JP2012051020A - Soldering iron device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering iron device which can perform soldering easily without damaging electronic components even when using lead-free solder, and at the same time, to actualize the soldering iron device with a simple structure.SOLUTION: The soldering iron device includes a soldering iron 1 in which a heater 5 and an outlet 1b are provided, a temperature sensor 10 which measures the temperature of a predetermined position set in the vicinity of the front end of the soldering iron tip 1a, a hot air generator 6 which blows hot air from the outlet 1b, a controller 2 to which the soldering iron 1 is connected, and a notification means 12 which performs predetermined notification. In the controller 2, a temperature comparator 13 detects the completion of preheating, when the temperature measured by the temperature sensor 10 exceeds a predetermined first setting temperature. When the completion of the preheating is detected by the temperature comparator 13, an operation control portion 15 makes the notification means 12 notify that effect.

Description

  The present invention relates to a soldering iron device used when soldering an electronic component to a substrate or the like.

  The soldering iron device replaces an electronic component when, for example, a part of the electronic component mounted on the board has deteriorated due to a failure or a lifetime, or when a defect is found in the mounting of the electronic component. Used for. That is, the engineer uses the soldering iron device to remove only the electronic component in which a failure or the like has occurred from the board and attach a new electronic component to the same location.

  As a prior art of such a soldering iron device, for example, a soldering iron tip temperature that has been detected by detecting the soldering iron tip temperature is proposed. (See Patent Document 1).

JP-A-61-37368

  In recent years, lead-free solder, which has become mainstream, has a higher melting point and poor wettability than conventional tin-lead solder. For this reason, when lead-free solder is used, the replacement of electronic components using a soldering iron device becomes more difficult, and electronic components that are newly attached to the board are broken during the mounting operation. It was easy for a trouble to occur. In particular, if the chip component is subjected to rapid heating, distortion due to a temperature difference is generated and a crack is generated.

  For this reason, when using the soldering iron device described in Patent Document 1, for example, in a site where lead-free solder is used to replace an electronic component, a separate device such as a heater is prepared and the electronic component and its After preheating the mounting part (substrate) and warming the part for an appropriate time, the electronic parts are joined. For this reason, there is a problem that an apparatus necessary for soldering becomes large, and the operation such as temperature management during preheating becomes very complicated.

  The present invention has been made to solve the above-described problems, and its purpose is to perform soldering easily without damaging electronic components even when lead-free solder is used. A soldering iron device that can be realized with a simple configuration.

  A soldering iron device according to the present invention includes a heater provided therein, a soldering iron provided with a blowout port at the tip, and a predetermined set provided in the vicinity of the tip of the tip. A temperature sensor for measuring the temperature of the position, a hot air generator for blowing hot air from the outlet toward the predetermined position, a control device to which the soldering iron is connected, and a user of the soldering iron And a control unit for comparing the temperature measured by the temperature sensor with a predetermined first set temperature, and the temperature measured by the temperature sensor is the first set temperature. A temperature comparison unit that detects the completion of preheating and an operation control unit that notifies the fact from the notification means when the completion of preheating is detected by the temperature comparison unit.

  With the soldering iron apparatus according to the present invention, even when lead-free solder is used, soldering can be easily performed without damaging electronic components. In addition, a soldering iron device can be realized with a simple configuration.

It is a perspective view which shows the soldering iron apparatus in Embodiment 1 of this invention. It is a principal part enlarged view of the soldering iron apparatus shown in FIG. It is a block diagram which shows the soldering iron apparatus in Embodiment 1 of this invention. It is a flowchart which shows operation | movement of the soldering iron apparatus in Embodiment 1 of this invention.

  In order to explain the present invention in more detail, it will be described with reference to the accompanying drawings. In addition, in each figure, the same code | symbol is attached | subjected to the part which is the same or it corresponds, The duplication description is simplified or abbreviate | omitted suitably.

Embodiment 1 FIG.
1 is a perspective view showing a soldering iron apparatus according to Embodiment 1 of the present invention, FIG. 2 is an enlarged view of a main part of the soldering iron apparatus shown in FIG. 1, and FIG. 3 is a soldering iron according to Embodiment 1 of the present invention. FIG.

