JP6366561B2 - Soldering apparatus and soldering method - Google Patents

Description

  The present invention relates to a soldering apparatus and a soldering method for performing soldering on a soldering target by mechanical driving, for example.

  Conventionally, a soldering apparatus for mechanically soldering an electronic component to a printed circuit board has been provided. This soldering device uses a flow soldering method in which a printed circuit board is brought into contact with the solder liquid surface, or a solder paste is preliminarily printed on the circuit board in accordance with a pattern, and the cream solder is heated to be melted. Various methods have been proposed, such as a reflow soldering method in which soldering is performed with a solder.

  Here, the applicant uses a cylindrical soldering iron, inserts the pin of the electronic component inserted into the through hole of the printed circuit board into the soldering iron, melts the solder inside, and solders it. A soldering device has been developed and provided (see Patent Document 1).

  The applicant's soldering apparatus can solder to a soldering point with a cylindrical nozzle, and can also solder a product with high heat transfer in a short time with a heater unit with good heat transfer efficiency. Since there is no bias in heat supply, the defect rate is reduced, and the soldering apparatus that does not scatter conductive foreign matters (solder balls) is very popular with customers such as automobile manufacturers.

Here, in such a soldering apparatus, the position of the nozzle is moved in accordance with the shape or the like of the object to be soldered, the solder is supplied to the nozzle moved to an appropriate soldering position, heated and melted, and soldered. . By performing this operation continuously and smoothly, soldering can be executed in a short time.
However, it has been desired to perform soldering at a higher speed.

JP 2013-120869 A

  An object of this invention is to provide the soldering apparatus and the soldering method which can be soldered at high speed in view of the above-mentioned problem.

The present invention is a soldering apparatus for performing soldering on a soldering target, having a solder passage hole through which the solder passes and contacting or approaching a soldering target site, and heating the nozzle Heating means for melting the solder in the solder passage hole of the nozzle, and a proximity separation direction moving means for moving the nozzle and the head portion provided with the heating means in the proximity separation direction with respect to the soldering target; Nozzle position moving means for moving the nozzle in a direction crossing the approaching / separating direction, a plurality of the nozzle and the heating means are provided in the head portion, and solder pieces are simultaneously applied to the plurality of nozzles. The present invention is characterized by a soldering apparatus provided with a solder piece simultaneous supply means for supplying , and a soldering method using the same.

  According to the present invention, it is possible to provide a soldering apparatus and a soldering method capable of soldering at high speed.

The right view which shows the external appearance structure of a soldering apparatus. The front view which shows the external appearance structure of the head part of a soldering apparatus. The right side sectional view of the structure of a nozzle unit and an XYZ drive system. Explanatory drawing explaining the structure of a solder piece preparation mechanism. The flowchart of the operation | movement which the control part of a soldering apparatus performs. FIG. 5 is an explanatory diagram showing a configuration when the solder magazine of Example 2 is used.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a right side view illustrating the external configuration of the soldering apparatus 1, and FIG. 2 is a front view illustrating the external configuration of the head unit 3 of the soldering apparatus 1.
As shown in FIG. 1, the soldering apparatus 1 includes a through hole (a soldering target) in which a pin 9a (see FIG. 2) of a work jig 9 (a soldering target) such as a printed circuit board to be soldered is provided. The head part 3 having a ceramic material nozzle 25 (soldering iron) to be soldered to the part), the air suspension unit 5 for bringing the head part 3 and the nozzle 25 into a floating state, and the air suspension unit 5 and the nozzle 25 are soldered. A proximity / separation direction moving unit 6 (proximity / separation direction moving means) that moves in a direction to approach / separate the attachment target (the vertical direction in FIG. 1, hereinafter referred to as “Z direction”), and the proximity / separation direction moving unit 6 and the nozzle 25. A transfer direction moving unit for moving the work jig 9 in the transfer direction (the depth direction in FIG. 1, hereinafter referred to as “X direction”). 7 and a transport width direction moving unit 8 for moving the transport direction moving unit 7 and the nozzle 25 in the transport width direction of the transport direction moving unit 7 (left and right direction in FIG. 1, hereinafter referred to as “Y direction”). . The transport direction moving unit 7 and the transport width direction moving unit 8 function as nozzle position moving means for moving in the XY directions.

