WO2008023461A1

WO2008023461A1 - Soldering iron, method for manufacturing electronic apparatus by using it, amd manufacturing equipment

Info

Publication number: WO2008023461A1
Application number: PCT/JP2007/000884
Authority: WO
Inventors: Mitsuo Ebisawa
Original assignee: Mitsuo Ebisawa
Priority date: 2006-08-21
Filing date: 2007-08-20
Publication date: 2008-02-28
Also published as: JPWO2008023461A1; JP5184359B2; JP2013077840A; JP5529983B2

Abstract

A soldering iron which prevents scattering of flux and is not likely to clog, and a process of soldering an electronic apparatus in which the amount of solder fed at a time for soldering is made constant and soldering is performed well. The soldering iron is characterized by comprising a cutting blade (52) which can advance/retreat in one direction depending on an output from a drive source and has a solder holding hole penetrating in the direction intersecting the advance/retreat direction perpendicularly to allow thread solder to pass, a receiving blade (51) having a recess for guiding the cutting blade in the advance/retreat direction and provided, on one side thereof, with a solder supply hole which is aligned with the through hole during retreat of the cutting blade and, on the same side or the opposite side thereof, with a solder discharge hole which is aligned with the through hole during advance of the cutting blade, a tube (9) that is disposed such that the radial position is aligned with the solder discharge hole and that has the opposite open ends, the inside diameter permitting passage of thread solder, and at least an inner surface at the tip portion being formed of a material exhibiting low wettability to solder, and a heating means (8) for melting solder at the tip thereof.

Description

Specification

Technical field of soldering iron, method of manufacturing electronic equipment using the same, and manufacturing apparatus

TECHNICAL FIELD [0001] The present invention relates to a solder iron for melting and soldering thread solder, a method of manufacturing an electronic device using the solder iron, and a manufacturing apparatus.

Background art

[0002] As a hook for soldering a land of a wiring board and terminals such as metal pins and wires, one having a cylindrical tip is known (Patent Document 1). By supplying thread solder into the cylinder with the pin protruding from the land surrounded by the inner peripheral surface of the cylinder and heating the cylinder, the molten solder is evenly wrapped around the pins and molten solder to unnecessary parts. It is intended to prevent the scattering of flux. The inner surface of the cylinder that is in contact with the molten solder has improved wettability to the solder due to soldering.

In order to achieve the same purpose, it is also known that the basket has a mortar shape in the upper half and a cylindrical shape in the lower half (Patent Document 2), and the inner surface is made of a solder repellent material. ing. Then, in the previous step, the thread solder is cut into a predetermined length to make a solder piece, which is melted in the mortar part, and then poured into the cylindrical part surrounding the pin by its own weight, so that the pin and the land are soldered. The

Patent Document 1: Japanese Patent Laid-Open No. 11-2 4 5 0 2 9

Patent Document 2: Japanese Patent Laid-Open No. 2 0 0 1 _ 2 0 3 4 4 6

Disclosure of the invention

Problems to be solved by the invention

[0003] When the soldering iron described in Patent Document 1 is used, the cylinder is easily clogged by the solder attached to the inner surface of the cylinder, and the solder does not solidify from the air holes formed on the side surface of the cylinder to prevent it. I need to blow air inside, which is cumbersome. In addition, in the soldering iron described in Patent Document 1, the tip of the yarn yarn fed continuously from the solder reel is heated through the cylinder and melted simultaneously with the unmelted remaining portion. To be separated. Therefore, the amount of solder used for one soldering is not constant, and defects such as insufficient bonding or short-circuiting between terminals may occur in manufactured electronic devices.

[0004] Next, when the soldering iron described in Patent Document 2 is used, the flux is vaporized while the solder is melted in the mortar portion, and the flux is not supplied to the lands or pins. For this reason, the molten solder is poured without removing the land pin oxide film and dirt, and the solder may not adhere to the land pin.

Therefore, the first object of the present invention is to provide a soldering iron that prevents the flux from scattering and is less prone to clogging. A second problem is to provide an electronic device manufacturing apparatus that can perform soldering satisfactorily while keeping the amount of solder used for one soldering constant in a soldering process of an electronic device. is there. The third issue is to provide high-quality electronic equipment.

