JP5184359B2 - Soldering iron, method of manufacturing electronic equipment using the same, and manufacturing apparatus - Google Patents

Description

  The present invention relates to a solder iron for melting and soldering thread solder, a method for manufacturing an electronic device using the solder iron, and a manufacturing apparatus.

As a hook for soldering a land of a wiring board and terminals such as a metal pin or a wire, there is known a hook having a cylindrical shape (Patent Document 1). By supplying thread solder into the cylinder with the pin protruding from the land surrounded by the inner peripheral surface of the cylinder and heating the cylinder, the molten solder is evenly wrapped around the pins and molten solder to unnecessary parts. It is intended to prevent the scattering of flux. The wettability of the inner surface of the cylinder with which the molten solder contacts is enhanced by solder plating or the like.
In order to achieve the same purpose, it is also known that the basket has a mortar shape in the upper half and a cylindrical shape in the lower half (Patent Document 2), where the inner surface is formed of a solder repellent material. ing. Then, in the previous step, the thread solder is cut into a predetermined length to make a solder piece, which is melted in a mortar part, and then poured into the cylindrical part surrounding the pin by its own weight, so that the pin and the land are soldered. The
JP-A-11-245029 JP 2001-203446 A

  When using the soldering iron described in Patent Document 1, the cylinder is easily clogged by the solder adhered to the inner surface of the cylinder, and air is blown before the solder is solidified from the air holes formed on the side surface of the cylinder in order to prevent this. It is necessary and troublesome. Moreover, in the soldering iron described in Patent Document 1, the tip of the thread solder continuously supplied from the solder reel is separated from the unmelted remainder simultaneously with melting by being heated through the cylinder. Therefore, the amount of solder used for one soldering is not constant, and defects such as insufficient bonding or short-circuiting between terminals may occur in the manufactured electronic device.

Next, when the soldering iron described in Patent Document 2 is used, the flux is vaporized while the solder is melted in the mortar portion, and the flux is not supplied to the lands or pins. For this reason, the molten solder is poured in without removing the oxide film and dirt on the lands and pins, and the solder may not adhere to the lands and pins.
Therefore, a first object of the present invention is to provide a soldering iron that prevents the flux from scattering and prevents clogging. A second problem is to provide an electronic device manufacturing apparatus that can perform soldering satisfactorily while keeping the amount of solder used for one soldering constant in a soldering process of an electronic device. . A third problem is to provide a high-quality electronic device.

In order to solve the problem, the soldering iron of the present invention is
At least the inner surface of the tip portion is formed of a material that is difficult to wet with solder, has an inner diameter through which thread solder can pass, and has a cylinder with both ends open.
According to this soldering iron, since both ends of the cylinder are open, if the cylinder is stood on the land and thread solder cut to a length necessary for one soldering is inserted from the rear end of the cylinder , Fall to the tip and touch the land or pin. Then, by melting the solder at the tip, the mating terminal such as a pin or wire is joined with a certain amount of solder. Since the soldering portion is surrounded by the cylinder, the molten solder or flux does not scatter around and the molten solder wraps around evenly. In addition, since the inner surface of the tip of the cylinder is made of a material that is difficult to wet with respect to the solder, the solder hardly adheres to the inner surface of the cylinder, and the clogging of the cylinder can be suppressed. As a result, the quantitativeness of the supplied solder is maintained and the appearance after joining is finished cleanly.

The tube may be provided with a vent hole penetrating from the outer peripheral surface to the inner peripheral surface. This is because an inert gas such as nitrogen can be sent into the cylinder from this vent hole to prevent solder and terminal oxidation.
In addition, when connecting an electronic component such as a choke coil in which a heat-meltable coated magnet wire (for example, polyurethane-coated copper wire) is wound around a metal pin to the substrate, the wire, the metal pin, and the land The three parties can be soldered simultaneously. This is because the flux eluted from the solder stays in the cylinder without being diffused, purifies the metal surface and makes it easy to get wet with the solder. Therefore, there is no need to solder the wire and the metal pin in advance, which is excellent in that the process can be shortened.
In this specification, a land means a terminal on an electronic device in a broad sense including a pad having no pin insertion hole.
As a heating means for melting the solder, a sheathed heater wound in a coil shape on the outer peripheral surface of the cylinder is preferable. This is because the tube is heated directly, so that the start-up is fast, high efficiency and safety.

