JP2017185530A - Solder processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solder processing apparatus which performs soldering while selecting a plurality of units having different setting and shape of soldering iron tip in accordance with conditions of soldering and a component to be soldered and can maintain productivity of a soldering process satisfactorily.SOLUTION: A solder processing apparatus includes: a plurality of soldering iron parts which supply solder, melt solder by means of heater and perform soldering for a substrate; and a driving mechanism which selects at least one of the plurality of soldering iron parts, arranges the soldering iron part on a position capable of soldering and, at the same time, arranges other soldering iron parts on stand-by positions. Therein, the plurality of soldering iron parts differentiate shapes or soldering conditions, perform melting processing which melts solder supplied while switching the soldering iron part via the driving mechanism and perform soldering by means of the soldering iron of the shape which is automatically appropriate in accordance with the component to be soldered.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a solder processing apparatus including a solder ridge for soldering a circuit board.

  In recent years, electronic circuits on which electronic components are mounted are mounted on various devices. In the formation process of the electronic circuit, soldering using a soldering iron is performed for the process of joining the lead wire to the wiring pattern (land) on the substrate. In addition, in order to mechanically realize such a soldering process, a solder processing apparatus including a robot for controlling the position of the solder ridge is used.

  There are a wide variety of electronic components that are soldered using a soldering iron, such as motor terminals, sensor terminals, and connector terminals, and there are circuit boards in which these terminals and minute electronic components are mixed. In order to perform appropriate soldering on these shaped parts, it is necessary to set soldering conditions such as the shape of a soldering iron suitable for the parts. For this reason, when soldering a circuit board in which components of various shapes are mixed, the soldering iron is manually replaced in accordance with the soldering location.

Japanese Patent Laying-Open No. 2015-166096 JP 2001-176636 A

However, in the above replacement method, considering the time required for replacement and the time for heating the solder iron after replacement, a lot of time is required for soldering, and the tact time of the production line is delayed. In addition, it is conceivable that a plurality of robots are provided and a soldering iron is mounted on each robot.
An object of the present invention is to quickly replace a soldering iron and shorten the time for heating the soldering iron to an appropriate temperature, thereby shortening the soldering time of the entire circuit board.

  The solder processing apparatus of the present invention is capable of soldering by selecting a plurality of solder flanges for supplying solder, melting the solder with a heater, and soldering to the substrate, and at least one of the plurality of solder flanges It has a drive mechanism that is placed at a position and placed at a position to wait for another solder hook, and a plurality of solder hooks have different shapes or soldering setting conditions, and the solder hook is switched via the drive mechanism. A melting process is performed to melt the supplied solder.

  As a specific configuration of the above configuration, at least one of the solder flanges has a different outer diameter of the soldering tip, and switches the solder flange depending on the shape of the soldering portion.

In addition, as a specific configuration of the above configuration, at least one of the solder flanges has a shape that press-contacts a terminal provided on the substrate, and performs soldering while pressing the terminal.
Further, as a specific configuration of the above configuration, at least one of the solder rod portions causes the solder to flow out in the side surface direction of the solder rod and performs soldering in the side surface direction.

Further, as a specific configuration of the above configuration, at least one of the solder rivets is to solder a board or a component having a large heat capacity so that the heat capacity of the solder rivet tip is different.
Further, as a specific configuration of the above-described configuration, at least one of the solder flanges varies the amount of solder to be melted, and performs soldering by changing the amount of solder according to the component to be soldered.

Further, as a specific configuration of the above configuration, at least one of the solder flanges is to perform soldering by changing the diameter of the solder while changing the size of the solder supply hole through which the solder passes.
Further, as a specific configuration of the above configuration, at least one of the solder flanges is to perform soldering by changing the length of solder to be supplied, that is, the amount of solder, and changing the length of the solder.

  In addition, as a specific configuration of the above configuration, at least one of the solder iron portions is changed in the solder iron temperature depending on the type of solder, the board to be soldered, and the parts by changing the heating setting temperature of the iron tip. Soldering is performed.