Means for solving the problem

[0005] In order to solve the problem, the soldering iron of the present invention is

At least the inner surface of the tip is formed of a material that is difficult to wet with solder, has an inner diameter through which thread solder can pass, and has a cylinder that is open at both ends. According to this soldering iron, since both ends of the cylinder are open, the cylinder stands on the land, and thread solder cut to a length necessary for one soldering is inserted from the rear end of the cylinder. If so, it will drop to the tip and touch the land or pin. Then, by melting the solder at the tip, the mating terminal such as a pin or wire is joined with a certain amount of solder. Since the soldering part is surrounded by a cylinder, the molten solder and flux do not scatter around, and the molten solder wraps around evenly. In addition, since the inner surface of the tip of the tube is formed of a material that is difficult to wet with solder, the solder hardly adheres to the inner surface of the tube, and clogging of the tube can be suppressed. As a result, the quantitativeness of the supplied solder is maintained and the appearance after joining is finished cleanly.

[0006] The tube may be provided with a vent hole penetrating from the outer peripheral surface to the inner peripheral surface.

Nitrogen or other inert gas is sent into the cylinder from this vent to prevent solder and terminal oxidation. This is because

In addition, when an electronic component such as a choke coil in which a heat-meltable coated magnet wire (for example, polyurethane-coated copper wire) is wound around a metal pin is connected to a substrate, the wire, the metal pin, and the land The three parties can be soldered at the same time. This is because the flux eluted from the solder stays in the cylinder without dissipating, purifying the metal surface and making it easy to get wet with the solder. Therefore, there is no need to solder the wire and the metal pin in advance, which is excellent in that the process can be shortened.

In this specification, a land means a terminal on an electronic device in a broad sense including a pad that does not have a pin insertion hole.

As a heating means for melting the solder, a sheathed heater wound in a coil shape on the outer peripheral surface of the cylinder is preferable. This is because the cylinder is heated directly, so that it rises quickly and is highly efficient and safe.

Therefore, an appropriate method for manufacturing an electronic device using this soldering iron is as follows:

At least the inner surface of the tip is formed of a material that is difficult to wet with solder, and thread solder can pass through it.

A soldering iron having a cylinder having an inner diameter and having both ends opened, and a heating means for melting the solder at the tip,

The tip of the cylinder is brought close to the terminal of the electronic device,

Insert the solder piece obtained by cutting the thread solder into the length necessary for one soldering, and drop it into the cylinder from the rear end of the cylinder.

The solder piece in the cylinder is melted at the tip by the heating means.

[0008] The inner diameter of the cylinder is preferably smaller than the length of the solder piece. As a result, after dropping, the solder piece stands up in the cylinder, so that the distance between the outer peripheral surface of the solder piece and the inner peripheral surface of the cylinder is the shortest, and the solder piece quickly and uniformly melts at the same time. This is because the flux is purified by the flux and the solder is easily attached. Of course, the inner diameter of the cylinder is larger than the outer diameter of the solder piece, and a pin is inserted. The case is larger than the outer diameter of the pin.

[0009] Further, an apparatus suitable for this manufacturing method is:

A solder holding hole, which consists of a cutting blade and a receiving blade, capable of receiving a yarn half of a predetermined length is formed in at least one of them, and is inserted into the solder holding hole by being relatively displaced while rubbing against each other. A cutter unit that cuts off the threaded solder,

At least the inner surface of the tip is formed of a material that is difficult to wet with solder, has an inner diameter through which thread solder can pass,

Heating means for melting solder at the tip;

It is characterized by providing.

In this apparatus, the cylinder and the heating means correspond to the soldering iron. The thread solder cut by the cutter becomes a piece of solder of the length necessary for one soldering.

[0010] In one specific configuration of the cutter unit, the cutting blade can advance and retreat in one direction according to the output of a drive source, and the solder holding hole penetrates in a direction perpendicular to the advancing and retreating direction of the cutting blade. Formed. In this case, the receiving blade has a recess that guides the cutting blade in the advancing and retracting direction, and a solder supply hole that is aligned with the through hole is formed on one side when the cutting blade is retracted, and the cutting blade is cut on the same side or the opposite side. A solder discharge hole is formed in alignment with the through hole when the blade advances. The cylinder is placed so that a radial position coincides with the solder discharge hole.

