JP2017087261A - Soldering device, soldering method, and soldering magazine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To decrease the weight of a mechanism that moves with a nozzle.SOLUTION: A soldering device 1 for soldering on a through-hole comprises: a cylindrical nozzle 25 which is brought into contact with or close to the through-hole; a heater 23 which heats the nozzle 25 to weld a soldering piece 29 of the nozzle 25; an approaching/separating direction moving unit 6 which moves the nozzle 25 to the through-hole in approaching/separating direction; a carrying direction moving unit 7 which moves the nozzle in a direction intersecting the approaching/separating direction and a carrying width direction moving unit 8; and a soldering magazine 40 which stores a predetermined amount of multiple soldering pieces 29 to be supplied to the nozzle 25.SELECTED DRAWING: Figure 2

Description

  The present invention relates to, for example, a soldering apparatus, a soldering method, and a solder magazine that perform soldering on a soldering target by mechanical driving.

  Conventionally, a soldering apparatus for mechanically soldering an electronic component to a printed circuit board has been provided. This soldering device uses a flow soldering method in which a printed circuit board is brought into contact with the solder liquid surface, or a solder paste is preliminarily printed on the circuit board in accordance with a pattern, and the cream solder is heated to be melted. Various methods have been proposed, such as a reflow soldering method in which soldering is performed with a solder.

  Here, the applicant uses a cylindrical soldering iron, inserts the pins (terminals) of electronic parts inserted into the through holes of the printed circuit board into the soldering iron, melts the solder inside, and solders it. Has been developed and provided (see Patent Document 1).

  The applicant's soldering apparatus can solder to a soldering point with a cylindrical nozzle, and can also solder a product with high heat transfer in a short time with a heater unit with good heat transfer efficiency. Since there is no bias in heat supply, the defect rate is reduced, and the soldering apparatus that does not scatter conductive foreign matters (solder balls) is very popular with customers such as automobile manufacturers.

  Here, in such a soldering apparatus, the position of the nozzle is moved in accordance with the shape or the like of the object to be soldered, the solder is supplied to the nozzle moved to an appropriate soldering position, heated and melted, and soldered. There is a need. For this reason, a mechanism for moving the nozzle is provided.

  However, if there is a heavy mechanism part or many mechanism parts as a mechanism that moves together with the moving nozzle, there is a problem that a driving force that can be opposed to this addition is required, and a problem that wear tends to occur.

JP 2013-120869 A

  In view of the above problems, an object of the present invention is to reduce the weight of a mechanism that moves together with a nozzle.

  The present invention is a soldering apparatus for performing soldering on a soldering target, a cylindrical nozzle that is brought into contact with or close to a soldering target part, and heating for heating the nozzle to melt the solder in the nozzle Means, a proximity / separation direction moving means for moving the nozzle in the proximity / separation direction with respect to the soldering object, a nozzle position moving means for moving the nozzle in a direction crossing the proximity / separation direction, and a supply to the nozzle The soldering apparatus includes a solder magazine in which a plurality of solder pieces having a predetermined amount are accommodated.

  According to the present invention, it is possible to provide a soldering apparatus, a soldering method, and a solder magazine that reduce the weight of the mechanism that moves together with the nozzle.

The right view which shows the external appearance structure of a soldering apparatus. The right side sectional view of the structure of a solder magazine, a magazine loading section, and an XYZ drive system. The top view which shows the structure of a solder magazine and a magazine loading part. Front sectional drawing which shows the structure of a magazine filling apparatus. The flowchart of the operation | movement which the control part of a soldering apparatus performs.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a right side view showing an external configuration of the soldering apparatus 1.
The soldering apparatus 1 includes a head portion 3 having a ceramic material nozzle 25 (soldering iron) for soldering to a through hole (soldering target portion) of a printed circuit board 9 (soldering target) to be soldered; The head suspension 3 and the nozzle 25 are moved in the floating state, and the air suspension unit 5 and the nozzle 25 are moved in the direction of approaching / separating the soldering target (vertical direction in FIG. 1, hereinafter referred to as “Z direction”). The proximity / separation direction moving unit 6 (proximity / separation direction moving means) to be moved, the proximity / separation direction movement unit 6 and the nozzle 25 in the transport direction (the depth direction in FIG. 1, hereinafter referred to as “X direction”) in which the printed circuit board 9 is transported. The transport direction moving unit 7 to be moved, and the transport direction moving unit 7 and the nozzle 25 are moved in the transport direction moving unit. Conveying width direction (lateral direction in FIG. 1, hereinafter referred to as "Y direction") of and a conveying width direction moving unit 8 is moved in. The transport direction moving unit 7 and the transport width direction moving unit 8 function as nozzle position moving means for moving in the XY directions.

