JP6566394B2 - Soldering equipment - Google Patents

Description

  The present invention relates to a solder processing apparatus having a solder iron, and more particularly to a solder processing apparatus for removing deposits attached to the tip of a solder iron.

  In recent years, many electric devices are equipped with electronic circuits on which electronic components are mounted. In the electronic circuit formation process, soldering using a soldering iron is used. For example, a terminal or wire of an electronic component is inserted into a through hole formed in the wiring board, and the tip portion thereof is soldered to a wiring pattern (land) formed around the through hole. Mounting and fixing to the wiring board is performed.

  The soldering process is realized by supplying the solder heated and melted at the tip of the soldering iron to the wiring board. For example, an apparatus disclosed in Patent Document 1 includes a solder rod configured to be supplied with solder pieces, and is configured to perform soldering by heating and melting the solder.

Japanese Patent No. 5184359

  Since the solder tip contacts the molten solder every time soldering is performed, dross (mainly flux carbide and solder oxide) is likely to adhere. If such deposits are attached to the tip of the solder, it becomes difficult to efficiently transfer heat to the solder pieces and the like, and proper heating and melting of the solder is hindered.

  For this reason, a cleaning process for removing deposits on the tip is necessary. As a technique for removing the deposit, for example, there is a technique of scraping off the deposit using a drill. However, a technique capable of removing the deposit more efficiently is desired from the viewpoint of productivity and convenience.

  An object of this invention is to provide the solder processing apparatus which can remove the deposit | attachment of a tip more efficiently in view of the said problem.

  A solder processing apparatus according to the present invention includes a soldering iron having a substantially cylindrical tip, and by melting the solder piece in the tip by heating the tip, and the melting process A solder processing apparatus that performs an incineration process that incinerates deposits attached to the tip of the tip, and has a configuration in which a gas containing oxygen is passed through the tip when the incineration process is performed. According to this configuration, it is possible to more efficiently remove the deposit on the tip.

  More specifically, the above-described configuration may be a configuration in which a high-concentration oxygen gas having a higher oxygen concentration than air is used as the gas. According to this structure, the deposit | attachment of a tip can be removed still more efficiently compared with the case where air is used as said gas to ventilate.

  More specifically, the above-described configuration further includes a gas generation device that generates the high-concentration oxygen gas using supplied air, and the gas generation device performs the incineration process when the high-concentration oxygen gas is used. It is good also as a structure which ventilates in the said tip.

  More specifically, the gas generator may be configured to separate the supplied air and generate the high-concentration oxygen gas and a high-concentration nitrogen gas having a higher nitrogen concentration than air. Good. Moreover, the said structure WHEREIN: The said gas generator is good also as a structure which ventilates the said high concentration nitrogen gas in the said tip when performing the said melting process.

  More specifically, the gas generator may be configured to change the flow rate of the ventilation into the tip between the melting process and the incineration process. More specifically, the above configuration may be configured such that high-pressure air is ventilated into the tip after the incineration process is completed.

  More specifically, the above-described configuration may be configured such that the heating of the tip in the melting process and the heating of the tip in the incineration process are performed by the same heater provided in the soldering iron.

  More specifically, the lower end of the tip extending in the vertical direction is in contact with or close to the substrate so that the melting process is performed, and the molten solder is supplied onto the substrate. It is good also as a formed structure.

  More specifically, as the above configuration, when performing the incineration process, a bottomed cylindrical ventilation control body may be arranged so as to cover from the periphery of the tip to the lower side. More specifically, the above configuration may include a configuration in which at least two soldering irons are provided, and the incineration process is alternately performed in the two soldering irons.

  According to the solder processing apparatus of the present invention, it is possible to more efficiently remove the deposit on the tip.

It is a perspective view of the soldering apparatus concerning a 1st embodiment. It is sectional drawing of the soldering apparatus shown by FIG. It is explanatory drawing regarding the movement of a cutter upper blade. It is a flowchart regarding a cleaning process. It is a schematic block diagram of a nitrogen / oxygen gas generator. It is explanatory drawing regarding a gas separator. It is explanatory drawing regarding a cleaning process. It is a graph about the relationship between the oxygen concentration of the gas which ventilates, and a deposit incineration time.