  As shown in FIG. 2, a plurality of (for example, 10) nozzle units 20 having nozzles 25 are arranged in a line in the X direction at equal intervals, as shown in FIG. A solder piece derivative 60 is provided, and a cut solder piece accommodating cassette 55 is provided on the solder piece derivative 60 so as to be movable in the X direction.

  Above the solder piece derivative 60, a plurality of push rods 13 are arranged on the space where the cut solder piece accommodation cassette 55 moves and enters. The pushing rods 13 are arranged in the same number as the nozzle units 20 so as to be aligned in a line at equal intervals in the same manner as the nozzle units 20 and face the nozzle units 20.

  Further above that, a support frame 12 for fixing all the push rods 13 is provided, and a push drive unit such as a stepping motor for moving the support frame 12 and all the push rods 13 in the Z direction simultaneously above the support frame 12. 11 is provided.

  Further, a cutting upper blade 51 is provided above the cutting solder piece accommodating cassette 55 at a position slightly outside in the X direction from the region where the plurality of nozzle units 20 are present, and the thread solder reel 15 is set above the cutting upper blade 51. ing.

  The thread solder 16 is straightly extended from the thread solder reel 15 to the cutting upper blade 51, and a feed amount detection roller 17 that detects the feed amount of the thread solder 16 at a position below the thread solder reel 15 and a feed amount detection roller 17. And a feed roller 18 that feeds the yarn solder 16 downward.

  The cutting upper blade 51 is in contact with a cutting solder piece housing cassette 55 that also functions as a cutting lower blade and a Z-axis facing surface, and the cutting solder piece housing cassette 55 is in contact with the fixed cutting upper blade 51. By moving in the X direction (or Y direction), it has a function of cutting the thread solder 16 by a predetermined amount to create a solder piece 29.

  FIG. 3 is a right side cross-sectional view showing the configuration of the nozzle unit 20 and the structure of the XYZ drive system of the soldering apparatus 1.

  As shown in FIG. 3, the soldering device 1 is fixed to the transport width direction moving unit 8 (see FIG. 1) and extends straight toward the transport path of the work jig 9 (see FIG. 1). 7f and a conveyance guide 7c that is moved along the conveyance guide 7f by a drive mechanism 7e such as a stepping motor. The drive mechanism 7e and the conveyance guide 7f are accommodated in the conveyance width direction moving unit 8 (see FIG. 1). The conveyance guide 7c extends straight toward the conveyance direction (X direction) of the conveyance path.

  The upper part of the X-direction conveyance guide 7c is composed of a moving body 7a that moves in the X direction along the conveyance guide 7c and a stepping motor that moves the moving body 7a in the X direction along the conveyance guide 7c. A drive mechanism portion 7b is provided. The moving body 7a, the drive mechanism 7b, and the transport guide 7c are housed in the transport direction moving unit 7 (see FIG. 1). The moving body 7a, the drive mechanism unit 7b, the transport guide 7c, the drive mechanism unit 7e, and the transport guide 7f function as a nozzle position moving unit that moves the nozzle 25 to an arbitrary position to be operated.

  The moving body 7a is provided with a Z-direction transport guide 5c extending in a direction in which the nozzle 25 approaches / separates from the through hole. The transport guide 5c is provided with a head fixing portion 5a that moves in the Z direction, and a drive mechanism portion 5b that includes a stepping motor and the like. The head fixing unit 5a, the drive mechanism unit 5b, and the conveyance guide 5c function as a proximity / separation direction moving unit that moves the nozzle 25 in a direction to approach / separate the soldering target, and the proximity / separation direction moving unit 6 (see FIG. 1). ).

