JP2018186180A - Soldering device and soldering method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To more surely exclude a soldering defective product by providing a soldering system capable of detecting a soldering defect, a soldering state inspection device, a soldering state inspection method and a product manufacturing method.SOLUTION: A soldering device 1a comprises: a solder piece quantitative supply part 50 which quantitatively supplies a solder piece; a nozzle 24 including an insertion hole 26 through which a quantitatively supplied solder piece 2a is inserted; and a heater 36 by which the solder piece 2a in the nozzle 24 is heated and fused. An inspection device 1c comprises: an inspection device control part 1C, an imaging part 70 and an emitted and received light control part 75 for acquiring soldered part state data consisting of at least one of an area, a height, a volume and a mass of a soldered part 110; and a discrimination part 98 for discriminating whether implemented soldering is appropriate based on reference data that are predetermined as data to be acquired in the case of normal soldering with a solder quantity of supplied solder pieces 2a, and the soldered part state data that are acquired after soldering.SELECTED DRAWING: Figure 4

Description

  The present invention relates to, for example, a soldering apparatus and a soldering method for soldering a terminal connected to an electronic component passed through a hole in a board to a land of the board around the hole.

  Conventionally, a soldering apparatus for mechanically soldering an electronic component to a printed circuit board has been provided. This soldering device uses a flow soldering method in which a printed circuit board is brought into contact with the solder liquid surface, or a solder paste is preliminarily printed on the circuit board in accordance with a pattern, and the cream solder is heated to be melted. Various methods have been proposed, such as a reflow soldering method in which soldering is performed with a solder.

  Here, the applicant uses a cylindrical soldering iron, inserts the pin of the electronic component inserted into the through hole of the printed circuit board into the soldering iron, melts the solder inside, and solders it. A soldering device has been developed and provided (see Patent Document 1).

  The soldering iron temperature, the position of the soldering iron, the load of the soldering iron, and the amount of solder supply are checked at a predetermined timing, such as when the equipment is started up or during operation, to ensure the reliability and reliability of soldering. The improvement of the property is aimed at (refer patent document 2).

  However, there has been a desire to more reliably supply a properly soldered product.

JP 2013-120869 A Japanese Patent Laying-Open No. 2015-115427

  In view of the above-described problems, the present invention provides a soldering system, a soldering state inspection device, a soldering state inspection method, and a product manufacturing method that can detect a soldering failure, and a product with a soldering failure more reliably. The purpose is to eliminate.

  The present invention is a soldering system including a soldering device for soldering a first conductor and a second conductor, and an inspection device for inspecting a soldered portion soldered by the soldering device, The attaching device includes a solder piece quantitative supply unit for supplying a fixed amount of solder pieces, a nozzle having an insertion hole for inserting the solder pieces supplied in a fixed quantity, and a heating means for heating and melting the solder pieces in the nozzle, The inspection apparatus includes a soldering part state acquisition unit that acquires soldering part state data including at least one of an area, a height, a volume, and a mass of the soldering part, and a solder piece quantitative supply unit. Reference data predetermined as data acquired by the soldering portion state acquisition means when the soldering amount of the supplied solder pieces is normally soldered, and the soldering portion acquired after soldering Soldering system including determination means for determining whether soldering is performed based on state data, soldering state inspection device used therefor, soldering state inspection method using the same, and product manufacturing method It is characterized by being.

  According to the present invention, it is possible to provide a soldering system, a soldering state inspection device, a soldering state inspection method, and a product manufacturing method that can detect a soldering failure.

The right view of a soldering system. Explanatory drawing of the external appearance structure of a soldering system. The expanded sectional view which shows the structure of a nozzle unit and a heater unit. The block diagram which shows the structure of the drive system and control system of a soldering system. The functional block diagram which shows the function of the control part of a soldering system. Explanatory drawing explaining the operation | movement which test | inspects by soldering. Explanatory drawing explaining the state of poor soldering with an end view.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  1 and 2 are explanatory views of an external configuration of a soldering system 1 having a soldering device 1a, a conveying device 1b, and an inspection device 1c. FIG. 1 is a right side view, FIG. 2 (A) is a front view, FIG. 2B is a plan view in which a part of the exterior of the head portion 3 of the soldering apparatus 1a is omitted.

  As shown in FIG. 1, in the soldering system 1, a soldering device 1a is disposed outside the conveyance width direction of the conveyance path 9 so that the soldering target on the conveyance path 9 by the conveyance device 1b can be soldered. An inspection device 1c is mounted on the soldering device 1a. In this embodiment, the inspection apparatus 1c is mounted on the soldering apparatus 1a. However, the soldering apparatus 1a and the inspection apparatus 1c are configured as separate and independent apparatuses, and the soldering apparatus 1a is provided in the front stage of the conveyance path 9. The inspection apparatus 1c may be disposed downstream. In addition, when mounting the inspection device 1c on the soldering device 1a, in this embodiment, it is arranged on the right side of the nozzle 24. However, an appropriate position such as the left side of the nozzle 24, the front surface, the back surface, or other positions. You may arrange in.

