JP6436527B2 - Soldering equipment - Google Patents

Description

  The present invention relates to a solder processing apparatus.

  In recent years, an electronic circuit board (hereinafter simply referred to as “substrate”) on which electronic components are mounted is mounted on many devices. In the substrate formation process, a soldering process for joining the lead wires to the wiring pattern on the substrate is performed.

  As an apparatus capable of performing soldering processing efficiently, a solder processing apparatus that supplies and melts solder on a substrate is used. For example, the solder processing apparatus supplies a solder piece onto the substrate so as to pass through the inside of the soldering iron, and melts the solder by the heat of the soldering iron. Patent Document 1 discloses an apparatus configured to perform soldering by heating and melting a supplied solder piece.

  However, in the solder processing apparatus having the above configuration, each process such as a soldering process is managed mainly by time, and it has not been easy to detect whether the solder has been melted and soldered.

For example, in Patent Document 2, whether or not a suitable fillet is formed by melting the solder is detected by continuity between a lead terminal of the electronic component and a check terminal provided in the electrical component that is insulated from the lead terminal. A method has been proposed.
However, in the method proposed in Patent Document 2, it is necessary to provide check terminals corresponding to each of the plurality of lead terminals, and these check terminals must be provided in advance in the electronic component. Increase size and weight.

In Patent Document 3, the land formed on the substrate is divided, the divided land is connected to the probe land, the probe is brought into contact with the probe land, and the electrical resistance between the probes is measured. There has been proposed a method for inspecting the occurrence of lift-off (solder cracks) in a soldered portion.
However, the method proposed in Patent Document 3 is an inspection method after soldering, and it cannot be inspected whether good soldering is performed during the soldering process. Further, it is necessary to provide a probe land on the substrate, which may increase the area of the substrate.

Further, Patent Document 4 proposes a method for evaluating the solderability of an electronic component by cream solder by measuring the voltage of the electronic component placed on the test substrate via the cream solder.
However, the evaluation method proposed in the cited document 4 is a method for evaluating the solderability of the electronic component to the cream solder, and is not a method for evaluating the solderability during the soldering process.

In Patent Document 5, a pair of electrodes insulated from each other at a predetermined interval is provided on the surface of the substrate, and the jet height and width of the jet solder can be controlled depending on whether the jet solder contacts between the pair of electrodes. An apparatus has been proposed.
However, the apparatus proposed in the cited document 5 is for adjusting and managing the jet height and width of the jet solder before the solder processing, and is not a method for evaluating the solderability during the soldering process.

Japanese Patent No. 5184359 JP 2009-54781 A JP 2003-273506 A JP 2000-28509 A Japanese Patent Laid-Open No. 11-126963

  The present invention has been made in view of the above circumstances, and without melting the electronic components to be mounted on the board and without providing inspection lands on the board, the solder can be melted and soldered properly. An object of the present invention is to provide a solder processing apparatus capable of detecting whether or not the soldering process has been performed.

  A solder processing apparatus according to the present invention is a solder processing apparatus that supplies and melts solder onto a substrate, has a supply hole that is the supply path, has a substantially cylindrical shape, and the tip end portion of the substantially cylindrical shape is A solder trough that melts the supplied solder in proximity to or in contact with the substrate; and a solder supply unit that drops and supplies the solder onto the substrate through the supply hole. It further comprises a detecting means for detecting melting of the solder.

  Further, as the above configuration, more specifically, the detection means has a pair of check terminals, and at least one of the pair of check terminals is not in contact with the solder before melting, and both are solder after melting. It is good also as a structure which is provided in the position which contacts with and detects the melting of the supplied solder by the conduction | electrical_connection detection between a pair of said check terminals.

  More specifically, as the above-described configuration, more specifically, the tip end portion of the supply hole continuously increases in diameter toward the outside, and at least one of the pair of check terminals is provided in a portion where the diameter of the supply hole is increased. It is good also as the structure comprised.

  Alternatively, as the above configuration, more specifically, a groove or a recess is formed in the circumferential direction or the axial direction on the inner peripheral surface of the tip of the supply hole, and at least one of the pair of check terminals is the groove or It is good also as a structure provided in the said recessed part.

  In addition, as the above configuration, more specifically, a solder processing apparatus for mounting an electronic component through hole, wherein one of the pair of check terminals is provided on the solder supply surface side and the other is opposite through the through hole. It is good also as a structure which is provided in the surface side and detects melting of the supplied solder and formation of a back fillet by detecting conduction between the pair of check terminals.