  The Y-direction conveyance guide 7f, the X-direction conveyance guide 7c, and the drive mechanism portions 7b and 7e configured as described above function as nozzle position moving means, so that the position of the nozzle 25 is soldered to an arbitrary position. Can be moved. Further, the Z-direction transport guide 5c and the drive mechanism unit 5b function as a proximity / separation direction moving unit, so that the nozzle 25 is moved in the proximity direction at the moved position and soldered into the hole 26 of the nozzle 25. The tip of the nozzle 25 can be brought into contact with the through hole through a terminal (such as a terminal of an electronic component) and separated after soldering.

  The head fixing portion 5a is provided with a floating unit 5d. The floating unit 5d is provided in the air suspension unit 5 (FIG. 1), lifts the nozzle unit 20 with the supplied air, and includes a floating unit 5d (including the nozzle 25) for the work jig 9 (see FIG. 1). The relative weight of is reduced. For example, if the normal weight is 100, the floating unit 5d may have a suitable structure such that the weight is 10%.

  The head unit 3 is fixed to the floating unit 5d, and includes a rod driving unit 11, a push rod 13, a nozzle unit 20, a heater 23, an SSR 23a, and a temperature controller 23b.

  The nozzle unit 20 includes a solder introduction cylinder 22 in the nozzle fixing portion 21, a nozzle 25 connected to the tip end side of the solder introduction cylinder 22, and a cylindrical heater 23 (abutting around the solder introduction cylinder 22 and the nozzle 25). Heating means) and a nozzle holder 24 for fixing the nozzle 25 to the nozzle fixing portion 21.

  The nozzle 25 is a cylindrical nozzle serving as a soldering iron, and includes a hole 25a that penetrates in a straight line at the center. In addition, the nozzle 25 includes a side hole 25b that connects the hole 25a and the outside in the vicinity of the tip portion where soldering is performed. By this side hole 25b, fumes generated in the nozzle 25 can be discharged to the outside.

  On the base side (upper side in the figure) of the nozzle 25, a nozzle holder 24 that wraps around the outer periphery of the nozzle 25 and has a fixing screw groove 24a (female screw) on the inner surface is provided. The nozzle holder 24 is fixed to the nozzle 25 so as not to rotate relative to the nozzle 25 by an appropriate detent. The screw groove 24a of the nozzle holder 24 is screwed and fixed to the screw groove 21a (male screw) of the nozzle fixing portion 21 that also functions as a heater unit. A cylindrical space into which the cylindrical heater 23 is inserted is provided between the inner side of the nozzle holder 24 and the outer side of the nozzle 25. This space is provided from the base of the nozzle 25 to the tip side slightly from the center.

  The nozzle fixing portion 21 is fixed with a cylindrical heater 23 and a cylindrical solder introduction cylinder 22 provided inside the heater 23. The solder introduction cylinder 22 has a tip abutting on the base of the nozzle 25 inserted into the heater 23, and a hole 22 a in the solder introduction cylinder 22 communicates with the hole 25 a of the nozzle 25. As a result, the solder piece 29 supplied from above passes through the hole 22 a and the hole 25 a and is heated and melted by the nozzle 25 heated by the heater 23.

  The heater 23 is connected to an SSR (Solid State Relay) 23a and a temperature controller 23b, and the temperature is adjusted individually. That is, a plurality of heaters 23 (see FIG. 2) are connected to the SSR 23a and the temperature controller 23b, respectively, and temperature adjustment is performed individually so that soldering can be performed at different temperatures for each nozzle unit 20. I have to.

  The nozzle 25 is configured to be attachable to and detachable from the nozzle fixing portion 21 by the nozzle holder 24. However, the nozzle 25 is not limited to this and is configured to be fixed, or for each heater unit including the heater 23. It is possible to adopt an appropriate configuration such as a detachable detachable configuration.

  In order to drive these components, each element of the soldering apparatus 1 is controlled by a control unit (not shown).

  FIG. 4 is an explanatory view for explaining the structure of the solder piece preparation mechanism 50 by the cutting upper blade 51 and the cut solder piece containing cassette 55. FIG. 4 (A) is a front sectional view of the state before cutting, and FIG. ) Shows a front sectional view of the state after cutting.

