JP2020167246A - Soldering device and nozzle therefor - Google Patents

Soldering device and nozzle therefor Download PDF

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JP2020167246A
JP2020167246A JP2019065256A JP2019065256A JP2020167246A JP 2020167246 A JP2020167246 A JP 2020167246A JP 2019065256 A JP2019065256 A JP 2019065256A JP 2019065256 A JP2019065256 A JP 2019065256A JP 2020167246 A JP2020167246 A JP 2020167246A
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solder
solder piece
nozzle
piece
soldering
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JP7286372B2 (en
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眞一郎 中
Shinichiro Ataru
眞一郎 中
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Parat Co Ltd
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Abstract

To provide a soldering device 1 and soldering method, capable of soldering various objects to be soldered, and to provide a nozzle 60 for the soldering device, capable of soldering the various objects to be soldered.SOLUTION: A soldering device 1 includes soldering piece supply means 40 for supplying a soldering piece 2a to a soldering piece supply passage 63 of a nozzle 60 and heating means for heating and melting the soldering piece 2a in the soldering piece supply passage 63 of the nozzle 60. The nozzle 60 with the soldering piece supply passage 63 for passing the soldering piece 2a is formed in each of a plurality of directions on a plane in the passage width direction.SELECTED DRAWING: Figure 6

Description

この発明は、例えば、プリント基板やモータ等の適宜の製品における第１導体（端子、ランド、リード線等）と第２導体（端子、ランド、リード線等）を半田付けする半田付け装置、および半田付け方法に関する。 The present invention provides, for example, a soldering apparatus for soldering a first conductor (terminals, lands, lead wires, etc.) and a second conductor (terminals, lands, lead wires, etc.) in an appropriate product such as a printed circuit board or a motor. Regarding the soldering method.

従来、プリント基板に電子部品を機械的に半田付けする半田付け装置が提供されている。この半田付け装置には、半田の液面にプリント基板を接触させて半田付けするフロー半田付け法や、予めパターンに合わせてクリーム半田を基板に印刷しておきクリーム半田に熱を加えて溶かすことで半田付けするリフロー半田付け法等、様々な方式が提案されている。 Conventionally, a soldering device for mechanically soldering an electronic component to a printed circuit board has been provided. This soldering device can be used by the flow soldering method, in which the printed circuit board is brought into contact with the liquid surface of the solder and soldered, or by printing cream solder on the board in advance according to the pattern and applying heat to the cream solder to melt it. Various methods have been proposed, such as a reflow soldering method in which soldering is performed in.

ここで、出願人は、半田ごてとして円筒形のノズルを用い、このノズル内にプリント基板のスルーホールに挿通された電子部品のピンを挿入し、内部で半田を溶かして半田付けする方式の半田付け装置を開発し、提供している（特許文献１参照）。 Here, the applicant uses a cylindrical nozzle as a soldering iron, inserts a pin of an electronic component inserted into a through hole of a printed circuit board into this nozzle, and melts and solders the solder inside. We have developed and provided a soldering device (see Patent Document 1).

そして、ノズルの温度、ノズルの位置、ノズルの荷重および半田の供給量について、装置の起動時や運用中など所定のタイミングで確認することにより、半田付けの信頼性や確実性の更なる向上を図っている（特許文献２参照）。 Then, by checking the nozzle temperature, nozzle position, nozzle load, and solder supply amount at predetermined timings such as when the device is started up or during operation, the reliability and reliability of soldering can be further improved. (See Patent Document 2).

しかしながら、大量生産が行われる現代では、様々な形状を有する半田付け対象に対して、さらに短時間で半田付けすることが望まれている。 However, in the present age when mass production is carried out, it is desired to solder objects having various shapes in a shorter time.

特開２０１３−１２０８６９号公報Japanese Unexamined Patent Publication No. 2013-12869 特開２０１５−１１５４２７号公報Japanese Unexamined Patent Publication No. 2015-115427

この発明は、上述の問題に鑑みて、短時間で半田付けできる半田付け装置と半田付け方法、および様々な半田付け対象に半田付けできる半田付け装置用ノズルと半田付け装置用ノズルの製造方法を提供し、利用者の満足度を向上させることを目的とする。 In view of the above problems, the present invention provides a soldering device and a soldering method that can be soldered in a short time, and a soldering device nozzle and a soldering device nozzle that can be soldered to various soldering objects. The purpose is to provide and improve user satisfaction.

この発明は、第１導体と第２導体とを溶融半田によって半田付けする半田付け装置であって、半田片を通過させる半田片供給通路を有するノズルと、前記第１導体と前記ノズルとの近接離間方向の相対距離を変化させて前記第１導体と前記ノズルを近接または当接させる相対距離変化手段と、前記半田片を前記ノズルの前記半田片供給通路に供給する半田片供給手段と、前記ノズルの前記半田片供給通路内の前記半田片を加熱して溶融させる加熱手段とを備え、前記半田片供給通路は、通路幅方向の平面上で複数方向にそれぞれ形成された構成をなす半田付け装置であることを特徴とする。 The present invention is a soldering device for soldering a first conductor and a second conductor by molten solder, wherein a nozzle having a solder piece supply passage through which the solder pieces pass and a nozzle having a solder piece supply passage and the first conductor and the nozzle are close to each other. The relative distance changing means for bringing the first conductor and the nozzle into close proximity or contact with each other by changing the relative distance in the separation direction, the solder piece supply means for supplying the solder piece to the solder piece supply passage of the nozzle, and the solder piece supply means. The solder piece supply passage is provided with a heating means for heating and melting the solder piece in the solder piece supply passage of the nozzle, and the solder piece supply passage has a structure formed in a plurality of directions on a plane in the width direction of the passage. It is characterized by being a device.

この発明により、短時間で半田付けできる半田付け装置と半田付け方法、および様々な半田付け対象に半田付けできる半田付け装置用ノズルと半田付け装置用ノズルの製造方法を提供できる。 INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a soldering apparatus and a soldering method capable of soldering in a short time, and a soldering apparatus nozzle and a soldering apparatus nozzle manufacturing method capable of soldering to various soldering objects.

半田付け装置の右側面図。Right side view of the soldering device. 半田付け装置の正面図。Front view of the soldering device. 半田付け装置の駆動系および制御系の構成を示すブロック図。The block diagram which shows the structure of the drive system and the control system of a soldering apparatus. 糸半田切断機構部の構成を説明する説明図。Explanatory drawing explaining the structure of the thread solder cutting mechanism part. 半田片の切断からノズルへの供給までの動作の説明図。Explanatory drawing of operation from cutting of solder piece to supply to nozzle. ノズルとヒータの構成の説明図。Explanatory drawing of the structure of a nozzle and a heater. ノズル及び糸半田切断機構部を模式的に示した説明図。Explanatory drawing which shows typically the nozzle and the thread solder cutting mechanism part. 半田片の切断からノズルへの供給までの動作手順を示すフロー図。The flow chart which shows the operation procedure from the cutting of a solder piece to the supply to a nozzle.

以下、この発明の一実施形態を図面と共に説明する。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

図１および図２は、半田付け装置１の外観構成の説明図であり、図１は右側面図、図２は正面図である。 1 and 2 are explanatory views of the external configuration of the soldering apparatus 1, FIG. 1 is a right side view, and FIG. 2 is a front view.

図１に示すように、半田付け装置１は、半田付け対象であるプリント基板Ｐのスルーホールに半田付けを行うノズル６０（半田ごて）を有するヘッド部３と、ヘッド部３およびノズル６０をフローティング状態にするエアーサスペンションユニット５と、エアーサスペンションユニット５およびノズル６０を半田付け対象に近接／離間させる方向（図１の上下方向）に移動させる近接離間方向移動ユニット６（相対距離変化手段）と、近接離間方向移動ユニット６およびノズル６０をプリント基板Ｐが搬送される搬送方向（図１の奥行方向，図２の左右方向）に移動させる搬送方向移動ユニット７と、搬送方向移動ユニット７およびノズル６０を搬送方向移動ユニット７の搬送幅方向（図１の左右方向，図２の前後方向）に移動させる搬送幅方向移動ユニット８と、を有している。 As shown in FIG. 1, the soldering device 1 includes a head portion 3 having a nozzle 60 (soldering iron) for soldering to a through hole of a printed circuit board P to be soldered, and a head portion 3 and a nozzle 60. An air suspension unit 5 to be in a floating state, and a proximity separation direction moving unit 6 (relative distance changing means) for moving the air suspension unit 5 and the nozzle 60 in the direction of approaching / separating from the soldering target (vertical direction in FIG. 1). , The transport direction moving unit 7 that moves the proximity separation direction moving unit 6 and the nozzle 60 in the transport direction (depth direction in FIG. 1 and the left-right direction in FIG. 2) in which the printed circuit board P is transported, and the transport direction moving unit 7 and the nozzle. It has a transport width direction moving unit 8 for moving 60 in the transport width direction (horizontal direction in FIG. 1 and front-back direction in FIG. 2) of the transport direction moving unit 7.

エアーサスペンションユニット５の上部には、リールに巻かれた糸半田２が設けられている。この糸半田２は、φ０．３〜φ２．０ｍｍを用いることができ、φ０．６〜φ１．６ｍｍのものを用いることが好ましい。 A thread solder 2 wound on a reel is provided on the upper portion of the air suspension unit 5. As the thread solder 2, φ0.3 to φ2.0 mm can be used, and it is preferable to use φ0.6 to φ1.6 mm.

ヘッド部３の下部には、ノズル６０が設けられ、ノズル６０にはヒータ５１（加熱手段）が接続されている。
搬送幅方向移動ユニット８の上面は、プリント基板Ｐを搬送する搬送路９の上面とほぼ同じ高さに構成されている。 A nozzle 60 is provided in the lower part of the head portion 3, and a heater 51 (heating means) is connected to the nozzle 60.
The upper surface of the transport width direction moving unit 8 is configured to be substantially the same height as the upper surface of the transport path 9 that transports the printed circuit board P.

ヘッド部３の可動範囲は、搬送幅方向移動ユニット８の上方に位置する待機位置（図１に示すＰ１の位置）と、プリント基板Ｐに対して半田付けを行う半田付け領域Ｅ１，Ｅ２（図１のＥ１と図２のＥ２で囲まれる領域）とになる。ヘッド部３は、これらの待機位置、及び半田付け領域のどの位置であっても近接離間方向移動ユニット６によって移動される。 The movable range of the head portion 3 includes a standby position (position of P1 shown in FIG. 1) located above the transfer width direction moving unit 8 and soldering areas E1 and E2 (FIG. 1) for soldering to the printed circuit board P. The area surrounded by E1 of 1 and E2 of FIG. 2). The head portion 3 is moved by the proximity separation direction moving unit 6 at any of these standby positions and soldering regions.

この構成により、半田付け装置１は、待機時にはノズル６０を待機ポジションＰ１の高さおよび位置に待機しておき、半田付け工程を実行するときは半田付け領域Ｅ１，Ｅ２内で待機ポジションＰ１よりも低い（半田付け対象に近い）半田付けポジションＰ２の高さにて半田付けを行う。 With this configuration, the soldering device 1 makes the nozzle 60 stand by at the height and position of the standby position P1 during standby, and when the soldering process is executed, the soldering device 1 is located in the soldering regions E1 and E2 and is higher than the standby position P1. Soldering is performed at a low soldering position P2 (close to the soldering target).

図３は、半田付け装置１の駆動系および制御系の構成を示すブロック図である。半田付け装置１は、搬送幅方向移動ユニット８（図１参照）に固定されて搬送路９（図１参照）へ向かって真っすぐ伸びるＹ方向（搬送幅方向，図２の奥行方向）の搬送ガイド７ｆと、ステッピングモータ等の駆動機構部７ｅによりＹ方向の搬送ガイド７ｆに沿って移動するＸ方向（搬送方向，図２の左右方向）の搬送ガイド７ｃが設けられている。この駆動機構部７ｅおよびＹ方向の搬送ガイド７ｆは、搬送幅方向移動ユニット８（図１参照）内に収納されている。Ｘ方向の搬送ガイド７ｃは、搬送路９の搬送方向（Ｘ方向）へ向かって真っすぐ伸びている。 FIG. 3 is a block diagram showing a configuration of a drive system and a control system of the soldering device 1. The soldering device 1 is fixed to the transport width direction moving unit 8 (see FIG. 1) and extends straight toward the transport path 9 (see FIG. 1) as a transport guide in the Y direction (transport width direction, depth direction of FIG. 2). A transport guide 7c in the X direction (conveyance direction, left-right direction in FIG. 2) that moves along the transport guide 7f in the Y direction is provided by the 7f and a drive mechanism unit 7e such as a stepping motor. The drive mechanism unit 7e and the transport guide 7f in the Y direction are housed in the transport width direction moving unit 8 (see FIG. 1). The transport guide 7c in the X direction extends straight toward the transport direction (X direction) of the transport path 9.

