JP2017112243A - Heater chip and soldering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heater chip capable of surely melting a solder piece as a cut wire solder even when a heat condition is constant.SOLUTION: In a heater chip 45 heated by a resistance heating and used in a soldering device, a solder piece introduction hole 45a arranged by introducing a solder piece 2a as a cut wire solder and a soldered part arrangement hole 45b to which a part of a terminal pin 4a soldered to a land 3a by the melted solder piece 2a is arranged are individually formed. In the heater chip 45, a state where a side surface of the solder piece introduction hole 45a and the solder piece 2a are not contacted due to influence of the terminal pin 4a or a state where a contact area of the side surface of solder piece introduction hole 45a and the solder piece 2a becomes small are prevented, and the contact area of the side surface of solder piece introduction hole 45a and the solder piece 2a can be secured.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a heater chip used in a soldering apparatus that performs soldering by melting yarn solder. The present invention also relates to a soldering apparatus provided with such a heater chip.

  2. Description of the Related Art Conventionally, a soldering apparatus that melts thread solder and solders a wiring board and terminals of an electronic component is known (for example, see Patent Document 1). The soldering apparatus described in Patent Document 1 includes a cutter unit that cuts thread solder into solder pieces, a solder feeding mechanism that feeds thread solder to the cutter unit, and a solder flange that is disposed below the cutter unit. It has. The soldering iron part is composed of a iron tip and a heater unit to which the iron tip is fixed. The tip is formed in a cylindrical shape, and the inside of the tip is a solder hole in which a solder piece cut by the cutter unit is arranged. The wiring board is formed with a through hole through which a terminal of the electronic component is inserted, and a land is formed so as to surround the through hole.

  In the soldering apparatus described in Patent Document 1, when soldering the land of the wiring board and the terminal of the electronic component, the lower end surface of the tip contacts the land formed on the upper surface of the wiring board. At this time, the terminal of the electronic component is inserted into the through hole from below, and the upper end portion of the terminal is disposed inside the solder hole. In this state, the solder piece cut by the cutter unit is supplied to the solder hole at the tip heated by the heater unit, and the land and the terminal are soldered.

Japanese Patent Laying-Open No. 2015-166096

  In the soldering apparatus described in Patent Document 1, the terminal of the electronic component and the solder piece are arranged in the same solder hole. For this reason, in this soldering apparatus, the side surface of the solder hole does not come into contact with the solder piece, or the contact area between the side surface of the solder hole and the solder piece, depending on the contact state between the terminal in contact with the solder hole and the solder piece. As a result of the study of the present inventor, it has become clear that the solder piece may become difficult to melt due to a decrease in size. In addition, in this soldering apparatus, the solder piece may be difficult to melt. Therefore, if the heating condition of the tip is constant, the solder piece arranged in the solder hole may not be melted appropriately. This has been clarified by the inventors' investigation.

  Therefore, an object of the present invention is to provide a heater chip that can reliably melt a solder piece, which is a cut yarn solder, even if heating conditions are constant. Moreover, the subject of this invention is providing the soldering apparatus provided with this heater chip.

  In order to solve the above problems, the heater chip of the present invention is heated by resistance heating, and in a heater chip used in a soldering apparatus, solder in which a solder piece that is cut yarn solder is introduced and arranged The piece introduction hole and the soldered part arrangement hole in which at least a part of the soldered part to be soldered by the molten solder piece is arranged are individually formed.

  In the heater chip of the present invention, a solder piece introduction hole in which the solder piece is introduced and arranged, and a soldered part arrangement hole in which at least a part of the soldered part to be soldered by the molten solder piece is arranged Are formed individually. Therefore, in the present invention, the situation that the side surface of the solder piece introduction hole does not contact with the solder piece due to the influence of the soldered portion or the situation that the contact area between the side surface of the solder piece introduction hole and the solder piece becomes small is generated. Therefore, it is possible to secure a contact area between the side surface of the solder piece introduction hole and the solder piece. Therefore, in the present invention, even if the heating condition of the heater chip is constant, the solder piece can be reliably melted by the heater chip.

  In the present invention, for example, the soldered portion is composed of a land formed so as to surround a through hole formed in the circuit board and a terminal pin inserted through the through hole. A part of the terminal pin is arranged. In this case, it is possible to prevent the occurrence of a situation in which the side surface of the solder piece introduction hole does not contact the solder piece due to the influence of the terminal pin or a situation in which the contact area between the side surface of the solder piece introduction hole and the solder piece becomes small. It is possible to secure a contact area between the side surface of the solder piece introduction hole and the solder piece.

  In the present invention, for example, the solder piece introduction hole and the soldered part arrangement hole are connected to one end of the solder piece introduction hole and the other end of the solder piece introduction hole and the soldered part. The solder piece introduction hole and the soldered part arrangement hole are formed so as to be separated from each other toward the other end of the part arrangement hole.

  In the present invention, the heater chip includes a hole forming portion in which a solder piece introduction hole and a soldered portion arrangement hole are formed, and two electrode connection portions connected to electrodes that supply current to the heater chip, The two electrode connection portions preferably protrude from the hole forming portion in a direction parallel to the direction in which the solder piece introduction hole is formed. With this configuration, for example, when a heater chip is manufactured by cutting a single plate-like member, the thickness of the raw material required to manufacture one heater chip can be reduced. It becomes possible. That is, since the solder piece introduction hole functions to introduce the solder piece into the heater chip, the length of the solder piece introduction hole needs to be increased to some extent so that the solder piece can be appropriately introduced. Since the soldering portion arrangement hole is provided to prevent interference between the soldered portion and the heater chip, there is no functional problem even if the length of the soldering portion arrangement hole is short. Therefore, for example, when a heater chip is manufactured by cutting one plate-like member, the electrode connection portion is directed in a direction parallel to the direction in which the solder piece introduction hole that requires a length is formed. If the protrusion protrudes, it is possible to reduce the thickness of the raw material of the heater chip while ensuring the length of the solder piece introduction hole, and as a result, it is possible to reduce the raw material cost of the heater chip. .

  In the present invention, the diameter of the solder piece introduction hole is preferably smaller than the diameter of the soldered portion arrangement hole. According to the study by the inventors of the present application, it has been clarified that the solder piece arranged in the solder piece introduction hole is staggered when heated and melted. In addition, if the solder piece arranged in the solder piece introduction hole fluctuates, the contact state between the side surface of the solder piece introduction hole and the solder piece may become unstable, and the solder piece may be difficult to melt. It became clear by examination. If the diameter of the solder piece introduction hole is smaller than the diameter of the soldered portion arrangement hole, suppressing the wobbling of the solder piece when the solder piece arranged in the small diameter solder piece introduction hole is melted, It is possible to stabilize the contact state between the side surface of the solder piece introduction hole and the solder piece. Therefore, even if the heating condition of the heater chip is constant, the solder piece can be reliably melted by the heater chip. Also, with this configuration, since the diameter of the soldered portion arrangement hole is larger than the diameter of the solder piece introduction hole, the flux fume generated when the solder piece is melted by the heater chip is reduced. It is possible to effectively escape using the attachment portion arrangement hole. Therefore, it becomes possible to suppress the adhesion of the flux to the heater chip.

  The heater chip of the present invention can be used in a soldering apparatus including the melting mechanism that has the heater chip and heats and melts the solder piece, and the cutting mechanism that cuts the thread solder into the solder piece. In this soldering apparatus, even if the heating condition of the heater chip is constant, the solder piece can be reliably melted by the heater chip.

  In the present invention, the soldered portion arrangement hole is formed so as to penetrate in the vertical direction, and the solder piece introduction hole is formed so as to penetrate in a direction inclined with respect to the vertical direction. It is preferable that the lower end side of the solder piece introduction hole is connected to the lower end side. If comprised in this way, compared with the case where the solder piece introduction hole is formed so that it may penetrate in an up-down direction, it becomes possible to make a solder piece contact the side surface of a solder piece introduction hole reliably. Therefore, even if the heating condition of the heater chip is constant, the solder chip can be more reliably melted by the heater chip.