  The cutting upper blade 51 is fixed to the head portion 3 (see FIG. 1), and one cylindrical shear blade 52 penetrating in the Z direction is provided at the center of the quadrangular columnar body. The shear blade 52 has a hole 53 penetrating in the Z direction inside, and is formed of a hard metal having a lower end on the inner periphery serving as a blade.

  The cut solder piece accommodating cassette 55 has a horizontally long rectangular column shape that is long in the X direction, which is the alignment direction of the nozzle units 20 (see FIG. 2), and is disposed at a position above all the nozzle units 20. The cut solder piece accommodation cassette 55 has the same number of cylindrical shear blades 56 as the nozzle units 20 having holes 57 (solder piece accommodation portions) penetrating in the Z direction so as to face all the nozzle units 20 (see FIG. 2). Only provided at the same interval. The shear blade 56 is formed of a hard metal whose lower end on the inner periphery of the hole 57 serves as a blade. The shearing blade 56 of the cutting solder piece storage cassette 55 and the shearing blade 52 of the upper cutting blade 51 function as thread solder cutting means.

  The cut solder piece accommodating cassette 55 is guided by a guide member (not shown) so as to be slidable in the X direction, and the outer peripheral surface of the roller of the drive mechanism portion 59 (solder piece accommodating portion moving means) is in contact therewith. The drive mechanism 59 is composed of a motor and a roller, and slides and moves the cut solder piece accommodation cassette 55 in contact with the outer peripheral surface in the X direction by rotation.

  A solder piece derivative 60 fixed to the head portion 3 is provided below the cut solder piece containing cassette 55. This solder piece derivative 60 is provided with the same number of holes 63 facing the nozzle unit 20 as the nozzle unit 20 (see FIG. 2), and is provided with a shutter 61 that covers the upper surfaces of all the holes 63. The shutter 61 is slid in the Y direction by a drive mechanism (not shown), and is simultaneously switched between a closed state and a released state.

  The shutter 61 and the plurality of push rods 13 function as solder piece simultaneous supply means for supplying the solder pieces to the nozzles 25 all at once.

  The inner diameter of the hole 63 of the solder piece derivative 60 is the same as or smaller than the inner diameter of the hole 22a in the solder introduction cylinder 22 and the hole 25a of the nozzle 25. As a result, the supplied solder pieces 29 are not caught or clogged in the middle, and stable soldering can be realized.

FIG. 5 is a flowchart showing the operation of the soldering apparatus 1.
The control unit of the soldering apparatus 1 starts temperature adjustment for adjusting the temperature of the heater 23 for each nozzle unit 20 by the SSR 23a and the temperature controller 23b (see FIG. 2) (step S1).

  The control unit of the soldering apparatus 1 moves the head unit 3 to the soldering position on the XY plane by the transport direction moving unit 7 (see FIG. 1) and the transport width direction moving unit 8 (step S2).

  As shown in FIG. 4A, the control unit of the soldering apparatus 1 moves the cut solder piece accommodation cassette 55 to the initial position by the drive mechanism unit 59 (step S3). This initial position is a position at which the hole 57 at the end of the cut solder piece accommodating cassette 55 communicates with the hole 53 of the cutting upper blade 51.

  The control unit of the soldering apparatus 1 feeds the yarn solder 16 by the feed roller 18 until it is detected by the feed amount detection roller 17 (see FIG. 2) that the desired feed amount has been reached (step S4).

  When the desired amount of feed is reached and the thread solder 16 is fed out by the required length, the control unit of the soldering apparatus 1 cuts the thread solder 16 and the next hole 57 of the cut solder piece accommodating cassette 55. Next position setting processing for communicating with the hole 53 of the cutting upper blade 51 is collectively executed (step S5). That is, the time is shortened by collectively performing the operation of cutting the thread solder 16 and the operation of moving the cut solder piece accommodating cassette 55 to the next position.

The control unit of the soldering apparatus 1 returns the processing to step S4 and repeats until the solder pieces 29 are completely loaded in all the holes 57 (step S6: No).
When the solder pieces 29 are completely loaded in all the holes 57 (step S6: Yes), the control unit of the soldering apparatus 1 lowers the header portion 3 in the floating state to make the nozzle 25 into the through hole of the work jig 9. Abut (step S7).