Ｘ方向の搬送ガイド７ｃの上部には、Ｘ方向の搬送ガイド７ｃに沿ってＸ方向に移動する移動体７ａと、この移動体７ａをＸ方向の搬送ガイド７ｃに沿ってＸ方向へ移動させるステッピングモータ等で構成された駆動機構部７ｂが設けられている。この移動体７ａ、駆動機構部７ｂ、およびＸ方向の搬送ガイド７ｃは、搬送方向移動ユニット７（図１参照）内に収納されている。この移動体７ａ、駆動機構部７ｂ、Ｘ方向の搬送ガイド７ｃ、駆動機構部７ｅ、およびＹ方向の搬送ガイド７ｆは、作業させたい任意の位置へノズル６０を移動させるノズル位置移動手段として機能する。 On the upper part of the transport guide 7c in the X direction, a moving body 7a that moves in the X direction along the transport guide 7c in the X direction and a stepping that moves the moving body 7a in the X direction along the transport guide 7c in the X direction. A drive mechanism unit 7b composed of a motor or the like is provided. The moving body 7a, the drive mechanism unit 7b, and the transport guide 7c in the X direction are housed in the transport direction moving unit 7 (see FIG. 1). The moving body 7a, the drive mechanism unit 7b, the transport guide 7c in the X direction, the drive mechanism unit 7e, and the transport guide 7f in the Y direction function as nozzle position moving means for moving the nozzle 60 to an arbitrary position to be operated. ..

移動体７ａには、ノズル６０がスルーホールに近接／離間する方向に伸びるＺ方向（高さ方向）の搬送ガイド５ｃが設けられている。この搬送ガイド５ｃには、Ｚ方向に移動するヘッド固定部５ａ、およびステッピングモータ等で構成される駆動機構部５ｂが設けられている。ヘッド固定部５ａ、駆動機構部５ｂ、および搬送ガイド５ｃは、ノズル６０を半田付け対象に近接／離間させる方向へ移動させる近接離間方向移動手段として機能し、近接離間方向移動ユニット６（図１参照）内に収納されている。 The moving body 7a is provided with a transport guide 5c in the Z direction (height direction) in which the nozzle 60 extends in the direction of approaching / separating from the through hole. The transport guide 5c is provided with a head fixing portion 5a that moves in the Z direction and a drive mechanism portion 5b composed of a stepping motor or the like. The head fixing portion 5a, the drive mechanism portion 5b, and the transport guide 5c function as proximity separation direction moving means for moving the nozzle 60 in the direction of approaching / separating from the soldering target, and the proximity separation direction moving unit 6 (see FIG. 1). ) Is stored in.

このように構成されたＹ方向の搬送ガイド７ｆとＸ方向の搬送ガイド７ｃ、および駆動機構部７ｂ，７ｅがノズル位置移動手段として機能することにより、ノズル６０の位置を半田付けする任意の位置へ移動させることができる。また、Ｚ方向の搬送ガイド５ｃおよび駆動機構部５ｂが近接離間方向移動手段として機能することにより、移動させた位置でノズル６０を近接方向へ移動させてノズル６０の孔（後述の半田片誘導通路６３）内に半田付けするピンを挿通しノズル６０の先端をスルーホールに当接させる等の半田付け位置にて半田付け対象に当接または近接させ、半田付け後に離間させることができる。また、Ｚ方向の搬送ガイド５ｃおよび駆動機構部５ｂにより、ノズルステーション（図示省略）で交換用のノズル６０またはヒータ５１に近接する方向へ移動させ、ノズル６０またはヒータ５１を交換した後に離間させることができる。 The Y-direction transfer guide 7f, the X-direction transfer guide 7c, and the drive mechanism units 7b and 7e configured in this way function as nozzle position moving means, so that the position of the nozzle 60 can be moved to an arbitrary position to be soldered. Can be moved. Further, the transport guide 5c in the Z direction and the drive mechanism unit 5b function as means for moving in the proximity separation direction, so that the nozzle 60 is moved in the proximity direction at the moved position and the hole of the nozzle 60 (the solder piece guiding passage described later). It is possible to abut or approach the soldering target at a soldering position such as inserting a pin to be soldered into 63) and bringing the tip of the nozzle 60 into contact with a through hole, and then separating them after soldering. Further, the transfer guide 5c and the drive mechanism 5b in the Z direction are used to move the nozzle station (not shown) in a direction close to the replacement nozzle 60 or the heater 51, and after replacing the nozzle 60 or the heater 51, separate them. Can be done.

ヘッド固定部５ａには、フローティングユニット１５が設けられている。このフローティングユニット１５は、エアーサスペンションユニット５（図１）内に設けられ、供給されたエアによってノズル６０を持ち上げ、プリント基板Ｐに対するフローティングユニット１５（ノズル６０が含まれる）の相対的な重みを軽くするものである。例えば、通常の加重を１００とするとフローティングユニット１５の加重が１０％となるようにするなど、適宜の構成とすることができる。 A floating unit 15 is provided on the head fixing portion 5a. The floating unit 15 is provided in the air suspension unit 5 (FIG. 1), lifts the nozzle 60 by the supplied air, and reduces the relative weight of the floating unit 15 (including the nozzle 60) with respect to the printed circuit board P. Is what you do. For example, if the normal weight is 100, the weight of the floating unit 15 may be 10%, and an appropriate configuration can be made.

ヘッド部３は、フローティングユニット１５に固定され、糸半田２（図１参照）を挿通する糸半田供給ガイド１６と、糸半田供給ガイド１６内の糸半田をローラで挟み込んで送り出す糸半田送り出し機構部１７が設けられ、底部に糸半田切断機構部４０を備えている。この糸半田切断機構部４０は、平面視直交する複数方向、換言すればいわゆるＸＹ方向に駆動可能な２つのステッピングモータ等により構成される平面移動機構部１９（半田片収納体移動手段）により移動可能に構成されており、糸半田供給ガイド１６に供給されてきた糸半田２ａ（図１参照）を平面移動機構部１９の制御に従って切断する。ここで、本実施形態では上にも示した通り、この平面移動機構部１９が、本発明に係る半田片収納体移動手段に相当する。 The head portion 3 is fixed to the floating unit 15 and has a thread solder supply guide 16 for inserting the thread solder 2 (see FIG. 1) and a thread solder delivery mechanism unit for sandwiching the thread solder in the thread solder supply guide 16 with rollers and feeding the thread solder. 17 is provided, and a thread solder cutting mechanism portion 40 is provided at the bottom. The thread solder cutting mechanism unit 40 is moved by a plane moving mechanism unit 19 (solder piece accommodating body moving means) composed of two stepping motors and the like that can be driven in a plurality of directions orthogonal to each other in a plan view, in other words, in the so-called XY directions. It is possible to cut the thread solder 2a (see FIG. 1) supplied to the thread solder supply guide 16 under the control of the plane moving mechanism unit 19. Here, in the present embodiment, as shown above, the plane moving mechanism portion 19 corresponds to the solder piece accommodating body moving means according to the present invention.

また、これらの構成要素を駆動するべく、各要素は制御部２１によって制御される。制御部２１には、駆動機構部５ｂ、駆動機構部７ｂ、駆動機構部７ｅ、フローティングユニット１５、糸半田送り出し機構部１７、平面移動機構部１９、ヒータユニット密着確認センサ２２、温度センサ２３、着脱用エアシリンダ２４、カメラ２５、及び記憶部２６が接続されている。 Further, each element is controlled by the control unit 21 in order to drive these components. The control unit 21 includes a drive mechanism unit 5b, a drive mechanism unit 7b, a drive mechanism unit 7e, a floating unit 15, a thread solder feeding mechanism unit 17, a plane moving mechanism unit 19, a heater unit adhesion confirmation sensor 22, a temperature sensor 23, and attachment / detachment. The air cylinder 24 for use, the camera 25, and the storage unit 26 are connected.

カメラ２５は、半田付け対象となるプリント基板のスルーホールおよびピンの位置等を確認して位置決めする際、および、半田付アカメが発生した場合等の半田付け異常を検出する際等に用いられる。 The camera 25 is used when confirming and positioning the positions of through holes and pins of the printed circuit board to be soldered, and when detecting a soldering abnormality such as when soldering red spots occur.

記憶部２６は、プリント基板等の半田付け対象ワークの画像と、この半田付け対象ワークに使用するツール（ノズル６０、若しくはヒータ５１）を関連づけた半田付け対象ワーク別ツールデータ、現在装着しているツールの種類、現在装着しているツールの使用回数および使用時間等のデータを記憶している。 The storage unit 26 is currently equipped with an image of a work to be soldered, such as a printed circuit board, and tool data for each work to be soldered, which is associated with a tool (nozzle 60 or heater 51) used for the work to be soldered. It stores data such as the type of tool, the number of times the tool is currently installed, and the usage time.

図４は、糸半田切断機構部４０の構成を説明する説明図であり、図４（Ａ）は糸半田切断機構部４０の分解斜視図、図４（Ｂ）は糸半田切断機構部４０の縦断面図を示す。 4A and 4B are explanatory views for explaining the configuration of the thread solder cutting mechanism unit 40, FIG. 4A is an exploded perspective view of the thread solder cutting mechanism unit 40, and FIG. 4B is a thread solder cutting mechanism unit 40. A vertical sectional view is shown.

糸半田切断機構部４０は、下方へ繰り出されてきた糸半田２ａを通過させる通路を有する糸半田供給ガイド１６と、切断した半田片２ｂを複数収納する半田片収納体４４と、半田片収納体４４を移動させる平面移動機構部１９（図３参照）により構成されている。また、半田片収納体４４には、収納された半田片２ｂの貯留／放出を制御するシャッタ３６と、シャッタ３６を付勢する付勢体３５（付勢手段）とが設けられている。また、半田片収納体４４とは分離して、シャッタ３６を解放操作するシャッタ操作部４９（シャッタ移動規制体）が設けられている。なお、半田片収納体４４と、平面移動機構部１９と、シャッタ３６と、シャッタ操作部４９は、半田片２ｂをノズル６０の孔（後述の半田片誘導通路６３）に供給する半田片供給手段として機能する。このように、この平面移動機構部１９は、半田片収納体４４を半田片収納部４５に半田片２ｂを収容する方向と直交する平面上の二方向（ＸＹ方向）へ移動させるＸＹ移動ステージである。 The thread solder cutting mechanism unit 40 includes a thread solder supply guide 16 having a passage for passing the thread solder 2a that has been fed downward, a solder piece storage body 44 that stores a plurality of cut solder pieces 2b, and a solder piece storage body. It is composed of a plane moving mechanism unit 19 (see FIG. 3) that moves 44. Further, the solder piece accommodating body 44 is provided with a shutter 36 for controlling the storage / release of the stored solder piece 2b and an urging body 35 (a urging means) for urging the shutter 36. Further, a shutter operation unit 49 (shutter movement restricting body) for releasing the shutter 36 is provided separately from the solder piece accommodating body 44. The solder piece accommodating body 44, the plane moving mechanism unit 19, the shutter 36, and the shutter operating unit 49 are solder piece supplying means for supplying the solder piece 2b to the hole of the nozzle 60 (the solder piece guiding passage 63 described later). Functions as. In this way, the plane moving mechanism portion 19 is an XY moving stage that moves the solder piece accommodating body 44 in two directions (XY directions) on a plane orthogonal to the direction in which the solder piece accommodating portion 45 accommodates the solder piece 2b. is there.

糸半田供給ガイド１６は、金属部材によって円筒形に形成されており、内側の孔（通路）に糸半田２ａを長手方向へ通過させる。また、糸半田供給ガイド１６は、糸半田２ａの通過方向と直角の方向（糸半田２ａの半径方向）へは移動しないように固定されている。 The thread solder supply guide 16 is formed in a cylindrical shape by a metal member, and allows the thread solder 2a to pass through an inner hole (passage) in the longitudinal direction. Further, the thread solder supply guide 16 is fixed so as not to move in a direction perpendicular to the passing direction of the thread solder 2a (radial direction of the thread solder 2a).

付勢体３５は、適宜のバネで構成することができ、この実施例では金属製の鶴巻ばねにて構成されている。 The urging body 35 can be made of an appropriate spring, and in this embodiment, it is made of a metal crane winding spring.

