JP6128609B2 - Soldering equipment - Google Patents

Description

  The present invention relates to a solder processing apparatus provided with a solder ridge.

  In recent years, electronic circuits on which electronic components are mounted are mounted on various devices. In the formation process of the electronic circuit, soldering using a soldering iron is performed for the process of joining the lead wire to the wiring pattern (land) on the substrate. In addition, in order to mechanically realize such a soldering process, a solder processing apparatus provided with a solder ridge is used.

  However, when soldering is performed using a solder processing apparatus, a part of the molten solder adheres to the tip as dross (residue such as tin oxide or carbide), which adversely affects the quality of subsequent soldering. Therefore, in order to maintain the soldering quality, cleaning is performed to remove dross from the tip.

Japanese Examined Patent Publication No. 6-104412 Japanese Patent No. 4665003

  However, there is a problem that during the cleaning of the tip, the soldering cannot be executed using the tip, and the productivity of the soldering process is lowered accordingly. For example, if the time required for soldering is the same as the time required for cleaning, when cleaning is performed each time soldering is completed, the soldering process is performed more than when soldering is performed continuously. Productivity will be halved.

  Conventionally, for example, even in a solder processing apparatus including two solder hooks, when one solder hook is used for soldering, the other solder hook is used as a substrate or the like. They just wait in a position where they do not interfere. In view of the above-described problems, an object of the present invention is to provide a solder processing apparatus that can maintain good productivity in a soldering process while cleaning the tip.

The solder processing apparatus according to the present invention includes at least a first solder rod portion and a second solder rod portion as solder rod portions having a substantially cylindrical shape with a supply hole used for supplying solder to a substrate. A solder processing apparatus for performing a melting process for melting the supplied solder and a cleaning process for removing solder residue adhering to the tip of the solder, wherein the melting process is performed at a first solder pot Between the first operation in which the cleaning process is performed on the second solder pad and the melting process is performed in the second solder pad. A second operation in which the cleaning process is performed is executed, and the first solder flange and the second solder flange are close to or in contact with the substrate and above the lower position. It is movable between the upper position and the lower position. The molten process is performed, wherein the cleaning process in the upper position is made, it is disposed under the solder鏝部in the upper position, and pan for receiving said removed residues, moving pan for moving the pan And the tray moving mechanism is disposed below the second solder pad when the first operation is performed, and is disposed below the first solder pad when the second operation is performed. Next, the tray is moved to be configured.

  According to this configuration, it is possible to maintain good productivity in the soldering process while cleaning the tip.

  More specifically, the cleaning process may be a process in which the residue is incinerated and removed by heating the tip.

  More specifically, the above-described configuration includes a rack and pinion mechanism having racks fixed to each of the first solder hook part and the second solder hook part, and a pinion sandwiched between the racks, The rack and pinion mechanism may be used to move the first solder hook part and the second solder hook part in the vertical direction.

  More specifically, as the above configuration, the first solder flange and the second solder flange are connected to a belt, and by driving the belt, the first solder flange and the second solder flange are driven. It is good also as a structure which moves a soldering iron part to an up-down direction.

  More specifically, in the above-described configuration, the first solder hook part, the second solder hook part, and the tray are connected to a belt, and by driving the belt, the first solder hook part and It is good also as a structure which moves the said saucer while moving a 2nd soldering iron part to an up-down direction.

  More specifically, the above configuration may further include an air blowing unit that blows air into the supply hole to blow off the residue and a collection unit that collects the blown residue. More specifically, the collection unit may include a suction unit that sucks the blown residue.

  According to the solder processing apparatus of the present invention, it is possible to maintain good productivity in the soldering process while cleaning the tip.

1 is an external view of a solder processing apparatus according to a first embodiment. It is explanatory drawing which shows the state which has arrange | positioned the board | substrate under the said solder processing apparatus. It is explanatory drawing regarding a saucer moving mechanism. It is sectional drawing of the solder processing apparatus at the time of a melting process and a cleaning process. It is sectional drawing of the solder processing apparatus at the time of a melting process and a cleaning process. It is explanatory drawing regarding a saucer moving mechanism. It is explanatory drawing regarding the process of blowing off the dross adhering to the heel. It is explanatory drawing regarding the process of blowing off the dross adhering to the heel. It is explanatory drawing regarding the process of blowing off the dross adhering to the heel. It is explanatory drawing regarding a rack and pinion mechanism. It is an external view of the solder processing apparatus which concerns on 2nd Embodiment. It is an external view of the solder processing apparatus which concerns on 3rd Embodiment. It is explanatory drawing regarding arrangement | positioning of a dust box. It is explanatory drawing regarding the process of collect | recovering dross in a dust box.

