JP2019155381A - Soldering apparatus and soldering method - Google Patents

Abstract

To provide a soldering apparatus 1 and a soldering method which can complete soldering of a plurality of object to be soldered in a short time.SOLUTION: A soldering apparatus 1 makes a nozzle 60 having soldering-piece guiding passages 63, through which cut-off soldering pieces 2b are passed, to contact a rand R, and heats and melts the soldering pieces 2b in the soldering-piece guiding passages 63. The nozzle 60 is provided with: a soldering-piece storage body 44 having a plurality of soldering-piece storage parts 45 which have the plurality of soldering-piece guiding passages 63 in a straight line formed parallely therein and store the soldering pieces 2b cut off by a thread-solder cutting mechanism 40; and a shutter 36 that switches between a stopping state in which the soldering pieces 2b stored in the soldering-piece storage part 45 is stopped so as not to move toward the nozzle 60 and a releasing state in which the soldering pieces are allowed to move. The soldering-piece storage parts 45 of the soldering-piece storage body 44 move the shutter 36 from a closed state to a released state at positions corresponding to the soldering-piece guiding passages 63 of the nozzle 60.SELECTED DRAWING: Figure 5

Description

  The present invention, for example, a soldering apparatus for soldering a first conductor (terminal, land, lead wire, etc.) and a second conductor (terminal, land, lead wire, etc.) in an appropriate product such as a printed circuit board or a motor, and It relates to a soldering method.

  Conventionally, a soldering apparatus for mechanically soldering an electronic component to a printed circuit board has been provided. This soldering device uses a flow soldering method in which a printed circuit board is brought into contact with the solder liquid surface, or a solder paste is preliminarily printed on the circuit board in accordance with a pattern, and the cream solder is heated to be melted. Various methods have been proposed, such as a reflow soldering method in which soldering is performed with a solder.

  Here, the applicant uses a cylindrical nozzle as a soldering iron, inserts a pin of an electronic component inserted into the through hole of the printed circuit board into the nozzle, melts the solder inside, and solders it. A soldering device has been developed and provided (see Patent Document 1).

  Further, by confirming the nozzle temperature, nozzle position, nozzle load and solder supply amount at a predetermined timing such as when the apparatus is started up or in operation, the reliability and reliability of soldering can be further improved. (See Patent Document 2).

  However, in a work site where a large amount of soldering is performed on soldering objects having various shapes, it is required to shorten the time until all the soldering objects are completely soldered.

JP 2013-120869 A Japanese Patent Laying-Open No. 2015-115427

  In view of the above-described problems, an object of the present invention is to provide a soldering apparatus and a soldering method capable of completing soldering of a plurality of soldering targets in a short time, and to improve user satisfaction.

  The present invention is a soldering apparatus for soldering a first conductor and a second conductor by molten solder, and a nozzle having a solder piece supply passage through which a solder piece passes, and the proximity of the first conductor and the nozzle Relative distance changing means for changing the relative distance in the separation direction so that the first conductor and the nozzle come close to or in contact with each other; and heating means for heating and melting the solder piece in the solder piece supply passage of the nozzle; The nozzle includes a plurality of straight solder piece supply passages formed in parallel, and a plurality of solder piece storage portions for storing the solder pieces between the thread solder feeding means and the nozzle. And a switching means for switching between a stopped state in which the solder pieces stored in the solder piece storage portion are stopped so as not to move toward the nozzle side and a release state in which the movement is permitted, and the half of the solder piece storage body. Wherein the piece accommodating portion is in the solder piece soldering device is configured to to switch to the released state from the stopped state to the switching means at a position corresponding to the supply passage of the nozzle.

  According to the present invention, it is possible to provide a soldering apparatus and a soldering method capable of completing a plurality of soldering objects in a short time.

The right view of a soldering apparatus. The front view of a soldering apparatus. The block diagram which shows the structure of the drive system and control system of a soldering apparatus. Explanatory drawing explaining the structure of a thread solder cutting | disconnection mechanism part. Explanatory drawing of operation | movement from the cutting | disconnection of a solder piece to supply to a nozzle. Explanatory drawing of a structure of a nozzle and a heater.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  1 and 2 are explanatory views of an external configuration of the soldering apparatus 1, FIG. 1 is a right side view, and FIG. 2 is a front view.

  As shown in FIG. 1, the soldering apparatus 1 includes a head unit 3 having a nozzle 60 (soldering iron) that performs soldering on a through hole of a printed circuit board P to be soldered, and the head unit 3 and the nozzle 60. An air suspension unit 5 to be brought into a floating state, and a proximity / separation direction moving unit 6 (relative distance changing means) for moving the air suspension unit 5 and the nozzle 60 in a direction in which the air suspension unit 5 and the nozzle 60 are approached / separated (vertical direction in FIG. 1). The transfer direction moving unit 7 and the nozzle 60 are moved in the transfer direction (the depth direction in FIG. 1 and the left and right direction in FIG. 2) in which the printed circuit board P is transferred, the transfer direction moving unit 7 and the nozzle. Transport width for moving 60 in the transport width direction (left-right direction in FIG. 1, front-rear direction in FIG. 2) of the transport direction moving unit 7 Has a direction moving unit 8.

