JP2018094595A - Solder processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform simultaneous multipoint soldering in a cylindrical solder iron.SOLUTION: A solder processing device includes: a substantially cylindrical iron tip extending vertically and capable of heating; a recessed portion disposed at an end of the iron tip and covering multiple soldering sites; a gas supply unit for feeding gas into the iron tip; and a solder piece supply unit for supplying a solder quantity for the multiple sites into the iron tip. A solder piece is supplied to the iron tip and melted, and gas is caused to flow so that the melted solder is supplied to the multiple soldering sites, and thereby soldering of the multiple sites is carried out in one soldering operation.SELECTED DRAWING: Figure 2

Description

   The present invention relates to a soldering processing apparatus for heating and melting a solder piece and soldering to a circuit board.

In recent years, electronic circuits on which electrical components are mounted are mounted on various devices. In the formation process of the electronic circuit, soldering using a soldering iron is performed for the process of joining the lead wire to the wiring pattern (land) on the substrate. In addition, in order to mechanically realize the soldering process, a solder processing apparatus having a hook portion is used.
For example, such a solder processing apparatus melts downward by supplying solder pieces (cut from thread solder) into a heated tip and heating and melting the solder pieces using the heat of the tip. It is configured to supply solder. Thereby, the soldering process with respect to the board | substrate arrange | positioned below is realizable.

  In the technique described in Patent Document 1, soldering is performed on terminals on a circuit board by a soldering iron that melts solder inside a cylinder.

International Publication No. 2008/023461

However, in the technique described in Patent Document 1, when soldering a plurality of terminals like a terminal board, each terminal is soldered one by one in order, so that a lot of time is required for soldering. There was a drawback of being necessary.
It is also conceivable to perform soldering at a plurality of locations simultaneously using a plurality of soldering irons. However, it is necessary to supply solder to each of the plurality of soldering irons. It wasn't.
In view of the above-described problems, an object of the present invention is to provide an apparatus for simultaneously performing a plurality of solders with a single soldering iron.

  The solder processing apparatus of the present invention is a substantially cylindrical tip that can be heated up and down, a recess that covers a plurality of soldering points provided at the end of the tip, and sends gas into the tip. Gas supply part and a solder piece supply part that supplies the solder amount for a plurality of locations in the tip, and melts by supplying the solder pieces to the tip and flows into a plurality of soldering locations by flowing gas Multi-point soldering is performed by supplying the solder.

  Further, as the above apparatus, specifically, the distribution of the molten solder is promoted by flowing a gas from the end portions of a plurality of soldering locations.

Further, the solder processing apparatus of the present invention promotes the separation of the molten solder between the soldering points by flowing a gas between the respective soldering points.
Further, as the above-described apparatus, specifically, a gas discharge port is provided in the recess, and the gas flow is controlled by controlling the gas flow direction.

Further, the solder processing apparatus of the present invention distributes the molten solder by moving the tip of the solder piece in the direction of the soldering portion when the solder piece is melted.
In the solder processing apparatus of the present invention, the gas flow rate is temporarily increased when the solder pieces are melted to increase the gas flow force.

  According to the solder processing apparatus of the present invention, the molten solder is supplied to the recesses covering the plurality of soldering locations, and the solder is supplied to each soldering location by the gas flow, so that a plurality of locations can be obtained by one soldering. Can be performed at the same time, and the soldering process time can be shortened.

It is a perspective view which shows Embodiment 1 of the solder processing apparatus of this invention. It is sectional drawing cut | disconnected by the II-II line of the solder processing apparatus shown in FIG. FIG. 2 is an exploded perspective view of a part of a drive mechanism provided in the solder processing apparatus shown in FIG. 1. It is sectional drawing which shows the tip when the solder of the solder processing apparatus of Embodiment 1 of this invention starts melting. It is sectional drawing which shows the tip when the same solder is distributed. It is sectional drawing which shows operation | movement of the tip of Embodiment 2 of the solder processing apparatus of this invention, (a) shows the time of solder piece insertion, (b) shows the time of solder piece melting, (c) shows a solder piece. Indicates the end time. It is a perspective view which shows the bottom face of the tip of the Embodiment 2. It is a perspective view which shows the tip and wiring board of Embodiment 3 of the solder processing apparatus of this invention. It is sectional drawing which shows operation | movement of the tip of the same Embodiment 3, (a) is a sectional view which shows before movement of a tip, and (b) is during tip movement. It is a perspective view which shows other embodiment of this invention, (a) shows the state before soldering, (b) shows the state at the time of solder injection | pouring.