  Further, the solder processing apparatus of the present invention includes a plurality of solder units in which the solder flange, the solder feeding mechanism, and the cutter unit are integrally installed, and at least one of the plurality of solder units is selected and disposed at a position where soldering is possible. And a drive mechanism for placing other solder units in a standby position, and a plurality of solder flanges have different shapes or soldering setting conditions, and the supplied solder is switched by switching the solder units via the drive mechanism. A melting process for melting is performed.

According to the solder processing apparatus of the present invention, by automatically and sequentially exchanging the solder saddle portion, the soldering quality can be improved by appropriately setting the saddle shape and the saddle setting condition even for the circuit boards having different component sizes and shapes. In addition to shortening the time of the soldering process while maintaining good productivity, it is possible not only to maintain a good productivity, but also to allow the solder rod part to be replaced with a simple drive device, which is small and inexpensive. Can be highly practical.
Further, since the solder execution position and the solder standby position of the solder flange are uniquely determined, the solder flange does not interfere with each other and the reliability is high.

The perspective view which shows the external appearance of Example 1 of the solder processing apparatus of this invention. The perspective view which shows the state which has arrange | positioned the board | substrate under the solder processing apparatus. Sectional drawing which shows the operation state which made the solder implementation position of the Example 1 the head 1A. Sectional drawing which shows the operation state which made the solder implementation position of the Example 1 the head 1B. The figure which shows the drive mechanism of the Example 1. FIG. The block diagram which shows the control of the Example 1. FIG. (A) is sectional drawing of the soldering iron part which shows the operation state of Example 2 of the solder processing apparatus of this invention, (b) is a fragmentary sectional view which shows the state which melted the solder. (A) is a fragmentary sectional view which shows the tip of the operation state of Example 3 of this invention, (b) is a fragmentary sectional view which shows the state which melted the solder. (A) is a fragmentary sectional view which shows the tip of the operation state of Example 4 of this invention, (b) is a fragmentary sectional view which shows the state which melted the solder. Sectional drawing which shows the operation state of the soldering iron part of Example 5 of the solder processing apparatus of this invention. Sectional drawing which shows the operation state of the soldering iron part of Example 5 of the solder processing apparatus of this invention. Sectional drawing which shows the operation state of the soldering iron part of Example 6 of the solder processing apparatus of this invention. Sectional drawing which shows the operation state of the soldering iron part of Example 7 of the solder processing apparatus of this invention. Sectional drawing which shows the operation state of the soldering iron part of Example 8 of the solder processing apparatus of this invention. The graph which shows the temperature of the tip of Example 9 of the solder processing apparatus of this invention.

  Embodiments of the present invention will be described below with reference to the drawings, taking Examples 1 to 9 as examples. The contents of the present invention are not limited to these embodiments. In addition, the up / down / left / right and front / rear directions used in the following description are as shown in FIG.

  FIG. 1 is an external view of a solder processing apparatus X according to the first embodiment, and a basic configuration related to solder processing is described in Japanese Patent Laid-Open No. 2015-166096. FIG. 2 is an explanatory view showing a state in which a board (circuit board) Bd is arranged under the solder processing apparatus X. As shown in FIGS. 1 and 2, in the solder processing apparatus X, two heads (soldering units) 1 </ b> A and 1 </ b> B arranged side by side are attached to the front surface of an upright flat plate-like wall body 11. It has been.

  Each head 1A and 1B is supplied with thread solder W from above and solders the lead wire Le to the land Ld of the substrate Bd as shown in FIG. It works to attach. The substrate Bd is attached to the jig Gj.

  Each of the heads 1A and 1B is movable in the vertical direction by a known robot arm (not shown) between a lower position close to or in contact with the substrate Bd and an upper position above the lower position. In the state shown in FIG. 1 and FIG. 2, the head 1A is in the lower position (soldering position) and can be soldered, and the head 1B is in the upper position (solder standby position) and the soldering is not performed. Is in a state.

