JP2015166098A - Soldering apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering iron and a soldering apparatus, each having a simple structure, capable of suppressing cost increase, and soldering accurately and efficiently.SOLUTION: A soldering apparatus A includes a cylindrical iron tip 5 having an open hole 51 formed thereon through which solder Wh is supplied, a heater unit 4 for heating the iron tip 5, a temperature acquisition part 7 for acquiring the temperature of the iron tip 5, and a control part 8 for controlling output of the heater unit 4(41) on the basis of the temperature of the iron tip 5 acquired by the temperature acquisition part 7.

Description

  The present invention relates to a soldering apparatus for soldering components.

  In recent years, many electric devices are equipped with electronic circuits on which electronic components are mounted. In the electronic circuit, a terminal or wire of the electronic component is inserted into a through hole (through hole) formed in the wiring board, and a tip portion thereof is soldered to a wiring pattern (land) formed around the through hole. By doing so, mounting and fixing of electronic components and wires to the wiring board are performed. For example, Patent Document 1 discloses a soldering apparatus that performs the soldering accurately and efficiently.

  The soldering apparatus described in Patent Document 1 includes a cylindrical tip. The soldering apparatus supplies thread solder into the cylinder in a state where the tip of a terminal (or wire) protruding from the through hole is surrounded by the inner surface of the tip of the cylinder. Then, by heating the tip, the solder is melted and the melted solder (molten solder) is evenly supplied around the terminals to solder the terminals and the lands. By using such a soldering apparatus, adhesion of molten solder and / or flux to unnecessary portions is suppressed.

Japanese Patent No. 5184359

  In the soldering apparatus, the wiring board is preheated and soldered in a state where the tip is in contact with the wiring board, so that the terminal is preheated, and the thread solder is supplied to the inner surface of the tip of the cylinder. It is difficult to confirm the state, the melted state, and the like.

  In such a soldering apparatus, a method of managing the timing of each soldering operation by time can be considered. When managing the soldering operation by time, even if the thread solder is not supplied or excessively melted, it will be judged that the soldering has been completed after a certain period of time. The accuracy is lowered, and the efficiency may be lowered because it is necessary to perform soldering again.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a soldering iron and a soldering apparatus that have a simple structure, suppress an increase in cost, and can perform soldering accurately and efficiently.

  In order to achieve the above object, the present invention provides a cylindrical tip having a through-hole to which solder is supplied, a heater unit that heats the tip, and a temperature acquisition unit that acquires the temperature of the tip. A soldering apparatus is provided that includes a control unit that controls the output of the heater unit based on the temperature of the tip acquired by the temperature acquisition unit.

  According to this configuration, since the tip temperature is measured and the output of the heater unit is controlled based on the temperature, the tip temperature can be accurately adjusted. Thereby, since the tip can be maintained at a temperature suitable for soldering, it is possible to perform soldering efficiently.

  Moreover, since the state of the tip and / or the surrounding of the tip can be detected from the temperature change of the tip, it is possible to suppress soldering under an inappropriate condition. It is possible to reduce the occurrence of defective products, that is, to perform efficient soldering.

  The said structure WHEREIN: The said temperature acquisition part may be equipped with the temperature measuring device which measures the temperature of the said tip directly. According to this configuration, since the temperature of the tip is directly measured, the measurement accuracy is high, and the state of the tip and / or the surrounding of the tip can be accurately detected.

  In the above configuration, the temperature acquisition unit includes a temperature measuring device that measures the temperature of the heater unit, and the control unit estimates the temperature of the tip based on the temperature measured by the temperature measuring device. It may be. According to this configuration, since a member such as a temperature measuring instrument is not attached to the tip, the tip can be easily attached and detached. Moreover, since what has been used conventionally can be utilized as a tip, versatility can be improved.

  The said structure WHEREIN: The said temperature acquisition part may be equipped with the 1st temperature measuring device which directly measures the temperature of the said tip, and the 2nd temperature measuring device which measures the temperature of the said heater unit.

  In the above configuration, when the temperature acquired by the first temperature measuring device is lower than the temperature acquired by the second temperature measuring device and the temperature difference is within a certain range, You may make it judge that the heat | fever is appropriately conducted to the said tip.

  In the above configuration, when the temperature acquired by the first temperature measuring device is higher than the temperature acquired by the second temperature measuring device or lower within a certain range, the control unit is configured so that the supplied solder is in the through hole. It may be determined that it has melted before reaching.

  In the above configuration, the tip is detachably attached to the heater block, the temperature measuring device is directly attached to the tip, and the temperature measuring device and the control unit can be separated from each other. You may make it connect via. According to this configuration, even when the tip falls off due to vibration or impact, the contact wire can be easily disconnected, so that the connection line connecting the temperature measuring device and the control unit is not easily damaged.

  The said structure WHEREIN: The said temperature measuring device may be provided with the thermocouple. By using a thermocouple, the cost can be reduced, the installation location can be reduced, and the soldering device itself can be reduced in size.

  The said structure WHEREIN: The said temperature measuring device may be provided with the non-contact-type temperature measurement sensor. By providing the non-contact type temperature sensor, the temperature of the tip and / or the heater unit is directly measured, so that the measurement accuracy can be increased.

  The said structure WHEREIN: The said temperature measuring device is a temperature measurement sensor which measures temperature by detecting the emitted infrared rays, The reflection member which reflects infrared rays may be provided in the said temperature measurement sensor. According to this configuration, by changing the position and angle of the reflecting member that reflects infrared light, the temperature measurement sensor can be irradiated with infrared light, so that the degree of freedom of the installation location of the temperature measurement sensor is increased.

