JP3207595U - Soldering equipment - Google Patents

Abstract

Provided is a solder processing apparatus capable of more reliably heating and melting a solder piece by using the heat of the iron tip and performing soldering in a narrow place. SOLUTION: A substantially cylindrical tip 5 that can be heated up and down, a first solder hole 51a provided in the tip 5, and a solder piece Wh supplied from above the first solder hole 51a are provided. A reduction portion 51b that is a solder receiving portion that is brought into contact with the inner wall of the tip 5 and a second solder hole 52a that is bent from the first solder hole 51a and supplies solder to the soldering portion, and the direction of the tip 5 is provided. By changing, it is not affected by nearby parts, and soldering is performed in a narrow place. [Selection] Figure 2

Description

 The present invention relates to a solder processing apparatus for heating and melting a solder piece.

  In recent years, electronic circuits on which electronic components are mounted are mounted on various devices. In the formation process of the electronic circuit, soldering using a soldering iron is performed for the process of joining the lead wire to the wiring pattern (land) on the substrate. In addition, in order to mechanically realize the soldering process, a solder processing apparatus having a hook portion is used.

  For example, such a solder processing apparatus melts downward by supplying solder pieces (cut from thread solder) into a heated tip and heating and melting the solder pieces using the heat of the tip. It is configured to supply solder. Thereby, the soldering process with respect to the board | substrate arrange | positioned below is realizable.

International Publication No. 2008/023461

  When soldering is performed by heating and melting the solder piece using the heat of the tip as described above, if a large electrical component is disposed in the vicinity of the soldering portion, a heater or soldering process for heating the tip It is difficult to perform soldering in a narrow place due to the contact of the drive unit that performs

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a solder processing apparatus that can perform soldering in the vicinity of adjacent components by appropriately forming the shape of the tip.

The solder processing apparatus according to the present invention includes a substantially cylindrical tip that can be heated up and down, a first solder hole provided in the tip, and a solder piece supplied from above the first solder hole. A solder receiving portion that contacts the inner wall of the tip and a second solder hole that bends from the first solder hole and supplies the solder to the soldering portion, and after the solder piece is reliably melted by the solder receiving portion Solder melted by the bent second solder hole is supplied to the soldering portion.
The solder processing apparatus of the present invention also has a substantially cylindrical tip that can be heated up and down, a first solder hole provided in the tip, a bend from the first solder hole, and solder to the soldering portion. And a third solder hole bent again from the second solder hole and parallel to the first solder hole, and the solder piece supplied from the upper part of the first solder hole is connected to the inner wall of the tip A solder receiving portion to be brought into contact with is provided in the first solder hole or the third solder hole, and the solder piece is reliably melted by the solder receiving portion and then supplied to the soldering portion.

  According to the solder processing apparatus of the present invention, the solder piece is heated and melted faster by using the heat of the iron tip and the melted solder is supplied by the bent solder hole, so that it is adjacent to the component. Soldering can be performed in the soldering part without contacting the component.

It is a perspective view of the solder processing apparatus concerning Example 1 of this invention. It is sectional drawing cut | disconnected by the II-II line | wire of the soldering apparatus shown in FIG. FIG. 2 is an exploded perspective view of a part of a drive mechanism provided in the soldering apparatus shown in FIG. 1. It is sectional drawing which shows the soldering process of Example 1 of this invention, (a) before soldering, (b) at the time of solder piece supply, (c) at the time of the fusion | melting in the 1st solder hole of a solder piece, (D) shows a state when the solder piece is melted in the second solder hole, (e) shows a state when the third solder hole is melted, and (f) shows a state when the solder piece flows out to the wiring board. It is sectional drawing of the tip in Example 2 of this invention. It is sectional drawing of the tip in Example 3 of this invention. It is sectional drawing of the tip in Example 4 of this invention. It is sectional drawing of the solder processing apparatus in Example 5 of this invention. It is sectional drawing of the solder processing apparatus in Example 6 of this invention.

  Embodiments of the present invention will be described below from Example 1 with reference to the drawings. The contents of the present invention are not limited to these embodiments.

  FIG. 1 is a perspective view of a soldering apparatus (one form of a solder processing apparatus) according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line II-II of the soldering apparatus A shown in FIG. FIG. 3 is an exploded perspective view of a part of the drive mechanism provided in the soldering apparatus A shown in FIG. In FIG. 1, a part of the housing and the support portion 1 is cut to display the inside of the soldering apparatus A.