  On the upper part of each head 1A and 1B, as a solder feeding mechanism 60 for supplying the thread solder W, a pair of feed rollers 61 for feeding the thread solder W and a guide tube 62 for guiding the thread solder W fed by the feed roller 61. And. The pair of feed rollers 61 sandwich the thread solder W and rotate to feed the thread solder W downward. The feed roller 61 determines the length of the thread solder W to be sent out according to the rotation angle (number of rotations).

  The guide tube 62 is a tube body that can be elastically deformed, and is disposed in proximity to a portion of the feed roller 61 where the thread solder W is fed out. Further, the lower end of the guide tube 62 moves following the sliding of the cutter upper blade 21. The guide tube 62 is provided so as not to be pulled or stretched within a range in which the cutter upper blade 21 slides.

  A cutter unit 20 for cutting the thread solder W fed by the solder feeding mechanism 60 into solder pieces having a predetermined length is provided below the solder feeding mechanism in each of the heads 1A and 1B. The cutter unit 20 includes a cutter lower blade 22 and a cutter upper blade 21 that is disposed above the cutter lower blade 22 and is slidable in the front-rear direction. The cutter unit 20 is driven by an actuator 32, and the cutter unit 20 is driven by a pusher pin in the vertical direction by the actuator 32.

  The cutter upper blade 21 includes a penetrating upper blade hole 211 into which the thread solder W fed by the solder feeding mechanism 60 is inserted. The lower edge of the upper blade hole 211 is formed in a cutting edge shape. The cutter lower blade 22 includes a lower blade hole (not shown) that penetrates the thread solder W that penetrates the upper blade hole 211. The upper edge portion of the lower blade hole is formed in a cutting blade shape. When the cutter upper blade 21 slides in a state where the thread solder W is inserted, the upper blade hole 211 and the lower blade hole are displaced in a direction intersecting the thread solder W, so that the thread solder W is removed by the mutual cutting blade. Cut into solder pieces.

  When the cutter upper blade 21 returns to the original position after cutting and the pusher pin described above is driven, the pusher pin is inserted to the lower blade hole. Thereby, even when the solder piece cut by the cutter unit 20 remains in the lower blade hole, the solder piece is pushed downward by the pusher pin.

  Also, a soldering iron part is provided below the cutter unit 20 in each head 1A, 1B. In addition to a heater unit including a heater 41 for soldering that generates heat when energized and a heater block 42 for attaching the heater 41, the soldering iron part includes a tip 51 attached to the heater unit.

  The heater block 42 has a cylindrical shape, and the heater 41 is wound around the outer peripheral surface. The heater block 42 includes a recess for attaching the hook 51 to the lower end in the axial direction, and a solder supply hole penetrating from the center of the bottom of the recess to the opposite side. The tip 51 has a cylindrical shape extending in the vertical direction (axial direction), and a supply hole extending in the axial direction is formed in the central portion of the tip 51. The lower blade hole of the cutter lower blade 22 communicates with the solder supply hole of the heater block 42 and the supply hole of the flange 51.

  Note that the tip 51 is made of a material having high thermal conductivity. For example, the thermal conductivity is 100 W / m · K or more. The material of the tip 51 is preferably an aluminum nitride, tungsten carbide, or boron nitride ceramic material.

  FIG. 3 shows a cross-sectional view of the solder processing apparatus X in a state where the head 1A is in the upper position (solder execution position) and the head 1B is in the lower position (solder standby position). The tip 51 is provided with a first temperature detector 52 such as a thermocouple, and the heater block 42 is provided with a second temperature detector 43. The first temperature detector 52 detects the temperature of the tip, and can be detected more accurately when installed at the tip (lower end in the figure) of the tip 51 where the solder melts. Since there is a dimensional restriction, it is provided away from the tip as shown in the figure. The second temperature detector detects the temperature of the heater block 42 and operates as a safety device that detects an abnormal temperature of the heater 41 and generates an alarm or the like.