  In the above configuration, it is preferable that the portions of the pair of check terminals that are in contact with the melted solder are made of a material that has wettability with the solder.

  Further, as the above configuration, more specifically, the detection unit includes a first contact sensor that detects contact of an object, and the first contact sensor does not contact the solder before melting, and after the melting. It is good also as a structure provided in the position which contacts with solder.

  Furthermore, as the above configuration, more specifically, the tip end portion of the supply hole may increase in diameter toward the outside, and the first contact sensor may be provided in a portion where the diameter of the supply hole is increased.

  Alternatively, as the above configuration, more specifically, a groove or a recess is formed in the circumferential direction or the axial direction on the inner peripheral surface of the tip of the supply hole, and the first contact sensor is provided in the groove or the recess. It is good also as a structure.

  More specifically, the above-described configuration is a solder processing apparatus for mounting an electronic component through-hole, wherein the detection unit further includes a second contact sensor for detecting contact of an object, and the second contact sensor The solder supply surface may be provided on the opposite surface side through a through hole, and the melting of the supplied solder and the formation of the back fillet may be detected by the first contact sensor and the second contact sensor.

  According to the solder processing apparatus of the present invention, the solder supplied to the solder flange is properly melted without having a special structure for the electronic component to be mounted on the substrate and without providing the inspection land on the substrate. Whether or not soldering has been performed can be detected during the soldering process.

  In addition, when electronic parts are mounted through holes, it is possible to detect during the soldering process whether the solder supplied to the solder flange has melted and fillets and back fillets have been formed.

1 is a perspective view showing an embodiment of a solder processing apparatus according to the present invention. It is the II sectional view taken on the line of FIG. It is a block diagram which shows the outline of the solder processing apparatus concerning this invention. It is a fragmentary sectional view which illustrates the attachment position to a tip of a pair of check terminals. It is sectional drawing which shows the structural example of a check terminal. It is a fragmentary sectional view explaining melting detection of a solder piece by a pair of check terminals. It is a fragmentary sectional view explaining melting detection of a solder piece by a pair of check terminals. It is a perspective view which shows other embodiment of the solder processing apparatus which concerns on this invention. It is the II-II sectional view taken on the line of FIG. It is a fragmentary sectional view which shows other embodiment of the solder processing apparatus which concerns on this invention. It is a fragmentary sectional view which shows other embodiment of the solder processing apparatus which concerns on this invention. It is a fragmentary sectional view which shows other embodiment of the solder processing apparatus which concerns on this invention.

  Embodiments of the present invention will be described below with reference to the drawings. The present invention is not limited to these embodiments.

(First embodiment)
FIG. 1 is a perspective view showing an embodiment of a solder processing apparatus according to the present invention, FIG. 2 is a cross-sectional view of the solder processing apparatus shown in FIG. 1 cut along line II, and FIG. 3 is a solder according to the present invention. It is a block diagram which shows the outline of a processing apparatus. In FIG. 1, a part of the support part 1 is cut to display the inside of the solder processing apparatus.

  The solder processing apparatus A according to the present invention supplies the thread solder W from above and uses the solder iron Sa provided at the lower part to solder the wiring board Bd and the electronic component Ep disposed below the solder iron Sa. It is a device to attach. As shown in FIGS. 1, 2, and 3, the solder processing apparatus A includes a support unit 1, a cutter unit 2, a drive mechanism 3, a solder feeding mechanism 6, a solder iron Sa, and a control unit 8 (see FIG. 3). Yes.

  The solder processing apparatus A supplies the molten solder to the lands Ld of the wiring board Bd attached to the jig Gj and the terminals of the electronic component Ep arranged on the wiring board Bd, and performs connection fixing. When performing soldering, the jig Gj is moved vertically and horizontally to position the wiring board Bd with the land Ld. Further, the solder processing apparatus A is movable in the vertical direction, and the tip of the solder iron Sa can be brought into contact with the land Ld by moving in the vertical direction after positioning.

  The support portion 1 includes a flat plate-like wall body 11 that is erected. The cutter unit 2 is for cutting the thread solder W fed by the solder feeding mechanism 6 into solder pieces W1 having a predetermined length. The cutter unit 2 includes a cutter lower blade 22 fixed to the sliding guide 13, and a cutter upper blade 21 that is disposed above the cutter lower blade 22 and is slidably disposed. Further, the cutter unit 2 includes a pusher pin 23 that is driven in a vertical direction (a direction intersecting the sliding direction of the cutter upper blade 21) by a second actuator 32 described later of the drive mechanism 3 (see FIG. 2). ).