  Embodiments of the present invention will be described below with reference to the drawings. The content of the present invention is not limited to the embodiment. In addition, the vertical and horizontal directions used in the following description are as shown in FIG.

[Overall structure of soldering equipment]
FIG. 1 is a perspective view of a soldering apparatus A (one form of a solder processing apparatus) according to the present embodiment. FIG. 2 is a plan view of the soldering apparatus A shown in FIG. It is sectional drawing at the time of cut | disconnecting by the plane which spreads in the top and bottom and right and left. In FIG. 1, a part of the support portion 1 is cut and displayed in consideration of the visibility of the drawing.

  The soldering apparatus A is an apparatus for supplying the thread solder W from above and soldering the wiring board Bd and the electronic component Ep disposed below the soldering iron Sa using the soldering iron Sa provided at the lower part. . As shown in FIGS. 1 and 2, the soldering apparatus A includes a support portion 1, a cutter unit 2, a driving mechanism 3, a solder feeding mechanism 6, and a soldering iron Sa. Although not shown in FIGS. 1 and 2, the soldering apparatus A also includes a nitrogen / oxygen gas generator 90 (see FIG. 5) and each part 100a (see FIG. 7) forming a ventilation control body. Is provided.

  The soldering apparatus A supplies the molten solder to the lands Ld of the wiring board Bd attached to the jig Gj and the terminals of the electronic component Ep arranged on the wiring board Bd, and performs connection fixing. The soldering apparatus A is configured to be movable in each direction including up, down, left, and right.

  The support portion 1 includes a flat plate-like wall body 11 that is erected. The cutter unit 2 is for cutting the thread solder W fed by the solder feeding mechanism 6 into solder pieces having a predetermined length. The cutter unit 2 includes a cutter lower blade 22 fixed to the sliding guide 13, and a cutter upper blade 21 that is disposed above the cutter lower blade 22 and is slidably disposed. Further, the cutter unit 2 includes a pusher pin 23 that is driven in a vertical direction (a direction intersecting the sliding direction of the cutter upper blade 21) by a second actuator 32 described later of the drive mechanism 3 (see FIG. 2). ).

  As shown in FIG. 2, the cutter upper blade 21 is an upper blade hole 211 that is a through hole into which the thread solder W fed by the solder feeding mechanism 6 is inserted, and a through hole into which the pusher pin 23 is inserted. Pin hole 212 is provided. The lower edge of the upper blade hole 211 is formed in a cutting edge shape.

  The cutter lower blade 22 includes a lower blade hole 221 that is a through hole into which the thread solder W penetrating the upper blade hole 211 is inserted. The edge part of the upper end of the lower blade hole 221 is formed in a cutting blade shape. The upper blade hole 211 and the lower blade hole 221 are displaced in a direction intersecting with the thread solder W in a state where the thread solder W is inserted, so that the thread solder W is cut into solder pieces by the mutual cutting blades.

  The upper blade hole 211 and the pin hole 212 are provided side by side in the sliding direction of the cutter upper blade 21. The cutter upper blade 21 slides between a position where the upper blade hole 211 and the lower blade hole 221 overlap vertically and a position where the pin hole 212 and the lower blade hole 221 overlap vertically.

  As shown in FIG. 2, the drive mechanism 3 includes a first actuator 31 that is fixed to the cutter lower blade 22 and slides the cutter upper blade 21, and a second actuator that is attached to the cutter upper blade 21 and drives the pusher pin 23. 32.

  The first actuator 31 includes a cylinder 311 fixed to the cutter lower blade 22 and a piston rod 312 that is disposed inside the cylinder 311 and expands and contracts by the pressure of supplied air. The tip portion of the piston rod 312 is fixed to the cutter upper blade 21, and the cutter upper blade 21 slides by the expansion and contraction of the piston rod 312.

  In the soldering apparatus A shown in FIG. 2, when the piston rod 312 of the first actuator 31 protrudes most from the cylinder 311, the cutter upper blade 21 is at the left end in the drawing, and the upper blade hole 211 is connected to the lower blade hole 221. It is designed to overlap vertically. As shown in FIG. 3, when the piston rod 312 is housed in the cylinder 311, the cutter upper blade 21 moves to the right end in the figure, and the pin hole 212 overlaps the lower blade hole 221.

