JP2003181633A - Method and device for soldering - Google Patents

Method and device for soldering

Info

Publication number
JP2003181633A
JP2003181633A JP2001379405A JP2001379405A JP2003181633A JP 2003181633 A JP2003181633 A JP 2003181633A JP 2001379405 A JP2001379405 A JP 2001379405A JP 2001379405 A JP2001379405 A JP 2001379405A JP 2003181633 A JP2003181633 A JP 2003181633A
Authority
JP
Japan
Prior art keywords
soldering
thread solder
solder
roller
thread
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001379405A
Other languages
Japanese (ja)
Inventor
Hideo Ueda
英男 上田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP2001379405A priority Critical patent/JP2003181633A/en
Publication of JP2003181633A publication Critical patent/JP2003181633A/en
Withdrawn legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and a device for soldering capable of accurately detecting and controlling feed rate of a solder wire to significantly improve productivity and quality in automatic soldering works of an electronic component. <P>SOLUTION: The soldering device: (1) allows a long sheet of solder wire 2 fed from a feed roller 3 to pass through a sawtoothed roller, irradiates light on the top side of the sawtoothed solder wire 11, allows a reflective photosensor 12 to detect the presence of its reflective light, and then transmit the detected signal to a control computer. Thus the control computer calculates feed rate of the sawtoothed solder wire 11 and also makes rotary control of the feed roller. The device (2) receives an unevenness signal of the sawtoothed solder wire detected by the reflective photosensor 12 to provide calculation of the feed rate and control for the sawtoothed solder wire. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、はんだ付方法及び
はんだ付装置に関するものである。更に詳述すれば本発
明は自動はんだ付ロボットを用いたはんだ付方法及びは
んだ付装置に関するものである。
TECHNICAL FIELD The present invention relates to a soldering method and a soldering apparatus. More specifically, the present invention relates to a soldering method and a soldering apparatus using an automatic soldering robot.

【0002】[0002]

【従来の技術】はんだ付作業はあらゆる製造業で広く行
われている作業である。電子部品製造業でのはんだ付作
業では自動はんだ付ロボットを用いた自動はんだ付作業
が多用されている。
2. Description of the Related Art Soldering work is a widely used work in all manufacturing industries. In the soldering work in the electronic component manufacturing industry, automatic soldering work using an automatic soldering robot is often used.

【0003】図4は従来のはんだ付方法及びはんだ付装
置を示した正面説明図である。
FIG. 4 is a front view showing a conventional soldering method and soldering apparatus.

【0004】図4において1は糸はんだ送出ボビン、2
は糸はんだ、3は送出ローラ、4はチューブ状曲がりガ
イド、5は弛み箇所、6は糸はんだ供給ノズル、7はロ
ボットハンド、8はロボット半田コテである。
In FIG. 4, 1 is a thread solder delivery bobbin, 2
Is a thread solder, 3 is a delivery roller, 4 is a tubular bending guide, 5 is a slack portion, 6 is a thread solder supply nozzle, 7 is a robot hand, and 8 is a robot soldering iron.

【0005】図4に示す従来のはんだ付方法及びはんだ
付装置では、まず図示しない駆動源を駆動させることに
より送出ローラ3を稼動し、それにより糸はんだ送出ボ
ビン1より糸はんだ2を送り出す。
In the conventional soldering method and soldering device shown in FIG. 4, first, a driving source (not shown) is driven to operate the feeding roller 3, and thereby the yarn solder 2 is fed from the yarn solder feeding bobbin 1.

【0006】次に、その糸はんだ送出ボビン1より送り
出された糸はんだ2はチューブ状曲がりガイド4へ送り
込まれる。ここにおいてチューブ状曲がりガイド4へ送
り込まれた糸はんだ2では弛み箇所5等が発生すること
が多い。
Next, the thread solder 2 delivered from the thread solder delivery bobbin 1 is delivered to the tubular bending guide 4. Here, in the thread solder 2 sent to the tubular bending guide 4, a slack portion 5 and the like often occur.