  The tip 51 is detachable from the heater block 42, and when mounted, the upper part is inserted and disposed in the recess of the heater block 42, and the lower end protrudes downward from the heater block 42. The solder piece of the thread solder cut by the cutter unit 20 passes through the solder supply hole 421 (shown in FIG. 3) of the heater block 42 and the supply hole 511 of the tip 51 on the substrate Bd below the tip 51. Supplied to.

  As shown in FIG. 3, in the head 1 </ b> A that is disposed at the soldering position and in the lower position, the solder piece Wh is supplied to the solder supply hole 421 after the tip 51 a is close to or in contact with the substrate Bd, and the melting process is performed. Done. In the meantime, in the head 1B in the upper position, a process for controlling the tip 51b to an appropriate temperature is executed.

  FIG. 4 shows a cross-sectional view of the solder processing apparatus X in a state where the head 1B is in the solder execution position and the head 1A is in the solder standby position. As shown in FIG. 4, in the head 1 </ b> B disposed at the soldering position and in the lower position, the solder 51 is melted in the supply hole 511 after the tip 51 b approaches or contacts the substrate Bd. The tip of the tip 51b is tapered compared to the tip 51b, and soldering is possible even if an electronic component is disposed in the vicinity of the soldering position. In the meantime, in the head 1A located at the upper position, a process of recovering the tip 51 to an appropriate temperature is executed.

When soldering is performed on the substrate Bd, the heat of the heater 41 is transmitted to the tip 51 through the heater block 42, and the solder piece Wh supplied onto the substrate Bd is melted by the heat. The temperature of the tip 51 is detected by the first temperature detector 52, and the energization amount to the heater 41 is controlled by the signal. When it is determined that the head is at the upper position (standby position) for a long time, the energization of the heater 41 may be temporarily stopped.
Each of the heads 1A and 1B used for soldering has a wall 11 attached to a robot arm (not shown). By controlling the position of the robot arm, the tip of the tip 51 approaches or contacts the substrate Bd. The solder piece Wh supplied onto the substrate Bd can be appropriately melted.

  As a drive mechanism for moving the heads 1A and 1B in the vertical direction, a rack and pinion mechanism K as shown in FIG. 5 is used. The rack and pinion mechanism K shown in FIG. 5 includes a rack 15a fixed to the head 1A, a rack 15b fixed to the head 1B, and a pinion 16 sandwiched between these racks. According to the rack and pinion mechanism, the heads 1A and 1B are alternately arranged at the upper position (standby position) and the lower position (execution position) by rotating the pinion 16 with a motor (not shown). It is possible to move as follows. Although the example of the drive mechanism is a rack and a pinion, it may be driven by belting.

  The control unit 8 will be described. The control unit 8 includes a logic circuit such as an MPU or CPU. As shown in FIG. 6, the control unit 8 controls the actuator 32 of the cutter unit 20 and the motor of the drive mechanism K, the heater 41 of the heater unit 4, and the feed roller 61 of the solder feed unit 6. And can send and receive signals. Moreover, the control part 8 is connected with the temperature measurement sensor, and acquires the temperature of the tip 5 measured with the temperature measurement sensor. Further, the control unit 8 is connected to the storage unit 81 and can exchange information with the storage unit 81. The storage unit 81 includes a ROM that can call information, a RAM that can be called and written, a semiconductor memory such as a detachable flash memory, a hard disk, and the like.

  The storage unit 81 stores in advance information on a soldering position and a soldered component, and selects the head 1A or 1B based on the information. In normal soldering, the head 1A is disposed at the soldering position and soldering is performed using the tip 51a as shown in FIG. 3, and when the component exists in the vicinity of the soldering position, the drive mechanism K tapers. Soldering is performed by placing the head 1 </ b> B provided with the shaped tip 51 b at the soldering position.

