decreases in this way, reducing gas tends to drift near the connection portion. Therefore, the site to be reduced can be prevented from oxidizing again.

  Moreover, according to the component conveying apparatus of this embodiment, since the suction port 21 is provided on the circuit board 45 side with respect to the spray port 31, the spray port 31 can be used even if the component 40 is a low-profile component with a small thickness. The component 40 can be appropriately arranged on the circuit board 45 without the portion where the is formed interferes with the component arrangement.

  In the present embodiment, the spray port 31 opens obliquely in a direction away from the holding unit 20 while facing the circuit board 45. However, as long as at least a part of the reducing gas is sprayed toward the circuit board 45, the spray port 31 may open in a direction parallel to the surface on which the component 40 of the circuit board 45 is disposed.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described in detail with reference to FIG. In addition, about the component which is the same as that of 1st Embodiment, or equivalent, except the case where it demonstrates especially, the same referential mark is attached | subjected and the overlapping description is abbreviate | omitted.

  FIG. 10 is a diagram illustrating a state around the holding unit and a state of the reducing gas sprayed in the component conveying device according to the present embodiment. FIG. 10 shows a state where the mixed gas of reducing gas and inert gas is sprayed in a state where the component 40 is disposed on the circuit board 45. As shown in FIG. 10, the movable arm 10 in the component conveying device of the present embodiment is different from the movable arm 10 of the first embodiment in that the spray port 31 is located closer to the circuit board 45 than the suction port 21. Further, the spray port 31 is different from the movable arm 10 of the first embodiment in that the spray port 31 is opened in a direction approaching the holding unit. For this reason, the mixed gas of the reducing gas and the inert gas sprayed from the spray port 31 flows so as to approach the holding unit 20 while at least a part thereof is directed to the circuit board 45.

  The component soldering method by the component conveying apparatus of this embodiment can be performed in the same manner as the first and second procedures of the component soldering method in the first embodiment.

  According to the component conveying device of the present embodiment, reducing gas can be sprayed in a direction approaching the holding unit 20 as compared with the component conveying device of the first embodiment. Therefore, compared with the component conveying apparatus of 1st Embodiment, reducing gas can be sprayed more directly toward the oxide film formed in a solder etc. FIG. Therefore, the oxide film can be reduced more efficiently.

(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described in detail with reference to FIG. In addition, about the component which is the same as that of 1st Embodiment, or equivalent, except the case where it demonstrates especially, the same referential mark is attached | subjected and the overlapping description is abbreviate | omitted.

  FIG. 11 is a diagram illustrating a state around the holding unit and a state of the reducing gas sprayed in the component conveying device according to the present embodiment. FIG. 11 shows a state where the mixed gas of the reducing gas and the inert gas is sprayed in a state where the component 40 is disposed on the circuit board 45. As shown in FIG. 11, the component transport apparatus according to the present embodiment is configured such that the movable arm 10 includes a frame portion 15 that surrounds the spray port 31 and a portion where the component 40 held by the holding portion 20 should be located. It differs from the movable arm 10 of 1 embodiment.

  The component soldering method by the component conveying apparatus of this embodiment can be performed in the same manner as the first and second procedures of the component soldering method in the first embodiment.

  By providing the frame portion 15 as in the present embodiment, the concentration of the reducing gas in the frame portion 15 can be increased. Therefore, the oxide film can be removed faster than in the case of using the component conveying apparatus of the first embodiment.

  As mentioned above, although the said embodiment was demonstrated to the example about this invention, this invention is not limited to these, It can change suitably.

  For example, in the present embodiment, the tip of the movable arm 10 is two-dimensionally moved. However, the present invention is not limited to this, and even if the movable arm moves one-dimensionally, the movable arm 10 moves three-dimensionally. It may be.

  Moreover, in the said embodiment, although the components 40 were hold | maintained by the suction from the suction port 21, the holding | maintenance part of this invention has the holding part which can hold the components 40 in the front-end | tip of the movable arm 10, for example, The gripping part may be a holding part.