  The soldering apparatus 1a includes a head unit 3 having a nozzle 24 (soldering iron) for soldering to a through hole of a printed circuit board P to be soldered, and an air suspension unit that brings the head unit 3 and the nozzle 24 into a floating state. 5, a proximity / separation direction moving unit 6 for moving the air suspension unit 5 and the nozzle 24 in a direction (vertical direction in FIG. 1) to approach / separate the soldering target, and the proximity / separation direction moving unit 6 and the nozzle 24 to the printed circuit board. A transport direction moving unit 7 that moves in the transport direction in which P is transported (the depth direction in FIG. 1, the left-right direction in FIG. 2A), and the transport width of the transport direction moving unit 7 and the transport direction moving unit 7 and the nozzle 24 A transport width direction moving unit 8 that moves in a direction (left-right direction in FIG. 1, front-rear direction in FIG. 2A); It is.

  On the upper part of the air suspension unit 5, a thread solder 2 wound around a reel is provided. The thread solder 2 can be φ0.3 to φ2.0 mm, and is preferably φ0.6 to φ1.6 mm.

Below the head unit 3, a nozzle unit 20 including a nozzle 24 and an imaging unit 70 of the inspection apparatus 1c are provided.
The upper surface of the transport width direction moving unit 8 is configured to have substantially the same height as the upper surface of the transport path 9 that transports the printed circuit board P.

  The movable range of the head unit 3 includes a standby position (position P1 shown in FIG. 1) located above the transport width direction moving unit 8 and soldering areas E1 and E2 for soldering the printed circuit board P (FIG. 1). 2 (B) is an area surrounded by E1 and E2. The head unit 3 is moved by the approaching / separating direction moving unit 6 at any of the standby position and the soldering area.

  With this configuration, the soldering apparatus 1a waits the nozzle unit 20 at the height and position of the standby position P1 during standby, and from the standby position P1 within the soldering regions E1 and E2 when performing the soldering process. Also, soldering is performed at a height of the soldering position P2 that is lower (close to the soldering target).

  Further, after soldering, the soldering apparatus 1a moves up to the height of the soldering position P1 with the position in the horizontal direction (XY direction) as it is (that is, the position where soldering is performed). Imaging is performed and inspection by the inspection apparatus 1c is performed. It should be noted that the position at the time of imaging is preferably set so that the soldered part that is soldered by being appropriately moved in the horizontal direction (XY direction) according to the installation position of the imaging unit 70 can be reliably imaged.

  FIG. 3 is an enlarged cross-sectional view showing the configuration of the nozzle unit 20 and the heater unit 30. The vicinity of the nozzle unit 20 includes a heater unit mounting unit 40 that attaches and detaches the heater unit 30, a heater unit 30 that heats the thread solder 2 (see FIG. 1), and a nozzle unit 20 that includes a nozzle 24.

  The nozzle unit 20 includes a nozzle 24 serving as a soldering iron and a nozzle holder 21 (attachment / detachment means, nozzle unit fixing means) for attaching and detaching the nozzle 24 to / from the heater unit 30.

  The nozzle 24 is formed in a cylindrical shape from ceramic and includes a columnar insertion hole 26 in the center. The insertion hole 26 communicates from the distal end surface 24d side where the terminal T (first conductor) is inserted to the base side which supplies the solder piece 2a (see FIG. 6A). Further, the nozzle 24 is provided with a side hole 23 that connects the insertion hole 26 and the outside in the vicinity of the tip portion where soldering is performed. By this side hole 23, fumes generated in the nozzle 24 can be discharged to the outside.

  On the base side (upper side in the figure) of the nozzle 24, there is provided a nozzle holder 21 that wraps around the outer periphery of the nozzle 24 and has a fixing screw groove 21a (female screw) on the inner surface. The nozzle holder 21 is fixed to the nozzle 24 so as not to rotate relative to the nozzle 24 by the rotation stopper 22. The screw groove 21a of the nozzle holder 21 is screwed and fixed to the screw groove 35a (male screw) of the heater unit 30. Between the inner side of the nozzle holder 21 and the outer side of the nozzle 24, a cylindrical space 21b into which a cylindrical heater 36 is inserted is provided. The space 21b is provided from the base of the nozzle 24 to the tip side slightly from the center.

The heater unit 30 includes a heater holder 35 having a base side (upper side in the figure) as a mounting side and a tip side (lower side in the figure) formed in a substantially cylindrical shape, and a cylindrical heater 36 (heating means) provided inside the heater holder 35. ) And a cylindrical solder introduction cylinder 34 provided inside the heater 36.
The heater 36 is preferably formed symmetrically with respect to the axis, and more preferably has a configuration in which the internal nozzle 24 is heated substantially uniformly from the periphery. In this embodiment, the heater 36 is formed in a cylindrical shape.
The tip of the solder introduction cylinder 34 abuts on the base of the nozzle 24 inserted into the heater 36, and a hole 34 a in the solder introduction cylinder 34 communicates with the insertion hole 26 of the nozzle 24.