Therefore, an appropriate method for manufacturing an electronic device using this soldering iron is as follows:
At least the inner surface of the tip portion is formed of a material that is difficult to wet with the solder, has a diameter that allows the thread solder to pass through, and has a cylinder open at both ends, and heating means for melting the solder at the tip portion And prepare
The tip of the cylinder is brought close to the terminal of the electronic device,
Insert the solder piece obtained by cutting the thread solder into the length necessary for one soldering and drop it into the cylinder from the rear end of the cylinder,
The solder piece in the cylinder is melted at the tip by the heating means.

  The inner diameter of the cylinder is preferably smaller than the length of the solder piece. As a result, the solder pieces stand up in the cylinder after dropping, so that the distance between the outer peripheral surface of the solder pieces and the inner peripheral surface of the cylinder is the shortest, and the solder pieces are melted quickly and uniformly, and at the same time the surfaces of the lands and pins This is because it is purified by flux and solder is easily attached. Of course, the inner diameter of the cylinder is larger than the outer diameter of the solder piece, and when the pin is inserted, it is larger than the outer diameter of the pin.

In addition, an apparatus suitable for this manufacturing method is:
A solder holding hole that is formed of a cutting blade and a receiving blade and can accept thread solder of a predetermined length is formed in at least one of them, and is inserted into the solder holding hole by being relatively displaced while rubbing against each other. A cutter unit for cutting thread solder;
At least the inner surface of the tip is formed of a material that is difficult to wet with solder, has an inner diameter through which thread solder can pass,
And a heating means for melting the solder at the tip portion.
In this apparatus, the cylinder and the heating means correspond to the soldering iron. The thread solder cut by the cutter becomes a solder piece having a length necessary for one soldering.

  In one specific configuration of the cutter unit, the cutting blade can advance and retreat in one direction according to the output of the drive source, and the solder holding hole is formed to penetrate in a direction perpendicular to the advancing and retreating direction of the cutting blade. The In this case, the receiving blade has a recess that guides the cutting blade in the advancing and retreating direction, and a solder supply hole that is aligned with the through hole when the cutting blade is retracted is formed on one side, and the cutting blade is formed on the same side or the opposite side. A solder discharge hole that is aligned with the through hole is formed during the forward movement. The cylinder is placed so that the radial position coincides with the solder discharge hole.

  According to this structure, when the cutting blade is advanced with respect to the receiving blade in a state where the thread solder is supplied from the supply hole to the holding hole, the shearing force acts on the fitting portion of both the blades and the thread solder is cut. The obtained solder piece comes out of the discharge hole, enters the cylinder, falls by its own weight, and comes into contact with the land facing the lower end surface of the cylinder. And it heat-melts and joining is performed as above-mentioned. The solder used for one-time soldering is a fixed-length solder piece determined by the length supplied to the holding hole. The length of the thread solder supplied to the holding hole can be controlled by the number of rotations of the solder feed roller.

  The receiving blade preferably has an introduction hole for receiving a gas or a plunger at a position facing the solder discharge hole. This is because even if burrs or bends are generated in the solder piece obtained by cutting, the solder piece can be discharged by blowing compressed gas from the introduction hole into the holding hole or inserting a plunger. The inner diameters of the solder holding hole and the cylinder are preferably smaller than the axial length of the solder holding hole. This is because the solder piece can be sent to the lower end of the cylinder with a small amount of resistance while standing in the axial direction.

  In another specific configuration of the cutter unit, the cutting blade is capable of rotating in accordance with the output of the driving source, and the solder holding hole is formed on the cutting blade through a diameter line perpendicular to the rotation axis of the cutting blade. Is done. In this case, the receiving blade has a bearing portion for holding the cutting blade, a solder supply hole that is aligned with the solder holding hole is formed on one side when the cutting blade is in a phase, and another phase is formed on the other side. Sometimes a solder discharge hole is formed which is aligned with the solder holding hole. The cylinder is placed so that the radial position coincides with the solder discharge hole.