  On the upper part of the air suspension unit 5, a thread solder 2 wound around a reel is provided. The thread solder 2 can be φ0.3 to φ2.0 mm, and is preferably φ0.6 to φ1.6 mm.

A nozzle 60 is provided below the head portion 3, and a heater 51 (heating means) is connected to the nozzle 60.
The upper surface of the transport width direction moving unit 8 is configured to have substantially the same height as the upper surface of the transport path 9 that transports the printed circuit board P.

  The movable range of the head unit 3 includes a standby position (position P1 shown in FIG. 1) located above the transport width direction moving unit 8 and soldering areas E1 and E2 for soldering the printed circuit board P (FIG. 1). 1 and an area surrounded by E2 in FIG. The head unit 3 is moved by the approaching / separating direction moving unit 6 at any of the standby position and the soldering area.

  With this configuration, the soldering apparatus 1 waits for the nozzle 60 at the height and position of the standby position P1 during standby, and when performing the soldering process, the soldering apparatus 1 is in the soldering areas E1 and E2 more than the standby position P1. Soldering is performed at a low soldering position P2 (close to the soldering target).

  FIG. 3 is a block diagram showing the configuration of the drive system and the control system of the soldering apparatus 1. The soldering apparatus 1 is fixed to the transport width direction moving unit 8 (see FIG. 1) and is transported in the Y direction (transport width direction, depth direction in FIG. 2) extending straight toward the transport path 9 (see FIG. 1). 7f and a conveyance guide 7c in the X direction (conveyance direction, left-right direction in FIG. 2) that moves along the conveyance guide 7f in the Y direction by a drive mechanism section 7e such as a stepping motor. The drive mechanism 7e and the Y-direction transport guide 7f are housed in a transport width direction moving unit 8 (see FIG. 1). The conveyance guide 7c in the X direction extends straight in the conveyance direction (X direction) of the conveyance path 9.

  A moving body 7a that moves in the X direction along the X direction conveying guide 7c and a stepping that moves the moving body 7a in the X direction along the X direction conveying guide 7c are provided above the X direction conveying guide 7c. A drive mechanism portion 7b composed of a motor or the like is provided. The moving body 7a, the drive mechanism 7b, and the X-direction transport guide 7c are housed in a transport direction moving unit 7 (see FIG. 1). The moving body 7a, the drive mechanism unit 7b, the X-direction transport guide 7c, the drive mechanism unit 7e, and the Y-direction transport guide 7f function as nozzle position moving means for moving the nozzle 60 to an arbitrary position to be operated. .

  The moving body 7a is provided with a conveyance guide 5c in the Z direction (height direction) in which the nozzle 60 extends in the direction of approaching / separating from the through hole. The transport guide 5c is provided with a head fixing portion 5a that moves in the Z direction, and a drive mechanism portion 5b that includes a stepping motor and the like. The head fixing unit 5a, the drive mechanism unit 5b, and the conveyance guide 5c function as a proximity / separation direction moving unit that moves the nozzle 60 in a direction to approach / separate the soldering target, and the proximity / separation direction moving unit 6 (see FIG. 1). ).

  The Y-direction conveyance guide 7f, the X-direction conveyance guide 7c, and the drive mechanism portions 7b and 7e configured as described above function as nozzle position moving means, so that the position of the nozzle 60 is soldered to an arbitrary position. Can be moved. In addition, the Z-direction conveyance guide 5c and the drive mechanism 5b function as the approaching / separating direction moving means, so that the nozzle 60 is moved in the proximity direction at the moved position, so that the hole of the nozzle 60 (a solder piece guiding path described later) 63) A pin to be soldered can be inserted into the soldering position such that the tip of the nozzle 60 is brought into contact with the through hole. Further, the Z-direction transport guide 5c and the drive mechanism unit 5b are moved in a direction close to the replacement nozzle 60 or the heater 51 at a nozzle station (not shown), and are separated after the nozzle 60 or the heater 51 is replaced. Can do.

  A floating unit 15 is provided in the head fixing portion 5a. The floating unit 15 is provided in the air suspension unit 5 (FIG. 1), lifts the nozzle 60 by the supplied air, and reduces the relative weight of the floating unit 15 (including the nozzle 60) with respect to the printed circuit board P. To do. For example, if the normal weight is 100, the weight of the floating unit 15 can be 10%.

  The head unit 3 is fixed to the floating unit 15, and a thread solder supply guide 16 for inserting the thread solder 2 (see FIG. 1), and a thread solder delivery mechanism that feeds the thread solder in the thread solder supply guide 16 with a roller sandwiched between them. 17 (thread solder feeding means for feeding the thread solder from the tip) is provided, and a thread solder cutting mechanism 40 is provided at the bottom. This thread solder cutting mechanism section 40 is configured to be movable by a rotation mechanism section 19 (solder piece storage body moving means, relative moving means) constituted by a stepping motor or the like, and has been supplied to the thread solder supply guide 16. The solder wire 2 (see FIG. 1) is cut from the tip at a set length according to the control of the rotation mechanism 19 to create a solder piece.

  In addition, each element is controlled by the control unit 21 to drive these components. The control unit 21 includes a drive mechanism unit 5b, a drive mechanism unit 7b, a drive mechanism unit 7e, a floating unit 15, a thread solder delivery mechanism unit 17, a rotation mechanism unit 19, a heater unit contact confirmation sensor 22, a temperature sensor 23, and a detachable unit. An air cylinder 24, a camera 25, and a storage unit 26 are connected.