【0007】次に、このようにチューブ状曲がりガイド
4へ送り込まれた糸はんだ2はそのチューブ状曲がりガ
イド4の先端部に連結されている糸はんだ供給ノズル6
を通って図示しない電子部品のはんだ付部へ送り出され
る。
Next, the thread solder 2 fed into the tube-shaped bending guide 4 in this way is connected to the tip of the tube-shaped bending guide 4 and the thread solder supply nozzle 6 is connected.
It is sent out to the soldering part of the electronic component (not shown).

【0008】次に、図4に示すロボットハンド7が下降
すると、そのロボットハンド7の下端に固定されている
ロボット半田コテ8が図示しない電子部品のはんだ付部
へ送り出されている糸はんだ2を加熱、溶融させ、それ
によりはんだ付け作業を自動的にできるようになってい
る。
Next, when the robot hand 7 shown in FIG. 4 descends, the robot soldering iron 8 fixed to the lower end of the robot hand 7 removes the thread solder 2 sent to the soldering portion of the electronic component (not shown). It is heated and melted so that the soldering work can be automated.

【0009】ここにおいて、糸はんだ2の送出し量は送
出ローラ3の回転速度を制御することにより行われる。
Here, the amount of wire solder 2 delivered is controlled by controlling the rotational speed of the delivery roller 3.

【0010】[0010]

【発明が解決しようとする課題】しかしながら、前述し
たように従来のはんだ付方法及びはんだ付装置では、そ
のチューブ状曲がりガイド4へ送り込まれた糸はんだ2
に弛み箇所5が多発するという難点があった。当然、チ
ューブ状曲がりガイド4内で弛み箇所5が発生した糸は
んだ2はそのチューブ状曲がりガイド4の先端部に連結
されている糸はんだ供給ノズル6から一定の送出速度で
送り出すことが困難である。
However, as described above, in the conventional soldering method and soldering apparatus, the thread solder 2 fed into the tube-shaped bending guide 4 is used.
However, there is a problem that the slack part 5 frequently occurs. Naturally, it is difficult to send the thread solder 2 in which the slack portion 5 is generated in the tube-shaped bending guide 4 from the thread solder supply nozzle 6 connected to the tip of the tube-shaped bending guide 4 at a constant delivery speed. .

【0011】このように糸はんだ供給ノズル6から糸は
んだ2を一定速度で送り出すことができないときには図
示しないはんだ付部への糸はんだ2の供給量がばらつ
き、その結果、糸はんだ供給不足によるはんだ付部強度
不良が発生したり、また、はんだ供給過剰によるはんだ
付部はんだ過着不良、はんだ付部外観不良、はんだ付部
寸法不良等が多発するという難点があった。
As described above, when the thread solder 2 cannot be delivered from the thread solder supply nozzle 6 at a constant speed, the supply amount of the thread solder 2 to the soldering portion (not shown) varies, and as a result, the soldering due to insufficient supply of the thread solder is performed. However, there is a problem that a defective portion strength occurs, and a soldering portion excessive soldering failure due to excessive supply of solder, a soldering portion appearance defect, and a soldering portion dimension defect occur frequently.

【0012】しかも、従来のはんだ付方法及びはんだ付
装置では、そのチューブ状ガイド4の先端から送り出さ
れる糸はんだ2の量を画像カメラを用いて検知しようと
してもその画像処理に長時間かかる上その画像処理シス
テム構築代が高価になるという難点があった。
Moreover, in the conventional soldering method and soldering apparatus, even if an image camera is used to detect the amount of the thread solder 2 sent out from the tip of the tubular guide 4, the image processing takes a long time, and There is a drawback that the image processing system construction cost becomes expensive.