  A nozzle unit 20 having a nozzle 25 is provided below the head unit 3, and a magazine loading unit 30 in which a solder magazine 40 is set is provided thereon.

  The magazine loading section 30 has a moving stage 32 (magazine moving means) on which the solder magazine 40 is placed and moves the solder magazine 40 in the XY directions (front and rear, left and right in FIG. 1), and solder at a position above the moving stage 32. A cover 31 is provided to cover the upper surface of the magazine 40 so that the solder pieces 29 do not come out. The cover 31 is sized (wide) so as to cover the entire range in which the solder magazine 40 can move relative to the nozzle 25, and when the push rod 13 protrudes toward the nozzle 25, A through hole 31a that allows passage is provided. The gap between the facing surfaces of the cover 31 and the solder magazine 40 is set to have no gap or less than the thickness of the solder piece 29.

  Above the magazine loading unit 30, there are provided a push rod 13 for pushing the solder piece 29 in the X direction through the nozzle 25, and a rod drive unit 11 for projecting and retracting the push rod 13 toward the solder magazine 40 in the X direction. ing.

  The upper surface of the transport width direction moving unit 8 is arranged at a position slightly higher than the upper surface of a transport path (not shown) for transporting the printed circuit board 9.

  2 is a right side cross-sectional view showing the configuration of the solder magazine 40, the magazine loading unit 30 and the nozzle unit 20 and the structure of the XYZ drive system. FIG. 3 is a plan view showing the structure of the solder magazine 40 and the magazine loading unit 30. FIG.

  As shown in FIG. 2, the soldering apparatus 1 is fixed to the transport width direction moving unit 8 (see FIG. 1) and extends straight toward the transport path of the printed circuit board 9 (see FIG. 1). In addition, a conveyance guide 7c is provided that moves along the conveyance guide 7f by a drive mechanism 7e such as a stepping motor. The drive mechanism 7e and the conveyance guide 7f are accommodated in the conveyance width direction moving unit 8 (see FIG. 1). The conveyance guide 7c extends straight toward the conveyance direction (X direction) of the conveyance path.

  The upper part of the X-direction conveyance guide 7c is composed of a moving body 7a that moves in the X direction along the conveyance guide 7c and a stepping motor that moves the moving body 7a in the X direction along the conveyance guide 7c. A drive mechanism portion 7b is provided. The moving body 7a, the drive mechanism 7b, and the transport guide 7c are housed in the transport direction moving unit 7 (see FIG. 1). The moving body 7a, the drive mechanism unit 7b, the transport guide 7c, the drive mechanism unit 7e, and the transport guide 7f function as a nozzle position moving unit that moves the nozzle 25 to an arbitrary position to be operated.

  The moving body 7a is provided with a Z-direction transport guide 5c extending in a direction in which the nozzle 25 approaches / separates from the through hole. The transport guide 5c is provided with a head fixing portion 5a that moves in the Z direction, and a drive mechanism portion 5b that includes a stepping motor and the like. The head fixing unit 5a, the drive mechanism unit 5b, and the conveyance guide 5c function as a proximity / separation direction moving unit that moves the nozzle 25 in a direction to approach / separate the soldering target, and the proximity / separation direction moving unit 6 (see FIG. 1). ).

