JP2015115427A - Soldering device and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering device which ensures reliability or certainty by confirming various conditions of soldering when starting the device or the like.SOLUTION: The device for performing soldering on a through hole of a printed circuit board by means of a cylindrical soldering iron 20 includes: a nozzle unit 17 for keeping the soldering iron 20 at a predetermined temperature; a transportation unit 4 for transporting the nozzle unit 17 in X, Y and Z directions to move to a predetermined position; a solder supply unit 10 for supplying a predetermined supply quantity of solders to the soldering iron 20; a floating unit 3 for keeping a load of the soldering iron 20 applied to the printed circuit board when performing soldering upon the printed circuit board; and inspection means 60 for inspecting the temperature of the soldering iron 20, a position of the soldering iron 20, the load of the soldering iron 20 and the quantity of solders to be supplied in predetermined timing and storing inspection results.

Description

  The present invention relates to a soldering apparatus and method for soldering electronic components.

〔background〕
Conventionally, “flow soldering method” and “reflow soldering method” have been performed as methods for mechanically soldering electronic components to a printed circuit board.

  The “flow soldering method” is a method of filling a solder bath with solder that has been heated and melted, moving a printed circuit board with electronic component terminal conductors inserted into the through holes on the solder bath, and bringing the solder liquid surface into contact with the substrate surface. This is a method of soldering. In this method, the printed circuit board is brought into contact with the liquid surface of the solder that has been melted by heating, so that the solder becomes hard due to contact with the printed circuit board. In order to avoid this, it is necessary to sufficiently heat the solder in the solder bath. However, a solder having a high melting point, such as lead-free solder, which has been recently diversified, has a problem that it is easy to apply a thermal stress to an electronic component because the heating temperature must be increased accordingly.

  "Reflow soldering method" is a method in which components are mounted on a printed circuit board that is pre-printed with cream solder according to the pattern, and solder is applied by directly applying heat to the printed circuit board to melt the cream solder. . This method requires screen printing or the like to print cream solder, and is suitable for mass-produced products. However, application to small lot products is extremely disadvantageous in terms of cost.

[Conventional technology]
Thus, for example, the following Patent Document 1 and Patent Document 2 are disclosed as techniques for performing necessary and sufficient heat treatment on each soldering location by using a cylindrical soldering iron. In addition, the code | symbol described by description of the literature described below is published in the gazette.

[Disclosure of references]
Patent Document 1 discloses a method for attaching solder to a plurality of conductive pads. This document has the following description (paragraph 0013, FIG. 1).
Using this solder deposition system 10, it is possible to deposit solder at selected sites, which are preferably conductive pads. The solder deposition system 10 preferably includes an operable robot arm 12. The robot arm 12 can move quickly between two points accurately and efficiently under the control of the robot controller 14. The solder deposition system 10 is preferably utilized to accurately position the solder nozzle assembly 20 at a selected height above the planar surface 16. Conductive pads 18 are disposed on the upper surface of the planar surface 16.

Patent Document 2 discloses a method for mounting an insertion mounting type component. This document has the following description (paragraph 0018, FIG. 2).
First, the lead 14 of the semiconductor package 10 described above is inserted into the through hole 22. Subsequently, the lead 14 is positioned so that the boundary between the insertion lead portion 16 of the lead 14 and the non-insertion lead portion 20 coincides with the upper surface of the annular metal land 26A on the package body side of the printed wiring board 28. Next, the insertion lead portion 16, the cylindrical metal land portion 24, and the annular metal land portion 26B are soldered using lead-free solder to form the solder joint 30, whereby the semiconductor package 10 is printed on a printed wiring board. 28 can be implemented.

Japanese Patent Publication No. 7-28121 JP 2001-339135 A

Patent Document 1 relates to a method for attaching solder to a plurality of conductive pads. It is described that the robot arm 12 positions the solder nozzle assembly 20 at a selected height above the planar surface 16 and attaches the solder to conductive pads 18 located on the top surface of the planar surface 16. .
However, the position of the solder nozzle assembly 20 on the planar surface 16, the temperature of the soldering iron 24, the load of the soldering iron 24, the amount of solder to be adhered, etc. are confirmed and corrected at the start-up and operation of the apparatus. There is no specific mention of the method.