Embodiments of the present invention will be described below with reference to the drawings.
(First embodiment)
FIG. 1 is a perspective view of an example of a soldering apparatus according to the present invention. 2 is a cross-sectional view taken along the line II-II of the soldering apparatus shown in FIG. FIG. 3 is an exploded perspective view of a part of the drive mechanism provided in the soldering apparatus shown in FIG. In FIG. 1, a part of the housing and the support unit 1 is cut to display the inside of the soldering apparatus.

As shown in FIG. 1, the soldering apparatus A supplies the wire solder W from above, and uses the rivet 5 provided at the lower part to provide a wiring board Bd disposed below the rivet 5 and an electronic component. This is a device for soldering the terminal Tp. As shown in FIGS. 1 and 2, the soldering apparatus A includes a support unit 1, a cutter unit 2, a drive mechanism 3, a heater unit 4, a tip 5, a solder feed mechanism 6, and a gas supply unit 7. In the soldering apparatus A, the support part 1, the cutter unit 2, the drive mechanism 3, and the solder feed mechanism 6 constitute a solder supply part A1.
The support portion 1 includes a flat plate-like wall body 11 that is erected. In the following description, for the sake of convenience, as shown in FIG. 1, the horizontal direction along the wall body 11 is the X direction, the horizontal direction perpendicular to the wall body 11 is the Y direction, and the vertical direction along the wall body 11 is the Z direction. To do. For example, as shown in FIG. 1, the wall 11 has a ZX plane.

  The soldering apparatus A supplies the molten solder to the wiring board Bd attached to the jig Gj and the plurality of terminals Tp of the electronic components arranged on the wiring board Bd, and performs connection fixing. When soldering, the jig Gj is moved in the X direction and the Y direction to position the wiring board Bd with the land Ld. Further, the soldering apparatus A is movable in the Z direction, and the tip of the hook 5 can be brought into contact with the land Ld by moving in the Z direction after positioning.

  The support part 1 includes a wall body 11, a holding part 12, a sliding guide 13, and a heater unit fixing part 14. The wall body 11 is a flat wall body erected in the vertical direction. The wall body 11 serves as a support member for the soldering apparatus A. The holding portion 12 is fixed at a position shifted upward from the lower end portion in the Z direction of the wall body 11. The holding unit 12 holds an air cylinder 31 described later of the drive mechanism 3. The heater unit fixing portion 14 is a member that fixes the heater unit 4, and is provided at an end portion (lower end portion) of the wall body 11 in the Z direction.

The sliding guide 13 is fixed near the lower end of the wall 11 in the Z direction. The sliding guide 13 is fixed to the wall 11 together with a cutter lower blade 22 described later of the cutter unit 2, and guides a cutter upper blade 21 described later of the cutter unit 2 so as to be slidable in the X direction.
The sliding guide 13 is a member that makes a pair in the Y direction. The sliding guide 13 has a pair of wall portions 131 and a retaining portion 132. The wall 131 is a flat plate member extending in the X direction. One wall portion 131 is arranged in contact with the wall body 11, and the surface on the side opposite to the wall body 11 is in contact with the cutter lower end 22. Further, the other wall 131 is in contact with the side surface of the cutter lower blade 22. That is, the pair of wall portions 131 sandwich the cutter lower blade 22 from both sides in the Y direction. And a pair of wall part 131 and the cutter lower blade 22 are fastened together with the wall body 11 with fasteners, such as a screw, and are fixed.