  The control unit of the soldering apparatus 1 drives the shutter 61 to open the shutter 61 (step S8), and pushes and drops the solder piece 29 into the nozzle 25 by the plurality of pushing rods 13 (step S9) to perform soldering. (Step S10).

  The control unit of the soldering apparatus 1 raises the head unit 3 to retract the nozzle unit 20 (step S11), and returns the process to step S1.

  With the above-described configuration and operation, the soldering apparatus 1 can realize stable quantitative spot soldering without defects without the flux being scattered outside the nozzle 25.

  The soldering apparatus 1 stores the solder pieces 29 obtained by cutting the thread solder 16 in the holes 57 of the cut solder piece accommodation cassette 55, and moves the nozzle unit 25 up and down once in the Z-axis direction. Simultaneous soldering at a plurality of locations can be realized by using the solder pieces 29 simultaneously.

  At this time, since the number of up / down movements of the nozzle unit 25 may be less than the number of soldering locations, the entire soldering process can be speeded up. That is, if it is necessary to move the nozzle unit 25 up and down by the number of soldering points, it takes time, but the number of vertical movements of the nozzle unit 25 is smaller than the number of soldering points (for example, the nozzle unit 25 is 10 Since the number of vertical movements is 1/10 times the normal number, it can be completed at a higher speed.

  Further, since the SSR 23a and the temperature controller 23b are provided for each heater 23, the temperature of the heater 23 in the nozzle unit 20 and the other heaters 23 can be made different. As a result, it is possible to simultaneously solder the soldering objects having different soldering conditions at the same time.

  Also, by making the operation of creating the solder piece 29 from the thread solder 16 independent of the soldering operation, the solder piece 29 can be produced at high speed.

  In addition, the cutting direction of the solder piece 29 from the thread solder 16, the moving direction of the cutting solder piece accommodating cassette 55, and the alignment direction of the push rod 13 are all matched, so that the solder piece 29 is cut and cut. The movement of the solder piece accommodating cassette 55 can be performed without loss, and soldering can be executed as soon as the cutting of the solder piece 29 is completed.

  Next, in the soldering apparatus 1 described in the first embodiment, the yarn solder reel 15, the feed amount detection roller 17, the feed roller 18, the cutting upper blade 51, and the cutting solder piece storage cassette 55 shown in FIG. Instead, the soldering apparatus 1 according to the second embodiment having the solder magazine 40 will be described.

  6A and 6B are explanatory diagrams for explaining the solder magazine 40, in which FIG. 6A shows a plan view and FIG. 6B shows a front view.

As shown in FIG. 6A, the solder magazine 40 is entirely formed of a resin material in a substantially rectangular plate shape, and a plurality of solder piece receiving holes 43 penetrating in the Z direction are equally spaced in the XY direction. They are arranged side by side. Each solder piece accommodation hole 43 accommodates a cylindrical solder piece 29 in which thread solder having a predetermined outer diameter (for example, φ0.5 to 1.6 mm) is cut to a predetermined length (for example, 2 mm to 15 mm). Yes. This accommodation is in a form in which one solder piece 29 is accommodated in one solder piece accommodation hole 43. More than 5,000 solder piece accommodation holes 43 and solder pieces 29 are arranged in one plane (XY plane) for one solder magazine 40.
As shown in FIG. 6B, the bottom surface of the solder magazine 40 is covered with a support sheet 45 (solder piece locking / releasing means) that prevents the solder pieces 29 from falling naturally from below the solder piece accommodation holes 43. . As a result, the solder piece 29 does not fall naturally, but when the solder piece 29 is pressed downward by the push rod 13 from above, a hole is formed in the support sheet 45 by the pressing force, and the solder piece 29 is moved downward. Extruded. The push rod 13 is inserted into the solder piece accommodation hole 43 from above the solder piece accommodation hole 43 and protrudes to a position where the push rod 13 penetrates below the solder piece accommodation hole 43. Thereby, the extrusion of the solder piece 29 is ensured.