シャッタ３６は、Ｌ字型に屈曲させた金属板により構成されており、Ｌ字の底面部が水平状態（近接離間方向に垂直な状態）の貯留／放出制御板部３８であり、Ｌ字の鉛直面部が付勢体３５に押圧される押圧操作部３７である。貯留／放出制御板部３８は、複数の解放孔３８ａ（貫通孔または貫通溝）が設けられている。この実施例では解放孔３８ａは都合８つ設けられている。この解放孔３８ａの隣接部分（解放孔３８ａと解放孔３８ａの間部分を含む）は、半田片２ｂの落下を防止する閉鎖部として機能する。なお、シャッタ３６に複数の解放孔３８ａを設けているが、これに限らず、複数の解放溝を設けて、シャッタ３６の貯留／放出制御板部３８が平面視櫛状に見える構成としてもよい。この場合も同じ機能を確保できる。すなわち本実施形態では、半田片収納部４５に収容された半田片２ｂを収容している収容状態と半田片２ｂをノズル６０の半田片供給通路６３へ供給する解放状態に切り替える、本発明に係る貯留／放出制御板部３８を有している。 The shutter 36 is composed of an L-shaped bent metal plate, and is an L-shaped storage / release control plate portion 38 in which the bottom surface portion of the L-shape is in a horizontal state (a state perpendicular to the proximity separation direction). A pressing operation unit 37 in which the vertical surface portion is pressed by the urging body 35. The storage / release control plate portion 38 is provided with a plurality of release holes 38a (through holes or through grooves). In this embodiment, eight release holes 38a are provided for convenience. The adjacent portion of the release hole 38a (including the portion between the release hole 38a and the release hole 38a) functions as a closing portion for preventing the solder piece 2b from falling. Although the shutter 36 is provided with a plurality of release holes 38a, the present invention is not limited to this, and a plurality of release grooves may be provided so that the storage / release control plate portion 38 of the shutter 36 looks like a comb in a plan view. .. The same function can be secured in this case as well. That is, according to the present invention, the present invention switches between a housed state in which the solder piece 2b housed in the solder piece storage unit 45 is housed and a released state in which the solder piece 2b is supplied to the solder piece supply passage 63 of the nozzle 60. It has a storage / release control plate portion 38.

半田片収納体４４は、横長の立方体形状のブロック部４３の下面に当該ブロック部４３の短手方向の幅よりも幅広で長手方向に同じ長さのガイド部４８が一体形成されている。ガイド部４８には、長手方向に貫通するシャッタ挿入孔４７が設けられている。このシャッタ挿入孔４７は、高さと幅がシャッタ３６の貯留／放出制御板部３８の高さと幅よりわずかに大きく形成され、シャッタ３６がブレなくスムーズに長手方向へスライド移動できるように構成されている。ブロック部４３とガイド部４８には、上下方向（近接離間方向）に貫通する半田片収納部４５が複数設けられている。この実施形態では上述の通り都合８つ設けられており、シャッタ３６の解放孔３８ａと同じ大きさで同じ間隔で設けられている。
換言すれば、本実施形態に係る半田片収納体４４の半田片収納部４５は、本実施形態では、少なくともノズル６０の半田片供給通路６３と同じ位置で同じ数が設けられている。これらの複数の半田片収納部４５は、すべて同じ太さで同じ長さの一直線状の孔であり、互いに平行に形成されている。 In the solder piece storage body 44, a guide portion 48 that is wider than the width of the block portion 43 in the lateral direction and has the same length in the longitudinal direction is integrally formed on the lower surface of the horizontally long cube-shaped block portion 43. The guide portion 48 is provided with a shutter insertion hole 47 penetrating in the longitudinal direction. The height and width of the shutter insertion hole 47 are formed to be slightly larger than the height and width of the storage / release control plate portion 38 of the shutter 36, and the shutter 36 is configured to smoothly slide and move in the longitudinal direction without blurring. There is. The block portion 43 and the guide portion 48 are provided with a plurality of solder piece storage portions 45 that penetrate in the vertical direction (proximity separation direction). In this embodiment, as described above, eight are provided for convenience, and are provided with the same size as the release holes 38a of the shutter 36 and at the same intervals.
In other words, in the present embodiment, the same number of solder piece storage portions 45 of the solder piece storage body 44 according to the present embodiment are provided at least at the same positions as the solder piece supply passages 63 of the nozzle 60. The plurality of solder piece accommodating portions 45 are all linear holes having the same thickness and the same length, and are formed in parallel with each other.

なお、シャッタ３６の解放孔３８ａは、半田片収納部４５よりも大きく形成されてもよい。これにより、確実に開放状態のときに半田片２ｂを落下させることができる。また、半田片収納部４５は、孔によって形成されているが、これに限らず、複数部材で周囲を囲まれて半田片２ｂを囲み内に収容できる囲み形状とするなど、半田片２ｂを落下可能に収納する適宜の形状とすることができる。 The release hole 38a of the shutter 36 may be formed larger than the solder piece accommodating portion 45. As a result, the solder piece 2b can be reliably dropped when it is in the open state. Further, although the solder piece storage portion 45 is formed by holes, the solder piece 2b is not limited to this, and the solder piece 2b can be dropped by being surrounded by a plurality of members and having an enclosure shape capable of accommodating the solder piece 2b in the enclosure. It can be shaped appropriately so that it can be stored.

半田片収納体４４の長手方向の一端上部には、半田片収納体４４の長手方向に長いガイド板４２の一端が連結されている。ガイド板４２の他端には、ネジ止め用の孔４１が設けられ、係止板３２がネジ３１によって孔４１にネジ止めされている。 One end of a guide plate 42 long in the longitudinal direction of the solder piece accommodating body 44 is connected to the upper portion of one end in the longitudinal direction of the solder piece accommodating body 44. A hole 41 for screwing is provided at the other end of the guide plate 42, and the locking plate 32 is screwed into the hole 41 by a screw 31.

係止板３２は、上部にネジ４１を挿通するネジ孔３３が設けられている。係止板３２のネジ孔３３より下方部分には、シャッタ３６の押圧操作部３７に対向する押圧対抗面３４が設けられている。この押圧対抗面３４に付勢体３５の一端が当接し、シャッタ３６の押圧操作部３７に付勢体３５の他端が当接することで、押圧対抗面３４から押圧操作部３７までの距離よりも長く伸びた状態が通常状態である付勢体３５は、押圧対抗面３４と押圧操作部３７が離れる方向へ付勢する。これによって、シャッタ３６は、押圧操作部３７が半田片収納体４４の一端面に当接した状態に維持される。このとき、図４（Ｂ）に示すように、半田片収納体４４の半田片収納部４５とシャッタ３６の解放孔３８ａは位置がずれており、半田片収納体４４の半田片収納部４５がシャッタ３６の貯留／放出制御板部３８で閉じられた状態となっている。従って、半田片収納部４５に存在する半田片２ｂは、シャッタ３６の貯留／放出制御板部３８によって下方へ落下しないように貯留されている。すなわち本実施形態に係る貯留／放出制御板部３８は、半田片収納部４５に収容された半田片２ｂを収容している収容状態と半田片２ｂをノズル６０の半田片供給通路６３へ供給する解放状態に切り替える本発明に係る収容／解放切替部に相当する。 The locking plate 32 is provided with a screw hole 33 at the top through which the screw 41 is inserted. A pressing counter surface 34 facing the pressing operation portion 37 of the shutter 36 is provided below the screw hole 33 of the locking plate 32. One end of the urging body 35 abuts on the pressing counter surface 34, and the other end of the urging body 35 abuts on the pressing operation portion 37 of the shutter 36, so that the distance from the pressing opposition surface 34 to the pressing operation portion 37 The urging body 35, which is in a normal state of being extended for a long time, is urged in a direction in which the pressing opposing surface 34 and the pressing operation unit 37 are separated from each other. As a result, the shutter 36 is maintained in a state in which the pressing operation unit 37 is in contact with one end surface of the solder piece accommodating body 44. At this time, as shown in FIG. 4B, the solder piece storage portion 45 of the solder piece storage body 44 and the release hole 38a of the shutter 36 are misaligned, and the solder piece storage portion 45 of the solder piece storage body 44 is displaced. It is in a state of being closed by the storage / release control plate portion 38 of the shutter 36. Therefore, the solder piece 2b existing in the solder piece storage portion 45 is stored by the storage / release control plate portion 38 of the shutter 36 so as not to fall downward. That is, the storage / discharge control plate unit 38 according to the present embodiment supplies the storage state in which the solder pieces 2b housed in the solder piece storage unit 45 are housed and the solder pieces 2b to the solder piece supply passage 63 of the nozzle 60. It corresponds to the accommodation / release switching unit according to the present invention that switches to the released state.

半田片収納体４４のガイド板４２と反対側には、半田片収納体４４から離間した位置に半田片収納体４４とは独立してシャッタ操作部４９が設けられている。このシャッタ操作部４９は、シャッタ３６の貯留／放出制御板部３８の押圧操作部３７とは逆側の端面に対向して配置されている。従って、平面移動機構部１９（図３参照）の駆動によって半田片収納体４４がシャッタ３６と共にシャッタ操作部４９側へ移動されていくと、シャッタ３６の端面がシャッタ操作部４９に当接する。そして、平面移動機構部１９（図３参照）の駆動によって半田片収納体４４がさらに移動されると、シャッタ操作部４９によってシャッタ３６がそれ以上移動しないために半田片収納体４４とシャッタ３６の相対位置が変化していき、半田片収納体４４の半田片収納部４５とシャッタ３６の解放孔３８ａの位置が同じ位置になって解放状態となり、半田片２ｂが下方へ落下する。 On the side of the solder piece storage body 44 opposite to the guide plate 42, a shutter operation unit 49 is provided at a position separated from the solder piece storage body 44 independently of the solder piece storage body 44. The shutter operation unit 49 is arranged so as to face the end surface of the storage / release control plate unit 38 of the shutter 36 opposite to the pressing operation unit 37. Therefore, when the solder piece accommodating body 44 is moved toward the shutter operation unit 49 together with the shutter 36 by driving the plane moving mechanism unit 19 (see FIG. 3), the end surface of the shutter 36 comes into contact with the shutter operation unit 49. Then, when the solder piece accommodating body 44 is further moved by driving the plane moving mechanism unit 19 (see FIG. 3), the shutter operating unit 49 does not move the shutter 36 any more, so that the solder piece accommodating body 44 and the shutter 36 are moved. The relative position changes, and the solder piece storage portion 45 of the solder piece storage body 44 and the release hole 38a of the shutter 36 are at the same position to be in the released state, and the solder piece 2b falls downward.

半田片収納体４４と糸半田供給ガイド１６は、互いの対向面が当接して配置され、供給される糸半田２ａの半径方向すなわちＸＹ方向の何れの方向へも相対的に移動できるように構成されている。この実施では、糸半田供給ガイド１６が固定され、半田片収納体４４が糸半田２ａの半径方向すなわちＸＹ方向のうち任意の方向へスライド移動できる。従って、糸半田供給ガイド１６から繰り出された糸半田２ａの一部が半田片収納体４４の半田片収納部４５に供給されている状態で、半田片収納体４４を糸半田２ａの半径方向すなわちＸＹ方向のうち任意の方向に移動させると、糸半田２ａは、半田片収納体４４と糸半田供給ガイド１６の相対移動によって半田片収納体４４と糸半田供給ガイド１６の互いの当接面で切断される。従って、半田片収納体４４と糸半田供給ガイド１６が半田片２ｂを切断する半田片切断手段となる。切断された半田片２ｂは、半田片収納体４４の半田片収納部４５に収納される。 The solder piece accommodating body 44 and the thread solder supply guide 16 are arranged so that their facing surfaces are in contact with each other and can move relatively in any direction in the radial direction, that is, the XY direction of the supplied thread solder 2a. Has been done. In this implementation, the thread solder supply guide 16 is fixed, and the solder piece accommodating body 44 can slide and move in any direction of the radial direction of the thread solder 2a, that is, the XY direction. Therefore, in a state where a part of the thread solder 2a unwound from the thread solder supply guide 16 is supplied to the solder piece storage portion 45 of the solder piece storage body 44, the solder piece storage body 44 is placed in the radial direction of the thread solder 2a, that is, When the thread solder 2a is moved in any of the XY directions, the thread solder 2a moves relative to the solder piece storage body 44 and the thread solder supply guide 16 so that the solder piece storage body 44 and the thread solder supply guide 16 come into contact with each other. Be disconnected. Therefore, the solder piece accommodating body 44 and the thread solder supply guide 16 serve as solder piece cutting means for cutting the solder piece 2b. The cut solder piece 2b is stored in the solder piece storage portion 45 of the solder piece storage body 44.

また、半田片収納体４４の上面と糸半田供給ガイド１６の下面、シャッタ３６の貯留／放出制御板部３８は、全て半田片収納体４４の移動方向と平行（特にこの実施例では水平方向）に構成されている。また、半田片収納部４５の長手方向（半田片通過方向）とノズル６０の半田片誘導通路６３（半田片供給通路，図５（Ｄ）参照）の長手方向（半田片通過方向）は、全て半田片収納体４４の移動方向と垂直（特にこの実施例では鉛直方向）に構成されている。 Further, the upper surface of the solder piece storage body 44, the lower surface of the thread solder supply guide 16, and the storage / discharge control plate portion 38 of the shutter 36 are all parallel to the moving direction of the solder piece storage body 44 (particularly in the horizontal direction in this embodiment). It is configured in. Further, the longitudinal direction of the solder piece accommodating portion 45 (solder piece passing direction) and the longitudinal direction of the solder piece guiding passage 63 (solder piece supply passage, see FIG. 5D) of the nozzle 60 are all in the longitudinal direction (solder piece passing direction). It is configured to be perpendicular to the moving direction of the solder piece storage body 44 (particularly, in the vertical direction in this embodiment).