  The second actuator 32 includes a cylinder 321 fixed to the cutter upper blade 21 and a piston rod 322 that is disposed inside the cylinder 321 and expands and contracts by air pressure. A pusher pin 23 is fixed to the tip of the piston rod 322.

  When the pin hole 212 and the lower blade hole 221 overlap each other, the second actuator 32 extends the piston rod 322 so that the pusher pin 23 is inserted into the lower blade hole 221 and the piston rod 322 is moved. The pusher pin 23 is removed from the lower blade hole 221 by being accommodated in the cylinder 321. Even when the solder piece cut by the cutter unit 2 remains in the lower blade hole 221, it is pushed out by the operation of the pusher pin 23.

  The solder feed mechanism 6 supplies the thread solder W, and includes a pair of feed rollers 61 that feed the thread solder W and a guide tube 62 that guides the thread solder W fed by the feed roller 61. The pair of feed rollers 61 is attached to the support portion 1, sandwiches the thread solder W, and rotates to feed the thread solder W downward. The feed roller 61 determines the length of the fed solder wire according to the rotation angle (number of rotations).

  The guide tube 62 is a tube body that can be elastically deformed, and its upper end is disposed in the vicinity of a portion of the feed roller 61 where the thread solder W is fed out. The lower end of the guide tube 62 moves following the sliding of the cutter upper blade 21 and is connected to the upper blade hole 211. The guide tube 62 is provided so as not to be pulled or stretched within a range in which the cutter upper blade 21 slides.

  A ventilation path 225 for sending nitrogen and air into the lower blade hole 221 is provided below the lower cutter blade 22. As shown in FIGS. 1 and 2, the solder iron Sa is fixed below the cutter unit 2. Details of the soldering iron Sa will be described below.

  The soldering iron Sa includes a heater unit 4 and a soldering tip 5 attached to the heater unit 4. As shown in FIG. 2, the heater unit 4 includes a heater 41 that generates heat when energized, a heater block 42 for attaching the heater 41, and a heater block holding portion 43 that holds the heater block 42.

  The heater block 42 has a cylindrical shape, and the heater 41 is wound around the outer peripheral surface. The heater block 42 includes a recess 421 having a circular cross section for attaching the tip 5 to the lower end portion in the axial direction, and a solder supply hole 422 penetrating from the center of the bottom of the recess 421 to the opposite side.

  The heater block holding part 43 is provided with a through hole formed in a flat body part. The heater block 42 is held by the heater block holding portion 43 by press-fitting the heater block 42 into the through hole. By attaching the heater block holding portion 43 to the support portion 1, the solder iron Sa is fixed to the support portion 1. As shown in FIG. 2, the lower blade hole 221 of the cutter lower blade 22 communicates with the solder supply hole 422 of the heater block 42.

  The tip 5 is a non-wetting member with respect to the solder and has a cylindrical shape extending in the vertical direction (axial direction). A solder hole 51 extending in the axial direction is formed in the central portion of the tip 5. The tip 5 is preferably made of a material having a high thermal conductivity, for example, a ceramic such as silicon carbide or aluminum nitride, or a metal such as tungsten.

  The tip 5 can be attached to and detached from the main body of the soldering iron Sa, and when it is attached, the upper part is inserted into the recess 421 of the heater block 42 and the lower end protrudes downward from the heater block 42. In this state, the solder hole 51 of the tip 5 and the solder supply hole 421 communicate with each other. The thread solder cut by the cutter unit 2 is supplied from the lower blade hole 221 to the solder hole 51 through the solder supply hole 421.

  When performing soldering with the soldering iron Sa, the heat of the heater 41 is transmitted through the heater block 42, and the solder pieces supplied to the solder holes 51 are melted by the heat. According to the soldering apparatus A, it is possible to perform soldering in a state in which the tip of the cylindrical tip 5 is in contact with the land Ld of the wiring board Bd. Thereby, it is possible to suppress scattering of solder, flux fume and the like.

