JP2020006405A - Soldering device and soldering method - Google Patents

Abstract

To provide a soldering device and method capable of stably supplying a melted solder to a soldering object heated by an iron tip.SOLUTION: A soldering device 1 for soldering to a soldering object 9 comprises: a hollow iron tip 25 having a hole 25c on a tip brought into contact with or in the vicinity of the soldering object 9; a solder piece supply means 30 supplying a solder piece 16a to the inside of the iron tip 25; heating means 23 heating and melting the solder piece 16a in the iron tip 25 by heating the iron tip 25; and a relative distance change means 6 changing a relative distance in the adjacency/separation direction of the object 9 and the iron tip 25. The inner diameter of a hole 25c in the iron tip 25 is formed shorter than the external diameter of the solder piece 16a before melting.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a soldering device for soldering a first conductor (terminal, land, lead wire, etc.) and a second conductor (terminal, land, lead wire, etc.) in an appropriate product such as a printed circuit board or a motor. About the attachment method.

  Conventionally, there has been provided a soldering apparatus for automatically soldering an electronic component to a printed circuit board. In this soldering apparatus, for example, a thread solder supply pipe is provided so as to supply thread solder at a soldering iron tip, and a thread solder of a fixed length is sequentially fed by a thread solder feed roller or the like. It is configured to be automatically supplied to Soldering is performed by melting the tip of the supplied thread solder and flowing to the soldering object heated by the tip.

  When soldering is repeated as described above, the tip of the thread solder supply pipe is close to the tip, so that the flux scattered during soldering is clogged in the thread solder supply pipe. There was a problem.

  Patent Literature 1 discloses an invention in which an air supply source is connected to a solder supply pipe, and air is blown from a tip of the solder supply pipe. This describes that pipe clogging can be prevented, and thread solder can always be supplied to the tip in a good state.

  However, in order to reliably supply the thread solder to the tip, it is necessary to bring the tip of the thread solder supply pipe as close to the tip as possible. Therefore, it is difficult to completely prevent the clogging of the solder supply pipe with the above-described soldering apparatus that supplies the thread solder to the soldering iron tip through the solder supply pipe.

Japanese Utility Model Publication No. 05-005268

  An object of the present invention is to provide a soldering apparatus and a soldering method capable of stably supplying a molten solder to a soldering object heated by a tip in view of the above-mentioned problem.

  The present invention is a soldering apparatus for performing soldering on an object to be soldered, comprising: a solder piece supply means for supplying a solder piece; and a soldering tip having a passage into which the solder piece supplied by the solder piece supply means enters. A relative distance changing means for changing a relative distance in a direction of approach and separation between the solder outflow end portion of the tip and the soldering target, and heating the tip to the solder in the passage of the tip. Heating means for heating and melting the solder piece, wherein the passage is provided with a solder piece supply-side large-diameter portion having a diameter larger than a maximum length of the solder piece supplied from the solder piece supply means, and near the tip. And a soldering method having a small-diameter portion having a diameter smaller than the maximum length of the solder piece inside the soldering device.

  According to the present invention, it is possible to provide a soldering apparatus and a soldering method capable of stably supplying a molten solder to a soldering object heated by a tip.

FIG. 2 is a right side view illustrating an external configuration of the soldering device. FIG. 3 is a partially cut end view of a right side surface of a head portion. FIG. 4 is a partial cross-sectional plan view of a head section. Explanatory drawing explaining cutting of a solder piece. FIG. 3 is an explanatory diagram illustrating a state in which a solder piece is melted and flows to a soldering target. Sectional drawing of the iron tip of Example 2. FIG.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings and the like.