  Thereby, the cut yarn solder 2 (see FIG. 1) supplied from above passes through the hole 34 a and the insertion hole 26 and is heated and melted by the nozzle 24 heated by the heater 36.

  On the base side (upper side in the drawing) of the heater holder 35, a positioning pin 31 protruding from the connection side surface (upper surface in the drawing), a magnet 33a disposed on the connection side surface, and a connector 32 are provided.

  The magnet 33a is fixed to a detachable knob 33 (detachment means, heater unit fixing means), and is biased toward the mounting unit 40 by a spring 33b. The magnet 33a is attracted to the metal plate 45 of the mounting unit 40 by a magnetic force, so that the heater unit 30 is fixed to the mounting unit 40. Then, when the heater unit 30 is removed, the magnet 33a is separated from the metal plate 45 by pulling the detachable knob 33 in the solder introduction direction (downward in the figure) by the detachable air cylinder 65 (see FIG. 4), thereby attracting the magnetic force. Is weakened and the heater unit 30 is detached.

  The connector 32 is connected to the connect pin 41 of the mounting unit 40 and enables power supply to the heater 36 and the temperature sensor 64 (see FIG. 4) through the heater power supply line and the temperature sensor line.

  The positioning pin 31 is inserted into a positioning bush 42 formed on the mounting surface side (lower surface side in the drawing) of the mounting unit 40 to position the relative position of the mounting unit 40 and the heater unit 30. Thereby, the solder introduction hole 43 of the mounting unit 40 and the hole 34a of the heater unit 30 are connected so that the cut yarn solder 2 (see FIG. 1) can be supplied smoothly.

  The mounting unit 40 is provided with a solder introduction hole 43 penetrating in the mounting direction of the heater unit 30, and a metal plate 45 is provided on the connection surface side (lower surface side in the drawing). Further, a connection pin 41, a positioning bush 42, and a heater unit contact confirmation sensor 44 connected to the control unit 61 (control means, see FIG. 4) are provided on the connection surface side (illustrated lower surface side) of the mounting unit 40. .

  The heater unit contact confirmation sensor 44 is composed of an appropriate sensor such as a proximity sensor, and detects whether or not the heater unit 30 is in close contact with the mounting unit 40.

  FIG. 4 is a block diagram showing the configuration of the drive system and control system of the soldering apparatus 1a. The soldering apparatus 1a includes a conveyance guide 7f in the Y direction that is fixed to the conveyance width direction moving unit 8 (see FIG. 1) and extends straight toward the conveyance path 9 (see FIG. 1), and a drive mechanism unit 7e such as a stepping motor. Thus, a conveyance guide 7c that moves along the conveyance guide 7f is provided. The drive mechanism 7e and the conveyance guide 7f are accommodated in the conveyance width direction moving unit 8 (see FIG. 1). The conveyance guide 7 c extends straight in the conveyance direction (X direction) of the conveyance path 9.

  The upper part of the X-direction conveyance guide 7c is composed of a moving body 7a that moves in the X direction along the conveyance guide 7c and a stepping motor that moves the moving body 7a in the X direction along the conveyance guide 7c. A drive mechanism portion 7b is provided. The moving body 7a, the drive mechanism 7b, and the transport guide 7c are housed in the transport direction moving unit 7 (see FIG. 1). The moving body 7a, the drive mechanism unit 7b, the transport guide 7c, the drive mechanism unit 7e, and the transport guide 7f function as a nozzle position moving unit that moves the nozzle 24 to an arbitrary position to be operated.

  The moving body 7a is provided with a Z-direction transport guide 5c extending in a direction in which the nozzle 24 approaches / separates from the through hole. The transport guide 5c is provided with a head fixing portion 5a that moves in the Z direction, and a drive mechanism portion 5b that includes a stepping motor and the like. The head fixing unit 5a, the drive mechanism unit 5b, and the conveyance guide 5c function as a proximity / separation direction moving unit that moves the nozzle 24 in a direction to approach / separate the soldering target, and the proximity / separation direction moving unit 6 (see FIG. 1). ).

  The Y-direction conveyance guide 7f, the X-direction conveyance guide 7c, and the drive mechanism portions 7b and 7e configured as described above function as nozzle position moving means, so that the position of the nozzle 24 is soldered to an arbitrary position. Can be moved. In addition, the Z-direction transport guide 5c and the drive mechanism 5b function as a proximity / separation direction moving unit, so that the nozzle 24 is moved in the proximity direction at the moved position and soldered into the insertion hole 26 of the nozzle 24. The tip of the nozzle 24 can be brought into contact with the through hole through the pin and separated after soldering. Also, the nozzle unit 20 (see FIG. 4) and the heater unit 30 are lowered to the soldering position by the Z-direction transport guide 5c and the drive mechanism 5b, and after the soldering, the nozzle unit 20 and the heater unit 30 are retracted upward. be able to.