  The solder iron Sa is provided with a first thermocouple 71 (hereinafter also referred to as “temperature detection means”) arranged to detect the temperature of the iron tip 5. The detection result of the temperature of the tip 5 by the temperature detection means is used as information for appropriately controlling the heating by the heater 41 so that the solder pieces can be melted and soldered. Further, the detection result of the temperature of the tip 5 by the temperature detecting means is also used for controlling the heating by the heater 41 in the cleaning process described later.

  The soldering iron Sa is also provided with a second thermocouple 72 arranged to detect the temperature of the heater block 42, and is used for the purpose of controlling the heating by the heater 41 with higher accuracy. In addition, installation of the 2nd thermocouple 72 may be abbreviate | omitted and means other than a thermocouple may be utilized as a means to detect the temperature of the tip 5.

  Further, as shown in FIG. 5, a nitrogen / oxygen gas generating device 90 (one form of the gas generating device) provided in the soldering apparatus A includes a compressed air inlet 91, an air dryer 92, an air filter (0.3 μm). 93, a pressure regulator 94 having a mist filter (0.01 μm), a stop valve 95, two digital flow meters (96a, 96b), and two discharge ports (97a, 97b) are provided.

  Compressed air flows into the compressed air inlet 91 from the outside. Compressed air that has flowed into the compressed air inlet 91 passes through an air dryer 92 and an air filter 93 in this order, and the main body of the nitrogen / oxygen gas generator 90 (a substantially rectangular parallelepiped shown on the right side of FIG. 5) is processed as compressed air P1. Device).

  In this main body, a pressure regulator 94 having a mist filter, a gas separator, and the like are provided. FIG. 6 shows a configuration example of the gas separator 98. The gas separator 98 shown in this figure has a hollow fiber membrane (hollow fiber separation membrane) 98a using a polyimide hollow fiber as a nitrogen-rich membrane. The hollow fiber membrane 98a utilizes the property that the hollow fiber is more permeable to oxygen than nitrogen in the air, so that the nitrogen-rich gas (high-concentration nitrogen gas having a higher nitrogen concentration than air) and the oxygen-rich gas (oxygen than air). It plays a role of separating high concentration oxygen gas).

  As shown in FIG. 6, oxygen selectively permeates through the membrane while the compressed air P1 flows inside the hollow fiber. As a result, what has mainly permeated the membrane is obtained as oxygen-rich gas, and what has reached the outlet of the hollow fiber membrane 98a without permeating is obtained as nitrogen-rich gas. The nitrogen / oxygen gas generator 90 having the gas separator 98 can separate supplied air (compressed air P1) to generate oxygen-rich gas and nitrogen-rich gas.

  Further, a stop valve 95 that opens and closes a path (pipe, etc.) connecting the compressed air P1 and the gas separator 98 is provided in the main body of the nitrogen / oxygen gas generator 90. Further, in the main body, there are provided paths through which compressed air P1, nitrogen-rich gas, and oxygen-rich gas are passed, and valves that enable opening and closing control are also provided for each of these paths. As a result, the nitrogen / oxygen gas generator 90 can selectively generate and output nitrogen-rich gas, oxygen-rich gas, and high-pressure air (air blowing air).

  The main body of the nitrogen / oxygen gas generator 90 is provided with a digital flow meter 96a for detecting the flow rate of nitrogen-rich gas and a digital flow meter 96b for detecting the flow rate of oxygen-rich gas or high-pressure air. It can be controlled. The generated nitrogen-rich gas, oxygen-rich gas, or high-pressure air can be discharged from the discharge ports (97a, 97b) to the ventilation path 225 side.

  The soldering apparatus A is provided with a control mechanism CS (not shown) for controlling various operations so that the apparatus functions normally. The control mechanism CS includes a logic circuit such as an MPU or CPU, and has a function of controlling the first actuator 31, the second actuator 32, the heater 41, the roller 61, the nitrogen / oxygen gas generator 90, and the like. . The control mechanism CS also has a function of controlling the movement of the soldering apparatus A (including the soldering iron Sa), and can continuously acquire the detection result of the temperature detection means.

  The control mechanism CS controls each part so that soldering is appropriately performed. More specifically, the control mechanism CS is used to perform a soldering process for performing soldering using the solder pieces supplied into the tip 5 and to remove dross and the like attached to the tip 5. Each part of the soldering apparatus A is controlled so that the cleaning process is appropriately performed.