  As shown in FIG. 2, the cutter upper blade 21 is an upper blade hole 211 that is a through hole into which the thread solder W fed by the solder feeding mechanism 6 is inserted, and a through hole into which the pusher pin 23 is inserted. Pin hole 212 is provided. The lower edge of the upper blade hole 211 is formed in a cutting edge shape. The cutter lower blade 22 includes a lower blade hole 221 that is a through hole into which the thread solder W penetrating the upper blade hole 211 is inserted. The edge part of the upper end of the lower blade hole 221 is formed in a cutting blade shape. The upper blade hole 211 and the lower blade hole 221 are displaced in a direction intersecting with the thread solder W in a state where the thread solder W is inserted, so that the thread solder W is cut into the solder pieces W1 by the mutual cutting blades. .

  The upper blade hole 211 and the pin hole 212 are provided side by side in the sliding direction of the cutter upper blade 21. The cutter upper blade 21 slides between a position where the upper blade hole 211 and the lower blade hole 221 overlap vertically and a position where the pin hole 212 and the lower blade hole 221 overlap vertically.

  As shown in FIG. 2, the drive mechanism 3 includes a first actuator 31 that is fixed to the cutter lower blade 22 and slides the cutter upper blade 21, and a second actuator that is attached to the cutter upper blade 21 and drives the pusher pin 23. 32. The first actuator 31 includes a cylinder 311 fixed to the cutter lower blade 22 and a piston rod 312 that is disposed inside the cylinder 311 and expands and contracts by the pressure of supplied air. The tip portion of the piston rod 312 is fixed to the cutter upper blade 21, and the cutter upper blade 21 slides by the expansion and contraction of the piston rod 312.

  In the solder processing apparatus A shown in FIG. 2, when the piston rod 312 of the first actuator 31 protrudes most from the cylinder 311, the cutter upper blade 21 is at the left end in the drawing, and the upper blade hole 211 is connected to the lower blade hole 221. It is designed to overlap vertically. Although not shown, when the piston rod 312 is housed in the cylinder 311, the cutter upper blade 21 moves to the right end in the figure, and the pin hole 212 overlaps the lower blade hole 221 vertically.

  The second actuator 32 includes a cylinder 321 fixed to the cutter upper blade 21 and a piston rod 322 that is disposed inside the cylinder 321 and expands and contracts by air pressure. A pusher pin 23 is fixed to the tip of the piston rod 322. When the pin hole 212 and the lower blade hole 221 overlap each other, the second actuator 32 extends the piston rod 322 so that the pusher pin 23 is inserted into the lower blade hole 221 and the piston rod 322 is moved. The pusher pin 23 is removed from the lower blade hole 221 by being accommodated in the cylinder 321. Even when the solder piece W1 cut by the cutter unit 2 (shown in FIG. 1) remains in the lower blade hole 221, it is pushed out by the operation of the pusher pin 23.

  The solder feed mechanism 6 supplies the thread solder W, and includes a pair of feed rollers 61 that feed the thread solder W and a guide tube 62 that guides the thread solder W fed by the feed roller 61. The pair of feed rollers 61 is attached to the support portion 1, sandwiches the thread solder W, and rotates to feed the thread solder W downward. The feed roller 61 determines the length of the fed solder wire according to the rotation angle (number of rotations).

  The guide tube 62 is a tube body that can be elastically deformed, and its upper end is disposed in the vicinity of a portion of the feed roller 61 where the thread solder W is fed out. The lower end of the guide tube 62 moves following the sliding of the cutter upper blade 21 and is connected to the upper blade hole 211. The guide tube 62 is provided so as not to be pulled or stretched within a range in which the cutter upper blade 21 slides.

  As shown in FIG. 1, the solder iron Sa is fixed below the cutter unit 2. Details of the soldering iron Sa will be described below.

  The solder iron Sa includes a heater unit 4, a iron tip 5 attached to the heater unit 4, and a temperature sensor (not shown) that acquires the temperature of the iron tip 5. As shown in FIG. 2, the heater unit 4 includes a heater 41 that generates heat when energized, a heater block 42 for attaching the heater 41, and a heater block holding portion 43 that holds the heater block 42.