<Soldering equipment>
FIG. 1 is a right side view illustrating an external configuration of the soldering device 1.
The soldering apparatus 1 includes a head 3 provided with a tip 25 for soldering to a printed board 9 to be soldered, and an air suspension unit 5 for bringing the head 3 and the tip 25 into a floating state. A proximity / separation direction movement unit 6 for moving the air suspension unit 5 and the soldering tip 25 in a direction (up / down direction in FIG. 1, hereinafter referred to as “Z direction”) for approaching / separating from the soldering target; A transport direction moving unit 7 for moving the unit 6 and the tip 25 in a transport direction in which the printed circuit board 9 is transported (a depth direction in FIG. 1; hereinafter, referred to as an “X direction”); 25 in the transport width direction of the transport direction moving unit 7 (the left-right direction in FIG. 1; hereinafter, referred to as the “Y direction”). It is. The conveying direction moving unit 7 and the conveying width direction moving unit 8 function as a tip position moving means for moving the tip 25 to an arbitrary position of a soldering target to be soldered. Function as relative distance changing means for changing the relative distance of the soldering tip 25 to the soldering target in the direction of approach and separation.

FIG. 2 is a partially cut end view of the right side surface of the head unit.
<Head part>
The head unit 3 is fixed to a floating unit 5d provided in the air suspension unit 5 (see FIG. 1). The head part 3 is provided with a solder tip 25 at a lower part, and a solder piece supply part 30 for supplying the solder piece 16a to the solder tip 25 via a solder piece dropping tube 34 (induction means) at an upper part. The tip 25 is suspended from the solder piece supply unit 30 by a suspension member 24, and a heater 23 is provided on an outer peripheral portion.

≪Solder strip supply section≫
The solder piece supply section 30 includes a thread solder reel 31 on which the thread solder 16 is wound on the base 3a, a thread solder cutting section 33 (cutting means) for cutting the thread solder 16 into solder pieces, and a thread solder reel 31. And a thread solder roller guide 32 for guiding the thread solder 16 having exited from the wire soldering section 33 to the thread solder cutting section 33.

FIG. 3 is a partial cross-sectional plan view of the head unit 3.
The thread solder reel 31 is arranged with the rotation axis directed in the X direction, and takes out the thread solder 16 in the Y direction (the traveling direction).

  The thread solder roller guide 32 includes a plurality of rollers 32 a (thread solder feeding means) symmetrically in the traveling direction of the thread solder 16. In this example, the thread solder roller guide 32 includes two sets of four rollers 32a symmetrically in the left and right direction, and a guide pipe 32b is provided between the two sets of rollers 32a in the traveling direction of the thread solder 16. Is provided. As a result, the thread solder roller guide 32 ties the thread solder 16 passed through the guide pipe 32b between the left and right rollers 32a, feeds the tip from the tip, and guides the thread solder cutting unit 33.

  FIG. 4A is a longitudinal sectional view of the thread solder cutting portion 33 before cutting the thread solder 16.

  The thread solder cutting portion 33 includes a rectangular cylindrical cylinder 33a erected in the Z direction (vertical direction) on the base 3a, and a prismatic piston slidably fitted inside from above the cylinder 33a. 33b, and an air cylinder 33f provided above the piston 33b to move the piston 33b up and down via a piston rod 33e (see FIG. 2).

  The cylinder 33a is provided with a flat shutter 33i at the lower end opening. The shutter 33i is disposed horizontally, and is connected to an air cylinder 33k that slides the shutter 33i in the horizontal direction via a piston rod 33j (see FIG. 3). Thus, the shutter 33i can open and close the lower end opening of the cylinder 33a. Note that the shutter 33i is not limited to the type that slides in the horizontal direction, and may be, for example, a type that rotates 90 degrees from the horizontal position to the vertical position.

  The cylinder 33a is provided with a cylindrical insertion hole 33g through which the thread solder 16 is inserted, on a side surface facing the thread solder 16 guided by the thread solder roller guide 32. The insertion hole 33g is provided at a position at a predetermined height from the shutter 33i. The insertion hole 33g has an inner diameter slightly larger than the outer diameter of the thread solder 16, and is provided with a fixed cutting blade 33h (support portion) formed of a cemented carbide material on the inner peripheral surface.

  The piston 33b is provided with a movable cutting blade 331 (cutting tool) formed of a cemented carbide material on the lower end surface.

≪Cutting operation of thread solder≫
FIG. 4B is a longitudinal sectional view of the thread solder cutting portion 33 immediately after cutting the thread solder 16.