  As shown in FIG. 1, the soldering apparatus A supplies the wire solder W from above, and uses the rivet 5 provided at the lower part to provide a wiring board Bd disposed below the rivet 5 and an electronic component. This is a device for soldering Ep. The thread solder W has a structure in which a flux layer is provided inside a tubular solder layer. Accordingly, the solder piece generated by cutting the thread solder W similarly has a structure in which a flux layer is provided inside the tubular solder layer. The soldering apparatus A includes a support unit 1, a cutter unit 2, a drive mechanism 3, a heater unit 4, a tip 5, and a solder feed mechanism 6. A combination of the heater unit 4 and the tip 5 constitutes a soldering iron part.

  The support portion 1 includes a flat plate-like wall body 11 that is erected. In the following description, for convenience, as shown in FIG. 1, the horizontal direction along the wall body 11 is the X direction, the horizontal direction perpendicular to the wall body 11 is the Y direction, and the vertical direction along the wall body 11 is the Z direction ( Vertical direction). For example, as shown in FIG. 1, the wall 11 has a ZX plane.

The soldering apparatus A supplies the molten solder to the wiring board Bd attached to the jig Gj and the terminal P of the electronic component Ep arranged on the wiring board Bd, and performs connection fixing. When soldering, the jig Gj is moved in the X direction and the Y direction to position the wiring board Bd with the land Ld. Further, the soldering apparatus A is movable in the Z direction, and the tip of the hook 5 can be brought into contact with the land Ld by moving in the Z direction after positioning.
The support portion 1 includes a holding portion 12 provided at a position shifted from a lower end portion of the wall body 11 in the Z direction, and a sliding guide 13 fixed to the edge portion (lower portion) of the wall body 11 in the Z direction. And a heater unit fixing portion 14 provided at an end portion (lower end portion) of the wall body 11 in the Z direction.

The cutter unit 2 is for cutting the thread solder W fed by the solder feeding mechanism 6 into solder pieces Wh (FIG. 2) having a predetermined length. The cutter unit 2 includes a cutter lower blade 22 (fixed blade portion) fixed to the sliding guide 13 and a cutter upper blade 21 (movable) disposed on the cutter lower blade 22 and slidable in the X direction. Blade part) and a pusher pin 23 (solder pressing part) that is provided on the cutter upper blade 21 and slides in a direction (Z direction) intersecting the sliding direction of the cutter upper blade 21. As shown in FIG. 1, the cutter upper blade 21 is restricted in movement in the Z direction by the sliding guide 13 and is slidable in the X direction.
Here, the sliding guide 13 will be described in detail. The sliding guide 13 includes a pair of wall portions 131 and 131 that come into contact with both ends of the cutter lower blade 22 in the Y direction, and the pair of wall portions 131 include retaining portions 132 and 132 that protrude toward the other side. Yes. The stoppers 132, 132 have an opening at the top of the sliding guide 13 so that the tips do not contact each other. The retaining portions 132 and 132 regulate the movement of the cutter upper blade 21 in the Z direction.

As shown in FIG. 2, the cutter upper blade 21 has an upper blade hole 211 that is a through hole into which the thread solder W fed by the solder feeding mechanism 6 is inserted, and a rod portion 231 of the pusher pin 23 inserted therein. The pin hole 212 which is a through-hole is provided. The lower edge of the upper blade hole 211 is formed in a cutting edge shape. The cutter lower blade 22 includes a lower blade hole 221 that is a through hole into which the thread solder W penetrating the upper blade hole 211 is inserted. The edge part of the upper end of the lower blade hole 221 is formed in a cutting blade shape. The upper blade hole 211 and the lower blade hole 221 are displaced in a direction intersecting with the thread solder W in a state where the thread solder W is inserted, whereby the thread solder W is cut by the mutual cutting blade.
The pusher pin 23 is a solder pressing part, and pushes down the solder piece Wh cut by the cutter upper blade 21 and the cutter lower blade 22 and remaining in the lower blade hole 221. The pusher pin 23 includes a rod portion 231 slidably supported in the pin hole 212, a head portion 232 provided at an end portion of the rod portion 231, and wound around the rod portion 231, And a spring 233 disposed between the blade 21 and the blade 21. Further, the pusher pin 23 is provided with a stopper that prevents the rod portion 231 from coming out of the pin hole 212 at the end of the rod portion 231 opposite to the head portion 232. The pusher pin 23 is always lifted upward, that is, on the side opposite to the cutter lower blade 22 by the elastic force of the spring 233.
The cutter lower blade 22 is provided with a gas supply hole 222 for supplying an inert gas from the outside in communication with the lower blade hole 221, and the inert gas is supplied from the first solder hole 51 to the third solder hole 53. To do.