  In the present invention, the soldered portion arrangement hole is preferably an escape hole for escaping the flux fume generated when the solder piece is melted by the heater chip. If comprised in this way, it will become possible to escape flux fume effectively using the to-be-soldered part arrangement | positioning hole penetrated to an up-down direction. Therefore, it becomes possible to suppress the adhesion of the flux to the heater chip.

  In the present invention, the heater chip includes a hole forming portion in which a solder piece introduction hole and a soldered portion arrangement hole are formed, and the hole forming portion is formed in a substantially rectangular parallelepiped shape with one horizontal direction as a longitudinal direction. When the direction orthogonal to the direction in which the solder piece introduction hole is formed and the longitudinal direction of the hole forming portion is the first direction, the thickness in the first direction on the upper end side of the hole forming portion is the thickness of the hole forming portion. It is preferable that the thickness is smaller than the thickness in the first direction on the lower end side. If comprised in this way, it will become possible to enlarge the opening part of the to-be-soldered part arrangement | positioning hole formed in the upper end side of a hole formation part. Therefore, it becomes possible to escape the flux fume more effectively by using the soldered portion arrangement hole penetrating in the vertical direction, and as a result, it is possible to effectively suppress the adhesion of the flux to the heater chip. become.

  In the present invention, the soldered portion is composed of lands formed so as to surround the through holes formed in the circuit board and terminal pins inserted through the through holes. A part of the pin is arranged, and the heater chip includes a hole forming portion in which a solder piece introduction hole and a soldered portion arrangement hole are formed, and the lower surface of the hole forming portion facing the upper surface of the circuit board is covered It is preferable that an annular projection that surrounds the soldering portion arrangement hole is formed, and the outer diameter of the projection is equal to or smaller than the outer diameter of the land. With this configuration, when the terminal pin is soldered to the land, the lower surface of the protruding portion contacts the land, but the lower surface of the hole forming portion other than the protruding portion is on the upper surface of the circuit board other than the land. Do not touch. Therefore, even if the circuit board is not covered with a heat-resistant protective film, it is possible to prevent damage to the circuit board due to heat during soldering.

  As described above, according to the present invention, even when the heating condition of the heater chip is constant, it is possible to reliably melt the solder piece that is the cut thread solder by the heater chip.

1 is a perspective view of a soldering apparatus according to an embodiment of the present invention. It is a side view which shows a part of the upper end side of the soldering apparatus shown in FIG. It is sectional drawing for demonstrating the structure of the cutting mechanism shown in FIG. 2, and a solder feed mechanism. It is sectional drawing for demonstrating the structure of the cutting mechanism shown in FIG. 2, and a solder feed mechanism. It is a front view of a melting mechanism, a holder, and a holder moving mechanism shown in FIG. It is sectional drawing of the EE cross section of FIG. It is an enlarged view for demonstrating the structure of the F section of FIG. FIG. 6 is a perspective view of the heater chip shown in FIG. 5. It is a figure of the heater chip | tip shown in FIG. 5, (A) is a front view, (B) is a top view, (C) is a bottom view, (D) is a side view, (E) is GG of (D). The figure which shows a heater chip | tip from a direction, (F) is an expanded sectional view of the HH cross section of (A). FIG. 6 is a side view of the melting mechanism, the holder, and the holder moving mechanism shown in FIG. 5. It is a perspective view of the holder shown in FIG. It is a figure which shows a holder from the JJ direction of FIG. It is a figure for demonstrating a state when the holder shown in FIG. 6 moves to a retracted position. It is a graph which shows an example of the temperature profile of a heater chip at the time of soldering with the soldering apparatus shown in FIG. It is a perspective view of the heater chip concerning other embodiments of the present invention. It is a figure of the heater chip | tip shown in FIG. 15, (A) is a front view, (B) is a top view, (C) is a bottom view, (D) is a side view, (E) is KK of (D). The enlarged view which shows a part of heater chip from a direction, (F) is an expanded sectional view of the MM cross section of (A).

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Overall structure of soldering equipment)
FIG. 1 is a perspective view of a soldering apparatus 1 according to an embodiment of the present invention. FIG. 2 is a side view showing a part of the upper end side of the soldering apparatus 1 shown in FIG.

  The soldering apparatus 1 of the present embodiment melts the thread solder 2 and solders the terminal pins 4a (see FIG. 7) of the electronic component 4 to the lands 3a (see FIG. 7) formed on the circuit board 3. Device. Specifically, the soldering apparatus 1 is an apparatus for simultaneously soldering a plurality of terminal pins 4a to a plurality of lands 3a. The soldering apparatus 1 of this embodiment solders each of the eight terminal pins 4a to each of the eight lands 3a at the same time.

  The soldering apparatus 1 includes a cutting mechanism 7 for cutting the thread solder 2 into a solder piece 2a (see FIG. 4), and a solder feeding mechanism for feeding the thread solder 2 wound around the solder reel 8 toward the cutting mechanism 7. 9, a melting mechanism 10 that heats and melts the solder piece 2 a, and a lifting mechanism 11 that lifts and lowers the melting mechanism 10. The soldering apparatus 1 also includes a guide portion 12 for guiding the thread solder 2 from the solder reel 8 to the solder feeding mechanism 9 and a solder piece supply pipe for supplying the solder piece 2a from the cutting mechanism 7 to the melting mechanism 10. 13 and a holder 14 (see FIG. 6), and a holder moving mechanism 15 that moves the holder 14. Furthermore, the soldering apparatus 1 includes a main body frame 16 to which these components are attached.

  In the following description, the X direction in FIG. 1 or the like is the front-rear direction, and the Y direction in FIG. Also, the X1 direction side of the X direction is the “front” side, the opposite X2 direction side is the “rear (back)” side, the Y1 direction side of the Y direction is the “right” side, The Y2 direction side that is the opposite side is the “left” side.

  The solder reel 8 is disposed on the rear side of the main body frame 16. The guide portion 12 is disposed on the upper end surface of the main body frame 16. The cutting mechanism 7 and the solder feeding mechanism 9 are disposed on the upper end side of the main body frame 16 and on the lower side of the guide portion 12. The melting mechanism 10, the elevating mechanism 11, the solder piece supply pipe 13, the holder 14, and the holder moving mechanism 15 are disposed on the front side of the main body frame 16, and are disposed below the cutting mechanism 7 and the solder feeding mechanism 9. Yes.

  A substrate mounting portion (not shown) on which the circuit board 3 is mounted is attached to the lower end side of the main body frame 16. The substrate placement unit is disposed below the melting mechanism 10. A suction pipe 17 is attached to the lower end side of the main body frame 16 for sucking flux fumes generated when the solder pieces 2a are melted by a heater chip 45, which will be described later, constituting the melting mechanism 10. The suction tube 17 is arranged so that the suction port 17a (see FIG. 13) of the suction tube 17 faces the front side. Further, in this embodiment, the two suction pipes 17 are attached to the lower end side of the main body frame 16 so that the suction ports 17a of the suction pipes 17 are arranged on both the left and right sides of the substrate mounting portion. The suction pipe 17 sucks flux fumes when the terminal pins 4a are soldered to the lands 3a.

  A reel holding member 19 that rotatably holds the eight solder reels 8 is attached to the rear surface side of the main body frame 16. The reel holding member 19 is fixed to the main body frame 16 so as to protrude rearward from a substantially center position of the main body frame 16 in the vertical direction. The solder reel 8 is held by a reel holding member 19 so as to be able to rotate with the left-right direction as the axis direction of rotation. The eight solder reels 8 are held by the reel holding member 19 so that the two solder reels 8 arranged in the left-right direction are arranged in four rows in the front-rear direction.

  The guide portion 12 includes a first guide portion 20 disposed on the rear end side of the upper end surface of the main body frame 16 and a second guide portion 21 disposed on the front end side of the upper end surface of the main body frame 16. The first guide portion 20 functions to guide the eight yarn solders 2 drawn upward from the solder reel 8 toward the front side. The second guide portion 21 has a function of guiding the eight thread solders 2 drawn from the first guide portion 20 toward the front side downward. In FIG. 1, a part of the thread solder 2 disposed between the eight solder reels 8 and the first guide portion 20 is not shown.