  A floating unit 51 is provided in the head fixing portion 5a. The floating unit 51 is provided in the air suspension unit 5 (FIG. 1), lifts the nozzle unit 20 with the supplied air, and sets the relative weight of the floating unit 51 (including the nozzle 24) to the printed circuit board P. It is lightening. For example, when the normal weight is 100, the weight of the floating unit 51 can be 10%.

  The head unit 3 is fixed to the floating unit 51, and includes a solder piece constant supply unit 50, a heater unit 30 below the solder piece constant supply unit 50, and an imaging unit 70. In FIG. 4, the imaging unit 70 is schematically illustrated at a position different from the actual position so that the heater unit 30 that is normally hidden by the imaging unit 70 can be seen.

  The solder piece constant supply unit 50 has a thread solder supply path 52 through which the thread solder 2 (see FIG. 1) is inserted downward from above, and the thread solder in the thread solder supply path 52 is sandwiched between rollers, and is below (nozzle side). A thread solder delivery mechanism 53 that feeds into the hole 55a of the rotary cutter 55, an abutment plate 56 that abuts and positions the tip of the thread solder 2 (see FIG. 1) inserted into the hole 55a, and a hole 55a. A rotary cutter 55 that cuts the thread solder 2 (see FIG. 1) by rotation and a rotation mechanism 54 such as a stepping motor that rotates the rotary cutter 55 are provided.

  A hole 55 a having the same length as the thickness of the disk-shaped rotary cutter 55 is formed as a hole having the same length as that of the necessary thread solder 2. Since the contact plate 56 is provided so as to close the lower surface of the hole 55a (the right hole 55a of the two holes 55a in FIG. 3) located immediately below the yarn solder supply path 52 serving as the standby position before cutting, the yarn The thread solder delivered by the solder delivery mechanism 53 stops in a state where the lower end position of the hole 55a at the cutting standby position is aligned with the front end position of the thread solder. The length of the hole 55a and the length of the cut solder piece 2a can be 1 to 30 mm, and preferably 2 to 15 mm.

  When the yarn solder 2 is inserted into the hole 55a at the cutting standby position by the yarn solder delivery mechanism 53 and the tip of the yarn solder 2 (see FIG. 1) is in contact with the contact plate 56, the rotary cutter 55 rotates. The solder 2 is cut to the insertion length of the hole 55a, and the post-cutting solder in which the hole 55a at the pre-cutting standby position that has been in communication with the thread solder supply path 52 is in communication with the hole 34a in the solder introduction cylinder 34 until then. Move to the single feed position. Since the insertion length is always constant and the thickness of the thread solder 2 is also constant, a fixed amount of solder pieces 2a is always formed. Thus, with the hole 55a and the hole 34a communicating, the push rod 59 pushes the cut solder piece 2a downward from the upper side and forcibly drops it into the solder introduction tube 34.

  In addition, each element is controlled by the control unit 61 to drive these components. The control unit 61 includes a drive mechanism unit 5b, a drive mechanism unit 7b, a drive mechanism unit 7e, a floating unit 51, a thread solder delivery mechanism unit 53, a rotation mechanism unit 54, a heater unit contact confirmation sensor 44, a temperature sensor 64, and a detachable unit. An air cylinder 65, a camera 67, a storage unit 68, and a light projecting / receiving control unit 70 are connected.

  The camera 67 is used when confirming and positioning the positions of through holes and pins of a printed circuit board to be soldered, and when detecting a soldering abnormality such as when a soldering turtle occurs.

  The storage unit 68 is a tool data for each work to be soldered that associates an image of a work to be soldered such as a printed circuit board with a tool (nozzle 24, nozzle unit 20, or heater unit 30) used for the work to be soldered. It stores data such as the type of tool that is currently mounted, the number of times the tool is currently mounted, and the usage time.

  The imaging unit 70 includes two light projecting units 72 and 72 and one light receiving unit 73. The two light projecting units 72 and 72 are arranged symmetrically about the light receiving unit 73 and project the measurement light obliquely toward a position below the light receiving unit 73. The light receiving unit 73 is configured to receive light from below to above, and receives the reflected light reflected by the measurement light at the soldering unit at the lower position.

  The light projecting / receiving control unit 75 causes the light projecting units 72, 72 to project measurement light and receives the reflected light by the light receiving unit 73, and the received signal obtained from the light receiving unit 73 to the control unit 61. Execute the process to send to.

FIG. 5 is a functional block diagram showing various functional units that the control unit 61 executes according to a program.
The control unit 61 includes a function unit (81 to 84) that functions as a soldering device control unit 1A that controls the soldering device 1a, and a function unit (87) that functions as a transport device control unit 1B that controls the transport device 1b. And functional units (91 to 98) functioning as an inspection device control unit 1C for controlling the inspection device 1c.

The heating unit 81 controls the heating of the heater 36 and adjusts the temperature to an appropriate temperature for melting and soldering the solder pieces 2a.
The solder supply unit 82 controls the operation of the solder piece quantitative supply unit 50 and supplies the fixed amount of solder pieces 2 a into the nozzle 24.