  Embodiments of the present invention will be described below with reference to the drawings, taking the first to third embodiments as examples. The contents of the present invention are not limited to these embodiments. In addition, the up / down / left / right and front / rear directions used in the following description are as shown in FIG.

1. First Embodiment FIG. 1 is an external view of a solder processing apparatus X according to the first embodiment, and FIG. 2 is an explanatory view showing a state in which a substrate (wiring board) Bd is arranged under the solder processing apparatus X. is there. As shown in FIGS. 1 and 2, in the solder processing apparatus X, two heads (1 </ b> A, 1 </ b> B) arranged side by side are attached to the front surface of an upright flat plate-like wall body 11. . Each head (1A, 1B) has basically the same configuration.

  Each head (1A, 1B) is supplied with the thread solder W from above, and solders the lead wire Le to the land Ld of the substrate Bd using the tip 51 of the solder iron provided at the lower part. Operate. In addition, as shown in FIG. 2, the board | substrate Bd is attached to the jig | tool Gj.

  Each head (1A, 1B) is movable in the vertical direction between a lower position that is close to or in contact with the substrate Bd and an upper position that is above the lower position. In the state shown in FIGS. 1 and 2, the head 1A is in the lower position and the head 1B is in the upper position.

  In the upper part of each head (1A, 1B), as a solder feeding mechanism for supplying the thread solder W, a pair of feed rollers 61 for feeding the thread solder W and a guide tube for guiding the thread solder W fed by the feed roller 61 62. The pair of feed rollers 61 sandwich the thread solder W and rotate to feed the thread solder W downward. The feed roller 61 determines the length of the thread solder W to be sent out according to the rotation angle (number of rotations).

  The guide tube 62 is a tube body that can be elastically deformed, and is disposed in proximity to a portion of the feed roller 61 where the thread solder W is fed out. Further, the lower end of the guide tube 62 moves following the sliding of the cutter upper blade 21. The guide tube 62 is provided so as not to be pulled or stretched within a range in which the cutter upper blade 21 slides.

  A cutter unit that cuts the thread solder W fed by the solder feeding mechanism into solder pieces of a predetermined length is provided below the solder feeding mechanism in each head (1A, 1B). The cutter unit includes a cutter lower blade 22 and a cutter upper blade 21 that is disposed above the cutter lower blade 22 and is slidable in the front-rear direction. The cutter unit is provided with an actuator 32 for driving the pusher pin in the vertical direction.

  The cutter upper blade 21 is provided with a penetrating upper blade hole 211 into which the thread solder W fed by the solder feeding mechanism is inserted. The lower edge of the upper blade hole 211 is formed in a cutting edge shape. The cutter lower blade 22 includes a lower blade hole (not shown) that penetrates the thread solder W that penetrates the upper blade hole 211. The upper edge portion of the lower blade hole is formed in a cutting blade shape. When the cutter upper blade 21 slides in a state where the thread solder W is inserted, the upper blade hole 211 and the lower blade hole are displaced in a direction intersecting the thread solder W, so that the thread solder W is removed by the mutual cutting blade. Cut into solder pieces.

  When the cutter upper blade 21 returns to the original position after cutting and the pusher pin described above is driven, the pusher pin is inserted to the lower blade hole. Thereby, even when the solder piece cut by the cutter unit remains in the lower blade hole, it is pushed downward by the pusher pin.

  Moreover, a soldering iron part is provided below the cutter unit in each head (1A, 1B). In addition to a heater unit including a heater 41 for soldering that generates heat when energized and a heater block 42 for attaching the heater 41, the soldering iron part includes a tip 51 attached to the heater unit.

  The heater block 42 has a cylindrical shape, and the heater 41 is wound around the outer peripheral surface. The heater block 42 includes a recess for attaching the hook 51 to the lower end in the axial direction, and a solder supply hole penetrating from the center of the bottom of the recess to the opposite side. The tip 51 has a cylindrical shape extending in the vertical direction (axial direction), and a supply hole extending in the axial direction is formed in the central portion of the tip 51. The lower blade hole of the cutter lower blade 22 communicates with the solder supply hole of the heater block 42 and the supply hole of the flange 51.