【0013】本発明はかかる点に立って為されたもので
あって、その目的とするところは前記した従来技術の欠
点を解消し、糸はんだの送出量の検知と制御とを正確に
行うことができ、それによって電子部品の自動はんだ付
作業の生産性と品質とを顕著に向上することができるは
んだ付方法及びはんだ付装置を提供することにある。
The present invention has been made in view of such a point, and its object is to eliminate the above-mentioned drawbacks of the prior art and to accurately detect and control the amount of wire solder delivered. It is therefore an object of the present invention to provide a soldering method and a soldering apparatus that can significantly improve the productivity and quality of automatic soldering work for electronic components.

【0014】[0014]

【課題を解決するための手段】本発明の要旨とするとこ
ろは、次の2点にある。 (1)長尺の糸はんだを送出ローラ、チューブ状ガイ
ド、糸はんだ供給ノズルを順次通過させてからはんだ付
部材のはんだ付箇所上へ送り出し、然る後該はんだ付部
材上へ下部側にロボット半田コテが設置されているロボ
ットハンドを所定時間下降させることによって前記はん
だ付部材上へはんだ付作業を自動的に行うことができる
はんだ付方法において、前記送出ローラから送り出され
た前記糸はんだを鋸歯付ローラを通過させることによっ
て上面側へ鋸歯状の凹凸を刻ませてから該鋸歯付糸はん
だが前記チューブ状ガイドを介して前記前記糸はんだ供
給ノズルを通過した直後に該鋸歯付糸はんだの上面側へ
光を照射すると共にその反射光の有無を反射型光センサ
により検出させ、然る後該検出信号を制御コンピュータ
へ送信させて該制御コンピュータによって前記鋸歯付糸
はんだの送出量の演算と前記送出ローラの回転制御とを
行わせるようにすることを特徴とするはんだ付方法。 (2)糸はんだを巻かれている糸はんだ送出ボビンと、
該糸はんだ送出ボビンから糸はんだを繰り出すことがで
きる送出ローラと、該送出ローラから送り出された前記
糸はんだをガイドすることができるチューブ状ガイド
と、該チューブ状ガイドの先端部に固定された糸はんだ
供給ノズルと、該糸はんだ供給ノズルから送り出された
前記糸はんだ上へロボット半田コテを所定時間下降でき
るロボットハンドとを具備して成るはんだ付装置におい
て、前記送出ローラと前記チューブ状ガイドとの間に前
記糸はんだの上面側へ鋸歯状の凹凸を刻ませることがで
きる鋸歯付ローラを設置し、且つ該鋸歯付ローラにより
上面側へ鋸歯状の凹凸を刻ませた鋸歯付糸はんだが前記
糸はんだ供給ノズルを通過する位置上に反射型光センサ
を架設し、しかも該反射型光センサが検出した前記鋸歯
付糸はんだの凹凸信号を受信して該鋸歯付糸はんだの送
出量の演算と制御とを行うことができる制御コンピュー
タを設置して成ることを特徴とするはんだ付装置。
The gist of the present invention lies in the following two points. (1) A long thread solder is sequentially passed through a delivery roller, a tube-shaped guide, and a thread solder supply nozzle, and then sent out onto a soldering portion of a soldering member, and then a robot is downwardly moved onto the soldering member. In a soldering method capable of automatically performing a soldering operation on the soldering member by lowering a robot hand on which a soldering iron is installed for a predetermined period of time, the thread solder sent from the delivery roller is sawtoothed. Saw-tooth-shaped unevenness is formed on the upper surface side by passing the saw-toothed solder, and immediately after the saw-toothed thread solder passes the thread solder supply nozzle through the tubular guide, the upper surface of the saw-toothed thread solder The light is emitted to the side and the presence or absence of the reflected light is detected by the reflection type optical sensor, and then the detection signal is transmitted to the control computer to perform the control. Soldering method which is characterized in that so as to perform the rotation control of the delivery roller and the operation of the delivery of the solder yarn with the sawtooth by computer. (2) A thread solder delivery bobbin wound with thread solder,
A delivery roller capable of delivering the thread solder from the thread solder delivery bobbin, a tube-shaped guide capable of guiding the thread solder delivered from the delivery roller, and a thread fixed to a tip end portion of the tube-shaped guide. In a soldering device comprising a solder supply nozzle and a robot hand capable of lowering a robot soldering iron onto the thread solder sent from the thread solder supply nozzle for a predetermined time, the delivery roller and the tubular guide are provided. A saw toothed roller capable of engraving sawtooth-shaped irregularities on the upper surface side of the thread solder is provided between the sawtoothed rollers, and the sawtoothed thread solder in which the sawtooth irregularities are engraved on the upper surface side is the thread. A reflection type optical sensor is installed above the position where the solder supply nozzle passes, and the concave and convex signal of the sawtoothed thread solder detected by the reflection type optical sensor is provided. Device soldering, characterized in that formed by installing a control computer capable of performing the control and calculation of the delivery amount of the yarn with the saw teeth solder receives.