The nozzle position moving unit 83 controls the operations of the transport direction moving unit 7 (see FIG. 1) and the transport width direction moving unit 8 to move the nozzle position in the horizontal direction.
The nozzle position lowering / raising part 84 controls the operation of the approaching / separating direction moving unit 6 to move the nozzle position in the vertical direction (direction approaching / separating the soldering target).

  The transfer operation unit 87 controls the transfer operation of the transfer path 9 to transfer the soldering target to the soldering position or the inspection position, and waits for the soldering target at that position. When the soldering is completed or the inspection is completed, the transfer is performed. The next soldering target is transported to the soldering position and inspection position.

  The pattern matching unit 91 performs pattern matching for searching for the inspection reference image with respect to the texture image captured by the imaging unit 70. Pattern matching that searches for inspection reference images is not performed on 3D images, but on 2D texture images or height images, greatly increasing the amount of computation required for 3D pattern matching. The inspection reference image can be aligned quickly and with light load.

  Further, the pattern matching unit 91 performs matching by searching for an image of the inspection target object using the entire texture image or height image, and the determination unit 98 executes image inspection for the matched position and orientation. You may comprise as follows. With this method, it is possible to reliably align the inspection reference image by searching the entire texture image. Note that the pattern matching is not limited to the entire search, but may be performed by searching for an image of the inspection object using a part of the characteristic part. In this case, the inspection reference image can be searched in a shorter time than the entire search.

  The reference plane setting unit 92 sets a reference plane in the inspection reference image of the reference object as a reference plane for measuring the height information of the inspection object during image inspection.

The height image acquisition unit 93 acquires a height image having height information based on the plurality of fringe projection images.
The measurement image composition unit 94 calculates from the respective images captured by the light receiving unit 73 receiving the light projected by the light projecting units 72 and 72 (see FIG. 4) for the same inspection object. The respective height images thus synthesized are combined to generate a single combined height image.

  The three-dimensional image combining unit 95 combines the texture image captured using the observation illumination light source and the height image generated based on the measurement image captured using the measurement light projector, A composite image ST is generated. That is, it is possible to generate a three-dimensional image in which texture information obtained from the texture image is provided with unevenness using the height information of the height image.

  The measurement part extraction unit 96 automatically extracts the soldered part as a measurement part from the inspection target image (image acquired by the light receiving unit 73).

  The measuring unit 97 calculates a contour line cut through a plane perpendicular to the screen through the profile line specified on the texture image, obtains a profile graph, and extracts a circle or a straight line from the contour line indicated by the profile graph Then find their radius and distance.

  The determination unit 98 performs a predetermined image inspection on the image of the inspection object imaged by the imaging unit 70. Details will be described later.

FIG. 6 is an explanatory view for explaining the operation of inspecting the soldered portion 100 by soldering the terminal T of the electronic component C to the land R (second conductor) of the printed circuit board P, and FIG. It is explanatory drawing explaining the state of a bad attachment with the end view of FIG. 7 (A)-FIG.7 (D).
6A is an end view showing a state in which the solder piece 2a is supplied until it abuts against the terminal T. FIG. 6B shows that the solder piece 2a melts and enters the through hole H due to heat sinking. FIG. 6C is an end view of a state in which the soldering unit 100 is inspected by the imaging unit 70. FIG.

  As shown in FIG. 6A, a through-hole H is formed in a printed circuit board P that is a soldering target, and a land R (target to be connected) is provided around the through-hole H. The land R includes a ring-shaped land surface portion Rf on the front surface side (lower surface side in FIG. 6) of the printed circuit board P, a ring-shaped land rear surface portion Rb on the back surface side (upper surface side in FIG. 6), and the through hole H. The cylindrical land inner peripheral portion Rh of the inner peripheral surface is integrally formed of a conductive thin film.

  The through hole H of the printed circuit board P has a terminal T of the electronic component C along the central axis of the through hole H from the front surface side to the back surface side (in FIG. 6, from the lower surface side to the upper surface side). Has been inserted. The protruding length of the terminal T from the printed circuit board P is preferably 5 mm or less, and more preferably 3 mm or less.

  When performing soldering, the nozzle 24 has the terminal T located on the central axis, and the tip surface 24d of the nozzle 24 abuts in parallel with the surface of the land Rb on the back surface side (the upper surface side in the drawing) of the printed circuit board P. It becomes a state. At this time, the heat from the heater 36 transmitted to the nozzle 24 is transferred to the land Rb on the back surface side by heat conduction through the tip surface 24d, and heats the entire land R.

Moreover, in the area | region surrounding the terminal T of the insertion hole 26 from the circumference | surroundings, the terminal T begins to be heated by the radiant heat transfer of the far infrared rays which the nozzle 24 which became high temperature radiates.
In this state, a certain amount of solder piece 2a is supplied from above into the insertion hole 26, and heated in the insertion hole 26 to melt the solder piece 2a.