  The retaining portion 132 is provided on each of the pair of wall portions 131. The pair of wall portions 131 extends in the Z direction from the upper surface of the cutter lower blade 22 in the Z direction, and extends from the upper end portions in the Z direction of the pair of wall portions 131 toward the other. That is, the sliding guide 13 includes a pair of retaining portions 132. And the front-end | tip of the Y direction of each of a pair of retaining part 132 does not contact, in other words, the sliding guide 13 has an opening in the upper part. The cutter upper blade 21 is at least partially disposed between the upper surface of the cutter lower blade 22 and the retaining portion 132. As a result, the cutter upper blade 21 is guided in the X direction and stopped in the Z direction.

Next, the configuration of the solder supply unit A1 will be described. The cutter unit 2 is a cutting tool that cuts the thread solder W fed by the solder feeding mechanism 6 into solder pieces Wh having a predetermined length. The cutter unit 2 includes a cutter upper blade 21, a cutter lower blade 22, and a pusher pin 23.
As described above, the cutter lower blade 22 is fixed to the wall body 11 together with the sliding guide 13. The cutter lower blade 22 includes a lower blade hole 221 and a gas inflow hole 222. The lower blade hole 221 is a through-hole penetrating the cutter lower blade 22 in the Z direction, and thread solder W penetrating an upper blade hole 211 described later of the cutter upper blade 21 is inserted therein. The edge part of the upper end of the lower blade hole 221 is formed in a cutting blade shape. Using the upper blade hole 211 and the lower blade hole 221, the thread solder W is cut into solder pieces Wh having a predetermined length. The cut solder piece Wh is pushed down by its own weight or by the pusher pin 23 and falls down in the lower blade hole 221. The lower blade hole 221 communicates with a solder hole 51 (described later) of the flange 5 via a solder supply hole 422 (described later) of the heater unit 4. The solder piece Wh dropped inside the lower blade hole 221 reaches the solder supply hole 422 and then falls into the solder hole 51.

  The gas inflow hole 222 is a hole that communicates the outer surface of the cutter lower blade 22 and the lower blade hole 221. A gas supply unit 7 for supplying gas is connected to the outside of the gas inflow hole 222. That is, the gas supplied from the gas supply unit 7 flows into the gas inflow hole 222. Then, the gas passes through the lower blade hole 221 and the solder supply hole 422 and reaches the solder hole 51. The gas is used to suppress solder oxidation when the solder is heated and melted. That is, it is a gas for suppressing contact between molten solder and oxygen. Examples of the gas include nitrogen gas, argon gas, helium gas, carbon dioxide, and the like. In the soldering apparatus A of this embodiment, it demonstrates as what supplies nitrogen gas. This gas flow acts to promote the movement and separation of the molten solder as will be described later.

As described above, the cutter upper blade 21 is disposed on the upper surface of the cutter lower blade 22 in the Z direction. The cutter upper blade 21 is guided by the sliding guide 13 so that the sliding direction becomes the X direction when sliding, and is prevented from coming off in the Z direction. That is, the cutter upper blade 21 slides in the X direction on the upper surface of the cutter lower blade 22 in the Z direction. The cutter upper blade 21 is slid by the drive mechanism 3.
The cutter upper blade 21 includes an upper blade hole 211 and a pin hole 212. The upper blade hole 211 is a through-hole penetrating the cutter upper blade 21 in the Z direction, and the thread solder W sent from the solder feeding mechanism 6 is inserted into the upper blade hole 211. The lower edge of the upper blade hole 211 is formed in a cutting edge shape. The pin hole 212 is a through hole that penetrates the cutter upper blade 21 in the Z direction. A rod portion 231 described later of the pusher pin 23 is slidably inserted into the pin hole 212.

  The pusher pin 23 includes a rod portion 231, a head portion 232, and a spring 233. The rod portion 231 is a columnar member and is slidably inserted into the pin hole 212. Further, the pusher pin 23 moves downward in the Z direction, so that the tip of the rod portion 23 protrudes from the pin hole 212. The head part 232 is connected to the upper end of the rod part 231 in the axial direction. The head portion 232 has a disk shape having an outer diameter larger than the inner diameter of the pin hole 212. The head portion 232 is not inserted into the pin hole 212. That is, the head portion 232 serves as a so-called stopper that restricts the movement of the rod portion 231 into the pin hole 212.