The above-mentioned patent document 2 relates to a mounting method of an insertion mounting type component for performing soldering on a substrate body 21 having a through hole 22. It is described that the lead 14 is positioned on the upper surface of the annular metal land 26A of the printed wiring board 28, and in this state, the cylindrical metal land portion 24, the annular metal land portion 26B and the insertion lead portion 16 are soldered.
However, a specific method for confirming and correcting the position of the lead 14 on the printed circuit board 28, the temperature of the soldering iron, the load of the soldering iron, the amount of solder to be adhered, etc. at the start-up or operation of the apparatus There is no mention.

〔the purpose〕
An object of the present invention is to provide a soldering apparatus and method for ensuring the reliability and certainty of soldering by confirming various soldering conditions during startup and operation of the apparatus.

[Claim 1]
In order to achieve the above object, the soldering apparatus of claim 1 employs the following configuration.
An apparatus for soldering a substrate through hole with a cylindrical soldering iron,
A nozzle unit for holding the soldering iron at a predetermined temperature;
A transport unit for transporting the nozzle unit in the X direction, the Y direction, and the Z direction and moving the nozzle unit to a predetermined position;
A solder supply unit for supplying solder in a predetermined supply amount to the soldering iron;
A floating unit that maintains the load of the soldering iron on the board when soldering to the board;
Inspection means for inspecting the temperature of the soldering iron, the position of the soldering iron, the load of the soldering iron and the supply amount of the solder with a predetermined timing and storing the inspection result is provided.

[Claim 2]
The soldering apparatus of claim 2 employs the following configuration in addition to the configuration of claim 1.
The inspection means includes a sensor unit including a temperature sensor for detecting the temperature of the soldering iron, a position sensor for detecting the position of the soldering iron, and a load sensor for detecting the load of the soldering iron. .

[Claim 3]
The soldering apparatus of claim 3 employs the following configuration in addition to the configuration of claim 1 or 2.
The inspection means includes a supply amount counter that detects a supply amount of solder in the solder supply unit.

[Claim 1]
The soldering apparatus according to the first aspect has the following effects by adopting the above configuration.
When performing soldering, the temperature of the soldering iron, the position of the soldering iron, the load of the soldering iron, and the amount of solder supplied are inspected, and the inspection result is stored.
By doing so, for example, at a predetermined timing such as when the apparatus is started up or during operation, various conditions regarding the temperature of the soldering iron, the position of the soldering iron, the load of the soldering iron, and the supply amount of the solder are used. By confirming, it was possible to ensure the reliability and certainty of soldering.

[Claim 2]
The soldering apparatus according to the second aspect has the following effects by adopting the above configuration.
With the sensor unit, the temperature of the soldering iron is detected by a temperature sensor, the position of the soldering iron is detected by a position sensor, and the load of the soldering iron is detected by a load sensor.
By doing so, the soldering iron temperature, the position of the soldering iron and the load of the soldering iron are checked at a predetermined timing, for example, when the apparatus is started up or during operation. The reliability and certainty of the attachment could be secured.

[Claim 3]
The soldering apparatus according to the third aspect has the following effects by adopting the above configuration.
The supply amount counter detects the supply amount of solder in the solder supply unit.
By doing so, for example, the reliability and certainty of soldering can be ensured by checking the supply amount of the solder at a predetermined timing such as when the apparatus is started up or during operation.

It is a figure which shows the soldering apparatus of one Embodiment to which this invention is applied. It is a figure explaining a nozzle unit and a solder supply unit. It is a figure explaining a soldering process. It is a figure explaining a sensor unit. It is a figure explaining a control system.

  Next, the best mode for carrying out the present invention will be described.

〔overall structure〕
FIG. 1 is a diagram showing an embodiment of a soldering apparatus 1 to which the present invention is applied.
The soldering apparatus 1 is an apparatus that performs soldering to the through hole 8 of the printed circuit board 5 with a cylindrical soldering iron 20.

  The soldering apparatus 1 has a nozzle unit 17 for holding the soldering iron 20 at a predetermined temperature, and moves the nozzle unit 17 in a X direction, a Y direction, and a Z direction to move it to a predetermined position. A transfer unit 4, a solder supply unit 10 for supplying solder to the soldering iron 20 at a predetermined supply amount, and solder applied to the printed circuit board 5 when soldering to the printed circuit board 5. A floating unit 3 that keeps the load of the iron 20 is provided.