  In the above configuration, when the tip contacts the target member to be soldered and performs preliminary heating, the control unit accurately reserves the target member when the temperature change of the tip is within a predetermined condition. You may make it judge that it is heating.

  In the above-described configuration, when the control unit melts the solder supplied inside the tip through-hole, when the tip temperature change falls within a predetermined condition, an accurate size solder is obtained. It may be determined that the solder is supplied and is in an appropriate state.

  According to the present invention, it is possible to provide a soldering iron and a soldering apparatus that have a simple structure, suppress an increase in cost, and can perform soldering accurately and efficiently.

It is a perspective view of an example of the soldering apparatus concerning the present invention. It is sectional drawing of the soldering apparatus shown in FIG. It is a block diagram which shows the outline of the soldering apparatus concerning this invention. It is a timing chart which shows the temperature of the tip of the soldering apparatus concerning this invention, and the output of a heater. It is sectional drawing of the soldering iron in the state which preheats the land before performing soldering and the terminal of an electronic component. It is a figure which shows the temperature change of the tip until a fixed time passes since the contact of the tip. It is sectional drawing of the soldering iron in the state which supplies the solder piece formed by cut | disconnecting thread solder to the soldering hole of a soldering tip. It is a figure which shows the temperature change of the tip until a fixed time passes after a solder piece is supplied. It is a partial cross section figure of other examples of the soldering apparatus concerning this invention. It is a partial cross section figure of other examples of the soldering apparatus concerning this invention. FIG. 10 is a partial cross-sectional view of still another example of the soldering apparatus according to the present invention. FIG. 10 is a partial cross-sectional view of still another example of the soldering apparatus according to the present invention. It is a one part perspective view of the further another example of the soldering apparatus concerning this invention. FIG. 14 is a cross-sectional view of the soldering apparatus shown in FIG. It is sectional drawing of the state which attached the tip of the soldering apparatus shown in FIG.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 1 is a perspective view of an example of a soldering apparatus according to the present invention, FIG. 2 is a cross-sectional view of the soldering apparatus shown in FIG. 1 cut along line II-II, and FIG. 3 is a soldering according to the present invention. It is a block diagram which shows the outline of an apparatus. In FIG. 1, a part of the support portion 1 is cut to display the inside of the soldering apparatus.

  The soldering apparatus A according to the present invention supplies the thread solder W from above and uses the solder iron Sa provided at the lower part to solder the wiring board Bd and the electronic component Ep disposed below the solder iron Sa. It is a device to attach. As shown in FIGS. 1, 2, and 3, the soldering apparatus A includes a support unit 1, a cutter unit 2, a drive mechanism 3, a solder feeding mechanism 6, a solder iron Sa, and a control unit 8 (see FIG. 3). Yes.

  The soldering apparatus A supplies the molten solder to the lands Ld of the wiring board Bd attached to the jig Gj and the terminals of the electronic component Ep arranged on the wiring board Bd, and performs connection fixing. When performing soldering, the jig Gj is moved vertically and horizontally to position the wiring board Bd with the land Ld. Further, the soldering apparatus A is movable in the vertical direction, and the tip of the solder iron Sa can be brought into contact with the land Ld by moving in the vertical direction after positioning.

  The support portion 1 includes a flat plate-like wall body 11 that is erected. The cutter unit 2 is for cutting the thread solder W fed by the solder feeding mechanism 6 into solder pieces having a predetermined length. The cutter unit 2 includes a cutter lower blade 22 fixed to the sliding guide 13, and a cutter upper blade 21 that is disposed above the cutter lower blade 22 and is slidably disposed. Further, the cutter unit 2 includes a pusher pin 23 that is driven in a vertical direction (a direction intersecting a sliding direction of the cutter upper blade 21) by a second actuator 32 described later of the drive mechanism 3 (see FIG. 2). ).

  As shown in FIG. 2, the cutter upper blade 21 is an upper blade hole 211 that is a through hole into which the thread solder W fed by the solder feeding mechanism 6 is inserted, and a through hole into which the pusher pin 23 is inserted. Pin hole 212 is provided. The lower edge of the upper blade hole 211 is formed in a cutting edge shape. The cutter lower blade 22 includes a lower blade hole 221 that is a through hole into which the thread solder W penetrating the upper blade hole 211 is inserted. The edge part of the upper end of the lower blade hole 221 is formed in a cutting blade shape. The upper blade hole 211 and the lower blade hole 221 are displaced in a direction intersecting with the thread solder W in a state where the thread solder W is inserted, so that the thread solder W is cut into solder pieces by the mutual cutting blades.

  The upper blade hole 211 and the pin hole 212 are provided side by side in the sliding direction of the cutter upper blade 21. The cutter upper blade 21 slides between a position where the upper blade hole 211 and the lower blade hole 221 overlap vertically and a position where the pin hole 212 and the lower blade hole 221 overlap vertically.

  As shown in FIG. 2, the drive mechanism 3 includes a first actuator 31 that is fixed to the cutter lower blade 22 and slides the cutter upper blade 21, and a second actuator that is attached to the cutter upper blade 21 and drives the pusher pin 23. 32. The first actuator 31 includes a cylinder 311 fixed to the cutter lower blade 22 and a piston rod 312 that is disposed inside the cylinder 311 and expands and contracts by the pressure of supplied air. The tip portion of the piston rod 312 is fixed to the cutter upper blade 21, and the cutter upper blade 21 slides by the expansion and contraction of the piston rod 312.

  In the soldering apparatus A shown in FIG. 2, when the piston rod 312 of the first actuator 31 protrudes most from the cylinder 311, the cutter upper blade 21 is at the left end in the figure, and the upper blade hole 211 is connected to the lower blade hole 221. It is designed to overlap vertically. Although not shown, when the piston rod 312 is housed in the cylinder 311, the cutter upper blade 21 moves to the right end in the figure, and the pin hole 212 overlaps the lower blade hole 221.