  Instead of covering the bottom surface of the solder magazine 40 with the support sheet 45, a drop prevention protrusion for preventing the solder piece 29 from falling off may be provided at the lower end of the solder piece accommodation hole 43. In this case, unlike the breakage of the support sheet 45, the fall prevention protrusion is deformed and the solder piece 29 can be fed out, so that the machine stop due to the broken piece or the like can be prevented. In addition, the solder pieces 29 can be reloaded into the used solder magazine 40 and reused.

  As shown in FIG. 6A, the magazine loading unit 30 is fixed in the moving station 32 and is long in the X direction to guide the movement of the transport chuck 36 in the X direction, and on the X direction guide 33. And a Y-direction guide 34 that is long in the Y-direction, and a conveyance chuck 36 that is provided on the Y-direction guide 34 and on which the solder magazine 40 is mounted.

  The Y-direction guide 34 includes an X-direction drive motor (not shown) that executes movement of the Y-direction guide 34 in the X direction by a rotation operation on the X-direction guide 33. A Y-direction drive motor (not shown) that moves the conveyance chuck 36 in the Y-direction by rotating on the Y-axis 34 is provided.

  The conveyance chuck 36 is configured to support two adjacent sides of the solder magazine 30 having a square shape in plan view from the side. The transport chuck 36 is provided with a vertically movable claw 35 that supports the side of the solder magazine 30 that faces one of the sides in the opposite direction from the side. The vertically movable claw 35 enables the mounting / removal of the solder magazine 30 in a state where it is moved upward to the height of the solder magazine 30 or more, and the vertically movable claw 35 is moved downward in a state where the solder magazine 30 is mounted. Then, the side surface of the solder magazine 30 is sandwiched between the transfer chuck 36 and the vertically movable claw 35. As a result, mounting / removal of the solder magazine 30 is allowed, and the mounted solder magazine 30 is fixed so as not to be displaced during movement.

  With this configuration, the magazine loading unit 30 enables the loading of the solder magazine 30 and the loading and moving of the solder magazine 30 in the XY directions to sequentially feed out the solder pieces 29.

The magazine loading unit 30 includes a moving stage 32 (magazine moving means) that moves the solder magazine 40 in the XY directions (front and rear, left and right in FIG. 1), and a solder piece 29 on the upper surface of the solder magazine 40 at a position above the moving stage 32. A cover 31 is provided so as not to be pulled out. The cover 31 is sized (wide) so as to cover the entire range in which the solder magazine 40 can move relative to the nozzle 25, and when the push rod 13 protrudes toward the nozzle 25, A through hole 31a that allows passage is provided. The gap between the facing surfaces of the cover 31 and the solder magazine 40 is set to have no gap or less than the thickness of the solder piece 29.
The magazine loading unit 30 and the solder magazine 40 are provided in place of the solder piece derivative 60 at the position of the solder piece derivative 60 of the first embodiment.

  Since other configurations and operations are the same as those in the first embodiment, description of the same elements is omitted.

  With the above configuration, the solder pieces 29 can be collectively supplied to the nozzle 25 from the solder magazine 40. Therefore, the soldering process can be executed at higher speed.

  Further, in this case, since the cutting upper blade 51, the cut solder piece storage cassette 55, the thread solder reel 15, the feed amount detection roller 17, and the feed roller 18 can be omitted from the head portion 3, the weight of the head portion 3 can be reduced. Can do. Thereby, the weight of the unit which should be made into a floating state can be suppressed.

  In addition, this invention is not restricted to embodiment mentioned above, It can be set as other various embodiment.

  For example, instead of covering the bottom surface of the solder magazine 40 with the support sheet 45, a drop prevention protrusion for preventing the solder piece 29 from falling off may be provided at the lower end of the solder piece accommodation hole 43. In this case, unlike the breakage of the support sheet 45, the fall prevention protrusion is deformed and the solder piece 29 can be fed out, so that the machine stop due to the broken piece or the like can be prevented. In addition, the solder pieces 29 can be reloaded into the used solder magazine 40 and reused.

