JP2018019029A - Solder treatment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solder treatment device which allows for more reliable heat melting of a solder piece by using the heat of iron tip, and reliable supply of molten solder to the soldering surface.SOLUTION: A solder treatment device includes a substantially cylindrical iron tip that is elongating vertically and heatable, and a solder receiving part for bringing a solder piece, supplied from a solder hole provided in the iron tip, into contact with the inside wall of the iron tip. Passage area of the iron tip at the solder receiving part is made larger than the cross-sectional area of the molten solder piece, so that the solder piece is fused quickly, and molten solder can be supplied reliably to the soldering surface.SELECTED DRAWING: Figure 4

Description

 The present invention relates to a solder processing apparatus that heats and melts solder pieces.

 In recent years, electronic circuits on which electronic components are mounted are mounted on various devices. In the formation process of the electronic circuit, soldering using a soldering iron is performed for the process of joining the lead wire to the wiring pattern (land) on the substrate. In addition, in order to mechanically realize the soldering process, a solder processing apparatus having a hook portion is used.

 For example, such a solder processing apparatus melts downward by supplying solder pieces (cut from thread solder) into a heated tip and heating and melting the solder pieces using the heat of the tip. It is configured to supply solder. Thereby, the soldering process with respect to the board | substrate arrange | positioned below is realizable.

International Publication No. 2008/023461

 When the solder piece is heated and melted using the heat of the tip as described above, it is important to make sure that the solder piece is in contact with the inner wall of the tip in order to reliably transfer the heat of the tip to the solder piece. However, for example, if a solder piece supplied from above into the tip of a solder stands straight on a substrate or terminal disposed below, the solder piece may not come into contact with the inner wall of the tip.

 In such a case, heat transfer from the tip to the solder piece is hindered, and the solder piece may not be melted properly. In view of the above-described problems, an object of the present invention is to provide a solder processing apparatus that can heat and melt a solder piece more reliably using the heat of the tip.

 The solder processing apparatus according to the present invention is a solder receiving device in which a substantially cylindrical tip that can be heated up and down and a solder piece supplied from a solder hole provided in the tip contact the inner wall of the tip. And the solder passage is larger than the cross-sectional area of the solder piece when melted, the solder is brought into contact with the inner wall to improve heat transfer, and the molten solder is applied to the soldering surface. To supply.

 In addition, the solder processing apparatus according to the present invention brings a substantially cylindrical shape of the tip that can be heated up and down, and a solder piece supplied from a solder hole provided in the tip of the tip into contact with the inner wall of the tip. Providing a solder receiving part with a passage enlargement part with a larger area than the solder hole in the solder receiving part, bringing the solder into contact with the inner wall to improve heat transfer and supplying the molten solder to the soldering surface It is.

Specifically, as the above configuration, the passage expanding portion expands the substantially cylindrical shape concentrically and drops the solder downward.
Further, the passage expanding portion is formed obliquely with respect to the substantially cylindrical axial direction.
Moreover, specifically as said structure, a channel | path expansion part is eccentrically provided with respect to the substantially cylindrical centerline.

 According to the solder processing apparatus of the present invention, not only can the solder pieces be heated and melted faster using the heat of the iron tip, but also reliably supplied to the soldering surface.

It is a perspective view of the soldering apparatus concerning the Example of this invention. It is sectional drawing cut | disconnected by the II-II line | wire of the soldering apparatus shown in FIG. FIG. 2 is an exploded perspective view of a part of a drive mechanism provided in the soldering apparatus shown in FIG. 1. It is sectional drawing which shows the structure of Example 1 of this invention, (a) is before melting of a solder piece, (b) is at the time of fusion, (c) shows the state at the time of soldering. It is the sectional view on the AA line of FIG. It is explanatory drawing which shows the state of the solder melting when the solder piece size in a solder processing apparatus which has a solder receiving part is small, (a) is before melting of a solder piece, (b) is at the time of melting, (c) is The state at the time of soldering is shown. It is explanatory drawing which shows the state of the solder melting when the size of the solder piece in the solder processing apparatus which has a solder receiving part is large, (a) shows the state at the time of melting before solder piece. It is sectional drawing which shows the structure of Example 2 of this invention, (a) is before melting of a solder piece, (b) shows the state at the time of melting. It is sectional drawing which shows the structure of Example 3 of this invention, (a) is before the melting of a solder piece, (b) shows the state at the time of melting. It is sectional drawing which shows the structure of Example 4 of this invention, (a) is before melting of a solder piece, (b) shows the state at the time of solder melting. It is sectional drawing which shows the structure of Example 5 of this invention, and shows the state at the time of the melting of a solder piece. It is sectional drawing which shows the structure of Example 6 of this invention, and shows the state before melting of a solder piece. It is sectional drawing which shows the structure of Example 7 of this invention, (a) is before melting of a solder piece, (b) is the BB sectional drawing of (a), (c) is the state at the time of solder melting. Show.