  The elevating mechanism 11 is attached to the main body frame 16 via a θ stage (rotating stage) 22 having the front-rear direction as the axis direction of rotation. The lifting mechanism 11 includes an air cylinder 23 that is fixed to a movable member of the θ stage 22. The air cylinder 23 is attached to the θ stage 22 so that the rod of the air cylinder 23 protrudes downward. An XY stage 24 is fixed to the tip (that is, the lower end) of the rod of the air cylinder 23. The melting mechanism 10, the holder 14, and the holder moving mechanism 15 are attached to an XY stage 24, and are movable in the front-rear direction and the left-right direction with respect to the air cylinder 23. Note that the θ stage 22 and the XY stage 24 of the present embodiment are manual stages that do not have a drive source.

  The elevating mechanism 11 lowers the melting mechanism 10, the holder 14, and the holder moving mechanism 15 when the terminal pin 4 a of the electronic component 4 is soldered to the land 3 a of the circuit board 3. Further, when the soldering of the terminal pins 4a to the lands 3a is completed, the elevating mechanism 11 raises the melting mechanism 10, the holder 14, and the holder moving mechanism 15.

(Configuration of cutting mechanism and solder feeding mechanism)
3 and 4 are cross-sectional views for explaining the configuration of the cutting mechanism 7 and the solder feeding mechanism 9 shown in FIG.

  The solder feeding mechanism 9 includes a driving roller 28 and a driven roller 29 that feed the thread solder 2 downward. The driving roller 28 and the driven roller 29 are disposed so as to sandwich the thread solder 2 in the front-rear direction, and are rotatable with the left-right direction as the axis direction of rotation. In this embodiment, the driving roller 28 is disposed on the rear side, and the driven roller 29 is disposed on the front side. The drive roller 28 is connected to an air-driven rotary actuator 30 via a one-way clutch (not shown), and is fed in one direction (counterclockwise direction in FIG. 2) with the power of the rotary actuator 30. ) Only rotate. Along with the operation of the rotary actuator 30, the driving roller 28 and the driven roller 29 send the thread solder 2 downward by a predetermined amount. Further, the driving roller 28 and the driven roller 29 send the eight yarn solders 2 simultaneously (together) downward.

  Further, the solder feeding mechanism 9 includes an upper guide member 31 that guides the thread solder 2 between the driving roller 28 and the driven roller 29 and a thread solder from between the driving roller 28 and the driven roller 29 toward the cutting mechanism 7. 2 and a lower guide member 32 for guiding 2. The solder feeding mechanism 9 of this embodiment includes eight upper guide members 31 and eight lower guide members 32 that guide each of the eight yarn solders 2. The eight upper guide members 31 and the eight lower guide members 32 are arranged at a constant pitch in the left-right direction.

  The upper guide member 31 is formed with a passage hole 31a through which the thread solder 2 guided downward by the second guide portion 21 passes vertically. The lower guide member 32 is formed with a through hole 32a through which the thread solder 2 fed by the driving roller 28 and the driven roller 29 passes vertically. The passage hole 31a and the passage hole 32a are formed in a round hole shape having a circular shape when viewed in the vertical direction. Further, the passage hole 31a and the passage hole 32a are arranged so that the center of the passage hole 31a and the center of the passage hole 32a coincide with each other when viewed in the vertical direction.

  The cutting mechanism 7 includes a fixed-side blade member 35 and a moving-side blade member 36 for cutting the thread solder 2, a guide member 37 that holds the moving-side blade member 36 so as to be movable in the front-rear direction, And an air cylinder 38 for moving the moving-side blade member 36 in the front-rear direction. The fixed-side blade member 35 and the moving-side blade member 36 are formed in a substantially rectangular parallelepiped block shape, for example. The fixed-side blade member 35 is fixed to a mounting plate 39 of the main body frame 16 on which the cutting mechanism 7 and the like are mounted via a predetermined member.

  The guide member 37 is fixed to the upper surface of the mounting plate 39. The moving blade member 36 is placed on the upper surface side of the guide member 37. The upper surface of the moving-side cutter member 36 is in contact with the lower surface of the fixed-side cutter member 35. The air cylinder 38 is disposed on the rear side of the moving blade member 36. The air cylinder 38 is fixed to the mounting plate 39 so that the rod of the air cylinder 38 protrudes to the front side. The tip (front end) of the rod of the air cylinder 38 is fixed to the rear end side of the moving-side cutter member 36 via a predetermined member.

  A passage hole 35a through which the thread solder 2 passes is formed in the fixed-side blade member 35 so as to penetrate in the vertical direction. Specifically, eight passage holes 35a through which each of the eight yarn solders 2 pass are formed in the rear end side portion of the fixed-side cutter member 35 so as to penetrate in the vertical direction. The eight passage holes 35a are formed at a constant pitch in the left-right direction. The passage hole 35a is formed in a round hole shape having a circular shape when viewed from above and below. The lower end of the passage hole 35 a is a fixed blade that cuts the thread solder 2.

  The lower guide member 32 is fixed to the upper surface of the fixed-side cutter member 35. Each of the eight passage holes 35a and each of the eight passage holes 32a of the lower guide member 32 are arranged such that the center of the passage hole 35a and the center of the passage hole 32a coincide with each other when viewed in the vertical direction. The lower end of the passage hole 32a and the upper end of the passage hole 35a are connected. The inner diameter of the passage hole 35a is slightly larger than the inner diameter of the passage hole 32a.

  In addition, the fixed-side blade member 35 is formed with an introduction hole 35 b into which compressed air for feeding the solder piece 2 a from the cutting mechanism 7 toward the melting mechanism 10 is introduced. The introduction hole 35b is formed in front of the passage hole 35a. The introduction hole 35b penetrates from the lateral hole 35c to the lower end surface of the fixed-side cutter member 35 at a substantially central position of the fixed-side cutter member 35 in the vertical direction. 8 vertical holes 35d to be formed. The horizontal hole 35c and the vertical hole 35d are formed in a round hole shape.

  The introduction hole 35 b includes a horizontal hole (not shown) formed so as to penetrate from the center of the horizontal hole 35 c in the left-right direction to the front end surface of the fixed-side cutter member 35. A joint 40 (see FIGS. 1 and 2) is fixed to the opening of the horizontal hole formed in the front end surface of the fixed-side cutter member 35. A supply source (not shown) of compressed air is connected to the joint 40 via a predetermined pipe, and compressed air is supplied from the supply source to the introduction hole 35b. The eight vertical holes 35d are formed at a constant pitch in the left-right direction. Specifically, the eight vertical holes 35d are formed at the same pitch as the eight passage holes 35a in the left-right direction. Further, each of the eight vertical holes 35d and each of the eight passage holes 35a are disposed at the same position in the left-right direction.

  A passage hole 36a through which the solder piece 2a passes is formed in the moving blade member 36 so as to penetrate in the vertical direction. Specifically, the movement-side blade member 36 is formed with eight passage holes 36a through which each of the eight solder pieces 2a passes vertically. The eight passage holes 36a are formed at a constant pitch in the left-right direction. Specifically, the eight passage holes 36a are arranged at the same pitch as the eight passage holes 35a in the left-right direction.

  In addition, each of the eight passage holes 36a and each of the eight passage holes 35a are disposed at the same position in the left-right direction. That is, each of the eight passage holes 36a and each of the eight vertical holes 35d are disposed at the same position in the left-right direction. The passage hole 36a is formed in a round hole shape having a circular shape when viewed from above and below. The inner diameter of the passage hole 36a is slightly larger than the inner diameter of the passage hole 35a. The upper end of the passage hole 36 a is a moving blade that cuts the thread solder 2.

  The moving blade member 36 moves in the front-rear direction by the power of the air cylinder 38. Specifically, when viewed from the vertical direction, the cutting start position (the position shown in FIG. 3) where the center of the passage hole 36a coincides with the center of the passage hole 35a, and the passage hole when viewed from the vertical direction. The movement-side cutter member 36 moves in the front-rear direction between the cutting completion position (position shown in FIG. 4) where the center of 36a coincides with the center of the vertical hole 35d.

  The guide member 37 is formed with a through hole 37a penetrating in the vertical direction. Specifically, eight through holes 37 a are formed in the guide member 37. The eight through holes 37a are arranged so that the centers of the eight through holes 37a and the centers of the eight vertical holes 35d coincide with each other when viewed in the vertical direction. An upper end portion of the first supply pipe 41 through which the solder piece 2a passes is fixed to each of the eight through holes 37a. The upper end side of the second supply pipe 42 through which the solder piece 2 a passes is fixed to the lower end side of the first supply pipe 41.