  The camera 25 is used when confirming and positioning the positions of through-holes and pins of a printed circuit board to be soldered and when detecting a soldering abnormality such as when a soldering turtle occurs.

  The storage unit 26 is currently attached with tool data for each soldering target work in which an image of a soldering target work such as a printed circuit board and a tool (nozzle 60 or heater 51) used for the soldering target work is associated. Data such as the type of tool, the number of times the tool is currently installed, and the usage time are stored.

  4A and 4B are explanatory views for explaining the configuration of the thread solder cutting mechanism 40. FIG. 4A is an exploded perspective view of the thread solder cutting mechanism 40, and FIG. A longitudinal sectional view is shown.

  The thread solder cutting mechanism 40 includes a thread solder supply guide 16 having a passage through which the thread solder 2a fed downward, a solder piece storage body 44 for storing a plurality of cut solder pieces 2b, and a solder piece storage body. It is comprised by the rotation mechanism part 19 (refer FIG. 3) which moves 44. FIG. Further, the solder piece storage body 44 is provided with a shutter 36 (switching means) for controlling storage / release of the stored solder pieces 2b and a biasing body 35 (biasing means) for biasing the shutter 36. ing. Further, a shutter operation unit 49 (shutter movement restricting body) for releasing the shutter 36 is provided separately from the solder piece storage body 44. The solder piece storage body 44, the rotation mechanism 19, the shutter 36, and the shutter operation unit 49 serve as solder piece supply means for supplying the solder piece 2b to a hole (a solder piece guide passage 63 described later) of the nozzle 60. Function.

  The thread solder supply guide 16 is formed in a cylindrical shape by a metal member, and allows the thread solder 2a to pass through the inner hole (passage) in the longitudinal direction. Further, the thread solder supply guide 16 is fixed so as not to move in a direction perpendicular to the passing direction of the thread solder 2a (radial direction of the thread solder 2a).

  The urging body 35 can be constituted by an appropriate spring, and in this embodiment, it is constituted by a metal crane spring.

  The shutter 36 is formed of a metal plate bent in an L shape, and is a storage / release control plate portion 38 in which the bottom surface of the L shape is in a horizontal state (a state perpendicular to the approaching / separating direction). A vertical operation portion 37 is a pressing operation portion 37 that is pressed by the urging body 35. The storage / release control plate portion 38 is provided with a plurality of release holes 38a (through holes or through grooves) at equal intervals in a straight line. In this embodiment, four release holes 38a are provided. An adjacent portion of the release hole 38a (including a portion between the release hole 38a and the release hole 38a) functions as a closing portion that prevents the solder piece 2b from falling. The shutter 36 is provided with a plurality of release holes 38a. However, the present invention is not limited to this, and a plurality of release grooves may be provided so that the storage / release control plate portion 38 of the shutter 36 looks like a comb shape in plan view. . In this case, the same function can be secured.

  The solder piece storage body 44 is integrally formed with a guide portion 48 that is wider than the width of the block portion 43 in the short direction and has the same length in the longitudinal direction on the lower surface of the horizontally long cubic block portion 43. The guide portion 48 is provided with a shutter insertion hole 47 penetrating in the longitudinal direction. The shutter insertion hole 47 is formed so that the height and width thereof are slightly larger than the height and width of the storage / release control plate portion 38 of the shutter 36, and the shutter 36 can slide smoothly in the longitudinal direction without blurring. Yes. The block portion 43 and the guide portion 48 are provided with a plurality of solder piece storage portions 45 penetrating in the vertical direction (proximity and separation direction) at regular intervals. In this embodiment, four are provided, which are the same size as the release holes 38a of the shutter 36 and are provided at the same intervals.

  Note that the release hole 38 a of the shutter 36 may be formed larger than the solder piece storage portion 45. Thereby, the solder piece 2b can be dropped reliably when it is in the open state. The solder piece storage portion 45 is formed by a hole, but is not limited to this, and the solder piece 2b is dropped, for example, by being surrounded by a plurality of members so that the solder piece 2b can be enclosed in the enclosure. It can be set to an appropriate shape that can be stored.

  One end of a guide plate 42 that is long in the longitudinal direction of the solder piece storage body 44 is connected to an upper end of the solder piece storage body 44 in the longitudinal direction. The other end of the guide plate 42 is provided with a screw-fastening hole 41, and the locking plate 32 is screwed into the hole 41 with a screw 31.

  The locking plate 32 is provided with a screw hole 33 through which the screw 41 is inserted. A pressing opposing surface 34 that faces the pressing operation portion 37 of the shutter 36 is provided below the screw hole 33 of the locking plate 32. One end of the urging body 35 comes into contact with the pressing facing surface 34 and the other end of the urging body 35 comes into contact with the pressing operation portion 37 of the shutter 36, so that the distance from the pressing facing surface 34 to the pressing operation portion 37 is determined. Further, the urging body 35 that is in the normal state is extended in a direction in which the pressing opposing surface 34 and the pressing operation portion 37 are separated from each other. As a result, the shutter 36 is maintained in a state in which the pressing operation portion 37 is in contact with one end surface of the solder piece storage body 44. At this time, as shown in FIG. 4B, the positions of the solder piece storage portion 45 of the solder piece storage body 44 and the release hole 38a of the shutter 36 are shifted, and the solder piece storage portion 45 of the solder piece storage body 44 is displaced. The shutter 36 is closed by a storage / release control plate 38. Accordingly, the solder pieces 2 b existing in the solder piece storage portion 45 are stored so as not to fall downward by the storage / release control plate portion 38 of the shutter 36.