By operating the drive mechanism K, one of them is always in the lower position as the solder execution position and the other is in the upper position as the solder standby position, so that they do not interfere with each other and do not damage the board. Although the two heads have different planar positions with respect to the substrate, the position information command to the robot may be corrected and provided.
In addition, either of the heads at the standby position can incinerate and remove impurities attached to the tip by heating to a temperature higher than the soldering temperature.

  Next, a second embodiment of the present invention will be described. FIG. 7 shows a head 1B having a solder height regulating tip 51c for preventing the solder from rising, and as shown in FIG. 7A, a space 51ca for regulating the height of the solder is provided. As shown in (b), the height of the melted solder is regulated by the space 51ca, and after the tip 51c is cooled and the solder is solidified, the tip 51c is pulled up. In this way, the height of the solder can be regulated.

  Next, a third embodiment of the present invention will be described. FIG. 8 shows a head 1B having a terminal soldering tip. Among the substrates to be soldered, there are parts having terminals such as sensors and actuators. When soldering to these terminals, the tip 51d is brought close to the floating terminal Lt as shown in FIG. 8 (a), and the terminal Lt is pressed against the substrate with the tip 51d as shown in FIG. 8 (b). Then, the solder is melted, and the tip 51d is pulled up after cooling. In this way, the terminal Lt can be reliably soldered.

  Next, a fourth embodiment of the present invention will be described. FIG. 9 shows a head 1B having a terminal tip 51e, and has a space 51ea surrounding the terminal Lm protruding from the substrate and bent as shown in FIG. 9A, and shown in FIG. 9B. So that the solder melts. By soldering the terminal Lm in this way, it is possible to prevent the terminal from coming off the substrate.

Next, a fifth embodiment of the present invention will be described. FIG. 10 shows that the head 1B has a side supply tip 51f that allows molten solder to flow out from the side of the tip of the tip. The direction of the solder supply hole 511 is changed so that the supply hole 511a is connected to the solder from the side of the tip 51. The supplied solder is supplied from a horizontally arranged motor M1 to a terminal M1t provided in the left direction in the figure to perform soldering.
FIG. 11 shows a head 1A provided with a side supply tip 51g having a different solder outflow direction in addition to the above-described side supply tip 51f, and soldered to a terminal M2t provided in the left direction of the motor M2. It is.

  Next, a sixth embodiment of the present invention will be described. FIG. 12 has the heat storage body 53 in the tip 51 of the head 1B, and heat is stored by heating the heat storage body 53. Even when the heat capacity of the parts to be soldered is large and there is a risk that the temperature of the tip 51 is lowered, the amount of heat is supplied from the heat storage body 53 to prevent the melting of the solder pieces from becoming insufficient. is there.

  Next, a seventh embodiment of the present invention will be described. In FIG. 13, a solder piece Wu having a width (diameter) larger than the solder piece Wh supplied to the head 1A is supplied to the tip 51 of the head 1B, and is used when a large amount of solder is required. Note that the inner diameter of the supply hole 512 may be increased as the solder piece Wu increases. In this embodiment, the width of the solder piece is increased. However, when the required amount of solder is small, the width of the solder piece is reduced.

  Next, a seventh embodiment of the present invention will be described. In FIG. 14, a solder piece Ws having a length shorter than that of the solder piece Wh supplied to the head 1A is supplied to the tip 51 of the head 1B, and is used when a small amount of solder is required. The length of the solder piece can be set in advance by the amount of rotation of the feed roller 61 (FIG. 1) of the solder feed mechanism 60. In this embodiment, the length of the solder piece is shortened. However, when the required amount of solder is large, the length is increased.