[Nozzle unit]
FIG. 2 shows a cross section of the nozzle unit 17.
The nozzle unit 17 is attached to the lower surface side of the head unit 2. The nozzle unit 17 includes a heater 18 that heats a cylindrical soldering iron 20. The head unit 2 includes a solder supply unit 10 that cuts the thread solder 21. The soldering iron 20 mounted on the nozzle unit 17 has a cylindrical shape, and the thread solder 21 drawn out from the reel 22 is cut into a predetermined size by the solder supply unit 10 and supplied into the hollow path.

[Solder supply unit]
FIG. 2 shows a cross section of the solder supply unit 10 mounted on the head unit 2.
The solder supply unit 10 includes a cutting plate 16 having a receiving blade 11, a cutting gear 15 having a plurality of cutting blades 12, and a motor 13 for rotationally driving the cutting gear 15. The receiving blade 11 is positioned directly below the feed roller 14 and has a cylindrical shape having a supply hole 11 a for receiving the supply of the thread solder 21. The cutting blade 12 has a cylindrical shape having a holding hole 12 a for holding the thread solder 21. In this example, two cutting blades 12 are arranged on the cutting gear 15 at symmetrical positions about the rotation axis. A discharge hole 11c and a soldering iron 20 are arranged at a position coaxial with the other cutting blade 12 in a state where the cutting gear 15 is stopped at a position where one of the cutting blades 12 is coaxial with the receiving blade 11. .

  First, the tip of the thread solder 21 is supplied to the holding hole 12a of the cutting blade 12 with the cutting gear 15 stopped where one of the cutting blades 12 is coaxial with the receiving blade 11. When the cutting gear 15 is rotated from there, the tip of the thread solder 21 is cut to generate a thread solder piece (not shown). Next, when the cutting gear 15 is rotated halfway from the initial position, the positions of the holding hole 12a and the discharge hole 11c of the cutting blade 12 coincide with each other, and the thread solder piece is discharged from the discharge hole 11c to the cylindrical soldering iron 20. Supplied. When the thread solder piece is supplied to the cylindrical soldering iron 20, soldering is performed as described above.

[Floating unit]
The head unit 2 is attached to the floating unit 3. The floating unit 3 is attached to the transport unit 4. As a result, the nozzle unit 17 attached to the head unit 2 is transported in the X, Y, and Z directions by the transport unit 4.

  The floating unit 3 is brought into a floating state by applying a force against its own weight to the head unit 2. The floating unit 3 includes an air cylinder 30 that brings the head unit 2 into a floating state by air pressure, and a guide mechanism 31 that guides the vertical movement of the head unit 2 within a predetermined height range. In this example, the air cylinder 30 applies a traction force against the head unit 2 against its own weight. For example, when the head unit 2 is pulled upward with a force of 90% of its own weight, the head unit 2 appears to have a load of 10% of its own weight. A state where the load is apparently smaller than its own weight is called a floating state.

  When the head unit 2 is brought into a floating state by the floating unit 3, the load of the soldering iron 20 applied to the printed circuit board 5 is kept in a predetermined range when the printed circuit board 5 is soldered. Yes.

[Transport unit]
The transport unit 4 includes an X-direction transport unit 42 for transporting the floating unit 3 in the left-right direction (hereinafter referred to as “X direction”) when the head unit 2 is viewed from the front, and the floating unit 3 from the front. A Y-direction transport unit 43 for transporting in the front-rear direction (hereinafter referred to as “Y direction”) and a Z-direction transport unit 41 for transporting the floating unit 3 in the vertical direction (hereinafter referred to as “Z direction”). It is prepared for. Thereby, the nozzle unit 17 on which the soldering iron 20 is mounted is conveyed in the X direction, the Y direction, and the Z direction.