  On the opposite side of the solder piece storage body 44 from the guide plate 42, a shutter operation unit 49 is provided at a position separated from the solder piece storage body 44 independently of the solder piece storage body 44. The shutter operation unit 49 is disposed to face an end surface of the shutter 36 opposite to the pressing operation unit 37 of the storage / release control plate unit 38. Therefore, when the solder piece storage body 44 is moved together with the shutter 36 toward the shutter operation unit 49 by the rotational drive of the rotation mechanism unit 19 (see FIG. 3), the end surface of the shutter 36 comes into contact with the shutter operation unit 49. When the solder piece storage body 44 is further moved by the rotational drive of the rotation mechanism 19 (see FIG. 3), the shutter 36 does not move any further by the shutter operation section 49, so that the solder piece storage body 44 and the shutter 36 are not moved. The relative position changes, the position of the solder piece storage portion 45 of the solder piece storage body 44 and the release hole 38a of the shutter 36 become the same position, and the released state, and the solder piece 2b falls downward.

  The solder piece storage body 44 and the thread solder supply guide 16 are arranged so that their opposing surfaces are in contact with each other, and are configured to be relatively movable in the radial direction of the thread solder 2a to be supplied. In this implementation, the thread solder supply guide 16 is fixed, and the solder piece storage body 44 can slide in the radial direction of the thread solder 2a. Therefore, in a state where a part of the thread solder 2a fed out from the thread solder supply guide 16 is supplied to the solder piece storage portion 45 of the solder piece storage body 44, the solder piece storage body 44 is moved in the radial direction of the thread solder 2a. When moved, the thread solder 2 a is cut at the contact surfaces of the solder piece storage body 44 and the thread solder supply guide 16 by the relative movement of the solder piece storage body 44 and the thread solder supply guide 16. Accordingly, the solder piece storage body 44 and the thread solder supply guide 16 serve as solder piece cutting means for cutting the solder piece 2b. The cut solder piece 2 b is stored in the solder piece storage portion 45 of the solder piece storage body 44.

  Further, the upper surface of the solder piece container 44, the lower surface of the thread solder supply guide 16, and the storage / release control plate 38 of the shutter 36 are all parallel to the moving direction of the solder piece container 44 (particularly in the horizontal direction in this embodiment). It is configured. Also, the longitudinal direction (solder piece passage direction) of the solder piece storage portion 45 and the longitudinal direction (solder piece passage direction) of the solder piece guide passage 63 (solder piece supply passage, see FIG. 5D) of the nozzle 60 are all. The solder piece storage body 44 is configured to be perpendicular to the moving direction (particularly, in this embodiment, the vertical direction).

  FIG. 5 is a cross-sectional view illustrating an operation in which the solder piece storage body 44 cuts the thread solder 2 to store a plurality of solder pieces 2b, and then opens the shutter 36 to drop the plurality of solder pieces 2b. FIG. This operation is performed by the control unit 21 (see FIG. 3) controlling the driving of the thread solder delivery mechanism unit 17 and the rotation mechanism unit 19.

  As shown in the cross-sectional view of FIG. 5A, the solder piece storage body 44 is supplied by the solder piece storage portion 45 closest to the shutter operation portion 49 by the rotational drive of the rotation mechanism 19 (see FIG. 3). It stops in a state where it communicates in a straight line at a position below the guide 16. In this state, the thread solder 2a, which is drawn out from the tip side of the wound thread solder 2 (see FIG. 1) and has a rod shape, is sent out by the thread solder delivery mechanism 17 (see FIG. 3), and FIG. As shown in B), the tip of the thread solder 2 a is stored in the solder piece storage portion 45. Then, when the thread solder 2a is fed out to a state where the length from the opposing surface portion (contact surface portion) of the solder piece storage body 44 and the thread solder supply guide 16 to the tip of the thread solder 2a becomes the required length of the solder piece 2b, The solder delivery mechanism 17 (see FIG. 3) stops supplying (feeding out) the thread solder 2a.

  In this state, when the solder piece storage body 44 is slid by the rotational drive of the rotation mechanism 19 (see FIG. 3), the thread solder 2a is caused by the opposing surface portion (contact surface portion) of the solder piece storage body 44 and the thread solder supply guide 16. Is cut into the solder piece 2b, and the solder piece 2b is stored (stored) in the solder piece storage portion 45 as shown in FIG. FIG. 5C shows a state in which the cutting is completed by repeating this cutting by the number of the solder piece storage portions 45 (the required number). The distance at which the solder piece storage body 44 is slid and moved at this time is the same as the distance between the centers of the adjacent solder piece storage portions 45. Therefore, immediately below the thread solder supply guide 16, the solder piece storage portion 45 adjacent to the solder piece storage portion 45 corresponding to the front is located.