  The spring 233 is a compression coil spring that surrounds the radially outer side of the rod portion 231. The spring 233 has a lower end in the Z direction in contact with the upper surface of the cutter upper blade 21 and an upper end in the Z direction in contact with the lower surface of the head portion 232. That is, the spring 233 receives a reaction force from the upper surface of the cutter upper blade 21 and pushes the head portion 232 in the Z direction. Accordingly, the rod portion 231 connected to the head portion 232 is lifted upward in the Z direction, and the lower end of the rod portion 231 is maintained so as not to protrude from the lower end of the pin hole 212. Note that a lower end (not shown) that suppresses the disconnection from the pin hole 212 is provided at the lower end of the rod portion 231 in the Z direction.

  The pusher pin 23 pushes the solder piece Wh cut by the cutter upper blade 21 and the cutter lower blade 22 and remaining in the lower blade hole 221 downward. The pusher pin 23 is always pushed upward by the elastic force of the spring 233, that is, on the side opposite to the cutter lower blade 22. That is, the rod portion 231 protrudes downward from the lower end portion in the Z direction of the pin hole 212 when the head portion 232 is pushed. Then, the head portion 232 is pushed by a cam member 33 described later of the drive mechanism 3.

  In the cutter upper blade 21, the upper blade hole 211 and the pin hole 212 are provided side by side in the X direction. The cutter upper blade 21 slides in the X direction to move to a position where the upper blade hole 211 and the lower blade hole 221 overlap vertically or a position where the pin hole 212 and the lower blade hole 221 overlap vertically. . When the cutter upper blade 21 slides to one sliding end, the upper blade hole 211 and the lower blade hole 221 overlap, and when the cutter upper blade 21 slides to the other sliding end, You may slide so that the blade hole 221 may overlap.

  When the thread solder W is sent from the solder feeding mechanism 6 in a state where the upper blade hole 211 and the lower blade hole 221 overlap with each other in the Z direction, the thread solder W that has passed through the upper blade hole 211 is transferred to the lower blade hole. 221 is inserted. As described above, the lower edge portion of the upper blade hole 211 is formed in a cutting edge shape, and the upper edge portion of the lower blade hole 221 is also formed in a cutting blade shape. The lower surface of the cutter upper blade 21 is in contact with the upper surface of the cutter lower blade 22. Therefore, when the thread solder W is inserted into the lower blade hole 221, the cutter upper blade 21 slides in the X direction, so that the thread solder W is cut by the upper blade hole 211 and the lower blade hole 221. Disconnected.

  The cutter upper blade 21 is slid in the X direction by the cam member 33. Therefore, the cutter upper blade 21 and the pusher pin 23 are synchronized with the cam member 33. The cam member 33 pushes the head portion 232 when the pin hole 212 overlaps the lower blade hole 221 in the Z direction. Therefore, when the cutter upper blade 21 slides in the X direction, the tip of the rod portion 231 of the pusher pin 23 is accommodated in the pin hole 212. Therefore, when the cutter upper blade 21 slides in the X direction, contact between the tip of the rod portion 231 and the upper surface of the cutter lower blade 22 is suppressed, and the tip of the rod portion 231 and / or the cutter lower blade 22 is suppressed. Deformation, breakage, etc. are suppressed.

  As the cutter upper blade 21 slides in the X direction, the lower blade hole 211 and the pin hole 212 overlap in the Z direction. The head portion 232 is pushed by the cam member 33 in a state where the pin hole 212 overlaps the lower blade hole 211. As a result, the pusher pin 23 moves downward in the Z direction. When the pusher pin 23 protrudes downward in the Z direction from the pin hole 212, a part of the pusher pin 23 is inserted into the lower blade hole 211. When a solder piece (described later) obtained by cutting the thread solder remains at the entrance of the lower blade hole 211, the tip of the pusher pin 23 pushes the solder piece, and the solder piece falls.