  The soldering process includes a melting process for melting the solder pieces in the tip 5, and the cleaning process includes an incineration process for incinerating deposits attached to the tip 5 through the melting process. . Hereinafter, the contents of the soldering process and the cleaning process will be described more specifically.

[Soldering process]
During the soldering process, the control mechanism CS moves the solder iron Sa so that the tip of the iron tip 5 approaches (or comes into contact with) the wiring board Bd. Thereafter, the control mechanism CS controls the roller 61 and the actuators (31, 32) so that the solder pieces are cut out from the thread solder W so that the solder pieces are supplied into the tip 5.

The control mechanism CS controls the heating by the heater 41 so that the solder pieces are melted.
Soldering using the solder pieces is achieved on the wiring board Bd. At this time, the control mechanism CS controls the heating by the heater 41 so that the temperature of the tip 5 is about 400 ° C., for example. As described above, the soldering apparatus A is formed so as to perform the melting process with the tip of the tip 5 in contact with or close to the wiring board Bd and supply the molten solder onto the wiring board Bd.

  At this time, the control mechanism CS controls the nitrogen / oxygen gas generator 90 so as to supply the nitrogen-rich gas into the tip 5. As a result, the nitrogen / oxygen gas generator 90 ventilates the nitrogen-rich gas into the tip 5 when performing the melting process. In addition, the ventilation volume in this case is set to the quantity which can suppress the raise of flux fume (smoke). Since nitrogen is an inert gas, it does not promote solder oxidation, and the ventilation does not hinder the soldering process.

[Cleaning process]
For example, the cleaning process may be performed at a predetermined cycle, or may be performed every time the soldering process is performed a predetermined number of times. Note that before performing the cleaning process, the control mechanism CS moves the solder iron Sa to a position above the soldering process. Furthermore, it is preferable to move either the substrate Bd or the soldering apparatus A to the left or right so that the incinerated dross does not fall on the substrate Bd. The flow of the cleaning process will be described below with reference to the flowchart shown in FIG.

  In the cleaning process, first, the control mechanism CS shifts the soldering apparatus A to the cleaning operation state (step S1). That is, the control mechanism CS performs (1) control for starting high-temperature heating by the heater 41, (2) control for starting ventilation of oxygen-rich gas into the tip 5 and (3) control for setting the ventilation control body. Do. The controls (1) to (3) will be described in more detail below.

(1) Control for starting high-temperature heating by heater 41 The control mechanism CS starts heating by the heater 41 in order to raise the temperature of the tip 5. At this time, the control mechanism CS raises the temperature of the heater 41 as compared with the melting process in the soldering process described above. As a result, the heating of the tip 5 is strengthened compared to when the melting process is performed, and the dross adhering to the tip 5 is incinerated more quickly (shortening the time required for the incineration process). It is possible to increase the operating efficiency.

  Regarding the incineration temperature of the carbon contained in the dross, for example, the carbon can be incinerated when the temperature of the tip 5 is about 400 ° C. or higher, but if it is about 430 ° C., the carbon can be incinerated in about 5 to 6 minutes. Further, if the temperature is about 500 ° C., it can be incinerated in about 1-2 minutes. When it is desired to suppress the cleaning process to about 1 minute, it is desirable to control the heating by the heater 41 so that the tip 5 becomes 500 ° C. or higher, for example.

(2) Control for starting ventilation of oxygen-rich gas into the tip 5 In the soldering apparatus A, the heater 41 is provided above the tip 5 extending in the vertical direction, and the heat generated by the heater 41 is downward. The tip 5 is heated by being transmitted to the tip 5. Therefore, the control mechanism CS controls the nitrogen / oxygen gas generator 90 so as to supply the oxygen-rich gas into the tip 5.

  As a result, the nitrogen / oxygen gas generator 90 ventilates the oxygen-rich gas into the tip 5 when performing the incineration process. As a result, ventilation from the top to the bottom starts in the tip 5 and heat can be transferred from the heater 41 to the tip 5 more efficiently, so that the temperature rise of the tip 5 can be further accelerated. It is.

  Further, since oxygen-rich gas is used for ventilation at this time, combustion of dross is promoted as compared with the case of using ordinary air. Therefore, dross combustion is effectively performed even with a small amount of air flow, and dross incineration removal can be achieved more reliably.