 Embodiments of the present invention will be described below from Example 1 with reference to the drawings. The contents of the present invention are not limited to these embodiments.

 1 is a perspective view of a soldering apparatus (one form of a solder processing apparatus) according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along the line II-II of the soldering apparatus A shown in FIG. FIG. 3 is an exploded perspective view of a part of the drive mechanism provided in the soldering apparatus A shown in FIG. In FIG. 1, a part of the housing and the support portion 1 is cut to display the inside of the soldering apparatus A.

 As shown in FIG. 1, the soldering apparatus A supplies the wire solder W from above, and uses the rivet 5 provided at the lower part to provide a wiring board Bd disposed below the rivet 5 and an electronic component. This is a device for soldering Ep. The thread solder W has a structure in which a flux layer is provided inside a tubular solder layer. Accordingly, the solder piece generated by cutting the thread solder W similarly has a structure in which a flux layer is provided inside the tubular solder layer. The soldering apparatus A includes a support unit 1, a cutter unit 2, a drive mechanism 3, a heater unit 4, a tip 5, and a solder feed mechanism 6. A combination of the heater unit 4 and the tip 5 constitutes a soldering iron part.

 The support portion 1 includes a flat plate-like wall body 11 that is erected. In the following description, for convenience, as shown in FIG. 1, the horizontal direction along the wall body 11 is the X direction, the horizontal direction perpendicular to the wall body 11 is the Y direction, and the vertical direction along the wall body 11 is the Z direction ( (Vertical direction). For example, as shown in FIG. 1, the wall 11 has a ZX plane.

 The soldering apparatus A supplies the molten solder to the wiring board Bd attached to the jig Gj and the terminal P of the electronic component Ep arranged on the wiring board Bd, and performs connection fixing. When soldering, the jig Gj is moved in the X direction and the Y direction to position the wiring board Bd with the land Ld. Further, the soldering apparatus A is movable in the Z direction, and the tip of the hook 5 can be brought into contact with the land Ld by moving in the Z direction after positioning.

 The support portion 1 includes a holding portion 12 provided at a position shifted from a lower end portion of the wall body 11 in the Z direction, and a sliding guide 13 fixed to the edge portion (lower portion) of the wall body 11 in the Z direction. And a heater unit fixing portion 14 provided at an end portion (lower end portion) of the wall body 11 in the Z direction.

 The cutter unit 2 is for cutting the thread solder W fed by the solder feeding mechanism 6 into solder pieces Wh (FIG. 2) having a predetermined length. The cutter unit 2 includes a cutter lower blade 22 (fixed blade portion) fixed to the sliding guide 13 and a cutter upper blade 21 (movable) disposed on the cutter lower blade 22 and slidable in the X direction. Blade part) and a pusher pin 23 (solder pressing part) that is provided on the cutter upper blade 21 and slides in a direction (Z direction) intersecting the sliding direction of the cutter upper blade 21. As shown in FIG. 1, the cutter upper blade 21 is restricted in movement in the Z direction by the sliding guide 13 and is slidable in the X direction.

 Here, the sliding guide 13 will be described in detail. The sliding guide 13 includes a pair of wall portions 131 and 131 that come into contact with both ends of the cutter lower blade 22 in the Y direction, and the pair of wall portions 131 include retaining portions 132 and 132 that protrude toward the other side. Yes. The stoppers 132, 132 have an opening at the top of the sliding guide 13 so that the tips do not contact each other. The retaining portions 132 and 132 regulate the movement of the cutter upper blade 21 in the Z direction.