[001 1] According to this configuration, when the thread solder is supplied from the supply hole to the holding hole and the cutting blade is advanced relative to the receiving blade, a shearing force acts on the fitting portion of the two blades, and the thread solder is Cut off. The obtained solder piece comes out of the discharge hole, enters the cylinder, falls by its own weight, and comes into contact with the land facing the lower end surface of the cylinder. Then, it is heated and melted and joined as described above. The solder used for one soldering is a fixed length solder piece determined by the length supplied to the holding hole. The length of the thread solder supplied to the holding hole can be controlled by the number of rotations of the solder feed roller.

[0012] Preferably, the receiving blade has an introduction hole for receiving a gas or a blanker at a position facing the solder discharge hole. Burrs and bends on the solder pieces obtained by cutting This is because the solder piece can be discharged by blowing compressed gas from the introduction hole into the holding hole or inserting a plunger. The inner diameters of the solder holding hole and the cylinder are preferably smaller than the axial length of the solder holding hole. This is because the solder piece can be sent to the lower end of the cylinder with a small resistance in the axial state.

[0013] In another specific configuration of the cutter unit, the cutting blade is capable of rotating in accordance with an output of a driving source, and the solder holding hole penetrates a straight line perpendicular to the rotation axis of the cutting blade. Formed on the cutting blade. In this case, the receiving blade has a bearing portion that holds the cutting blade, and a solder supply hole that is aligned with the solder holding hole at a phase where the cutting blade is located on one side is formed on the other side. A solder discharge hole that aligns with the solder holding hole during the phase is formed. The cylinder is placed so that its radial position coincides with the solder discharge hole.

[0014] According to this configuration, when the cutting blade is rotated in a state where the thread solder is supplied to the holding hole, the shearing force acts on the fitting portion of both the blades and the thread solder is cut. The obtained solder piece comes out of the discharge hole, enters the cylinder, falls by its own weight, and comes into contact with the land facing the lower end surface of the cylinder. And it heat-melts and joining is performed as above-mentioned. The solder used for one soldering is a fixed length solder piece determined by the length supplied to the holding hole. Similar to the above configuration, the receiving blade may have an introduction hole for receiving gas or a plunger at a position facing the solder discharge hole.

[0015] In still another specific configuration of the cutter unit, the cutting blade can advance and retreat in one direction according to the output of the drive source, and the receiving blade has a plane that guides the cutting blade in the advancing and retreating direction. Have. In this case, the solder holding hole is formed in the receiving blade so as to penetrate in a direction perpendicular to the advancing and retreating direction of the cutting blade. The cylinder is placed such that its radial position coincides with the solder holding hole.

According to this configuration, when the thread solder is supplied to the holding hole and the cutting blade is advanced with respect to the receiving blade, the shearing force acts on the fitting portion of both blades to cut the thread solder. The obtained solder piece comes out of the holding hole, enters the cylinder, falls by its own weight, and comes into contact with the land facing the lower end surface of the cylinder. And it is heated and melted and joined as described above It is. Solder used for one soldering is a piece of solder of a certain length determined by the length supplied to the holding hole.

[001 6] Preferably, the basic configuration of the manufacturing apparatus further includes a shutter that opens and closes a rear end of the cylinder. Without the shutter, the flux evaporated when the solder melts may enter the solder piece passage located in the previous process of the cylinder, adhere to the passage, and block the passage. Therefore, by closing the shutter while the solder pieces in the cylinder are melted, the passage in the previous process of the cylinder can always be kept clean.

The invention's effect

[001 7] According to the present invention, the solder supplied to the joint is a fixed-length piece of solder, and it hardly adheres to the ridge after joining and does not scatter around. Therefore, the amount of solder consumed for joining is small. It is constant. Therefore, an excellent quality electronic device can be provided.

Brief Description of Drawings

FIG. 1 is a perspective view showing a manufacturing apparatus according to Embodiment 1.

FIG. 2 is a vertical sectional view showing a cutter unit used in the apparatus, where (a) is when the cutting blade is retracted and (b) is when it is moving forward.

FIG. 3 is a perspective view showing a soldering iron and a wiring board used in the apparatus.

[Fig. 4] A vertical cross-sectional view showing the soldering iron and the wiring board, (a) before solder melting

(B) is after melting.

FIG. 5 is a perspective view showing a modification of the heating block in the first embodiment.

FIG. 6 is a cross-sectional view showing various combinations of cylinders and heating blocks in the first embodiment.

FIG. 7 is a perspective view showing another example of the heating means in the first embodiment.

