KR101548461B1 - Soldering device - Google Patents

Abstract

The present invention relates to a solder supplying device of a soldering system. The purpose is to prevent the failure of soldering and maintain the input/output of a wire by forming a driving roller for providing a driving force to the wire on a side of a control housing. For this, the present invention, in a solder supplying device of a soldering system which provides a wire to mount a circuit on a PCB, includes a driving roller (84a) which is formed on or near a side of a control housing (86) or to accurately input/output the wire.

Description

[0001] SOLDERING DEVICE [0002]

The present invention relates to a solder supplying device of a soldering system, and more particularly, to a soldering apparatus for supplying solder to a soldering system by providing a driving roller for providing a driving force to a door in one side of the adjusting housing, To the solder supply system of the soldering system.

In general, Surface Mounted Technology (SMT) is a technique of mounting a surface mount electronic component on a printed circuit board (PCB) surface and soldering it.

The surface mounting technology has been widely used today because it has many advantages that the space of the electronic parts can be closely spaced, both sides of the substrate can be used, and the area of the printed circuit board can be reduced.

Currently, there are reflow soldering using heat conduction or infrared ray as the soldering technology of the surface mounting type component which is widely used.

1, a soldering apparatus 1 includes a base 2, a semiconductor chip and a PCB element supplying means 3, a soldering stage 4, a gripper means 5, , A laser assembly (6), a camera module (7) and a solder (8).

The base 2 is mounted on a floor, and a support 2a, which is parallel to the upper surface, is vertically provided on one side of the base.

The semiconductor chip and the PCB element supplying means 3 are provided on one side of the base 2 to mount and transfer a plurality of semiconductor chips and PCB elements on a tray. The semiconductor chip and the PCB element are provided on the upper part of the transfer rail and the transfer rail in such a manner that the tray is removably seated. And is reciprocally transported.

The soldering stage 4 includes a semiconductor chip mounted on the upper surface of the base 2 so as to be rotatable in the front, rear, left, and right directions from the upper portion of the base 2 and equipped with a plurality of semiconductor chips and PCB- For laser soldering PCB devices.

The gripper means 5 includes a guide rail provided on the front surface of the support 2a of the base 2, a first movable body provided horizontally horizontally on the guide rail, And a finger for holding and transferring the semiconductor chip and the PCB element.

The laser assembly 6 includes a second movable body that is installed to be capable of moving left and right from a support base 2a of the base 2 and a second movable body that is installed on both sides of the lower portion of the second movable body so as to be angle- To irradiate a soldering portion of the semiconductor chip mounted on the stage 4 with a beam to preheat the semiconductor chip.

The camera module 7 is mounted on a second moving body constituting the laser assembly 6 so as to photograph the soldering parts of the semiconductor chip and the PCB element mounted on the stage so as to display images, 4, the gripper means 5, and the laser assembly 6 to the control unit.

The solder 8 is provided at an opposite position of the laser assembly 6 and is a means for providing a wire 81 for soldering, that is, a lead.

2, the solder 8 includes a housing 82, a bobbin 83 formed on the inner side of the housing 82 to wind the wire 81, A driving roller 84 provided at one side of the housing 82 to provide a driving force to move the wire 81 forward or backward by a predetermined amount according to a control signal of the control unit, A flexible pipe 85 into which the wire 81 is inserted so as to protect the wire 81 and a regulating housing 86 arranged at the end of the flexible pipe 85 for regulating the position of the wire 81 to be supplied at a specified position ).

The solder 8 is positioned at the position to be soldered according to the control signal of the control unit and the wire 81 is advanced by the driving force of the driving roller 84 to be supplied to a predetermined amount, Soldering is effected through the laser assembly 6.

Thereafter, when a driving force in the reverse direction is provided by the driving roller 84, the wire 81 is moved backward so that it is ready for the next soldering.

However, the conventional solder 8 has a problem that the distance from the bobbin 83 to the regulating housing 86 and the distance between the bobbin 83 and the flexible pipe 85 can be reduced by providing the drive roller 84 close to the bobbin 83, There is a problem that the supply distance of the wire 81 is irregular due to interference, resulting in defective soldering.

Especially, as shown in FIGS. 3A and 3B, since the adjustment housing 86 moves according to the position for soldering, the flexible pipe 85 also moves accordingly, so that a bent curved portion 85a is generated . At this time, in the curved portion 85a, a clearance S is formed between the wire 81 and the flexible pipe 85, not in a concentric state, but shifted to one side. As a result, the deviation S due to the clearance S As the length of the wire 81 becomes longer or shorter, the amount of movement of the wire 81 advancing or retracting due to the driving force provided by the driving roller 84 varies.

The curved portion 85a of the flexible pipe 85 keeps a part of the wire 81 in close contact with the curved portion 85a so that the driving force of the driving roller 84 advances or retreats There is a problem in that smooth advancement or backward movement can not be performed due to the frictional force of the portion curved portion 85a to which the wire 81 adheres.

As a result, the curved portion 85a of the flexible pipe 85 makes the amount of the wire 81 irregular, thereby causing a problem of soldering failure.