  According to this configuration, when the cutting blade is rotated in a state where the thread solder is supplied to the holding hole, the shearing force acts on the fitting portion of the both blades, thereby cutting the thread solder. The obtained solder piece comes out of the discharge hole, enters the cylinder, falls by its own weight, and comes into contact with the land facing the lower end surface of the cylinder. And it heat-melts and joining is performed as above-mentioned. The solder used for one-time soldering is a fixed-length solder piece determined by the length supplied to the holding hole. Similar to the above-described configuration, the receiving blade may have an introduction hole for receiving gas or a plunger at a position facing the solder discharge hole.

In still another specific configuration of the cutter unit, the cutting blade can advance and retreat in one direction according to the output of the drive source, and the receiving blade has a flat surface for guiding the cutting blade in the advancing and retreating direction. In this case, the solder holding hole penetrates in the direction perpendicular to the advancing and retreating direction of the cutting blade and is formed in the receiving blade. The cylinder is placed so that the radial position coincides with the solder holding hole.
According to this structure, when the cutting blade is advanced with respect to the receiving blade in a state in which the thread solder is supplied to the holding hole, the shearing force acts on the fitting portion of both the blades, and the thread solder is cut. The obtained solder piece comes out of the holding hole, enters the cylinder, falls by its own weight, and comes into contact with the land facing the lower end surface of the cylinder. And it heat-melts and joining is performed as above-mentioned. The solder used for one-time soldering is a fixed-length solder piece determined by the length supplied to the holding hole.

  It is preferable that the basic configuration of the manufacturing apparatus further includes a shutter for opening and closing the rear end of the cylinder. Without the shutter, the flux evaporated at the time of melting the solder may enter the solder piece passage located in the previous step of the cylinder, adhere to the passage, and block the passage. Therefore, by closing the shutter while the solder pieces in the cylinder are melted, the path in the previous process of the cylinder can be kept clean at all times.

  According to the present invention, the solder supplied to the joining portion is a solder piece of a certain length, hardly adheres to the ridge after joining and does not scatter around, so the amount of solder consumed for joining is constant. Therefore, an excellent quality electronic device can be provided.

1 is a perspective view showing a manufacturing apparatus according to Embodiment 1. FIG. It is a vertical direction sectional view showing a cutter unit used in the apparatus, wherein (a) is when the cutting blade is retracted and (b) is when it is advanced. It is a perspective view which shows the soldering iron and wiring board which are used for the apparatus. It is a vertical direction sectional view showing the soldering iron and the wiring board, (a) before solder melting, (b) after melting. It is a perspective view which shows the modification of the heating block in Embodiment 1. FIG. It is sectional drawing which shows the various combination of the pipe | tube and heating block in Embodiment 1. FIG. It is a perspective view which shows another example of the heating means in Embodiment 1. (A) is sectional drawing which shows the relationship between a pipe | tube and a cleaner, (b) is a perspective view which shows the modification of a pipe | tube. It is a perspective view which shows another method of joining with the manufacturing apparatus of Embodiment 1. FIG. The manufacturing apparatus which concerns on Embodiment 2 is shown, (a) is a perspective view, (b) is sectional drawing. FIG. 10 is a main part sectional view showing a manufacturing apparatus according to a third embodiment. FIG. 6 is a cross-sectional view of a main part showing a manufacturing apparatus according to a fourth embodiment. FIG. 10 is a perspective view showing a main part of a manufacturing apparatus according to a fifth embodiment. FIG. 10 is a cross-sectional view showing a main part of a manufacturing apparatus according to a fifth embodiment. FIG. 10 is a perspective view showing a main part of a manufacturing apparatus according to a sixth embodiment. FIG. 10 is a cross-sectional view of a main part showing a manufacturing apparatus according to a sixth embodiment. FIG. 10 is a cross-sectional view showing a main part of a manufacturing apparatus according to a seventh embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,11 Electronic device manufacturing apparatus 2 Main body 2a Base 2b Wall 2c Connection plate 2d Bracket 2e Jig 2x, 2y, 2z Rail 3 Solder reel 4 Feed roller 5 Cutter unit 6 Sensor 7 Guide tubes 8, 18, 28 Heating blocks 9, 19 , 29, 39, 49 Tube 42 Fixed intermittent feeding device 51 Receiving blade 52 Cutting blade 51a Recess 51b Solder supply hole 51c Gas introduction hole 51d Solder discharge hole 52a Solder holding hole F, J Solder piece

Embodiment 1
A manufacturing apparatus according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an electronic device manufacturing apparatus of the embodiment, FIG. 2 is a vertical sectional view showing a cutter unit used in the apparatus ((a) is when the cutting blade is retracted, (b) is when moving forward), 3 is a perspective view showing a soldering iron and a wiring board used in the apparatus, FIG. 4 is a vertical cross-sectional view showing the soldering iron and the wiring board ((a) before solder melting, (b) after melting. ).

