JP7366785B2 - Soldering equipment and soldering method - Google Patents

Description

Application of Article 30, Paragraph 2 of the Patent Act (1) Test date: September 26, 2019 Test location: Experiment booth in the Japan Unix Co., Ltd. showroom (2-21-25 Akasaka, Minato-ku, Tokyo)

The present invention relates to a soldering device and a soldering method.

FIG. 7 shows a soldering device described in Patent Document 1 as a conventional example of a soldering device. This soldering device 10 includes a stage 11, a stage moving device 12 that moves the stage 11, a soldering head 13, a solder supply section 14, a movable stand 15 that holds the soldering head 13, a stage moving device 12, and a soldering head 13. A control unit 16 for controlling the operation of the soldering head 13 is provided.

The stage moving device 12 moves the stage 11 along the Y axis. On the other hand, the movable stand 15 holds the soldering head 13 above the stage 11, drives it along the Z axis, and moves the soldering head 13 along the X axis. For example, a printed circuit board S is placed on the stage 11 as a workpiece, and the soldering head 13 can be moved to any position on the printed circuit board S by the stage moving device 12 and the movable stand 15.

The solder supply unit 14 includes a reel 14a around which linear (thread-like) solder H is wound, a drawing device 14b that draws the solder H toward the soldering head 13, and the like.

FIG. 8 shows an enlarged view of the soldering head 13, and the soldering head 13 includes a soldering iron main body 21, an iron holder 22 that removably holds the soldering iron main body 21, and a retracting device 14b. A solder guiding part 23 that guides the solder H drawn in by the soldering iron body 21 to the tip 21a of the soldering iron main body 21, and a soldering iron movable part 24 that moves the soldering iron main body 21 held by the iron holder 22 up and down. We are prepared.

JP 2018-114519 Publication

By the way, in soldering, after melting the solder with a soldering iron and adhering a certain amount of molten solder to the tip, the soldering iron is moved to the part to be soldered, and the molten solder adhering to the tip is removed. A two-step method of soldering is also performed, in which soldering is performed using solder.In such two-step method of soldering, in order to shorten and simplify the process, solder is generally placed directly above the components to be soldered. The solder is melted by placing a soldering iron thereon.

However, when the solder melts, the flux contained in the solder bumps and the molten solder becomes solder balls that scatter around the surroundings. If this occurs, the scattered solder balls may adhere to or enter between the wiring or terminals of the component, causing short circuits.

In this respect, the conventional soldering apparatus 10 shown in FIGS. 7 and 8 does not have an effective means for preventing the occurrence of short circuits due to adhesion or intrusion of scattered solder balls.

SUMMARY OF THE INVENTION An object of the present invention is to provide a soldering device and a soldering method that can prevent problems such as short circuits caused by adhesion or intrusion of scattered solder balls.

According to the invention of claim 1, in the first step, the solder is melted with a soldering iron to adhere the molten solder to the iron tip, in the second step, the soldering iron is lowered, and in the third step, the molten solder is attached to the iron tip. In a soldering device that solders components with molten solder, a cover is positioned between the soldering iron tip and the component in the first step, and is displaced in the second step to allow the soldering iron to descend. shall be equipped with the following.

In the invention of claim 2, in the invention of claim 1, the cover is made up of a bottom plate and a peripheral wall, and in the first step, the bottom plate is located below the tip, and the peripheral wall surrounds the four sides of the tip to form a box shape. It is assumed that

In the invention according to claim 3, in the invention according to claim 2, the cover is made up of two parts that can be opened and closed left and right, and is configured to open left and right in the second step.

In the invention according to claim 4, in the invention according to claim 2, the cover is made horizontally movable, and a notch is provided in the peripheral wall through which the soldering tip and the nozzle for supplying solder to the soldering iron tip pass when the cover is moved laterally, In the second step, the cover is configured to move laterally.

According to a fifth aspect of the invention, in any one of claims 1 to 4, the cover is configured to be displaced mechanically in conjunction with the vertical movement of the soldering iron.

According to the invention of claim 6, the first step of melting the solder with a soldering iron and adhering the molten solder to the iron tip, the second step of lowering the soldering iron, and the step of melting the solder with the soldering iron and depositing the molten solder on the iron tip. A soldering method including a third step of soldering components, in which a cover is positioned between the iron tip and the component in the first step, and the cover is displaced in the second step to lower the soldering iron. possible.

According to this invention, since the cover can prevent the solder balls from scattering and the scattered solder balls from adhering to or entering the components, it is possible to prevent the occurrence of defects such as short circuits caused by the solder balls. After applying molten solder to the soldering iron tip, the soldering iron is lowered to perform soldering, thereby making it possible to successfully perform two-step soldering.