図５は、半田片収納体４４によって糸半田２ａを切断して半田片２ｂを複数貯留し、その後にシャッタ３６を開状態にして複数の半田片２ｂを落下させる動作を断面図により説明する説明図である。この動作は、制御部２１（図３参照）が糸半田送り出し機構部１７および平面移動機構部１９の駆動を制御して実行される。 FIG. 5 is a cross-sectional view illustrating an operation in which the thread solder 2a is cut by the solder piece accommodating body 44 to store a plurality of solder pieces 2b, and then the shutter 36 is opened and the plurality of solder pieces 2b are dropped. It is a figure. This operation is executed by the control unit 21 (see FIG. 3) controlling the drive of the thread solder feeding mechanism unit 17 and the plane moving mechanism unit 19.

図５（Ａ）の断面図に示すように、平面移動機構部１９（図３参照）の駆動によって、半田片収納体４４は、シャッタ操作部４９に最も近い半田片収納部４５が糸半田供給ガイド１６の下方位置で一直線に連通する状態で停止する。この状態で、巻かれていた糸半田２（図１参照）の先端側から引き出されて棒状となっている糸半田２ａが糸半田送り出し機構部１７（図３参照）によって送り出され、図５（Ｂ）に示すように糸半田２ａの先端が半田片収納部４５内に収納される。そして、半田片収納体４４と糸半田供給ガイド１６の対向面部（接触面部）から糸半田２ａの先端までの長さが必要な半田片２ｂの長さとなる状態まで糸半田２ａを繰り出すと、糸半田送り出し機構部１７（図３参照）は糸半田２ａの供給（繰り出し）を停止する。 As shown in the cross-sectional view of FIG. 5A, the solder piece accommodating body 44 is supplied by the solder piece accommodating portion 45 closest to the shutter operating portion 49 by driving the plane moving mechanism portion 19 (see FIG. 3). It stops at a position below the guide 16 in a straight line. In this state, the rod-shaped thread solder 2a pulled out from the tip side of the wound thread solder 2 (see FIG. 1) is sent out by the thread solder feeding mechanism 17 (see FIG. 3), and is fed out in FIG. 5 (see FIG. 3). As shown in B), the tip of the thread solder 2a is stored in the solder piece storage portion 45. Then, when the thread solder 2a is unwound to a state where the length from the facing surface portion (contact surface portion) of the solder piece accommodating body 44 and the thread solder supply guide 16 to the tip of the thread solder 2a is the required length of the solder piece 2b, the thread is fed. The solder feeding mechanism unit 17 (see FIG. 3) stops the supply (feeding) of the thread solder 2a.

この状態で平面移動機構部１９（図３参照）の駆動によって、半田片収納体４４をスライド移動させると、半田片収納体４４と糸半田供給ガイド１６の対向面部（接触面部）によって糸半田２ａが切断されて半田片２ｂとなり、図５（Ｃ）に示すように半田片２ｂが半田片収納部４５に収納（貯留）される。図５（Ｃ）は、この切断を半田片収納部４５の数だけ（必要な数だけ）繰り返して切断完了した状態を示している。このときの半田片収納体４４をスライド移動させる距離は、隣接する半田片収納部４５の互いの中心間の距離と同一である。したがって、糸半田供給ガイド１６の直下には、その前に対応していた半田片収納部４５の隣の半田片収納部４５が位置することとなる。 In this state, when the solder piece accommodating body 44 is slidably moved by driving the plane moving mechanism unit 19 (see FIG. 3), the thread solder 2a is formed by the facing surface portion (contact surface portion) between the solder piece accommodating body 44 and the thread solder supply guide 16. Is cut into a solder piece 2b, and the solder piece 2b is stored (stored) in the solder piece storage portion 45 as shown in FIG. 5 (C). FIG. 5C shows a state in which this cutting is repeated for the number of solder piece storage portions 45 (as many as necessary) to complete the cutting. The distance for sliding the solder piece storage body 44 at this time is the same as the distance between the centers of the adjacent solder piece storage portions 45. Therefore, directly below the thread solder supply guide 16, the solder piece storage portion 45 adjacent to the solder piece storage portion 45 corresponding to the front is located.

平面移動機構部１９（図３参照）の駆動によって半田片収納体４４をスライド移動させると、図５（Ｄ）に示すようにシャッタ３６の先端がシャッタ操作部４９に当接して押圧され、付勢体３５が縮み、半田片収納体４４の半田片収納部４５とシャッタ３６の解放孔３８ａが全て連通して複数の半田片２ｂが一斉に落下して下方へ供給される。すなわち平面移動機構部１９は、半田片収納体４４を半田片収納部４５に半田片２ｂを収容する方向と直交する平面上の二方向へ移動させる半田片収納体移動手段に相当する。なお、半田片２ｂを落下させる際に、図示省略する押し込みロッドを全ての半田片収納部４５に上方から下方へ挿入し、半田片２ｂを下方へ押し出して、強制的に半田片２ｂを下方のノズル６０（図３参照）に供給する構成としてもよい。 When the solder piece accommodating body 44 is slidably moved by driving the plane moving mechanism unit 19 (see FIG. 3), the tip of the shutter 36 abuts on the shutter operating unit 49 and is pressed as shown in FIG. 5 (D). The force 35 contracts, the solder piece storage portion 45 of the solder piece storage body 44 and the release holes 38a of the shutter 36 all communicate with each other, and the plurality of solder pieces 2b fall all at once and are supplied downward. That is, the plane moving mechanism portion 19 corresponds to a solder piece accommodating body moving means for moving the solder piece accommodating body 44 in two directions on a plane orthogonal to the direction in which the solder piece accommodating portion 45 accommodates the solder piece 2b. When dropping the solder piece 2b, a push rod (not shown) is inserted into all the solder piece storage portions 45 from above to below, and the solder piece 2b is pushed downward to forcibly push the solder piece 2b downward. It may be configured to supply to the nozzle 60 (see FIG. 3).

図６は、ノズル６０とヒータ５１の構成を説明する説明図であり、図６（Ａ）は分解斜視図、図６（Ｂ）は斜視図、図６（Ｃ）は縦断面図を示す。図７は、ノズル６０、半田片収納体４４及び糸半田供給ガイド１６の相対的な配置を模式的に示した平面図である。そして図８は、制御部２１が平面移動機構部１９を制御することにより半田片収納体４４をＸＹ方向に動作させる手順を示すフロー図である。
ノズル６０は、複数の第１部材６１と第２部材６５とを重ね合わせて（当接させて）形成されている。第１部材６１と第２部材６５は、いずれもセラミックにより形成されている。
すなわち本実施形態に係るノズル６０は、図６及び図７に示すように、複数の半田片供給通路６３を、通路幅方向の平面上で複数方向にそれぞれ形成された構成をなすようにした。これらの複数の半田片供給通路６３は、すべて同じ太さで同じ長さの一直線状の孔であり、互いに平行に形成されている。 6A and 6B are explanatory views for explaining the configurations of the nozzle 60 and the heater 51, FIG. 6A is an exploded perspective view, FIG. 6B is a perspective view, and FIG. 6C is a vertical sectional view. FIG. 7 is a plan view schematically showing the relative arrangement of the nozzle 60, the solder piece accommodating body 44, and the thread solder supply guide 16. FIG. 8 is a flow chart showing a procedure in which the control unit 21 controls the plane moving mechanism unit 19 to operate the solder piece accommodating body 44 in the XY direction.
The nozzle 60 is formed by superimposing (contacting) a plurality of first members 61 and second members 65. Both the first member 61 and the second member 65 are made of ceramic.
That is, as shown in FIGS. 6 and 7, the nozzle 60 according to the present embodiment has a configuration in which a plurality of solder piece supply passages 63 are formed in a plurality of directions on a plane in the width direction of the passages. The plurality of solder piece supply passages 63 are all linear holes having the same thickness and the same length, and are formed parallel to each other.

第１部材６１は、一部材として一体形成された直方体形状の一面（第２部材６５との対向面６１ａ）に鉛直方向（近接離間方向）に一直線の半田片誘導路６３ａ（溝）が単数或いは複数平行に形成されている。また、第１部材６１は、半田片誘導路６３ａが設けられた面の隣となる側面に、固定溝６２が設けられている。 The first member 61 has a single solder piece guide path 63a (groove) that is linear in the vertical direction (proximity separation direction) on one surface (opposite surface 61a facing the second member 65) of a rectangular parallelepiped shape integrally formed as one member. Multiple are formed in parallel. Further, the first member 61 is provided with a fixing groove 62 on the side surface adjacent to the surface on which the solder piece guide path 63a is provided.

第２部材６５は、外形が第１部材６１と対称となる形状で同じ大きさの直方体に形成されている。すなわち、第１部材６１と当接する面の大きさおよび形状が同じようになるように形成されている。また、第２部材６５は、第１部材６１との対向面の隣となる側面に、固定溝６６が設けられている。この固定溝６６の位置および深さは。第１部材６１の固定溝６２と同一に形成されている。 The second member 65 is formed in a rectangular parallelepiped having the same size as the first member 61 in a shape symmetrical to the outer shape. That is, they are formed so that the size and shape of the surface that comes into contact with the first member 61 are the same. Further, the second member 65 is provided with a fixing groove 66 on a side surface adjacent to a surface facing the first member 61. What is the position and depth of this fixing groove 66? It is formed in the same shape as the fixing groove 62 of the first member 61.

第２部材６５は、第１部材６１との対向面に近い位置で、複数の半田片誘導路６３ａが並べられた並び方向に貫通するヒータ用貫通孔６７が設けられている。このヒータ用貫通孔６７には、ヒータ５１の加熱部５２が挿入される。図示の例では、ヒータ用貫通孔６７の両端の開口から２つのヒータ５１の各加熱部５２がそれぞれ挿入されている。２つの加熱部５２は、全ての半田片誘導通路６３（図７参照）に対応させて配置されている。これにより、全ての半田片誘導通路６３に対してほぼ同一の加熱を行うことができ、半田片誘導通路６３毎に半田片誘導通路６３の壁面温度や半田片２ｂの溶融速度に差が出ないようにしている。 The second member 65 is provided with a through hole 67 for a heater that penetrates in the arrangement direction in which a plurality of solder piece guide paths 63a are arranged at a position close to the surface facing the first member 61. The heating portion 52 of the heater 51 is inserted into the heater through hole 67. In the illustrated example, each heating portion 52 of the two heaters 51 is inserted through the openings at both ends of the heater through hole 67. The two heating portions 52 are arranged so as to correspond to all the solder piece induction passages 63 (see FIG. 7). As a result, almost the same heating can be performed for all the solder piece guide passages 63, and there is no difference in the wall surface temperature of the solder piece guide passage 63 and the melting speed of the solder piece 2b for each solder piece guide passage 63. I am doing it.

また、第２部材６５は、第１部材６１との対向面と反対側の面の中央に孔６８が設けられ、この孔６８に熱電対５７が挿入されている。熱電対５７は、温度センサ２３（図３参照）として機能し、ノズル６０の温度を測定する。 Further, the second member 65 is provided with a hole 68 in the center of the surface opposite to the surface facing the first member 61, and the thermocouple 57 is inserted into the hole 68. The thermocouple 57 functions as a temperature sensor 23 (see FIG. 3) and measures the temperature of the nozzle 60.

これらがすべて組み合わせされると、図６（Ｂ）に示すように、複数（三つ）の第１部材６１と第２部材６５の対向面同士が隙間なく当接され、第１部材６１の半田片誘導路６３ａ（図６（Ａ）参照）と、第１部材６１、第２部材６５の対向面６５ａのうち半田片誘導路６３ａと対向している対向部分とで半田片２ｂを端子Ｔに当接させる位置まで誘導する半田片誘導通路６３が形成される。この半田片誘導通路６３は、鉛直方向（近接離間方向）に一直線で、かつ、通路幅方向の平面上で複数方向にそれぞれ配置されている。 When all of these are combined, as shown in FIG. 6B, the facing surfaces of the plurality (three) first members 61 and the second member 65 are brought into contact with each other without a gap, and the solder of the first member 61 is soldered. The solder piece 2b is connected to the terminal T between the one-sided taxiway 63a (see FIG. 6A) and the facing portion of the facing surfaces 65a of the first member 61 and the second member 65 facing the solder piece taxiway 63a. A solder piece guide passage 63 for guiding to a contact position is formed. The solder piece guiding passages 63 are arranged in a straight line in the vertical direction (proximity separation direction) and in a plurality of directions on a plane in the passage width direction.