  Note that the tip 51 is made of a material having high thermal conductivity. For example, the thermal conductivity is 100 W / m · K or more. The material of the tip 51 is preferably an aluminum nitride, tungsten carbide, or boron nitride ceramic material.

  The tip 51 is detachable from the heater block 42, and when mounted, the upper part is inserted and disposed in the recess of the heater block 42, and the lower end protrudes downward from the heater block 42. The solder pieces of thread solder cut by the cutter unit are supplied onto the substrate Bd below the tip 51 through the solder supply hole of the heater block 42 and the supply hole of the tip 51.

  When soldering is performed on the substrate Bd, the heat of the heater 41 is transmitted to the tip 51 through the heater block 42, and the solder pieces supplied onto the substrate Bd are melted by the heat. In addition, each head (1A, 1B) at the time of soldering has moved to a lower position where the tip of the tip 51 is close to or in contact with the substrate Bd, so that the solder pieces supplied onto the substrate Bd are appropriately transferred. Can be melted.

In addition, a tray 71 that is movable in the left-right direction is provided at a lower portion of the solder processing apparatus X. When the head 1A is in the upper position, the tray 71 is moved so that it is disposed directly below the tip 51 of the head 1A. When the head 1B is in the upper position, the tray 71 is disposed immediately below the tip 51 of the head 1B. . The role of the saucer 71 will be described in detail again.

  Further, the solder processing apparatus X is provided with a control mechanism CS (not shown) that controls various operations so that the apparatus functions normally. The control mechanism CS includes a logic circuit such as an MPU or CPU, and controls each part of the solder processing apparatus X.

  In the control mechanism CS, a melting process for melting the solder supplied to the substrate Bd and a cleaning process for burning and removing the dross by heating the dross attached to the tip 51 are alternately performed in the head 1A and the head 1B. To be done. That is, while the melting process is performed at the tip 51 of the head 1A, the first process in which the cleaning process is performed on the tip 51 of the head 1B and the melting process is performed at the tip 51 of the head 1B. In the meantime, the second operation in which the cleaning process is performed on the tip 51 of the head 1A is executed.

  The melting process is a process for realizing soldering. More specifically, the solder piece cut from the thread solder W is supplied onto the substrate Bd (and remains in the supply hole of the tip 51). In this state, the solder pieces are heated and melted using the heater 41. At this time, the heater 41 is controlled so that the tip 51 is about 400 ° C., for example, at a temperature setting of 550 ° C. so that the solder piece melts. On the other hand, in the cleaning process, the tip 51 is heated for several minutes at a temperature of, for example, 450 ° C. or higher using the heater 41 so that the dross attached to the tip 51 is incinerated. The temperature of the tip 51 is normally set higher at the temperature during the cleaning process than at the melting process.

  When the first operation is performed, the head 1A is in the lower position and the head 1B is in the upper position. When the second operation is performed, the head 1A is in the upper position and the head 1B is in the lower position. Therefore, since each head (1A, 1B) is in a lower position close to or in contact with the substrate Bd when performing the melting process, the melting process can be appropriately performed. Further, when the cleaning process is performed, it is at an upper position relatively far from the substrate Bd, so that the influence of heating or the like in the cleaning process can be prevented from reaching the substrate Bd as much as possible.

  In synchronization with the vertical movement of the heads 1A and 1B, the tip temperature of one head is set to the cleaning processing temperature, and the tip temperature of the other head is set to the melting processing temperature. When the cleaning process for the one head is completed, the energization of the heater 41 is stopped, and the temperature of the tip 51 is lowered to the melting process temperature by natural heat radiation to prepare for the next melting process. At this time, compressed air that blows off the dross may be used in order to quickly reduce the temperature.

  The cleaning processing temperature can be changed according to the required cleaning processing time. That is, when the cleaning process time is shortened, the cleaning process temperature can be set high, and the cleaning process temperature can be set low if the cleaning process time is sufficient.

  Further, the replacement timing of the heads 1A and 1B, that is, the timing of the cleaning process of the tip 51 may be appropriately determined depending on the number of melting processes, the amount of solder used, and the like. For example, when the number of melting processes or the amount of solder used reaches a predetermined value, the cleaning process of the tip 51 is performed. Alternatively, the cleaning process may be performed simply for a preset time.

In addition, as described above, the tray 71 is arranged below each head (1A, 1B) at the upper position. Therefore, when each head (1A, 1B) is cleaned, the dross that is peeled off from the tip 51 is received by the tray 71, so that it is prevented from adhering to the substrate Bd.