  As shown in FIGS. 1 and 2, the drive mechanism 3 passes through an air cylinder 31 held by the holding portion 12 and a through hole provided in the holding portion 12, and is driven to slide in the Z direction by the air cylinder 31. And a cylindrical guide shaft 35 that is supported by both the holding rod 12 and the cutter lower blade 22 and extends in the Z direction. The drive mechanism 3 includes a cam member 33 supported by the guide shaft 35 so as to be slidable in the Z direction, and a slider portion 34 having a cam groove 340 with which a later-described pin 332 provided on the cam member 33 is engaged. It has.

The air cylinder 31 slides (stretches) the piston rod 32 with the pressure of air supplied from the outside, and the air cylinder 31 and the piston rod 32 constitute an actuator of the drive mechanism 3. The piston rod 32 is provided in parallel with the guide shaft 35 and reciprocates linearly along the guide shaft 35. The tip of the piston rod 32 is fixed to the cam member 33 and slides in the Z direction by the expansion and contraction of the piston rod 32. The sliding of the cam member 33 is guided by the guide shaft 35.
As shown in FIG. 2, the guide shaft 35 has a lower end fitted in a recessed hole provided in the cutter lower blade 22, and is fixed to the cutter lower blade 22 with a screw 351. Further, the upper portion of the guide shaft 35 passes through a hole provided in the holding portion 12, and movement is restricted by the pin 352. In other words, the guide shaft 35 is fixed to the cutter lower blade 22 by the screw 351 and the holding portion 12 by the pin 352.

As shown in FIGS. 2 and 3, the cam member 33 is a rectangular member, and is connected to the recess 330 having a part of the long side cut out in a rectangular shape and the cam member 33, and the guide shaft 35 passes therethrough. And a cylindrical support portion 331 having a through-hole. The slider part 34 is slidably disposed in the recess 330 (in the X direction and the Z direction). Further, the support portion 331 has a shape extending in a direction parallel to the pin 35, and is provided to prevent the cam member 33 from rattling. That is, when the cam member 33 has a certain thickness and is unlikely to generate rattling, the cylindrical portion may be omitted, and the support portion 331 may be configured only by the through hole.
The cam member 33 is provided at an intermediate portion of the recess 330 and has a cylindrical pin 332 whose central axis is orthogonal to the guide shaft 35, a pin pressing portion 333 that presses the pusher pin 23 adjacent to the recess 330, and a support And a bearing 334 disposed inside the hole 331. The pin 332 is inserted into a cam groove 340 described later provided in the slider portion 34. Further, the bearing 334 is a member that is fitted on the guide shaft 35 and is slid smoothly so that the cam member 33 does not rattle.

As shown in FIGS. 2 and 3, the slider portion 34 is a rectangular plate-like member, and is formed integrally with the cutter upper blade 21. The slider portion 34 includes a cam groove 340 that penetrates in the plate thickness direction and extends in the longitudinal direction. The cam groove 340 has a first groove part 341 extending in parallel with the guide shaft 35 on the upper side and a second groove part 342 extending in parallel with the guide shaft 35 on the lower side. The first groove portion 341 and the second groove portion 342 are provided so as to be shifted in the X direction, and the cam groove 340 includes a connection groove portion 343 that connects the first groove portion 341 and the second groove portion 342.
A pin 332 of the cam member 33 is inserted into the cam groove 340, and the pin 332 slides on the inner surface of the cam groove 340 as the cam member 33 moves along the guide shaft 35. When the pin 332 is positioned in the connection groove 343 of the cam groove 340, the inner surface of the connection groove 343 is pushed. Thus, the slider part 34 and the cutter upper blade 21 formed integrally with the slider part 34 move in the direction (X direction) intersecting the sliding direction (Z direction) of the cam member 33 (with respect to the cutter lower blade 22). Slide).