各半田片誘導通路６３（および半田片誘導路６３ａ）は、半田片収納体４４（図５参照）の半田片収納部４５と同じ大きさで同じ間隔に形成されている。 Each solder piece guide passage 63 (and the solder piece guide path 63a) is formed to have the same size and the same interval as the solder piece storage portion 45 of the solder piece storage body 44 (see FIG. 5).

従って、図５（Ｄ）に示したように一斉に（ほぼ同時に）落下する半田片２ｂは、その下方位置にて半田片収納部４５と半田片誘導通路６３が連通するように配置されたノズル６０の半田片誘導通路６３に、図６（Ｃ）に示すように一斉に（ほぼ同時に）供給される。 Therefore, as shown in FIG. 5D, the solder pieces 2b that fall all at once (almost at the same time) are nozzles arranged so that the solder piece storage portion 45 and the solder piece guide passage 63 communicate with each other at a lower position thereof. As shown in FIG. 6C, the solder pieces are supplied to the solder piece induction passage 63 of 60 all at once (almost at the same time).

半田付けをするとき、ノズル６０は、下端がプリント基板ＰのランドＲに接触する位置まで下げられており、この位置にて上述した半田片２ｂの供給を受ける。このとき、半田片２ｂは、プリント基板Ｐの電子部品Ｃの端子Ｔの先端（若しくは半田片誘導通路６３の半田片誘導方向（図６（Ｃ）の下方）に対して最も凸となる端部（図６（Ｃ）の上端））に接触して停止する。図示の例では端子Ｔの上に半田片２ｂが乗った状態で停止する。 At the time of soldering, the nozzle 60 is lowered to a position where the lower end contacts the land R of the printed circuit board P, and the solder piece 2b described above is supplied at this position. At this time, the solder piece 2b is the end portion most convex with respect to the tip of the terminal T of the electronic component C of the printed circuit board P (or the solder piece guiding direction (lower side of FIG. 6C) of the solder piece guiding passage 63). (Upper end of FIG. 6C)) to stop. In the illustrated example, the solder piece 2b is stopped on the terminal T.

そして、ノズル６０の半田片誘導通路６３に供給された半田片２ｂは、ヒータ５１の加熱部５２からの熱をうけて溶融する。このとき、加熱部５２の熱が半田片２ｂから端子Ｔに伝達され、この伝達熱によって端子Ｔも徐々に加熱されていく。また、ランドＲについては、ノズル６０から直接熱を受け、端子Ｔよりも先に加熱されている。 Then, the solder piece 2b supplied to the solder piece induction passage 63 of the nozzle 60 receives heat from the heating portion 52 of the heater 51 and melts. At this time, the heat of the heating unit 52 is transferred from the solder piece 2b to the terminal T, and the terminal T is gradually heated by this heat transfer. Further, the land R receives heat directly from the nozzle 60 and is heated before the terminal T.

そうして、半田片２ｂが溶融温度に達すると、半田片２ｂが溶融するが、まだ端子Ｔの上に略球状となって載った状態となる。この間も端子Ｔを伝達熱で加熱する。そして、さらに端子Ｔの加熱が進むと、半田片２ｂが溶融した複数（４つ）の溶融半田が端子Ｔに沿って流れ出し、複数の端子Ｔ（第２導体）とランドＲ（第１導体）を一斉に（同時に）半付けして電気的に接続する。その後、ノズル６０を上方へ移動させて離間させ、溶融半田が冷えて固化することで、複数箇所の半田付けが一斉に（同時に）完了する。
この半田付けの動作について、以下に詳細に説明する。 Then, when the solder piece 2b reaches the melting temperature, the solder piece 2b melts, but it is still placed on the terminal T in a substantially spherical shape. During this time as well, the terminal T is heated by the transfer heat. Then, as the heating of the terminal T further progresses, a plurality of (four) molten solders in which the solder pieces 2b are melted flow out along the terminal T, and the plurality of terminals T (second conductor) and land R (first conductor) All at once (at the same time) and half-attach and connect electrically. After that, the nozzles 60 are moved upward to separate them, and the molten solder cools and solidifies, so that soldering at a plurality of locations is completed all at once (at the same time).
The operation of this soldering will be described in detail below.

＜半田付けの動作＞
図６（Ｃ）の断面図に示すように、半田付けの母材として、ランドＲが形成されたプリント基板Ｐに、当該プリント基板Ｐのスルーホールにプリント基板Ｐの表面側から裏面側（図６（Ｃ）では下面側から上面側）に向けて電子部品Ｃの端子Ｔが挿入されたものが準備されている。 <Soldering operation>
As shown in the cross-sectional view of FIG. 6C, the printed circuit board P on which the land R is formed as the base material for soldering is provided with the through holes of the printed circuit board P from the front side to the back side of the printed circuit board P (FIG. 6). In 6 (C), the terminal T of the electronic component C is inserted from the lower surface side to the upper surface side).

＜位置合わせ工程＞
制御部２１は、Ｙ方向の搬送ガイド７ｆとＸ方向の搬送ガイド７ｃ、および駆動機構部７ｂ，７ｅにより、ノズル６０の複数の半田片誘導通路６３の位置をＸＹ平面上で移動させて半田付けする複数のランドＲに対向させる。このときの位置は、プリント基板Ｐの裏面側のランドＲの中心と半田片誘導通路６３の中心がほぼ一致する位置とする、または、端子Ｔの先端中心と半田片誘導通路６３の中心がほぼ一致する位置とする。 <Alignment process>
The control unit 21 uses the transfer guide 7f in the Y direction, the transfer guide 7c in the X direction, and the drive mechanism units 7b and 7e to move the positions of the plurality of solder piece guide passages 63 of the nozzle 60 on the XY plane for soldering. Facing a plurality of lands R to be At this time, the position is such that the center of the land R on the back surface side of the printed circuit board P and the center of the solder piece guide passage 63 substantially coincide with each other, or the center of the tip of the terminal T and the center of the solder piece guide passage 63 substantially coincide with each other. Make it a matching position.

＜半田片切断収納工程＞
制御部２１は、糸半田送り出し機構部１７によって半田片収納体４４内の１つの半田片収納部４５に糸半田２ａを必要長さまで供給し、平面移動機構部１９を駆動させて半田片収納体４４を移動させ、糸半田切断機構部４０（糸半田切断手段）により糸半田２ａを切断して半田片２ｂを得て半田片収納部４５に収納する。このとき、シャッタ３６は閉鎖状態となっているため、半田片収納部４５から半田片２ｂが落下することは無い。この動作を繰り返すことで、全ての半田片収納部４５に１つずつ必要長さの半田片２ｂを収納する。なお、この半田片切断収納工程は、前記ノズル近接工程よりも前に実行する、あるいは、ノズル近接工程と並行して実行するなど、適宜のタイミングとすることができる。
当該半田片切断工程では、平面移動機構部１９をＸＹ方向に適宜移動させることにより、複数の半田片収納部４５に対し一つの糸半田２ａから効率よく半田片２ｂを供給し得るようにしている。平面移動機構部１９による当該糸半田切断部４０の具体的な動作については、後に詳述する。 <Solder piece cutting and storage process>
The control unit 21 supplies the thread solder 2a to one solder piece storage unit 45 in the solder piece storage body 44 to the required length by the thread solder delivery mechanism unit 17, and drives the plane movement mechanism unit 19 to drive the solder piece storage body. 44 is moved, and the thread solder 2a is cut by the thread solder cutting mechanism unit 40 (thread solder cutting means) to obtain the solder piece 2b and store it in the solder piece storage unit 45. At this time, since the shutter 36 is in the closed state, the solder piece 2b does not fall from the solder piece storage portion 45. By repeating this operation, one solder piece 2b having the required length is stored in all the solder piece storage portions 45. The solder piece cutting and storing step can be performed at an appropriate timing, such as being executed before the nozzle proximity step or in parallel with the nozzle proximity step.
In the solder piece cutting step, the plane moving mechanism portion 19 is appropriately moved in the XY direction so that the solder piece 2b can be efficiently supplied from one thread solder 2a to the plurality of solder piece storage portions 45. .. The specific operation of the thread solder cutting portion 40 by the plane moving mechanism portion 19 will be described in detail later.

＜ノズル近接工程＞
制御部２１は、駆動機構部５ｂにより搬送ガイド５ｃに沿ってフローティング状態のヘッド部３をランドＲとの近接方向へ移動させて、ノズル６０の先端面（図示下端面）をプリント基板Ｐの裏面側のランドＲの表面に当接させる。これにより、ノズル６０の半田片誘導通路６３の内側に端子Ｔの先端が挿入された状態となる。 <Nozzle proximity process>
The control unit 21 uses the drive mechanism unit 5b to move the floating head unit 3 along the transport guide 5c in a direction close to the land R, so that the front end surface (lower end surface in the drawing) of the nozzle 60 is the back surface of the printed circuit board P. It is brought into contact with the surface of the land R on the side. As a result, the tip of the terminal T is inserted inside the solder piece guiding passage 63 of the nozzle 60.

このとき、端子Ｔはノズル６０の半田片誘導通路６３の内壁から等距離だけ離れており、端子Ｔとノズル６０が非接触で離間した状態が保たれている。これにより、ノズル６０から端子Ｔに直接熱が伝達されることを防止しており、端子Ｔは、輻射熱伝達および対流熱伝達により徐々に加熱される。一方で、プリント基板ＰのランドＲは、接触するノズル６０からの直接の熱伝導と、対流熱伝達による伝熱で急速に加熱される。 At this time, the terminal T is equidistant from the inner wall of the solder piece guiding passage 63 of the nozzle 60, and the terminal T and the nozzle 60 are kept in a non-contact and separated state. This prevents heat from being directly transferred from the nozzle 60 to the terminal T, and the terminal T is gradually heated by radiant heat transfer and convective heat transfer. On the other hand, the land R of the printed circuit board P is rapidly heated by direct heat conduction from the contact nozzle 60 and heat transfer by convective heat transfer.

＜半田片供給工程＞
制御部２１は、平面移動機構部１９を駆動させて半田片収納体４４をさらに移動させ、シャッタ３６がシャッタ操作部４９に当接して押圧されるまで移動させる。これにより、シャッタ３６の複数の解放孔３８ａが複数の半田片収納部４５とそれぞれ連通し、複数の半田片２ｂが一斉に落下し、ノズル６０の複数の半田片誘導通路６３に１つずつ供給される。上方から落下するように供給された半田片２ｂは、半田片誘導通路６３を通過中に予熱され、端部が端子Ｔに当接して当接位置で停止し、位置および落下が規制される。このとき、半田片誘導通路６３の内壁は、半田片２ｂが端子Ｔの先端の上で垂直または斜めに立っている状態から落下しないように規制する落下規制部として機能する。 <Solder piece supply process>
The control unit 21 drives the plane moving mechanism unit 19 to further move the solder piece accommodating body 44 until the shutter 36 comes into contact with the shutter operating unit 49 and is pressed. As a result, the plurality of release holes 38a of the shutter 36 communicate with the plurality of solder piece storage portions 45, respectively, and the plurality of solder pieces 2b fall all at once and are supplied one by one to the plurality of solder piece induction passages 63 of the nozzle 60. Will be done. The solder piece 2b supplied so as to fall from above is preheated while passing through the solder piece guide passage 63, its end abuts on the terminal T and stops at the contact position, and the position and drop are restricted. At this time, the inner wall of the solder piece guide passage 63 functions as a drop regulation portion that regulates the solder piece 2b from falling from a state of standing vertically or diagonally on the tip of the terminal T.

＜溶融工程＞
当接位置に案内された溶融前の半田片２ｂは、その位置から落下することなく、端子Ｔと反対側の端部などの少なくとも一部が、ヒータ５１の加熱部５２の近くに位置して半田片誘導通路６３の内壁に当接する。このため、当接位置にある溶融前の複数の半田片２ｂは、半田片誘導通路６３の内壁に当接した半田片２ｂの一端部、両端部、又は側部を介した熱伝導により一斉に溶融される。なお、この半田片２ｂの溶融のとき、ノズル６０と接触しての直接熱伝導に加えて、ノズル６０からの輻射熱伝達、および、ノズル６０内を対流する熱風による対流熱伝達などの間接熱伝導も行われる。 <Melting process>
The unmelted solder piece 2b guided to the abutting position does not fall from that position, and at least a part such as an end opposite to the terminal T is located near the heating portion 52 of the heater 51. It abuts on the inner wall of the solder piece guide passage 63. Therefore, the plurality of solder pieces 2b before melting at the contact positions are all at once due to heat conduction via one end, both ends, or the side of the solder pieces 2b that are in contact with the inner wall of the solder piece induction passage 63. It is melted. When the solder piece 2b is melted, in addition to direct heat conduction in contact with the nozzle 60, indirect heat conduction such as radiant heat transfer from the nozzle 60 and convective heat transfer by hot air convection in the nozzle 60. Is also done.