  The Y-direction conveyance guide 7f, the X-direction conveyance guide 7c, and the drive mechanism portions 7b and 7e configured as described above function as nozzle position moving means, so that the position of the nozzle 25 is soldered to an arbitrary position. Can be moved. Further, the Z-direction transport guide 5c and the drive mechanism unit 5b function as a proximity / separation direction moving unit, so that the nozzle 25 is moved in the proximity direction at the moved position and soldered into the hole 26 of the nozzle 25. The tip of the nozzle 25 can be brought into contact with the through hole through a terminal (such as a terminal of an electronic component) and separated after soldering.

  The head fixing portion 5a is provided with a floating unit 5d. The floating unit 5d is provided in the air suspension unit 5 (FIG. 1), lifts the nozzle unit 20 by the supplied air, and sets the relative weight of the floating unit 5d (including the nozzle 25) to the printed circuit board 9. It is lightening. For example, if the normal weight is 100, the floating unit 5d may have a suitable structure such that the weight is 10%.

  The head unit 3 is fixed to the floating unit 5 d and includes a rod driving unit 11 and a pushing rod 13, a magazine loading unit 30, a solder magazine 40, and a nozzle unit 20.

  The nozzle unit 20 includes a solder introduction cylinder 22 in the nozzle fixing portion 21, a nozzle 25 connected to the tip end side of the solder introduction cylinder 22, and a cylindrical heater 23 (abutting around the solder introduction cylinder 22 and the nozzle 25). Heating means) and a nozzle holder 24 for fixing the nozzle 25 to the nozzle fixing portion 21.

  The nozzle 25 is a cylindrical nozzle serving as a soldering iron, and includes a straight hole 25a at the center. In addition, the nozzle 25 includes a side hole 25b that connects the hole 25a and the outside in the vicinity of the tip portion where soldering is performed. By this side hole 25b, fumes generated in the nozzle 25 can be discharged to the outside.

  On the base side (upper side in the figure) of the nozzle 25, a nozzle holder 24 that wraps around the outer periphery of the nozzle 25 and has a fixing screw groove 24a (female screw) on the inner surface is provided. The nozzle holder 24 is fixed to the nozzle 25 so as not to rotate relative to the nozzle 25 by an appropriate detent. The screw groove 24a of the nozzle holder 24 is screwed and fixed to the screw groove 21a (male screw) of the nozzle fixing portion 21 that also functions as a heater unit. A cylindrical space into which the cylindrical heater 23 is inserted is provided between the inner side of the nozzle holder 24 and the outer side of the nozzle 25. This space is provided from the base of the nozzle 25 to the tip side slightly from the center.

  The nozzle fixing portion 21 is fixed with a cylindrical heater 23 and a cylindrical solder introduction cylinder 22 provided inside the heater 23. The solder introduction cylinder 22 has a tip abutting on the base of the nozzle 25 inserted into the heater 23, and a hole 22 a in the solder introduction cylinder 22 communicates with the hole 25 a of the nozzle 25. As a result, the solder piece 29 supplied from above passes through the hole 22 a and the hole 25 a and is heated and melted by the nozzle 25 heated by the heater 23.

  The inner diameters of the hole 22a in the solder introducing cylinder 22 and the hole 25a of the nozzle 25 are configured to be equal to or larger than the inner diameter of the solder piece accommodation hole 43 (solder piece accommodation portion) of the solder magazine 40. As a result, the supplied solder pieces 29 are not caught or clogged in the middle, and stable soldering can be realized.

  The nozzle 25 is configured to be attachable to and detachable from the nozzle fixing portion 21 by the nozzle holder 24. However, the nozzle 25 is not limited to this, and is configured as a fixed type or a heater unit including the heater 23. It is possible to adopt an appropriate configuration such as a detachable configuration that can be attached and detached collectively.

  As shown in FIG. 3, the solder magazine 40 is entirely formed of a resin material in a substantially square plate shape, and a plurality of solder piece receiving holes 43 penetrating in the Z direction are arranged at equal intervals in the XY direction. Has been placed. Each solder piece accommodation hole 43 accommodates a cylindrical solder piece 29 in which thread solder having a predetermined outer diameter (for example, φ0.5 to 1.6 mm) is cut to a predetermined length (for example, 2 mm to 15 mm). Yes. This accommodation is in a form in which one solder piece 29 is accommodated in one solder piece accommodation hole 43. More than 5,000 solder piece accommodation holes 43 and solder pieces 29 are arranged in one plane (XY plane) for one solder magazine 40.