  When the terminal T is heated to an appropriate temperature through the molten solder piece 2a, the molten solder piece 2a starts to get wet and flows out from the tip of the terminal T (upper end in the figure) along the side surface of the terminal T.

  As shown in FIG. 6B, the molten solder piece 2a that has flowed out along the side surface Tw of the terminal T spreads to the land Rb on the back surface side, and further, into the side surface of the terminal T and the through hole H by capillary action. It also flows into the gap between the facing land Rh. And it also spreads to the land Rf on the surface side.

  When the soldering is completed in this manner, the shape and size of the back surface fillet 101 on the back surface (solder surface side) and the back fillet 103 on the front surface side (component surface side) of the printed circuit board P are substantially the same. The soldering part 100 in which the filling part 102 in H is filled with solder is formed, and the terminal T and the land R are well soldered, and the product 110 that has been soldered is completed.

  As illustrated in FIG. 6C, the imaging unit 70 images the soldering unit 100 according to the control of the light projecting / receiving control unit 75. The control unit 61 (see FIG. 4) acquires the area, height, and volume of the soldering unit 110 by the function units (91 to 98) (see FIG. 5) that function as the inspection apparatus 1c (see FIG. 4). Then, it is determined whether it is within a predetermined range from the reference data, and it is determined whether it is a non-defective product.

  Specifically, the determination unit 98 performs soldering such as the area, height, and volume of a region (that is, the surface fillet 101) that can be imaged on the imaging unit 70 side of the soldering unit 100 of the printed circuit board P that is an inspection target. The result of the measurement of the part state data is compared with the area, height, and volume of the reference data stored in advance, and is determined to be appropriate (non-defective) if it is within a predetermined range. If so, it is determined to be inappropriate (defective). The soldered portion state data used for the determination here may be at least one of area, height, and volume, but may be two or more of these, or all of them. More specifically, it is preferable that the soldered portion state data used for the determination here is an area and a height, or only a volume. In this embodiment, the volume is used for the determination.

  Further, the determination unit 98 stores the determination result of each time in the storage unit 68. Then, if the soldering unit state data is smaller than the predetermined range with respect to the reference data, the determination unit 98 determines the region determined by the soldering unit 100 as shown in the end view of FIG. It is determined that either the amount of solder is small and the amount of heat at the time of soldering is excessive, or the solder residue 105 remains in the nozzle 24 as shown in FIG. In this case, it is determined that the solder residue 105 can be taken out to the next process.

  Further, if the soldering part state data is larger than a predetermined range with respect to the reference data, the judging unit 98, as shown in FIG. 7B, the amount of solder in the region judged by the soldering part 100 It is determined that either the amount of heat at the time of soldering is insufficient or the solder residue 105 remaining in the nozzle 24 flows out and is soldered with an excessive amount of solder as shown in FIG. .

  Then, the determination unit 98 goes back to the determination result stored in the storage unit 68, and there is a determination that the amount of solder is small in the continuous processing, and thereafter, until this determination is a non-defective product determination (normal determination). For example, when the amount of solder is small, as shown in FIG. 7C, it is determined that the solder residue 105 remains in the nozzle 24 and the solder residue 105 flows out during the current soldering. That is, the phenomenon when the amount of solder is “low” (small) and “high” (large) is not an excessive amount of heat and an insufficient amount of heat, and the soldering part 100 for normal judgment between them can be normally soldered. Judgment is high. Here, the continuous process indicates that the soldering process is continuously performed without cleaning or replacing the nozzle 24.

On the other hand, when there is no situation where a small amount of solder and a large amount of solder exist as a pair in the continuous processing, the determination unit 98 has a small amount of solder as shown in FIG. It is determined that the amount of heat of soldering is excessive and the amount of heat of soldering is insufficient. In this case, excessive heat may be generated even before and after soldering with a small amount of solder, and insufficient heat may be generated even before and after soldering with a large amount of solder. It may be determined that there is.
As a result, it is possible to pick up a product having a possibility of poor soldering with higher accuracy and to ship only a normal product. In addition, this makes it possible to distinguish between a product soldered during a period in which the solder residue 105 remains in the nozzle 24 and a product soldered after the solder residue 105 is eliminated.

  Further, after the soldering in which the determination unit 98 determines that the solder amount is small in this way, when there is a soldering in which it is determined that the solder amount is large, the solder amount that is small and the solder amount that is large from the volume calculation If there is no difference, but it is slight, it may be determined that all the solder residue 105 remaining in the nozzle 24 has flowed out. As a result, even when a part of the solder residue 105 flows out and the remaining part remains in the nozzle 24, the situation can be accurately determined, and even when the remaining part flows out and the amount of solder increases. It can be determined with high accuracy.

  With the above configuration and operation, a soldering failure can be detected, and if the finished product 110 is a soldering failure, it can be excluded. In particular, this soldering system 1 can accurately detect soldering defects at low cost, at high speed.