A is a partially schematic front view for explaining the configuration of main parts of Example 1 of the soldering device according to the present invention, and B is a front view showing a state in which the soldering iron is lowered from the state shown in A. . A is a partially omitted right side view of FIG. 1A, and B is a partially omitted right side view of FIG. 1B. A is a diagram for explaining the link mechanism in FIG. 1A, and B is a diagram showing a state when the soldering iron is lowered from the state shown in A. FIG. 3 is a front view for explaining the configuration of main parts of a second embodiment of the soldering device according to the present invention. A is a right side view of FIG. 4, and B is a right side view showing a state in which the soldering iron is lowered from the state shown in A. A is a right side view for explaining the main part configuration of a third embodiment of the soldering device according to the present invention, and B is a right side view showing a state in which the soldering iron is lowered from the state shown in A. FIG. 1 is a perspective view showing a conventional example of a soldering device. FIG. 8 is a diagram showing details of the soldering head in FIG. 7;

Embodiments of the present invention will be described by way of examples with reference to the drawings.

FIGS. 1A and 1B and FIGS. 2A and 2B show the main structure and operation of a first embodiment of a soldering device according to the present invention.

In this example, the soldering device melts the solder with the soldering iron in the first step and deposits a certain amount of molten solder on the iron tip, then lowers the soldering iron in the second step, and lowers the soldering iron in the third step. The components are soldered using the molten solder that has already been applied, that is, the soldering is performed in two steps.

1A and 2A show the state of the soldering device in the first step, and FIG. 1B and FIG. 2B show the state of the soldering device in the third step. In addition, the connector 31 and the electric wire 32 are shown together with a soldering device as parts to be soldered, taking as an example a case in which an electric wire is connected to a connector by soldering. In FIGS. 2A and 2B, 32a indicates the core wire of the electric wire 32, and the portion where the core wire 32a is located becomes the soldering portion 33.

In this example, the soldering iron is built into a soldering iron unit 40, and a tip 41 of the soldering iron protrudes downward from the lower end of the soldering iron unit 40. The solder supplied to the soldering iron tip 41 is thread solder, and a nozzle 52 attached to the tip of a thread solder supply guide 51 is located near the soldering iron tip 41. The solder thread is sent out from this nozzle 52 and supplied to the iron tip 41.

The thread solder supply guide 51 is attached and fixed to the soldering iron unit 40 via a nozzle height adjustment mechanism 53. The position (height position) of the nozzle 52 can be adjusted by a nozzle height adjustment mechanism 53, and the height position of the nozzle 52 is adjusted according to soldering conditions and the like.

In contrast to the above configuration, this example includes a link mechanism 70 that displaces the cover 60 and the cover 60 in conjunction with the vertical movement of the soldering iron, that is, the vertical movement of the soldering iron unit 40. Note that the link mechanism 70 is schematically shown in FIGS. 1A and 1B, and is not shown in FIGS. 2A and 2B.

The cover 60 is made up of two parts, a left cover 61 and a right cover 62, so that the cover 60 can be opened and closed left and right. The left cover 61 and the right cover 62 are meshed with each other and integrated as shown in FIG. 1A in the first step of melting the solder wire and attaching the molten solder to the tip 41, thereby closing the cover 60. In this state, the bottom plate 60a and the peripheral wall 60b form a box shape with an open top.

Note that notches 61b and 62b (see FIG. 1B) are provided in the side walls 61a and 62a of the left cover 61 and the right cover 62, which are engaged with each other and constitute one surface (in this example, the front surface) of the peripheral wall 60b of the cover 60. When the cover 60 is closed, these cutouts 61b and 62b form a window 63 as shown in FIG. 1A. A nozzle 52 for supplying thread solder to the soldering iron tip 41 is configured to pass through this window 63.

In the first step, the cover 60 has a box shape as described above, the bottom plate 60a is located below the tip 41, and the peripheral wall 60b is positioned so as to surround the front, back, left and right sides of the tip 41. The tip 41 is now accommodated within the cover 60. Therefore, the solder balls generated when the solder wire melts are prevented from scattering by the cover 60 and remain within the cover 60, so that adhesion or intrusion of the scattered solder balls may cause defects such as short circuits on the parts to be soldered. It is possible to solve problems such as the occurrence of Note that in FIG. 2A, illustration of the right cover 62 is omitted in order to clearly show the iron tip 41 and nozzle 52 housed in the cover 60, and illustration of the right cover 62 is similarly omitted in FIG. 2B. are doing.