 As shown in FIG. 2, the cutter upper blade 21 has an upper blade hole 211 that is a through hole into which the thread solder W fed by the solder feeding mechanism 6 is inserted, and a rod portion 231 of the pusher pin 23 inserted therein. The pin hole 212 which is a through-hole is provided. The lower edge of the upper blade hole 211 is formed in a cutting edge shape. The cutter lower blade 22 includes a lower blade hole 221 that is a through hole into which the thread solder W penetrating the upper blade hole 211 is inserted. The edge part of the upper end of the lower blade hole 221 is formed in a cutting blade shape. The upper blade hole 211 and the lower blade hole 221 are displaced in a direction intersecting with the thread solder W in a state where the thread solder W is inserted, whereby the thread solder W is cut by the mutual cutting blade.

 The pusher pin 23 is a solder pressing part, and pushes down the solder piece Wh cut by the cutter upper blade 21 and the cutter lower blade 22 and remaining in the lower blade hole 221. The pusher pin 23 includes a rod portion 231 slidably supported in the pin hole 212, a head portion 232 provided at an end portion of the rod portion 231, and wound around the rod portion 231, And a spring 233 disposed between the blade 21 and the blade 21. Further, the pusher pin 23 is provided with a stopper that prevents the rod portion 231 from coming out of the pin hole 212 at the end of the rod portion 231 opposite to the head portion 232. The pusher pin 23 is always lifted upward, that is, on the side opposite to the cutter lower blade 22 by the elastic force of the spring 233.

 As shown in FIGS. 1 and 2, the drive mechanism 3 passes through an air cylinder 31 held by the holding portion 12 and a through hole provided in the holding portion 12, and is driven to slide in the Z direction by the air cylinder 31. And a cylindrical guide shaft 35 that is supported by both the holding rod 12 and the cutter lower blade 22 and extends in the Z direction. The drive mechanism 3 includes a cam member 33 supported by the guide shaft 35 so as to be slidable in the Z direction, and a slider portion 34 having a cam groove 340 with which a later-described pin 332 provided on the cam member 33 is engaged. It has.

 The air cylinder 31 slides (stretches) the piston rod 32 with the pressure of air supplied from the outside, and the air cylinder 31 and the piston rod 32 constitute an actuator of the drive mechanism 3. The piston rod 32 is provided in parallel with the guide shaft 35 and reciprocates linearly along the guide shaft 35. The tip of the piston rod 32 is fixed to the cam member 33 and slides in the Z direction by the expansion and contraction of the piston rod 32. The sliding of the cam member 33 is guided by the guide shaft 35.

 As shown in FIG. 2, the guide shaft 35 has a lower end fitted in a recessed hole provided in the cutter lower blade 22, and is fixed to the cutter lower blade 22 with a screw 351. Further, the upper portion of the guide shaft 35 passes through a hole provided in the holding portion 12, and movement is restricted by the pin 352. In other words, the guide shaft 35 is fixed to the cutter lower blade 22 by the screw 351 and the holding portion 12 by the pin 352.

 As shown in FIGS. 2 and 3, the cam member 33 is a rectangular member, and is connected to the recess 330 having a part of the long side cut out in a rectangular shape and the cam member 33, and the guide shaft 35 passes therethrough. And a cylindrical support portion 331 having a through-hole. The slider part 34 is slidably disposed in the recess 330 (in the X direction and the Z direction). Further, the support portion 331 has a shape extending in a direction parallel to the pin 35, and is provided to prevent the cam member 33 from rattling. That is, when the cam member 33 has a certain thickness and is unlikely to generate rattling, the cylindrical portion may be omitted, and the support portion 331 may be configured only by the through hole.

 The cam member 33 is provided at an intermediate portion of the recess 330 and has a cylindrical pin 332 whose central axis is orthogonal to the guide shaft 35, a pin pressing portion 333 that presses the pusher pin 23 adjacent to the recess 330, and a support And a bearing 334 disposed inside the hole 331. The pin 332 is inserted into a cam groove 340 described later provided in the slider portion 34. Further, the bearing 334 is a member that is fitted on the guide shaft 35 and is slid smoothly so that the cam member 33 does not rattle.

 As shown in FIGS. 2 and 3, the slider portion 34 is a rectangular plate-like member, and is formed integrally with the cutter upper blade 21. The slider portion 34 includes a cam groove 340 that penetrates in the plate thickness direction and extends in the longitudinal direction. The cam groove 340 has a first groove part 341 extending in parallel with the guide shaft 35 on the upper side and a second groove part 342 extending in parallel with the guide shaft 35 on the lower side. The first groove portion 341 and the second groove portion 342 are provided so as to be shifted in the X direction, and the cam groove 340 includes a connection groove portion 343 that connects the first groove portion 341 and the second groove portion 342.