  The first supply pipe 41 is a metal tube made of metal such as stainless steel. The 2nd supply pipe | tube 42 is a resin-made resin tube which has a softness | flexibility. That is, the second supply pipe 42 is a resin-made flexible tube. The second supply pipe 42 is fixed to the first supply pipe 41 by press-fitting the lower end portion of the first supply pipe 41 to the inner peripheral side of the upper end portion of the second supply pipe 42. In this embodiment, the first supply pipe 41 and the second supply pipe 42 constitute the solder piece supply pipe 13, and the upper end of the first supply pipe 41 that is one end of the solder piece supply pipe 13 is connected to the cutting mechanism 7. ing. A part of the solder piece supply pipe 13 is a resin-made flexible tube.

  When cutting the thread solder 2 into the solder piece 2a, as shown in FIG. 3, the rotary actuator 30 is activated with the moving blade member 36 disposed at the cutting start position, and the driving roller 28 and the driven roller are driven. By 29, the thread solder 2 is sent downward by a certain amount. In this state, the tip side portion of the thread solder 2 to be the solder piece 2a is disposed in the passage hole 36a. Thereafter, the air cylinder 38 is activated, and the moving side cutter member 36 moves to the cutting completion position as shown in FIG. As described above, since the lower end of the passage hole 35a is a fixed blade and the upper end of the passage hole 36a is a moving blade, when the moving side cutter member 36 moves from the cutting start position to the cutting completion position, the yarn The tip side portion of the solder 2 is cut into a solder piece 2a.

  When the moving blade member 36 moves to the cutting completion position, the solder piece 2a is pushed downward by the compressed air supplied to the introduction hole 35b, and gravity acts on the solder piece 2a. Passes through the first supply pipe 41 and the second supply pipe 42 and is sent downward. That is, in this embodiment, the solder piece 2a is sent from the cutting mechanism 7 to the melting mechanism 10 using gravity and compressed air acting on the solder piece 2a. Further, in this embodiment, eight yarn solders 2 are cut at the same time, and eight solder pieces 2a are formed at the same time.

(Structure of melting mechanism)
FIG. 5 is a front view of the melting mechanism 10, the holder 14, and the holder moving mechanism 15 shown in FIG. 6 is a cross-sectional view taken along the line EE of FIG. FIG. 7 is an enlarged view for explaining the configuration of the F part in FIG. 6. FIG. 8 is a perspective view of the heater chip 45 shown in FIG. FIG. 9 is a view of the heater chip 45 shown in FIG. 5, (A) is a front view, (B) is a plan view, (C) is a bottom view, (D) is a side view, and (E) is (D). The figure which shows the heater chip | tip 45 from the GG direction of (), (F) is an expanded sectional view of the HH cross section of (A).

  The melting mechanism 10 includes a heater chip 45 that is heated by resistance heating and melts the solder piece 2 a, and two electrodes 46 that supply current to the heater chip 45. The electrode 46 is formed in, for example, an elongated substantially quadrangular prism shape, and is arranged so that the longitudinal direction of the electrode 46 and the front-rear direction coincide. The two electrodes 46 are fixed to the XY stage 24 via a predetermined support member. In addition, the two electrodes 46 are arranged in a state where a certain interval is left in the left-right direction.

  A chip fixing surface 46 a to which the heater chip 45 is fixed is formed at the front end of the electrode 46. The chip fixing surface 46a is formed in a planar shape. The chip fixing surface 46a is an inclined surface that is inclined with respect to the vertical direction. Specifically, as shown in FIG. 6, the chip fixing surface 46a is an inclined surface that inclines toward the front side toward the upper side. The inclination angle of the chip fixing surface 46a with respect to the vertical direction is, for example, 25 °. A current supply cable (not shown) is connected to the rear end side of the electrode 46, and current is supplied to the electrode 46 through this cable.

  The heater chip 45 is formed of a cemented carbide having poor solder wettability. The heater chip 45 is formed with a solder piece introduction hole 45a in which the solder piece 2a is introduced and arranged. Further, in addition to the solder piece introduction hole 45a, the heater chip 45 is formed with a terminal pin arrangement hole 45b as a soldered part arrangement hole in which a part on the upper end side of the terminal pin 4a is arranged (see FIG. 7). That is, the heater chip 45 is individually formed with a solder piece introduction hole 45a in which the solder piece 2a is introduced and a terminal pin arrangement hole 45b in which a part of the upper end side of the terminal pin 4a is arranged. Yes.

  As shown in FIG. 7, the circuit board 3 has a through hole 3b, and the land 3a is formed on the upper surface of the circuit board 3 so as to surround the through hole 3b. The electronic component 4 is mounted on the lower surface of the circuit board 3, and the terminal pin 4a is inserted through the through hole 3b from below. In this embodiment, the land 3a and the terminal pin 4a constitute a soldered part to be soldered by the molten solder piece 2a, and the terminal pin arrangement hole 45b is a part of the soldered part. A part of the upper end side of the terminal pin 4a is arranged. In addition, the circuit board 3 of this form is a flexible printed circuit board (FPC). In FIG. 7, for convenience of explanation, the thickness of the land 3a (the thickness in the vertical direction) is larger than the actual thickness of the land 3a.

  The heater chip 45 includes a hole forming portion 45c in which a solder piece introduction hole 45a and a terminal pin arrangement hole 45b are formed, and two electrode connection portions 45d connected to the electrode 46. The hole forming portion 45c is formed in an elongated and substantially rectangular parallelepiped shape. The two electrode connecting portions 45d are formed so as to protrude from both ends in the longitudinal direction of the hole forming portion 45c in one direction perpendicular to the longitudinal direction of the hole forming portion 45c. It is formed in the shape of a mold frame. A through hole 45e through which a screw 47 (see FIG. 10) for fixing the heater chip 45 to the electrode 46 is inserted is formed at the tip side of the electrode connecting portion 45d. Note that the screw 47 is not shown in FIGS.

  The heater chip 45 is fixed to the chip fixing surface 46a of the electrode 46 so that the longitudinal direction of the hole forming portion 45c coincides with the left-right direction and the tip of the electrode connecting portion 45d is arranged on the upper side. Yes. That is, in a state where the heater chip 45 is fixed to the electrode 46, the hole forming portion 45c has a substantially rectangular parallelepiped shape with the left-right direction as the longitudinal direction. As described above, the chip fixing surface 46a is an inclined surface that inclines toward the front side toward the upper side. Therefore, the heater chip 45 is fixed to the electrode 46 in a state where the heater chip 45 is inclined to the front side as it goes upward.

  As described above, the hole forming portion 45c is formed with the solder piece introduction hole 45a and the terminal pin arrangement hole 45b. Specifically, eight solder piece introduction holes 45a and eight terminal pin arrangement holes 45b are formed in the hole forming portion 45c. The eight solder piece introduction holes 45a and the eight terminal pin arrangement holes 45b are formed at a constant pitch in the left-right direction (that is, the longitudinal direction of the hole forming portion 4c). Also, each of the eight solder piece introduction holes 45a and each of the eight terminal pin arrangement holes 45b are formed at the same position in the left-right direction.

  The solder piece introduction hole 45a and the terminal pin arrangement hole 45b are formed in a round hole shape. Further, the solder piece introduction hole 45a and the terminal pin arrangement hole 45b are connected to one end side of the solder piece introduction hole 45a to one end side of the terminal pin arrangement hole 45b, and the other end of the solder piece introduction hole 45a and the terminal pin arrangement hole 45b. The solder piece introduction hole 45a and the terminal pin arrangement hole 45b are formed so as to be separated from each other toward the other end. The solder piece introduction hole 45a and the terminal pin arrangement hole 45b are formed so as to penetrate the hole forming portion 45c.

  Specifically, in a state where the heater chip 45 is fixed to the electrode 46, the lower end side of the solder piece introduction hole 45a is connected to the lower end side of the terminal pin arrangement hole 45b. That is, the lower end side of the solder piece introduction hole 45a is joined to the lower end side of the terminal pin arrangement hole 45b. Further, in a state where the heater chip 45 is fixed to the electrode 46, the terminal pin arrangement hole 45b is formed to penetrate in the vertical direction, and the solder piece introduction hole 45a penetrates in a direction inclined with respect to the vertical direction. It is formed as follows.