  The second actuator 32 includes a cylinder 321 fixed to the cutter upper blade 21 and a piston rod 322 that is disposed inside the cylinder 321 and expands and contracts by air pressure. A pusher pin 23 is fixed to the tip of the piston rod 322. When the pin hole 212 and the lower blade hole 221 overlap each other, the second actuator 32 extends the piston rod 322 so that the pusher pin 23 is inserted into the lower blade hole 221 and the piston rod 322 is moved. The pusher pin 23 is removed from the lower blade hole 221 by being accommodated in the cylinder 321. Even when the solder piece cut by the cutter unit 2 remains in the lower blade hole 221, it is pushed out by the operation of the pusher pin 23.

  The solder feed mechanism 6 supplies the thread solder W, and includes a pair of feed rollers 61 that feed the thread solder W and a guide tube 62 that guides the thread solder W fed by the feed roller 61. The pair of feed rollers 61 is attached to the support portion 1, sandwiches the thread solder W, and rotates to feed the thread solder W downward. The feed roller 61 determines the length of the fed solder wire according to the rotation angle (number of rotations).

  The guide tube 62 is a tube body that can be elastically deformed, and its upper end is disposed in the vicinity of a portion of the feed roller 61 where the thread solder W is fed out. The lower end of the guide tube 62 moves following the sliding of the cutter upper blade 21 and is connected to the upper blade hole 211. The guide tube 62 is provided so as not to be pulled or stretched within a range in which the cutter upper blade 21 slides.

  As shown in FIGS. 1 and 2, the solder iron Sa is fixed below the cutter unit 2. Details of the soldering iron Sa according to the present invention will be described.

  The soldering iron Sa includes a heater unit 4, a soldering tip 5 attached to the heater unit 4, and a temperature acquisition unit 7 that acquires the temperature of the soldering tip. As shown in FIG. 2, the heater unit 4 includes a heater 41 that generates heat when energized, a heater block 42 for attaching the heater 41, and a heater block holder 43 that holds the heater block 42.

  The heater block 42 has a cylindrical shape, and a heater 41 is wound around the outer peripheral surface. The heater block 42 includes a recess 421 having a circular cross section for attaching the tip 5 to the lower end portion in the axial direction, and a solder supply hole 422 penetrating from the center of the bottom of the recess 421 to the opposite side.

  The heater block holding portion 43 includes a holding hole 430 that is a through hole formed in the flat body portion. The heater block 42 is held by the heater block holding portion 43 by press-fitting the end of the heater block 42 opposite to the concave portion 421 into the holding hole 430. As shown in FIG. 2, the portion that is press-fitted into the holding hole 430 of the heater block 42 is formed with a step so as to have a small diameter, but is not limited to this, and has a shape without a step. There may be.

  By attaching the heater block holding part 43 to the support part 1, the soldering iron Sa is fixed to the support part 1. As shown in FIG. 2, when the heater block holding portion 43 is attached to the support portion 1, the solder iron Sa connects the lower blade hole 221 of the cutter lower blade 22 and the solder supply hole 422 of the heater block 42.

  As shown in FIG. 2, the tip 5 is a cylindrical member, and includes a solder hole 51 extending in the axial direction in the central portion. The tip 5 is preferably made of a material having a high thermal conductivity, for example, a ceramic such as silicon carbide or aluminum nitride, or a metal such as tungsten.

  The tip 5 is disposed with the upper portion in the axial direction inserted into the recess 421 of the heater block 42, and the lower end protrudes downward from the heater block 42. The solder hole 51 of the tip 5 and the solder supply hole 421 communicate with each other. The thread solder cut by the cutter unit 2 is supplied from the lower blade hole 221 to the solder hole 51 through the solder supply hole 421.

  When soldering with the soldering iron Sa, the heat of the heater 41 is transmitted through the heater block 42, and the solder pieces supplied to the solder holes 51 are melted by the heat. In the soldering apparatus A, soldering, flux fume, and the like are suppressed from being scattered by performing soldering in a state where the tip of the cylindrical tip 5 is in contact with the land Ld of the wiring board Bd. On the other hand, since soldering is performed in a state where the soldering portion 5 surrounds the portion to be soldered, it is difficult to confirm the state of solder during soldering and the preheating state of the land Ld. Therefore, in the soldering apparatus A according to the present invention, the temperature acquisition unit 7 acquires the temperature of the tip 5 of the soldering iron Sa.

  As shown in FIGS. 1 and 2, the temperature acquisition unit 7 includes a non-contact type temperature measurement sensor 71 that is a temperature measuring device. As such a non-contact type thermometer, for example, there is a radiation thermometer that measures the temperature of the tip 5 by detecting infrared rays emitted from the tip 5, but is not limited thereto. The temperature measurement sensor 71 is attached to the tip of a stay 431 formed in the heater block holding portion 43 so that a detection portion for detecting infrared rays faces the tip 5. The temperature measuring sensor 71 can transmit information on the measured temperature to the control unit 8 as an electrical signal.

  The control unit 8 will be described. The control unit 8 includes a logic circuit such as an MPU or CPU. As shown in FIG. 3, the control unit 8 controls the first actuator 31 and the second actuator 32 of the drive unit 3, the heater 41 of the heater unit 4, and the feed roller 61 of the solder feed unit 6. It is connected to each part and can send and receive signals. The control unit 8 is connected to the temperature measurement sensor 71 of the temperature acquisition unit 7 and acquires the temperature of the tip 5 measured by the temperature measurement sensor 71. Further, the control unit 8 is connected to the storage unit 81 and can exchange information with the storage unit 81. The storage unit 81 includes a ROM that can call information, a RAM that can be called and written, a semiconductor memory such as a detachable flash memory, a hard disk, and the like.