  Next, an eighth embodiment of the present invention will be described. The temperature of the tip 51 can be changed according to the set temperature of the memory built in the storage unit 81 shown in FIG. The controller 8 controls the heating amount of the heater 41 by comparing the set temperature with the first temperature detector 52. FIG. 15 shows the temperature change when the set temperature of the tip 51 of the head 1A and the head 1B is changed. From the viewpoint of soldering performance, the tip temperature is controlled between Tc and Tb. preferable. The temperature change value a of the head 1A is an example when the heat capacity of the component to be soldered is small. The initial temperature value of the tip 51 is controlled to T0, and the temperature drops to T1 by soldering at the point P0. . When the first soldering is completed, the heater 41 is heated and the temperature rises to T2, and by the second soldering at the point P1, it falls to T3. The temperature change value b of the head 1B is an example in the case where the heat capacity of the component to be soldered is large. The temperature of the tip 51 is controlled to an initial temperature value T10 higher than T0 of the head 1A, and the heat capacity is large at point P10. By soldering to the part, the temperature drops greatly to T11. When the first soldering is completed, the temperature is increased to T12 by being heated by the heater 41, and by the second soldering at the point P11, the temperature is decreased to T13. Even when soldering a component having a large heat capacity, the tip temperature can be controlled between the temperatures Tc and Tb by increasing the tip temperature in advance.

In this embodiment, the solder head, the solder feeding mechanism, and the cutter unit are integrally fixed to configure the solder head and switched by the driving mechanism. However, the solder piece that has been cut in advance is used as the solder hook. If supplied, it is sufficient to switch only the soldering iron part with the driving mechanism.
Further, in this embodiment, an example in which two heads are alternately operated by a driving mechanism has been described, but three or more heads may be provided, and one of them may be soldered and another head may be put on standby.

1A, 1B head (soldering unit)
20 Cutter unit 41 Heater 51, 51a, 51b, 51c, 51d, 51e, 51f, 51g Tip 511 Tip supply hole 52 First temperature detector 53 Heat storage body 60 Solder feed mechanism Bd Substrate X Solder processing device K Drive mechanism W Yarn solder Wh, Wu, Ws Solder pieces

Claims (10)

  A plurality of solder flanges for supplying solder and melting the solder with a heater and soldering to the substrate, and at least one of the plurality of solder flanges is selected and disposed at a solderable position, and another solder A drive mechanism arranged at a position to wait for the collar, and the plurality of solder collars vary in shape, solder heating state or solder supply state, and the solder collar is switched via the drive mechanism. A solder processing apparatus for performing a melting process for melting supplied solder.  2. The solder processing apparatus according to claim 1, wherein at least one of the solder flange portions has a different outer diameter of the tip.  3. The solder processing apparatus according to claim 1, wherein at least one of the solder flanges has a shape that press-contacts a terminal provided on the substrate. 4.   The solder processing apparatus according to claim 1, wherein at least one of the solder troughs causes the solder to flow out in a direction of a side surface of the solder trough.  The solder processing apparatus according to claim 1, wherein at least one of the solder ridges has different heat capacities of the solder rivets.  6. The solder processing apparatus according to claim 1, wherein at least one of the solder ridges has a different amount of solder to be melted.  The solder processing apparatus according to claim 6, wherein at least one of the solder flanges has a different size of a solder supply hole through which the solder passes.  8. The solder processing apparatus according to claim 6, wherein at least one of the solder flanges has a different length of solder to be supplied. 9.  9. The solder processing apparatus according to claim 1, wherein at least one of the solder ridges has a different heating setting temperature of the rivet tip. 10. A solder flange for supplying solder and melting the solder with a heater and soldering to the substrate; a solder feed mechanism for supplying the solder; a cutter unit for cutting the solder and supplying a solder piece to the solder flange; A plurality of soldering units in which the solder flange, the solder feed mechanism, and the cutter unit are integrally installed; at least one of the plurality of solder units is selected and disposed at a position where soldering is possible; Provided with a drive mechanism arranged at a position to wait for the solder units, the solder flanges of the plurality of solder units are made different in shape, solder overheat state or solder supply state, and the solder units are switched via the drive mechanism A solder processing apparatus for performing a melting process for melting the supplied solder.

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