  In this embodiment, the solder piece introduction hole 45a is inclined to the front side as it goes upward, and the direction in which the solder piece introduction hole 45a is formed (the V direction in FIG. 7) and the electrode connection portion 45d. Is parallel to the protruding direction. That is, the electrode connection portion 45d protrudes from the hole forming portion 45c in a direction parallel to the direction in which the solder piece introduction hole 45a is formed. The solder piece introduction hole 45a is formed so as to penetrate in a direction inclined with respect to the vertical direction by the same angle as the inclination angle of the chip fixing surface 46a with respect to the vertical direction when viewed from the left and right direction. It is formed so as to penetrate in a direction inclined by 25 ° with respect to the vertical direction. Further, in a state where the heater chip 45 is fixed to the electrode 46, the lower surface of the hole forming portion 45c is a plane orthogonal to the vertical direction. The lower surface of the hole forming portion 45 c is a contact surface that contacts the upper surface of the circuit board 3.

  The length (length in the V direction) of the solder piece introduction hole 45a is longer than the length of the solder piece 2a. The diameter of the solder piece introduction hole 45a is smaller than the diameter of the terminal pin arrangement hole 45b. Further, as described above, in a state where the heater chip 45 is fixed to the electrode 46, the terminal pin arrangement hole 45b is formed so as to penetrate in the vertical direction, and the terminal pin arrangement hole 45b is formed by the heater chip 45. It is an escape hole for releasing flux fumes generated when the solder piece 2a is melted.

  If the direction in which the solder piece introduction hole 45a is formed and the direction orthogonal to the left-right direction (the W direction in FIG. 7) is the first direction, the upper end of the hole forming portion 45c is shown in FIG. The thickness in the first direction on the side is thinner than the thickness in the first direction on the lower end side of the hole forming portion 45c. However, concave portions 45f are formed at both left and right ends of the lower end side of the hole forming portion 45c, and the thickness in the first direction of the portion where the concave portion 45f is formed on the lower end side of the hole forming portion 45c is This is equal to the thickness in the first direction on the upper end side of the forming portion 45c.

  When the direction (V direction) in which the solder piece introduction hole 45a is formed is the second direction, the thickness in the second direction of the central portion of the hole forming portion 45c in the left-right direction is the hole forming portion 45c in the left-right direction. It is thicker than the thickness in the second direction of the both ends. Specifically, when the hole forming portion 45c is divided into approximately three equal parts in the left-right direction, as shown in FIG. 9A, in the portion arranged at the center of the hole forming portion 45c divided into approximately three equal parts. The thickness in the second direction is constant, and the portions arranged on both the left and right sides of the substantially three equally divided hole forming portions 45c increase the thickness in the second direction toward the outside in the left and right direction. It is getting thinner.

(Configuration of holder and holder moving mechanism)
FIG. 10 is a side view of the melting mechanism 10, the holder 14, and the holder moving mechanism 15 shown in FIG. FIG. 11 is a perspective view of the holder 14 shown in FIG. FIG. 12 is a view showing the holder 14 from the JJ direction of FIG. 6. FIG. 13 is a view for explaining a state when the holder 14 shown in FIG. 6 is moved to the retracted position 14B.

  The holder 14 is formed of a metal material and is formed in a block shape. The holder 14 is formed with a through hole 14a penetrating in a substantially vertical direction. Moreover, the holder 14 is comprised from the hole formation part 14b in which the through-hole 14a is formed, and the to-be-fixed part 14c fixed to the holder fixing member 52 mentioned later. The hole forming portion 14b and the fixed portion 14c are formed in a substantially rectangular parallelepiped shape. The hole forming portion 14b is connected to the fixed portion 14c so as to protrude from the lower end side of the fixed portion 14c toward the front lower side.

  In the hole forming portion 14b, eight through holes 14a are formed at a constant pitch in the left-right direction. The pitch of the eight through holes 14a in the left-right direction is equal to the pitch of the eight solder piece introduction holes 45a in the left-right direction. Further, each of the eight through holes 14a and each of the eight solder piece introduction holes 45a are arranged at the same position in the left-right direction. The upper end side portion of the through hole 14a is a fixing hole 14d in which the lower end side of the second supply pipe 42 is inserted and fixed. The fixed hole 14d is formed in a round hole shape.

  A lower end side portion of the through hole 14a is a solder piece supply hole 14e to which the lower end of the second supply pipe 42 is connected. That is, the holder 14 is formed with a solder piece supply hole 14 e that is connected to the lower end of the second supply pipe 42 that is the other end of the solder piece supply pipe 13. The solder piece supply hole 14e is formed in a round hole shape. The through hole 14a includes a fixed hole 14d and a solder piece supply hole 14e, and the lower end of the fixed hole 14d and the upper end of the solder piece supply hole 14e are connected. The diameter of the solder piece supply hole 14e is smaller than the diameter of the fixing hole 14d. Further, the diameter of the solder piece supply hole 14 e is slightly larger than the inner diameter of the second supply pipe 42.

  The fixed portion 14c is formed with two magnet fixing holes 14f penetrating substantially in the front-rear direction. The fixed portion 14c is formed with two positioning holes 14g penetrating in the same direction as the magnet fixing hole 14f. The two magnet fixing holes 14f are formed so as to be adjacent to each other in the left-right direction, and the two positioning holes 14g are respectively formed on both left and right outer sides of the two magnet fixing holes 14f. The magnet fixing hole 14f is formed in a round hole shape. A permanent magnet 50 formed in a columnar shape is fixed in the magnet fixing hole 14f (see FIGS. 5 and 6). One positioning hole 14g of the two positioning holes 14g is formed in a round hole shape, and the other positioning hole 14g is formed in a long hole shape that is long in the left-right direction. A positioning pin 51 (see FIG. 5) for positioning the holder 14 with respect to a holder fixing member 52 described later is inserted into the positioning hole 14g.

  On the lower surface of the boundary portion between the hole forming portion 14b and the fixed portion 14c, a concave portion 14h that is recessed upward is formed. The recess 14h is formed so that the cross-sectional shape orthogonal to the left-right direction is rectangular. The recess 14h is formed so that the lower side and the rear side are opened. That is, the recess 14h is not formed in the entire region of the holder 14 in the left-right direction, and side walls 14j are formed on both sides in the left-right direction of the recess 14h as shown in FIG. The side wall 14j arranged on the right side is from the solder piece introduction hole 45a and the terminal pin arrangement hole 45b arranged at the right end of the eight solder piece introduction holes 45a and the terminal pin arrangement holes 45b formed in the heater chip 45. Is also located on the right side. Further, the side wall 14j arranged on the left side is arranged on the left side of the solder piece introduction hole 45a and the terminal pin arrangement hole 45b arranged at the left end of the eight solder piece introduction holes 45a and the terminal pin arrangement holes 45b. ing.

  The holder moving mechanism 15 includes a holder fixing member 52 to which the holder 14 is fixed, a support member 54 that rotatably supports the holder fixing member 52 via a support shaft 53, and the holder fixing member 52 with respect to the support member 54. And an air cylinder 55 for rotating the. The support member 54 is fixed to the XY stage 24 via a predetermined member. The support shaft 53 is attached to the front end side of the support member 54 so that the axial direction of the support shaft 53 coincides with the left-right direction. The support shaft 53 rotatably holds the upper end portion of the holder fixing member 52, and the holder fixing member 52 can be rotated about the support shaft 53 as a center of rotation.

  A fixing portion 52 a to which the fixed portion 14 c of the holder 14 is fixed is formed on the lower end side of the holder fixing member 52. In the fixing portion 52a, two magnet fixing holes are formed at positions corresponding to the magnet fixing holes 14f of the holder 14, and permanent magnets 56 are fixed to the magnet fixing holes (FIGS. 6 and 6). 13). In addition, the rear end portion of the two positioning pins 51 is fixed to the fixing portion 52a. The positioning pin 51 protrudes forward from the fixed portion 52a.