  Since the solder pieces 2a used for soldering are always quantitative, it can be determined whether the product is a non-defective product or a defective product by a simple method of imaging by the imaging unit 70. That is, if there is a variation in the amount of solder pieces 2a to be supplied, the shape and size of the completed soldering portion 100 will change, and it is difficult to determine suitability by imaging. If there is such variation, it is not possible to judge whether the melted solder is in contact with the terminal T, how much area it is in contact with, and how much it is in contact with the land R.

  On the other hand, since the soldering is performed in a fixed amount, the accuracy is obtained by comparing at least one of the height, area, and volume of the soldering portion 100 with the reference height, area, and volume. Good pass / fail judgment can be realized.

  In particular, since the solder piece 2a is melted and soldered inside the cylindrical nozzle 24, the shape of the soldering part 100 is stable, and one of the height, area, and volume of the soldering part 100 is stable. However, if it is determined whether it is within the reference range, it can be determined whether it is acceptable or not. Furthermore, if it is determined whether two or more of the height, area, and volume are within the standard range, the quality can be more reliably determined, and whether the height, area, and volume are all within the standard range can be determined. In this case, it is possible to more reliably determine the quality. In addition, it is possible to make a good determination with a balance between determination time and determination accuracy by determining suitability by both height and area, or by determining volume.

  In addition, a soldering method in which a predetermined amount of solder piece 2a is supplied and melted and soldered in the nozzle 24, the electronic component C side (the front side of the printed circuit board P) where the sufficiently melted solder is beyond the through hole H ) And the surface fillet 101 and the back fillet 103 can be soldered in a stable size and shape. For this reason, an area that is not imaged in the soldering unit 100 (this example) is determined only by determination based on data captured by the imaging unit 70 that exists only on one side of the printed circuit board P (in this example, the soldering side). Then, the quality can be determined including the state of the back fillet 103 on the front side and the filling portion 102) in the through hole H. In other words, since the soldering is performed stably with the fixed amount of solder pieces 2a without inspecting the non-imaged area, the non-imaged area is also appropriate if the imaged area is appropriate. Wax is estimated with high accuracy, and it can be determined as a whole whether or not the imaged area is acceptable.

In the correspondence between the present invention and the embodiment,
The soldering state inspection device corresponds to the inspection device 1c,
The soldering part state acquisition means corresponds to the inspection apparatus control part 1C, the imaging part 70, and the light projection / reception control part 75,
The heating means corresponds to the heater 36,
The light receiving means corresponds to the light receiving unit 73,
The determination means corresponds to the determination unit 98,
The first conductor and the second conductor correspond to the terminal T and the land R, but the present invention is not limited to this embodiment, and may be various other embodiments.

  For example, the product to be soldered and the first conductor and the second conductor are not limited to the printed circuit board P, the terminal T and the land R, but are the motor, the coil and the terminal, the board, the lead wire and the contact metal fitting. For example, appropriate products and parts to be soldered can be obtained.

  In this case as well, the same operational effects as in the above-described embodiment can be obtained, and the first conductor and the second conductor can be soldered by the solder pieces 2a so that an electric signal flows.

  The first conductor and the second conductor are not limited to melting and soldering the solder piece 2a in a state where at least one of the first conductor and the second conductor is partially inserted into the insertion hole 26 of the nozzle 24. Alternatively, the solder piece 2 a may be melted in the nozzle 24 in a state in which both are outside the insertion hole 26 of the nozzle 24. In this case, at least one of the first conductor and the second conductor is in contact with or close to at least a part of the tip of the nozzle 24, and the tip of the solder piece 2a is in contact with or in close contact with the first conductor or the second conductor. To melt the solder piece 2a, the solder piece 2a can be melted in the insertion hole 26 of the nozzle 24, and good soldering can be performed while preventing the scattering of the flux as much as possible. Accordingly, in this case as well, the quality of the entire soldering unit 100 can be determined by imaging with the imaging unit 70 only from one direction of the soldering unit 100. Here, imaging with the imaging unit 70 only from one direction of the soldering unit 100 may indicate that imaging is not performed from both sides across the soldering unit 100, or there are a plurality of light projecting units 72. Even so, it can be pointed out that the light receiving portion 73 is in one place.

  Further, the volume is obtained by capturing the three-dimensional shape of the soldering unit 100 by the imaging unit 70 having the two light projecting units 72 and 72 having different light irradiation directions and angles, the light projecting / receiving control unit 75, and the inspection device control unit 1C. However, the present invention is not limited to this, and a configuration may be adopted in which a two-dimensional image is acquired by imaging with a camera, the area of the soldering unit 100 in the two-dimensional image is obtained, and the suitability of soldering is determined based on this area. Also in this case, the same effect as the above-described embodiment can be obtained.

  Further, the imaging unit 70 includes two light projecting units 72 and 72 and one light receiving unit 73, and the light receiving unit 73 is used as a detection unit. However, the imaging unit 70 is not limited to this, and the laser beam irradiation unit and the laser beam It is good also as comprising by the laser beam detection part which detects permeation | transmission or reflection, and making a laser beam detection part into a detection means. Also in this case, the same effects as those of the above-described embodiment can be obtained.