  The manufacturing apparatus 1 joins a land and a pin with a thread solder W in a state where a metal pin is inserted into a land on a wiring board S of an electronic device, and a flat base 2a and a wall 2b fixed perpendicularly to the base 2a. A main body 2 is provided. A rail 2x extending in the X direction is laid on the table 2a, and a rail 2y extending in the Y direction is fixed on the rail 2x so as to be movable along the rail 2x. A jig 2e on which the wiring board S is placed is fixed on the rail 2y so as to be movable in the XY directions. A rail 2z extending in the Z direction is attached to the wall 2b. A connecting plate 2c is fixed to the rail 2z so as to be movable along the rail 2z. Each movement is made by a driving source (not shown) such as a motor.

A solder reel 3, a feed roller 4, a cutter unit 5, a sensor 6 and a guide tube 7 are attached to the connecting plate 2 c in order from above via a bracket 2 d having a U-shape in plan view.
As shown in FIG. 2A, the cutter unit 5 drives a receiving blade 51 having a recess 51a sandwiched between upper and lower surfaces parallel to each other, a cutting blade 52 slidably fitted in the recess 51a, and the cutting blade 52. It consists of a fluid pressure cylinder 53. The output rod of the cylinder 53 is moved forward and backward by fluid pressure.

  A supply hole 51b and an introduction hole 51c penetrating from the upper surface to the recess 51a are formed in the upper part of the receiving blade 51. The supply hole 51b is located immediately below the feed roller 4 and has an inner diameter through which the thread solder W can pass without resistance. The introduction hole 51c is located farther from the cylinder 53 than the supply hole 51b and has substantially the same inner diameter as the supply hole 51b. At the lower part of the receiving blade 51, the horizontal position is the same as the introduction hole 51c, and a discharge hole 51d having the same inner diameter as the supply hole 51b is formed. The cutting blade 52 has a holding hole 52a that penetrates in the vertical direction and has substantially the same inner diameter as the supply hole 51b. The length of the cutting blade 52 and the stroke of the cylinder 53 are designed so that the position of the holding hole 52a coincides with the supply hole 51b when the cutting blade 52 moves backward and coincides with the introduction hole 51c and the discharge hole 51d when moving forward. . The guide tube 7 is located immediately below the discharge hole 51d. The sensor 6 includes a light emitting element 6a provided on one side with a guide tube 7 therebetween, and a light receiving element 6b provided on the other side. The guide tube 7 is made of a transparent material or has a transparent window at least at the height of the sensor 6.

  In addition, a heating block 8 made of a highly thermally conductive material such as copper is attached to the connection plate 2c below the bracket 2d. As shown in FIG. 3, the heating block 8 includes a thin-walled portion 8a on the fixed end side and a thick-walled portion 8b on the free end side connected to the fixed-end-side thinned portion 8a. A number of holes are formed to insulate. A heater 8c and a cylinder 9 are embedded in the thick portion 8b. The cylinder 9 has substantially the same inner diameter as the holding hole 52a, penetrates up and down, protrudes below the heating block 8, and has a tapered lower end on the outer diameter to avoid interference with peripheral components. . The tube 9 is only required to be able to withstand a temperature of about 600 ° C., and at least the inner peripheral surface of the lower end portion is difficult to wet with the solder. Even if it is made of a single material, it is a combination of a plurality of members. May be. In the case of a single material, a ceramic or a non-solder wettable metal such as stainless steel or titanium is desirable. In the case of a ceramic, a high thermal conductive ceramic such as aluminum nitride or silicon carbide is particularly desirable.