  The operation of the soldering apparatus A according to the present invention will be described with reference to the drawings. FIG. 4 is a timing chart showing the tip temperature and heater output of the soldering apparatus according to the present invention. FIG. 4 includes two upper and lower broken lines. The upper part shows the temperature change of the tip 5 measured by the temperature measurement sensor 71, and the lower part shows the output of the heater 41. Also, the horizontal axis in FIG. 4 is time, and for the sake of convenience, the leftmost part is the timing S0. Further, in FIG. 4, the first output H1, the second output H2, and the third output H3 are used as the output of the heater 41.

  In the soldering apparatus A, the tip 5 is always maintained at the temperature T1 during the driving time in order to perform soldering quickly. While maintaining the tip 5 at the temperature T1, the output of the heater 41 is set to the first output H1. That is, the tip 5 is maintained at the temperature T1 by the output of the heater 41 by the first output H1. At this time, the tip 5 is not in contact with the substrate or the like, and no solder piece is supplied.

  FIG. 5 is a cross-sectional view of the solder iron in a state in which preheating of the lands and the terminals of the electronic component before soldering is performed. In the soldering apparatus A, pre-heating of the terminals of the electronic components protruding from the lands Ld and the lands Ld is performed before soldering. By performing this preliminary heating, it is possible to quickly pour molten solder into an appropriate position.

  As shown in FIG. 5, in the soldering apparatus A, preheating is performed in which the tip 5 is brought into contact with the land Ld and the terminals of the land Ld and the electronic component Ep are heated prior to soldering. When the tip 5 is brought into contact with the land Ld, the heat held by the tip 5 is transferred to the land Ld. For this reason, the temperature of the tip 5 rapidly decreases. As shown in FIG. 4, the temperature of the tip 5 decreases at the timing S <b> 1 when the tip 5 comes into contact with the land Ld.

  Since the control unit 8 controls the movement of the soldering apparatus A or acquires information on the movement from a control unit (not shown) for controlling the movement provided separately, the tip 5 The information of the timing S1 which contacts the land Ld is acquired. As described above, since the temperature of the tip 5 decreases due to the contact with the land Ld, the control unit 8 causes the heater 41 at the timing S1 at which the tip 5 and the land Ld come into contact (assumed to be in contact). Is switched from the first output H1 to the second output H2 (see FIG. 4). As shown in FIG. 4, the second output is larger than the first output H1.

  The control unit 8 recognizes that the tip 5 and the land Ld are in contact with each other at the timing S1 based on the operation of the soldering apparatus A, and the tip 5 is different from the land Ld on which the soldering is performed. It is also conceivable that they are in contact with each other or are not in exact contact with the land Ld. Therefore, the control unit 8 confirms the contact between the tip 5 and the land Ld based on the temperature of the tip 5. Below, the confirmation of the contact between the tip 5 and the land Ld by the control unit 8 will be described.

  The temperature measuring sensor 71 always measures the temperature of the tip 5. The control unit 8 causes the storage unit 81 to store the timing (timing S1) when the tip 5 comes into contact with the land Ld (or contact) and the temperature of the tip 5 at that time. And the control part 8 acquires the temperature of the tip 5 when predetermined time passes from timing S1 (timing S2). And the control part 8 has confirmed the contact of the tip 5 and the land Ld based on the temperature (temperature difference with timing S1) of timing S2.

  FIG. 6 is a diagram showing a temperature change of the tip until a predetermined time elapses from the contact of the tip. In FIG. 6, a solid line CL1 is a temperature change when the tip 5 comes into contact with a predetermined land Ld (assumed to be an appropriate land Ld). Of the remaining three broken lines, broken lines CL2 and CL3 indicate the temperature change of the tip 5 when contacting a land different from the predetermined land Ld, and the broken line CL4 indicates a case where the tip 5 does not contact the land Ld. The temperature change of the tip 5 is shown.

  As shown in FIG. 6, when the tip 5 comes into contact with an appropriate land Ld to be soldered, the temperature of the tip 5 from the timing S1 to the timing S2 follows the solid line CL1, and the tip at the timing S2. The temperature of 5 becomes the temperature T3.

  On the other hand, when the size of the contact land Ld is larger than the land to be soldered or when the specific heat is large, a lot of heat is taken from the tip 5. Therefore, at the timing S2, the temperature of the tip 5 is lower than when the contact is made with the appropriate land Ld (broken line CL2, temperature T32). On the contrary, when the contact land Ld is smaller than the land to be soldered, the temperature of the tip 5 is increased (broken line CL3, temperature T33). Further, when the tip 5 does not contact the land Ld, the tip 5 is not deprived of heat by the land Ld. Further, since the heater 41 is raised from the first output H1 to the second output H2, the temperature of the tip 5 is higher at the timing S2 than when measured at the timing S1 (broken line CL4, temperature T34).

  The controller 8 determines that the tip 5 is accurately in contact with the land Ld to be soldered when the temperature of the tip 5 reaches the temperature T3 of the solid line CL1. On the other hand, when the temperature changes away from the solid line CL1, the control unit 8 does not contact the land Ld to be soldered accurately, contacts a different land Ld, or the tip 5 contacts the land Ld. Judge that it is not. Information on the temperature change of the tip 5 indicated by the solid line CL1 is stored in the storage unit 81 in advance, and the control unit 8 compares the information with the actually measured temperature of the tip 5 from the temperature measurement sensor 71.

  When the control unit 8 determines that the land Ld to be soldered and the tip 5 are not in contact, the soldering apparatus A adjusts the output of the heater 41, for example, and is currently in contact with the tip 5 An operation of separating from the land Ld is performed.