  As shown in FIG. 2, the bottom surface of the solder magazine 40 is covered with a support sheet 45 (solder piece locking / releasing means) that prevents the solder pieces 29 from falling naturally from below the solder piece accommodation holes 43. As a result, the solder piece 29 does not fall naturally, but when the solder piece 29 is pressed downward by the push rod 13 from above, a hole is formed in the support sheet 45 by the pressing force, and the solder piece 29 is moved downward. Extruded. The push rod 13 is inserted into the solder piece accommodation hole 43 from above the solder piece accommodation hole 43 and protrudes to a position where the push rod 13 penetrates below the solder piece accommodation hole 43. Thereby, the extrusion of the solder piece 29 is ensured.

  The prevention of the natural fall of the solder piece 29 is not limited to the support sheet 45, and a deformable protrusion is provided at the lower end position of the solder piece accommodation hole 43. Therefore, it is possible to obtain an appropriate configuration that allows the solder piece 29 to be extruded.

  As shown in FIG. 3, the magazine loading unit 30 is provided on the X-direction guide 33 and the X-direction guide 33 that are fixed in the movement station 32 and guide the movement of the transport chuck 36 in the X-direction long in the X-direction. A Y-direction guide 34 that is long in the Y-direction and a transport chuck 36 that is provided on the Y-direction guide 34 and to which the solder magazine 40 is mounted are provided.

  The Y-direction guide 34 includes an X-direction drive motor (not shown) that executes movement of the Y-direction guide 34 in the X direction by a rotation operation on the X-direction guide 33. A Y-direction drive motor (not shown) that moves the conveyance chuck 36 in the Y-direction by rotating on the Y-axis 34 is provided.

  The conveyance chuck 36 is configured to support two adjacent sides of the solder magazine 30 having a square shape in plan view from the side. The transport chuck 36 is provided with a vertically movable claw 35 that supports the side of the solder magazine 30 that faces one of the sides in the opposite direction from the side. The vertically movable claw 35 enables the mounting / removal of the solder magazine 30 in a state where it is moved upward to the height of the solder magazine 30 or more, and the vertically movable claw 35 is moved downward in a state where the solder magazine 30 is mounted. Then, the side surface of the solder magazine 30 is sandwiched between the transfer chuck 36 and the vertically movable claw 35. As a result, mounting / removal of the solder magazine 30 is allowed, and the mounted solder magazine 30 is fixed so as not to be displaced during movement.

  With this configuration, the magazine loading unit 30 enables the loading of the solder magazine 30 and the loading and moving of the solder magazine 30 in the XY directions to sequentially feed out the solder pieces 29.

  In order to drive these components, each element of the soldering apparatus 1 is controlled by a control unit (not shown).

FIG. 4 is a front sectional view showing the configuration of the magazine filling device 70.
The magazine filling device 70 includes a solder supply unit 71, a cutting unit 75, and a moving stage 80.

  The solder supply unit 71 includes a thread solder reel 72 disposed above and wound with a thread solder 72a, a feed amount detection roller 73 that detects a feed amount of the thread solder 72a at a position below the thread solder reel 72, and a feed. A feed roller 74 for feeding the thread solder 72a downward at a position below the amount detection roller 73 is provided.

  The cutting unit 75 is disposed below the feed roller 74 and includes a cutting upper blade 76 and a cutting lower blade 77. The cutting upper blade 76 is fixed with a hole 76a through which the thread solder 72a is inserted, and allows the thread solder 72a to pass through the hole. The lower cutting blade 77 has a hole 77a through which the thread solder 72a is inserted, and is moved by a cylinder (not shown) in a direction perpendicular to the vertical direction (Z direction) in the supply direction of the thread solder 72a. The cutting lower blade 77 is slid in a state where the smooth lower surface of the cutting upper blade 76 and the smooth upper surface of the cutting lower blade 77 are in contact with each other, so that a position between the cutting upper blade 76 and the cutting lower blade 77 is reached. Thus, the thread solder 72a is cut. Also, the feed amount is detected by the feed amount detection roller 73, and the thread solder 72a is fed and cut by the feed roller 74 by a desired solder length, whereby the solder piece 29 having a desired length can be created.