As shown in FIG. 2, the heater unit 4 is a heating device for heating and melting the solder piece Wh, and is fixed to the heater unit fixing portion 14 provided at the lower end portion of the wall body 22. The heater unit 4 includes a heater 41 that generates heat when electricity is passed, and a heater block 42 for attaching the heater 41. The heater 41 is wound around the outer peripheral surface of a cylindrical heater block 42.
The heater block 42 has a cylindrical shape, a concave section 421 having a circular cross section for attaching the tip 5 to an end portion in the axial direction, and a solder supply hole 422 penetrating from the center of the bottom of the concave section 421 to the opposite side. And. The heater block 42 is provided in contact with the cutter lower blade 22 so that the solder supply hole 422 and the lower blade hole 221 communicate with each other. By providing the heater block 42 in this manner, the solder piece Wh moves from the lower blade hole 221 to the solder supply hole 422.

The tip 5 is a cylindrical heatable member extending in the up-down direction of the tip, and includes a first tip 51, a second tip 52, and a third tip 53. Each hook has a first solder hole 51a, a second solder hole 52a, and a third solder hole 53a extending in the axial direction at the center. The first tip 51 is inserted into the recess 421 of the heater block 42, and is prevented from coming off by a member not shown. Further, the first solder hole 51 a of the first tip 51 communicates with the solder supply hole 421 of the heater block 42, and the solder piece Wh is sent from the solder supply hole 421. The first solder hole 51a has a reduced portion 51b which is a solder receiving portion having a passage area smaller than that of the solder piece Wh, and the dropped solder piece Wh is contacted and received by the reduced portion 51b.
The second tip 52 is attached obliquely to the first tip 51 arranged in the vertical direction, and the second solder hole 52a is bent from the first solder hole 51a. Further, the second tip 52 is provided with a first release hole 52b, and releases fumes of flux generated in the second solder hole 52a. A third tip 53 is further connected to the second tip 52, and a third inner hole 53a is connected to the third tip 53 in the vertical direction, and contacts the wiring board Bd during soldering. Supply molten solder.

  The tip 5 is transferred with heat from the heater 41 and melts the solder piece Wh with the heat. Therefore, the tip 5 is made of a material having high thermal conductivity, for example, a ceramic such as silicon carbide or aluminum nitride, or a metal such as tungsten. In the soldering apparatus A, the tip 5 has a cylindrical shape, but is not limited thereto, and a cylindrical shape having a polygonal cross section or an elliptical shape may be used. Different shapes may be prepared according to the shape of the wiring board Bd to be soldered and / or the terminal P of the electronic component Ep.

As shown in FIGS. 1 and 2, the solder feeding mechanism 6 supplies the thread solder W, a pair of feed rollers 61 that feeds the thread solder W, and the thread solder W that has been fed to the cutter upper blade 21. And a guide tube 62 for guiding the upper blade hole 211. The feed roller is attached to the support portion 1, sandwiches the thread solder W, and feeds the thread solder W downward by rotating. The guide tube 62 is a tube body that can be elastically deformed, and its upper end is disposed in the vicinity of a portion of the feed roller 61 where the thread solder W is fed out.
The lower end of the guide tube 62 is provided so as to communicate with the upper blade hole 211 of the cutter upper blade 21. The lower end of the guide tube 62 moves following the sliding of the cutter upper blade 21, and the guide tube 62 is not pulled or pulled excessively within the range in which the cutter upper blade 21 slides. Is provided. The feed roller determines the length of the thread solder fed out by the rotation angle (number of rotations).

  When soldering is performed by the soldering apparatus A, the tip of the tip 5 is brought into contact with the land Ld of the wiring board (soldering substrate) Bd to be soldered, and at the tip 5, the land Ld and the terminal P of the electronic component Ep are connected. Surround (soldering part). At this time, heat from the heater 41 is transmitted to the tip 5, and when the tip 5 comes into contact, the land Ld and the terminal P of the electronic component Ep are heated to a temperature suitable for soldering (preheating). )

Next, the operation of the soldering apparatus A will be described. As shown in FIG. 2, the soldering apparatus A is in a state where the piston rod 32 is housed inside the air cylinder 31 immediately before performing soldering, and the cam member 33 is located in the upper part (sliding range) in the Z direction. At the top). At this time, the pin 332 is located in the first groove portion 341 of the cam groove 340, and the cutter upper blade 21 is at a position closest to the guide shaft 35. This position is the initial position. In the soldering apparatus A, the cutter upper blade 21 and the cutter lower blade 22 are formed so that the upper blade hole 211 overlaps the lower blade hole 221 in the Z direction when in the initial position.
Then, the feed roller 61 is rotationally driven to send out the thread solder W. Since the upper blade hole 211 and the lower blade hole 221 are in communication with each other, the tip of the thread solder W moves into the lower blade hole 221. The rotation angle of the feed roller 61 is adjusted so that the length of the thread solder W entering the lower blade hole 221 becomes the length of the solder piece Wh. The length of the solder piece Wh is determined according to the size of the land Ld to be soldered and the terminal P of the electronic component Ep.