  The heater block 42 has a cylindrical shape, and the heater 41 is wound around the outer peripheral surface. The heater block 42 includes a recess 421 having a circular cross section for attaching the tip 5 to the lower end portion in the axial direction, and a solder supply hole 422 penetrating from the center of the bottom of the recess 421 to the opposite side.

  The heater block holding portion 43 includes a holding hole 430 which is a through hole formed in a flat plate-like main body portion, and a pair of check terminals 71a and 71b are attached to both left and right end portions in FIG. The heater block 42 is held by the heater block holding portion 43 by press-fitting the end of the heater block 42 opposite to the concave portion 421 into the holding hole 430. In addition, as shown in FIG. 2, the step press-fitted into the holding hole 430 of the heater block 42 is formed with a step so as to have a small diameter, but is not limited to this, and has a shape without a step. There may be.

  By attaching the heater block holding portion 43 to the support portion 1, the solder iron Sa is fixed to the support portion 1. As shown in FIG. 2, when the heater block holding portion 43 is attached to the support portion 1, the solder iron Sa communicates between the lower blade hole 221 of the cutter lower blade 22 and the solder supply hole 422 of the heater block 42.

  As shown in FIG. 2, the tip 5 is made of a non-wetting member with respect to the solder and has a cylindrical shape extending in the vertical direction (axial direction). A supply hole 51 extending in the axial direction is formed in the central portion of the tip 5. The tip 5 is preferably made of a material having a thermal conductivity of 100 W / m · K or more. For example, the tip 5 is preferably made of a ceramic such as silicon carbide or aluminum nitride, or a metal such as tungsten, and more preferably a ceramic.

  The tip 5 is detachable from the heater block 42, and when mounted, the upper portion is inserted into the recess 421 of the heater block 42, and the lower end protrudes downward from the heater block 42. The supply hole 51 of the tip 5 and the solder supply hole 422 communicate with each other. The solder piece W1 cut by the cutter unit 2 is supplied from the lower blade hole 221 to the supply hole 51 through the solder supply hole 422.

  When soldering with the soldering iron Sa, the heat of the heater 41 is transmitted to the iron tip 5 through the heater block 42, and the solder piece W1 supplied to the supply hole 51 is melted by the heat. The temperature of the heater block 42 is detected by a temperature sensor (not shown), and a detection signal is transmitted to the control unit 8. The controller 8 controls the voltage application to the heater 41 so that the heater block 42 has a predetermined temperature.

  In the solder processing apparatus A, soldering, flux fume, and the like are suppressed from being scattered by performing soldering in a state where the tip of the cylindrical tip 5 is in contact with the land Ld of the wiring board Bd. The solder processing apparatus A and the substrate Bd are relatively movable so that the lower end of the tip 5 and the land Ld on the substrate Bd are in contact with each other.

  The control unit 8 will be described. The control unit 8 includes a logic circuit such as an MPU or CPU. As shown in FIG. 3, the control unit 8 controls the first actuator 31 and the second actuator 32 of the drive unit 3, the heater 41 of the heater unit 4, and the feed roller 61 of the solder feed unit 6. It is connected to each part and can send and receive signals. The control unit 8 is connected to a temperature sensor (not shown) and acquires the temperature of the heater block 42 measured by the temperature sensor. Further, the control unit 8 is also connected to detection means (a pair of check terminals 71a and 71b) for detecting melting of the solder piece W1 supplied to the supply hole 51 of the tip 5 and based on a signal from the detection means. Control the completion of soldering and the set temperature of the heater. Further, it is connected to the storage unit 81 so that information can be exchanged with the storage unit 81. The storage unit 81 includes a ROM that can call information, a RAM that can be called and written, a semiconductor memory such as a detachable flash memory, a hard disk, and the like.

  As shown in FIG. 2, a pair of check terminals 71 a and 71 b as detection means are detachably inserted into the tip 5 of the tip 5 so as to be exposed at opposing positions in the supply hole 51. Yes. More specifically, as shown in the partially enlarged view of FIG. 2, the tip end portion (lower end portion) of the supply hole 51 of the tip 5 is continuously expanded in the downward direction. A pair of check terminals 71a and 71b are attached to the enlarged diameter portion 52 so that the tip portions thereof are exposed. As a result, the unmelted solder piece W1 supplied into the supply hole 51 does not contact the pair of check terminals 71a and 71b, and no conduction occurs between the pair of check terminals 71a and 71b. On the other hand, when the solder piece W1 is melted by heating, the melted solder comes into contact with the pair of check terminals 71a and 71b, and conduction occurs between the pair of check terminals 71a and 71b. In other words, the melting of the solder piece W1 in the supply hole 51 can be detected by detecting the conduction between the check terminals 71a and 71b.