The operation of cutting the thread solder 16 to generate the solder pieces 16a is as follows.
The piston 33b is made to stand by at a standby position where the movable cutting blade 331 on the lower end surface is located above the insertion hole 33g.
The thread solder 16 is inserted through the insertion hole 33g into the inside of the cylinder 33a, and is set so as to protrude into the cylinder 33a by a predetermined length of the solder piece.

The piston 33b is pushed down to allow the movable cutting blade 331 to pass through the vicinity of the insertion hole 33g at a stretch. As a result, the fixed cutting blade 33h and the movable cutting blade 331 on the inner peripheral surface of the insertion hole 33g cut so as to sandwich the thread solder 16 to generate the solder piece 16a.
After the movable cutting blade 331 is lowered from the shutter 33i to a lower limit position of a predetermined height, the piston 33b is turned up and returned to the standby position.

  The generated solder piece 16a falls onto the shutter 33i, and is held on the shutter 33i with the longitudinal direction thereof oriented horizontally. The space defined by the shutter 33i inside the cylinder 33a and the lower limit position of the piston 33b functions as a solder piece storage tank 33m for storing the solder piece 16a. The solder piece storage tank 33m and the shutter 33i function as a storage / discharge unit 33n (storage / release means) for temporarily storing and releasing the solder pieces 16a. By repeating the operation of generating the solder pieces 16a, a plurality of solder pieces 16a can be generated and stored in the solder piece storage tank 33m.

FIG. 5A is a longitudinal sectional end view around the tip of the iron.
The solder piece supply unit 30 is provided below the cylinder 33a, and includes a solder piece dropping tube 34 for guiding the solder pieces 16a dropped from the solder piece storage tank 33m.

  The solder piece dropping tube 34 is a cylindrical tube extending vertically, having a center line common to the center line of the cylinder 33a, and an upper end opening connected to the lower end of the cylinder 33a. The solder piece dropping tube 34 has an inverted truncated conical cylindrical (funnel-shaped) dropping port 34a (reduced diameter portion) at the lower end portion of which the cylindrical tube extends and gradually decreases in diameter downward. The discharge port 34c is provided at the tip. As a result, the lower end opening of the outlet port portion 34a of the solder piece dropping tube 34 is smaller than the upper end opening portion connected to the cylinder 33a. The solder piece dropping tube 34 has an upper end opening larger than the lower end opening of the cylinder 33a, but the lower end opening of the dropping opening 34a has substantially the same size as the lower end opening of the cylinder 33a. Has become.

  Thereby, the solder piece 16a stored in the solder piece storage tank 33m and held on the shutter 33i is dropped into the solder piece drop tube 34 by operating the shutter 33i to open the lower end opening of the cylinder 33a. After being naturally dropped in a free posture as it is, it can be further dropped downward through the drop outlet 34a.

≫ tip
The tip 25 is formed of a heat-resistant ceramic material such as SiC, and is provided below the solder piece drop tube 34 and slightly away from the solder piece drop tube 34.

  The tip 25 is a cylindrical tube whose central portion 25j (the large-diameter portion on the solder piece supply side) extends up and down. The center line is common to the center line of the solder piece dropping tube 34. The inner diameter of the passage 25k, which is the hole of the tip 25, is formed smaller than the inner diameter of the discharge port 34c, which is the lower end opening of the discharge port 34a of the solder piece discharge pipe 34, and longer than the maximum length of the solder piece 16a. ing. The inner diameter of the central portion of the tip 25 is 4 mm in this example, but is appropriately determined.

The heater block 23a is provided on the outer periphery of a cylindrical tube at the center of the tip 25, and is formed of a heat-resistant ceramic material such as SiC.
The heater 23 is embedded in the heater block 23 a and provided along the outer peripheral portion of a cylindrical tube at the center of the tip 25.

  The suspension member 24 is formed of a heat-insulating machinable ceramic material. The suspending member 24 supports the heater block 23a from both sides, and suspends the entire tip 25 from the solder piece supply unit 30 (not shown).

