JP2013191675A - Automatic soldering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an automatic soldering device that can automatically solder even a microcomponent with a suitable (minute) amount of solder, and obtain a suitable fillet shape.SOLUTION: An automatic soldering device 10 using a vertical multi-articulated robot 13 including an arm having a soldering iron 11 and a thread solder feeder 12 installed at a tip includes a contact mechanism control section which controls movements of the vertical multi-articulated robot 13 so as to move (rotate) the soldering iron 11 installed at the tip of the arm in contact with a component or a land when soldering the component and the land with the soldering iron 11, and positively brings solder staying on a surface of the soldering iron 11 into contact with the component and the land. Consequently, soldering is completed with a small suitable (minute) amount of solder even by automatic soldering of the microcomponent, and an ideal and suitable fillet shape can be obtained.

Description

  The present invention relates to an automatic soldering apparatus that automatically solders various electronic components to a printed wiring board or the like using a robot.

Generally, in the automatic soldering apparatus, the relative position between the soldering iron and the solder wire during soldering is constant. When the soldering iron is used for a while, it becomes difficult for the solder to spread due to oxidation or the like, and the molten solder accumulates on the spot (see FIG. 1A), and therefore does not flow to the parts or lands.
Therefore, in order to wet and spread the solder on the parts and lands, it is necessary to supply a large amount of thread solder so that the solder collected on the surface of the soldering iron can come into contact with the parts and lands (see FIG. 1B).

However, in this case, the external appearance of soldering (hereinafter referred to as “fillet shape”) is a sharp shape (see FIG. 2), which is far from the ideal shape (see FIG. 3). Internal defects may be overlooked.
Therefore, in the automatic soldering of fine parts, a yarn solder automatic supply method has been developed in which the supply amount of the thread solder is fed with high accuracy for the purpose of supplying an appropriate amount (a small amount) of the thread solder. (See Patent Document 1)

JP 2008-142769 A

  However, for example, even if a conventional method of supplying solder solder as in Patent Document 1 is used, it is difficult to control the flow of molten solder, and as a result, it is difficult to stabilize the amount of solder remaining in the component. There was a problem.

  The present invention has been made to solve the above-described problems, and even in automatic soldering of fine parts, soldering can be performed with an appropriate amount (a small amount) of solder, and an appropriate fillet shape can be obtained. An object of the present invention is to provide an automatic soldering apparatus that can be obtained.

  In order to achieve the above object, the present invention provides an automatic soldering apparatus using a vertical articulated robot having an arm having a soldering iron and a thread solder feeding device installed at the tip, and soldering parts and lands with the soldering iron. And a contact mechanism control unit for controlling the movement of the vertical articulated robot so as to move the soldering iron installed at the tip of the arm while being in contact with the component and the land. To do.

  According to the present invention, by controlling the movement of the contact mechanism (vertical articulated robot) so as to move the soldering iron while being in contact with the component and the land, the solder accumulated on the surface of the soldering iron is actively removed. In addition, since it is in contact with the land, it is possible to perform soldering with a small amount (small amount) of solder even in automatic soldering of fine parts, and an ideal and appropriate fillet shape can be obtained.

In the conventional automatic soldering apparatus, when soldering to a component and a land with a soldering iron, it is the schematic which shows the relationship between soldering iron, thread solder, and solder. It is the figure which looked at the fillet shape which rose when a lot of thread solder was supplied and soldered from the side. It is the figure which looked at the ideal fillet shape by an appropriate amount of solder from the side. In the automatic soldering apparatus of Embodiment 1, it is an example of the schematic diagram which shows the relationship between soldering iron, thread solder, and solder when soldering to a component and a land with a soldering iron. 1 is a schematic external view illustrating a configuration of an automatic soldering apparatus according to Embodiment 1. FIG. 2 is a functional block diagram showing an internal configuration of the automatic soldering apparatus according to Embodiment 1. FIG. FIG. 5 is another example of a schematic diagram showing the relationship between soldering iron, thread solder, and solder when soldering a component and a land with a soldering iron in the automatic soldering apparatus of the first embodiment. It is a figure which shows the front-end | tip part of a general soldering iron. FIG. 10 is a diagram showing a tip portion of a soldering iron in a second embodiment. It is a figure which shows an example of the apparatus which positions a soldering iron. It is a figure which shows the example of the shape of the front-end | tip shape of a soldering iron, and a front-end | tip alignment jig. It is a figure which shows another example of the apparatus which positions a soldering iron.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
Embodiment 1 FIG.
FIG. 1 is a schematic diagram showing the relationship between soldering iron, thread solder, and solder when soldering parts and lands with a soldering iron in a conventional automatic soldering apparatus. FIG. 1A shows a state in which the soldering iron 1 becomes difficult to wet and spread due to oxidation or the like, and the molten solder 5 does not wet and spread on the surface of the soldering iron 1 and accumulates on the spot. . FIG. 1B shows a large amount of thread solder so that the solder 5 accumulated as shown in FIG. 1A can come into contact with the component 3 and the land 4 in order to wet and spread the solder 5 on the component 3 and the land 4. 2 shows a state in which 2 is supplied.