  In this embodiment, the holder 14 is fixed to the holder fixing member 52 by a magnetic attractive force acting between the permanent magnet 50 and the permanent magnet 56 in a state where the holder 14 is positioned by the positioning pin 51 inserted into the positioning hole 14g. ing. As shown in FIG. 5, the holder 14 fixed to the holder fixing member 52 is disposed above the hole forming portion 45 c of the heater chip 45. Further, the holder 14 fixed to the holder fixing member 52 is disposed in front of the suction ports 17a of the two suction pipes 17 attached to the lower end side of the main body frame 16 (see FIG. 13).

  The air cylinder 55 is fixed to the support member 54. The air cylinder 55 is arranged so that the rod of the air cylinder 55 protrudes toward the front side. The rod end of the air cylinder 55 (front end) is in contact with the rear surface of the holder fixing member 52 below the support shaft 53. The holder fixing member 52 is urged by a tension coil spring 57 in a direction in which the rear surface of the holder fixing member 52 and the tip of the rod of the air cylinder 55 contact each other about the support shaft 53. The rear end of the tension coil spring 57 is attached to the support member 54, and the front end of the tension coil spring 57 is attached to the lower end side of the holder fixing member 52. It should be noted that the biasing direction of the tension coil spring 57 (support) is supported by a screw 58 fixed to the holder fixing member 52 so as to protrude rearward and a stopper plate 59 fixed to the support member 54 and abutting the rear end of the screw 58. The rotation range of the holder fixing member 52 in the clockwise direction in FIG. 10 centering on the shaft 53 is restricted.

  In the holder moving mechanism 15, the solder piece supply hole 14e of the holder 14 and the solder piece introduction hole 45a of the heater chip 45 overlap each other, so that the solder piece 2a can be supplied from the solder piece supply hole 14e to the solder piece introduction hole 45a. Solder piece supply position 14A (position shown in FIGS. 7 and 10A) and retraction position 14B (FIG. 10B) where holder 14 retreats so that solder piece supply hole 14e is displaced from solder piece introduction hole 45a. The holder 14 is moved between the position shown in FIG. When the holder 14 moves between the solder piece supply position 14 </ b> A and the retracted position 14 </ b> B, the holder 14 and the holder fixing member 52 rotate around the support shaft 53. That is, when the holder 14 moves between the solder piece supply position 14 </ b> A and the retracted position 14 </ b> B, the holder fixing member 52 also moves together with the holder 14.

  When the holder 14 is in the solder piece supply position 14A, compressed air is not supplied to the air cylinder 55, and the rod of the air cylinder 55 is retracted rearward (see FIG. 10A). At this time, the rear end of the screw 58 is in contact with the front surface of the stopper plate 59 by the biasing force of the tension coil spring 57. At this time, the center axis of each of the eight solder piece supply holes 14e and the center axis of each of the eight solder piece introduction holes 45a coincide with each other, and the lower end of the solder piece supply hole 14e and the solder Each of the eight solder piece supply holes 14e and each of the eight solder piece introduction holes 45a is in the second direction (V direction) with a slight gap between the upper end of the piece introduction hole 45a. overlapping.

  Therefore, when the solder piece 2a passes through the solder piece supply hole 14e when the holder 14 is at the solder piece supply position 14A, the solder piece 2a is disposed in the solder piece introduction hole 45a. In this embodiment, the solder piece supply pipe 13 and the solder piece supply hole 14e (that is, the first supply pipe 41, the second supply pipe 42, and the solder piece supply hole 14e) are directed from the cutting mechanism 7 to the melting mechanism 10. Thus, a solder piece passage way through which the solder piece 2a passes is configured.

  On the other hand, when the holder 14 is in the retracted position 14B, compressed air is supplied to the head side of the air cylinder 55, and the rod of the air cylinder 55 protrudes to the front side (see FIG. 10B). At this time, the lower end of the solder piece supply hole 14e is shifted forward from the upper end of the solder piece introduction hole 45a. At this time, as shown in FIG. 13, the concave portion 14 h is arranged above the hole forming portion 45 c of the heater chip 45. Specifically, the concave portion 14h is disposed directly above the hole forming portion 45c so as to cover substantially the entire upper surface side of the hole forming portion 45c. As described above, the recess 14h is formed so that the lower side and the rear side are opened, and the lower side and the rear side of the recess 14h are opened even when the holder 14 is in the retracted position 14B. Yes.

  As described above, when the terminal pin 4a of the electronic component 4 is soldered to the land 3a of the circuit board 3, the melting mechanism 10, the holder 14, and the holder moving mechanism 15 are lowered. In a state where the melting mechanism 10, the holder 14, and the holder moving mechanism 15 are lowered, the suction pipe 17 is disposed behind the holder 14 and the heater chip 45 as shown in FIG. 13. That is, in this state, the suction tube 17 is disposed so that the suction port 17a faces the holder 14 side. In this state, when the holder 14 is in the retracted position 14B, the rear side of the recess 14h, which is the side where the suction port 17a is disposed, is open.

(Operation of soldering equipment)
FIG. 14 is a graph showing an example of the temperature profile of the heater chip 45 when soldering is performed by the soldering apparatus 1 shown in FIG.

  When soldering the terminal pins 4a of the electronic component 4 to the lands 3a of the circuit board 3 in the soldering apparatus 1, the eight thread solders 2 are simultaneously cut by the cutting mechanism 7 as described above, and the eight The solder piece 2 a is sent out from the cutting mechanism 7. Specifically, the solder piece 2a is sent out from the cutting mechanism 7 by the compressed air supplied to the introduction hole 35b of the fixed-side blade member 35 and the gravity acting on the solder piece 2a. In this embodiment, even after the solder piece 2a is sent out from the cutting mechanism 7, the moving-side blade member 36 is in the cutting completion position (position shown in FIG. 4) until the soldering of the terminal pin 4a to the land 3a is completed. is there.

  When the thread solder 2 is cut, the holder 14 is in the solder piece supply position 14A. Therefore, the eight solder pieces 2a sent out from the cutting mechanism 7 sequentially pass through the solder piece supply pipe 13 and the solder piece supply hole 14e of the holder 14, and as shown in FIG. It arrange | positions at the piece introduction hole 45a. The solder piece 2a disposed in the solder piece introduction hole 45a contacts the land 3a and the terminal pin 4a. The melting mechanism 10, the holder 14, and the holder moving mechanism 15 are lowered so that the lower surface of the hole forming portion 45 c contacts the upper surface of the circuit board 3 before the solder piece 2 a reaches the solder piece introduction hole 45 a. For example, the melting mechanism 10, the holder 14, and the holder moving mechanism 15 are lowered before the cutting mechanism 7 starts cutting the thread solder 2.

  In this embodiment, the current is intermittently supplied to the heater chip 45 before the terminal pins 4a are soldered to the lands 3a, and the temperature of the heater chip 45 is maintained at T0 (° C.) higher than the normal temperature. (See FIG. 14). T0 (° C.) is a temperature lower than the melting point of the solder piece 2a, and is, for example, 80 (° C.). When the solder piece 2a is disposed in the solder piece introduction hole 45a, current is supplied to the heater chip 45 so that the temperature of the heater chip 45 rises from T0 (° C.) to T1 (° C.) during t1 (seconds). The T1 (° C.) is, for example, 340 (° C.), and t1 (second) is, for example, 1 (second). Since T0 (° C.) is a temperature lower than the melting point of the solder piece 2a, the solder piece 2a does not start to melt in the process of placing the solder piece 2a in the solder piece introduction hole 45a. That is, the solder piece 2a does not start to melt before contacting the land 3a or the terminal pin 4a, but starts to melt after contacting the land 3a or the terminal pin 4a by being disposed in the solder piece introduction hole 45a.

  When the temperature of the heater chip 45 reaches T1 (° C.), a current is supplied to the heater chip 45 so that the temperature of the heater chip 45 is maintained at T1 (° C.) for t2 (seconds). When the time has elapsed, the supply of current to the heater chip 45 is stopped. t2 (seconds) is, for example, 2 (seconds). Thereafter, the state in which the lower surface of the hole forming portion 45c is in contact with the upper surface of the circuit board 3 is maintained until the temperature of the heater chip 45 is lowered to T2 (° C.). The mechanism 10, the holder 14, and the holder moving mechanism 15 are raised. T2 (° C.) is, for example, 330 (° C.). The eight solder pieces 2a are melted until the melting mechanism 10, the holder 14, and the holder moving mechanism 15 are raised. Further, when the melting mechanism 10, the holder 14, and the holder moving mechanism 15 are raised, the melted solder is solidified, and the soldering of the terminal pins 4a to each of the eight lands 3a is completed.