  The tip 25 has a receiving port 25a at the upper end of which a central cylindrical tube extends and whose inner diameter gradually increases upward. A funnel-shaped tapered surface 25i (guiding means-side tapered surface) is provided on the inner side surface of the receiving port portion 25a so as to be spaced apart from and parallel to the outer side surface 34b of the dropping portion 34a of the upper solder piece dropping tube 34. Have been. The separation distance between the inner surface of the receiving port 25a and the outer surface of the discharge port 34a of the solder piece discharge tube 34 is preferably 0.1 to 2 mm, more preferably 0.3 to 0.7 mm.

  Accordingly, it is possible to prevent heat from leaking from the heated tip 25 to the solder piece dropping tube 34 side by heat conduction, and to suppress leakage of hot air rising inside the heated tip 25 to the outside. be able to.

  The angle of inclination of the inner surface of the receiving port 25a is the same as the angle of inclination of the outer surface of the discharge port 34a of the solder piece discharge tube 34, and is preferably 30 to 60 degrees, more preferably 40 to 50 degrees.

  The tip 25 has a melting portion 25b (solder outflow tip) in which a cylindrical tube at the center extends and the inner diameter gradually decreases downward at the lower portion (tip). A funnel-shaped inner surface of the fusion portion 25b whose diameter is reduced forms a tapered surface 25m. The tip 25 has an outflow hole 25c (small diameter portion) at the lower end of the melted portion 25b having a reduced diameter. As a result, the outflow hole portion 25c is arranged on the vertical line of the drop opening portion 34a of the solder piece drop tube 34 and the solder piece storage tank 33m. The inner diameter of the outflow hole portion 25c is preferably smaller than the maximum length of the solder piece 16a (the length in the longitudinal direction in the case of a cylindrical solder piece) and smaller than the outer dimensions of the solder piece 16a. Here, the outer dimension of the solder piece 16a refers to the smaller one of the diameter and the length. Further, the inner diameter of the outflow hole 25c is preferably 0.2 to 0.9 times the outer dimension of the solder piece 16a, and more preferably 0.4 to 0.6 times the outer dimension of the solder piece 16a. Further, the inclination angle of the tapered surface 25i, which is the inner side surface of the melted portion 25b, is preferably 30 to 60 degrees, and more preferably 40 to 50 degrees. In this example, the solder piece 16a has a diameter of 1.6 mm and a length of 2 mm.

  As a result, the solder pieces 16a dropped downward from the discharge port 34a of the solder piece drop tube 34 fall naturally to the melting portion 25b through the inside of the tip 25, and flow out on the inner surface of the melting portion 25b. It is held near the hole 25c.

  Further, by appropriately setting the inner diameter of the outflow hole portion 25c, the solder piece 16a can be appropriately melted in the melting portion 25b.

  The tip 25 has a cylindrical abutting portion 25d at the lower end where the outer peripheral portion of the central cylindrical tube extends further beyond the melting portion 25b. The contact portion 25d is a portion that comes into contact with a land 9a provided on the substrate 9 to be soldered.

  Thus, in a state where the contact surface portion 25g at the tip of the contact portion 25d is in contact with the land 9a of the printed circuit board 9, the contact portion 25d and the melted portion 25b are inserted through the board hole 9c surrounded by the land 9a. The surrounding space 25h surrounding the terminal 9d of the electronic component from around and from above is formed.

  The tip 25 has a smoke discharge side hole 25f that penetrates the tube in the horizontal direction in the vicinity of the melted portion 25b below the central cylindrical tube. The smoke discharge side hole 25f discharges smoke and the like generated by the solder pieces 16a melted in the melting portion 25b inside the iron tip 25 to the outside through the smoke discharge side hole 25f.

  The tip 25 has an air purge side hole 25e that penetrates the tube in the horizontal direction near the receiving port 25a above the central cylindrical tube. The air purge side hole 25e is configured to send air or the like from the outside into the inside of the tip 25 through the air purge side hole 25e.

  Thereby, the air pressure inside the tip 25 can be increased. Then, by the press with the air having the increased air pressure inside the tip 25, the discharge of smoke and the like through the smoke discharge side hole 25f can be promoted.

≪Soldering operation≫
FIG. 5A is also an explanatory diagram for explaining a state immediately after the solder piece 16 a is supplied into the iron tip 25.