  The diameter of the thread solder W and the dimensions of the holding hole 52a and the cylinder 9 may be appropriately determined according to the amount of solder necessary for one soldering. For example, when the outer diameter of the pin is 1 mm, the thread solder By setting the diameter of W to 1.2 mm, the inner diameter of the holding hole 52a and the cylinder 9 to 3 mm, the length of the cut piece (solder piece) of the thread solder W to 6 mm, and the length of the holding hole 52a to 7 mm, the solder The piece stands up in the cylinder 9 while adjoining the pin, and the entire solder piece is quickly and evenly heated. Therefore, when the thread solder W is eutectic solder, if the lower end temperature of the tube 9 is 350 ° C., the soldering can be performed satisfactorily.

The procedure for soldering using the manufacturing apparatus 1 is as follows.
Metal pins are inserted into the lands P of the wiring board S, and the wiring board S is placed on the jig 2e. Then, the jig 2 e is moved together with the wiring board S so that the land is located directly below the cylinder 9. The connecting plate 2c is lowered to a position where the lower end surface of the cylinder 9 is positioned in the immediate vicinity of the land. As shown in FIG. 2A, the cutting blade 52 is retracted until the holding hole 52a coincides with the supply hole 51b, and the heater 8c is energized. The land P and the pin T are preheated by this radiant heat. The feed roller 4 is rotated to draw the thread solder W from the solder reel 3 and pass through the supply hole 51b. When the thread solder W enters the holding hole 52a and is fed a predetermined length, the feed roller 4 is stopped. The feed amount of the thread solder W is controlled by the rotational speed of the feed roller 4. In this state, the cylinder 53 is driven to advance the cutting blade 52 forward.

  Then, as shown in FIG. 2B, a shearing force is applied between the cutting blade 52 and the receiving blade 51 so that the thread solder W is cut to a predetermined length and becomes a solder piece F which is discharged together with the holding hole 52a. It moves over the hole 51d. Here, air is blown onto the holding hole 52a through the hose 51e connected to the introduction hole 51c. The solder piece F falls into the guide tube 7 through the discharge hole 51d, enters the cylinder 9 and moves onto the land P as shown in FIG. In the middle, the sensor 6 detects the passage of the solder piece F, and on the basis of the signal, the feed roller 4 rotates again at the place where the cutting blade 52 is retracted until the holding hole 52a coincides with the supply hole 51b. Is supplied to the holding hole 51b. The solder piece F that has reached the land P becomes molten solder F 'by the heat of the heater 8c, as shown in FIG. Since the molten solder F 'is surrounded by the cylinder 9, it does not scatter around. Further, since the inner peripheral surface of the lower end portion of the cylinder 9 is made of a material that is difficult to wet with solder, the entire amount of the solder pieces F is consumed for joining the metal pins T and the lands P, and the appearance after joining is finished cleanly. Smoke generated by the combustion of the flux during melting is sucked from the suction pipe 8d. Thereafter, the connecting plate 2c is raised and the cylinder 9 is moved away from the wiring board S. Then, the jig 2e moves in the X direction or the ZY direction along with the wiring board S, and starts a bonding process between the next land and the metal pin.

  In the apparatus 1, unlike the above, the heater 8 c may be embedded in the heating block so as to be parallel to the cylinder 9. In this case, as shown in a perspective view in FIG. 5, the thickness around the heater 8 c in the heating block 18 may be further increased. Various combinations of the cylinder and the heating block can be applied. For example, as shown in FIG. 6A, the cylinder 19 may be integrally formed with the heating block. In FIG. 6B, the tube 29 is formed integrally with the heating block, and the upper inner peripheral surface of the tube 29 is tapered upward. FIG. 6C shows a case in which the tube 39 is integrally formed with the heating block, and a coating 39 a made of a material that is difficult to wet with solder is formed on the inner peripheral surface of the tube 39. The coating 39a may be formed only on the inner peripheral surface of the lower end portion. FIG. 6D shows the cylinder 9 formed separately from the heating block 28 in the same manner as in FIG. 4, but the heating block 28 protrudes around the lower end of the cylinder 9 and extends from the heating block 28 to the lower end of the cylinder 9. The heat conduction to is improved. FIG. 6E shows a case where a through-hole constituting a part of the cylinder is formed integrally with the heating block 38, and a short cylindrical tip 49 constituting the remaining part of the cylinder is fitted to the lower end of the through-hole. . The heating block 38 can be molded from a high thermal conductivity material, and the short cylindrical chip 49 can be molded from a non-solder wettable heat resistant material.