  1 to 3, 1 is a soldering iron, 2 is a control device, 3 is a signal line connected between the soldering iron 1 and the control device 2, and 4 is a connection between the soldering iron 1 and the control device 2. It is a blower pipe connected between them. The soldering iron 1 is for melting the solder by the tip 1a, and a heater 5 is provided inside. That is, when the heater 5 generates heat under the control of the control device 2, the tip 1a is heated to a temperature at which the solder can be melted.

  In addition, the tip 1a of the soldering iron 1 is provided with an air outlet 1b. The hot air generator 6 is for blowing hot air from the outlet 1b to the electronic component 8 to be soldered to the substrate 7 and its mounting portion (for example, a land portion of the substrate 7). That is, the hot air generator 6 blows hot air toward a predetermined position (a certain range including the predetermined position) set near the tip of the tip 1a.

In the present embodiment, as the hot air generating device 6, an example in which a blower (not shown) is built in the control device 2 and a nozzle 9 is installed in the soldering iron 1 is shown as an example. In this hot air generator 6, by sending the wind from the blower to the soldering iron 1 side through the blower pipe 4, the sent wind is discharged from the blowout port 1 b formed in the nozzle 9. Yes.
In addition, the hot air generator 6 may be provided only in the soldering iron 1 as long as it can be provided with the above function.

  The hot air generator 6 may be provided with a heater or the like for heating air separately from the heater 5, but for example, as shown in FIG. 2, the nozzle 9 is surrounded by the tip 1a. By arrange | positioning, you may discharge | emit from the blower outlet 1b, after warming the wind sent from the air blower with the tip 1a (namely, with the heater 5). With such a configuration, it is not necessary to provide a heating device such as a heater in the hot air generator 6 itself, and the configuration can be further simplified.

  Reference numeral 10 is a temperature sensor, and 11 is a laser pointer. The temperature sensor 10 and the laser pointer 11 are provided on the soldering iron 1, and are disposed, for example, on a mount portion 1c protruding from the tip 1a.

The temperature sensor 10 is for detecting the temperature of the electronic component 8 to be soldered to the substrate 7 and its mounting portion. For example, the temperature sensor 10 is configured to measure the temperature at the predetermined position in the vicinity of the tip of the tip 1a.
The laser pointer 11 is for indicating the predetermined position, that is, the position where the temperature sensor 10 measures the temperature. The laser pointer 11 is disposed so as to be close to the temperature sensor 10, and irradiates laser light that passes through the predetermined position (or the vicinity thereof) from the mount portion 1c.

  Further, the present soldering iron apparatus is provided with a notifying means 12 for giving a predetermined notice to a person using the soldering iron 1. The notification unit 12 includes, for example, a display 12a, a lamp 12b, a buzzer (not shown), and the like provided in the control device 2. The notification means 12 performs necessary notifications by displaying characters on the display 12a, turning on the lamp 12b, changing its lighting color, ringing a buzzer, or the like. Note that the notification means 12 may be installed on the soldering iron 1 or may be installed on both the soldering iron 1 and the control device 2.

  The control device 2 has a function of controlling each device. For example, the control device 2 performs various controls based on information such as the temperature measured by the temperature sensor 10. The control device 2 includes a temperature comparison unit 13, a storage unit 14, and an operation control unit 15.

  The temperature comparison unit 13 has a function of detecting the completion of preheating and a predetermined overheating state based on the temperature measured by the temperature sensor 10. Specifically, the temperature comparison unit 13 compares the temperature measured by the temperature sensor 10 with the set temperature stored in advance in the storage unit 14 and performs the above detection. For example, the storage unit 14 stores in advance a predetermined first set temperature and a second set temperature that is a predetermined temperature higher than the first set temperature, and the temperature comparison unit 13 stores the temperature sensor 10. When the measured temperature by exceeds the first preset temperature, the completion of preheating is detected. Further, when the temperature measured by the temperature sensor 10 exceeds the second set temperature, the temperature comparison unit 13 detects a predetermined overheating state.

  In addition, you may comprise so that the said 1st preset temperature and 2nd preset temperature can be suitably set according to the electronic component 8 which solders. In such a case, for example, the temperature input from the temperature setting unit 16 is stored in the storage unit 14 as the first set temperature or the second set temperature.

  The operation control unit 15 has a function of controlling each of the heater 5, the warm air generator 6, the laser pointer 11, the notification unit 12, and the like based on the detection result of the temperature comparison unit 13. Hereinafter, the operation of the soldering iron apparatus (particularly, the operation control unit 15) having the above-described configuration will be specifically described with reference to FIG. FIG. 4 is a flowchart showing the operation of the soldering iron apparatus according to the first embodiment of the present invention.