[FIG. 8] (a) is a sectional view showing the relationship between the cylinder and the cleaner, and (b) is a perspective view showing a modification of the cylinder.

FIG. 9 is a perspective view showing another method of joining with the manufacturing apparatus of Embodiment 1.

FIG. 10 shows a manufacturing apparatus according to Embodiment 2, wherein (a) is a perspective view and (b) is a cross-sectional view. FIG. 11 is a cross-sectional view of a main part showing a manufacturing apparatus according to Embodiment 3.

FIG. 12 is a cross-sectional view of a main part showing a manufacturing apparatus according to Embodiment 4.

FIG. 13 is a perspective view showing a main part of a manufacturing apparatus according to Embodiment 5.

FIG. 14 is a cross-sectional view of a main part showing a manufacturing apparatus according to Embodiment 5.

FIG. 15 is a perspective view of relevant parts showing a manufacturing apparatus according to Embodiment 6.

FIG. 16 is a cross-sectional view showing the main parts of a manufacturing apparatus according to Embodiment 6.

FIG. 17 is a cross-sectional view showing the main parts of a manufacturing apparatus according to Embodiment 7. Explanation of symbols

1, 1 1 Electronic equipment manufacturing equipment

2 Body

2 a

2b wall

2 c Connecting plate

2d bracket

2 e jig

2 X, 2 y, 2 z

3 Solder reel

4 Feed roller

5 force turn

6 Sensor

7 Guide tube

8 1 8, 28 Heating block

9 1 9, 29, 39,

4 2 Fixed intermittent feeding device

5 1 Receiving blade

5 2 Cutting blade

5 1 a recess

5 1 b Solder supply hole 5 1 C gas inlet

5 1 d Solder discharge hole

5 2 a Solder holding hole

F and J solder pieces

BEST MODE FOR CARRYING OUT THE INVENTION

[0020] One Embodiment 1

A manufacturing apparatus according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing the electronic device manufacturing apparatus of the embodiment, and Fig. 2 is a vertical sectional view showing a cutter unit used in the apparatus (( _a ) is when the cutting blade is retracted, and (b) is when it is moving forward. 3 is a perspective view showing the soldering iron and the wiring board used in the apparatus, FIG. 4 is a vertical cross-sectional view of the soldering iron and the wiring board ((a) is before solder melting, (b) is After melting).

[0021] The manufacturing apparatus 1 joins a land and a pin with a thread solder W in a state where a metal pin is inserted into a land on a wiring board S of an electronic device, and is perpendicular to the flat base 2a and the base 2a. A main body 2 comprising a wall 2 b fixed to the main body 2 is provided. A rail 2 X extending in the X direction is laid on the base 2 a, and a rail 2 y extending in the Y direction is fixed on the rail 2 X so as to be movable along the rail 2 X. On the rail 2 y, a jig 2 e for placing the wiring board S is fixed so as to be movable in the X and Y directions. A rail 2 z extending in the Z direction is attached to the wall 2 b. A connecting plate 2 c is fixed to the rail 2 z so as to be movable along the rail 2 z. Each movement is made by a driving source (not shown) such as a motor.

[0022] Solder roll 3, feed roller 4, cutter unit 5, sensor 6 and guide tube 7 are attached to connecting plate 2c in order from above via bracket 2d which is U-shaped in plan view. ing.

As shown in FIG. 2 (a), the cutter unit 5 includes a receiving blade 51 having a recess 51a sandwiched between upper and lower surfaces parallel to each other, and a cutting blade 5 slidably fitted in the recess 51a. 2 and a hydraulic cylinder 5 3 for driving the cutting blade 5 2. The output rod of cylinder 53 is moved forward and backward by fluid pressure. A supply hole 5 1 b and an introduction hole 51 c that penetrate from the upper surface to the recess 51 a are formed in the upper part of the receiving blade 51. The supply hole 5 1 b is positioned directly below the feed roller 4 and has an inner diameter through which the thread solder W can pass without resistance. The introduction hole 51c is located farther from the cylinder 53 than the supply hole 51b and has substantially the same inner diameter as the supply hole 51b. In the lower part of the receiving blade 51, the horizontal position is the same as that of the introduction hole 51 c, and a discharge hole 51 d having substantially the same inner diameter as the supply hole 51 b is formed. The cutting blade 52 has a holding hole 5 2 a that penetrates in the vertical direction and has substantially the same inner diameter as the supply hole 51 b. The length of the cutting blade 5 2 and the stroke of the cylinder 5 3 are such that the position of the holding hole 5 2 a coincides with the supply hole 5 1 b when the cutting blade 52 is retracted, and the introduction hole 5 1 c and the discharge hole 5 when moving forward Designed to match 1d. The guide pipe 7 is located immediately below the discharge hole 51d. The sensor 6 includes a light emitting element 6 a provided on one side with a guide tube 7 interposed therebetween, and a light receiving element 6 b provided on the other side. The guide tube 7 is made of a transparent material or has a transparent window at least at the height of the sensor 6.

