CN105499730A - Circuit board soldering method - Google Patents
Circuit board soldering method Download PDFInfo
- Publication number
- CN105499730A CN105499730A CN201610042084.4A CN201610042084A CN105499730A CN 105499730 A CN105499730 A CN 105499730A CN 201610042084 A CN201610042084 A CN 201610042084A CN 105499730 A CN105499730 A CN 105499730A
- Authority
- CN
- China
- Prior art keywords
- solder
- soldering method
- horn
- wiring board
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a circuit board soldering method. The method comprises the steps of S1, preheating a solder tip; S2, moving a solder wire to be above a bonding pad along with the solder tip; S3, sending the solder wire to the solder tip; S4, enabling the solder tip and the solder wire to swing back and forth horizontally; S5, forming uniform solder spots, and withdrawing the solder tip and the solder wire from the position above the bonding pad. According to the circuit board soldering method, the solder spots diffuse perfectly to completely cover the bonding pad, solder spot conduction performance is good, and quality is reliable.
Description
Technical field
The present invention relates to the tin-soldering method of wiring board.
Background technology
At present, the welding of wiring board utilizes the flowing of tin liquor self to scatter, and bump spreads out to surrounding sometimes, and cover pad, bump spreads to side sometimes, can not be covered on pad well, causes solder joint conduction poor.
Summary of the invention
The object of the present invention is to provide a kind of tin-soldering method of wiring board, solder joint spreads completely, complete covering pad, and conduction property is good, reliable in quality.
The technical scheme that the tin-soldering method of wiring board disclosed by the invention adopts is:
A tin-soldering method for wiring board, comprises the following steps: the preheating of S1 solder horn; S2 solder moves to above pad along with solder horn; S3 solder is delivered on solder horn; S4 solder horn and solder swing back and forth in the horizontal direction; S5 forms uniform solder joint, and solder horn and solder are withdrawn above pad.
Preferably, in step s 4 which, solder horn and solder repeatedly swing back and forth at left and right directions and X-direction.
Preferably, in step s 4 which, solder horn and solder repeatedly swing back and forth at fore-and-aft direction and Y direction.
Preferably, in step s 4 which, solder horn and solder are shaken up and down at vertical direction and Z-direction.
The beneficial effect of the tin-soldering method of wiring board disclosed by the invention is: solder horn and solder swing back and forth in the horizontal direction, tin liquor evenly spreads out in the horizontal direction, ensure that tin point covers pad completely and forms firm alloy-layer, solder joint conduction is good, reliable in quality.
Accompanying drawing explanation
Fig. 1 is the flow chart of the tin-soldering method of wiring board of the present invention.
Detailed description of the invention
Below in conjunction with specific embodiment and Figure of description the present invention be further elaborated and illustrate:
Please refer to Fig. 1, a kind of tin-soldering method of wiring board, comprises the following steps:
The preheating of S1 solder horn;
S2 solder moves to above pad along with solder horn;
S3 solder is delivered on solder horn;
S4 solder horn and solder repeatedly swing back and forth at left and right directions and X-direction, repeatedly swing back and forth at fore-and-aft direction and Y direction;
S5 forms uniform solder joint, and solder horn and solder are withdrawn above pad.
The tin-soldering method of above-mentioned wiring board, in step s 4 which, increase solder horn and solder are shaken up and down at vertical direction and Z-direction;
Solder horn and solder swing back and forth in the horizontal direction, and tin liquor is evenly spread out in the horizontal direction, shake under in the vertical direction, tin liquor on solder horn falls, and makes tin liquor full, therefore tin point covers pad completely and forms firm alloy-layer, solder joint conduction is good, reliable in quality.
Finally should be noted that; above embodiment is only in order to illustrate technical scheme of the present invention; but not limiting the scope of the invention; although done to explain to the present invention with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify to technical scheme of the present invention or equivalent replacement, and not depart from essence and the scope of technical solution of the present invention.
Claims (4)
1. a tin-soldering method for wiring board, is characterized in that, comprises the following steps:
The preheating of S1 solder horn;
S2 solder moves to above pad along with solder horn;
S3 solder is delivered on solder horn;
S4 solder horn and solder swing back and forth in the horizontal direction;
S5 forms uniform solder joint, and solder horn and solder are withdrawn above pad.
2. the tin-soldering method of wiring board as claimed in claim 1, it is characterized in that, in step s 4 which, solder horn and solder repeatedly swing back and forth at left and right directions and X-direction.
3. the welding method of wiring board as claimed in claim 2, it is characterized in that, in step s 4 which, solder horn and solder repeatedly swing back and forth at fore-and-aft direction and Y direction.
4. the welding method of the wiring board as described in any one of claim 1-3, is characterized in that, in step s 4 which, solder horn and solder are shaken up and down at vertical direction and Z-direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610042084.4A CN105499730A (en) | 2016-01-21 | 2016-01-21 | Circuit board soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610042084.4A CN105499730A (en) | 2016-01-21 | 2016-01-21 | Circuit board soldering method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105499730A true CN105499730A (en) | 2016-04-20 |
Family
ID=55708238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610042084.4A Pending CN105499730A (en) | 2016-01-21 | 2016-01-21 | Circuit board soldering method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105499730A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102069255A (en) * | 2009-11-23 | 2011-05-25 | 常州铭赛机器人科技有限公司 | Automatic solder robot |
| CN102886580A (en) * | 2011-07-21 | 2013-01-23 | 谭永福 | Device and method for simulating manual tin soldering by automatic tin soldering machine |
| CN203566032U (en) * | 2013-11-29 | 2014-04-30 | 东莞市立迪电子科技有限公司 | Automatic tin soldering equipment with manipulator |
| CN203679473U (en) * | 2014-01-13 | 2014-07-02 | 昆山和协荣威精密机械有限公司 | Table-type three-axis welding machine |
| JP2015115427A (en) * | 2013-12-11 | 2015-06-22 | 株式会社パラット | Soldering device and method |
| CN204818342U (en) * | 2015-07-28 | 2015-12-02 | 深圳市创盈时代科技有限公司 | Universal welding machine |
-
2016
- 2016-01-21 CN CN201610042084.4A patent/CN105499730A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102069255A (en) * | 2009-11-23 | 2011-05-25 | 常州铭赛机器人科技有限公司 | Automatic solder robot |
| CN102886580A (en) * | 2011-07-21 | 2013-01-23 | 谭永福 | Device and method for simulating manual tin soldering by automatic tin soldering machine |
| CN203566032U (en) * | 2013-11-29 | 2014-04-30 | 东莞市立迪电子科技有限公司 | Automatic tin soldering equipment with manipulator |
| JP2015115427A (en) * | 2013-12-11 | 2015-06-22 | 株式会社パラット | Soldering device and method |
| CN203679473U (en) * | 2014-01-13 | 2014-07-02 | 昆山和协荣威精密机械有限公司 | Table-type three-axis welding machine |
| CN204818342U (en) * | 2015-07-28 | 2015-12-02 | 深圳市创盈时代科技有限公司 | Universal welding machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160420 |