  As shown in FIGS. 1 and 2, the drive mechanism 3 includes an air cylinder 31, a piston rod 32, a cam member 33, a slider portion 34, and a guide shaft 35. The air cylinder 31 is held by the holding unit 12. The air cylinder 31 has a bottomed cylindrical shape. A piston rod 32 is housed inside the air cylinder 31 and is slidably driven (expanded / contracted) by the pressure of air supplied from the outside. The air cylinder 31 and the piston rod 32 constitute an actuator of the drive mechanism 3. The piston rod 32 is disposed inside the air cylinder 31, and a part of the piston rod 32 always protrudes from one end of the air cylinder 31 in the axial direction (here, the lower end in the Z direction). The air cylinder 31 is held by the holding unit 12 so that the surface from which the piston rod 32 protrudes faces the cutter unit 2, that is, faces downward in the Z direction.

The piston rod 32 passes through a through hole (not shown) provided in the holding unit 12. The piston rod 32 is provided in parallel with the guide shaft 35 and reciprocates linearly along the guide shaft 35. The distal end portion of the piston rod 32 is fixed to the cam member 33, and the cam member 33 slides in the Z direction by the expansion and contraction of the piston rod 32. The sliding of the cam member 33 is guided by the guide shaft 35.
As shown in FIG. 2, the guide shaft 35 has a lower end fitted in a recessed hole provided in the cutter lower blade 22, and is fixed to the cutter lower blade 22 with a screw 351. Further, the upper portion of the guide shaft 35 passes through a hole provided in the holding portion 12, and movement is restricted by the pin 352. In other words, the guide shaft 35 is fixed to the cutter lower blade 22 by the screw 351 and the holding portion 12 by the pin 352.

  In this embodiment, the guide shaft 35 is fixed by the screw 351 and the pin 352. However, the guide shaft 35 is not limited to this, and is fixed by a fixing method such as press fitting or welding. Also good. In the present embodiment, the guide shaft 35 is a cylindrical member, but is not limited thereto, and a polygonal cross section, an ellipse, or the like may be used.

As shown in FIGS. 2 and 3, the cam member 33 is a rectangular member, and is connected to the recess 330 having a part of the long side cut out in a rectangular shape and the cam member 33, and the guide shaft 35 passes therethrough. And a cylindrical support portion 331 having a through-hole. The slider part 34 is slidably disposed in the recess 330 (in the X direction and the Z direction). Further, the support portion 331 has a shape extending in a direction parallel to the guide shaft 35, and is provided to prevent the cam member 33 from rattling. That is, when the cam member 33 has a certain thickness and is unlikely to generate rattling, the cylindrical portion may be omitted, and the support portion 331 may be configured only by the through hole.
The cam member 33 is provided at an intermediate portion of the recess 330 and has a cylindrical pin 332 whose central axis is orthogonal to the guide shaft 35, a pin pressing portion 333 that presses the pusher pin 23 adjacent to the recess 330, and a support And a bearing 334 disposed inside the portion 331. The pin 332 is inserted into a cam groove 340 described later provided in the slider portion 34. Further, the bearing 334 is a member that is fitted on the guide shaft 35 and is slid smoothly so that the cam member 33 does not rattle.

As shown in FIGS. 2 and 3, the slider portion 34 is a rectangular plate-like member, and is formed integrally with the cutter upper blade 21. The slider portion 34 includes a cam groove 340 that penetrates in the plate thickness direction and extends in the longitudinal direction. The cam groove 340 has a first groove part 341 extending in parallel with the guide shaft 35 on the upper side and a second groove part 342 extending in parallel with the guide shaft 35 on the lower side. The first groove portion 341 and the second groove portion 342 are provided so as to be shifted in the X direction, and the cam groove 340 includes a connection groove portion 343 that connects the first groove portion 341 and the second groove portion 342.
A pin 332 of the cam member 33 is inserted into the cam groove 340, and the pin 332 slides on the inner surface of the cam groove 340 as the cam member 33 moves along the guide shaft 35. When the pin 332 is positioned in the connection groove 343 of the cam groove 340, the inner surface of the connection groove 343 is pushed. Thus, the slider part 34 and the cutter upper blade 21 formed integrally with the slider part 34 move in the direction (X direction) intersecting the sliding direction (Z direction) of the cam member 33 (with respect to the cutter lower blade 22). Slide).