[0024] Further, a heating block 8 made of a high thermal conductivity material such as copper is attached to the connection plate 2c below the bracket 2d. As shown in FIG. 3, the heating block 8 is composed of a thin-walled portion 8a on the fixed end side and a thick-walled portion 8b on the free end side that is connected to the fixed-end-side thin-walled portion 8a. A number of holes are formed to insulate between 8 b. A heater 8c and a cylinder 9 are embedded in the thick part 8b. The cylinder 9 has substantially the same inner diameter as the holding hole 52a, penetrates up and down and protrudes downward from the heating block 8.The outer diameter of the lower end is the same to avoid interference with surrounding parts. I am a dad. The tube 9 may be any tube as long as it can withstand a temperature of about 60 ° C. and at least the inner peripheral surface of the lower end portion is less wettable to the solder. It may be a combination of members. In the case of a single material, ceramic or non-solder wettable metal such as stainless steel or titanium is desirable. In the case of ceramics, high thermal conductivity ceramics such as aluminum nitride and silicon carbide are particularly desirable. [0025] The diameter of the thread solder W, the holding hole 5 2a, and the dimensions of the cylinder 9 may be appropriately determined according to the amount of solder necessary for one soldering. For example, the outer diameter of the pin is 1 mm. , The diameter of the thread solder W is 1.2 mm, the inner diameter of the holding hole 5 2 a and the cylinder 9 is 3 mm, the length of the cut piece (solder piece) of the thread solder W is 6 mm, the holding hole 5 2 By setting the length of a to 7 mm, the solder piece stands up in the cylinder 9 while adjoining the pin, and the entire solder piece is quickly and evenly heated. Therefore, when the thread solder W is a eutectic solder, soldering can be performed satisfactorily if the lower end temperature of the tube 9 is 3500 ° C.

The procedure for soldering using the manufacturing apparatus 1 is as follows.

Insert metal pins into the land P of the wiring board S, and place the wiring board S on the jig 2 e. Then, the jig 2 e is moved together with the wiring board S so that the land is located directly below the cylinder 9. Lower the connecting plate 2c until the lower end of the tube 9 is positioned in the immediate vicinity of the land. As shown in FIG. 2 (a), the cutting blade 52 is retracted until the holding hole 52a coincides with the supply hole 51b, and the heater 8c is energized. Land P and pin T are preheated by this radiant heat. Rotate the feed roller 4 and pull out the thread solder W from the solder reel 3 and pass it through the supply hole 5 1 b. When the thread solder W enters the holding hole 5 2 a and is fed a predetermined length, the feed roller 4 is stopped. The feed amount of the thread solder W is controlled by the rotation speed of the feed roller 4. In this state, the cylinder 53 is driven to advance the cutting blade 52.

Then, as shown in FIG. 2 (b), a shearing force acts between the cutting blade 5 2 and the receiving blade 5 1, so that the thread solder W is cut into a predetermined length and becomes a solder piece F. It moves to the discharge hole 5 1 d together with the holding hole 5 2 a. Here, air is blown onto the holding hole 5 2 a through the hose 5 1 e connected to the introduction hole 5 1 c. The solder piece F falls into the guide tube 7 through the discharge hole 51d, enters the cylinder 9 and moves onto the land P as shown in Fig. 4 (a). On the way, the sensor 6 detects the passage of the solder piece F, and based on the signal, the feed roller is moved at the place where the cutting blade 5 2 is retracted until the holding hole 5 2 a coincides with the supply hole 5 1 b. 4 rotates again, and the subsequent thread solder W is supplied to the holding hole 5 1 b. As shown in Fig. 4 (b), the solder piece F reaching the land P The heat of c becomes molten solder F 'and the land P and pin T are joined. Since the molten solder F 'is surrounded by the cylinder 9, it does not scatter around. In addition, since the inner peripheral surface of the lower end of the cylinder 9 is made of a material that is difficult to wet with solder, the entire amount of the solder piece F is consumed for joining the metal pin T and the land P, and the appearance after joining is finished cleanly. Smoke generated by the combustion of flux during melting is sucked from the suction pipe 8d. Thereafter, the connecting plate 2 c rises and the tube 9 moves away from the wiring board S. Then, the jig 2 e moves in the X direction or the ZY direction along with the wiring board S, and starts the bonding process between the next land and the metal pin.