  On the moving stage 80, the solder magazine 40 is placed. The solder magazine 40 is placed with the support sheet 45 positioned on the lower surface, and the solder pieces 29 cut by the lower cutting blade 77 are naturally dropped and stored in the solder piece receiving holes 43. For this reason, the lower cutting blade 77 stops at a position where the position of the hole 77a after the cutting communicates with the solder piece accommodation hole 43 which accommodates the solder piece 29 in the vertical direction.

  The moving stage 80 is provided with a Y-direction conveyance guide 85 and a conveyance guide 83 that moves along the conveyance guide 85 by a drive mechanism 84 such as a stepping motor. The conveyance guide 83 extends straight in the X direction.

  The upper part of the transport guide 83 in the X direction is configured by a moving body 81 that moves in the X direction along the transport guide 83 and a stepping motor that moves the movable body 81 in the X direction along the transport guide 83. A drive mechanism unit 82 is provided. In the moving body 81, the drive mechanism portion 82, the conveyance guide 83, the drive mechanism portion 84, and the conveyance guide 85, the solder piece accommodation hole 43 into which the solder piece 29 is loaded is positioned below the position after the cutting of the cutting lower blade 77. Thus, it functions as a solder magazine position moving means for moving the solder magazine 40.

  With this configuration, the magazine loading unit 30 sends out a necessary amount of the thread solder 72 a by the solder supply unit 71, accommodates the solder pieces 29 cut by the cutting unit 75 in the solder piece accommodation holes 43 of the solder magazine 40, and moves them by the moving stage 80. The operation | movement corresponding to the position of the solder piece accommodation hole 43 which moves the solder magazine 40 and loads the solder piece 29 next is performed. Thus, the thread solder 72a can be continuously cut and the solder pieces 29 can be loaded, and more than 5,000 pieces of solder pieces 29 can be loaded into the solder magazine 40.

  In addition, although the operation | movement which sends out the solder piece 29 from the cutting lower blade 77 to the solder piece accommodation hole 43 was made into natural fall, it pushes from not only this but the hole 77a of the cutting lower blade 77 after a cutting | disconnection from the top. A configuration may be adopted in which a rod is inserted and the solder pieces 29 are forcibly sent out to the solder piece accommodation holes 43. In this case, the solder piece 29 can be more reliably loaded.

FIG. 5 is a flowchart showing an operation executed by the control unit of the soldering apparatus 1.
The control unit of the soldering apparatus 1 first sets the solder magazine 40 shown in FIG. 3 in the magazine loading unit 30, and sets the position of the solder piece accommodation hole 43 in which the solder piece 29 to be used first is accommodated in the solder introduction cylinder. It adjusts to the position connected with the hole 22a in 22 (step S1).

  The control unit of the soldering apparatus 1 moves the position of the nozzle 25 to the soldering position of the printed circuit board 9 (see FIG. 1), causes the push rod to protrude by the rod driving unit 11, and solder pieces in the solder piece accommodation hole 43. 29 is pushed into the hole 22a in the solder introduction cylinder 22, the solder piece 29 is heated and melted by the heater 23 and soldered at the lower end position in the nozzle 25 (step S2). At the time of this soldering, the tip of the nozzle 25, which is a soldering iron, is in contact with the through hole of the printed circuit board 9 without any gap, and soldering is performed with the pin inserted into the hole 25a. Stable soldering with no solder failure can be realized without scattering of flux. At this time, since the floating nozzle 25 is in contact with the through hole of the printed circuit board 9, the nozzle 25 can be pressed against the printed circuit board 9 with a constant pressing force.

  If the solder pieces 29 in the row currently used in the solder magazine 40 remain in the solder magazine 40 (step S3: Yes), the control unit of the soldering apparatus 1 opens the solder piece receiving holes 43 that become one in the current row. A single feed operation for driving the moving stage 32 is performed so as to face 22a (step S4), and the process returns to step S2.