  As shown in FIG. 4, when the tip 5 is in contact with an appropriate land Ld to be soldered, the control unit 8 maintains a state where the heater 41 outputs the second output H2. When the temperatures of the tip 5 and the land Ld coincide with each other, the temperature of the tip 5 changes from falling to rising. Thereafter, the temperature of the tip 5 and the temperature of the land Ld transition (rise) at substantially the same temperature. That is, when the temperature of the tip 5 reaches a predetermined preheating temperature T2, the terminals of the land Ld and the electronic component Ep are also raised to the preheating temperature T2. Using this fact, when the tip 5 rises to the preheating temperature T2 (timing S3), the control unit 8 determines that the preheating of the lands Ld and the terminals of the electronic component Ep is completed.

  FIG. 7 is a cross-sectional view of the soldering iron in a state where a solder piece formed by cutting the thread solder into the soldering hole at the tip is supplied. The controller 8 determines that the preheating of the lands Ld and the terminals of the electronic component Ep has been completed at the timing S3 when the temperature of the tip 5 reaches the temperature T2, and drives the first actuator 31 to remove the thread solder W from the solder piece. Cut to Wh. And the control part 8 drives the 2nd actuator 32, pushes the solder piece Wh cut | disconnected by the pusher pin 23, and supplies the solder piece Wh to the soldering plan 51 of the tip 5 (refer FIG. 7).

  When the solder piece Wh melts inside the solder hole 51 of the tip 5, it takes heat of fusion from the tip 5. Since the solder piece Wh needs a lot of heat when it melts, the temperature of the tip 5 drops. The controller 8 controls the output of the heater 41 so that the output of the heater 41 changes from the second output H2 to the third output H3 in order to quickly melt the solder piece Wh of the solder hole 51 of the tip 5 (FIG. 4). reference).

  As shown in FIG. 7, the solder piece Wh is supplied from the lower blade hole 221 to the solder hole 51 via the solder supply hole 421. In the soldering apparatus A, in order to confirm from the outside whether the solder piece Wh has been correctly supplied or the solder piece Wh of the correct size (length) has been supplied, the change in the temperature of the tip 5 can be confirmed. Is used.

  The control unit 8 causes the storage unit 81 to store the timing at which the preheating is completed (timing S3) and the temperature of the tip 5 at that time. And the control part 8 acquires the temperature of the tip 5 when predetermined time passes from timing S3 (timing S4). And the control part 8 has confirmed the contact with the tip 5 and the land Ld based on the temperature of timing S4 (or temperature difference with timing S3).

  FIG. 8 is a diagram showing a temperature change of the tip from the time when the solder piece is supplied until a predetermined time elapses. In FIG. 8, a solid line DL1 is a temperature change of the tip 5 when the solder piece Wh having an accurate size is supplied. Among the remaining three broken lines, broken lines DL2 and DL3 indicate temperature changes of the tip 5 when a solder piece Wh having a predetermined size is supplied, and a broken line DL4 indicates that the solder piece Wh is not supplied. The temperature change of the tip 5 is shown.

  As shown in FIG. 8, when a solder piece Wh of an appropriate size is supplied to the solder hole 51 of the tip 5, the temperature of the tip 5 from timing S3 to timing S4 follows the solid line DL1, The temperature of the tip 5 decreases from the temperature T2 at the timing S3 to the temperature T5 at the timing S4. This temperature drop is due to the heat of fusion of the solder as described above.

  On the other hand, when the supplied solder piece Wh is larger than the solder piece Wh of an appropriate size (length is long), a lot of heat is taken from the tip 5. Therefore, at the timing S4, the temperature of the tip 5 is lower than when the solder piece Wh of an appropriate size is supplied (broken line DL2, temperature T52). Conversely, when the supplied solder piece Wh is smaller than the appropriate solder piece Wh, the heat deprived from the tip 5 is reduced, and the temperature of the tip 5 at the timing S4 is increased (broken line DL3, temperature T53). Further, when the solder piece Wh is not supplied to the solder hole 51 of the tip 5, the tip 5 is not deprived of heat of fusion when the solder piece Wh melts. Further, since the heater 41 is raised from the second output H2 to the third output H3, the temperature of the tip 5 becomes higher at the timing S4 than when measured at the timing S3 (broken line DL4, temperature T54).

  The controller 8 determines that an appropriate solder piece Wh is supplied to the solder hole 51 of the tip 5 when the temperature of the tip 5 reaches the temperature T5 of the solid line DL1. On the other hand, when the temperature changes away from the solid line DL1, the control unit 8 determines that the length of the supplied solder piece Wh is short or the solder piece Wh is not supplied. Information on the temperature change of the solid line DL1 at the timing S4 is stored in the storage unit 81 in advance, and the control unit 8 compares the information with the actually measured temperature of the tip 5 from the temperature measurement sensor 71. . The control unit 8 stops soldering.

  In addition, as operation | movement of the soldering apparatus A when the solder piece Wh of an appropriate magnitude | size is not supplied, the following can be mentioned, for example. When the solder piece Wh is supplied (when the tip 5 indicates the temperature change of the broken lines DL2 and DL3), the output from the heater 41 is suppressed in order to prevent the molten solder from flowing out and contaminating the surroundings. And wait until the temperature of the tip 5 reaches a temperature at which the outflow of solder can be suppressed. On the other hand, when the solder piece Wh is not supplied (when the tip 5 indicates a temperature change of the broken line DL4), the output of the heater 41 is stopped and the tip 5 is separated from the land Ld. In addition, when a failure occurs such that the solder piece Wh is not supplied, it may be notified that it is abnormal, or it may be configured to simply stop or perform the same operation again.