The cover 60 is opened left and right in the second step to allow the soldering iron (soldering iron unit 40) to be lowered, and the soldering (third step) is performed with the cover 60 opened left and right as shown in FIG. 1B. process) is carried out. In this way, in this example, the cover 60 can be opened and closed, so the cover 60 does not interfere with the soldering work.

The cover 60 is opened and closed by a link mechanism 70 in conjunction with the vertical movement of the soldering iron unit 40. 3A and 3B show only the link mechanism 70 and cover 60 in FIGS. 1A and 1B, and the configuration and operation of the link mechanism 70 will be described below.

In FIG. 3A, 71 to 76 indicate links, and all adjacent links are joined by circular pairs. In FIG. 3A, 81 to 86 indicate link joints.

Arms 91 and 92 are attached and fixed outwardly to links 73 and 74 that extend in the vertical direction and face each other, and rollers 93 and 94 are attached to the tips of these arms 91 and 92, respectively. In FIGS. 3A and 3B, reference numerals 95 and 96 indicate stoppers that allow the rollers 93 and 94 to move in the left-right direction and restrict their downward movement. A coil spring (tension coil spring) 97 is attached between the joint parts 84 and 85. Note that the links 73 and 74 have extension parts 73a and 74a that extend downward from the joint parts 84 and 85, respectively, and these extension parts 73a and 74a are connected to the left cover 61 and the right cover 62 through attachment parts 98 and 99. Each is attached and fixed.

In the above configuration, the joints 81 and 86 are attached to the soldering iron unit 40 and move up and down as the soldering iron unit 40 moves up and down. When the soldering iron unit 40 is lowered from the state where the cover 60 is closed in the first step shown in FIG. 3A and the joint portion 81 is lowered accordingly, the rollers 93 and 94 hit the stoppers 95 and 96 and move in the left and right direction. , the links 71 to 76 are interlocked with this, resulting in the state shown in FIG. 3B, and the cover 60 is opened left and right.

On the other hand, when the soldering iron unit 40 is raised after soldering and the joint portion 81 is raised accordingly, the link mechanism 70 returns to the state shown in FIG. 3A and the cover 60 is closed. The restoring force of the coil spring 97 acts as a force in the direction of closing the cover 60.

The configuration and operation of the first embodiment of the soldering device according to the present invention have been described above. According to this example, in the two-step soldering method, the soldering iron tip 41 is applied to a component located directly below the tip 41 of the soldering iron. Adhesion and penetration of solder balls can be effectively prevented.

In the first embodiment, the cover 60 that accommodates the tip 41 of the soldering iron and prevents solder balls from scattering is configured to open and close from side to side, but the cover may have other configurations.

4 and 5A and 5B show the configuration and operation of the main parts of the soldering device when it is equipped with a cover that moves laterally instead of opening and closing left and right, and FIGS. 4 and 5A show the first step. FIG. 5B shows the state of the soldering device in the third step. Note that parts corresponding to the configuration of the first embodiment described above are given the same reference numerals, and detailed explanation thereof will be omitted.

In this example, the cover 65 is made of a single component and has a box shape with an open top surface. The shape of the cover 65 is similar to the shape of the cover 60 in the first step of Example 1, and consists of a bottom plate 65a and a peripheral wall 65b. As shown in FIG. 4, a notch 66 is provided on one surface (in this example, the front surface) of the peripheral wall 65b.

In the first step, the cover 65 has a bottom plate 65a located below the soldering iron tip 41 and a peripheral wall 65b located so as to surround the soldering iron tip 41, similar to the cover 60 in the first embodiment. As a result, the soldering iron tip 41 is accommodated within the cover 65, and it is possible to prevent the scattering of solder balls and the occurrence of defects such as short circuits due to adhesion or intrusion of the scattered solder balls.

The cover 65 is designed to move laterally in the second step to enable the soldering iron unit 40 to be lowered. In this example, the cover 65 is moved rearward, and soldering (third step) is performed with the cover 65 moved rearward, as shown in FIG. 5B. Note that a notch 66 provided in the peripheral wall 65b of the cover 65 allows the lower end portion of the soldering iron unit 40 including the iron tip 41 and the nozzle 52 for supplying thread solder to the iron tip 41 to enter and exit from the cover 65. The lower end portion of the soldering iron unit 40 and the nozzle 52 pass through this notch 66 when the cover 65 moves laterally.