複数の半田片２ｂは、溶融すると表面張力によりそれぞれ丸まって略球状になろうとするが、ノズル６０の半田片誘導通路６３の内壁と端子Ｔの先端に規制されるため真球になれず、端子Ｔの先端に接触している状態（端子Ｔの上に載っている状態）で太く短い形状に変形する。この形状は、短い円柱の両端が球面になった形状となっている。 When the plurality of solder pieces 2b are melted, they tend to curl up to become substantially spherical due to surface tension, but they cannot become a true sphere because they are restricted by the inner wall of the solder piece guide passage 63 of the nozzle 60 and the tip of the terminal T. It is deformed into a thick and short shape in a state of being in contact with the tip of T (a state of being placed on the terminal T). This shape is such that both ends of a short cylinder are spherical.

こうして溶融すると、ノズル６０から複数の半田片２ｂに熱が伝わり、さらに、複数の半田片２ｂから複数の端子Ｔにそれぞれ熱が伝わることで、複数の端子Ｔは以前にも増して急速に加熱される。この加熱中、溶融した半田片２ｂは端子Ｔに接触した状態、すなわち端子Ｔの上に載った状態で半田片供給方向（下方向）へ移動せずに停止している。尚、半田片２ｂが溶融するのは、２１７℃以上である。 When melted in this way, heat is transferred from the nozzle 60 to the plurality of solder pieces 2b, and heat is further transferred from the plurality of solder pieces 2b to the plurality of terminals T, so that the plurality of terminals T are heated more rapidly than before. Will be done. During this heating, the molten solder piece 2b is stopped without moving in the solder piece supply direction (downward direction) in a state of being in contact with the terminal T, that is, in a state of being placed on the terminal T. The solder piece 2b melts at 217 ° C. or higher.

溶融した半田片２ｂを介して適正温度にまで端子Ｔが加熱されると、溶融した複数の半田片２ｂは、ぬれ始め、端子Ｔの先端から端子Ｔの側面を伝って一斉に流れ出す。ここで、溶融しはじめてから流れ出す前の半田片２ｂは、位置が停止したままで熱の影響等によって形状が変化し続けていても良い。そして、端子Ｔの側面を伝って流れ出した溶融した半田片２ｂは、裏面側のランドＲに広がり、さらに、毛細管現象により、端子Ｔの側面とスルーホールに面するランドＲとの隙間にも流入する。そして、表面側のランドＲにも広がっていく。 When the terminal T is heated to an appropriate temperature via the molten solder piece 2b, the plurality of molten solder pieces 2b begin to get wet and flow out from the tip of the terminal T along the side surface of the terminal T all at once. Here, the shape of the solder piece 2b after it begins to melt and before it flows out may continue to change due to the influence of heat or the like while the position remains stopped. Then, the molten solder piece 2b that flows out along the side surface of the terminal T spreads to the land R on the back surface side, and further flows into the gap between the side surface of the terminal T and the land R facing the through hole due to the capillary phenomenon. To do. Then, it spreads to the land R on the surface side.

＜ノズル離間工程＞
その後、制御部２１は、駆動機構部５ｂにより搬送ガイド５ｃに沿ってフローティング状態のヘッド部３をランドＲとの離間する方向へ移動させ、ノズル６０の先端面をプリント基板Ｐの裏面側のランドＲの表面から離隔する。これにより、ランドＲ、端子Ｔ、及び溶融した半田片２ｂは急速に冷却され、溶融した半田片２ｂが固化して半田付け動作は終了する。 <Nozzle separation process>
After that, the control unit 21 moves the floating head unit 3 along the transport guide 5c in a direction away from the land R by the drive mechanism unit 5b, and moves the front end surface of the nozzle 60 to the land on the back surface side of the printed circuit board P. Separate from the surface of R. As a result, the land R, the terminal T, and the molten solder piece 2b are rapidly cooled, the molten solder piece 2b is solidified, and the soldering operation is completed.

溶融した半田片２ｂのこのような動きにより、複数の端子Ｔは複数のランドＲにそれぞれ確実に半田付けされる。こうして一斉に（ほぼ同時に）半田付けされた複数箇所の半田の仕上がり外観は美しく、バックフィレット形状も綺麗に形成される。 Due to such movement of the molten solder piece 2b, the plurality of terminals T are reliably soldered to the plurality of lands R, respectively. The finished appearance of the solder at multiple locations soldered all at once (almost at the same time) is beautiful, and the back fillet shape is also beautifully formed.

しかして本実施形態では、図７に示すように、半田片供給通路６３は、通路幅方向の平面上で複数方向にそれぞれ形成された構成をなす。加えて本実施形態では、図８に示すように、制御部２１による平面移動機構部１９への制御により、半田片切断収納工程において、単一の糸半田２ａを備えながら上述のような複数の半田片供給通路６３へ一斉に半田片２ｂを効率よく供給することを可能としている。以下、半田片切断収納工程における動作について詳述する。 Thus, in the present embodiment, as shown in FIG. 7, the solder piece supply passage 63 has a configuration formed in a plurality of directions on a plane in the width direction of the passage. In addition, in the present embodiment, as shown in FIG. 8, by controlling the plane moving mechanism unit 19 by the control unit 21, a plurality of as described above are provided in the solder piece cutting and storing step while providing a single thread solder 2a. It is possible to efficiently supply the solder pieces 2b to the solder piece supply passage 63 all at once. Hereinafter, the operation in the solder piece cutting and storing process will be described in detail.

ステップＳ１では、制御部２１は、任意の半田片収納部４５を平面視糸半田供給ガイド１６に平面視一致するよう位置決めし、しかる後、上述の通り当該半田片収納部４５が有する列に沿って糸半田２ａを切断して半田片２ｂを供給していく処理を行う。 In step S1, the control unit 21 positions the arbitrary solder piece storage unit 45 so as to coincide with the plan view thread solder supply guide 16 in a plan view, and then follows the row of the solder piece storage unit 45 as described above. The process of cutting the thread solder 2a and supplying the solder piece 2b is performed.

ステップＳ２では、制御部２１は、同じ列に未だ半田片２ｂが供給されていない半田片収納部４５が有るか否かの判定を行う処理を行う。当該ステップＳ２にて半田片２ｂが供給されていない半田片収納部４５があった場合は、ステップＳ１へ移行する。このようにステップＳ１を一列の半田片収納部４５の数だけ繰り返し、一列の半田片収納部４５に対して同方向（一方向）に半田片収納体４４を移動させて糸半田２ａの切断をしていく。当該ステップＳ２にて半田片２ｂが供給されていない半田片収納部４５が無くなった場合は、ステップＳ３へ移行する。 In step S2, the control unit 21 performs a process of determining whether or not there is a solder piece storage unit 45 in the same row to which the solder piece 2b has not yet been supplied. If there is a solder piece accommodating portion 45 to which the solder piece 2b is not supplied in step S2, the process proceeds to step S1. In this way, step S1 is repeated for the number of solder piece storage portions 45 in a row, and the solder piece storage body 44 is moved in the same direction (one direction) with respect to the solder piece storage portions 45 in a row to cut the thread solder 2a. I will do it. When the solder piece accommodating portion 45 to which the solder piece 2b is not supplied disappears in the step S2, the process proceeds to step S3.

ステップＳ３では、制御部２１は、違う列に位置する半田片収納部４５に未だ半田片２ｂが供給されていない半田片収納部４５が有るか否かの判定を行う処理を行う。当該ステップＳ３にて半田片２ｂが供給されていない半田片収納部４５の列が他に無かった場合は、処理を終了する。
当該ステップＳ３にて半田片２ｂが供給されていない半田片収納部４５の列があった場合は、ステップＳ４へ移行する。 In step S3, the control unit 21 performs a process of determining whether or not the solder piece storage unit 45 located in a different row has a solder piece storage unit 45 to which the solder piece 2b has not yet been supplied. If there is no other row of the solder piece accommodating portion 45 to which the solder piece 2b is not supplied in the step S3, the process ends.
If there is a row of solder piece storage portions 45 to which the solder piece 2b is not supplied in step S3, the process proceeds to step S4.

ステップＳ４では、制御部２１は、半田片２ｂが供給されていない他の列に半田片２ｂが供給し得るよう半田片収納体４４を移動させる処理を行う。そしてしかる後、上記ステップＳ１へ移行する。このように列を変更したとき、その前の列と同方向に切断していくこともできるが、逆方向に切断することが好ましい。逆方向に切断していくことで、半田片収容体４４を移動させる時間を短縮できる。 In step S4, the control unit 21 performs a process of moving the solder piece accommodating body 44 so that the solder piece 2b can be supplied to another row to which the solder piece 2b is not supplied. Then, after that, the process proceeds to step S1. When the row is changed in this way, it is possible to cut in the same direction as the previous row, but it is preferable to cut in the opposite direction. By cutting in the opposite direction, the time for moving the solder piece accommodating body 44 can be shortened.

このようにして本実施形態では、平面移動機構部１９を制御２１によって好適に制御することでステップＳ１〜ステップＳ４を経て、通路幅方向の平面上で複数方向にそれぞれ形成された構成をなす半田片供給通路６３と同じ位置で同じ数が設けられている半田片収納部４５へ、順次半田片２ｂを供給することができる。 In this way, in the present embodiment, the plane moving mechanism unit 19 is suitably controlled by the control 21 to form a solder formed in a plurality of directions on the plane in the passage width direction through steps S1 to S4. The solder pieces 2b can be sequentially supplied to the solder piece storage portions 45 provided at the same positions as the piece supply passages 63 and in the same number.

以上の構成及び動作により、本実施形態によれば、ノズル６０に設けた半田片供給通路６３を通路幅方向の平面上で複数方向にそれぞれ形成することにより、された構成をなすことにより、１つずつではなく、一直線だけでもない、面での複数の半田付けが可能となる。具体的には、このように複数の半田片誘導通路６３を有するノズル６０を用いることで、複数の端子Ｔ（半田付け箇所）に一斉に（同時に）半田付けをし、短時間で多数の半田付けを完了させることができる。上述した実施形態では、８つの半田片２ｂを順次切断し、一斉に８ヶ所の半田付けを実施できるため、１か所ずつ半田付けするよりも非常に短時間で半田付け完了できる。
その結果、従来の構成に比べて大幅なタクト短縮（時間短縮）が実現できる。 Based on the above configuration and operation, according to the present embodiment, the solder piece supply passages 63 provided in the nozzle 60 are formed in a plurality of directions on a plane in the width direction of the passages. It is possible to solder multiple surfaces, not just one by one, but only in a straight line. Specifically, by using the nozzle 60 having a plurality of solder piece guide passages 63 in this way, the plurality of terminals T (soldering points) can be soldered all at once (simultaneously), and a large number of solders can be soldered in a short time. Soldering can be completed. In the above-described embodiment, the eight solder pieces 2b can be cut in sequence and soldered at eight locations at the same time, so that the soldering can be completed in a much shorter time than soldering at one location at a time.
As a result, a significant reduction in tact (time reduction) can be realized as compared with the conventional configuration.

しかも本実施形態によれば、ノズル６０自体の平面視の面積が大きくなることによりノズル６０の熱容量が大きくなることで、基板への予熱効果が見込め、半田付け時間も従来よりも短縮させることができる。その結果、例えばパワーデバイス等の熱引きが大きなパターンへの半田付けであっても好適に行うことが可能となっている。 Moreover, according to the present embodiment, the area of the nozzle 60 itself in a plan view is increased, so that the heat capacity of the nozzle 60 is increased, so that a preheating effect on the substrate can be expected and the soldering time can be shortened as compared with the conventional case. it can. As a result, for example, even soldering to a pattern having a large heat draw such as a power device can be preferably performed.

また本実施形態によれば、半田片収納体４４の半田片収納部４５を、少なくともノズル６０の半田片供給通路６３と同じ位置で同じ数が設けられている構成としているので、より正確且つ迅速な半田付けが可能となっている。 Further, according to the present embodiment, the solder piece storage portions 45 of the solder piece storage body 44 are provided at least at the same positions as the solder piece supply passages 63 of the nozzle 60, so that the solder piece storage portions 45 are more accurately and quickly provided. It is possible to solder easily.

さらに本実施形態によれば、平面移動機構部１９を半田片収納体４４を半田片収納部４５に半田片２ｂを収容する方向と直交する平面上の二方向へ移動させる半田片収納体移動手段として機能させることで、単一の糸半田２ａのみを有する構成であっても複数方向に複数設けられたノズル６０の半田片供給通路６３に対して一斉に半田片２ｂを供給すべく半田片収納体４４の半田片収納部４５へ正確に安定して半田片２ｂを供給することを実現している。 Further, according to the present embodiment, the solder piece accommodating body moving means for moving the plane moving mechanism portion 19 in two directions on a plane orthogonal to the direction in which the solder piece accommodating body 44 is accommodating the solder piece 2b in the solder piece accommodating portion 45. By functioning as, even if the configuration has only a single thread solder 2a, the solder pieces are stored so as to supply the solder pieces 2b to the solder piece supply passages 63 of the nozzles 60 provided in a plurality of directions all at once. It is realized that the solder piece 2b is accurately and stably supplied to the solder piece storage portion 45 of the body 44.