 A pin 332 of the cam member 33 is inserted into the cam groove 340, and the pin 332 slides on the inner surface of the cam groove 340 as the cam member 33 moves along the guide shaft 35. When the pin 332 is positioned in the connection groove 343 of the cam groove 340, the inner surface of the connection groove 343 is pushed. Thus, the slider part 34 and the cutter upper blade 21 formed integrally with the slider part 34 move in the direction (X direction) intersecting the sliding direction (Z direction) of the cam member 33 (with respect to the cutter lower blade 22). Slide).

 As shown in FIG. 2, the heater unit 4 is a heating device for heating and melting the solder piece Wh, and is fixed to the heater unit fixing portion 14 provided at the lower end portion of the wall body 22. The heater unit 4 includes a heater 41 that generates heat when electricity is passed, and a heater block 42 for attaching the heater 41. The heater 41 is wound around the outer peripheral surface of a cylindrical heater block 42.

 The heater block 42 has a cylindrical shape, a concave section 421 having a circular cross section for attaching the tip 5 to an end portion in the axial direction, and a solder supply hole 422 penetrating from the center of the bottom of the concave section 421 to the opposite side. And. The heater block 42 is provided in contact with the cutter lower blade 22 so that the solder supply hole 422 and the lower blade hole 221 communicate with each other. By providing the heater block 42 in this manner, the solder piece Wh moves from the lower blade hole 221 to the solder supply hole 422.

 The tip 5 is a cylindrical heatable member extending in the vertical direction, and has a solder hole 51 extending in the axial direction at the center. The tip 5 is inserted into the recess 421 of the heater block 42 and is prevented from coming off by a member not shown. Further, the solder hole 51 of the tip 5 communicates with the solder supply hole 421 of the heater block 42, and the solder piece Wh is sent from the solder supply hole 421.

 The tip 5 is transferred with heat from the heater 41 and melts the solder piece Wh with the heat. Therefore, the tip 5 is made of a material having high thermal conductivity, for example, a ceramic such as silicon carbide or aluminum nitride, or a metal such as tungsten. In the soldering apparatus A, the tip 5 has a cylindrical shape, but is not limited thereto, and a cylindrical shape having a polygonal cross section or an elliptical shape may be used. Different shapes may be prepared according to the shape of the wiring board Bd to be soldered and / or the terminal P of the electronic component Ep.

 As shown in FIGS. 1 and 2, the solder feeding mechanism 6 supplies thread solder W, a pair of feed rollers (61a, 61b) for feeding the thread solder W, and the thread solder W fed thereto by a cutter. And a guide tube 62 for guiding the upper blade 21 into the upper blade hole 211. The pair of feed rollers (61a, 61b) are attached to the support unit 1, sandwich the yarn solder W, and rotate to feed the yarn solder W downward. The guide tube 62 is a tube body that can be elastically deformed, and its upper end is disposed in the vicinity of a portion of the feed roller 61 where the thread solder W is fed out.

 The lower end of the guide tube 62 is provided so as to communicate with the upper blade hole 211 of the cutter upper blade 21. The lower end of the guide tube 62 moves following the sliding of the cutter upper blade 21, and the guide tube 62 is not pulled or pulled excessively within the range in which the cutter upper blade 21 slides. Is provided. Each feed roller (61a, 61b) determines the length of the thread solder fed out by the rotation angle (number of rotations).

 When soldering is performed by the soldering apparatus A, the tip of the tip 5 is brought into contact with the land Ld of the wiring board Bd to be soldered, and the land Ld and the terminal P of the electronic component Ep are surrounded by the tip 5. At this time, heat from the heater 41 is transmitted to the tip 5, and when the tip 5 comes into contact, the land Ld and the terminal P of the electronic component Ep are heated to a temperature suitable for soldering (preheating). )

 Next, the operation of the soldering apparatus A will be described. As shown in FIG. 2, the soldering apparatus A is in a state where the piston rod 32 is housed inside the air cylinder 31 immediately before performing soldering, and the cam member 33 is located in the upper part (sliding range) in the Z direction. At the top). At this time, the pin 332 is located in the first groove portion 341 of the cam groove 340, and the cutter upper blade 21 is at a position closest to the guide shaft 35. This position is the initial position. In the soldering apparatus A, the cutter upper blade 21 and the cutter lower blade 22 are formed so that the upper blade hole 211 overlaps the lower blade hole 221 in the Z direction when in the initial position.