  Further, the SSR 23a and the temperature controller 23b are provided in all the nozzle units 20. However, the present invention is not limited to this, and a part of the SSR 23a and the temperature controller 23b may be provided in common for a plurality of nozzle units 20. . In this case, the nozzle unit 20 that has only to be adjusted to the same temperature is temperature-adjusted by one SSR 23a and the temperature adjuster 23b, and the nozzle unit 20 that is adjusted to a temperature different from this is adjusted by the individual SSR 23a and the temperature adjuster 23b. can do. Thereby, weight reduction and cost reduction can be achieved.

  The present invention can be used in industries that perform soldering in production facilities.

DESCRIPTION OF SYMBOLS 1 ... Soldering device 6 ... Proximity separation direction moving unit 7 ... Conveyance direction moving unit 8 ... Conveyance width direction moving unit 9 ... Work jig 13 ... Push rod 23 ... Heater 25 ... Nozzle 25a ... Hole 29 ... Solder piece 30 ... Magazine Loading section 40 ... solder magazine 52, 56 ... shear blade 57 ... hole 61 ... shutter

Claims (6)

A soldering apparatus for performing soldering on a soldering target,
A nozzle that has a solder passage hole through which solder passes and is in contact with or close to the soldering target site;
Heating means for heating the nozzle to melt the solder in the solder passage hole of the nozzle;
Proximity / separation direction moving means for moving a head portion provided with the nozzle and the heating means in the proximity / separation direction with respect to the soldering target;
Nozzle position moving means for moving the nozzle in a direction crossing the approaching / separating direction,
The head portion is provided with a plurality of the nozzles and the heating means ,
A soldering apparatus comprising solder piece simultaneous supply means for simultaneously supplying solder pieces to the plurality of nozzles . Thread solder cutting means for cutting thread solder by a predetermined amount;
A solder piece storage section for storing the supplied solder pieces at the same intervals as the arrangement intervals of the nozzles;
Soldering apparatus of the solder piece accommodating portion moved to the solder piece accommodating portion moving means and according to claim 1, further comprising from said yarn solder cutting means to the corresponding position of the nozzle. The soldering apparatus according to claim 1, further comprising a solder magazine setting portion for setting a solder magazine accommodate a plurality of solder pieces. A soldering apparatus for performing soldering on a soldering target,
A nozzle that has a solder passage hole through which solder passes and is in contact with or close to the soldering target site;
Heating means for heating the nozzle to melt the solder in the solder passage hole of the nozzle;
Proximity / separation direction moving means for moving the nozzle in the proximity / separation direction with respect to the soldering target;
Nozzle position moving means for moving the nozzle in a direction crossing the approaching / separating direction,
A soldering apparatus, comprising: solder piece simultaneous supply means for simultaneously supplying the solder pieces to the plurality of solder passage holes .   Thread solder cutting means for cutting thread solder by a predetermined amount;
A solder piece storage section for storing the supplied solder pieces at the same intervals as the arrangement intervals of the plurality of solder passage holes;
Solder piece accommodating portion moving means for moving the solder piece accommodating portion from the thread solder cutting means to a corresponding position of the solder passage hole.
The soldering apparatus according to claim 4. A nozzle that has a solder passage hole through which solder passes and is in contact with or close to the soldering target site;
Heating means for heating the nozzle to melt the solder in the solder passage hole of the nozzle;
Proximity / separation direction moving means for moving a head portion provided with the nozzle and the heating means in the proximity / separation direction with respect to the soldering target;
Nozzle position moving means for moving the nozzle in a direction crossing the approaching / separating direction,
Using a soldering apparatus in which a plurality of the nozzles and the heating means are provided in the head part,
The nozzle position moving means and the approaching / separating direction moving means are driven and controlled, and the nozzles are supplied from a plurality of the nozzles in a state where the nozzles are in contact with or close to the soldering parts to be soldered, respectively. A soldering method for executing a soldering process in which a solder piece is heated and melted by the heating means and soldered.

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