【0015】[0015]

【発明の実施の形態】次に、本発明のはんだ付方法及び
はんだ付装置の一実施例を図面により説明する。
BEST MODE FOR CARRYING OUT THE INVENTION Next, an embodiment of the soldering method and the soldering apparatus of the present invention will be described with reference to the drawings.

【0016】図1は本発明のはんだ付方法及びはんだ付
装置の一実施例を示した正面説明図である。
FIG. 1 is a front explanatory view showing an embodiment of a soldering method and a soldering apparatus of the present invention.

【0017】図1において1は糸はんだ送出ボビン、2
は糸はんだ、3は送出ローラ、4はチューブ状曲がりガ
イド、6は糸はんだ供給ノズル、7はロボットハンド、
8はロボット半田コテ、10は鋸歯付ローラ、11は鋸
歯付糸はんだ、12は反射型光センサである。
In FIG. 1, 1 is a thread solder delivery bobbin, 2
Is thread solder, 3 is a delivery roller, 4 is a tube-shaped bending guide, 6 is a thread solder supply nozzle, 7 is a robot hand,
Reference numeral 8 is a robot soldering iron, 10 is a sawtooth roller, 11 is a sawtooth thread solder, and 12 is a reflection type optical sensor.

【0018】次に、本発明のはんだ付方法及びはんだ付
装置の一実施例の動作について説明する。
Next, the operation of one embodiment of the soldering method and the soldering apparatus of the present invention will be described.

【0019】まず、図示しない駆動源を駆動させるとに
より送出ローラ3を稼動し、それにより糸はんだ送出ボ
ビン1より糸はんだ2を送り出す。
First, the delivery roller 3 is operated by driving a drive source (not shown), and thereby the thread solder 2 is delivered from the thread solder delivery bobbin 1.

【0020】次に、送出ボビン1より送り出された糸は
んだ2は鋸歯付ローラ10へ送り込まれる。
Next, the thread solder 2 delivered from the delivery bobbin 1 is delivered to the saw tooth roller 10.

【0021】図2は本発明のはんだ付方法及びはんだ付
装置の一実施例において、糸はんだを鋸歯付ローラへ送
り込み、その鋸歯付ローラによって糸はんだの上面側に
鋸歯を刻む様子を示した部分拡大正面説明図である。
FIG. 2 shows a part of the embodiment of the soldering method and the soldering device of the present invention in which the thread solder is fed to the saw-toothed roller and the saw-toothed roller is used to cut the saw-tooth on the upper surface side of the thread solder. It is an enlarged front explanatory view.

【0022】図2において2は糸はんだ、3は送出ロー
ラ、10は鋸歯付ローラ、11は鋸歯付糸はんだであ
る。
In FIG. 2, 2 is a solder wire, 3 is a delivery roller, 10 is a saw tooth roller, and 11 is a saw tooth thread solder.

【0023】即ち、鋸歯付ローラ10へ送り込まれた糸
はんだ2の上面側には図2に示すように鋸歯状の凹凸が
交互に、且つ等間隔に刻まれる。
That is, as shown in FIG. 2, serrated irregularities are alternately and equally spaced on the upper surface side of the thread solder 2 fed to the serrated roller 10.