 Then, the feed rollers (61a, 61b) are rotationally driven to feed the thread solder W out. Since the upper blade hole 211 and the lower blade hole 221 are in communication with each other, the tip of the thread solder W moves into the lower blade hole 221. The rotation angle of each feed roller (61a, 61b) is adjusted so that the length of the thread solder W entering the lower blade hole 221 becomes the length of the solder piece Wh. The length of the solder piece Wh is determined according to the size of the land Ld to be soldered and the terminal P of the electronic component Ep.

 Then, the piston rod 32 is protruded from the air cylinder 31 and the cam member 33 is moved downward along the guide shaft 35. Since the pin 332 is disposed in the cam groove 340, the pin 332 slides in the cam shaft 340. When the pin 332 is in the first groove 341, the first groove 341 coincides with the moving direction of the pin 332 (the axial direction of the guide shaft 35), so the slider 34 does not receive a force from the cam member 33, and the cam member 34 It is stationary. When the pin 332 reaches the connecting groove 343 from the first groove 341, the pin 332 presses the inner surface of the connecting groove 343. Thereby, a force in the X direction is applied to the slider portion 34, and the cutter upper blade 21 formed integrally with the slider portion 34 and the slider portion 34 moves (slids) in the X direction.

 When the cutter upper blade 21 slides, the upper blade hole 211 and the lower blade hole 221 are displaced in the X direction, and the cutting blade formed on the edge of the end of the upper blade hole 211 due to the displacement of these holes, Cutting edges formed at the edge of the end of the lower blade hole 221 intersect. As a result, the thread solder W is cut and a solder piece Wh is generated.

 When the piston rod 32 further protrudes, the cam member 33 moves further downward, and the pin 332 moves from the connection groove 343 to the second groove 342. Since the second groove portion 342 also extends parallel to the guide shaft 35, the pin 332 does not press the slider portion 34 even when the cam member 33 moves downward along the guide shaft 35. That is, the cam member 33 moves, but the cutter upper blade 21 and the slider portion 34 stop. The cutter upper blade 21 is located farthest from the guide shaft 35. When in this position, the cutter upper blade 21 and the cutter lower blade 22 are formed so that the pin hole 212 overlaps the lower blade hole 221 in the Z direction.

 When the piston rod 32 further protrudes, the cam member 33 slides downward, and the pin pushing portion 333 of the cam member 33 pushes the head portion 232 of the pusher pin 23. Thereby, the rod portion 231 of the pusher pin 23 is inserted into the lower blade hole 221. At this time, the solder piece Wh remaining in the lower blade hole 221 is pushed by the rod portion 231 and moves toward the tip 5. Although the solder piece Wh may move downward due to its own weight during cutting, the solder piece Wh can be reliably supplied to the solder hole 51 of the tip 5 by using the pusher pin 23.

 FIG. 4 shows how the solder piece Wh is supplied into the tip 5. As shown in this figure, the solder hole 51 has a passage enlarged portion 51a at the lower portion, and a receiving portion 5a is provided so as to protrude from the passage enlarged portion 51a. The receiving portion 5a is formed so that a part of the passage of the passage expanding portion 51a is narrowed to hold the solder piece 51a, that is, the inner wall of the tip 5 protrudes inward. Since the receiving portion 5 a narrows the passage of the passage expanding portion 51 a as shown in FIG. 5, the passage area of this portion is considerably larger than the solder hole 51. In addition, the receiving part 5a is located above the terminal P front-end | tip of the electronic component Ep, and does not contact the terminal P before the solder piece Wh fuse | melts.

  As shown in FIG. 4A, the solder piece Wh that has fallen from above the tip 5 is caught by the receiving portion 5a before it reaches the terminal P of the electronic component Ep, and is held in an upright state. The inner diameter of the tip 5 above the passage enlarged portion 51a of the solder hole 51 is set to a size that is slightly larger than the outer diameter of the solder piece Wh. Therefore, even if the solder piece Wh is tilted in the tip 5, the solder piece Wh is always supported in the tip 5 because it is supported by the inner wall of the tip 5.