  In addition, by using the temperature acquisition unit 7 to check the melting state of the solder piece Wh, it is determined whether heat is reliably transferred to the solder piece Wh, and is called dross in the solder hole 51 of the tip 5. It is also possible to detect adhesion of deposits (carbide, tin oxide, etc.).

  As shown in FIG. 4, when a solder piece Wh of an appropriate size is supplied, the temperature of the tip 5 decreases until the solder piece Wh finishes melting, and then increases. When the temperature of the tip 5 rises to a predetermined temperature T4, the control unit 8 determines that the soldering is finished. Then, after the soldering is completed, after the tip 5 reaches the temperature T1, the control unit 8 adjusts the output of the heater 41 to the first output H1 in order to maintain the temperature T1 of the tip 5.

  Thus, by measuring the temperature of the tip 5 and adjusting the output of the heater 41 based on the temperature, useless heating is not performed. Further, depending on the temperature of the tip 5, it is possible to determine whether the tip 5 and the land Ld are in proper contact with each other or whether the solder piece Wh having an appropriate length is supplied. Thereby, it is possible to suppress the occurrence of problems that the land Ld and the electronic component Ep are not sufficiently heated and soldering becomes insufficient, or the wiring board and the electronic component are damaged due to overheating. In addition, the soldering operation is performed in a state where the solder piece Wh is not supplied, and the manufacturing process is not completed in a state where the land Ld and the terminal of the electronic component Ep are not connected, and there are many defective products. It is possible to prevent it from coming out.

  Moreover, the tip 5 can be easily replaced by using the non-contact type temperature acquisition unit 7 as in the present embodiment. It is also possible to detect the temperature at all times and detect an abnormality over time when the temperature reaches the set temperature. Further, it is possible to detect the state from the time change pattern of the temperature. Further, a database for setting time and temperature may be provided based on the shape of the workpiece (land, terminal), the size of the solder piece, and the like. At this time, each parameter of the database may be acquired by a preliminary test, or a learning function may be provided so that the database can be updated as needed.

(Second Embodiment)
Another example of the soldering apparatus according to the present invention will be described with reference to the drawings. FIG. 9 is a partial cross-sectional view of another example of the soldering apparatus according to the present invention. In the soldering iron Sa2 of the soldering apparatus B shown in FIG. 9, the temperature acquisition unit 7b reflects the temperature measurement sensor 71, which is a temperature measuring device for detecting infrared rays, and the infrared radiation emitted from the tip 5 to the temperature measurement sensor 71. A reflection member 72 is provided. The temperature measurement sensor 71 has the same configuration as the temperature measurement sensor 71 of the solder iron Sa. The other parts of the soldering apparatus B have the same configuration as that of the soldering apparatus A. The substantially same parts are denoted by the same reference numerals and detailed description of the same parts is omitted. To do.

  As shown in FIG. 9, the temperature measurement sensor 71 is attached to the stay 431. The reflection member 72 is also attached to the stay 431 although not shown. Thus, by providing the reflection member 72, the detection part of the temperature measurement sensor 71 does not need to face the tip 5 and the degree of freedom of the installation place of the temperature measurement sensor 71 can be increased. For example, as shown in FIG. 9, the temperature measurement sensor 71 can be firmly fixed to the stay 431.

  Other features are the same as in the first embodiment.

(Third embodiment)
Another example of the soldering apparatus according to the present invention will be described with reference to the drawings. FIG. 10 is a partial cross-sectional view of another example of the soldering apparatus according to the present invention. The soldering iron Sa3 of the soldering apparatus C shown in FIG. 10 has a configuration in which the first thermocouple 73 is attached to the tip 5c as the temperature acquisition unit 7c. Other parts of the soldering apparatus C have the same configuration as the soldering apparatus A, and substantially the same parts are denoted by the same reference numerals, and detailed description of the same parts is omitted.

  The tip 5c used for the soldering iron Sa3 has a first thermocouple 73 (one of the temperature measuring devices) inserted and fixed in a recessed hole provided on the side surface. The first thermocouple 73 is fixed by using a ceramic adhesive, but is not limited to this. Even if the temperature of the tip 5c rises, the first thermocouple 73 is fixed. What can be maintained firmly can be widely adopted.

  Thus, by using the 1st thermocouple 73 as the temperature acquisition part 7c, it is possible to reduce cost rather than using a non-contact-type temperature measurement sensor. Since the first thermocouple 73 is directly attached to the tip 5c, the temperature of the tip 5c can be accurately measured.

  Moreover, by using the 1st thermocouple 73, the installation place of the temperature acquisition part 7c can be made small, and it is possible to miniaturize soldering apparatus C itself. In addition, since the first thermocouple 73 is in direct contact with the tip 5c, the temperature of the tip 5c can be detected even when a member that blocks infrared rays is disposed in the vicinity of the tip 5. . In addition, the temperature acquisition unit 7 and the temperature acquisition unit 7b are difficult to measure when the angle of the measurement unit is shifted due to external impact or vibration, but the first thermocouple 73 is directly connected to the tip 5c. Even when an external impact or vibration is applied, it is possible to continue measuring the temperature of the tip 5c. That is, by using the temperature acquisition unit 7c, it is possible to provide a soldering apparatus C that is resistant to external contamination such as dust and dust, vibrations, and shocks.

  Other features are the same as those of the first and second embodiments.

(Fourth embodiment)
Still another example of the soldering apparatus according to the present invention will be described with reference to the drawings. FIG. 11 is a partial sectional view of still another example of the soldering apparatus according to the present invention. The soldering iron Sa4 of the soldering apparatus D shown in FIG. 11 has a configuration in which the second thermocouple 74 is attached to the heater block 42d as the temperature acquisition unit 7d. The other parts of the soldering apparatus D have the same configuration as the soldering apparatus C. The substantially same parts are denoted by the same reference numerals, and detailed description of the same parts is omitted.