  The mounting positions of the pair of check terminals 71a and 71b are positions where at least one of the pair of check terminals 71a and 71b does not contact the solder piece before melting and both contact the solder piece W1 after melting. There is no particular limitation as long as it is determined, and it may be appropriately determined from the shape of the supply hole 51 formed in the tip 5, the size and shape of the supplied solder piece W1, the shape of the electronic component Ep to be soldered, and the like. For example, as shown in FIG. 4A, the enlarged diameter portion 53 is formed so that a step is formed at the lower end portion of the supply hole 51, and a pair of check terminals 71a and 71b are provided in the enlarged diameter portion 53. Good. Alternatively, as shown in FIG. 4B, a groove 54 may be formed in the axial direction at the lower end of the supply hole 51, and a check terminal may be provided in the groove 54. Although not shown in the drawing, a recess may be formed on the inner peripheral surface of the lower end portion of the supply hole 51, and one or both of the pair of check terminals 71a and 71b may be provided in the recess.

  Further, it is desirable that the tip portions of the check terminals 71a and 71b that are in contact with the solder pieces W1 are made of a material having conductivity and wettability to the solder. Examples of the material having wettability to solder include Fe, Cu, Ni, and alloys thereof. On the other hand, it is desirable to coat the surfaces of the check terminals 71a and 71b other than the tip portions with a material that does not wet the solder. Thereby, the solder adhering to the check terminals 71a and 71b can be reduced. Examples of the material that does not wet with solder include Cr. In addition, the check terminals 71a and 71b preferably have a small heat capacity within a range in which conduction through the solder can be detected, and the cross-sectional diameter of the check terminals 71a and 71b is preferably in the range of 0.1 mm to 1 mm, for example. FIG. 5 shows an example of the check terminal. In the check terminal 71 shown in this figure, the outer peripheral portion of the core material made of Fe is Cr plated, and the end portion is exposed to Fe.

  It is desirable that the check terminals 71a and 71b are attached to the tip 5 in a detachable manner. Depending on the long-term use, oxides or foreign substances may adhere to the portions of the check terminals 71a and 71b that come into contact with the solder, resulting in poor conduction. Therefore, the check terminals 71a and 71b are periodically removed from the tip 5 So that they can be cleaned.

  FIG. 6 is an explanatory diagram in the case where the electronic component Ep is mounted on the substrate Bd using the solder processing apparatus shown in FIGS. 1 and 2. A lead pin Lp protruding upward from the electronic component Ep attached to the lower surface of the substrate Bd is inserted through the through hole Th of the substrate Bd and protrudes from the upper surface of the substrate Bd. When the lead pin Lp and the land Ld formed on the outer periphery of the through hole Th are joined by solder, the cylindrical tip 5 is in contact with the upper surface of the substrate Bd so as to surround the outer periphery of the lead pin Lp and the land Ld. The solder piece W1 is supplied into the supply hole 51. Since the solder piece W1 supplied into the supply hole 51 has not melted yet, for example, it abuts on the upper end of the lead pin Lp and stands up in the supply hole 51 (FIG. 6A). In this state, since the solder piece W1 is not in contact with the pair of check terminals 71a and 71b, no conduction occurs between the pair of check terminals 71a and 71b. Next, when the solder piece W1 is melted by the heat from the tip 5, the melted solder forms a fillet around the lead pin Lp and comes into contact with the pair of check terminals 71a and 71b (FIG. 6B). As a result, conduction occurs between the pair of check terminals 71a and 71b, and the melting of the solder piece W1 is detected. At this time, if it is arranged so that one of the pair of check terminals 71a and 71b is in contact with the fillet portion of the molten solder and the other is in contact with the back fillet, not only the fillet but also the back fillet is formed at the same time. Can be detected. The embodiment will be described later.