 Further, at least a part of the solder piece Wh supplied into the tip 5 is always in contact with the inner wall of the tip 5 (including the receiving portion 5a). If the receiving part 5a is not provided, the solder piece Wh stands straight on the terminal P of the electronic component Ep, and the solder piece Wh does not contact any part of the inner wall of the tip 5. obtain. Accordingly, the receiving portion 5a avoids non-contact between the supplied solder piece Wh and the inner wall of the tip 5 (in other words, forcibly contacts the supplied solder piece Wh with the inner wall of the tip 5). It can be said that it has a role.

 Heat from the heater 41 is transmitted to the tip 5, and the solder piece Wh is heated by this heat. At this time, the solder piece Wh is held on the receiving portion 5a, and the solder piece Wh and the inner wall of the tip 5 are always in contact with each other, so that the solder piece Wh and the inner wall of the tip 5 are not in contact with each other. Compared with the case where it exists, it is possible to transmit the heat | fever of the tip 5 more reliably to the solder piece Wh.

 Further, since the solder piece Wh is received by the receiving portion 5a, the solder piece Wh does not come into contact with the terminal P of the electronic component Ep. Further, when the solder piece Wh is heated to some extent, the flux flows out from the inside of the solder piece Wh, and if this flux is interposed between the solder piece Wh and the inner wall of the tip 5, both contact properties are further improved. . For each of the reasons described above, in this embodiment, the solder piece Wh is efficiently heated, and a problem that the heating and melting of the solder piece Wh is insufficient is prevented as much as possible.

 The solder piece Wh melted on the receiving portion 5a becomes spherical due to surface tension as shown in FIG. 4B, but its size is smaller than the space formed by the passage expanding portion 51a and the receiving portion 5a. The solder piece Wh falls downward as shown in FIG. Since the tip 5 surrounds the land Ld of the wiring board Bd and the terminal P of the electronic component Ep, the molten solder flows to the land Ld below and the terminal P of the electronic component Ep. And the tip 5 leaves | separates from the land Ld by moving the soldering apparatus A to a Z direction. Thus, the solder is cooled and solidified by the outside air, and the land Ld and the terminal P of the electronic component Ep are soldered.

 When the soldering is completed, the air cylinder 31 accommodates the piston rod 32 inside. As a result, the cam member 33 moves upward in the Z direction, and the pusher pin 23 is pushed upward by the elastic force of the spring 233. The rod portion 231 comes out from the lower blade hole 221. Even if the cutter upper blade 21 slides in this state, the pusher pin 23 is not damaged. Then, the pin 332 of the cam member 33 reaches the connection groove portion 343 of the cam groove 340, and the slider portion 34 and the cutter upper blade 21 slide so as to approach the guide shaft 35. When the pin 332 reaches the first groove 341 of the cam groove 340, the soldering apparatus A returns to the initial position.

The behavior of the molten solder in the solder hole 51 in the case where the above-described passage enlarged portion 51a is not provided will be described. FIG. 6A shows a molten state when the receiving portion 5a is provided in the solder hole 51 having no passage enlarged portion 51a and slightly larger than the solder outer diameter, and a small amount of solder pieces Wh1 is supplied. As shown in b), the solder piece Wh1 melts at the receiving portion 5a and becomes substantially spherical due to its surface tension. Since the solder piece Wh1 is small, it can fall downward from the gap of the receiving portion 5a, and the melted solder as shown in FIG. 6C is the land Ld and the terminals of the electronic component Ep below. Flows to P.
FIG. 7 (a) shows a state when a large amount of solder pieces Wh2 are supplied. As shown in FIG. 7 (b), the molten solder has a large volume and surface tension acts to receive the solder. It stays in the solder hole 51 at the portion 5a and cannot flow out to the wiring board Bd, and soldering cannot be performed.

  The case where the passage expanding part 51a is provided in the vicinity of the receiving part 5a of the present invention will be described. As shown in FIG. 4B, the molten solder is deformed in a spherical shape by the solder hole 51 and the passage enlarged portion 51a, but the passage sectional area of the passage enlarged portion 51a is more than the maximum sectional area of the molten solder. Since it is large, the solder falls by gravity and soldering is performed as shown in FIG. In order to facilitate the dropping of the solder, the receiving portion 5a is preferably a thin plate.

 FIG. 8 is a configuration diagram showing a second embodiment of the present invention. The difference from FIG. 4 is that the passage enlarged portion 51 b is configured obliquely with respect to the central axis of the solder hole 51. By cutting diagonally, the opening 51ba of the passage enlarged portion 51b becomes elliptical as shown in FIG. 8A, and the cross-sectional area increases, and the molten solder falls as shown in FIG. 7B. Can be easily.