  As a heating means, instead of the cylinder 9 and the separate heater 8c, the cylinder 9 itself may be formed of a ceramic in which a resistor or a heating element is embedded, and the cylinder 9 may be directly energized. Alternatively, the cylinder 9 may be formed of a magnetic material, and the cylinder 9 may be heated by applying a high frequency power from a high frequency power supply 48d by winding a coil 48c around the outer periphery as shown in FIG. Alternatively, as shown in FIG. 7B, a sheathed heater 58c may be wound instead of the coil 48c. In any case, since the tube 9 is directly heated, the rise is quick and the efficiency is high. Further, the preheating of the land P is performed using radiant heat. However, depending on the properties of the land P and the thread solder, the cylinder 9 may be brought into contact with the land P and the pin T and may be performed using the conduction heat.

As shown in FIG. 1, a tubular cleaner 2f having an outer diameter smaller than the inner diameter of the cylinder 9 is attached to one side of the jig 2e with the tip facing upward. Then, when the inner surface of the cylinder 9 is dirty, the jig 2e is moved so that the cleaner 2f is positioned immediately below the cylinder 9, and the cleaner 2f is inserted into the cylinder 9 and sucked as shown in FIG. It is preferable to clean the inner surface of the tube 9 by It is preferable that the brush 2g is planted on the outer peripheral surface of the cleaner 2f.
As shown in FIG. 8B as a perspective view, the cylinder 9 may be slightly cut at the lower end surface in the axial direction. Thereby, interference with the adjacent pin T nearby can be avoided.

  9A and 9B show a method of joining the coated conductor terminal U instead of the rod-shaped metal terminal to the land P in parallel with the main surface of the wiring board S. FIG. 9A is a perspective view, and FIGS. 9B to 9D are vertical directions. It is sectional drawing. When the terminal U from which the coating resin at the tip is peeled is placed on the land P, the cylinder 9 is lowered, and the solder piece F is dropped to become the molten solder F ′. The joining is completed by raising the tube 9.

Embodiment 2
A second embodiment of the manufacturing apparatus of the present invention is shown in FIG. 10 (a) as a perspective view, and FIG.
The manufacturing apparatus 11 solders the lead L of the semiconductor package Q having the gull-wing type lead L to the land P of the wiring board S. A plurality of leads L extend from the side surface of the package Q, and it is necessary to solder them simultaneously. Therefore, in the heating block 8, cylinders 59 having the same number of parallel through holes as the number of the leads L (four in the drawing) are embedded, and the same number of solder pieces F are simultaneously dropped and melted. is there.

Embodiment 3
A third embodiment of the manufacturing apparatus of the present invention is shown in FIG. In this embodiment, the receiving blade 51 and the cutting blade 52 in Embodiment 1 are used not as a cutter unit but as a mediation unit. A supply pipe 41 concentric with the supply hole 51b is disposed on the receiving blade 51, and a fixed amount intermittent feeding device 42 is attached to the side surface thereof. The fixed intermittent feeding device 42 has blocking rods 42 a and 42 b on the upper and lower sides, and these advance and retract alternately in the supply pipe 41.

  In this embodiment, the thread solder W is cut in advance into a solder piece J having a predetermined length shorter than the length of the holding hole 52a by a cutter unit (not shown). Then, as shown in FIG. 11A, a large number of solder pieces J descend by their own weight in a single row. When the n-th solder piece J enters the holding hole 52a, the upper blocking rod 42a moves forward and presses the n + 1-th solder piece J to stand by. Next, as shown in FIG. 11B, the cutting blade 52 moves forward to move the nth solder piece J onto the discharge hole 51d. Thereafter, it is dropped onto the solder land P through the guide tube 7 and melted in the same manner as in the first embodiment. In parallel, the lower blocking rod 42b moves forward, and instead the upper blocking rod 42a moves backward to place the (n + 1) th solder piece J on the lower blocking rod 42b. When the cutting blade 52 is retracted, the lower blocking rod 42b is retracted, and the (n + 1) th solder piece J is put into the holding hole 52a.