In addition, the conventional solder 8 is prevented from being soldered after the soldering through the wire 81 is completed. However, as described above, the curved portion 85a smoothly retreats There is a problem in that excessive soldering is performed to cause defective soldering.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems, and it is an object of the present invention to provide an apparatus and a method for controlling a soldering operation, And the solder of the soldering device.

It is a further object of the present invention to provide a method for controlling the amount of movement of the wire by accurately measuring the amount of the wire inserted and drawn out by the driving force of the driving roller So as to prevent defective soldering.

Another object of the present invention is to provide a solder of a soldering apparatus which relieves defective soldering by reliable retraction of a wire by the cylinder having a mechanical operating relationship by constituting a cylinder on one side of the regulating housing.

According to an aspect of the present invention, there is provided a solder of a soldering apparatus configured to provide a wire for mounting a circuit on a printed circuit board (PCB), the solder including: And a driving roller at a position where the driving roller is rotated.

In the present invention, it is preferable that at one end of the adjustment housing, a cover is provided on the inner side of the drive roller to protect the drive roller.

According to an embodiment of the present invention, it is preferable that the adjusting housing further includes a first sensor for measuring a substantially entering and exiting amount of the wire entering and exiting by the driving force of the driving roller so that the wire is precisely inserted and removed.

In the present invention, it is preferable that the first sensor is an encoder.

In the present invention, it is preferable that the solder further includes a cylinder for providing a driving force for retracting the wire by a predetermined length in accordance with a control signal of the controller after the soldering through the wire is completed.

According to the present invention, the drive roller for providing the driving force to the guard is formed on one side of the adjustment housing, thereby achieving an effect of preventing the soldering failure by keeping the amount of the wire entering and leaving uniformly.

Further, a first sensor is formed on one side of the adjustment housing, and the actual amount of the wire that goes in and out by the drive force of the drive roller is measured by the first sensor, thereby accurately controlling the amount of wire entry and exit, And the like.

Further, by constituting the cylinder on one side of the adjustment housing, there is an effect of solving the defective soldering by reliable retraction of the wire by the cylinder having a mechanical operating relationship.

1 is a schematic perspective view of a conventional soldering system;
2 is a schematic front view of a conventional solder;
FIGS. 3A and 3B are partially enlarged views showing interference states of a flexible piping and a wire of a conventional solder;
4 is a schematic front view of a solder feeder according to a first embodiment of the present invention;
5 is a partially enlarged view showing an engaging relationship between the driving roller and the regulating housing according to the first embodiment of the present invention.
6 is a partially enlarged view showing an engaging relationship between the driving roller and the regulating housing according to the second embodiment of the present invention.
7 is a schematic perspective view of a soldering system according to a third embodiment of the present invention;

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings (the same reference numerals are used for the same components as the conventional ones, and a detailed description thereof will be omitted).

≪ Embodiment 1 >

4, the solder supply device 8a of the first embodiment includes a housing 82, a bobbin 83 formed in the housing 82 and wound with a wire 81, A flexible pipe 85 into which the wire 81 is inserted to protect the wire 81 exposed to the outside of the flexible pipe 85, an adjustment housing 86 formed at the end of the flexible pipe 85, And a driving roller 84a provided at one side of the wire 86 to provide a driving force to move the wire 81 in and out.

A cover 84b, on which the driving roller 84a is mounted, is formed on one side of the adjustment housing 86. The drive roller 84a may be disposed inside the adjustment housing 86 so that the drive roller 84a can move the flexible wire 85a without interfering with bending of the flexible pipe 85, It is possible to constitute any position as long as it can control the amount of entrance and exit of the door 81.

The driving roller 84a is composed of a plurality of opposed opposite ends of the wire 81 so that the wire 81 is conveyed by frictional force.

The use of the solder in the soldering apparatus constructed as above will be described below.

First, when a control signal is transmitted to the driving roller 84a by the control unit 10, a driving force is provided by the driving roller 84a, and a wire 81 closely attached to the driving roller 84a is moved forward or backward And is inserted into and removed from one end of the adjustment housing 86 as shown in FIG.

5, the driving roller 84a is installed close to the adjusting housing 86 in which the wire 81 is moved in and out, so that the driving force of the driving roller 84a is transmitted to the wire 81 The amount of the wire 81 can be precisely and precisely controlled, thereby preventing defective soldering.

Since the driving roller 84a is installed close to the adjustment housing 86, the interference due to the curved portion such as the bending of the flexible pipe 85 formed between the housing 82 and the adjustment housing 86 The amount of movement of the wire 81 can be controlled regardless of whether or not the wire 81 is in contact with the wire 81.

≪ Embodiment 2 >

The same reference numerals are used for the same components as those in the first embodiment, and a detailed description thereof will be omitted.

6, the solder supply device 8a of the second embodiment measures the substantial amount of the wire 81 that is moved in and out by the driving force of the drive roller 84a, The first sensor 90 is configured to control the amount of the fluid.