  The Z-direction transport unit 41 is configured by attaching a lifting unit 46 that moves up and down according to the rotation of the ball screw 44 to a ball screw 44 fixed to the support member 45 along the vertical direction. The above-described floating unit 3 is attached to the lifting unit 46. When the ball screw 44 is rotationally driven, the elevating unit 46 moves up and down, thereby conveying the floating unit 3 in the Z direction. When the floating unit 3 is conveyed in the Z direction, the head unit 2 attached thereto is also conveyed in the Z direction, and as a result, the nozzle unit 17 is also conveyed in the Z direction.

  The X-direction transport unit 42 includes a slide rail mechanism on which the support member 45 of the Z-direction transport unit 41 is placed and which allows the support member 45 to slide in the X direction. The sliding movement can be realized by a ball screw mechanism (not shown), for example. By driving the slide rail mechanism, the Z-direction transport unit 41 is transported in the X direction. When the Z-direction transport unit 41 is transported in the X direction, the floating unit 3 and the head unit 2 attached thereto are transported in the X direction, and as a result, the nozzle unit 17 is transported in the X direction.

  The Y-direction transport unit 43 is provided with a slide rail mechanism on which the X-direction transport unit 42 is placed and which allows the X-direction transport unit 42 to slide in the Y direction. The sliding movement can be realized by a ball screw mechanism (not shown), for example. By driving the slide rail mechanism, the X-direction transport unit 42 is transported in the Y direction. When the X-direction transport unit 42 is transported in the Y direction, the Z-direction transport unit 41, the floating unit 3 and the head unit 2 attached thereto are transported in the Y direction, and as a result, the nozzle unit 17 is transported in the Y direction. .

[Soldering process]
FIG. 3 is a diagram illustrating a soldering process.
This soldering apparatus 1 joins the through hole 8 and the conductor 6 with the thread solder piece 21a in a state where the conductor 6 of the electronic component 7 is inserted into the through hole 8 on the printed board 5. The tip of the cylindrical soldering iron 20 is pressed around the through-hole 8 in a state where the lead wire 6 having passed through the through-hole 8 enters the hollow path of the cylindrical soldering iron 20. In this state, the thread solder piece 21a is supplied to the hollow path of the cylindrical soldering iron 20, and is heated and melted at the tip portion for soldering. In the figure, reference numeral 9 denotes a guide tube 9 for guiding a thread solder piece 21 a obtained by cutting with a solder supply unit 10 described later to a cylindrical soldering iron 20.

[Condition inspection]
In the above-described soldering process, it is necessary to perform a condition inspection when the apparatus is started or when the soldering iron 20 or the heater 18 is replaced. This is because the quality of soldering cannot be ensured unless conditions are appropriate in the condition inspection. In the condition inspection, soldering conditions such as the temperature of the soldering iron 20, the position of the soldering iron 20, the load of the soldering iron 20, and the supply amount of the solder are inspected, and the inspection results are stored.

  Hereinafter, the inspection means 60 of the present invention for performing the above-described condition inspection will be described.

[Inspection means]
The soldering device 1 inspects the temperature of the soldering iron 20, the position of the soldering iron 20, the load of the soldering iron 20, and the supply amount of the solder at a predetermined timing, and stores the inspection results. Inspection means 60 is provided.

The inspection means 60 includes a temperature sensor 58 that detects the temperature of the soldering iron 20, a position sensor 57 that detects the position of the soldering iron 20, and a load sensor 56 that detects the load of the soldering iron 20. The sensor unit 51 is provided.
The inspection means 60 includes a supply amount counter 59 that detects the amount of solder supplied in the solder supply unit 10.

  Further, the inspection means 60 includes a computer device 48. The computer device 48 includes a storage unit 49 that stores the inspection results of the temperature of the soldering iron 20, the position of the soldering iron 20, the load of the soldering iron 20, and the supply amount of the solder. Further, the computer device 48 includes a control unit 50 that performs control to execute the series of inspections at a predetermined timing and store the inspection results in the storage unit 49.

[Sensor unit]
FIG. 4 is a diagram for explaining the sensor unit 51. In this example, the sensor unit 51 includes a position detection unit 52 having a position sensor 57 and a temperature / load detection unit 53 having a temperature sensor 58 and a load sensor 56.

  The temperature / load detection unit 53 is provided with a temperature inspection opening 58A and a load inspection opening 56A on the upper surface of a unit main body 53A formed in a block shape.