Embodiment 4
A fourth embodiment of the manufacturing apparatus of the present invention is shown in FIG. In this embodiment, while the solder piece F is being melted, the cylinder 9 is moved horizontally within a range overlapping the terminal in plan view. That is, first, as shown in FIG. 12A, the solder piece F is dropped into the cylinder 9 and melted. Then, as shown in FIGS. 12B and 12C, the cylinder 9 is moved in one direction (left direction in the drawing), and then moved in the opposite direction (same right direction). Thereby, the molten solder spreads to both ends of the land P. More preferably, it is also moved in the front-rear direction. When the cylinder 9 is retracted upward, the solder spreads over the entire land P as shown in FIG. In any case, the cylinder 9 only needs to move relative to the land P. Therefore, in the configuration of the apparatus 1 in which the cylinder 9 is fixed, the land P is moved horizontally. Further, the cylinder 9 may be revolved around the pin T as shown in FIG. In addition, the code | symbol M in a figure shows a wire.

-Embodiment 5
A fifth embodiment of the manufacturing apparatus of the present invention is shown in FIG. 13 as a perspective view of relevant parts and as a sectional view of relevant parts in FIG. In this embodiment, in order to make the solder piece F cut out by the cutter unit fall directly into the cylinder, the guide tube 7 in the first embodiment is omitted, and the cylinder is arranged directly under the cutter unit; The configuration of the cutter unit and the provision of a shutter are different from those of the first embodiment. Hereinafter, differences from the first embodiment will be described in detail.

  The cutter unit 15 has a cylindrical shape, and includes a cutting blade 151 having a solder holding hole 15a penetrating on a diameter line, and a receiving blade 152 having a bearing portion that rotatably holds the cutting blade 151. In order to supply the thread solder W to the solder holding hole 15a on the side surface of the receiving blade 152, a supply hole 15b that coincides with the holding hole 15a at a certain phase of the cutting blade 151 is formed. In addition, a discharge hole 15c that coincides with the holding hole 15a at another phase of the cutting blade 151 is formed below the receiving blade 152 in order to discharge the solder pieces in the holding hole 15a. And the plunger introduction hole 15e which receives the plunger 15d is formed in the upper part facing the discharge hole 15c. The plunger introduction hole 15e is branched upward, and the branch path functions as the gas introduction hole 15f.

The shutter 17 includes a cylinder 17a, a rod 17b, and a shutter plate 17c fixed to the receiving blade 152. As the rod 17b reciprocates, the shutter 17c moves back and forth between the discharge hole 15c and the cylinder 9 in the horizontal direction. Then, the rear end of the tube 9 is opened and closed.
The thread solder W sent by the feed roller 4 enters the holding hole 15a through the supply hole 15b (FIG. 14A). When the cutting blade 151 is rotated in this state, a shearing force acts to cut the thread solder W (FIG. 14B). Then, the shutter 17 is opened, the cutting blade 151 is stopped at a phase where the holding hole 15a coincides with the discharge hole 15c, and gas is introduced. Thereby, the solder piece F exits from the discharge hole 15c and enters the cylinder 9 (FIG. 14C), falls by its own weight, and contacts the land P facing the lower end surface of the cylinder 9. If it is difficult for the solder piece F to fall due to gas introduction, the plunger 15d is lowered to push down the solder piece F. Thereafter, the shutter 17 is closed, and the solder piece F is heated and melted (FIG. 14D).

  Since the shutter 17 is closed, the flux volatilized from the molten solder purifies the surfaces of the land P and the pin T without adhering to the discharge hole 15c and the holding hole 15a. Therefore, the land P and the pin T are joined well. The solder used for one-time soldering is a fixed-length solder piece determined by the length supplied to the holding hole 15a.

-Embodiment 6
A sixth embodiment of the manufacturing apparatus of the present invention is shown in FIG. 15 as an essential part perspective view and FIG. 16 as an essential part sectional view. Also in this embodiment, in order for the solder pieces F cut out by the cutter unit to fall directly into the cylinder, the guide tube 7 in the first embodiment is omitted, and the cylinder is arranged directly below the cutter unit; The configuration of the cutter unit and the provision of a shutter are different from those of the first embodiment. Hereinafter, differences from the first embodiment will be described in detail.