FIG. 2 is a side view of the fillet shape when a large amount of thread solder 2 is supplied and soldered as shown in FIG. In the conventional automatic soldering apparatus, a large amount of solder 5 is gradually accumulated on the surface of the soldering iron 1 and soldering is performed after waiting for contact with the component 3 and the land 4. As shown in the figure, it was a fillet shape.
If such a fillet shape is formed, it is difficult to determine whether or not the soldering is normally performed from the appearance, and there is a possibility that an internal defect or the like may be overlooked.
As an ideal fillet shape, as shown in FIG. 3, it is a shape in which the base of an appropriate amount (a small amount) of solder 5 is widened.

  FIG. 4 is an example of a schematic diagram showing the relationship between soldering iron, thread solder, and solder when soldering a component and a land with a soldering iron in the automatic soldering apparatus according to Embodiment 1 of the present invention. In FIG. 4A, as in FIG. 1A, the soldering iron 11 is oxidized and the solder 5 is difficult to wet and spread, and the molten solder 5 does not spread on the surface of the soldering iron 11 and collects on the spot. It shows the state that is. It should be noted that the amount of solder 5 shown in FIG. 4A is an appropriate amount (a small amount) that is even smaller than the amount of solder 5 shown in FIG.

  FIG. 4B shows the soldering iron 11 with the soldering iron 11 in contact with the component 3 and the land 4 from the state of FIG. 4A in order to wet and spread the solder 5 on the component 3 and the land 4. It is a figure which shows the state which is performing the operation | movement which rotates the soldering iron 11 centering | focusing on the center axis | shaft of the soldering iron 11, so that the solder pool of the surface contacts the component 3 and the land 4. In this way, as a result of rotating the soldering iron 11 while being in contact with the component 3 and the land 4, the solder 5 remaining on the soldering iron 11 is brought into contact with the component 3 and the land 4 to be spread. be able to.

Here, a mechanism for rotating the soldering iron 11 will be described.
FIG. 5 is a schematic external view showing the configuration of the automatic soldering apparatus according to Embodiment 1 of the present invention. FIG. 5 (a) is a side view, FIG. 5 (b) is a front view, and FIG. It is a principal part enlarged view of FIG.5 (b).
The automatic soldering apparatus 10 includes a soldering iron 11, a thread solder feeder 12, and a contact mechanism 13. The contact mechanism 13 is a six-axis vertical articulated robot, and a soldering iron 11 is installed at the tip of the arm. Specifically, the soldering iron 11 is fixed to a mounting plate 14 attached to the tip of an arm of a contact mechanism (vertically articulated robot) 13, and the thread solder feeder 12 is also fixed to the same mounting plate 14. Has been.

FIG. 6 is a functional block diagram showing the internal configuration of the automatic soldering apparatus according to Embodiment 1 of the present invention.
The automatic soldering apparatus 10 includes a control unit 20 therein. The control unit 20 moves the soldering iron temperature control unit 21 that controls the temperature of the soldering iron 11, the yarn solder feeding control unit 22 that controls the amount of yarn solder supplied from the yarn solder feeding device 12, and the soldering iron 11. A contact mechanism control unit 23 that controls the movement of the contact mechanism (vertically articulated robot) 13 is provided.

Then, the contact mechanism control unit 23 controls the contact mechanism (vertically articulated robot) 13 to rotate the soldering iron 11 while being in contact with the component 3 and the land 4. The parts 3 and the lands 4 are forcibly brought into contact with each other and spread.
As a result, even in automatic soldering of fine parts, soldering can be performed with an appropriate amount (a small amount) of solder 5, so that an ideal and appropriate fillet shape as shown in FIG. 3 can be obtained.