Here, a tray moving mechanism for moving the tray 71 will be described. As shown in FIG. 3, the tray moving mechanism has a configuration in which a tray 71 is provided at one end of a support member 72 extending in the front-rear direction, and the other end of the support member 72 is slidably attached to the wall body 11. It has become. And the support member 72 slides in the left-right direction along the wall 11, and the saucer 71 moves in the left-right direction. In addition, the movement of the tray 71 is performed so as not to interfere with the vertical movement of each head (1A, 1B).

  FIG. 4 is a cross-sectional view of the solder processing apparatus X in a state where the melting process is performed by the head 1A and the cleaning process is performed by the head 1B. As shown in the drawing, in the head 1A at the lower position, the tip 51 is brought close to or in contact with the substrate Bd and the melting process is performed. In the meantime, in the head 1B located at the upper position, the cleaning process is executed in a state where the tray 71 is disposed below.

  FIG. 5 is a cross-sectional view of the solder processing apparatus X in a state where the melting process is performed by the head 1B and the cleaning process is performed by the head 1A. As shown in this figure, in the head 1B at the lower position, the tip 51 is brought close to or in contact with the substrate Bd and the melting process is performed. In the meantime, in the head 1A located at the upper position, the cleaning process is executed in a state where the tray 71 is disposed below.

  In addition, the specific form of a saucer moving mechanism is not restricted to what was mentioned above, For example, as shown in FIG. 6, the saucer 71 may become a form which moves so that an arc may be drawn. According to the tray moving mechanism shown in FIG. 6, the tray 71 is provided at one end of the support member 72 extending in one direction, and the other end of the support member 72 is rotatably attached to the wall body 11. ing.

  Moreover, when using the solder processing apparatus X, the process for blowing in compressed air from the upper side to the supply hole of the tip 51, and blowing off the dross adhering to the tip 51 may be provided. Such a process will be described below with reference to FIGS.

  FIG. 7A shows a form of a process in which the casing 81 is installed below the tip 51 and the dross attached to the tip 51 is blown away and the dross is collected by the casing 81. ing. As shown in the figure, the housing 81 includes a guide member 82 for guiding the dross blown from the tip 51 into the housing 81, a through hole 83 penetrating to the outside, and a space having the guide member 82. A filter 84 is provided so as to partition a space with the through hole 83. According to this aspect, it is possible to collect the dross blown off by the compressed air in the housing 81.

  FIG. 7B shows a form in which a fan (suction means) 85 is provided in the housing 81 (a space between the through hole 83 and the filter 84). According to this embodiment, the compressed air is blown into the tip 51 and at the same time the fan 85 is rotated, thereby causing an air flow from the inside of the casing 81 to the outside through the through hole 83 and into the casing 81. Dross can be actively sucked. Thereby, it is possible to collect the blown-out dross in the housing 81 more reliably.

  8 (a) and 8 (b) show an example in which the guide member 82 is modified so that dross attached to the end face of the tip 51 can be more easily removed in the form shown in FIG. 7 (b). Yes. In the form shown in FIG. 8A, the end face of the heel 51 contacts with a part of the guide member 82. In the form shown in FIG. 8B, the outer edge of the end face of the heel 51 Is in contact with a part of the guide member 82.

  FIG. 9 shows an example in which the guide member 82 is modified so as to make it easier to remove dross attached to the end face of the tip 51 in the form shown in FIG. 7B. In the form shown in the figure, the guide member 82 is partially uneven, and the end surface of the tip 51 can be rubbed against the unevenness. In addition, the said unevenness | corrugation may be brush shape.

  As a mechanism for moving each head (1A, 1B) in the vertical direction, a rack and pinion mechanism as shown in FIG. 10 may be used. The rack and pinion mechanism shown in the figure includes a rack 15a fixed to the head 1A, a rack 15b fixed to the head 1B, and a pinion 16 sandwiched between these racks. According to the rack and pinion mechanism, the heads (1A, 1B) can be moved alternately to the upper position and the lower position by rotationally driving the pinion 16.

2. Second Embodiment Next, a second embodiment will be described. The second embodiment is basically the same as the first embodiment except for a mechanism for moving each head (1A, 1B) and the tray 71. In the following description, emphasis is placed on the description of the points different from the first embodiment, and description of common points may be omitted.