  FIG. 7 is an explanatory diagram showing the configuration of the tip 5 and the pair of check terminals 71a and 71b when the land Ld formed on the substrate surface and the lead wire LL are joined by solder. A notch 55 is formed at the lower end of the cylindrical tip 5, and when the lower end of the tip 5 contacts the substrate surface, the notch 55 does not contact the substrate surface and forms an opening. . In the embodiment of FIG. 7A, the check terminal 71b is attached to the lower end portion of the tip 5 so that its tip is exposed inside the supply hole 51, and the other check terminal 71a is It is attached so that the tip is located outside the notch 55. The unmelted solder piece W1 (broken line in FIG. 7) supplied to the supply hole 51 of the tip 5 does not contact any of the check terminals 71a and 71b, and conduction is established between the pair of check terminals 71a and 71b. Does not occur. Next, when the solder piece W1 is melted by heating from the tip 5, the molten solder comes into contact with the check terminal 71b. Also, a part of the molten solder flows and flows outward from an opening formed by the notch 55 and the substrate surface, and comes into contact with another check terminal 71a. Thereby, conduction | electrical_connection arises between a pair of check terminals 71a and 71b, and melting of the solder piece W1 is detected.

  In the embodiment of FIG. 7B, one check terminal 71a is attached so that its tip is located in an opening formed by the notch 55 and the surface of the substrate Bd. In this case, when the solder melted by the heat from the tip 5 flows to the opening formed by the notch 55 and the surface of the substrate Bd, conduction occurs between the pair of check terminals 71a and 71b, and the solder piece W1 Melting is detected.

  The position, size, and shape of the notch 55 formed at the lower end portion of the tip 5 may be appropriately determined in consideration of the shape after solidification of the molten solder that joins the land Ld and the lead wire LL. Further, in the case where solder bonding is performed between the land Ld and the lead wire LL in a state where the tip 5 is not brought into contact with the substrate surface, the notch 55 may not be provided at the lower end portion of the tip 5. . In this case, both the pair of check terminals 71a and 71b may be provided in the gap between the lower end of the tip 5 and the substrate surface or in the vicinity of the gap.

(Second Embodiment)
FIG. 8 is a perspective view showing a second embodiment of the solder processing apparatus according to the present invention, and FIG. 9 is a sectional view taken along line II-II in FIG. The solder processing apparatus B shown in FIGS. 8 and 9 is an apparatus for mounting the electronic component Ep through-hole, and can detect not only the fillet formation on the substrate surface of the molten solder but also the back fillet formation on the back surface of the substrate. . In the following description, the description of the same members and parts as those of the apparatus of the first embodiment shown in FIGS. 1 and 2 is omitted.

  FIG. 8A is a perspective view before the electronic component Ep in which a plurality of lead pins Lp protrude upward from the main body is mounted on the substrate Bd having the through hole Th in which the land Ld is formed. Corresponding to each of the lead pins Lp, a through hole Th in which a land Ld is formed is provided in the substrate Bd.

  FIG. 8B is a perspective view of the solder processing apparatus B that solder-joins the land Ld formed in the through hole Th and the lead pin Lp of the electronic component Ep. The support unit 1, the cutter unit 2, the drive mechanism 3, the solder feeding mechanism 6, the solder iron Sa, and the control unit 8 in the solder processing apparatus B are the same as those in the solder processing apparatus A of the first embodiment. Similarly to the solder processing apparatus A, the solder processing apparatus B is relatively movable in a direction in which the solder processing apparatus B is separated from and contacting the substrate Bd. The difference from the solder processing apparatus A is that one check terminal 71a is attached to the lower end portion of the tip 5 and the other check terminal 71b is movable to the back fillet forming portion on the back surface of the substrate Bd.

  The check terminal 71 b is attached to a rod 92 that is moved in and out by an air cylinder 91. The air cylinder 91 is attached to a lower end portion of an “L” -shaped stay 431 attached to the heater block 43 (shown in FIG. 2), and moves together with the solder processing apparatus B.

  Detection of solder bonding and solder melting (formation of fillet and back fillet) by the solder processing apparatus B is performed as follows. First, the tip 5 is positioned above the land Ld and the lead pin Lp to be soldered by moving one or both of the solder processing apparatus B and the substrate Bd. Then, the solder processing apparatus B is relatively moved in the substrate direction to bring the tip 5 into contact with the land Ld on the substrate surface. When the solder processing apparatus B is relatively moving, the rod 92 is pulled into the air cylinder 91, and the check terminal 71b is not in contact with the substrate Bd. Next, as shown in FIG. 9, the rod 92 is protruded from the air cylinder 91, and the tip of the check terminal 71b is moved to a position where it comes into contact with the back fillet of the molten solder. Then, the solder piece W1 (broken line in FIG. 9) is supplied to the supply hole 51. When the solder piece W1 is not melted, the solder does not contact the check terminal 71a and the check terminal 71b, so that conduction between the check terminals 71a and 71b does not occur. Further, even if the solder is melted, conduction between the check terminals 71a and 71b does not occur if the molten solder only forms a fillet. Only when the molten solder forms a fillet and a back fillet is formed on the back side of the substrate through the through hole Th, conduction occurs between the check terminals 71a and 71b. That is, the formation of the molten solder fillet and back fillet is detected based on the presence or absence of conduction between the check terminals 71a and 71b.