  When the last solder piece 29 in the currently used column is used in the solder magazine 40 (step S3: Yes), the control unit of the soldering apparatus 1 determines whether all the columns have been completed (step S5).

  If there is a row in which the solder pieces 29 still remain (step S5: No), the control unit of the soldering apparatus 1 drives the moving stage 32 so that the solder piece accommodation holes 43 in the next row face the holes 22a. A line feed operation is performed (step S6), and the process returns to step S2.

  When all rows are completed and the solder pieces 29 are not left in the solder magazine 40 (step S5: Yes), the control unit of the soldering apparatus 1 discharges the used solder magazine 40 (step S7). Then, the process is returned to step S1, and the process is repeated from the loading of the solder magazine 40.

With the above configuration and operation, stable quantitative spot soldering without defects can be realized without the flux scattering out of the nozzle 25.
Providing the solder pieces 29 by the solder magazine 40 eliminates the need for a mechanism for cutting the thread solder every time, and makes it possible to reduce the weight of the head unit 3 that is floated by the air suspension unit 5 and moved each time soldering is performed. it can.

  By reducing the weight of the head unit 3, it is possible to reduce the load on the drive mechanism units 5b, 7b, and 7e, and it is possible to further increase the speed.

  Further, since a cutting mechanism for cutting the thread solder every time can be omitted, the cost can be reduced.

  Further, since the solder piece 29 is used in an amount that is used for one soldering, there is no cutting residue that may occur when the thread solder is cut each time, and there is no consumable part to prevent machine stoppage. it can.

  Further, in order to move the magazine loading unit 30 in the XY direction at the moving station 32, the loaded solder pieces 29 are moved one after another to the position facing the nozzle 25, and the solder pieces 29 are fed out one by one and soldered. it can. Further, the movement in the XY directions is executed one by one, and in the next row where all the solder pieces 29 in one row are fed out in order, the moving time by the moving station 32 is reduced by feeding out in the opposite direction in order. Soldering can be executed continuously at a high speed with a reduced amount.

  In addition, since the solder magazine 40 stores one solder piece 29 in one solder piece receiving hole 43, the operation of feeding out the solder piece 29 can be executed stably.

  In addition, since a support sheet 45 is provided on the bottom surface of the solder magazine 40 to prevent the solder pieces 29 from dropping naturally and to allow the solder pieces 29 to fall due to deformation by being pushed by the push rod 13, the solder pieces 29 are stabilized. Can be held and fed out stably.

  Further, by pushing out the solder piece 29 by the push rod 13, the solder piece 29 can be fed out more stably than by natural fall.

  Further, since the magazine loading unit 30 covers the upper surface of the solder magazine 40 with the cover 31 without a gap, even if the solder magazine 40 is moved together with the head unit 3 at a high speed, the solder piece 29 is not intended and the solder piece receiving hole is not intended. It is possible to prevent the occurrence of soldering failure or machine stoppage due to slipping out of 43.

  Further, the magazine filling device 70 can cut the thread solder 72a in a fixed amount and load it into the solder magazine 40. By configuring the solder magazine 40 in this way, it is possible to use a solder piece 29 that is cut into a predetermined amount by being filled, instead of spherical solder that is not filled with dust.

  In addition, this invention is not restricted to embodiment mentioned above, It can be set as other various embodiment.

  For example, the soldering apparatus 1 may be provided with a plurality of nozzle units 20. In this case, the plurality of nozzle units 20 are preferably arranged so as to correspond to the plurality of through holes arranged at equal intervals in a row to be soldered. Thereby, many can be soldered simultaneously.

  In this case, the solder piece accommodation holes 43 of the solder magazine 40 are arranged in an integer multiple of the number of the nozzle units 20 in one row, and the interval between the solder piece accommodation holes 43 is also an integer of the interval of the nozzle units 20. A good fraction

  Thereby, the solder pieces 29 of the solder magazine 40 can be used up efficiently. That is, for example, when the number of the solder piece accommodation holes 43 in the number of the nozzle units 20 (for example, 10) is n times (for example, 50 times the number of the solder pieces), 43 and n−1 solder piece receiving holes 43 are equally arranged between the nozzle units 20. Thereby, n times of soldering can be executed in one row of the solder magazine 40.