  The mounting plate 14 on which the soldering iron 11 is installed is provided with a spring (not shown), and the soldering iron 11 is held while maintaining the contact state between the soldering iron 11 and the component 3 and the land 4 by this spring. The contact mechanism (vertically articulated robot) 13 is controlled to rotate.

In addition, the case where the contact mechanism control unit 23 rotates the soldering iron 11 as an example of moving the soldering iron 11 while being in contact with the component 3 and the land 4 has been described so far. Any movement that can bring the molten solder 5 into contact with the component 3 and the land 4 is not limited to rotational movement.
FIG. 7 is another example of a schematic diagram showing the relationship between soldering iron, thread solder, and solder when soldering parts and lands with a soldering iron in the automatic soldering apparatus according to Embodiment 1 of the present invention. is there.

  FIG. 7A shows a state where the solder 5 does not spread to the end when the position of the soldering iron 11 is fixed because the amount of solder to be supplied is very small. 7B shows the soldering iron 11 along the component 3 and the land 4 while keeping the soldering iron 11 in contact with the component 3 and the land 4 in order to wet and spread the solder 5 on the component 3 and the land 4. It is a figure which shows the state which is carrying out the linear motion.

  Conventionally, the supply amount of thread solder was increased so that the solder 5 was sufficiently wet and spread on the component 3 and the land 4, so that the proper fillet shape was not obtained. However, as shown in FIG. As a result of the linear movement while being in contact with the component 3 and the land 4, the solder 5 that has accumulated on the soldering iron 11 can be brought into contact with the component 3 and the land 4 and spread. The amount of the solder 5 shown in FIG. 7A is an appropriate amount (a small amount) that is even smaller than the amount of the solder 5 shown in FIG.

As a means for moving the soldering iron 11 in contact with the component 3 and the land 4 by the contact mechanism control unit 23, control for rotating the soldering iron 11 as shown in FIGS. 4 and 5, and as shown in FIG. In combination with the control for causing the soldering iron 11 to move linearly, it is possible to firmly spread the solder 5 to the end of the component 3 and the land 4 to the end and to spread the solder 5 with a small amount (small amount) of the solder 5. .
That is, the soldering iron 11 may be moved by adopting a suitable one depending on the shape of the component 3 and the land 4 such as rotation, straight line, rotation and straight line.

  As described above, according to the first embodiment of the present invention, by controlling the movement of the contact mechanism (vertically articulated robot) so as to move the soldering iron while being in contact with the parts and the land, Since the solder accumulated on the surface is positively brought into contact with the component and the land, even in the automatic soldering of the fine component, the soldering can be performed with a small appropriate amount (a small amount) of solder, as shown in FIG. An ideal and proper fillet shape can be obtained.

Embodiment 2. FIG.
The automatic soldering apparatus according to the second embodiment is substantially the same as the automatic soldering apparatus 10 according to the first embodiment shown in FIGS. 5 and 6, but the solder plating range of the tip portion of the soldering iron is as follows. This is different from the first embodiment. In addition, the same code | symbol is attached | subjected to the structure similar to what was demonstrated in Embodiment 1, and the overlapping description is abbreviate | omitted.
FIG. 8 is a diagram showing a tip portion of a general soldering iron also used in the first embodiment, and FIG. 9 is a diagram showing a tip portion of the soldering iron in the second embodiment of the present invention. .

FIG. 8A and FIG. 9A show the solder plating ranges of the respective soldering irons. The hatched portion 11a of the soldering iron 11 shown in FIG. 8A indicates a general solder plating range, and the tip portion of the soldering iron 11 is plated over the entire circumference. And the solder 5 gets wet in this solder plating range 11a.
On the other hand, the hatched portion 31a of the soldering iron 31 shown in FIG. 9A indicates the solder plating range in the second embodiment of the present invention, and the tip portion of the soldering iron 31 is plated only half a circle. Compared with the soldering iron 11 shown in FIG. 8, the soldering iron 31 has a smaller area where the solder 5 gets wet.

FIG. 8B and FIG. 9B show a state in which the same amount of solder is supplied to each soldering iron. Comparing FIG. 8B and FIG. 9B, in FIG. 9B, the solder plating range 31a is narrowed, so that the amount of solder protruding from the surface of the soldering iron increases even with the same amount of solder. You can see that As a result, according to the soldering iron 31 shown in FIG. 9, the molten solder 5 is more easily brought into contact with the component 3 and the land 4.