  When the solder piece storage body 44 is slid by the rotational drive of the rotation mechanism 19 (see FIG. 3), the tip of the shutter 36 is pressed against the shutter operating portion 49 as shown in FIG. The force member 35 contracts, and the solder piece storage portion 45 of the solder piece storage body 44 and the release hole 38a of the shutter 36 all communicate with each other, and the plurality of solder pieces 2b are simultaneously dropped and supplied downward. When dropping the solder pieces 2b, push rods (not shown) are inserted into all the solder piece storage portions 45 from the upper side to the lower side, the solder pieces 2b are pushed downward, and the solder pieces 2b are forced downward. It is good also as a structure supplied to the nozzle 60 (refer FIG. 3).

6A and 6B are explanatory views for explaining the configuration of the nozzle 60 and the heater 51. FIG. 6A is an exploded perspective view, FIG. 6B is a perspective view, and FIG. 6C is a longitudinal sectional view.
The nozzle 60 is formed by overlapping (contacting) two members of the first member 61 and the second member 65. The first member 61 and the second member 65 are both made of ceramic.

  In the first member 61, a plurality of straight solder piece guide grooves 63a are formed in parallel in a vertical direction (proximity and separation direction) on one surface of a rectangular parallelepiped shape integrally formed as one member (a surface 61a facing the second member 65). ing. The first member 61 has a fixing groove 62 on the side surface adjacent to the surface on which the solder piece guiding groove 63a is provided.

  The second member 65 is formed in a rectangular parallelepiped having the same outer shape as the first member 61 and the same size. That is, the second member 65 is such that the surface 65a facing the first member 61 is a flat surface without the solder piece guiding groove 63a, and the size and shape of the surface in contact with the first member 61 are the same. Is formed. The second member 65 is provided with a fixing groove 66 on the side surface adjacent to the surface facing the first member 61. What is the position and depth of the fixing groove 66? It is formed in the same manner as the fixing groove 62 of the first member 61.

  The second member 65 is provided with a heater through-hole 67 penetrating in the arrangement direction in which a plurality of solder piece guiding grooves 63a are arranged at a position close to the surface facing the first member 61. The heater 52 of the heater 51 is inserted into the heater through hole 67. In the illustrated example, the heating portions 52 of the two heaters 51 are inserted from the openings at both ends of the heater through hole 67, respectively.

  The second member 65 is provided with a hole 68 at the center of the surface opposite to the surface facing the first member 61, and a thermocouple 57 is inserted into the hole 68. The thermocouple 57 functions as the temperature sensor 23 (see FIG. 3) and measures the temperature of the nozzle 60.

  When all these are combined, as shown in FIG. 6B, the opposing surfaces of the first member 61 and the second member 65 are brought into contact with each other without a gap, and the solder piece guiding groove 63a (see FIG. 6 (A)) and a solder piece guide passage 63 for guiding the solder piece 2b to a position where it abuts against the terminal T at a portion of the opposing surface of the second member 65 facing the solder piece guide groove 63a. It is formed. The solder piece guide passages 63 are arranged in a straight line in the vertical direction (proximity / separation direction), and a plurality (four in this embodiment) are arranged in parallel at equal intervals.

  Each solder piece guide passage 63 (and solder piece guide groove 63a) is formed in the same size and at the same interval as the solder piece storage portion 45 of the solder piece storage body 44 (see FIG. 5).

  Therefore, as shown in FIG. 5D, the solder pieces 2b that fall simultaneously (substantially simultaneously) are arranged such that the solder piece storage portion 45 and the solder piece guide passage 63 communicate with each other at the lower position. As shown in FIG. 6C, the solder piece guide passages 63 are supplied all at once (substantially simultaneously).

  When soldering, the nozzle 60 is lowered to a position where the lower end is in contact with the land R of the printed circuit board P, and the supply of the above-described solder piece 2b is received at this position. At this time, the solder piece 2b is the end portion that is the most convex with respect to the tip of the terminal T of the electronic component C of the printed circuit board P (the solder piece guiding passage 63 in the solder piece guiding direction (below in FIG. 6C)). It stops in contact with the upper end of FIG. In the illustrated example, the solder piece 2b is placed on the terminal T and stopped.

  The solder piece 2 b supplied to the solder piece guiding passage 63 of the nozzle 60 is melted by receiving heat from the heating unit 52 of the heater 51. At this time, the heat of the heating part 52 is transmitted from the solder piece 2b to the terminal T, and the terminal T is also gradually heated by this transmitted heat. The land R receives heat directly from the nozzle 60 and is heated before the terminal T.

Then, when the solder piece 2b reaches the melting temperature, the solder piece 2b is melted, but is still in a substantially spherical state on the terminal T. Also during this time, the terminal T is heated by the transfer heat. When the heating of the terminal T further proceeds, a plurality (four) of molten solders in which the solder pieces 2b are melted flow out along the terminal T, and a plurality (four) of the terminals T (second conductor) and the land R ( The first conductors are half-attached simultaneously (simultaneously) and electrically connected. Thereafter, the nozzle 60 is moved upward and separated, and the molten solder is cooled and solidified, whereby soldering at a plurality of locations is completed simultaneously (simultaneously).
This soldering operation will be described in detail below.

<Soldering operation>
As shown in the sectional view of FIG. 6C, a printed circuit board P on which lands R are formed as a soldering base material, and a through hole of the printed circuit board P is inserted into the through-hole of the printed circuit board P from the front surface side (FIG. 6 (C) is prepared in which the terminal T of the electronic component C is inserted from the lower surface side to the upper surface side.