  The control device 2 includes, for example, a power switch (not shown) that is operated when starting a soldering operation. When a person who solders the electronic component 8 (hereinafter, also simply referred to as “worker”) turns on the power switch, the operation control unit 15 includes the hot air generator 6, the heater 5, the laser pointer 11, and the temperature. Each operation of the sensor 10 is started (S101 to S104).

  Specifically, the operation control unit 15 starts the blowing of warm air toward a certain range including the predetermined position by operating the blower of the warm air generating device 6. Further, the operation control unit 15 starts energization to cause the heater 5 to generate heat and heat the tip 1a to a predetermined temperature for melting the solder. In the hot air generator 6 in the present embodiment, the blower operates and the tip 1a is heated, whereby hot air is supplied from the outlet 1b. Further, the operation control unit 15 irradiates laser light from the laser pointer 11 and starts measuring the temperature by the temperature sensor 10.

  In addition, before performing the soldering operation | work of the electronic component 8, an operator first performs the preheating operation | work which warms the electronic component 8 and its attachment part to predetermined temperature. The operator preheats the electronic component 8 and the like by applying the warm air blown from the air outlet 1b to the electronic component 8 and its mounting portion. At this time, the operator places the tip 1a of the soldering iron 1 toward the electronic component 8 and its mounting portion, and the light irradiated from the laser pointer 11 is at the same position (position of the electronic component 8 etc.). By adjusting to, the temperature measurement position of the temperature sensor 10 and the hot air blowing position from the outlet 1b can be appropriately matched with the predetermined position.

  When the operation is started in S104, the temperature sensor 10 measures the temperature at the predetermined position and outputs the measurement result to the control device 2. Then, the temperature comparison unit 13 compares the temperature measured by the temperature sensor 10 with the first set temperature stored in the storage unit 14, and determines whether or not preheating is completed (S105).

When the electronic component 8 or the like is warmed by the warm air from the air outlet 1b and the temperature measured by the temperature sensor 10 exceeds the first set temperature, the temperature comparison unit 13 detects completion of preheating (Yes in S105). . For example, when the electronic component 8 to be soldered to the substrate 7 is a chip component, the temperature comparison unit 13 detects the completion of preheating by satisfying the following formula.
(Temperature measured by temperature sensor 10)> ((set) temperature of tip 1a) −130 ° C.

  That is, when the temperature of the tip 1a is set to 260 ° C., the temperature comparison unit 13 detects completion of preheating when the temperature measured by the temperature sensor 10 reaches 130 ° C. Note that the temperature of 130 ° C. in the above equation is determined by the restrictions of the electronic component 8 and the like.

  When the completion of preheating is detected by the temperature comparison unit 13, the operation control unit 15 starts a predetermined process for causing the worker to perform a soldering operation. Specifically, when the completion of the preheating is detected by the temperature comparison unit 13, the operation control unit 15 notifies the notification unit 12 that the preheating is completed (S106). The operator can know that the preheating has been completed, that is, the soldering operation may be started, by hearing or watching the notification from the notification means 12.

  Moreover, the operation control part 15 will control the warm air generator 6 so that the warm air from the blower outlet 1b stops or weakens, if the completion of preheating is detected by the temperature comparison part 13 (S107). For example, the operation control unit 15 stops the blower of the hot air generating device 6 so that the hot air is not discharged from the outlet 1b. When the notification means 12 informs that the preheating has been completed, the worker brings the tip 1a of the soldering iron 1 into contact with the mounting portion of the electronic component 8 and melts the solder. At this time, if the hot air discharged from the air outlet 1b has a strong momentum, the molten solder may be scattered around. That is, such a situation can be prevented by the process of S107.

  Then, when the soldering of the electronic component 8 is finished, the worker turns off the power switch and finishes the operation.

  The temperature comparison unit 13 detects the completion of preheating in S105, and then compares the temperature measured by the temperature sensor 10 with the second set temperature stored in the storage unit 14, and the electronic component 8 or the like is determined in advance. It is determined whether or not it is in an overheated state (S108). When the temperature measured by the temperature sensor 10 exceeds the second set temperature because the temperature of the tip 1a is transmitted to the electronic component 8, etc., the temperature comparison unit 13 detects an overheated state (Yes in S108). . Then, the operation control unit 15 controls the heater 5 so that the temperature of the tip 1a is lowered when the temperature comparison unit 13 detects the overheating state (S109), and further indicates that the overheating state is present. The notification means 12 is notified (S110).