  A temperature sensor 58 is provided at the bottom of the temperature inspection opening 58A. By the conveyance of the conveyance unit 4, the soldering iron 20 is inserted from the opening of the temperature inspection opening 58 </ b> A, and the tip of the soldering iron 20 is brought into contact with the temperature sensor 58. Thereby, the temperature of the soldering iron 20 is detected by the temperature sensor 58. The detected temperature is stored in the storage unit 49 of the computer device 48 as an inspection result. This inspection is controlled by the control means 50 of the computer device 48.

  A load sensor 56 is provided at the bottom of the load inspection opening 56A. By the conveyance of the conveyance unit 4, the soldering iron 20 is inserted from the opening of the load inspection opening 56 </ b> A, and the tip of the soldering iron 20 is brought into contact with the load sensor 56. At this time, the load of the soldering iron 20 set by the floating unit 3 is applied to the load sensor 56. Thereby, the load of the soldering iron 20 is detected by the load sensor 56. The detected load is stored in the storage unit 49 of the computer device 48 as an inspection result. This inspection is controlled by the control means 50 of the computer device 48.

  The position detection unit 52 is provided with a position inspection opening 57A on the upper surface of a unit main body 52A formed in a block shape. By the conveyance of the conveyance unit 4, the soldering iron 20 is inserted from the opening of the position inspection opening 57A, and the soldering iron 20 is lowered at a position facing the position sensor 57. Gradually, the soldering iron is brought closer to the position sensor 57, and the Z-direction coordinate at the height at which the presence of the soldering iron 20 is recognized is detected. Subsequently, the height of the transport unit 4 is maintained by the transport of the transport unit 4, and the soldering iron 20 is moved in the X direction and the Y direction, respectively. At this time, the position sensor 57 detects the coordinates of the soldering iron 20 from the coordinates at which the presence of the soldering iron 20 is recognized and the coordinates at which it is no longer recognized.

  Then, the shift amount is calculated by comparing the coordinates of the center position determined by attaching the master jig to the head unit 2 in advance instead of the nozzle unit 17 and the coordinates of the soldering iron 20 detected in the above inspection. This deviation amount is output by the computer device 48 for use in position correction by the operator. This inspection is controlled by the control means 50 of the computer device 48.

  The master jig is used as a set together with a center adjusting jig to adjust the center position of the soldering iron 20 when the nozzle unit 17 is attached. That is, with the center adjusting jig fixed at a predetermined position, the tip of the master jig is fitted into the center hole provided on the upper surface of the center adjusting jig. In this state, the center position of the soldering iron 20 is determined.

[Supply amount counter]
FIG. 2 shows a supply amount counter 59 for detecting the amount of solder supplied in the solder supply unit 10. The supply amount counter 59 is fed by the rotation of the feed roller 14 and cut by the rotation of the cutting gear 15 in accordance with the rotation of the feed roller 14 that feeds the thread solder 21 and the rotation of the cutting gear 15 in the solder supply unit 10. The length of the solder piece 21a is counted and detected as the amount of solder supplied. The detected supply amount of solder is stored in the storage unit 49 of the computer device 48 as an inspection result. This inspection is controlled by the control means 50 of the computer device 48.

[Control system]
FIG. 5 is a diagram for explaining a control system of the soldering apparatus 1.

  As described above, the computer device 48 includes the storage unit 49 and the control unit 50. The storage unit 49 stores the detected temperature of the soldering iron 20, the position of the soldering iron 20, the load of the soldering iron 20, and the amount of solder supplied as inspection results. The storage unit 49 stores the inspection date and time together with the inspection result. The control means 50 performs the above-described series of inspections at a predetermined timing, and performs control to store the inspection results in the storage unit 49. The predetermined timing is, for example, when the apparatus is started up, when the heater 18 is replaced, when the soldering iron 20 is replaced, and the like. Specifically, the computer program 48 starts up and executes the inspection program. The inspection is started.

  The control means 50 controls the transport unit 4 and controls the nozzle unit 17 to be transported in the X direction, the Y direction, and the Z direction and moved to a predetermined position when performing inspection. Specifically, the control means 50 includes a Z-direction drive motor 41a for driving the Z-direction transport unit 41, an X-direction drive motor 42a for driving the X-direction transport unit 42, and a Y-direction transport unit 43. The Y direction drive motor 43a for driving is driven and controlled to control the operation of transporting the head unit 2 in the Z direction, the X direction, and the Y direction.