The cutter unit 25 includes a receiving blade 252 having a flat upper surface, and a cutting blade 251 that slides on the upper surface of the receiving blade 252 by driving a cylinder 25c. The receiving blade 252 is formed with a solder holding hole 25a penetrating in the vertical direction. In the cutting blade 251, a solder supply hole 25b and a plunger introduction hole 25e penetrating in the vertical direction are formed at positions corresponding to the holding hole 25a when the cutting blade 251 moves forward and backward, respectively. Further, the plunger introduction hole 25e is branched upward, and the branch path functions as a gas introduction hole 25f. As in the fifth embodiment, the shutter 17 is fixed to the receiving blade 252 and opens and closes the rear end of the tube 9.
In this apparatus, the holding hole 25a also serves as a discharge hole. Therefore, the configuration is simple. Moreover, soldering is performed as well as in the fifth embodiment.

-Embodiment 7-
This is a modification of the sixth embodiment, in which a ventilation hole 9a is provided on one side of the tube 9 as shown in a sectional view of the main part in FIG. By sending an inert gas such as nitrogen into the cylinder 9 from the vent hole 9a, oxidation of the solder and the terminals is prevented, and soldering is performed more satisfactorily.

A cylinder 9 having an inner diameter of 2.5 mm and a solder piece F made of eutectic solder and having a diameter of 1.2 mm and a length of 6 mm was prepared in the shape shown in FIG. Then, when the solder piece F was supplied into the cylinder 9 and soldering was performed while maintaining the lower end temperature of the cylinder 9 at 350 ° C., all of the solder piece F adhered to the pins and lands. This was repeated several tens of times, but solder did not adhere to the inner surface of the tip of the tube 9, and solder clogging did not occur.
For comparison, when soldering was similarly performed using a cylinder made of copper having the same shape and size as the cylinder 9, most of the solder pieces F adhered to the inner surface of the cylinder, and soldered to the lands and pins. Was not sufficiently supplied, and the pins and lands were not joined. In addition, solder clogging occurred in the third soldering.

Claims (8)

In an electronic device manufacturing apparatus having a terminal,
A solder holding hole that is formed of a cutting blade and a receiving blade and can accept thread solder of a predetermined length is formed in at least one of them, and is inserted into the solder holding hole by being relatively displaced while rubbing against each other. A cutter unit for cutting thread solder;
With soldering iron,
The soldering iron is a cylinder made of a single material of aluminum nitride or silicon carbide, and has an inner diameter through which thread solder can pass, penetrates in the axial direction, and opens at both ends;
Heating means for melting the cut solder pieces at the tip of the cylinder ,
The electronic device manufacturing apparatus, wherein the cylinder protrudes downward from the heating means . The manufacturing apparatus according to claim 1, wherein the cylinder has a vent hole penetrating from an outer peripheral surface to an inner peripheral surface. An apparatus according to claim 1 or 2, characterized in that the material of the tube is an aluminum nitride sintered body. In cylinder formed of aluminum nitride or single material of silicon carbide, and has a wire solder can pass inside diameter, a cylindrical with both ends open,
The cylinder is provided with a heating block for melting solder at the tip of the cylinder,
Preparing a soldering iron in which the cylinder protrudes below the heating block ;
The tip of the cylinder is brought close to the terminal of the electronic device,
Cut the thread solder to the length necessary for one soldering, insert the obtained solder piece into the cylinder from the rear end of the cylinder and drop it ,
Method of manufacturing an electronic device, characterized in that to melt the solder strip in the cylinder in front Symbol tip. The manufacturing method according to claim 4, wherein the cylinder has a vent hole penetrating from the outer peripheral surface to the inner peripheral surface. 6. The manufacturing method according to claim 4, wherein the material of the cylinder is an aluminum nitride sintered body. A plurality of the terminals, a combination of a land formed on the substrate and a metal pin inserted into the land, or a land formed on the substrate, a metal pin inserted into the land, and a metal wound around the metal pin The manufacturing method according to claim 4, which is a combination with a wire. The manufacturing method according to claim 7 , wherein an inner diameter of the cylinder is smaller than a length of the solder piece.

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