In this example as well, the cover 65 moves laterally in conjunction with the vertical movement of the soldering iron unit 40. Although not shown in FIGS. 4 and 5A and 5B, for example, a link mechanism or the like can be used as a mechanism for moving the cover 65 in conjunction with the vertical movement of the soldering iron unit 40.

Next, the main structure and operation of a third embodiment of the soldering apparatus according to the present invention will be described with reference to FIGS. 6A and 6B.

In this example, the cover is not box-shaped like the cover 60 of the first embodiment and the cover 65 of the second embodiment, but is a simple flat plate.

The cover 67, which is a flat plate, is positioned between the soldering iron tip 41 and the parts to be soldered (the connector 31 and the electric wire 32 in FIG. 6A) in the first step, as shown in FIG. In order to enable the iron unit 40 to be lowered, it is moved laterally as in the second embodiment, and soldering (third step) is performed while it is moved laterally as shown in FIG. 6B. It becomes.

The cover 67 has a size that covers the parts to be soldered, and even if the cover 67 is just a flat plate, covering the parts to be soldered with the cover 67 prevents the adhesion of scattered solder balls. It is possible to solve problems such as defects such as short circuit failures occurring in the parts to be soldered due to the soldering.

The cover 67 moves laterally in conjunction with the vertical movement of the soldering iron unit 40, and although the mechanism for interlocking is not shown in FIGS. 6A and 6B, for example, a link mechanism or the like may be used. .

Although the embodiments of the present invention have been described above, the mechanism for displacing the cover in conjunction with the vertical movement of the soldering iron (soldering iron unit) is not limited to a link mechanism, and a mechanism using a cam, for example, can be used. May be adopted. In addition, the configuration is not limited to mechanically coupling and interlocking the soldering iron and the cover, for example, a switch that is turned ON/OFF by the vertical movement of the soldering iron, and the cover is displaced by turning ON/OFF the switch. It is also possible to have a structure in which they are interlocked via electrical means such as.

10 Soldering device 11 Stage 12 Stage moving device 13 Soldering head 14 Solder supply section 14a Reel 14b Retraction device 15 Movable stand 16 Control unit 21 Soldering iron main body 21a Tip section 22 Iron holder 23 Solder guide section 24 Soldering iron Movable part 31 Connector 32 Electric wire 32a Core wire 33 Soldering part 40 Soldering iron unit 41 Iron tip 51 Thread solder supply guide 52 Nozzle 53 Nozzle height adjustment mechanism 60 Cover 60a Bottom plate 60b Peripheral wall 61 Left cover 61a Side wall 61b Notch 62 Right Cover 62a Side wall 62b Notch 63 Window 65 Cover 65a Bottom plate 65b Peripheral wall 66 Notch 67 Cover 70 Link mechanism 71-76 Links 73a, 74a Extension portion 81-86 Joint portion 91, 92 Arm 93, 94 Roller 95, 96 Stopper 97 Coil Spring 98, 99 mounting part

Claims (5)

In the first step, the solder is melted with a soldering iron to adhere the molten solder to the iron tip, in the second step the soldering iron is lowered, and in the third step, the molten solder attached to the iron tip is used to attach the molten solder to the soldering iron tip. A soldering device for soldering,
comprising a cover located between the soldering iron tip and the component in the first step and displaced in the second step to allow the soldering iron to descend;
The cover consists of a bottom plate and a peripheral wall, and in the first step, the bottom plate is placed below the iron tip.
the surrounding wall surrounds the four sides of the iron tip to form a box shape.
A soldering device characterized by : The soldering device according to claim 1 ,
The soldering device is characterized in that the cover is made up of two parts that can be opened and closed left and right, and is configured to open left and right in the second step. The soldering device according to claim 1 ,
The cover is movable laterally, and the peripheral wall is provided with a notch through which the soldering tip and a nozzle for supplying solder to the soldering tip pass when the cover is moved laterally,
A soldering device characterized in that the cover is configured to move laterally in the second step. The soldering device according to any one of claims 1 to 3 ,
A soldering device characterized in that the cover is configured to be displaced mechanically in conjunction with the vertical movement of the soldering iron. A first step of melting the solder with a soldering iron and adhering the molten solder to the iron tip, a second step of lowering the soldering iron, and a third step of soldering the components with the molten solder adhering to the iron tip. A soldering method comprising a process,
In the first step, a cover is positioned between the iron tip and the component,
In the second step, the cover is displaced to allow the soldering iron to descend;
The cover consists of a bottom plate and a peripheral wall, and in the first step, the bottom plate is placed below the iron tip.
The surrounding wall surrounds the soldering tip on all sides to form a box shape.
A soldering method characterized by :

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