  The control means 50 controls the floating unit 3 at the time of executing the inspection, and the soldering iron 20 applied to the printed circuit board 3 when soldering the printed circuit board 5 with the head unit 2 in a floating state. Control to keep the load.

  The control means 50 controls the solder supply unit 10 to control the feeding and cutting of the thread solder 21 and to supply the soldering iron 20 with a predetermined supply amount during inspection. To do. In addition, the control means 50 controls the heater 18 of the nozzle unit 17 to perform the inspection so as to hold the soldering iron at a predetermined temperature.

  As described above, the control means 50 performs inspection on the temperature of the soldering iron 20, the position of the soldering iron 20, the load of the soldering iron 20, and the amount of solder supplied. That is, as described above, the temperature of the soldering iron 20, the position of the soldering iron 20, the load of the soldering iron 20, and the supply amount of the solder are detected and stored in the storage unit 49 as inspection results.

  At this time, the control unit 50 detects coordinates in the X, Y, and Z directions when the transport unit 4 transports the head unit 2 in the X, Y, and Z directions as necessary. . Specifically, the coordinates are detected based on the number and angle of rotation of the X-direction drive motor 42a, the Y-direction transport unit 43, and the Z-direction drive motor 41a.

[Function and effect]
The soldering apparatus 1 and method of this embodiment have the following operational effects.

  For example, various conditions regarding the temperature of the soldering iron 20, the position of the soldering iron 20, the load of the soldering iron 20, and the supply amount of the solder should be confirmed at a predetermined timing such as when the apparatus is started up or during operation. As a result, it was possible to ensure the reliability and certainty of soldering.

[Modification]
The above has described a particularly preferred embodiment of the present invention. However, the present invention is not intended to be limited to the illustrated embodiment, and can be implemented by being modified in various aspects, and the present invention includes various modifications. This is the purpose.

1: Soldering device 2: Head unit 3: Floating unit 4: Transport unit 5: Printed circuit board 6: Conductor wire 7: Electronic component 8: Through hole 9: Guide tube 10: Solder supply unit 11: Receiving blade 11a: Supply hole 11c : Discharge hole 12: cutting blade 12a: holding hole 13: motor 14: feed roller 15: cutting gear 16: cutting plate 17: nozzle unit 18: heater 20: soldering iron 21: thread solder 21a: thread solder piece 22: reel 30: Air cylinder 31: Guide mechanism 41: Z direction transport unit 41a: Z direction drive motor 42: X direction transport unit 42a: X direction drive motor 43: Y direction transport unit 43a: Y direction drive motor 44: Ball screw 45: Support member 46: Elevating unit 48: Computer device 49: Storage unit 50: Control means 51: Sensor unit 52: Position Knowledge unit 52A: Unit main body 53: Temperature / load detection unit 53A: Unit main body 56: Load sensor 56A: Load inspection opening 57: Position sensor 57A: Position inspection opening 58: Temperature sensor 58A: Temperature inspection opening 59: Supply Quantity counter 60: Inspection means

Claims (3)

An apparatus for soldering a substrate through hole with a cylindrical soldering iron,
A nozzle unit for holding the soldering iron at a predetermined temperature;
A transport unit for transporting the nozzle unit in the X direction, the Y direction, and the Z direction and moving the nozzle unit to a predetermined position;
A solder supply unit for supplying solder in a predetermined supply amount to the soldering iron;
A floating unit that maintains the load of the soldering iron on the board when soldering to the board;
Inspecting means for inspecting the temperature of the soldering iron, the position of the soldering iron, the load of the soldering iron, and the supply amount of the solder with a predetermined timing and storing the inspection result. Soldering device characterized by The inspection means includes a sensor unit including a temperature sensor for detecting the temperature of the soldering iron, a position sensor for detecting the position of the soldering iron, and a load sensor for detecting the load of the soldering iron. The soldering apparatus according to claim 1. The soldering apparatus according to claim 1, wherein the inspection unit includes a supply amount counter that detects a supply amount of solder in the solder supply unit.

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