Preferably, the first sensor 90 is disposed on one side of the regulating housing 86. However, the present invention is not limited thereto, and it is possible to install the wire 81 at any position as long as it can measure the substantial amount of the wire 81.

The first sensor 90 is preferably an encoder capable of measuring the amount of displacement by the number of revolutions. Of course, the present invention is not limited to this, and the first sensor 90 may be any sensor capable of measuring a substantial amount of movement of the wire 81.

Thus, when the driving force is supplied from the driving roller 84a in accordance with the control signal from the control unit 10, the wire 81 is moved in and out of the adjustment housing 86. At this time, The first sensor 90 measures the actual amount of the wire 81 to be inserted or removed.

At this time, when the amount of the entrance and exit measured by the first sensor 90 is less than the amount of entrance and exit required by the control unit 10, the control unit 10 transmits a control signal to the drive roller 84a, The controller 90 transmits a control signal to the drive roller 84a until the amount of movement measured by the first sensor 90 and the amount of movement required by the control unit 10 become equal to each other.

The amount of the wire 81 measured by the first sensor 90 may be controlled so that the actual amount of movement of the wire 81 measured by the first sensor 90 during the movement of the wire 81 by the driving force of the driving roller 84a, The amount of movement of the wire 81 is controlled by stopping the control signal transmitted to the driving roller 84a by the control unit 10 when the amount of input / output requested by the control unit 10 is reached.

Therefore, it is possible to precisely and precisely control the amount of wire 81 to be controlled by the driving roller 84a and the first sensor 90, thereby achieving accurate soldering.

The first sensor 90 may be configured to provide an encoder to any one or both of the plurality of driving rollers 84a to perform the role of the first sensor 90. [

≪ Third Embodiment >

The same reference numerals are used for the same components as those of the first and second embodiments, and a detailed description thereof will be omitted.

In the solder 8 of the third embodiment, as shown in Fig. 7, the cylinder 100 is configured to mechanically retract the wire 81 after completing the soldering.

The cylinder 100 includes a cylinder main body and a piston main body having one side inserted into the cylinder main body and the other side fixed to one side of the adjustment housing 86 of the solder 8, And a rod 102.

In addition, the cylinder 100 is provided with a fixing bracket 104 for fixing the cylinder 100 so that the cylinder 100 is stably fixed.

In addition, the cylinder 100 is used either as hydraulic or pneumatic depending on the purpose of use and the installation state. In this case, it is preferable to construct a pneumatic cylinder having a high reactivity.

One end of the piston rod 102 is fixed to the regulating housing 86 so that when the regulating control signal is input through the controller 10, the regulating housing 86 is retracted, The exposed wire 81 is also retracted.

The piston rod 102 is not limited to one end fixed to the adjustment housing 86. When the retraction control signal of the controller 10 is inputted, the piston rod 102 can be retracted by a predetermined length Any location can be fixed. For example, either one side of the flexible pipe 85 or the drive roller 84a may be fixed to the cover 84b etc. constituted.

The fixing bracket 104 is a means for stably fixing the cylinder 100. In some cases, the fixing bracket 104 may be omitted and the cylinder 100 may be fixed to one side of the main body or one side of the housing 82 of the solder 8.

That is, the cylinder 100 can be fixed at any position where it is not interfered with the operation of retracting the wire 81 by the sliding force of the forward or backward movement of the piston rod 102 by a predetermined length.

Therefore, by mechanically reliably retreating the wire 81 of the solder 8 soldered by the cylinder 100, the defective rate of soldering is minimized.

The above description is only one embodiment for implementing the soldering of the soldering apparatus, and the present invention is not limited to the above embodiment. It will be understood by those skilled in the art that various changes may be made without departing from the spirit of the invention.

8a: Solder feeder 81: Wire
82: housing 83: bobbin
84, 84a: drive roller 84b: cover
85: Flexible piping 85a: Curved portion
86: regulating housing 90: first sensor
100: Cylinder 102: Piston rod

Claims (5)

1. A solder feeder of a soldering system configured to provide a wire for mounting a circuit on a printed circuit board (PCB)
And a plurality of driving rollers (84a) at one side or near the regulating housing (86) so that the wire (81) can be precisely inserted and removed;
One end of the regulating housing 86 includes a cover 84b in which the plurality of drive rollers 84a are configured to be inwardly to protect the plurality of drive rollers 84a;
A first sensor 90 (see FIG. 1) is provided at one end of the adjustment housing 86 for measuring a substantial amount of the wire 81 entering and exiting by the driving force of the plurality of driving rollers 84a, );
The solder supplying device 8a includes a cylinder 100 for providing a driving force for retracting the wire 81 by a predetermined length in accordance with a control signal of the controller 10 after soldering through the wire 81 is completed ;
The cylinder 100 includes a piston rod 102 for advancing or retracting the wire 81, and a fixing bracket 104 for stably fixing the cylinder 100.
And a solder supply device for supplying solder to the solder supply device.
delete delete The method according to claim 1,
The first sensor (90) comprises: an encoder;
And the solder supply device is a solder supply device. delete

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