  The proximity / separation direction moving unit 6 (not shown) gradually brings the tip 25 closer to the printed circuit board 9, and connects the tip contact surface 25 g of the tip 25 d of the tip 25 to the land of the printed circuit board 9. 9a.

The tip 25 heated by the heater 23 heats the land 9a by heat conduction from the contact portion 25d.
The tip 25 heated by the heater 23 simultaneously has the contact portion 25d and the melting portion 25b surrounding the terminal 9d of the electronic component inserted through the substrate hole 9c surrounded by the land 9a from the periphery and from above. Heating is performed by heat and convection of air in the surrounding space 25h.

  The solder piece 16a is dropped into the inside of the soldering tip 25 from the dropout part 34a of the soldering piece dropping tube 34, falls naturally into the melting part 25b below the soldering tip 25, and flows out on the inner surface of the melting part 25b. It is held near the hole 25c.

FIG. 5B is an explanatory diagram for explaining how the solder pieces 16a in the soldering tip 25 are melted by a longitudinal sectional end view.
The solder piece 16a is heated to a high temperature in the melting portion 25b and melts. The melted solder piece 16a is rounded by the surface tension and moves onto the outflow hole 25c to block the outflow hole 25c.

When the temperature of the melted solder piece 16a is further increased by heating, the solder piece 16a projects downward from the outflow hole 25c by capillary action and comes into contact with the terminal 9d.
The terminal 9d is further heated by heat conduction from the melting portion 25b via the melted solder piece 16a in contact.

FIG. 5 (C) is an explanatory view for explaining a state in which the melted solder piece 16a flows to the terminal 9d and the land 9a to be soldered by a longitudinal end view.
When the terminal 9d is heated to a sufficiently high temperature, the molten solder piece 16a in contact with the terminal 9d starts flowing on the surface of the terminal 9d.
Then, the flowing and melted solder piece 16a enters the gap 9c between the terminal 9d and the land 9a by capillary action, and forms a fillet on the back surface side of the land 9a.

  With the above configuration and operation, the inner diameter of the outflow hole portion 25c provided in the melting portion 25b at the tip of the tip 25 is formed smaller than the outer dimensions of the unmelted solder piece 16a dropped into the melting portion 25b. ing. As a result, the solder piece 16a is heated while being held (contacted) in the melting portion 25b, stays in the melting portion 25b for a while after being melted, reaches a sufficiently high temperature, and reaches the outlet hole portion 25c. , And then flows out to the soldering target below the outflow hole 25c. For this reason, the wettability of the melted solder piece 16a to the soldering object is improved, and a beautiful fillet shape can be formed.

  Further, since the contact surface 25g of the tip 25 is in contact with the land 9a of the printed circuit board 9, the land 9a is heated while the solder piece 16a is being melted. For this reason, the outflowing molten solder contacts the land 9a and passes through the board hole 9c (through hole) satisfactorily, and beautiful and good soldering including the back fillet can be realized.

  Further, since the solder piece drop tube 34 and the tip 25 are separated from each other, the heat of the solder tip 25 is prevented from being directly transmitted to the solder piece drop tube 34. Further, the storage and discharge section 33n for temporarily storing the solder pieces 16a is arranged with a distance of the solder piece drop tube 34 from the tip 25. Therefore, it is possible to prevent the inside of the storage / discharge unit 33n or the shutter 33i from being heated and the solder piece 16a of the storage / discharge unit 33n from melting.

  In addition, the solder piece supply unit 30 holds the solder piece 16a held on the shutter 33i of the solder piece storage tank 33 with the longitudinal direction in the horizontal direction in the outflow hole portion of the melting portion 25b on the vertical line in the posture as it is. It is dropped by free fall toward 25c. That is, the solder piece 16a is cut downward by the piston 33b and stored in the storing / discharging portion 33n, the shutter 33i is opened to drop the solder piece 16a downward into the solder piece dropping tube 34, and the tip 25 Falls downward in the passage 25k. In this way, it is efficient to move the solder piece 16a in a straight line from cutting to soldering, and it is possible to reliably supply the solder piece 16a to the melting portion 25b.