  Moreover, in the said embodiment, although the mixed gas of reducing gas and inert gas was sprayed, inert gas is not essential and you may spray only reducing gas.

  Moreover, you may provide the frame part 15 like 5th Embodiment in the movable arm 10 of 2nd-4th Embodiment.

  As described above, according to the present invention, there is provided a component conveying apparatus capable of performing appropriate soldering in a state in which the position of the component is accurately determined, and a component soldering method using the same. It can be used for manufacturing electrical equipment and the like.

DESCRIPTION OF SYMBOLS 1 ... Parts conveying apparatus 10 ... Movable arm 15 ... Frame part 20 ... Holding part 21 ... Suction port 22 ... Suction hole 31 ... Spraying port 32 ... Supply hole 40 ... Part 45 ... Circuit board 51 ... Driver 52 ... Guide 53 ... Heater IG ... Inert gas supply part RG ... Reducible gas supply part SP ... Suction pump S11, S21 ... Conveyance step S12, S24 ... Arrangement step S13, S23 ... Spraying step S14, S25 ... Soldering step S22 ... Stopping step

Claims (17)

A component conveying device for conveying a component onto a circuit board by a movable arm,
A holding portion that is provided on the movable arm and holds the component;
A spray port provided on the movable arm and sprayed with the reducing gas such that at least a part of the reducing gas is directed toward the circuit board;
A component conveying device comprising: The component holding apparatus according to claim 1, wherein the holding unit has a suction port that holds the component by sucking the component. The component conveying device according to claim 2, wherein the suction port is provided closer to the circuit board than the spray port. The component conveying apparatus according to claim 2, wherein the suction port and the spray port are provided flush with each other on a surface parallel to a surface on which the component of the circuit board is disposed. The component conveying apparatus according to claim 2, wherein the spray port is provided closer to the circuit board than the suction port. The component conveying apparatus according to claim 2, wherein the spray port opens in a direction away from the holding unit. The component conveying apparatus according to claim 2, wherein the spray port opens in a direction approaching the holding unit. The component conveying apparatus according to claim 1, further comprising a frame portion surrounding the spray port and a portion where the component held by the holding portion is to be located. The component spray device according to claim 1, wherein the spray port sprays an inert gas together with the reducing gas. A heater for heating the reducing gas;
The said reducing gas is sprayed in the state heated with the said heater, The components conveying apparatus of any one of Claims 1-9 characterized by the above-mentioned. A transporting step of transporting the part by holding the part by a holding part provided in a movable arm of the part transporting apparatus;
An arrangement step of arranging the component on the circuit board and maintaining the state in which the holding unit holds the component;
Spray that sprays the reducing gas from a spray port provided in the movable arm so that at least a part of the reducing gas is directed to the circuit board in a state where the components on the circuit board are held by the holding unit. Steps,
A soldering step of soldering the component and the circuit board in a state where the component on the circuit board is held by the holding unit;
A method of soldering a component, comprising: A transporting step of transporting the component by holding the component by a holding unit provided in a movable arm of the component transporting device;
When the distance between the circuit board and the component is equal to or less than a predetermined distance, the reducing gas is sprayed from a spray port provided in the movable arm so that at least a part of the reducing gas is directed to the circuit board. A spraying step;
An arrangement step of arranging the component on the circuit board and maintaining the state in which the holding unit holds the component;
A soldering step of soldering the component and the circuit board in a state where the component on the circuit board is held by the holding unit;
A method of soldering a component, comprising: In the state where the predetermined distance between the component held by the holding unit and the circuit board is the stop, further comprising a stop step of temporarily stopping the conveyance of the component,
The component soldering method according to claim 12, wherein the spraying step is performed during the stopping step. 14. The component soldering method according to claim 12 or 13, wherein the spraying step is performed until after the component is placed on the circuit board. The component soldering method according to claim 11, wherein at least a part of the spraying step and at least a part of the soldering step are simultaneously performed. 14. The method of soldering parts according to claim 12, wherein the spraying step is ended before the placing step. 17. The component soldering method according to claim 11, wherein the circuit board is heated before the component is placed on the circuit board and halfway through the soldering step.

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