  Further, the imaging unit 70 may be provided with a capacitance sensor, and this capacitance sensor may be used as the detection means. In this case, the capacitance sensor acquires the capacitance at the soldering position before soldering and the capacitance at the soldering position after soldering, and calculates the difference between the capacitance by the solder portion (ie, solder) The mass of the portion may be used. Also in this case, the same effects as those of the above-described embodiment can be obtained.

  Further, the imaging unit 70 is provided in the vicinity of the nozzle 24 of the soldering apparatus 1a and the soldering apparatus 1a and the inspection apparatus 1c are integrated. However, the present invention is not limited to this, and the inspection apparatus is separate from the soldering apparatus 1a. 1c may be provided. In this case, it is preferable to arrange the soldering device 1a in the previous stage of the conveyance path 9 for conveying the product and arrange the inspection apparatus 1c in the subsequent stage. In this case, the inspection apparatus 1c includes an XY movement unit (for example, the conveyance direction movement unit 7 and the conveyance width shown in FIG. 1) that moves the position of the imaging unit 70 according to the soldering position soldered to the product to be soldered. Direction moving unit 8), or XYZ moving means (for example, the close / separate direction moving unit 6, transport direction moving unit 7, and transport width direction moving unit 8 shown in FIG. 1) may be provided. In this case as well, the same operational effects can be obtained, and overall throughput can be improved by making soldering and inspection separate processes.

  The present invention can be used in industries that perform soldering in production facilities.

DESCRIPTION OF SYMBOLS 1 ... Soldering system 1a ... Soldering apparatus 1c ... Inspection apparatus 1C ... Inspection apparatus control part 2a ... Solder piece 24 ... Nozzle 26 ... Insertion hole 36 ... Heater 50 ... Solder piece fixed quantity supply part 70 ... Imaging part 73 ... Light receiving part 75 ... Light emitting / receiving control part 98 ... Determination part 100 ... Soldering part 110 ... Product R ... Land T ... Terminal

Claims (8)

A soldering system comprising: a soldering device for soldering a first conductor and a second conductor; and an inspection device for inspecting a soldering part soldered by the soldering device,
The soldering apparatus includes:
A solder piece quantitative supply section for supplying solder pieces in a fixed quantity;
A nozzle having an insertion hole for inserting a fixed amount of solder pieces;
Heating means for heating and melting the solder pieces in the nozzle,
The inspection device includes:
Soldering part state acquisition means for acquiring soldering part state data comprising at least one of the area, height, volume, and mass of the soldering part;
Reference data predetermined as data acquired by the soldering portion state acquisition means when soldering is normally performed with the solder amount of the solder pieces supplied by the solder piece quantitative supply unit, and the acquired data after soldering A soldering system comprising: determination means for determining suitability of the performed soldering based on the soldering part state data. The soldering part state acquisition means includes:
Comprising a detecting means for detecting the soldering portion;
The detection means includes
2. The soldering system according to claim 1, wherein the soldering system is provided only on one side of the nozzle side or the opposite side of a soldering target product including the first conductor and the second conductor. The determination means includes
If it is determined that the soldering portion state data in a range detectable by the detection means is appropriate, it is determined appropriate including the soldering portion in a range not detectable by the detection means,
3. The solder according to claim 2, wherein the soldering portion state data in the detectable range is determined to be inappropriate including the soldering portion in a range that cannot be detected by the detection means when determined as inappropriate. Attachment system. The determination means includes
If the area, height, volume, or mass of the soldered portion state data is smaller than the area, height, volume, or mass of the reference data, a solder residue in the nozzle during soldering of the soldered portion The soldering system according to claim 1, 2 or 3, wherein the soldering system is configured to determine that the residual is left. The determination means includes
If the area, height, volume, or mass of the soldered portion state data is larger than the area, height, volume, or mass of the reference data, it remains in the nozzle when soldering the soldered portion. The soldering system according to claim 1, wherein the solder residue is determined to be soldered together. A soldering part state acquisition means for acquiring soldering part state data comprising at least one of the area, height, volume, or mass of the soldered part soldered;
Reference data predetermined as data acquired by the soldering part state acquisition means when the soldering amount of the solder pieces supplied in a fixed amount is normally soldered, and the soldering part state data acquired after soldering And a determination means for determining the suitability of the performed soldering based on the above. Acquire soldering part state data consisting of at least one of the area, height, volume, or mass of the soldered part soldered by the soldering part state acquisition means,
Reference data predetermined as data acquired by the soldering part state acquisition means when the soldering amount of the solder pieces supplied in a fixed amount is normally soldered, and the soldering part state data acquired after soldering Based on the above, a soldering state inspection method for determining the suitability of the performed soldering by the determining means. Soldering said 1st conductor and said 2nd conductor using the soldering system of Claims 1-5, except what was determined to be inappropriate by the said determination means, and what was determined appropriate is made into a product Product manufacturing method.

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