  Further, a tapered surface 25i is provided in the receiving portion 25a of the iron tip 25, and an outer surface 34b of the dropout portion 34a of the solder piece dropping tube 34 is also a tapered surface, and the inclination thereof is substantially the same. Therefore, the solder piece dropping tube 34 and the soldering tip 25 can be made as close as possible while keeping the heat of the soldering tip 25 away from the solder piece dropping tube 34. Therefore, the solder piece 16a can be reliably supplied from the solder drop tube 34 to the tip 25, and a problem due to heat transmission can be prevented.

  Further, since the inner diameter of the passage 25k is longer than the maximum length of the solder piece 16a (longer than the length of the solder piece 16a in the axial direction), the solder piece 16a can be dropped freely without being caught in the middle. In addition, the inner diameter of the outflow hole portion 25c provided in the melting portion 25b at the tip of the tip 25 is formed smaller than the outer dimensions of the unmelted solder piece 16a dropped into the melting portion 25b. Thus, the solder piece 16a can be reliably heated near the outflow hole 25c.

  In addition, since the inside diameter (diameter) of the passage 25k is longer than the maximum length of the solder piece 16a, the inside diameter of the drop port 34a of the solder piece drop tube 34 does not have to be so small, and the solder piece 16a is caught by the drop port 34a. Can be prevented. In other words, if the diameter of the solder 16a is reduced in the direction toward the long distance in the approaching / separating direction from the solder at the drop opening 34a, the solder piece 16a may be in an oblique state near the drop opening 34a and may be caught. However, since the opening at the lower end of the dropout portion 34a can have a diameter close to or greater than the maximum length (length in the longitudinal direction) of the solder piece 16a, the solder piece 16a is physically placed in a state of being obliquely hooked. Therefore, the solder piece 16a can be reliably supplied to the passage 25k of the tip 25.

  Further, since the tapered surface 25m is provided on the inner surface of the melting portion 25b on the tip side of the tip 25, the solder piece 16a before melting can be brought closer to the outflow hole portion 25c, and the molten solder piece 16a Can be reliably poured out of the outflow hole 25c.

FIG. 6 is a vertical end view of the soldering tip 125 of the soldering apparatus according to the second embodiment.
Hereinafter, only differences from the embodiment will be described, and other description will be omitted. Further, the same name is used for a part having the same function as the part in the embodiment.

  The tip 125 has an inverted truncated cone shape in which the lower end contact portion 125d extends downward from the melting portion 125b, and the diameter of the upper base connected to the melting portion 125b is the center of the tip 125. Is smaller than the outer diameter of the cylindrical tube. The contact portion 125d has a cylindrical surrounding space 125h in which the outflow hole portion 25c of the melting portion 125b extends downward as it is on the center line.

  Thus, in a state where the contact surface portion (lower bottom of the inverted truncated cone) 125g at the tip of the contact portion 125d is in contact with the land 109a, the contact portion 125d moves upward through the substrate hole 109c surrounded by the land 109a. The terminal 109d of the electronic component inserted straight into the surrounding space 125h is surrounded from the periphery.

  With the above configuration and operation, the shape of the contact portion 125d of the tip 125 is changed according to the shape of the land 109a of the printed circuit board 109 to be soldered and the shape of the terminal 109d of the electronic component. The same function as the soldering device can be exhibited. That is, the molten solder piece 16a can be stably supplied to the soldering object heated by the iron tip 125. The soldering apparatus according to the second embodiment can also provide the same operation and effect as the first embodiment.

  Note that the present invention is not limited to this embodiment, and can be various other embodiments.

  For example, the storage / discharge unit 33n may include a container-shaped storage unit with an open top and a rotation mechanism such as a motor for rotating the storage unit by 180 degrees. In this case, the cut solder pieces 16a are stored in the storage part whose upper surface is open, and the storage part is rotated by 180 degrees about a substantially horizontal axis to change the posture so that the upper opening is positioned on the lower surface. The solder piece 16a thus dropped can be supplied to the solder drop tube 34 by dropping it downward.

  Further, the passage 25k of the tip 25 and the inside passage of the solder piece dropping tube 34 are not limited to the columnar shape, but may be formed in an appropriate shape such as a square pillar shape or a hexagonal pillar shape. Also in this case, the solder pieces 16a can be passed without any delay.