  As shown in FIG. 11, the heater block 42d used for the soldering iron Sa4 has a second thermocouple 74 (one of the temperature measuring instruments) inserted and fixed in a recessed hole provided on the side surface. In addition, as a fixing method of the 2nd thermocouple 74, the same method as the 1st thermocouple 73 may be employ | adopted, and a different method may be employ | adopted. However, the present invention is not limited to this, and a wide variety of devices that can maintain a fixed state even when the temperature of the heater block 42d rises can be widely used.

  In the solder iron Sa4, the heat of the heater 41 is conducted to the heater block 42d, and further conducted from the heater block 42d to the iron tip 5. Therefore, by measuring the temperature of the heater block 42d with the second thermocouple 74 and transmitting the information to the control unit 8, the control unit 8 can obtain the temperature of the tip 5 from the temperature.

  In this embodiment, since the temperature of the tip 5 is not directly measured, the relationship between the temperature acquired by the control unit 8 and each timing of the soldering operation of the soldering apparatus D is as follows. The relationship is different from FIG. 4 shown in the embodiment.

  By using the soldering device D of the present embodiment, since the thermocouple is not attached to the tip 5, the tip 5 can be easily attached and detached, and the maintainability can be improved. It becomes. It is also possible to attach a tip used in a conventional soldering apparatus or a newly prepared tip.

  Further, since the temperature of the heater block 42d is measured by the second thermocouple 74, the controller 8 is operating normally when the temperature of the heater block 42d measured by the second thermocouple 74 is low. It can be judged that there is not. Thus, not only the tip 5 but also the state of the heater unit 4 can be detected.

  In the present embodiment, the temperature of the heater block 42d is measured by a thermocouple, but a non-contact type temperature measurement sensor such as the soldering apparatus A or the soldering apparatus B may be used.

  The other features are the same as in the third embodiment.

(Fifth embodiment)
Still another example of the soldering apparatus according to the present invention will be described with reference to the drawings. FIG. 12 is a partial cross-sectional view of still another example of the soldering apparatus according to the present invention. The soldering iron Sa5 of the soldering apparatus E shown in FIG. 12 includes a first thermocouple 73 fixed to the tip 5c and a second thermocouple 74 fixed to the heater block 42d as the temperature acquisition unit 7e. It is said. The other parts of the soldering apparatus E have the same configurations as the soldering apparatus C and the soldering apparatus D, and substantially the same parts are denoted by the same reference numerals and detailed description of the same parts Is omitted.

  The first thermocouple 73 and the second thermocouple 74 are each connected to the control unit 8. The connection unit 8 acquires the temperature of the tip 5 c from the first thermocouple 73 and acquires the temperature of the heater block 42 d from the second thermocouple 74.

  In some cases, the solder piece Wh is caught in the solder supply hole 421 and the solder piece Wh is melted in the solder supply hole 421. In such a case, the temperature of the heater block 42d rapidly decreases. In the soldering apparatus E, for example, when the temperature of the heater block 42d acquired from the second thermocouple 74 is significant even though the temperature of the tip 5c acquired from the first thermocouple 73 is not so much lowered, The control unit 8 determines that the solder piece Wh has melted in the solder supply hole 421.

  The control unit 8 also determines that the temperature of the tip 5c acquired from the first thermocouple 73 is significantly lower than the temperature of the heater block 42d acquired from the second thermocouple 74 (from a predetermined temperature difference). If there is a large temperature difference), it is determined that the heat of the heater 41 is not transferred to the tip 5c. The reason why the heat of the heater 41 is not transmitted to the tip 5c is that the contact between the heater block 42d and the tip 5c is not sufficient, or the tip 5c is damaged, a gap is opened and a thermal resistance is formed. Cases can be considered.

  In addition to these, the controller 8 uses the temperature information of the tip 5c from the first thermocouple 73 and the temperature information of the heater block 42d from the second thermocouple 74 to change the state of the solder rod Sa5. It is possible to detect.

  Other features are the same as those in the third and fourth embodiments.

(Sixth embodiment)
Still another example of the soldering apparatus according to the present invention will be described with reference to the drawings. 13 is a perspective view of a part of still another example of the soldering apparatus according to the present invention. FIG. 14 is a sectional view of the soldering apparatus shown in FIG. It is sectional drawing of the state which attached the tip of the soldering apparatus shown in FIG. The soldering iron Sa6 of the soldering apparatus F of the present embodiment is configured such that the ironing tip 5f can be easily attached and detached.

  As shown in FIG. 13, the heater block holding portion 43 includes a contact portion 432 and a proximity portion 433 disposed between the contact portion 432 and the heater block 42f. A magnet 434 is attached to the proximity portion 433. Magnet 434 may be a permanent magnet or an electromagnet. Here, from the viewpoint of energy saving, a permanent magnet that does not require power supply when not in use is used.

  The inner surface of the concave portion 421 of the heater block 42f and the insertion portion 52 of the flange 5f are each tapered, and the insertion portion 52 is inserted into the concave portion 421. The flange 5f is connected to the support portion 53 fixed to the cylindrical portion, the flat contact portion 54 provided away from the support portion 53, and the support portion 53 and the contact portion 54. A portion 55 is provided. The contact portion 54 is made of a ferromagnetic material such as iron or nickel. Moreover, the structure provided with a magnet in the part which adjoins the magnet 434 may be sufficient.