As shown in FIGS. 1 and 2, the solder feeding mechanism 6 supplies the thread solder W. The solder feed mechanism 6 includes a pair of feed rollers 61 and a guide tube 62. The pair of feed rollers 61 are rotatably attached to the support wall 11. The pair of feed rollers 61 feeds the thread solder downward by rotating across the side surface of the thread solder W. The pair of feed rollers 61 are biased toward each other, and the thread solder W is sandwiched by the biasing force. The length of the thread solder W fed out is measured (determined) by the rotation angle (number of rotations) of the feed roller 61.
The guide tube 62 is a tube body that can be elastically deformed, and its upper end is disposed in the vicinity of a portion of the feed roller 61 where the thread solder W is fed out. The lower end of the guide tube 62 is provided so as to communicate with the upper blade hole 211 of the cutter upper blade 21. The lower end of the guide tube 62 moves following the sliding of the cutter upper blade 21, and the guide tube 62 has a length that is not excessively pulled or stretched within the range in which the cutter upper blade 21 slides. And has a shape.

The heater unit 4 is a heating device for heating and melting the solder piece Wh, and is fixed to the heater unit fixing portion 14 provided at the lower end portion of the wall 22 as shown in FIG. The heater unit 4 includes a heater 41 and a heater block 42. The heater 41 generates heat when energized. Here, the heater 41 has a heating wire wound around the outer peripheral surface of a cylindrical heater block 42.
The heater block 42 has a cylindrical shape, a concave section 421 having a circular cross section for attaching the tip 5 to an end portion in the axial direction, and a solder supply hole 422 penetrating from the center of the bottom of the concave section 421 to the opposite side. And. The heater block 42 is provided in contact with the cutter lower blade 22 so that the solder supply hole 422 and the lower blade hole 221 communicate with each other. By providing the heater block 42 in this manner, the solder piece Wh moves from the lower blade hole 221 to the solder supply hole 422.

The tip 5 is a cylindrical member and is provided with a solder hole 51 extending in the axial direction at the center. The tip 5 is inserted into the recess 421 of the heater block 42 and is prevented from coming off by a member not shown. Further, the solder hole 51 of the tip 5 communicates with the solder supply hole 421 of the heater block 42, and the solder piece Wh is sent from the solder supply hole 421.
The tip 5 is transferred with heat from the heater 41 and melts the solder piece Wh with the heat. Therefore, the tip 5 is made of a material having high thermal conductivity, for example, a ceramic such as silicon carbide or aluminum nitride, or a metal such as tungsten.
A concave portion 52 that communicates with the solder hole 51 is provided at the end portion of the tip 5, and the concave portion 52 covers a plurality of terminals Tp and lands Ld and a part of the side surface. The molten solder Wh flows from the solder hole 51 into the recess 52.

The gas supply unit 7 supplies a gas supplied from a gas supply source GS provided outside the soldering apparatus A to the soldering apparatus A. By using the inert gas described above as the gas, it is possible to prevent the solder from being oxidized. As shown in FIG. 2, the gas supply unit 7 includes a pipe 70, a first adjustment unit 71, and a measurement unit 72 that measures the gas flow rate and pressure and outputs an electrical signal. In FIG. 2, for convenience, the piping 70 is shown by a diagram, but is actually a tube body (for example, a copper tube or a resin tube) that does not leak nitrogen gas.
The pipe 70 is a pipe that connects the gas supply source GS and allows the nitrogen gas from the gas supply source GS to flow into the gas inflow hole 222.
In the soldering apparatus A, the gas inflow hole 222 communicates with the recess 52 from the lower blade hole 221, the solder supply hole 422, and the solder hole 51.