  FIG. 11 is an external view of a solder processing apparatus X according to the second embodiment. In addition, the main part of the drive mechanism 90 which moves each head (1A, 1B) and the saucer 71 is shown in the broken-line frame in this figure. The drive mechanism 90 is installed on the rear side of the wall body 11.

  The drive mechanism 90 connects the belt 91, four supports (92 a to 92 d) that support the belt 91 in a rotationally movable manner, a connecting member 93 a that connects the head 1 A to the belt 91, and the head 1 B to the belt 91. A connecting member 93b is provided.

  In addition, each support body (92a-92d) is arrange | positioned so that the rectangular four corners may be formed. The belt 91 extends in the vertical direction between the support body 92b and the support body 92c, and the connecting member 93a is fixed thereto. Between the support body 92c and the support body 92d, the belt 91 extends in the left-right direction, and the support member 72 is fixed thereto. Between the support body 92d and the support body 92a, the belt 91 extends in the vertical direction, and a connecting member 93b is fixed thereto.

  According to the drive mechanism 90 of the present embodiment, by driving the belt 91, the heads (1A, 1B) are moved in the vertical direction, and the tray 71 is disposed so as to be disposed under the head at the upper position. It can be moved. The drive mechanism 90 is adjusted so that the moving tray 71 does not interfere with the vertical movement of each head (1A, 1B).

  Further, two stoppers 95a and 95b for restricting the movable range of the connecting member 93b are provided on the left side surface of the wall body 11, and a magnet 96 for attracting the connecting member 93b is provided on each of the stoppers 95a and 95b. is set up. Thereby, each head (1A, 1B) can be prevented from moving beyond an allowable range, and the function of positioning each head (1A, 1B) can be achieved.

  As is clear from the above description, in the present embodiment, each head (1A, 1B) is belted using the belt 91, and the belt 91 is driven to move each head (1A, 1B) up and down like a seesaw. It is like that. The tray 71 also moves to the left and right in conjunction with the belt 91 and receives dross falling during the cleaning process. Moreover, each stopper 95a, 95b can be utilized also for the position detection of each head (1A, 1B).

3. Third Embodiment Next, a third embodiment will be described. The third embodiment is basically the same as the first embodiment except for a mechanism for moving each head (1A, 1B) and the tray 71. In the following description, emphasis is placed on the description of the points different from the first embodiment, and description of common points may be omitted.

  FIG. 12 is an external view of a solder processing apparatus X according to the third embodiment. In addition, the main part of the drive mechanism 90 which moves each head (1A, 1B) and the saucer 71 is shown in the broken-line frame in this figure. The drive mechanism 90 is installed on the rear side of the wall body 11.

  The drive mechanism 90 connects the belt 91, the two supports (92e, 92f) that support the belt 91 in a rotationally movable manner, the connecting member 93a that connects the head 1A to the belt 91, and the head 1B to the belt 91. A connecting member 93b is provided.

  In addition, each support body (92e, 92f) is formed larger than the support bodies (92a-92d) in 2nd Embodiment, and the support body 92f is arrange | positioned under the support body 92e. Between the right side of the support body 92e and the right side of the support body 92f, the belt 91 extends in the vertical direction, and a connecting member 93a is fixed thereto.

  Between the left side of the support body 92e and the left side of the support body 92f, the belt 91 extends in the vertical direction, and a connecting member 93b is fixed thereto. A support member 72 is fixed at a position near the outer periphery on the front surface of the support body 92f.

  According to the drive mechanism 90 of the present embodiment, each head (1A, 1B) can be moved in the vertical direction by driving the belt 91. Further, with the rotation of the support 92f at this time, the tray 71 can be moved so as to be disposed under the head at the upper position.

  The drive mechanism 90 is adjusted so that the moving tray 71 does not interfere with the vertical movement of each head (1A, 1B). In the present embodiment, since the tray 71 also moves so as to descend when one head is lowered, it is easy to adjust so as not to interfere. Furthermore, in the saucer 71 in this embodiment, the hollow for receiving dross is provided in the both sides of the front and back.

  Further, two stoppers 95a and 95b for restricting the movable range of the connecting member 93b are provided on the left side surface of the wall body 11, and a magnet 96 for attracting the connecting member 93b is provided on each of the stoppers 95a and 95b. is set up. Thereby, each head (1A, 1B) can be prevented from moving beyond an allowable range, and the function of positioning each head (1A, 1B) can be achieved.