In the apparatus 1, unlike the above, the heater 8c may be embedded in the heating block so as to be parallel to the tube 9. In this case, as shown in FIG. 5 as a perspective view, the thickness around the heater 8 c in the heating block 18 may be further increased. Various combinations of the cylinder and the heating block can be applied. For example, as shown in FIG. 6 (a), the cylinder 19 may be integrally formed with the heating block. In FIG. 6 (b), the cylinder 29 is integrally formed with the heating block, and the upper inner peripheral surface of the cylinder 29 is formed as a taper extending upward. In FIG. 6 (c), the tube 39 is integrally formed with the heating block, and a coating 39a made of a material that is difficult to wet with solder is formed on the inner peripheral surface of the tube 39. The coating 39a may be formed only on the inner peripheral surface of the lower end. Fig. 6 (d) shows the case where the cylinder 9 is formed separately from the heating block 28 as in Fig. 4, but the heating block 28 protrudes from the periphery of the lower end of the cylinder 9 to the cylinder from the heating block 28. 9 The heat conduction to the lower end is improved. Fig. 6 (e) shows a case where a through-hole constituting a part of a cylinder is formed integrally with a heating block 38, and a short cylindrical tip 49 constituting the remainder of the cylinder is fitted to the lower end of the through-hole. It is. The heating block 38 can be molded from a high thermal conductivity material, and the short cylindrical chip 49 can be molded from a non-solder wettable heat resistant material.

[0029] As a heating means, instead of the cylinder 9 and the separate heater 8c, the cylinder 9 itself may be formed of a resistor or a ceramic embedded with a heating element, and the cylinder 9 may be directly energized. In addition, the cylinder 9 is formed of a magnetic material, and the cylinder 9 is added by applying a high frequency power from a high frequency power source 48 8 d by winding a coil 48 c around the outer periphery as shown in FIG. May be heated. Alternatively, as shown in FIG. 7B, a sheath heater 58c may be wound instead of the coil 48c. In either case, the cylinder 9 is heated directly, so that the start-up is fast and efficient. Furthermore, the preheating of the land P is performed using radiant heat. However, depending on the properties of the land P and the thread solder, the cylinder 9 may be brought into contact with the land P and the pin T and may be performed using the conduction heat.

[0030] As shown in Fig. 1, a tubular cleaner 2f having an outer diameter smaller than the inner diameter of the tube 9 is attached to one side of the jig 2e with the tip facing upward. Then, when the inner surface of the cylinder 9 is dirty, the jig 2 e is moved so that the cleaner _ 2 f is located immediately below the cylinder 9 and the cleaner _ 2 f is inserted into the cylinder 9 as shown in FIG. 8 (a). It is preferable to clean the inner surface of the cylinder 9 by suction. It is preferable that 2 g of brush is planted on the outer peripheral surface of the cleaner-2 f.

As shown in FIG. 8B as a perspective view, the cylinder 9 may have a lower end surface slightly cut in the axial direction. This avoids interference with adjacent pins T nearby.

[0031] FIG. 9 shows a method of joining the coated conductor terminal U instead of the rod-shaped metal terminal to the land P in parallel with the main surface of the wiring board S, (a) is a perspective view, and (b) to (d ) Is a cross-sectional view of lead. When the terminal U from which the coating resin at the tip has been peeled is placed on the land P, the cylinder 9 descends, and the solder piece F falls to become molten solder F ′. Ascending the tube 9 completes the joining.

[Embodiment 2]

A second embodiment of the manufacturing apparatus of the present invention is shown in FIG. 10 (a) as a perspective view, and in FIG. 10 (b) as a main part sectional view.