【0024】次に、このように上面側に鋸歯状の凹凸が
交互に、且つ等間隔に刻まれた鋸歯付糸はんだ11はチ
ューブ状曲がりガイド4内へ送り込まれる。ここにおい
てチューブ状曲がりガイド4内へ送り込まれた鋸歯付糸
はんだ11はその上面側に鋸歯状の凹凸が交互に、且つ
等間隔に刻まれていることからチューブ状曲がりガイド
4の曲がり方向にスムーズに追従でき、それにより弛み
が発生しない。
Next, the saw-toothed thread solder 11 in which the saw-tooth-shaped irregularities are alternately and equally spaced on the upper surface side as described above is fed into the tube-shaped bending guide 4. Here, since the saw-toothed solder 11 fed into the tubular bending guide 4 has sawtooth-shaped irregularities alternately and equally spaced on its upper surface side, it is smooth in the bending direction of the tubular bending guide 4. Can be followed, so that slack does not occur.

【0025】次に、チューブ状曲がりガイド4内を通過
した鋸歯付糸はんだ11はそのチューブ状曲がりガイド
4の先端部に連結されている糸はんだ供給ノズル6を通
って図示しない電子部品のはんだ付部へ送り出される。
Next, the saw-toothed thread solder 11 passing through the tube-shaped bending guide 4 passes through a thread-solder supply nozzle 6 connected to the tip of the tube-shaped bending guide 4 to solder an electronic component (not shown). Sent to the department.

【0026】次に、鋸歯付糸はんだの送り量の検出方法
及び制御方法について説明する。
Next, a method for detecting and controlling the feed amount of the sawtoothed solder will be described.

【0027】図3は本発明のはんだ付方法及びはんだ付
装置の一実施例において、鋸歯付糸はんだの送り量の検
出様子を示した正面拡大説明図であって、その(a)は
鋸歯付糸はんだの凸面、つまり平らな面へ反射型光セン
サから光を照射してその反射光を検出できる様子を示し
た正面拡大説明図、(b)は鋸歯付糸はんだの凹面へ反
射型光センサから光を照射してその反射光を検出できな
い様子を示した正面拡大説明図である。
FIG. 3 is an enlarged front view showing how to detect the feed amount of the saw-toothed solder in the embodiment of the soldering method and the soldering apparatus of the present invention. FIG. 3B is a front enlarged explanatory view showing a state in which light can be emitted from the reflective optical sensor to the convex surface of the thread solder, that is, a flat surface, and the reflected light can be detected. FIG. 6 is an enlarged front view showing a state in which light is emitted from the head and reflected light cannot be detected.

【0028】図3において11は鋸歯付糸はんだ、12
は反射型光センサである。
In FIG. 3, 11 is a sawtooth thread solder, and 12
Is a reflection type optical sensor.

【0029】図3(a)から分かるように反射型光セン
サから鋸歯付糸はんだの凸面、つまり平らな面へ光を照
射したときには、その照射光はその凸面、つまり平らな
面から真っ直ぐに反射し、その結果反射型光センサはそ
の反射光を検出することができる。(反射光検出のON
信号) これに対して図3(b)から分かるように反射型光セン
サから鋸歯付糸はんだ11の凹面へ光を照射したときに
は、その照射光は斜め方向へ反射し、その結果反射型光
センサはその斜め方向へ向かう反射光を検出することが
できない。(反射光検出のOFF信号) 次に、このようにして検出した反射光検出のON信号と
反射光検出のOFF信号との繰り返し回数信号は図1及
び図3に図示しない制御コンピュータへ送信する。
As can be seen from FIG. 3A, when light is irradiated from the reflection type optical sensor to the convex surface of the saw-toothed thread solder, that is, the flat surface, the irradiation light is reflected straight from the convex surface, that is, the flat surface. As a result, the reflection type optical sensor can detect the reflected light. (ON of reflected light detection
(Signal) On the other hand, as can be seen from FIG. 3B, when light is irradiated from the reflection type optical sensor to the concave surface of the sawtooth solder 11, the irradiation light is reflected in an oblique direction, and as a result, the reflection type optical sensor. Cannot detect the reflected light traveling in the oblique direction. (Reflected Light Detection OFF Signal) Next, a signal indicating the number of repetitions of the reflected light detection ON signal and the reflected light detection OFF signal thus detected is transmitted to a control computer (not shown in FIGS. 1 and 3).