特に、第１部材６１と第２部材６５の分割式のノズル６０としたことにより、半田片誘導通路６３となる半田片誘導路６３ａを長さや幅や深さにかかわらず容易に形成することができる。しかしながら本発明においては、分割式のノズル６０のみならず、一体に形成されたノズルを適用することを否定するものではない。 In particular, by adopting the split nozzle 60 of the first member 61 and the second member 65, the solder piece guide path 63a serving as the solder piece guide passage 63 can be easily formed regardless of the length, width and depth. it can. However, in the present invention, it is not denied that not only the split type nozzle 60 but also the integrally formed nozzle is applied.

なお、この発明は、上述した実施形態に限られるものではなく、様々な実施形態とすることができる。本実施形態のように、半田片収納体４４の半田片収納部４５とシャッタ３６の解放孔３８ａとノズル６０の半田片誘導通路６３は、列を更に増やす構成とすることができる。これにより、半田付け対象の配置間隔に合わせて一斉に半田付けができる。 The present invention is not limited to the above-described embodiment, but may be various embodiments. As in the present embodiment, the solder piece storage portion 45 of the solder piece storage body 44, the release hole 38a of the shutter 36, and the solder piece guide passage 63 of the nozzle 60 can be configured to further increase the number of rows. As a result, soldering can be performed all at once according to the arrangement interval of the soldering target.

また、ノズル６０の形状と半田片誘導通路６３の数や形状は半田付け対象に合わせて様々構成とすることができ、これに合わせて半田片収納体４４の半田片収納部４５とシャッタ３６の形状を形成することで、様々な半田付け対象に対して複数箇所に一斉に半田付けすることができる。 Further, the shape of the nozzle 60 and the number and shape of the solder piece guide passages 63 can be variously configured according to the soldering target, and the solder piece storage portion 45 and the shutter 36 of the solder piece storage body 44 can be configured accordingly. By forming the shape, it is possible to solder to various soldering objects at a plurality of locations at the same time.

また、半田片収納体４４は、一面に一直線の溝を複数平行に配置した２つの部材を互いの溝が対向するように合わせて、この溝が半田片収納部４５を形成するように構成してもよい。この場合、２つの部材の対向面は当接していることが好ましいが、半田片２ｂの厚みよりも小さい隙間だけ離間させて構成してもよい。この場合も半田片２ｂを半田片収納部４５に収納し、シャッタ３６を動作させて半田片２ｂを一斉に落下させることができる。 Further, the solder piece storage body 44 is configured such that two members having a plurality of straight grooves arranged in parallel on one surface are aligned so that the grooves face each other, and the grooves form the solder piece storage portion 45. You may. In this case, it is preferable that the facing surfaces of the two members are in contact with each other, but the two members may be spaced apart by a gap smaller than the thickness of the solder piece 2b. In this case as well, the solder pieces 2b can be stored in the solder piece storage portion 45, and the shutter 36 can be operated to drop the solder pieces 2b all at once.

また、ノズル６０の半田片誘導通路６３は、断面四角の孔としたが、断面正方形、断面長方形、断面円形、断面楕円形、断面半円形など、適宜の形状の孔とすることができる。この場合、第１部材６１と第２部材６５の両方に半田片誘導路６３ａを設けて重ね合わせたときにこれらの適宜の形状の孔となるように構成してもよい。 Further, although the solder piece guiding passage 63 of the nozzle 60 has a hole having a square cross section, it may have a hole having an appropriate shape such as a square cross section, a rectangular cross section, a circular cross section, an elliptical cross section, or a semicircular cross section. In this case, when the solder piece guide paths 63a are provided on both the first member 61 and the second member 65 and are overlapped with each other, the holes may be configured to have an appropriate shape.

また、ノズル６０の各半田片誘導通路６３から第１部材６１と第２部材６５の一方または両方に水平方向に伸びる側孔をそれぞれ設け、半田付け時に半田片誘導通路６３内で発生するヒュームを外部へ排出する構成としてもよい。この場合、この側孔は、半田片誘導通路６３内で端子Ｔに当接する半田片２ｂの上端よりも上方に設けることが好ましい。これにより、半田ボールやフラックス等が側孔からノズル６０の外へ飛散することを防止できる。 Further, side holes extending in the horizontal direction are provided in one or both of the first member 61 and the second member 65 from each solder piece guiding passage 63 of the nozzle 60, and the fume generated in the solder piece guiding passage 63 at the time of soldering is provided. It may be configured to discharge to the outside. In this case, it is preferable that this side hole is provided in the solder piece guiding passage 63 above the upper end of the solder piece 2b that abuts on the terminal T. As a result, it is possible to prevent solder balls, flux, and the like from scattering from the side holes to the outside of the nozzle 60.

また、半田付け対象である第１導体と第２導体は、プリント基板Ｐの端子ＴとランドＲに限らず、例えば、モータの端子とリード線とする、プリント基板の配線上に寝かした状態で置いた端子と当該配線とする、など、適宜の半田付け対象とすることができる。これらの場合も同様にノズルを第１導体に近接または当接させた状態で第１導体と第２導体を半田付けして電気的に接続することができる。 Further, the first conductor and the second conductor to be soldered are not limited to the terminals T and land R of the printed circuit board P, but are laid down on the wiring of the printed circuit board, for example, the terminals and lead wires of the motor. It can be an appropriate soldering target, such as the placed terminal and the wiring. In these cases as well, the first conductor and the second conductor can be soldered and electrically connected in a state where the nozzle is close to or in contact with the first conductor.

また、上記実施形態では半田片収納体４４の半田片収納部４５へ半田片２ｂを供給する順序を、ＸＹ何れかの方向に沿った列に沿って順次供給していく手順を一例として説明したが勿論、制御部２１による平面移動機構部１９への制御により、半田片収納体４４の外周から中心へ向けて半田片２ｂを供給する態様や、その逆の手順にて半田片２ｂを供給する態様としてもよい。また、任意の一の半田片収納部４５から順次最も近接した他の半田片収納部４５へ半田片２ｂを供給する態様など、種々の態様をとることができる。これらの場合、上記図８のフロー図とは異なるフロー（手順）となることは言うまでもない。 Further, in the above embodiment, the procedure of sequentially supplying the solder pieces 2b to the solder piece storage portion 45 of the solder piece storage body 44 along a row along any direction of XY has been described as an example. Of course, by controlling the plane moving mechanism unit 19 by the control unit 21, the solder piece 2b is supplied from the outer circumference to the center of the solder piece accommodating body 44, and vice versa. It may be an embodiment. In addition, various modes can be taken, such as supplying the solder piece 2b from any one solder piece storage unit 45 to the other solder piece storage unit 45 which is closest to the solder piece storage unit 45 in sequence. Needless to say, in these cases, the flow (procedure) is different from the flow diagram of FIG.

また、ステップＳ２で半田片収納部４５が無くなった場合とは、一列全ての半田片収納部４５への収納が完了して次の半田片収納部４５が無くなった場合とすることもできるが、これに限らない。具体的には、最後の半田片収納部４５に糸半田２ａを収納した後、平面移動機構部１９による半田片収納体４４の移動方向を、それまでの方向（一列に切断してきた方向）と別の方向（例えば次に供給する半田片収納部４５が存在する方向）へ変更し、ステップＳ４にてこの別の方向への移動をすることで糸半田２ａを切断して半田片２ａとしてもよい。この場合、平面移動機構部１９による半田片収納体４４の移動時間を最小限にし、かつ、各半田片収納部４５へ半田片２ｂを供給することができ、糸半田２ａを切断して全ての半田片収納部４５へ半田片２ｂの供給するために要する時間を最小限にすることができる。 Further, the case where the solder piece storage portion 45 disappears in step S2 can be the case where the storage in all the solder piece storage portions 45 in one row is completed and the next solder piece storage portion 45 disappears. Not limited to this. Specifically, after the thread solder 2a is stored in the last solder piece storage unit 45, the moving direction of the solder piece storage body 44 by the plane moving mechanism unit 19 is the direction up to that point (the direction in which the solder pieces are cut in a row). Even if the thread solder 2a is cut into a solder piece 2a by changing to a different direction (for example, the direction in which the solder piece accommodating portion 45 to be supplied next exists) and moving in this other direction in step S4. Good. In this case, the moving time of the solder piece accommodating body 44 by the flat surface moving mechanism portion 19 can be minimized, and the solder piece 2b can be supplied to each solder piece accommodating portion 45, and the thread solder 2a is cut and all the solder pieces are cut. The time required to supply the solder piece 2b to the solder piece storage portion 45 can be minimized.

また、糸半田切断機構部４０は、制御部２１の制御によって、半田片収納体４４を移動させることによって糸半田２ａを切断する動作を、ＸＹ平面上の２以上の方向で実行できるように構成することが好ましい。これにより、制御部２１の制御によって様々な方向へ移動させて切断することができるため、糸半田２ａを挿通している半田片収納部４５（糸半田供給ガイド１６と対向している半田片収納部４５）から最も近い半田片収納部４５の方向へ向けて半田片収納体４４を移動させ、この移動動作によって半田片収納部４５と糸半田供給ガイド１６の接触面（若しくは近接面）にて糸半田２ａが切断されて半田片２ｂとして半田片収納部４５に収容され、次の半田片収納部４５に半田片収納部４５を対向させて糸半田２ａを供給し、また次の近い半田片収納部４５と糸半田供給ガイド１６を対向させる方向へ移動して糸半田２ａを切断して半田年２ｂを半田片収納部４５に収容するという一連の動作を最短時間で完了することができる。 Further, the thread solder cutting mechanism unit 40 is configured so that the operation of cutting the thread solder 2a by moving the solder piece accommodating body 44 under the control of the control unit 21 can be executed in two or more directions on the XY plane. It is preferable to do so. As a result, it is possible to move and cut in various directions under the control of the control unit 21, so that the solder piece storage unit 45 through which the thread solder 2a is inserted (the solder piece storage unit facing the thread solder supply guide 16) can be stored. The solder piece accommodating body 44 is moved from the portion 45) toward the nearest solder piece accommodating portion 45, and by this moving operation, at the contact surface (or close surface) between the solder piece accommodating portion 45 and the thread solder supply guide 16. The thread solder 2a is cut and accommodated as a solder piece 2b in the solder piece storage portion 45, the solder piece storage portion 45 is opposed to the next solder piece storage portion 45 to supply the thread solder 2a, and the next nearby solder piece is supplied. A series of operations of moving the accommodating portion 45 and the thread solder supply guide 16 in the opposite directions to cut the thread solder 2a and accommodating the solder year 2b in the solder piece accommodating portion 45 can be completed in the shortest time.

また、図３に示した糸半田供給ガイド１６をＹ方向に複数配置し、各糸半田供給ガイド１６に１つずつ糸半田送り出し機構部１７および糸半田２（図１参照）を備えて、制御部２１の制御に従って指定された１または複数の糸半田２を一括して繰り出す構成としてもよい。この場合、図４（Ａ）に示した半田片収納体４４にＸＹ方向に設けられた半田片収納部４５に対して、Ｘ方向に一列に並んだ半田片収納部４５の列がＹ方向に何列あるかに合わせて、この列数と同じ数の糸半田供給ガイド１６を備えると良い。そして、平面移動機構部１９による半田片収納体４４の移動は、Ｘ方向のみの移動とし、一方向への移動によって複数の糸半田２を一括して切断する構成とすると良い。すなわち、半田片収納体４４がＸ方向へ移動されてある段（ここで、段とは、Ｘ方向の位置の違いを指す）の半田片収納部４５が糸半田供給ガイド１６に対向する状態で、その段の半田片収納部４５に対して糸半田２を一括供給することで、同じ段にあるＹ方向に複数並んでいる半田片収納部４５に糸半田２を供給できる。この状態で半田片収納体４４をＸ方向へ移動させることによって、その段にある複数の半田片収納部４５にそれぞれ糸半田２を一括供給できる。このように構成することで、半田片収納体４４の移動方向を一方向としつつ、ＸＹ方向に複数設けられた半田片収納部４５に糸半田２を供給でき、ノズル６０にＸＹ方向に複数設けられた半田片誘導路６３ａに一斉に糸半田２を供給できる。 Further, a plurality of thread solder supply guides 16 shown in FIG. 3 are arranged in the Y direction, and each thread solder supply guide 16 is provided with a thread solder feeding mechanism 17 and a thread solder 2 (see FIG. 1) for control. The configuration may be such that one or a plurality of thread solders 2 designated according to the control of the unit 21 are fed out at once. In this case, with respect to the solder piece storage portion 45 provided in the solder piece storage body 44 shown in FIG. 4A in the XY direction, the rows of the solder piece storage portions 45 arranged in a row in the X direction are in the Y direction. It is preferable to provide the same number of thread solder supply guides 16 as the number of rows according to the number of rows. Then, the movement of the solder piece accommodating body 44 by the plane moving mechanism unit 19 may be performed only in the X direction, and the plurality of thread solders 2 may be cut at once by moving in one direction. That is, in a state where the solder piece storage portion 45 of the stage in which the solder piece storage body 44 is moved in the X direction (here, the stage refers to the difference in position in the X direction) faces the thread solder supply guide 16. By collectively supplying the thread solder 2 to the solder piece storage section 45 of that stage, the thread solder 2 can be supplied to the solder piece storage portions 45 arranged in the same stage in the Y direction. By moving the solder piece storage body 44 in the X direction in this state, the thread solder 2 can be collectively supplied to each of the plurality of solder piece storage portions 45 on the stage. With this configuration, the solder piece storage body 44 can be moved in one direction, and the thread solder 2 can be supplied to a plurality of solder piece storage portions 45 provided in the XY direction, and a plurality of thread solders 2 can be provided in the nozzle 60 in the XY direction. The thread solder 2 can be supplied to the solder piece guide path 63a all at once.