  INDUSTRIAL APPLICATION This invention can be utilized for the industry of a soldering apparatus.

DESCRIPTION OF SYMBOLS 1 ... Soldering device 6 ... Proximity and separation direction moving unit 7 ... Conveying direction moving unit 8 ... Conveying width direction moving unit 9 ... Printed circuit board 16 ... Thread solder 16a ... Solder piece 23 ... Heater 25 ... Iron tip 25b ... Melting part 25c ... Outflow hole 25d ... Contact part 25i ... Tapered surface 25j ... Central part 25k ... Path 25m ... Tapered surface 30 ... Solder piece supply part 32a ... Roller 33 ... Thread solder cutting part 33h ... Fixed cutting blade 33l ... Movable cutting blade 33n ... Storing and discharging part 34. Solder piece discharging pipe 34a.

Claims (7)

A soldering device that performs soldering on a soldering object,
Solder piece supply means for supplying solder pieces,
A tip having a passage into which the solder piece supplied by the solder piece supply means enters,
Relative distance changing means for changing the relative distance in the approach and separation direction between the solder outflow tip of the tip and the soldering target,
Heating means for heating and melting the solder pieces in the passage of the tip by heating the tip,
The passage has a solder piece supply-side large-diameter portion having a diameter larger than the maximum length of the solder piece supplied from the solder piece supply unit, and the inside of the vicinity of the solder outflow end portion, which is larger than the maximum length of the solder piece. A soldering device having a small diameter portion with a small diameter. The passage of the tip is
The soldering apparatus according to claim 1, wherein a tapered surface is provided near the tip end of the solder outflow, the diameter gradually decreasing from the large diameter portion on the solder piece supply side to the small diameter portion. The solder piece supply means,
Yarn solder feeding means for feeding the yarn solder from the tip end,
Cutting means for cutting the tip end of the thread solder fed by the thread solder feeding means to a predetermined length to form the solder piece;
Guide means for guiding the solder piece cut by the cutting means to the tip,
The guiding means includes a discharge port for discharging a solder piece to the solder piece supply-side large-diameter portion of the passage of the tip,
The soldering apparatus according to claim 1, wherein the tip is separated from the tip. The guiding means,
Having a diameter-reducing portion that reduces in diameter toward the vicinity of the discharge port,
4. The soldering apparatus according to claim 3, wherein an inner diameter of the discharge port is formed to be equal to or smaller than an inner diameter of the solder piece supply-side large-diameter portion of the tip. The tip has an inducing means-side tapered surface in which the inner diameter is further expanded from the solder piece supply-side large-diameter portion at the end of the inducing means,
5. The soldering apparatus according to claim 4, wherein the inclination of the outer surface of the reduced diameter portion of the guiding means and the inclination of the tapering surface on the guiding means side are substantially the same. The thread solder feeding means is configured to feed the tip end of the thread solder toward the cutting means in a direction substantially perpendicular to the approach / separation direction,
The cutting means, a support portion for supporting the thread solder from which the tip end is fed, and a cutting tool located on a side farther than the guide means with respect to the tip end, in parallel with the approaching and separating direction. The tip is cut from the thread solder by relative movement to form the solder piece,
A storage release means for temporarily storing the solder pieces cut by the cutting means and releasing the temporarily stored solder pieces to the guidance means at an appropriate timing, on the guide means side of the cutting means. The soldering apparatus according to any one of items 3 to 5. A soldering method of performing soldering with a soldering device that performs soldering on a soldering target,
A step of changing the relative distance in the approach and separation direction between the solder outflow tip of the tip and the soldering target by relative distance changing means,
Putting the solder piece into the passage of the tip by solder piece supply means,
Heating the soldering tip by heating means to heat and melt the solder pieces in the passage of the tip,
The passage has a solder piece supply-side large-diameter portion having a diameter larger than the maximum length of the solder piece supplied from the solder piece supply means, and the inside of the vicinity of the solder outflow end portion has a size larger than the maximum length of the solder piece. Having a small diameter portion with a small diameter,
A soldering method for heating and melting the solder piece near the small diameter portion.

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