【0030】次に、このように反射光検出のON信号と
反射光検出のOFF信号との繰り返し回数信号を受信し
た図示しない制御コンピュータはその鋸歯付糸はんだ1
1の送り量を演算すると共に指定送り量となったときに
送出ローラ3を所定時間停止させる停止命令を出し、更
に、図1に示すロボットハンド7へ下降命令を出す。
Next, the control computer (not shown) that has received the signal for the number of repetitions of the ON signal for reflected light detection and the OFF signal for reflected light detection in this manner is the saw toothed solder 1
The feed amount of 1 is calculated, and when the designated feed amount is reached, a stop command for stopping the feed roller 3 for a predetermined time is issued, and further, a descending command is issued to the robot hand 7 shown in FIG.

【0031】次に、このように下降命令を受けたロボッ
トハンド7は下降し、それに伴いロボットハンド7の下
側に固定されているロボット半田コテ8も図示しない電
子部品のはんだ付部へ送り出されている鋸歯付糸はんだ
11へ接触し、その結果鋸歯付糸はんだ11が加熱、溶
融させてはんだ付け作業が自動的に行われる。
Next, the robot hand 7 which has received the descending instruction descends, and the robot soldering iron 8 fixed to the lower side of the robot hand 7 is also sent out to the soldering portion of the electronic component (not shown). The saw-toothed thread solder 11 is contacted, and as a result, the saw-toothed thread solder 11 is heated and melted, and the soldering operation is automatically performed.

【0032】このように本発明のはんだ付方法及びはん
だ付装置の一実施例によれば鋸歯付糸はんだの送り量を
正確に制御でき、それにより電子部品のハンダ付作業の
生産性と品質とを顕著に顕著に向上することができる。
As described above, according to one embodiment of the soldering method and the soldering apparatus of the present invention, it is possible to accurately control the feed amount of the saw-toothed thread solder, thereby improving the productivity and quality of soldering work of electronic parts. Can be significantly improved.

【0033】[0033]

【発明の効果】本発明のはんだ付方法及びはんだ付装置
によれば鋸歯付糸はんだの送り量を正確に制御でき、そ
れにより電子部品のハンダ付作業の生産性と品質とを顕
著に顕著に向上することができるものであり、工業上有
用である。
According to the soldering method and the soldering apparatus of the present invention, it is possible to accurately control the feed amount of the saw-toothed thread solder, which remarkably improves the productivity and quality of the soldering work of the electronic component. It can be improved and is industrially useful.

【図面の簡単な説明】[Brief description of drawings]

【図1】図1は本発明のはんだ付方法及びはんだ付装置
の一実施例を示した正面説明図である。
FIG. 1 is a front explanatory view showing an embodiment of a soldering method and a soldering apparatus of the present invention.

【図2】本発明のはんだ付方法及びはんだ付装置の一実
施例において、糸はんだを鋸歯付ローラへ送り込み、そ
の鋸歯付ローラによって糸はんだの上面側に鋸歯を刻む
様子を示した部分拡大正面説明図である。
FIG. 2 is a partially enlarged front view showing a state in which a thread solder is fed to a saw tooth roller and saw teeth are cut on the upper surface side of the thread solder by the saw tooth roller in one embodiment of the soldering method and the soldering apparatus of the present invention. FIG.