  The drive mechanism 90 of the present embodiment is suitable for the step of arranging the dust box 99 as shown in FIG. 13 and collecting the dross peeled off from the tip 51 to the dust box 99. That is, as shown in FIG. 14, when the support 92 f rotates, the tray 71 moves while rotating, so that the dross on the tray 71 can be dropped into the dust box 99.

  More specifically, the dross ("Dross A" in FIG. 14) that has fallen from the tip 51 of the head 1A to the tray 71 falls from the tray 71 to the dust box 99 while the support 92f rotates clockwise. . Further, the dross ("Dross B" in FIG. 14) that has fallen from the tip 51 of the head 1B to the tray 71 falls from the tray 71 to the dust box 99 while the support 92f rotates counterclockwise. In this manner, the dross can be easily collected into the dust box 99 by utilizing the change in the orientation of the tray 71 with the rotation of the support 92f.

4). Others The solder processing apparatus X according to each of the embodiments described above includes at least a head as a solder flange (head) having a substantially cylindrical tip 51 having a supply hole used for supplying a solder piece to the substrate Bd. 1A and a head 1B, which are configured to perform a melting process for melting the supplied solder piece and a cleaning process for removing dross attached to the tip 51.

  Further, the solder processing apparatus X performs the first operation in which the cleaning process is performed on the head 1B while the melting process is performed in the head 1A and the head 1A while the melting process is performed in the head 1B. Then, the second operation in which the cleaning process is performed is executed. Therefore, according to the solder processing apparatus X, the line tact time is not increased for the cleaning process, and the productivity of the soldering process can be satisfactorily maintained while cleaning the tip.

  In the above-described embodiment, the number of heads provided in the solder processing apparatus X is two, but three or more heads may be provided. Even in this case, the present invention can be applied by performing the cleaning process on other heads while the melting process is performed on some of the heads.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to this content. The embodiments of the present invention can be variously modified without departing from the spirit of the invention.

1A, 1B Head 11 Wall body 21 Cutter upper blade 22 Cutter lower blade 32 Actuator 41 Heater 42 Heater block 51 Tip 61 Feed roller 62 Guide tube 71 Sauce tray 72 Support member 81 Housing 82 Guide member 83 Through hole 84 Filter 85 Fan 91 Belts 92a to 92f Support members 93a and 93b Connecting members 95a and 95b Stopper 96 Magnet 99 Dust box X Solder processing device W Yarn solder Bd Substrate Gj Jig Ld Land Le Lead wire

Claims (7)

As a solder rod portion having a substantially cylindrical shape with a supply hole used for supplying solder to the substrate, at least a first solder rod portion and a second solder rod portion are provided,
A solder processing apparatus for performing a melting process for melting the supplied solder and a cleaning process for removing a solder residue attached to the tip,
A first operation in which the cleaning process is performed on the second solder pad while the melting process is performed on the first solder pad;
Performing the second operation in which the cleaning process is performed on the first solder pad while the melting process is performed in the second solder pad,
The first solder flange and the second solder flange are
It is movable between a lower position that is close to or in contact with the substrate and an upper position that is above the lower position;
The melting process is performed at the lower position, the cleaning process is performed at the upper position ,
A tray that is disposed below the solder ridge in the upper position and receives the removed residue; and a tray moving mechanism that moves the tray.
The saucer moving mechanism is disposed below the second solder flange when the first operation is performed, and is disposed below the first solder flange when the second operation is performed. soldering apparatus according to claim Rukoto the moved.   The solder processing apparatus according to claim 1, wherein the cleaning process is a process of removing the residue by incineration by heating the tip. A rack and pinion mechanism having each rack fixed to each of the first solder hook part and the second solder hook part, and a pinion sandwiched between the racks;
The rack-and-pinion mechanism using a soldering apparatus according to claim 1 or 2 to move the first solder鏝部and second solder鏝部vertically. The first solder hook part and the second solder hook part are connected to a belt,
Wherein by driving the belt, soldering apparatus according to claim 1 or 2 to move the first solder鏝部and second solder鏝部vertically. The first solder brim part and the second solder brim part and the tray are connected to a belt,
5. The solder processing apparatus according to claim 1 , wherein by driving the belt, the first and second solder ridges are moved in the vertical direction and the tray is moved. . Air blowing means for blowing air into the supply hole to blow away the residue;
Soldering apparatus according to any one of claims 1 to 5 comprising a recovery means for recovering the blown residue. The solder processing apparatus according to claim 6 , wherein the recovery unit includes a suction unit that sucks the blown residue.