  In this way, the tip portion of the soldering iron 31 is plated only half a cycle to narrow the solder plating range 31a, so that when the molten solder 5 accumulates on the surface of the soldering iron 31, the solder plating range 31a is always in the portion. Will stay. As a result, when the soldering iron is moved (rotated, linearly moved, etc.) while being in contact with the component 3 and the land 4 as shown in the first embodiment, the solder plating range 31a portion faces the component 3 and the land 4. By controlling in this way, it is possible to perform soldering with a smaller amount (small amount) of solder 5.

At this time, the positioning of the soldering iron 31 greatly affects the quality.
Normally, for example, when the contact position of the soldering iron 31 with respect to the component 3 and the land 4 varies, the component 3 and the land 4 cannot be heated sufficiently, leading to defects such as the solder 5 not flowing into the component 3 and the land 4. Further, if the position of the soldering iron 31 relative to the solder supply position when supplying the thread solder 2 from the thread solder feeding device 12 varies, the flow of the melted solder 5 changes, and the solder 5 flows to the component 3 and the land 4. Phenomenon that does not come. In addition, when the soldering iron 31 is used repeatedly, it is necessary to periodically replace the soldering iron 31 with a new one due to deterioration of the surface oxidation or copper erosion, etc. Therefore, the quality of the soldering iron 31 deteriorates before and after replacement due to variations in the shape of each soldering iron. Problem arises.

Therefore, in order to eliminate the variation in the contact position between the soldering iron 31 and the component 3 and the land 4 and the variation in the soldering iron 31 and the solder supply position, the automatic soldering apparatus according to the second embodiment is similar to that shown in FIG. Further, the soldering iron 31 attached to the tip of the arm of the contact mechanism (vertical articulated robot) 13 is positioned using a soldering iron fixing jig 40 and a tip alignment jig 50 as shown in FIG. Assumed to be performed.
FIG. 10A is a cross-sectional view taken along a plane that passes through the central axis of the soldering iron 31 and is perpendicular to the mounting plate 14, and FIG. 10B is a cross-sectional view taken along line A- in FIG. It is A sectional drawing.

  The soldering iron fixing jig 40 has a structure in which the soldering iron 31 is sandwiched between two hemispherical holding tools 41 as shown in FIG. It is. When the position of the soldering iron 31 is determined by abutting the tip of the soldering iron 31, the fixing screw 43 is completely fixed. At this time, since the holder 41 has a hemispherical shape (spherical surface), there is a degree of freedom in the rotational directions around the X, Y, and Z until it is completely fixed by the fixing screw 43, and the tip of the soldering iron 31 is free. It is possible to make fine adjustments in any direction. And in this state, it is possible to eliminate the variation in the tip position of the soldering iron 31 by fixing the soldering iron 31 after it is abutted against the tip alignment jig 50 and positioned.

Here, the shape of the tip alignment jig 50 needs to be optimized depending on the shape of the tip of the soldering iron 31.
For example, as shown in FIG. 11 (a), when the tip of the soldering iron 31 is tapered and spherical, there is no need to worry about the orientation, and therefore the tip alignment jig 50a provided with the round hole 51a. However, as shown in FIG. 11 (b), the tip is tapered and chamfered (hereinafter referred to as “D shape”). In this case, since it is necessary to adjust the rotation direction, the tip alignment jig 50b provided with the square hole 51b is used, and the tip of the soldering iron 31 is brought into contact with the square hole 51b to align the position. There is a need.

At this time, as shown in FIG. 9, since the soldering iron 31 has a solder plating range 31a in which the tip portion is plated only half a circle, it is also considered which side the solder plating range 31a faces. By performing positioning, soldering can be performed with a high quality and a smaller appropriate amount (a small amount) of solder 5.
In addition to the tip alignment jig 50 shown in FIGS. 10 and 11, as a method for positioning the soldering iron 31, a method using a camera image as shown in FIG.

FIG. 12A is a view in which a transparent plate 60 is provided instead of the tip alignment jig 50 in FIG. 10A and a camera 70 for photographing the tip of the soldering iron 31 from the front through the transparent plate 60 is installed.
In this method, the tip of the soldering iron is abutted against a transparent plate 60 such as glass to determine the position in the length direction, and then the camera 70 is viewed through the transparent plate 60 and the camera image is viewed on the two-dimensional plane of the soldering iron tip. Perform alignment.