Then, the piston rod 32 is protruded from the air cylinder 31 and the cam member 33 is moved downward along the guide shaft 35. Since the pin 332 is disposed in the cam groove 340, the pin 332 slides in the cam shaft 340. When the pin 332 is in the first groove 341, the first groove 341 coincides with the moving direction of the pin 332 (the axial direction of the guide shaft 35), so the slider 34 does not receive a force from the cam member 33, and the cam member 34 It is stationary. When the pin 332 reaches the connecting groove 343 from the first groove 341, the pin 332 presses the inner surface of the connecting groove 343. Thereby, a force in the X direction is applied to the slider portion 34, and the cutter upper blade 21 formed integrally with the slider portion 34 and the slider portion 34 moves (slids) in the X direction.
When the cutter upper blade 21 slides, the upper blade hole 211 and the lower blade hole 221 are displaced in the X direction, and the cutting blade formed on the edge of the end of the upper blade hole 211 due to the displacement of these holes, Cutting edges formed at the edge of the end of the lower blade hole 221 intersect. As a result, the thread solder W is cut and a solder piece Wh is generated.

When the piston rod 32 further protrudes, the cam member 33 moves further downward, and the pin 332 moves from the connection groove 343 to the second groove 342. Since the second groove portion 342 also extends parallel to the guide shaft 35, the pin 332 does not press the slider portion 34 even when the cam member 33 moves downward along the guide shaft 35. That is, the cam member 33 moves, but the cutter upper blade 21 and the slider portion 34 stop. The cutter upper blade 21 is located farthest from the guide shaft 35. When in this position, the cutter upper blade 21 and the cutter lower blade 22 are formed so that the pin hole 212 overlaps the lower blade hole 221 in the Z direction.
When the piston rod 32 further protrudes, the cam member 33 slides downward, and the pin pushing portion 333 of the cam member 33 pushes the head portion 232 of the pusher pin 23. Thereby, the rod portion 231 of the pusher pin 23 is inserted into the lower blade hole 221. At this time, the solder piece Wh remaining in the lower blade hole 221 is pushed by the rod portion 231 and moves toward the tip 5. The solder piece Wh may move downward due to its own weight when cutting, but by using the pusher pin 23, the solder piece Wh is reliably supplied to the first solder hole 51a of the first tip 5. Can do.

FIG. 4 shows a state from when the solder piece Wh is supplied into the tip 5 to melt and supplied to the wiring board Bd, from FIG. 4 (a) to FIG. 4 (f). FIG. 4A shows a state before soldering, and the flange 5 is separated from the wiring board Bd. FIG. 4B shows a state in which the solder piece Wh is supplied after the soldering tip 5 is lowered and comes into contact with the wiring board Bd to perform preheating, and the solder piece Wh is provided in the first solder hole 51a. It is received by the contraction part 51b, is contacted at this part, heat is transferred from the first tip 51 to the solder piece Wh, and the solder piece Wh is melted as shown in FIG. 4C. The melted solder Wh falls from the first solder hole 51a reduced portion 51b, and the molten solder Wha further falls along the second solder hole 52a as shown in FIGS. 4 (d) to 4 (e). The molten solder Wha flows into the pins P and lands Ld through the solder holes 53a, and soldering is performed as shown in FIG.
As shown in FIG. 2, since the third tip 53 is moved in the X direction (right side in the figure) of the soldering apparatus A by connecting the second tip 52, the component Db is placed on the wiring board Bd. Even if already arranged, the tip 5 does not contact.

The amount of movement of the third solder hole 53a with respect to the first solder hole 51a varies depending on the angle and length of the second solder hole 52a in the vertical direction (Z direction). Can be appropriately selected.
In addition, the amount of movement of the third solder hole 53a with respect to the first solder hole 51a can be changed by replacing only the second tip 52.

  FIG. 5 shows the tip of the second embodiment of the present invention. The difference from the first embodiment is that a reduced portion is installed on the third tip 53. The reduced portion 53b is provided in the third solder hole 53a, and the solder piece Wh is received and melted by the reduced portion 53b, and can be melted in the vicinity of the soldered portion.