The first adjusting unit 71 is provided in the pipe 70, the first adjusting unit 71 adjusts the flow rate or pressure of nitrogen gas flowing through the pipe 701, and the measuring unit 72 is the flow rate of nitrogen gas flowing through the pipe 70. It is a flow meter that measures A control unit 73 controls the flow rate and pressure.
The control unit 73 can perform control including the approach and separation of the soldering apparatus A to the substrate Bd of the soldering apparatus A, the cutting of the thread solder W, the heating of the tip 5 and the like.

  Next, the operation of this embodiment will be described. In the soldering apparatus A, the tip 5 is separated from the substrate Bd before soldering (for example, heating the tip 5 or changing the substrate Bd to be soldered). Next, in order to perform soldering after the reference state, the tip 5 is brought into contact with the land Ld of the substrate Bd. In the soldering apparatus A, the tip 5 is brought into contact with the land Ld to raise the temperature of the land Ld to an appropriate temperature for soldering. At this time, nitrogen gas is supplied from the gas supply unit 7, and a flow of nitrogen gas is generated inside the solder hole 51. Then, the solder piece Wh is put into the solder hole 51 at the timing when the preheating is completed. The solder piece Wh is formed by cutting the thread solder W with the cutter upper blade 21 and the cutter lower blade 22 (see FIG. 2). When pressed by its own weight or the pusher pin 23, the solder piece Wh falls, passes through the lower blade hole 221 and the solder supply hole 422, and is put into the solder hole 51. The solder piece Wh is received and stopped by the reduced portion 51a of the solder hole 51, and starts to melt upon receiving heat from the tip 51.

The molten solder piece Wh flows downward due to gravity and flows into the recess 52 as shown in FIG. 4. The recess 52 is a non-wetting material with respect to the solder, whereas the land Ld and the terminal Tp Has high wettability, so that it spreads over the wiring board Bd in the recess 52. At this time, nitrogen gas is continuously supplied, and the solder pieces Wh melted at a constant amount by this flow are supplied to the plurality of lands Ld and terminals Tp01 to Tp04 of the wiring board Bd. The surface of the wiring board Bd other than the lands Ld and the terminals Tp is covered with a resist Re that is a non-wetting material, and does not adhere to the resist Re, but solder selectively adheres to the lands Ld and the terminals Tp.
In order to more effectively diffuse the solder pieces by the nitrogen gas flow, a discharge port 52a is provided in the recess 52 as shown in FIG. 5 to generate a horizontal flow in the drawing. The diffused solder pieces adhere to the lands Ld and the terminals Tp separated by the resist Re, and further flow into the plurality of through-holes Th to form back fillets. By adjusting the nitrogen gas flow rate according to the amount of solder and the number of terminals, it is possible to distribute the solder evenly to the respective terminals Tp. Thus, a plurality of terminals are soldered by a single soldering operation. The adjustment of the nitrogen gas flow can be performed by changing the setting of the first adjustment unit 71 of the gas supply unit 7 by the control unit 73.
When the viscosity of the solder piece Wh is high or the number of the plurality of terminals Tp is large, in order to ensure the diffusion of the solder piece, a flow of nitrogen gas is temporarily made to flow more than usual. Since the time from the supply of the solder piece Wh to the melting is known in advance, the nitrogen gas flow can be supplied in a pulsed manner in accordance with this timing.