  For reference, the graph of FIG. 8 shows the results of an experimental investigation of the relationship between the oxygen concentration of the gas to be passed and the deposit (drosse) incineration time with the set temperature of the heater 41 being 500 ° C. In this graph, the horizontal axis indicates the oxygen concentration (%) of the gas to be ventilated, and the vertical axis indicates the incineration time (min) of the deposit. The solid line graph shows the relationship when the air flow rate is 0.2 L / min, and the broken line graph shows the relationship when the air flow rate is 0.4 L / min.

  As is apparent from the graph of FIG. 8, the incineration time is shortened as the oxygen concentration increases regardless of the amount of ventilation. In addition, it is possible to reduce the incineration time by simply ventilating normal air (the oxygen concentration is about 21%), compared to the case of not ventilating, but by ventilating a gas with a higher oxygen concentration, As described above, the incineration time can be shortened. The nitrogen / oxygen gas generator 90 of the present embodiment is appropriately configured so as to generate an oxygen-rich gas having an oxygen concentration (for example, about 30 to 50%) that sufficiently assists the combustion of dross.

  Note that the nitrogen / oxygen gas generator 90 performs ventilation into the tip 5 between the melting process (when nitrogen-rich gas is ventilated) and the incineration process (when oxygen-rich gas is ventilated). The flow rate may be changed. For example, when nitrogen-rich gas is ventilated, an optimal flow rate may be used from the viewpoint of suppressing an increase in flux vaporization, and when oxygen-rich gas is ventilated, an optimal flow rate may be used from the viewpoint of heat transfer. In general, the flow rate when the oxygen-rich gas is vented is smaller than the flow rate when the nitrogen-rich gas is ventilated.

(3) Control of setting ventilation control body By the above-described ventilation in the tip 5, the tip 5 can be efficiently heated mainly from the inner surface side. Furthermore, in the present embodiment, the bottomed cylindrical (container type) ventilation control body 100 extends from the periphery of the tip 5 to the lower side so as to further accelerate the temperature rise of the tip 5 using this ventilation. It is set so as to cover (see FIG. 7B). The configuration and usage of the ventilation control body will be described below with reference to FIG.

  FIG. 7A shows a state before the ventilation control body 100 is set. The ventilation control body 100 can be divided into left and right parts 100a which are divided in half. As described above, the ventilation control body 100 can be divided in the left-right direction (direction orthogonal to the up-down direction), and the control mechanism CS can control the positions of the divided left and right portions 100a. These left and right parts 100a stand by at positions away from the left and right sides of the soldering iron Sa so that the soldering process is not hindered during normal times.

  When the incineration process is performed in the cleaning process, the control mechanism CS determines each part 100a of the ventilation control body divided into left and right in the direction indicated by the white arrow in FIG. 7A (the direction toward the tip 5). Move to. Thereby, as shown in FIG.7 (b), each part 100a of the divided ventilation control body couple | bonds, and the bottomed cylindrical ventilation control body 100 is formed. In this embodiment, since the ventilation control body 100 is formed in such a form, it is possible to use the ventilation control body 100 when necessary while preventing the ventilation control body 100 from obstructing the soldering process. .

  The ventilation control body 100 is arrange | positioned so that the circumference | surroundings of the tip 5 may be covered as shown in FIG.7 (b) (a container was covered on the tip 5 from the downward direction). Therefore, when the air in the tip 5 is ventilated, the high-temperature air discharged from the lower end of the tip 5 moves upward along the outer wall of the tip 5 as shown by a dotted arrow in FIG. Head. Thereby, the temperature rise of the tip 5 can be further accelerated using the said ventilation.

  Note that the ventilation control body 100 has a member (in this embodiment, a reflection member) that increases the heat reflectivity on the bottomed cylindrical inner surface formed by the heat insulating material 101, as shown in the broken line frame in FIG. A plate 102) is provided. Therefore, the tip 5 can be more efficiently heated using ventilation, and the temperature rise of the tip 5 can be accelerated.

  Moreover, since the ventilation control body 100 is arrange | positioned like the cover on the tip 5 from the downward direction, it is possible to receive the dross peeled in the cleaning process on the bottom surface. Thereby, it is possible to prevent the peeled-off dross from being scattered and to collect the dross briefly later.