<Alignment process>
The control unit 21 uses the Y-direction conveyance guide 7f, the X-direction conveyance guide 7c, and the drive mechanism portions 7b and 7e to move the positions of the plurality of solder piece guide passages 63 of the nozzle 60 on the XY plane and perform soldering. Facing a plurality of lands R. The position at this time is such that the center of the land R on the back surface side of the printed circuit board P and the center of the solder piece guiding passage 63 are substantially coincident, or the center of the tip end of the terminal T and the center of the solder piece guiding passage 63 is approximately. The matching position.

<Solder piece cutting and storing process>
The control unit 21 supplies the solder wire 2a up to a required length to one solder piece storage unit 45 in the solder piece storage body 44 by the thread solder delivery mechanism unit 17 and drives the rotation mechanism unit 19 to drive the solder piece storage body 44. The thread solder 2 is cut by the thread solder cutting mechanism section 40 (thread solder cutting means) to obtain the solder piece 2b, which is stored in the solder section storage section 45. At this time, since the shutter 36 is in a closed state (a stopped state in which the solder piece 2b is stopped in the accommodated state), the solder piece 2b does not fall from the solder piece accommodating portion 45. By repeating this operation, the solder pieces 2b having the required length are stored one by one in all the solder piece storage portions 45. It should be noted that this solder piece cutting and storing step can be performed at an appropriate timing such as being executed before the nozzle approaching step or being performed in parallel with the nozzle approaching step.

<Nozzle proximity process>
The control unit 21 moves the head unit 3 in a floating state along the conveyance guide 5c in the direction of proximity to the land R by the drive mechanism unit 5b, so that the front end surface (lower end surface in the drawing) of the nozzle 60 is the back surface of the printed board P. It is made to contact the surface of the land R on the side. As a result, the tip of the terminal T is inserted inside the solder piece guiding passage 63 of the nozzle 60.

  At this time, the terminal T is separated from the inner wall of the solder piece guiding passage 63 of the nozzle 60 by an equal distance, and the state where the terminal T and the nozzle 60 are separated in a non-contact manner is maintained. This prevents heat from being directly transferred from the nozzle 60 to the terminal T, and the terminal T is gradually heated by radiant heat transfer and convective heat transfer. On the other hand, the land R of the printed circuit board P is rapidly heated by direct heat conduction from the nozzle 60 in contact and heat transfer by convective heat transfer.

<Solder piece supply process>
The control unit 21 drives the rotation mechanism unit 19 to further move the solder piece storage body 44 and moves the shutter 36 until the shutter 36 contacts and is pressed against the shutter operation unit 49. As a result, the plurality of release holes 38a of the shutter 36 communicate with the plurality of solder piece storage portions 45, respectively, and the plurality of solder pieces 2b fall all at once and are supplied one by one to the plurality of solder piece guide passages 63 of the nozzle 60. Is done. The solder piece 2b supplied so as to fall from above is preheated while passing through the solder piece guiding passage 63, and the end portion comes into contact with the terminal T and stops at the contact position, so that the position and the fall are regulated. At this time, the inner wall of the solder piece guiding passage 63 functions as a drop restricting portion that restricts the solder piece 2b from falling from a state where the solder piece 2b stands vertically or obliquely on the tip of the terminal T.

<Melting process>
The unmelted solder piece 2 b guided to the contact position does not drop from the position, and at least a part of the end portion on the side opposite to the terminal T is located near the heating portion 52 of the heater 51. It contacts the inner wall of the solder piece guide passage 63. For this reason, the plurality of unmelted solder pieces 2b at the contact position are all at once by heat conduction through one end, both ends, or sides of the solder piece 2b that is in contact with the inner wall of the solder piece guide passage 63. Melted. In addition, when the solder piece 2b is melted, in addition to direct heat conduction in contact with the nozzle 60, indirect heat conduction such as radiant heat transfer from the nozzle 60 and convection heat transfer by hot air convection in the nozzle 60. Is also done.

  When the plurality of solder pieces 2b are melted, they tend to be rounded and become almost spherical due to surface tension. However, since the solder pieces 2b are restricted by the inner wall of the solder piece guide passage 63 of the nozzle 60 and the tip of the terminal T, they cannot become true spheres. It deforms into a thick and short shape in a state where it is in contact with the tip of T (a state where it is placed on the terminal T). This shape is a shape in which both ends of a short cylinder are spherical.

  When melted in this way, heat is transferred from the nozzle 60 to the plurality of solder pieces 2b, and further, heat is transferred from the plurality of solder pieces 2b to the plurality of terminals T, so that the plurality of terminals T are heated more rapidly than before. Is done. During this heating, the molten solder piece 2b is in contact with the terminal T, that is, placed on the terminal T and stopped without moving in the solder piece supply direction (downward). In addition, it is 217 degreeC or more that the solder piece 2b fuse | melts.