また、平面移動機構部１９による半田片収納体４４の移動は、Ｘ方向のみの移動とし、半田片収納体４４と糸半田供給ガイド１６の間にシリンダーにてＹ方向へ移動する切断冶具を備えてもよい。この切断冶具は、円筒形状など、半田片収納部４５と同程度の大きさの孔を有する冶具であればよく、孔の軸方向が糸半田供給ガイド１６の孔の軸方向および半田片収納体４４の半田片収納部４５（孔）の軸方向と同方向となる構成にすると良い。これにより、半田片収納体４４の半田片収納部４５のある１つの段を切断冶具と対応させる位置で、糸半田供給ガイド１６から供給される糸半田２を切断冶具の孔内に挿入し、この状態でシリンダを駆動して切断冶具をＹ方向へ移動させて糸半田２を切断して半田片２ａとし、さらに切断冶具を半田片収納部４５の上部まで移動させて半田片２ａを半田片収納部４５へ供給する。そうして、シリンダー駆動により切断冶具を戻して再度糸半田２を切断し、同じ段の違う位置の半田片収納部４５へ半田片２ａを供給する動作を繰り返す。これにより、１段の半田片収納部４５への半田片２ａの供給が完了すると、半田片収納体４４をＸ方向へ移動して次の段にセットし、その段の半田片収納部４５へ半田片２ａを供給していく上述の動作を繰り返す。このように構成することで、切断冶具の一方向（Ｙ方向）への移動によって半田片２ａを複数の半田片収納部４５にＹ方向へ供給する動作を、半田片収納体４４を別の方向（Ｘ方向）へ移動して各段で繰り返すことができ、ＸＹ方向に複数設けられた半田片収納部４５に半田片２ａを供給できる。そして、ノズル６０にＸＹ方向に複数設けられた半田片誘導路６３ａに一斉に糸半田２を供給できる。 Further, the movement of the solder piece storage body 44 by the plane moving mechanism unit 19 is limited to the movement in the X direction only, and a cutting jig that moves in the Y direction by a cylinder is provided between the solder piece storage body 44 and the thread solder supply guide 16. You may. The cutting jig may be a jig having a hole having a size similar to that of the solder piece storage portion 45, such as a cylindrical shape, and the axial direction of the hole is the axial direction of the hole of the thread solder supply guide 16 and the solder piece storage body. It is preferable that the solder piece storage portion 45 (hole) of 44 is configured in the same direction as the axial direction. As a result, the thread solder 2 supplied from the thread solder supply guide 16 is inserted into the hole of the cutting jig at a position where one step of the solder piece accommodating body 44 having the solder piece accommodating portion 45 corresponds to the cutting jig. In this state, the cylinder is driven to move the cutting jig in the Y direction to cut the thread solder 2 into a solder piece 2a, and further move the cutting jig to the upper part of the solder piece storage portion 45 to move the solder piece 2a to the solder piece. Supply to the storage unit 45. Then, the cutting jig is returned by the cylinder drive, the thread solder 2 is cut again, and the operation of supplying the solder piece 2a to the solder piece storage portions 45 at different positions on the same stage is repeated. As a result, when the supply of the solder piece 2a to the solder piece storage unit 45 in the first stage is completed, the solder piece storage body 44 is moved in the X direction and set in the next stage, and is set in the solder piece storage unit 45 in that stage. The above-mentioned operation of supplying the solder piece 2a is repeated. With this configuration, the operation of supplying the solder piece 2a to the plurality of solder piece storage portions 45 in the Y direction by moving the cutting jig in one direction (Y direction), and the solder piece storage body 44 in another direction. It can be moved in the (X direction) and repeated in each stage, and the solder pieces 2a can be supplied to a plurality of solder piece storage portions 45 provided in the XY direction. Then, the thread solder 2 can be supplied all at once to the solder piece guide paths 63a provided in the nozzle 60 in the XY directions.

また、上述した実施例において、Ｘ方向を搬送方向（図２の左右方向）とし、Ｙ方向を搬送幅方向（図２の奥行方向）としたが、これに限らず、Ｘ方向を搬送幅方向としＹ方向を搬送方向とするなど、適宜の構成とすることができる。これにより、半田片収納体４４の駆動方向や制御など様々な形態をとることができる。 Further, in the above-described embodiment, the X direction is the transport direction (horizontal direction in FIG. 2) and the Y direction is the transport width direction (depth direction in FIG. 2), but the present invention is not limited to this, and the X direction is the transport width direction. An appropriate configuration can be provided, such as setting the Y direction as the transport direction. Thereby, various forms such as the driving direction and control of the solder piece accommodating body 44 can be taken.

この発明は、生産設備で半田付けを実行するような産業に利用することができる。 The present invention can be used in industries such as performing soldering in production equipment.

１…半田付け装置
２ｂ…半田片
６…近接離間方向移動ユニット
１６…糸半田供給ガイド
１７…糸半田送り出し機構部
４０…半田片供給手段
４４…半田片収納体
４５…半田片収納部
５１…ヒータ
５２，２５２…加熱部
６０…ノズル
６３…半田片誘導通路
６３ａ…半田片誘導路
Ｒ…ランド
Ｔ…端子 1 ... Soldering device 2b ... Soldering piece 6 ... Proximity separation direction moving unit 16 ... Thread solder supply guide 17 ... Thread solder feeding mechanism unit 40 ... Soldering piece supply means 44 ... Soldering piece storage body 45 ... Soldering piece storage unit 51 ... Heater 52, 252 ... Heating unit 60 ... Nozzle 63 ... Soldering piece guide passage 63a ... Soldering piece guide path R ... Land T ... Terminal

Claims (5)

第１導体と第２導体とを溶融半田によって半田付けする半田付け装置であって、
半田片を通過させる半田片供給通路を有するノズルと、
前記第１導体と前記ノズルとの近接離間方向の相対距離を変化させて前記第１導体と前記ノズルを近接または当接させる相対距離変化手段と、
前記半田片を前記ノズルの前記半田片供給通路に供給する半田片供給手段と、
前記ノズルの前記半田片供給通路内の前記半田片を加熱して溶融させる加熱手段とを備え、
前記半田片供給通路は、
通路幅方向の平面上で複数方向にそれぞれ形成された構成をなす
半田付け装置。 A soldering device that solders the first conductor and the second conductor with molten solder.
A nozzle having a solder piece supply passage for passing the solder piece,
Relative distance changing means for bringing the first conductor and the nozzle into close proximity or contact with each other by changing the relative distance between the first conductor and the nozzle in the proximity separation direction.
A solder piece supply means for supplying the solder piece to the solder piece supply passage of the nozzle,
A heating means for heating and melting the solder piece in the solder piece supply passage of the nozzle is provided.
The solder piece supply passage is
A soldering device that is formed in multiple directions on a plane in the width direction of the passage. 糸半田を先端から送り出す糸半田送り出し機構部と、
前記糸半田送り出し手段より下流側で送り出された前記糸半田を挿通する糸半田供給ガイドとを備え、
前記糸半田供給ガイドの先端は、送り出した前記糸半田の突出部分を切断して半田片とする切断部を有し、
前記半田片供給手段は、
前記糸半田供給ガイドより送り出されて切断された半田片を収容する半田片収納部を複数有する半田片収納体と、
前記半田片収納部に収容された前記半田片を収容している収容状態と前記半田片を前記ノズルの前記半田片供給通路へ供給する解放状態に切り替える収容／解放切替部とを有し、
前記半田片収納体の前記半田片収納部は、少なくとも前記ノズルの前記半田片供給通路と同じ位置で同じ数が設けられている
請求項１記載の半田付け装置。 The thread solder feeding mechanism that feeds the thread solder from the tip,
A thread solder supply guide for inserting the thread solder fed downstream from the thread solder feeding means is provided.
The tip of the thread solder supply guide has a cutting portion that cuts the protruding portion of the thread solder that has been sent out to form a solder piece.
The solder piece supply means
A solder piece storage body having a plurality of solder piece storage portions for storing the solder pieces sent out from the thread solder supply guide and cut.
It has a storage / release switching unit for switching between a storage state in which the solder pieces housed in the solder piece storage unit are housed and a release state in which the solder pieces are supplied to the solder piece supply passage of the nozzle.
The soldering apparatus according to claim 1, wherein the solder piece storage portion of the solder piece storage body is provided with at least the same number at the same position as the solder piece supply passage of the nozzle. 前記半田片収納体を前記半田片収納部に前記半田片を収容する方向と直交する平面上の二方向へ移動させる半田片収納体移動手段を備えた
請求項２記載の半田付け装置。 The soldering apparatus according to claim 2, further comprising a solder piece accommodating body moving means for moving the solder piece accommodating body in the solder piece accommodating portion in two directions on a plane orthogonal to the direction in which the solder piece is accommodating. 請求項１から３のいずれか１つに記載の半田付け装置を用い、
前記相対距離変化手段により前記第１導体と前記ノズルとの近接離間方向の相対距離を変化させて前記第１導体と前記ノズルを近接または当接させ
前記半田片供給手段により複数の前記半田片を前記ノズルの複数の前記半田片供給通路に一斉に供給し、
前記加熱手段により前記ノズルの前記半田片供給通路内の前記半田片を加熱して溶融させ、
前記第１導体と前記第２導体を前記半田片が溶融した溶融半田により半田付けする
半田付け方法。 Using the soldering apparatus according to any one of claims 1 to 3,
By changing the relative distance between the first conductor and the nozzle in the proximity separation direction by the relative distance changing means, the first conductor and the nozzle are brought close to each other or in contact with each other, and a plurality of the solder pieces are brought into contact with each other by the solder piece supplying means. It is supplied to the plurality of solder piece supply passages of the nozzle all at once.
The solder pieces in the solder piece supply passage of the nozzle are heated and melted by the heating means.
A soldering method in which the first conductor and the second conductor are soldered by molten solder in which the solder pieces are melted. 請求項１から３のいずれか１つに記載の半田付け装置に用いる半田付け装置用ノズルであって、
前記半田片供給通路を前記通路の幅方向の複数方向に複数配置した
半田付け装置用ノズル。 A soldering device nozzle used in the soldering device according to any one of claims 1 to 3.
A nozzle for a soldering device in which a plurality of solder piece supply passages are arranged in a plurality of directions in the width direction of the passages.
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Publication number Priority date Publication date Assignee Title
JPH11514933A (en) * 1995-11-10 1999-12-21 フィン，ダーヴィト Bonding material welding equipment
JP2012038907A (en) * 2010-08-06 2012-02-23 Yazaki Corp Terminal and soldering structure for the same
JP2013120869A (en) * 2011-12-08 2013-06-17 Parat Co Ltd Soldering device
JP2015115427A (en) * 2013-12-11 2015-06-22 株式会社パラット Soldering device and method
JP2016124004A (en) * 2014-12-27 2016-07-11 株式会社アンド Solder processing unit
JP2017092222A (en) * 2015-11-09 2017-05-25 株式会社パラット Soldering device and soldering method
JP2017087261A (en) * 2015-11-09 2017-05-25 株式会社パラット Soldering device, soldering method, and soldering magazine

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11514933A (en) * 1995-11-10 1999-12-21 フィン，ダーヴィト Bonding material welding equipment
JP2012038907A (en) * 2010-08-06 2012-02-23 Yazaki Corp Terminal and soldering structure for the same
JP2013120869A (en) * 2011-12-08 2013-06-17 Parat Co Ltd Soldering device
JP2015115427A (en) * 2013-12-11 2015-06-22 株式会社パラット Soldering device and method
JP2016124004A (en) * 2014-12-27 2016-07-11 株式会社アンド Solder processing unit
JP2017092222A (en) * 2015-11-09 2017-05-25 株式会社パラット Soldering device and soldering method
JP2017087261A (en) * 2015-11-09 2017-05-25 株式会社パラット Soldering device, soldering method, and soldering magazine

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