  FIG. 6 shows a third embodiment of the present invention. The difference from the first embodiment is that the first to third tips are integrally formed. The tip 54 has a first solder hole 54a, a second solder hole 54b, and a third solder hole 54c inside, and a reduced portion 54d is provided in the first solder hole 54a to receive and melt the solder piece Wh. The second solder hole 54b communicates with the outside to form a first release hole 54e, which can release fumes of flux generated inside.

  A second release hole 54f is provided above the third solder hole 54c to prevent an excessive increase in the pressure of the inert gas for preventing the molten solder from being oxidized. In addition to preventing the solder from being oxidized, the inert gas has a function of stably sending the solder pieces to the lower part of the tip. That is, in FIG. 6A, the solder piece Wh is pushed downward by the supply pressure of the inert gas, and the molten solder is promoted to fall below the contraction portion 54d. When this supply pressure acts continuously, as shown in FIG. 6B, the melted solder reaches the wiring board and flows into the through holes around the terminals P to form back fillets. However, if an excessive pressure is applied, the solder may be removed from the upper portion of the terminal P by pushing the molten solder Wha into the through hole more than necessary. The second release hole 54f functions to release the pressure of an inert gas that acts on the solder after the molten solder flows into the through hole in order to prevent this excessive pressure rise.

  FIG. 7 shows a fourth embodiment of the present invention. The difference from the third embodiment is that a receiving portion for the solder piece Wh is provided in the bent portion 54g of the first solder hole 54a and the second solder hole 54b. . The solder piece Wha dropped from the first solder hole 54a is received and melted by the bent portion 54g, flows into the third solder hole 54c from the second solder hole 54b, and is soldered.

  FIG. 8 shows a fifth embodiment of the present invention. The difference from the first embodiment is that the position of the tip 5 is arranged on the left side of the drawing. By changing the attachment angle of the tip 5 by 180 degrees as shown in FIG. 8, or by changing it by 90 degrees or 270 degrees, the degree of freedom of the soldering position is expanded.

  FIG. 9 shows a sixth embodiment of the present invention. The difference from the first embodiment is that two soldering devices having different directions are provided. In FIG. 8, the first soldering device A1 and the second soldering device A2 rotated 180 degrees are installed facing each other, and the terminals P1 and P2 are soldered simultaneously. Thus, by making 1st soldering apparatus A1 and 2nd soldering apparatus A2 face each other, each 3rd solder hole 53a1 and 53a2 can be adjoined, and the adjacent terminals P1 and P2 are soldered simultaneously. Therefore, soldering of the terminal board on which a large number of terminals are arranged can be performed in a short time. In addition, although Example 5 showed the example of 2 units | sets, it is also possible to carry out by 3 units | sets or more.

5 Tip 51 First Tip 51a First Solder Hole 51b Reduced Part (Solder Receiving Part)
52 Second Tip 52a Second Solder Hole 52b First Release Hole 53 Third Solder Hole 53a Third Solder Hole 53b Reduced Part (Solder Receiving Part)
54 Tip 54a First solder hole 54b Second solder hole 54c Third solder hole 54d Reduced portion (solder receiving portion)
54e First release hole 54f Second release hole A Soldering device (solder processing device)
A1 First soldering device A2 Second soldering device P, P1, P2 Terminal Wh Solder piece Wha Molten solder

Claims (6)

  A substantially cylindrical tip that can be heated up and down, a first solder hole provided in the tip, and a solder piece supplied from above the first solder hole are brought into contact with the inner wall of the tip. A solder processing apparatus, comprising: a solder receiving portion to be bent; and a second solder hole that is bent from the first solder hole and supplies solder to the soldering portion.   A substantially cylindrical tip that extends vertically that can be heated, a first solder hole provided in the tip, and a second solder hole that bends from the first solder hole and supplies solder to the soldering portion And a third solder hole which is bent again from the second solder hole and is parallel to the first solder hole, and a solder piece supplied from above the first solder hole is brought into contact with the inner wall of the tip. A solder processing apparatus, wherein a solder receiving portion is provided in the first solder hole or the third solder hole.   The solder processing apparatus according to claim 1, wherein the solder receiving portion is a reduced portion in which a passage area of the solder hole is reduced.   The first solder hole and the second solder hole, or the first solder hole, the second solder hole, and the third solder hole are formed of an integral member. The solder processing apparatus according to item 1.   The solder processing apparatus according to claim 1, wherein the second solder hole can be attached by changing a bending direction.   The solder processing apparatus according to claim 1, wherein a plurality of the solder processing apparatuses are used, and the relative angles are changed and soldering is performed simultaneously.

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