JP2018094595A5 - - Google Patents

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Publication number
JP2018094595A5
JP2018094595A5 JP2016241323A JP2016241323A JP2018094595A5 JP 2018094595 A5 JP2018094595 A5 JP 2018094595A5 JP 2016241323 A JP2016241323 A JP 2016241323A JP 2016241323 A JP2016241323 A JP 2016241323A JP 2018094595 A5 JP2018094595 A5 JP 2018094595A5
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Japan
Prior art keywords
solder
soldering
gas
tip
processing apparatus
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JP2016241323A
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Japanese (ja)
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JP6818973B2 (en
JP2018094595A (en
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Priority to JP2016241323A priority Critical patent/JP6818973B2/en
Priority claimed from JP2016241323A external-priority patent/JP6818973B2/en
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Publication of JP2018094595A5 publication Critical patent/JP2018094595A5/ja
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Description

本発明の半田処理装置は、加熱可能である上下に伸びた略筒形状の鏝先と、鏝先の下端部に設けられた複数の半田付け箇所の一部又は全部を覆う凹部と、鏝先内にガスを送出するガス供給部と、鏝先内に複数箇所分の半田量を供給する半田供給部とを備え、鏝先内に半田片を供給して溶融するとともにガスの流体力により複数の半田付け箇所に溶融した半田を分配して供給することにより多点のはんだ付けを行うものである。 Soldering apparatus of the present invention includes: a soldering tip having a substantially cylindrical shape that extends vertically is heatable, and a recess for covering a part or all of the plurality of soldering points provided under end of the soldering tip, trowel A gas supply unit for sending gas into the tip and a solder supply unit for supplying solder for a plurality of locations in the tip , and supplying and melting the solder pieces into the tip , and by the fluid force of the gas Multi-point soldering is performed by distributing and supplying molten solder to a plurality of soldering locations.

Claims (5)

加熱可能である上下に伸びた略筒形状の鏝先と、前記鏝先の下端部に設けられた複数の半田付け箇所の一部又は全部を覆う凹部と、前記鏝先内にガスを送出するガス供給部と、前記鏝先内に複数箇所分の半田量を供給する半田供給部とを備え、前記鏝先内に半田片を供給して溶融するとともに前記ガスの流体力により前記複数の半田付け箇所に溶融した半田を分配して供給することを特徴とする半田処理装置。 Sending a soldering tip having a substantially cylindrical shape that extends vertically is heatable, and a portion or recess which covers all of the plurality of soldering points provided under end of the soldering tip, a gas into the soldering tip a gas supply unit which includes a solder supply unit for supplying a solder amount of multiple branching into the soldering tip, the plurality of the fluid force of the gas along with the melt by supplying a solder strip into the soldering tip A solder processing apparatus that distributes and supplies molten solder to soldering points. 前記複数の半田付けの箇所の端部から前記ガスを流すことにより溶融半田の分配を促進することを特徴とする請求項１記載の半田処理装置。 The solder processing apparatus according to claim 1, wherein distribution of molten solder is promoted by flowing the gas from an end portion of the plurality of soldering portions. 前記複数の半田付けのそれぞれ箇所の間に前記ガスを流すことにより溶融半田の分配を促進することを特徴とする請求項１記載の半田処理装置。 Soldering apparatus according to claim 1, wherein the promoting distributable solder melt by flowing the gas between each portion of the plurality of soldering. 前記半田片の溶融時に、前記鏝先を半田付け箇所の方向に移動させ溶融半田を分配することを特徴とする請求項１に記載の半田処理装置。 2. The solder processing apparatus according to claim 1 , wherein when the solder piece is melted, the solder tip is moved in a direction of a soldering portion to distribute the molten solder. 前記半田片の溶融時に前記ガスの流量を一時的に増加させることを特徴とする請求項１〜４のいずれか１項に記載の半田処理装置。 The solder processing apparatus according to claim 1, wherein the flow rate of the gas is temporarily increased when the solder piece is melted.
JP2016241323A 2016-12-13 2016-12-13 Handa processing equipment Active JP6818973B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016241323A JP6818973B2 (en) 2016-12-13 2016-12-13 Handa processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016241323A JP6818973B2 (en) 2016-12-13 2016-12-13 Handa processing equipment

Publications (3)

Publication Number Publication Date
JP2018094595A JP2018094595A (en) 2018-06-21
JP2018094595A5 true JP2018094595A5 (en) 2019-11-28
JP6818973B2 JP6818973B2 (en) 2021-01-27

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ID=62634176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016241323A Active JP6818973B2 (en) 2016-12-13 2016-12-13 Handa processing equipment

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JP (1) JP6818973B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020006405A (en) * 2018-07-09 2020-01-16 株式会社パラット Soldering device and soldering method

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