  Note that the notification unit 12 may perform the notification in S106 and S110 by changing the lighting method of the light emitted from the laser pointer 11 (for example, blinking the laser beam). The operator looks at the light from the laser pointer 11 and the tip 1a of the soldering iron 1 when performing preheating work or soldering work. For this reason, by notifying by the method of blinking the light from the laser pointer 11, the notification content can be reliably transmitted to the worker.

If it is a soldering iron apparatus of the above-mentioned composition, control at the time of preheating or completion of preheating can be performed easily and appropriately, and even when lead-free solder is used, without damaging the electronic component 8, Soldering can be performed at the optimum temperature. For this reason, the reliability with respect to the electronic component 8 and its joining can be improved, and the lifetime of the board | substrate 7 can be extended.
Further, if the soldering iron device has the above-described configuration, it is not necessary to prepare a separate device or the like for preheating, and the device can be miniaturized. For this reason, in both preheating and soldering operations, the workability can be greatly improved.

In addition, in this Embodiment, although the case where the blower outlet 1b was formed around the tip 1a was demonstrated, the structure of the blower outlet 1b is not limited to this. For example, the nozzle 9 may be installed on the mount 1c and the like, and hot air may be blown from the side of the tip 1a. Alternatively, a through hole that opens near the tip of the tip 1a may be formed in the tip 1a, and hot air may be blown from the through hole.
Even with such a configuration, it is possible to achieve the same effects as described above.

DESCRIPTION OF SYMBOLS 1 Soldering iron 1a Iron tip 1b Outlet 1c Mount part 2 Control apparatus 3 Signal line 4 Blow pipe 5 Heater 6 Hot air generator 7 Board | substrate 8 Electronic component 9 Nozzle 10 Temperature sensor 11 Laser pointer 12 Notification means 12a Indicator 12b Lamp 13 Temperature comparison unit 14 Storage unit 15 Operation control unit 16 Temperature setting unit

Claims (8)

A soldering iron with a heater inside and an outlet at the tip;
A temperature sensor for measuring a temperature at a predetermined position provided on the soldering iron and set near the tip of the tip;
A warm air generator for blowing warm air from the air outlet toward the predetermined position;
A control device to which the soldering iron is connected;
Informing means for making a predetermined notification to the user of the soldering iron,
With
The controller is
A temperature comparison unit that compares the temperature measured by the temperature sensor with a predetermined first set temperature, and detects completion of preheating when the temperature measured by the temperature sensor exceeds the first set temperature;
When completion of preheating is detected by the temperature comparison unit, an operation control unit for informing the fact from the notification unit,
A soldering iron device characterized by comprising:   The said operation control part controls the said warm air generator so that the warm air from the said blower outlet stops or weakens, when completion of preheating is detected by the said temperature comparison part. The soldering iron apparatus according to 1. The temperature comparison unit compares the temperature measured by the temperature sensor with a second set temperature that is a predetermined temperature higher than the first set temperature, and when the temperature measured by the temperature sensor exceeds the second set temperature Detects overheating condition,
The said operation control part controls the said heater so that the temperature of the said tip will fall, if the overheating state is detected by the said temperature comparison part, The Claim 1 or Claim 2 characterized by the above-mentioned. Soldering iron equipment.   4. The soldering iron device according to claim 3, wherein when the overheating state is detected by the temperature comparison unit, the operation control unit notifies the notification means to that effect. A laser pointer provided on the soldering iron for pointing to the predetermined position;
The soldering iron device according to any one of claims 1 to 4, further comprising:   6. The soldering iron apparatus according to claim 5, wherein the notification means performs notification by changing a lighting method of light emitted from the laser pointer. The warm air generator is
A blower provided in the control device;
A blower pipe connected between the control device and the soldering iron;
A nozzle provided on the soldering iron to form the air outlet;
With
The soldering iron device according to any one of claims 1 to 6, wherein the air from the blower is discharged from the outlet through the blower pipe.   The solder according to claim 7, wherein the nozzle warms the wind sent from the blower through the blower pipe at the tip of the soldering iron and discharges it from the blowout port. Trowel device.

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