(Second Embodiment)
Another example of the solder processing apparatus according to this embodiment will be described with reference to the drawings. FIG. 6 is a view showing a main part of the solder processing apparatus of the present invention. The difference from the first embodiment is that a gas flow is supplied between a plurality of terminals. That is, as shown in FIG. 6A, solder is supplied to the non-wetting recess 51, and gas is blown out between the terminals Tp11 and Tp12. Then, as shown in FIG. 6B, a nitrogen gas flow is blown to the central portion of the melted solder, whereby the land Ld1 (terminals) separated by the resist Re as shown in FIG. Soldering is performed to Tp11) and land Tp2 (terminal Tp12). Since the recess 52 is non-wetting, it does not adhere to the wall surface of the recess 52, and a certain amount of solder pieces Wh are supplied, so that an appropriate amount of solder is supplied around the terminals Tp11 to Tp12. At this time, preferably, the gas flow rate is temporarily temporarily increased to ensure separation, and even when the distance between the terminals Tp11 and Tp12 is small, soldering can be performed simultaneously without generating a bridge in which the terminals are connected by solder. Is possible.
As shown in FIGS. 7A and 7B, which are perspective views of the bottom surface of FIG. It can be done reliably.
In the present embodiment, the number of terminals is two, but the present invention can be carried out with three or more terminals.

(Third embodiment)
Another example of the solder processing apparatus according to this embodiment will be described with reference to the drawings. FIG. 8 is a view showing a main part of the solder processing apparatus of the present invention. The difference from the first embodiment is that soldering is performed while moving the recess 52 of the tip 5. In FIG. 8, openings 52d are provided in the recesses 52 of the tip 5 in the arrangement direction of the terminals Tp. As shown in FIG. 9A, when the solder pieces Wh melt and flow into the terminals Tp21 from the recesses 52, The tip 5 integrated with 52 is moved in the terminal arrangement direction (left direction in the figure as indicated by the arrow). The height of the opening 52d is set to be higher than the height of the terminal Tp on the wiring board Bd, and does not become an obstacle during movement. After the molten solder pieces Wh adhere to the terminals Tp21 and Tp22, as shown in FIG. 9B, the molten solder pieces Wh are sequentially supplied to the terminals Tp23 and Tp24. The solder piece Wh attached to the terminal Tp flows into the land Ld and the through hole Th, is separated by the non-wetting resist Re, and the molten solder piece Wh from the terminals Tp21 to Tp24 is supplied. At this time, since the solder pieces Wh are supplied in a constant amount and the recess 52 is non-wetting, an equal amount of soldering is performed without causing a bridge from the terminals Tp21 to Tp24. The timing for moving the tip 5 is when molten solder is supplied to Tp21. At this time, an image sensor or a temperature sensor is used to indicate whether the time elapsed from the supply of solder by the timer or the supply of molten solder to the terminal Tp1. It may be detected.
As a means for moving the tip 5, a robot (not shown) that moves the solder processing apparatus A may be used.

As a terminal Tp to be soldered, a terminal Tp31 having a shape as shown in FIG. 10 (a) can be soldered as shown in FIG. 9 (b).
Further, the soldering location in the present invention is not limited to the terminal, but can be applied to other mounting parts.
As mentioned above, although embodiment of this invention was described, this invention is not limited to this content. The embodiments of the present invention can be variously modified without departing from the spirit of the invention.

5 Tip 7 Gas supply part 51 Solder hole 52 Recesses 52a, 52b, 52c Discharge port 52d Opening part A Solder processing device A1 Solder supply part Wh Solder piece Bd Wiring board Ld Land Tp Terminal

Claims (6)

  A substantially cylindrical tip extending up and down that can be heated; a recess that covers a plurality of soldering points provided at an end of the tip; and a gas supply unit that sends gas into the tip, A solder piece supply section for supplying a solder amount for a plurality of locations in the tip, and supplying and melting the solder pieces to the tip and flowing a gas to flow the solder to the plurality of solder locations. Soldering apparatus characterized by supplying.   The solder processing apparatus according to claim 1, wherein distribution of molten solder is promoted by flowing a gas from an end portion of the plurality of soldering portions.    The solder processing apparatus according to claim 1, wherein separation of molten solder is promoted by flowing a gas between each of the plurality of soldering portions.   The solder processing apparatus according to claim 2, wherein a gas flow is generated by providing a gas discharge port in the recess.   5. The solder processing apparatus according to claim 1, wherein when the solder piece is melted, the soldering tip is moved in a direction of a soldering portion to distribute the molten solder.   The solder processing apparatus according to claim 1, wherein a gas flow rate is temporarily increased when the solder piece is melted.

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