  When the terminal T is heated to an appropriate temperature through the molten solder piece 2b, the plurality of molten solder pieces 2b start to get wet and flow from the tip of the terminal T along the side surface of the terminal T all at once. Here, the shape of the solder piece 2b before starting to flow after being melted may continue to change due to the influence of heat or the like while the position is stopped. Then, the molten solder piece 2b that has flowed out along the side surface of the terminal T spreads over the land R on the back surface side, and further flows into the gap between the side surface of the terminal T and the land R facing the through hole by capillary action. To do. And it also spreads to the land R on the surface side.

<Nozzle separation process>
Thereafter, the control unit 21 causes the drive mechanism unit 5b to move the floating head unit 3 along the conveyance guide 5c in a direction away from the land R, and the tip surface of the nozzle 60 is moved to the land on the back side of the printed circuit board P. Separate from the surface of R. Thereby, the land R, the terminal T, and the molten solder piece 2b are rapidly cooled, the molten solder piece 2b is solidified, and the soldering operation is completed.

  By such a movement of the melted solder piece 2b, the plurality of terminals T are reliably soldered to the plurality of lands R, respectively. Thus, the finished appearance of the solder at a plurality of locations soldered all at once (beautifully) is beautiful, and the back fillet shape is also beautifully formed.

  With the above configuration and operation, a plurality of soldering objects can be soldered in a short time. In the embodiment described above, the four solder pieces 2b can be sequentially cut and soldered at four locations all at once, so that soldering can be completed in a much shorter time than soldering one by one.

  Further, only the solder pieces 2b are cut one by one, but the other proximity and separation operations of the nozzle 60 and the melting and soldering operations of the plurality of solder pieces 2b are the same as in the case of soldering one by one. Since this can be done in time, the same number of solder pieces 2b as many as the solder piece guide passages 63 of the nozzle 60 can be implemented simultaneously to reduce the time.

  Further, the control unit 21 only controls the driving of the rotation mechanism unit 19 to cut the solder pieces 2b from the thread solder 2a and store them in the solder piece storage units 45, and the shutter 36 is released by the shutter operation unit 49. The plurality of stored solder pieces 2b can be supplied to the solder piece guide passage 63 of the nozzle 60 all at once. Therefore, it is possible to carry out from the cutting of the plurality of solder pieces to the simultaneous supply of the plurality of solder pieces in a short time without waste with a small and lightweight structure.

  Further, by controlling the operation of the rotation mechanism 19 by the control unit 21, a plurality of solder piece guiding passages 63 of the nozzle 60 are all used for simultaneous soldering or a part of the solder piece guiding passages 63. It is possible to easily control whether one or a plurality of places are to be soldered using. Further, which solder piece guide passage 63 among the plurality of solder piece guide passages 63 stores the solder piece 2b depends on the distance by which the control section 21 moves the solder piece storage body 44 and the yarn solder delivery mechanism section 17. It can be controlled freely by controlling the delivery timing of the thread solder 2a. Accordingly, when there are a large number of soldered portions on one printed circuit board P, it is possible to perform soldering on a plurality of portions at the same time, and solder this other portion one by one.

  In addition, this invention is not restricted to embodiment mentioned above, It can be set as various embodiment.

  For example, the solder piece storage portion 45 of the solder piece storage body 44, the release hole 38a of the shutter 36, and the solder piece guide passage 63 of the nozzle 60 are all arranged in a line at the same interval, but this is not a limitation, and the arrangement interval is changed. In addition, an appropriate configuration such as a plurality of columns instead of one column can be employed. As a result, soldering can be performed simultaneously in accordance with the arrangement interval of the soldering target, and in the case of a plurality of rows, a plurality of solder pieces 2b can be cut and soldered so that more solder pieces 2b can be soldered simultaneously. it can.

  Further, the shape of the nozzle 60 and the number and shape of the solder piece guide passages 63 can be variously configured according to the soldering object, and according to this, the solder piece storage portion 45 of the solder piece storage body 44 and the shutter 36 are arranged. By forming the shape, it is possible to perform soldering at a plurality of locations all together for various soldering objects.

  In addition, the solder piece storage body 44 is configured such that two members having a plurality of straight grooves arranged in parallel on one surface are aligned so that the grooves face each other, and the grooves form the solder piece storage portion 45. May be. In this case, the opposing surfaces of the two members are preferably in contact with each other, but may be configured to be separated by a gap smaller than the thickness of the solder piece 2b. Also in this case, it is possible to store the solder pieces 2b in the solder piece storage portion 45 and operate the shutter 36 to drop the solder pieces 2b all at once.

  In addition, the nozzle 60 is configured by bringing the first member 61 and the second member 65 into contact with each other. However, the nozzle 60 may be configured to be separated by a gap smaller than the thickness of the solder piece 2b. Also in this case, the solder piece 2b is guided by the solder piece guide passage 63 until it abuts against the terminal T, and the solder piece 2b that is abutted against the terminal T and stopped is melted and soldered on the terminal T. Can do. In addition, when the 1st member 61 and the 2nd member 65 are contact | abutted, the effect which can prevent more that a solder ball or a flux is discharge | released outside from the solder piece accommodating part 45 is acquired.

  Further, although the solder piece guide passage 63 of the nozzle 60 is a hole having a square section, it can be a hole having an appropriate shape such as a square section, a section rectangle, a section circle, a section ellipse, or a section semicircle. In this case, when the solder piece guiding groove 63a is provided on both the first member 61 and the second member 65 and they are overlapped with each other, the holes may be appropriately formed.