  When the formation of the molten solder fillet and back fillet is detected, the rod 92 is drawn into the air cylinder 91 and the check terminal 71b moves to a position where it does not come into contact with the substrate Bd. Thereafter, the solder processing apparatus B relatively moves, and the tip 5 is positioned above the land Ld and the lead pin Lp to be soldered next. Then, the solder joint and the solder melting detection (fillet and back fillet formation) are repeated in the same manner.

(Third embodiment)
10 and 11 are partial cross-sectional views showing a third embodiment of the solder processing apparatus according to the present invention. In the embodiments shown in these drawings, a contact sensor that detects contact of an object is used as detection means for detecting melting of the solder piece W1 supplied into the supply hole 51. In the solder processing apparatus of FIG. 10, the tip of the stylus of the first contact sensor 72a is attached to be exposed at the enlarged diameter portion 52 that continuously expands downward at the lower end of the supply hole 51. . As shown in FIG. 10A, the unmelted solder piece W1 supplied into the supply hole 51 does not contact the stylus of the first contact sensor 72a. On the other hand, as shown in FIG. 10B, when the solder piece W1 is melted by heating with the tip 5, the melted solder comes into contact with the stylus of the first contact sensor 72a, and the first contact sensor 72a causes the supply hole to be supplied. The melting of the solder piece W1 in 51 is detected.

  The contact sensor used in the present invention is not particularly limited as long as it detects contact of an object, and a conventionally known sensor can be used. As a commercially available product, “Cylindrical Touch Switch D5C” manufactured by OMRON Corporation is preferably used.

  Similar to the above-described embodiment, the stylus of the first contact sensor 72a needs to be provided at a position that does not contact the solder piece W1 before melting and contacts the solder after melting. The attachment position of the stylus of the first contact sensor 72a may be appropriately determined from the size and shape of the supplied solder piece W1, the shape of the electronic component Ep to be soldered, and the like. For example, as in the above-described embodiment, as shown in FIG. 4, the enlarged diameter portion 53 formed at the lower end portion of the supply hole 51 or the axial groove portion 54 formed at the lower end portion of the supply hole 51. The stylus of the first contact sensor 72a may be provided. Although not shown in the drawing, a concave portion may be formed on the inner peripheral surface of the lower end portion of the supply hole 51, and the stylus of the first contact sensor 72a may be provided in the concave portion.

  FIG. 11 is an explanatory diagram in the case where the first contact sensor 72a and the second contact sensor 72b detect the fillet formation on the substrate surface and the back fillet formation on the substrate back surface of the electronic component Ep to be mounted through-hole. The overall configuration of the solder processing apparatus is the same as that shown in FIGS. 9 and 10, and uses a first contact sensor 72a and a second contact sensor 72b instead of the pair of check terminals 71a and 71b. According to the solder processing apparatus having such a configuration, the fillet on the substrate surface due to the molten solder is detected by the first contact sensor 72a, and the back fillet on the back surface of the substrate is detected by the second contact sensor 72b. The operation control of the solder processing apparatus is the same operation control as that of the solder processing apparatus shown in FIGS.

(Other embodiments)
In the above-described embodiment, the pair of check terminals 71a and 71b or the contact sensors 72a and 72b are used as detection means. For example, the fillet formation on the front surface of the substrate may be detected by conduction between the pair of check terminals 71a and 71b, and the back fillet formation on the back surface of the substrate may be detected by the contact sensor 72.

  As a detecting means for detecting the melting of the solder piece W1 in the supply hole 51, it is also possible to use a gas flow rate sensor or a pressure sensor. In the solder processing apparatus, nitrogen is quantitatively supplied into the supply hole 51 of the tip 5 in order to prevent oxidation of the solder. Therefore, for example, as shown in FIG. 12, a pipe P connected to the supply hole 51 is attached to the tip of the hook 5, and nitrogen is discharged or supplied from here. The opening of the pipe P in the supply hole 51 is open when the solder piece W1 is not melted, but when the solder piece W1 is melted, all or part of the opening is closed with the molten solder. According to such a configuration, the melting of the solder piece W1 in the supply hole 51 can be detected by detecting the flow rate and pressure of nitrogen flowing through the pipe P. Furthermore, the melted state of the solder piece W1 such that a part of the solder piece W1 is melted can be detected depending on the degree of blockage of the opening.