  The temperature acquisition unit 7f includes a second thermocouple 74 attached to the heater block 42f and a temperature measurement unit 75 attached to the temperature of the tip 5f. The temperature measuring unit 75 measures the temperature of the tip 5f. The first thermocouple 751 arranged inside the support portion 53 and the contact portion 54 and fixed to the tip 5f, the control unit 8, A signal line 752 for transmitting a signal including temperature information, a contact 753 protruding from the upper surface of the contact portion 54, and a contact 754 provided on the contact portion 432 are provided.

  The contact portion 54 is a long member, and when the insertion portion 52 of the heel 5f is inserted into the concave portion 421, the end portion on the distal end side in the longitudinal direction is in contact with the contact portion 431 and the proximity portion 433 is contacted. It is pulled by the magnetic force of the magnet 434 provided. At this time, a gap is interposed between the proximity portion 433 and the contact portion 54, that is, the proximity portion 433 and the contact portion 54 are not in contact with each other. By forming in this way, the tip 5f generates a moment that pushes up the insertion portion 52 of the tip 5f around the contact portion between the contact portion 54 and the contact portion 432. The insertion portion 52 is pressed against the recess 421 by this moment.

  When the contact part 54 contacts the contact part 432, the contact point 753 contacts the contact point 754. Thereby, the thermocouple 751 is electrically connected to the signal line 752 via the contact 753 and the contact 754.

  In the soldering apparatus F, the first thermocouple 751 of the temperature acquisition unit 7f measures the temperature of the tip 5f and transmits it to the control unit 8. Further, the second thermocouple 74 measures the temperature of the heater block 42 f and transmits it to the control unit 8. Thus, in the soldering apparatus F, it is possible to measure the temperature of the detachable tip 5f and the heater block 42f.

  With this configuration, the tip 5f can be attached to the heater block 42f with a simple configuration that is simply pulled by the magnetic force of the magnet 434, and the first thermocouple for measuring the temperature of the tip 5f. 751 can be connected to the control unit 8. In addition, since the portion connected to the outer surface of the tip 5f of the first thermocouple 751 is inside the support portion 53 and the portion connected to the contact point 753 is inside the contact portion 54, the first thermocouple 75 is It is difficult to be pulled, and it is possible to suppress disconnection of the first thermocouple 751 and dropping from the surface of the tip 5f.

  In this embodiment, the contact portion 54 provided on the heel 5f is in contact with the contact portion 432 and close to the proximity portion 433. However, the proximity portion 433 is omitted and the contact portion 54 is The structure which provided the magnet 434 may be sufficient.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to this content. The embodiments of the present invention can be variously modified without departing from the spirit of the invention.

A to F Soldering device Sa, Sa2 to Sa6 Solder rod 1 Support portion 11 Wall body 13 Sliding guide 2 Cutter unit 21 Cutter upper blade 211 Upper blade hole 212 Pin hole 22 Cutter lower blade 221 Lower blade hole 23 Pusher pin 3 Drive Mechanism 31 First actuator 311 Cylinder 312 Piston rod 32 Second actuator 321 Cylinder 322 Piston rod 4 Heater unit 41 Heater 42 Heater block 421 Recess 422 Solder supply hole 43 Heater block holding part 430 Through hole 431 Stay 432 Contact part 433 Proximity part 434 Magnet 5 Tip 51 Solder hole 52 Insertion part 53 Support part 54 Contact part 55 Connection part 6 Solder feed mechanism 61 Feed roller 62 Guide tube 7, 7b-7f Temperature acquisition part 71 Temperature measurement sensor 72 Reflective member 73 First thermocouple 74 Second thermocouple 75 warm Measuring unit 751 first thermocouple 752 signal line 753 contacts 754 terminal W yarn solder Wh solder pieces Bd wiring board Ep electronic component Ld Land

Claims (10)

A cylindrical tip having a through-hole to which a desired amount of solder is supplied;
A heater unit for heating the tip;
A first temperature measuring device that directly measures the temperature of the tip;
A soldering apparatus comprising: a control unit that controls an output of the heater unit based on a temperature of the tip. The tip is detachably attached to the heater unit, and the first temperature measuring device is directly attached to the tip.
The soldering apparatus according to claim 1, wherein the first temperature measuring device and the control unit are connected via a detachable signal connection unit.   The control unit performs accurate pre-heating of the target member when the temperature change of the tip is within a predetermined condition when the tip contacts the target member to be soldered and performs pre-heating. The soldering apparatus according to claim 1, wherein the soldering apparatus is determined to be present.   When the control unit melts the solder supplied in the through hole of the tip, when the temperature change of the tip is within a predetermined condition, the correct size of solder is supplied, The soldering apparatus according to any one of claims 1 to 3, wherein it is determined that the solder is melted in an appropriate state.   The soldering apparatus according to any one of claims 1 to 4, wherein the first temperature measuring device includes a thermocouple.   The soldering apparatus according to claim 1, wherein the first temperature measuring device includes a non-contact type temperature measuring sensor. The first temperature measuring device is a temperature measuring sensor for measuring temperature by detecting emitted infrared rays, and
The soldering apparatus according to claim 6, wherein the temperature measuring sensor includes a reflecting member that reflects infrared rays. A second temperature measuring device for measuring the temperature of the heater unit;
The said control part presumes the state of the said tip based on the temperature which the said 1st temperature measuring device measured, and the temperature which the said 2nd temperature measuring device measured. Soldering equipment.   When the temperature acquired from the first temperature measuring device is lower than the temperature acquired from the second temperature measuring device and the temperature difference is within a certain range, the control unit moves from the heater unit to the tip. The soldering apparatus according to claim 8, wherein it is determined that heat is appropriately conducted.   When the temperature acquired from the first temperature measuring device is higher than the temperature acquired from the second temperature measuring device or lower within a certain range, the control unit is configured to allow the supplied solder to reach the through hole. The soldering apparatus according to claim 8, wherein the soldering apparatus determines that it has melted.