  Returning to FIG. 4, after performing the control of step S <b> 1, the control mechanism CS performs heating and ventilation by the heater 41 until a predetermined condition regarding heating (a condition in which incineration of dross attached to the tip 5 is expected to be incinerated) is satisfied. It is made to continue (step S2). The content of the predetermined condition is not particularly limited as long as dross incineration can be appropriately achieved.

  For example, if it is known that dross attached to the tip 5 is almost completely incinerated when a temperature of 500 ° C. or higher is maintained for 2 minutes, a predetermined condition may be set based on this. That is, in this case, the time when the temperature detected by the temperature detecting means is 500 ° C. or higher is measured, and heating and ventilation are continued until the condition “the measurement time has reached 2 minutes” is satisfied. May be.

  Moreover, when the heating time required to incinerate the dross is known in advance, the heating execution time by the heater 41 may be controlled. For example, if it is empirically found that dross is incinerated about 15 minutes after the start of heating, the execution time of the heater 41 is controlled to 15 minutes (that is, the heating is stopped 15 minutes after the start of heating). You may do it.

  When the above-described predetermined condition is satisfied (Yes in step S2), the control mechanism CS ends the heating by the heater 41. Then, the control mechanism CS controls the nitrogen / oxygen gas generator 90 so as to supply high-pressure air into the tip 5. That is, the control mechanism CS controls the nitrogen / oxygen gas generator 90 so that air blowing with a higher air volume is performed in the tip 5 (step S3). Thus, after the incineration process is completed, high-pressure air is ventilated into the tip 5.

  The dross attached to the tip 5 may still be attached to the tip 5 in an incinerated state. Therefore, in the process of step S3, this is blown off by air blow so that dross is completely removed. Incinerated dross has almost no adhesive force and can be easily removed by applying a gas.

  When the process of step S3 is completed, the air blow is stopped and the ventilation control body 100 is divided again into left and right and moved to a position away from the tip 5. This movement may be performed before the process of step S3 is started. When the processing up to this point is completed, the current cleaning process ends.

  As described above, the soldering apparatus A according to the present embodiment includes the soldering iron Sa having the cylindrical iron tip 5, and melts the solder pieces in the iron tip 5 by heating the iron tip 5. An incineration process is performed to incinerate deposits attached to the tip 5 through the process and the melting process. And the soldering apparatus A ventilates the gas containing oxygen in the tip 5 when performing this incineration process.

  Therefore, according to the soldering apparatus A, for example, it is possible to remove the deposits more efficiently than when a method of scraping off the deposits using a drill is employed. In addition, compared with the case where the tip 5 is simply heated and the deposit is burned, the burning of the deposit is promoted by ventilating the gas containing oxygen, so that the deposit can be removed more efficiently. In particular, in the present embodiment, since the oxygen-rich gas having a higher oxygen concentration than air is ventilated, it is possible to remove the deposits more efficiently than when air is ventilated.

  In the present embodiment, the heating of the tip 5 in the melting process in the soldering process and the heating of the tip 5 in the incineration process in the cleaning process are performed by the same heater 41 provided on the soldering iron Sa. Since the heating means (heater) is shared in this way, the configuration of the soldering apparatus A is simplified accordingly. However, the heating of the tip 5 in the melting process and the heating of the tip 5 in the incineration process may be performed by each separately provided heating means. In this case, each heating means can be configured to be optimized for the corresponding application.

  In addition, although the soldering apparatus A of this embodiment is provided with the one soldering iron Sa, it is good also as a structure provided with the 2 or more soldering iron Sa. In particular, in the case of a configuration (one head type) provided with one solder rod Sa, the length of time of the cleaning process greatly affects the soldering work efficiency (the number of times soldering can be performed per unit time). Therefore, it is highly desirable that the heating of the tip 5 can be promoted by using the above-described ventilation or ventilation control body 100 and the cleaning process can be completed in a short time.