【図3】本発明のはんだ付方法及びはんだ付装置の一実
施例において、鋸歯付糸はんだの送り量の検出様子を示
した正面拡大説明図であって、その(a)は鋸歯付糸は
んだの凸面、つまり平らな面へ反射型光センサから光を
照射してその反射光を検出できる様子を示した正面拡大
説明図、(b)は鋸歯付糸はんだの凹面へ反射型光セン
サから光を照射してその反射光を検出できない様子を示
した正面拡大説明図である。
FIG. 3 is a front enlarged explanatory view showing how to detect the feed amount of the sawtooth thread solder in the embodiment of the soldering method and the soldering apparatus of the present invention, in which (a) is sawtooth thread solder. Is an enlarged front view showing how the reflected light sensor can detect the reflected light by irradiating the convex surface, that is, the flat surface, with the light from the reflective light sensor to the concave surface of the sawtooth thread solder. FIG. 4 is an enlarged front view showing how the reflected light cannot be detected by illuminating.

【図4】従来のはんだ付方法及びはんだ付装置を示した
正面説明図である。
FIG. 4 is a front explanatory view showing a conventional soldering method and a conventional soldering apparatus.

【符号の説明】[Explanation of symbols]

1 糸はんだ送出ボビン 2 糸はんだ 3 送出ローラ 4 チューブ状曲がりガイド 5 弛み箇所 6 糸はんだ供給ノズル 7 ロボットハンド 8 ロボット半田コテ 10 鋸歯付ローラ 11 鋸歯付糸はんだ 12 反射型光センサ 1 Thread solder delivery bobbin 2 Thread solder 3 Sending roller 4 Tube-shaped bending guide 5 slack 6 Thread solder supply nozzle 7 Robot hand 8 Robot soldering iron 10 Saw toothed roller 11 Sawtooth thread solder 12 Reflective optical sensor

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】長尺の糸はんだを送出ローラ、チューブ状
ガイド、糸はんだ供給ノズルを順次通過させてからはん
だ付部材のはんだ付箇所上へ送り出し、然る後該はんだ
付部材上へ下部側にロボット半田コテが設置されている
ロボットハンドを所定時間下降させることによって、前
記はんだ付部材上へはんだ付作業を自動的に行うことが
できるはんだ付方法において、前記送出ローラから送り
出された前記糸はんだを鋸歯付ローラを通過させること
によって上面側へ鋸歯状の凹凸を刻ませてから該鋸歯付
糸はんだが前記チューブ状ガイドを介して前記糸はんだ
供給ノズルを通過した直後に該鋸歯付糸はんだの上面側
へ光を照射すると共にその反射光の有無を反射型光セン
サにより検出させ、然る後該検出信号を制御コンピュー
タへ送信させて該制御コンピュータによって前記鋸歯付
糸はんだの送出量の演算と前記送出ローラの回転制御と
を行わせるようにすることを特徴とするはんだ付方法。
1. A long thread solder is passed through a delivery roller, a tube-shaped guide and a thread solder supply nozzle in this order, and then sent out onto a soldering portion of a soldering member, and then, onto the soldering member on a lower side. In the soldering method capable of automatically performing the soldering work on the soldering member by lowering the robot hand having the robot soldering iron installed therein for a predetermined time, the yarn sent from the delivery roller Immediately after the sawtooth-shaped unevenness is formed on the upper surface side by passing the solder through the sawtooth roller, the sawtoothed thread solder is passed immediately after the sawtoothed thread solder passes through the threaded solder supply nozzle through the tubular guide. The upper surface side of the is irradiated with light and the presence or absence of the reflected light is detected by a reflection type optical sensor, and then the detection signal is transmitted to a control computer to Soldering method which is characterized in that so as to perform the rotation control of the delivery roller and the operation of the delivery of the solder yarn with the sawtooth by your computer.
【請求項2】糸はんだを巻かれている糸はんだ送出ボビ
ンと、該糸はんだ送出ボビンから糸はんだを繰り出すこ
とができる送出ローラと、該送出ローラから送り出され
た前記糸はんだをガイドすることができるチューブ状ガ
イドと、該チューブ状ガイドの先端部に固定された糸は
んだ供給ノズルと、該糸はんだ供給ノズルから送り出さ
れた前記糸はんだ上へロボット半田コテを所定時間下降
できるロボットハンドとを具備して成るはんだ付装置に
おいて、前記送出ローラと前記チューブ状ガイドとの間
に前記糸はんだの上面側へ鋸歯状の凹凸を刻ませること
ができる鋸歯付ローラを設置し、且つ該鋸歯付ローラに
より上面側へ鋸歯状の凹凸を刻ませた鋸歯付糸はんだが
前記糸はんだ供給ノズルを通過する位置上に反射型光セ
ンサを架設し、しかも該反射型光センサが検出した前記
鋸歯付糸はんだの凹凸信号を受信して該鋸歯付糸はんだ
の送出量の演算と制御とを行うことができる制御コンピ
ュータを設置して成ることを特徴とするはんだ付装置。
2. A thread solder delivery bobbin wound with the thread solder, a delivery roller capable of delivering the thread solder from the thread solder delivery bobbin, and a guide for the thread solder delivered from the delivery roller. And a robot hand capable of descending the robot soldering iron for a predetermined time onto the thread solder sent from the thread solder supply nozzle. In the soldering device, a saw tooth roller capable of engraving saw tooth-shaped irregularities on the upper surface side of the thread solder is provided between the delivery roller and the tubular guide, and the saw tooth roller is used. Install a reflection type optical sensor on the position where the saw-toothed wire solder with sawtooth-shaped irregularities on the top surface passes through the wire solder supply nozzle. Also, a control computer is provided which is capable of receiving a concave-convex signal of the saw-toothed thread solder detected by the reflection type optical sensor and performing calculation and control of a delivery amount of the saw-toothed thread solder. Soldering equipment.
JP2001379405A 2001-12-13 2001-12-13 Method and device for soldering Withdrawn JP2003181633A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001379405A JP2003181633A (en) 2001-12-13 2001-12-13 Method and device for soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001379405A JP2003181633A (en) 2001-12-13 2001-12-13 Method and device for soldering