  Further, the solder magazine 40 stores one solder piece 29 in one solder piece receiving hole 43. However, the present invention is not limited to this, and a plurality of solder pieces 29 may be stored without being partitioned. Also in this case, the solder pieces 29 can be fed out one by one and soldered.

  In addition, instead of covering the bottom surface of the solder magazine 40 with the support sheet 45, a drop prevention protrusion for preventing the solder piece 29 from falling off may be provided at the lower end of the solder piece accommodation hole 43. In this case, unlike the breakage of the support sheet 45, the fall prevention protrusion is deformed and the solder piece 29 can be fed out, so that the machine stop due to the broken piece or the like can be prevented. In addition, the solder pieces 29 can be reloaded into the used solder magazine 40 and reused.

  The present invention can be used in industries that perform soldering in production facilities.

DESCRIPTION OF SYMBOLS 1 ... Soldering device 6 ... Proximity separation direction moving unit 7 ... Conveyance direction moving unit 8 ... Conveyance width direction moving unit 9 ... Printed circuit board 13 ... Push rod 23 ... Heater 25 ... Nozzle 29 ... Solder piece 32 ... Moving stage 40 ... Solder Magazine 43 ... Solder piece receiving hole 45 ... Support sheet

Claims (8)

A soldering apparatus for performing soldering on a soldering target,
A cylindrical nozzle to be brought into contact with or close to the soldering target part;
Heating means for heating the nozzle to melt the solder in the nozzle;
Proximity / separation direction moving means for moving the nozzle in the proximity / separation direction with respect to the soldering target;
Nozzle position moving means for moving the nozzle in a direction crossing the approaching / separating direction;
Provided with a solder magazine containing a plurality of predetermined amount of solder pieces to be supplied to the nozzle,
Soldering device. 2. The apparatus according to claim 1, further comprising a magazine moving unit configured to move the solder magazine relative to the nozzle and sequentially supply the plurality of solder pieces accommodated in the solder magazine into the nozzle. Soldering device. The solder magazine has a configuration in which a plurality of the solder pieces are arranged in a direction perpendicular to the approaching / separating direction.
The soldering apparatus according to claim 1 or 2. The soldering apparatus according to claim 1, wherein the solder magazine is provided with as many solder piece accommodating portions as the number of the solder pieces for accommodating one solder piece. The solder magazine is
During normal operation, the solder piece is prevented from coming out of the solder piece housing portion, and the solder piece housed in the solder piece housing portion moves in the direction of withdrawal when the solder piece is used. The soldering apparatus according to claim 4, further comprising a permitted solder piece locking release means. The solder magazine is disposed upstream of the heating means in the direction of supplying solder to the nozzle,
The soldering device according to any one of claims 1 to 5, further comprising a push rod that pushes the solder piece from the solder magazine toward the nozzle. A cylindrical nozzle to be brought into contact with or close to the soldering target part;
Heating means for heating the nozzle to melt the solder in the nozzle;
Proximity / separation direction moving means for moving the nozzle in the proximity / separation direction with respect to the soldering target;
Nozzle position moving means for moving the nozzle in a direction crossing the approaching / separating direction;
Using a soldering apparatus provided with a solder magazine containing a plurality of predetermined amount of solder pieces to be supplied to the nozzle,
Driving the solder position moving means and the approaching / separating direction moving means to bring the nozzle into contact with or close to the soldering portion to be soldered, the solder piece supplied from the solder magazine is heated to the heating means. A soldering method for performing a soldering process in which soldering is performed by heating and melting by means of soldering. A solder piece containing portion for containing a solder piece;
During normal operation, the solder piece is prevented from coming out of the solder piece housing portion, and the solder piece housed in the solder piece housing portion moves in the direction of withdrawal when the solder piece is used. Solder magazine provided with an acceptable solder piece locking release means.

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