  Further, for example, in a configuration including two solder rods Sa (two-head type), when each solder rod Sa performs soldering alternately, one solder rod Sa is used for the soldering process. In the meantime, the cleaning process may be performed on the other solder iron Sa. In this case, the incineration process is alternately performed in the two soldering irons Sa, which is preferable from the viewpoint of shortening the tact time. Also in this case, it is possible to improve the soldering work efficiency by completing the cleaning process for each solder iron Sa in as short a time as possible.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to this content. The embodiments of the present invention can be variously modified without departing from the spirit of the invention.

  The present invention is applicable to, for example, a solder processing apparatus that automatically performs soldering.

DESCRIPTION OF SYMBOLS 1 Support part 11 Wall body 13 Sliding guide 2 Cutter unit 21 Cutter upper blade 211 Upper blade hole 212 Pin hole 22 Cutter lower blade 221 Lower blade hole 23 Pusher pin 3 Drive mechanism 31 1st actuator 311 Cylinder 312 Piston rod 32 2nd Actuator 321 Cylinder 322 Piston rod 4 Heater unit 41 Heater (heating means)
42 Heater block 421 Recessed part 422 Solder supply hole 43 Heater block holding part 5 Tip 51 Solder hole 6 Solder feed mechanism 61 Feed roller 62 Guide pipe 71 First thermocouple 72 Second thermocouple 90 Nitrogen / oxygen gas generator (gas generation apparatus)
100 Ventilation Control Body 100a Each Part A of Divided Ventilation Control Body A Soldering Device Sa Soldering W W Yarn Solder Bd Wiring Board Ep Electronic Component Ld Land

Claims (13)

A soldering iron having a substantially cylindrical tip is provided,
A solder processing apparatus for performing a melting process for melting a solder piece in the tip by heating the tip, and an incineration process for incinerating deposits attached to the tip through the melting process. ,
When performing the incineration process, a gas containing oxygen is passed through the tip, and the gas has a higher oxygen concentration than when performing the melting process . A soldering iron having a substantially cylindrical tip is provided,
A solder processing apparatus for performing a melting process for melting a solder piece in the tip by heating the tip, and an incineration process for incinerating deposits attached to the tip through the melting process. ,
When performing the incineration process, let the gas containing oxygen flow through the tip ,
After said incineration process is completed, soldering apparatus according to claim Rukoto is ventilated high-pressure air into the soldering tip. Comprising at least two soldering irons having a substantially cylindrical tip,
A solder processing apparatus for performing a melting process for melting a solder piece in the tip by heating the tip, and an incineration process for incinerating deposits attached to the tip through the melting process. ,
When performing the incineration process, let the gas containing oxygen flow through the tip ,
In the above two soldering iron, soldering apparatus wherein the incineration is characterized Rukoto alternately performed. The solder processing apparatus according to claim 1 , wherein a high-concentration oxygen gas having a higher oxygen concentration than air is used as the gas. A gas generator for generating the high-concentration oxygen gas using the supplied air;
The gas generator is
The solder processing apparatus according to claim 4 , wherein the high-concentration oxygen gas is ventilated into the tip when performing the incineration process. The gas generator is
The solder processing apparatus according to claim 5 , wherein the supplied air can be separated to generate the high-concentration oxygen gas and a high-concentration nitrogen gas having a higher nitrogen concentration than air. The gas generator is
The solder processing apparatus according to claim 6 , wherein the high-concentration nitrogen gas is ventilated into the tip when performing the melting process. The gas generator is
The solder processing apparatus according to claim 7 , wherein a flow rate of ventilation into the tip is changed between when the melting process is performed and when the incineration process is performed. The solder processing apparatus according to claim 1 or 3 , wherein high-pressure air is ventilated into the tip after the incineration process is completed. The solder processing apparatus according to any one of claims 1 to 9 , wherein the heating of the tip in the melting process and the heating of the tip in the incineration process are performed by the same heater provided in the soldering iron. . The lower end of the tip extending in the vertical direction performs the melting process in a state where the tip is in contact with or close to the substrate
Soldering apparatus according to any one of claims 10 to molten solder claim 1 which is formed so as to supply to the substrate. The solder processing apparatus according to claim 11 , wherein when performing the incineration process, a bottomed cylindrical ventilation control body is arranged so as to cover from the periphery of the tip to the lower side. Comprising at least two soldering irons;
The solder processing apparatus according to claim 1, wherein the incineration process is alternately performed in the two soldering irons.