  Further, side holes extending in the horizontal direction are provided in one or both of the first member 61 and the second member 65 from each solder piece guide passage 63 of the nozzle 60, and fumes generated in the solder piece guide passage 63 during soldering are provided. It is good also as a structure discharged | emitted outside. In this case, this side hole is preferably provided above the upper end of the solder piece 2 b that contacts the terminal T in the solder piece guide passage 63. Thereby, it can prevent that a solder ball, flux, etc. scatter from the side hole out of the nozzle 60.

  In addition, the first conductor and the second conductor to be soldered are not limited to the terminal T and the land R of the printed circuit board P. An appropriate soldering target such as a placed terminal and the wiring can be used. In these cases as well, the first conductor and the second conductor can be soldered and electrically connected in a state where the nozzle is close to or in contact with the first conductor.

  In addition, the configuration in which the solder piece 2b is supplied from the solder piece storage portion 45 of the solder piece storage body 44 to the solder piece guide passage 63 of the nozzle 60 by opening and closing the shutter 36 as switching means is not limited to this. In a state where 2b is stored in the solder piece storage portion 45, the solder piece storage body 44 is rotated and turned upside down, and the solder piece 2b is dropped from the solder piece storage portion 45 and supplied to the solder piece guide passage 63 of the nozzle 60. It is good. In this case, the shutter 36 is not provided, the solder piece storage portion 45 is opened with respect to one surface (upper surface) of the solder piece storage body 44, and the solder piece storage portion 45 is closed without opening on the opposite surface (lower surface). It is better to have a configuration with In this case, the same effects as those of the above-described embodiment can be obtained.

  The present invention can be used in industries that perform soldering in production facilities.

DESCRIPTION OF SYMBOLS 1 ... Soldering apparatus 2, 2a ... Yarn solder 2b ... Solder piece 6 ... Proximity / separation direction moving unit 17 ... Yarn solder delivery mechanism part 19 ... Rotating mechanism part 35 ... Energizing body 36 ... Shutter 38a ... Release hole 40 ... Yarn solder Cutting mechanism 44 ... Solder piece storage body 45 ... Solder piece storage part 49 ... Shutter operation part 51 ... Heater 60 ... Nozzle 63 ... Solder piece guide passage R ... Land T ... Terminal

Claims (6)

A soldering apparatus for soldering a first conductor and a second conductor with molten solder,
A nozzle having a solder piece supply passage through which the solder piece passes;
Relative distance changing means for changing the relative distance between the first conductor and the nozzle in the approaching / separating direction to bring the first conductor and the nozzle into proximity or contact with each other;
Heating means for heating and melting the solder pieces in the solder piece supply passage of the nozzle,
The nozzle is
A plurality of straight solder piece supply passages are formed in parallel,
Between the thread solder feeding means and the nozzle,
A solder piece storage body having a plurality of solder piece storage portions for storing the solder pieces;
A switching means for switching between a stop state for stopping the solder pieces stored in the solder piece storage portion so as not to move to the nozzle side and a release state for allowing movement;
The soldering apparatus which is the structure which switches the said switching means from the said stop state to the said releasing state in the position where the said solder piece accommodating part of the said solder piece accommodating body respond | corresponds to the said solder piece supply channel | path of the said nozzle. The switching means is a shutter provided with a plurality of through holes or through grooves corresponding to positions of the plurality of solder piece storage portions of the solder piece storage body, and a portion adjacent to the through holes or the through grooves is provided. The soldering apparatus according to claim 1, wherein the soldering device functions as a closing portion that closes the plurality of solder piece storage portions of the solder piece storage body. An arrangement interval of the plurality of solder piece supply passages of the nozzle;
An arrangement interval of the plurality of solder piece storage portions of the solder piece storage body,
The arrangement interval of the plurality of through holes or through grooves of the shutter is
3. The soldering apparatus according to claim 2, wherein all of the soldering apparatuses are formed at the same arrangement interval. Solder piece container moving means for moving the solder piece container in the thickness direction of the supplied solder piece;
Biasing means for biasing the shutter against the solder piece housing in the same direction as the moving direction of the solder piece housing by the solder piece housing moving means;
A shutter movement restricting body for restricting movement of the shutter and changing a relative positional relationship between the solder piece containing body and the shutter when the solder piece containing body is moved together with the shutter by the solder piece containing body moving means; The soldering apparatus of Claim 2 or 3 provided with these. Thread solder feeding means for feeding the thread solder from the tip;
A guide body that guides the leading end of the drawn-out thread solder to be stored in the solder piece storage portion of the solder piece storage body,
Arranging the guide body and the solder piece storage body in contact with or in close proximity to each other;
Relative movement means for cutting the yarn solder to create a solder piece accommodated in the solder piece accommodating portion by relatively moving the solder piece accommodation and the guide body in the width direction of the yarn solder. The soldering apparatus according to any one of claims 1 to 4. A soldering method for soldering with the soldering apparatus according to any one of claims 1 to 5,
The solder pieces are sequentially stored one by one in the plurality of solder piece storage portions of the solder piece storage body,
After the solder pieces are stored in all the solder piece storage portions, the switching means is switched from the stopped state to the released state,
A soldering method for supplying a plurality of solder pieces to the plurality of solder piece supply passages of the nozzle one by one in correspondence with each other.

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