FIG. 12B is a diagram illustrating an example of a camera image captured by the camera 70. For example, when the shape of the tip of the soldering iron is a D shape, the camera image 71 displays a square guide display 72 in which the range where the tip of the soldering iron is to be positioned is indicated by a broken line. While viewing this camera image 71, positioning may be performed so that the tip of the soldering iron 31 overlaps the guide display 72.
This eliminates the need to prepare a tip alignment jig for each tip shape in a work site where a large number of soldering irons 31 having different tip shapes are used, and only changes the guide display according to the type of tip shape. Positioning can be performed.

  Thus, for example, in a work site where the types of soldering iron tips are fixed, the method using the tip alignment jig 50 shown in FIGS. 10 and 11 is suitable, and a plurality of types of soldering irons are used. In a work site to be used, the method using the camera image shown in FIG. 12 is suitable. That is, the soldering iron positioning method may be any method as long as accurate positioning can be performed, and may be appropriately selected by those skilled in the art depending on the application.

  In any of these methods, the soldering iron is completely fixed by the above-mentioned soldering iron fixing jig 40 in a state where the soldering iron is positioned, for example, the soldering iron can be replaced with a new one. Even if it is replaced with a soldering iron of this kind, it is possible to eliminate variations in the tip position, so that the quality of soldering can be kept good, and an ideal and appropriate fillet shape as shown in FIG. Can be obtained.

  As described above, according to the second embodiment of the present invention, by controlling the movement of the contact mechanism (vertical articulated robot) so as to move the soldering iron while being in contact with the parts and the land, When the solder accumulated on the surface is positively brought into contact with the parts and lands, only the half circumference of the tip of the soldering iron is plated to halve the area where the solder accumulates on the surface of the soldering iron. In addition to the same effect as 1, soldering can be performed with a smaller appropriate amount (a small amount) of solder, and an ideal and appropriate fillet shape as shown in FIG. 3 can be obtained more easily.

  Also, when positioning the soldering iron installed at the tip of the arm of the contact mechanism (vertical articulated robot), two hemispherical holding tools that sandwich the soldering iron and the soldering iron are fixed together with the holding tools. Since a soldering iron fixing jig equipped with a fixing part and a fixing screw that completely fixes the tip of the soldering iron is determined, for example, the soldering iron is replaced with a new one or a different type of soldering iron is used. Even if it is replaced, it is possible to eliminate variations in the tip position of the soldering iron, so that the quality of soldering can be maintained well, and an ideal and appropriate fillet shape as shown in FIG. 3 can be obtained. Can do.

  In the present invention, within the scope of the invention, any combination of the embodiments, or any modification of any component in each embodiment, or omission of any component in each embodiment is possible. .

DESCRIPTION OF SYMBOLS 1,11,31 Soldering iron 2 Yarn solder 3 Parts 4 Land 5 Solder 10 Automatic soldering apparatus 11a, 31a Solder plating range of soldering iron (11, 31) 12 Yarn solder feeding apparatus 13 Contact mechanism (vertically articulated robot)
DESCRIPTION OF SYMBOLS 14 Mounting plate 20 Control part 21 Soldering iron temperature control part 22 Yarn solder feed control part 23 Contact mechanism control part 40 Soldering iron fixing jig 41 Holder 42 Fixing part 43 Fixing screw 50, 50a, 50b Tip alignment jig 51a, 51b Hole provided in the tip alignment jig 60 Transparent plate 70 Camera 71 Camera image 72 Guide display

Claims (5)

In an automatic soldering device by a vertical articulated robot equipped with an arm with a soldering iron and a thread solder feeding device at the tip,
When soldering a component and a land with the soldering iron, the movement of the vertical articulated robot is controlled so that the soldering iron installed at the tip of the arm is moved in contact with the component and the land. An automatic soldering apparatus comprising a contact mechanism control unit. The automatic soldering apparatus according to claim 1, wherein the contact mechanism control unit controls the movement of the vertical articulated robot so as to rotate the soldering iron about a central axis of the soldering iron. 3. The automatic soldering according to claim 1, wherein the contact mechanism control unit controls movement of the vertical articulated robot so that the soldering iron moves linearly along the component and the land. 4. apparatus. The automatic soldering apparatus according to any one of claims 1 to 3, wherein the soldering iron has a tip part plated only half a circle. When positioning the soldering iron installed at the tip of the arm,
Solder iron fixing comprising two hemispherical holders for sandwiching the soldering iron, a fixing part for fixing the soldering iron together with the holder, and a fixing screw for fixing the soldering iron once the position of the soldering iron is determined The automatic soldering apparatus according to claim 1, wherein a jig is used.

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