Publications (1)

Publication Number Publication Date
JP2003181633A true JP2003181633A (en) 2003-07-02

Family

ID=27591026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001379405A Withdrawn JP2003181633A (en) 2001-12-13 2001-12-13 Method and device for soldering

Country Status (1)

Country Link
JP (1) JP2003181633A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012207990A (en) * 2011-03-29 2012-10-25 Fujitsu Ltd Solder state detection device
JP2015115427A (en) * 2013-12-11 2015-06-22 株式会社パラット Soldering device and method
KR101548461B1 (en) 2014-05-21 2015-08-31 주식회사 넥스뷰티엑스 Soldering device
KR101711877B1 (en) * 2015-08-31 2017-03-03 (주)다원넥스뷰 Laser Soldering Device Having Wire Feeding System
WO2017196137A1 (en) * 2016-05-13 2017-11-16 한국기계연구원 Device for supplying wire for manufacturing three-dimensional object
CN107498138A (en) * 2017-10-11 2017-12-22 南京信息工程大学 A kind of electronic double rollers squash type feeder of pen type solder stick

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012207990A (en) * 2011-03-29 2012-10-25 Fujitsu Ltd Solder state detection device
JP2015115427A (en) * 2013-12-11 2015-06-22 株式会社パラット Soldering device and method
KR101548461B1 (en) 2014-05-21 2015-08-31 주식회사 넥스뷰티엑스 Soldering device
KR101711877B1 (en) * 2015-08-31 2017-03-03 (주)다원넥스뷰 Laser Soldering Device Having Wire Feeding System
WO2017196137A1 (en) * 2016-05-13 2017-11-16 한국기계연구원 Device for supplying wire for manufacturing three-dimensional object
CN107498138A (en) * 2017-10-11 2017-12-22 南京信息工程大学 A kind of electronic double rollers squash type feeder of pen type solder stick

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