The manufacturing apparatus 11 is for soldering the lead L of the semiconductor package Q having the gull-wing type lead L to the land P of the wiring board S. Multiple leads L extend from the side of the package Q and must be soldered at the same time. Therefore, in the heating block 8, cylinders 59 having the same number of parallel through holes as the number of leads L (4 in the figure) are embedded, and the same number of solder pieces F are simultaneously dropped and melted. It is. [0033] Embodiment 3—

A third embodiment of the manufacturing apparatus of the present invention is shown in FIG. In this embodiment, the receiving blade 51 and the cutting blade 52 in Embodiment 1 are used not as a cutter unit but as a mediation unit. A supply pipe 41 that is concentric with the supply hole 51b is disposed on the receiving blade 51, and a fixed quantity skip device 42 is attached to the side surface. The fixed intermittent feeding device 4 2 has blocking rods 4 2 a and 4 2 b on the upper and lower sides, and these advance and retract alternately in the supply pipe 41.

In this embodiment, the thread solder W is cut in advance into a solder piece J having a predetermined length shorter than the length of the holding hole 52 a by a cutter unit (not shown). Then, as shown in Fig. 11 (a), a large number of solder pieces J descend in their own weight in their own row. When the n-th solder piece J enters the holding hole 5 2 a, the upper blocking rod 4 2 a moves forward and presses the n + 1-th solder piece J to stand by. Next, as shown in FIG. 11 (b), the cutting blade 52 advances to move the nth solder piece J onto the discharge hole 51d. Thereafter, it is dropped onto the solder land P through the guide tube 7 and melted in the same manner as in the first embodiment. In parallel, the lower blocking rod 4 2 b moves forward, and instead the upper blocking rod 4 2 a moves backward, and the n + 1st solder piece J is placed on the lower blocking opening 4 2 b. When the cutting blade 5 2 is retracted, the lower blocking rod 4 2 b is retracted, and the n + 1 first solder piece J is inserted into the holding hole 5 2 a.

[0035] One embodiment 4

A fourth embodiment of the manufacturing apparatus of the present invention is shown in FIG. In this embodiment, while the solder piece F is being melted, the cylinder 9 is moved horizontally within a range overlapping the terminal in plan view. That is, first, as shown in FIG. 12 (a), the solder piece F is dropped into the tube 9 and melted. Then, as shown in FIGS. 12 (b) and 12 (c), the cylinder 9 is moved in one direction (left direction in the drawing) and then moved in the opposite direction (same right direction). As a result, the molten solder spreads to both ends of the land P. More preferably, it is also moved in the front-rear direction. When the cylinder 9 is retracted upward, the solder spreads over the entire land P as shown in FIG. 12 (d). No Since the cylinder 9 only needs to move relative to the land P, the land P is moved horizontally in the configuration of the apparatus 1 in which the cylinder 9 is fixed. Further, the cylinder 9 may be revolved around the pin T by a turning mechanism (not shown) as shown in FIG. 12 (e). In addition, the code | symbol M in a figure shows a wire.

[Embodiment 5]

A fifth embodiment of the manufacturing apparatus of the present invention is shown in FIG. 13 as a perspective view of relevant parts and as a sectional view of relevant parts in FIG. In this embodiment, in order to allow the chip F cut off by the cutter unit to fall directly into the cylinder, the guide pipe 7 in the first embodiment is omitted and the cylinder is arranged directly under the cutter unit. The configuration of the cutter unit and the provision of a shutter are different from the first embodiment. Hereinafter, differences from the first embodiment will be described in detail.

[0037] Cutter unit 15 has a cylindrical shape, and a solder holding hole penetrating on the diameter line.

1 5 1 and a receiving blade 1 5 2 having a bearing portion that rotatably holds the cutting blade 1 5 1. In order to supply thread solder W to the solder holding hole 1 5 a on the side of the receiving blade 1 5 2, a supply hole 1 5 b that matches the holding hole 1 5 a is formed during the phase of the cutting blade 1 5 1. Has been. Also, at the lower part of the receiving blade 15 2, there is a discharge hole 15 c that coincides with the holding hole 15 a at another phase of the cutting blade 15 51 to discharge the solder pieces in the holding hole 15 a. Is formed. A plunger introduction hole 15 e for receiving the plunger 15 d is formed in the upper part facing the discharge hole 15 c. Plunger introduction hole 15 e is branched upward, and the branch path functions as gas introduction hole 15 f.