 FIG. 9 is a block diagram showing a third embodiment of the present invention. The difference from FIG. 4 is that the center of the hole of the passage expanding portion 51 c is decentered from the center of the solder hole 51. As shown in FIG. 9 (a), the passage enlargement portion 51c is made larger than the solder hole 51, and the center of the solder hole 51 and the center of the passage enlargement portion 51c are made eccentric by an eccentric amount e. The solder piece Wh can be disposed using the stepped portion 51ca formed by the step as a receiving portion. As shown in FIG. 9B, the molten solder flows out from the biased opening 51cb.

 FIG. 10 shows a fourth embodiment of the present invention, which is different from FIG. 4 in that the passage expanding portion 51d and the receiving portion 5a are arranged close to the terminal P. FIG. As shown in FIG. 10 (a), when the passage enlargement 51d is moved downward and provided close to the terminal P, it contacts the terminal P when the solder piece Wh melts as shown in FIG. 10 (b). However, since it flows along the terminal P with good solder wettability, even when the amount of solder is very large, the molten solder does not remain in the passage enlarged portion 51d, and all the molten solder flows out easily.

 FIG. 11 shows a fifth embodiment of the present invention. The difference from FIG. 4 is that a throttle body 52 having a hole having a smaller inner diameter than the passage expanding portion 51e is provided at the lower end portion of the passage expanding portion 51e. is there. Since the flow of the melted solder Wh is narrowed by the throttle body 52 when flowing out to the terminal P or the land Ld, the solder Wh is not diffused by the Bp on the circuit board, and soldering can be performed by narrowing the soldering point.

 FIG. 12 shows a sixth embodiment of the present invention, in which the receiving portion 5b is arranged obliquely. The receiving part 5b arranged obliquely has an advantage that the molten solder can easily flow and a part of the molten solder does not remain on the receiving part 5b when the molten solder flows out.

 FIG. 13 shows a seventh embodiment of the present invention. The difference from FIG. 4 is that a plurality of receiving portions 5c are arranged in the solder holes 51 larger than the diameter of the solder pieces. FIG. 13A shows a state before the solder piece Wh is melted, and FIG. 13B shows a cross section taken along the line BB of FIG. 13A. A part of the passage of the solder hole 51 is narrowed by the two bar-shaped receiving portions 5c provided in the solder hole 51 to hold the solder piece Wh. FIG. 13C shows a state when the solder piece Wh is melted, and the molten solder falls downward from the gap 51f shown in FIG. 13B. Since the solder hole 51 can be configured with the same inner diameter size above and below the receiving portion 5c, the solder hole 51 can be easily processed. Even if the size of the solder piece Wh is changed, the length of the bar-shaped receiving part 5c may be adjusted, so that the parts can be shared. If three or more receiving portions 5f are provided, the solder piece Wh can be stably held, and the contact area between the solder piece Wh and the receiving portion can be increased, and also from the viewpoint of heat transfer. preferable.

As mentioned above, although embodiment of this invention was described, this invention is not limited to this content. The embodiments of the present invention can be variously modified without departing from the spirit of the invention.

A Soldering equipment (solder processing equipment)
5 Tip 5a Solder receiving part 51 Solder hole 51a, 51b, 51c, 51d, 51e Passage enlarged part Wh Solder piece

Claims (5)

  A substantially cylindrical tip that can be heated up and down, a solder hole provided in the tip, and a solder receiving portion for bringing a solder piece supplied from the solder hole into contact with the inner wall of the tip And a solder processing apparatus, wherein a passage area of the tip of the solder receiving portion is larger than a cross-sectional area when the solder piece is melted.   A substantially cylindrical tip that can be heated up and down, a solder hole provided in the tip, and a solder receiving portion for bringing a solder piece supplied from the solder hole into contact with the inner wall of the tip A solder processing apparatus, characterized in that a passage enlargement portion having a passage area larger than the solder hole is provided in the solder receiving portion.   The solder processing apparatus according to claim 2, wherein the passage enlarging portion expands the substantially cylindrical shape concentrically.   The solder processing apparatus according to claim 2, wherein the passage expanding portion is formed obliquely with respect to the substantially cylindrical axial direction.   The solder processing apparatus according to claim 2, wherein the passage expanding portion is provided eccentrically with respect to the substantially cylindrical center line.

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