  Further, in the present embodiment, the holder moving mechanism 15 has the solder piece supply position before the start of melting of the solder piece 2a by the heater chip 45 or before a predetermined time has elapsed after the start of melting of the solder piece 2a by the heater chip 45. The holder 14 at 14A is moved to the retracted position 14B. In this embodiment, when the solder piece 2a passes through the solder piece supply hole 14e and is disposed in the solder piece introduction hole 45a, the holder moving mechanism 15 moves the holder 14 at the solder piece supply position 14A to the retracted position 14B. . That is, the holder 14 moves to the retracted position 14B before the solder piece 2a starts to melt.

  As described above, when the holder 14 is in the retracted position 14B, the concave portion 14h of the holder 14 is disposed directly above the hole forming portion 45c so as to cover substantially the entire upper surface side of the hole forming portion 45c. When the holder 14 is in the retracted position 14B, the lower side and the rear side of the recess 14h are open. Further, in a state where the melting mechanism 10, the holder 14, and the holder moving mechanism 15 are lowered, the suction pipe 17 is disposed on the rear side of the holder 14 so that the suction port 17a faces the holder 14 side. Therefore, when the holder 14 moves to the retracted position 14B, flux fume generated when the solder piece 2a is melted flows along a path as indicated by an arrow in FIG. That is, when the holder 14 moves to the retracted position 14B, a flow path of flux fumes from the hole forming portion 45c to the suction pipe 17 via the recess 14h is formed.

  As described above, even after the solder piece 2a is sent out from the cutting mechanism 7, until the soldering of the terminal pin 4a to the land 3a is completed, the moving-side blade member 36 is in the cutting completion position. Compressed air is introduced from the upper end of the solder piece supply pipe 13 (that is, the upper end of the first supply pipe 41) into the solder piece supply pipe 13 until the soldering of the terminal pin 4a is completed. Therefore, when the solder piece 2a is heated by the melting mechanism 10, the pressure of the solder piece supply pipe 13 and the solder piece supply hole 14e (that is, the pressure of the solder piece passage) is positive (positive pressure). That is, when the solder piece 2 a is heated by the melting mechanism 10, the pressure of the solder piece supply pipe 13 and the solder piece supply hole 14 e is positive due to the compressed air introduced from the upper end of the solder piece supply pipe 13.

(Main effects of this form)
As described above, in this embodiment, the solder chip introduction hole 45a in which the solder piece 2a is introduced and arranged in the heater chip 45, and the terminal pin arrangement hole 45b in which a part on the upper end side of the terminal pin 4a is arranged. And are formed individually. Therefore, in this embodiment, the situation where the side surface of the solder piece introduction hole 45a does not contact the solder piece 2a due to the influence of the terminal pin 4a, or the situation where the contact area between the side surface of the solder piece introduction hole 45a and the solder piece 2a becomes small. Can be prevented, and a contact area between the side surface of the solder piece introduction hole 45a and the solder piece 2a can be secured. Therefore, in this embodiment, even if the heating condition of the heater chip 45 is constant, the solder piece 2a disposed in the solder piece introduction hole 45a can be reliably melted.

  In particular, in this embodiment, since the solder piece introduction hole 45a is formed so as to penetrate in a direction inclined with respect to the vertical direction, it is compared with the case where the solder piece introduction hole 45a is formed so as to penetrate in the vertical direction. Thus, the solder piece 2a can be reliably brought into contact with the side surface of the solder piece introduction hole 45a. Therefore, in this embodiment, even if the heating condition of the heater chip 45 is constant, the solder piece 2a disposed in the solder piece introduction hole 45a can be more reliably melted.

  In this embodiment, the diameter of the solder piece introduction hole 45a is smaller than the diameter of the terminal pin arrangement hole 45b. According to the study of the present inventor, the solder piece 2a arranged in the solder piece introduction hole 45a may fluctuate when heated and melted. If the solder piece 2a arranged in the solder piece introduction hole 45a fluctuates, It has been clarified that the contact state between the side surface of the piece introduction hole 45a and the solder piece 2a becomes unstable, and the solder piece 2a is hardly melted. In this embodiment, since the diameter of the solder piece introduction hole 45a is small, the fluctuation of the solder piece 2a when the solder piece 2a disposed in the solder piece introduction hole 45a is melted is suppressed, and the solder piece introduction hole 45a. It is possible to stabilize the contact state between the side surface of the solder piece and the solder piece 2a. Therefore, in this embodiment, even if the heating condition of the heater chip 45 is constant, the solder piece 2a disposed in the solder piece introduction hole 45a can be more reliably melted.

  In this embodiment, since the solder piece introduction hole 45a and the terminal pin arrangement hole 45b are individually formed, the solder piece 2a can be reliably sent to the vicinity of the land 3a. Therefore, in this embodiment, the land 3a and the terminal pin 4a can be reliably soldered.

  In this embodiment, the electrode connecting portion 45d protrudes from the hole forming portion 45c in a direction parallel to the direction in which the solder piece introducing hole 45a is formed. Therefore, for example, when the heater chip 45 is manufactured by cutting one plate-like member, it is possible to reduce the thickness of the raw material necessary for manufacturing one heater chip 45. Become. That is, since the solder piece introduction hole 45a functions to introduce the solder piece 2a into the heater chip 45, it is necessary to lengthen the length of the solder piece introduction hole 45a to some extent so that the solder piece 2a is appropriately introduced. On the other hand, since the terminal pin arrangement hole 45b is provided in order to prevent interference between the terminal pin 4a and the heater chip 45, a problem arises in function even if the length of the terminal pin arrangement hole 45b is short. Absent. Therefore, for example, when the heater chip 45 is manufactured by cutting one plate-like member, it is parallel to the direction in which the solder piece introduction hole 45a that requires a length is formed as in this embodiment. If the electrode connection portion 45d protrudes in any direction, it is possible to reduce the thickness of the raw material of the heater chip 45 while ensuring the length of the solder piece introduction hole 45a. It becomes possible to reduce the raw material cost of 45.

  In this embodiment, the terminal pin arrangement hole 45b formed in the heater chip 45 for arranging a part of the terminal pin 4a is formed so as to penetrate in the vertical direction, and the terminal pin arrangement hole 45b is formed of a solder piece. It is an escape hole for escaping the flux fume generated when 2a is melted. Therefore, in this embodiment, it is possible to effectively escape the flux fume using the terminal pin arrangement hole 45b. Therefore, in this embodiment, it is possible to suppress the adhesion of the flux to the heater chip 45.

  Particularly in this embodiment, the diameter of the terminal pin arrangement hole 45b is larger than the diameter of the solder piece introduction hole 45a. Further, in this embodiment, the thickness in the first direction (W direction) on the upper end side of the hole forming portion 45c of the heater chip 45 is thinner than the thickness in the first direction on the lower end side of the hole forming portion 45c. The opening of the terminal pin arrangement hole 45b formed on the upper end side of the hole forming portion 45c can be enlarged. Therefore, in this embodiment, it becomes possible to escape the flux fume more effectively using the terminal pin arrangement hole 45b, and as a result, it is possible to effectively suppress the adhesion of the flux to the heater chip 45. Become.

(Other embodiments)
The above-described embodiment is an example of a preferred embodiment of the present invention, but is not limited to this, and various modifications can be made without departing from the scope of the present invention.

  In the embodiment described above, the soldering apparatus 1 solders each of the eight terminal pins 4a to each of the eight lands 3a at the same time. In addition, for example, the soldering apparatus 1 may simultaneously solder each of the seven or less terminal pins 4a to each of the seven or less lands 3a, or each of the nine or more lands 3a. Each of the more terminal pins 4a may be soldered simultaneously. The soldering apparatus 1 may solder one terminal pin 4a to one land 3a.