  INDUSTRIAL APPLICABILITY The solder processing apparatus of the present invention is useful because it can detect during the soldering process whether the solder supplied to the solder ridge has melted and has been properly soldered.

DESCRIPTION OF SYMBOLS 1 Support part 2 Cutter unit 3 Drive mechanism 4 Heater unit 5 Tip 6 Solder feed mechanism A Solder processing apparatus B Solder processing apparatus P Pipe W Yarn solder W1 Solder piece 11 Wall body 13 Sliding guide 21 Cutter upper blade 22 Cutter lower blade 23 Pusher pin 31 1st actuator 32 2nd actuator 41 Heater 42 Heater block 43 Heater block holding part 51 Supply hole 61 Feed roller 62 Guide pipe 71a, 71b Check terminal 72a 1st contact sensor 72b 2nd contact sensor Sa Soldering iron Bd board Ep Electronic component Ld Land 211 Upper blade hole 212 Pin hole 221 Lower blade hole 311 Cylinder 321 Cylinder 421 Recess 422 Solder supply hole 430 Holding hole

Claims (9)

A solder processing apparatus for supplying and melting solder on a substrate,
A substantially cylindrical shape having a supply hole which is the supply path, and a tip end portion of the substantially cylindrical shape being close to or in contact with the substrate, and a solder flange portion for melting the supplied solder;
A solder supply unit that drops and supplies the solder onto the substrate so as to pass through the supply hole;
It further comprises a detecting means for detecting melting of the supplied solder ,
The detection means has a pair of check terminals,
The pair of check terminals is provided at a position where at least one of the check terminals does not contact with the solder before melting, and both contact with the solder after melting,
The solder processing apparatus, wherein melting of the supplied solder is detected by detecting conduction between the pair of check terminals . The tip portion of the supply hole is enlarged toward the outside, wherein at least one of the pair of check terminals, soldering apparatus according to claim 1, wherein provided on the enlarged diameter portion of said supply hole. Wherein the inner peripheral surface of the distal end portion of the supply holes, the circumferential direction or the axial direction in the groove or recess is formed, at least one of the pair of check terminals, the groove or claim 1 or 2, wherein provided in the recess Soldering equipment. A solder processing apparatus for mounting electronic components through holes,
One of the pair of check terminals is provided on the solder supply surface side, and the other is provided on the opposite surface side through the through hole,
Soldering apparatus according to any one of claims 1 to 3 for detecting the supplied solder melting and forming of the back fillet by conduction detection between the pair of check terminals. The melted portion in contact with the solder of the pair of check terminals, soldering apparatus according to any one of claims 1 to 4 comprising a solder wettability of a material. A solder processing apparatus for supplying and melting solder on a substrate,
A substantially cylindrical shape having a supply hole which is the supply path, and a tip end portion of the substantially cylindrical shape being close to or in contact with the substrate, and a solder flange portion for melting the supplied solder;
A solder supply unit that drops and supplies solder onto the substrate so as to pass through the supply hole;
With
It further comprises a detecting means for detecting melting of the supplied solder,
The detection means includes a first contact sensor that detects contact of an object,
The first contact sensor does not contact with the solder before melting, and solder processing apparatus characterized by being provided at a position in contact with the solder after melting. The solder processing apparatus according to claim 6 , wherein a tip end portion of the supply hole has an increased diameter toward the outside, and the first contact sensor is provided at a portion of the supply hole having an increased diameter. The solder processing apparatus according to claim 6 or 7 , wherein a groove or a recess is formed in an inner peripheral surface of a tip portion of the supply hole in a circumferential direction or an axial direction, and a first contact sensor is provided in the groove or the recess. . A solder processing apparatus for mounting electronic components through holes,
The detection means further includes a second contact sensor that detects contact of an object,
A second contact sensor is provided on the opposite side of the solder supply surface through a through hole;
Soldering apparatus according to any one of claims 6-8 for detecting the formation of a melt and the back fillet of solder that is the supply by the first contact sensor and the second contact sensor.