  For example, the soldering device 1 may simultaneously solder each of the three terminal pins 4a to each of the three lands 3a. In this case, the melting mechanism 10 includes a heater chip 65 shown in FIGS. 15 and 16, for example, instead of the heater chip 45. The heater chip 65 is formed with a solder piece introduction hole 65a corresponding to the solder piece introduction hole 45a of the heater chip 45 and a terminal pin arrangement hole 65b corresponding to the terminal pin arrangement hole 45b. Specifically, three solder piece introduction holes 65 a and three terminal pin arrangement holes 65 b are formed in the heater chip 65. FIG. 16 is a view of the heater chip 65 shown in FIG. 15, where (A) is a front view, (B) is a plan view, (C) is a bottom view, (D) is a side view, and (E) is a view. (D) The enlarged view which shows a part of heater chip 65 from the KK direction, (F) is an expanded sectional view of the MM cross section of (A).

  The heater chip 65 includes a hole forming portion 65c corresponding to the hole forming portion 45c of the heater chip 45 and an electrode connecting portion 65d corresponding to the electrode connecting portion 45d. A through hole 65e corresponding to the through hole 45e is formed on the tip end side of the electrode connecting portion 65d. Concave portions 65f that are recessed in the first direction (W direction) are formed at the left and right ends of the hole forming portion 65c. In the heater chip 65, the thickness in the first direction of the lower end portion of the hole forming portion 65c is equal to the thickness in the first direction of the upper end side of the hole forming portion 65c. In the heater chip 65, the thickness in the second direction (V direction) of the central portion of the hole forming portion 65c in the left-right direction is equal to the thickness in the second direction of both end portions of the hole forming portion 65c in the left-right direction. ing.

  Further, when the soldering apparatus 1 simultaneously solders each of the three terminal pins 4a to each of the three lands 3a, for example, the solder feeding mechanism 9 includes the three upper guide members 31 and 3 A number of lower guide members 32 are provided. Further, in this case, three passage holes 35 a and three vertical holes 35 d are formed in the fixed-side blade member 35, and three passage holes 36 a are formed in the moving-side blade member 36, and the guide member 37. Three through holes 37 a are formed in the holder 14, and three through holes 14 a are formed in the holder 14.

  In the embodiment described above, the bottom surface of the hole forming portion 45c facing the top surface of the circuit board 3 is a flat surface, but as shown in FIGS. 16 (E) and 16 (F), the hole facing the top surface of the circuit board 3 is used. An annular protrusion 65g may be formed on the lower surface of the formation portion 65c. The protrusion 65g is formed so as to surround the terminal pin arrangement hole 65b. Further, the outer diameter of the protrusion 65g is equal to or smaller than the outer diameter of the land 3a. Specifically, the outer diameter of the protrusion 65g is equal to the outer diameter of the land 3a. Further, the inner diameter of the protrusion 65g is equal to the inner diameter of the land 3a. In this case, when the terminal pin 4a is soldered to the land 3a, the lower surface of the protruding portion 65g contacts the land 3a, but the lower surface of the hole forming portion 65c other than the protruding portion 65g is other than the land 3a. The upper surface of the circuit board 3 is not contacted. Therefore, in this case, even if the circuit board 3 is not covered with a heat-resistant protective film, it is possible to prevent damage to the circuit board 3 due to heat during soldering.

  In the embodiment described above, the terminal pin arrangement hole 45b of the heater chip 45 is formed so as to penetrate in the vertical direction, and the solder piece introduction hole 45a is formed so as to penetrate in a direction inclined with respect to the vertical direction. . In addition, for example, the solder piece introduction hole 45a may be formed so as to penetrate in the vertical direction, and the terminal pin arrangement hole 45b may be formed so as to penetrate in a direction inclined with respect to the vertical direction.

  In the embodiment described above, the electrode connecting portion 45d protrudes from the hole forming portion 45c in a direction parallel to the direction in which the solder piece introducing hole 45a is formed, but the electrode connecting portion 45d is the solder piece introducing hole 45a. You may protrude from the hole formation part 45c toward the direction inclined with respect to the direction in which is formed. For example, the electrode connection part 45d may protrude from the hole forming part 45c in a direction parallel to the direction in which the terminal pin arrangement hole 45b is formed.

  In the embodiment described above, the diameter of the solder piece introduction hole 45a is smaller than the diameter of the terminal pin arrangement hole 45b, but the diameter of the solder piece introduction hole 45a is equal to the diameter of the terminal pin arrangement hole 45b. Alternatively, the diameter of the solder piece introduction hole 45a may be larger than the diameter of the terminal pin arrangement hole 45b. In the embodiment described above, the circuit board 3 is a flexible printed board, but the circuit board 3 may be a rigid board.

DESCRIPTION OF SYMBOLS 1 Soldering apparatus 2 Yarn solder 2a Solder piece 3 Circuit board 3a Land (a part of soldered part)
3b Through hole 4a Terminal pin (part of soldered part)
7 Cutting mechanism 10 Melting mechanism 45, 65 Heater chip 45a, 65a Solder piece introduction hole 45b, 65b Terminal pin arrangement hole (soldered part arrangement hole)
45c, 65c Hole forming part 45d, 65d Electrode connection part 65g Projection part W First direction

Claims (10)

In the heater chip that is heated by resistance heating and used in the soldering apparatus,
Solder piece introduction hole in which a solder piece, which is a cut thread solder, is introduced and arranged, and a soldered part arrangement hole in which at least a part of a soldered part to be soldered by the molten solder piece is arranged And a heater chip characterized by being formed individually. The soldered portion is constituted by a land formed so as to surround a through hole formed in a circuit board, and a terminal pin inserted through the through hole,
The heater chip according to claim 1, wherein a part of the terminal pin is disposed in the soldered portion disposition hole.   The solder piece introduction hole and the soldered portion arrangement hole are connected to one end side of the solder piece introduction hole and one end side of the solder piece introduction hole, and the other end of the solder piece introduction hole and the soldered portion. 3. The heater chip according to claim 1, wherein the solder piece introduction hole and the soldered part arrangement hole are formed so as to be separated from each other toward the other end of the part arrangement hole. A hole forming portion in which the solder piece introduction hole and the soldered portion arrangement hole are formed, and two electrode connection portions connected to electrodes for supplying current to the heater chip,
4. The heater chip according to claim 3, wherein the two electrode connection portions protrude from the hole forming portion in a direction parallel to a direction in which the solder piece introduction hole is formed.   5. The heater chip according to claim 1, wherein a diameter of the solder piece introduction hole is smaller than a diameter of the soldered portion arrangement hole.   A melting mechanism that has the heater chip according to any one of claims 1 to 5 and that melts the solder piece by heating, and a cutting mechanism that cuts the yarn solder into the solder piece. Soldering device. The soldered portion arrangement hole is formed so as to penetrate in the vertical direction,
The solder piece introduction hole is formed so as to penetrate in a direction inclined with respect to the vertical direction,
The soldering apparatus according to claim 6, wherein a lower end side of the solder piece introduction hole is connected to a lower end side of the soldered portion arrangement hole.   The soldering apparatus according to claim 7, wherein the soldered portion arrangement hole is an escape hole for releasing flux fumes generated when the solder pieces are melted by the heater chip. The heater chip includes a hole forming portion in which the solder piece introduction hole and the soldered portion arrangement hole are formed,
The hole forming portion is formed in a substantially rectangular parallelepiped shape having one horizontal direction as a longitudinal direction,
When the direction perpendicular to the direction in which the solder piece introduction hole is formed and the longitudinal direction of the hole forming portion is the first direction,
9. The soldering apparatus according to claim 8, wherein the thickness in the first direction on the upper end side of the hole forming portion is thinner than the thickness in the first direction on the lower end side of the hole forming portion. . The soldered portion is constituted by a land formed so as to surround a through hole formed in a circuit board, and a terminal pin inserted through the through hole,
A part of the terminal pin is arranged in the soldered part arrangement hole,
The heater chip includes a hole forming portion in which the solder piece introduction hole and the soldered portion arrangement hole are formed,
On the lower surface of the hole forming portion facing the upper surface of the circuit board, an annular projection that surrounds the soldered portion arrangement hole is formed,
10. The soldering apparatus according to claim 7, wherein an outer diameter of the projecting portion is equal to or smaller than an outer diameter of the land.

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