[0038] The shirter 1 7 is composed of a cylinder 1 7 a fixed to the receiving blade 1 5 2, a rod 1 7 b, and a shutter plate 1 7 c, and the shutter _ 1 as the rod 1 7 b reciprocates. 7 c opens and closes the rear end of tube 9 by moving back and forth horizontally between discharge hole 15 c and tube 9.

The thread solder W sent by the feed roller 4 enters the holding hole 15 a through the supply hole 15 b (FIG. 14 (a)). In this state, when the cutting blade 15 51 is rotated, a shearing force is applied to cut the thread solder W (FIG. 14 (b)). And shirt 1 7 is opened, the cutting blade 1 5 1 is stopped at a phase where the holding hole 1 5 a coincides with the discharge hole 1 5 c, and gas is introduced. As a result, the solder piece F exits from the discharge hole 15 c and enters the cylinder 9 (FIG. 14 (c)), falls by its own weight, and contacts the land P facing the lower end surface of the cylinder 9. If the solder piece F is difficult to drop due to gas introduction, lower the plunger 15 d and push down the solder piece F. Thereafter, the shutter 17 is closed, and the solder piece F is heated and melted (FIG. 14 (d)).

[0039] Since the shirter 17 is closed, the flux volatilized from the molten solder purifies the surfaces of the land P and the pincho without adhering to the discharge hole 15c and the holding hole 15a. Therefore, the land P and the pin T are joined well. The solder used for one soldering is a fixed length solder piece determined by the length supplied to the holding hole 15a.

[0040] One Embodiment 6—

A sixth embodiment of the manufacturing apparatus of the present invention is shown in FIG. 15 as a perspective view of relevant parts and as a sectional view of relevant parts in FIG. Also in this embodiment, in order to allow the chip F cut off by the cutter unit to fall directly into the cylinder, the guide pipe 7 in the first embodiment is omitted, and the cylinder is arranged directly under the cutter unit. The configuration of the cutter unit and the provision of a shutter are different from the first embodiment. Hereinafter, differences from the first embodiment will be described in detail.

[0041] The cutter unit 25 includes a receiving blade 2 52 having a flat upper surface, and a cutting blade 2 5 1 that slides on the upper surface of the receiving blade 2 52 by driving the cylinder 25 c. The receiving blade 25 2 is formed with a solder holding hole 25 a penetrating in the vertical direction. In the cutting blade 2 51, the solder supply hole 25 b and the plunger introduction hole 25 e that penetrate vertically are aligned with the holding hole 25 a when the cutting blade 2 51 is advanced and retracted, respectively. Is formed. Further, the plunger introduction hole 25 e is branched upward, and the branch path functions as the gas introduction hole 25 f. As in the fifth embodiment, the shutter 17 is fixed to the receiving blade 2 52 and opens and closes the rear end of the tube 9. In this apparatus, the holding hole 25 a also serves as a discharge hole. Therefore, the configuration is simple. Moreover, soldering is performed as well as in the fifth embodiment. [0042] One Embodiment 7—

This is a modification of the sixth embodiment, in which a vent 9a is provided on one side of the tube 9, as shown in a cross-sectional view of the main part in FIG. By sending an inert gas such as nitrogen into the cylinder 9 from the air hole 9a, the solder and terminals are prevented from being oxidized, and the soldering is performed in a satisfactory layer.

Example

[0043] A cylinder 9 having an inner diameter of 2.5 mm and a solder piece F made of eutectic solder and having a diameter of 1.2 mm and a length of 6 mm is formed of an aluminum nitride sintered body having the shape shown in FIG. Got ready. Then, when the solder piece F was supplied into the cylinder 9 and soldering was performed while maintaining the lower end temperature of the cylinder 9 at 3500 ° C., all of the solder piece F adhered to the pins and lands. This was repeated several tens of times. Solder did not adhere to the inner surface of the tip of the tube 9, and solder clogging did not occur.

For comparison, soldering was similarly performed using a copper tube of the same shape and the same size as the tube 9, but most of the solder pieces F adhered to the inner surface of the tube, and soldered to the lands and pins. Was not supplied enough, and the pin and the land were not joined. Also, solder clogging occurred in the third soldering.

Claims

The scope of the claims

[1] Solder characterized in that at least the inner surface of the tip is formed of a material that is difficult to wet with solder, has an inner diameter through which thread solder can pass, and has a cylinder with both ends open.

[2] The soldering iron according to [1], wherein the material that is difficult to wet with solder is ceramic, stainless steel, or titanium.

[3] The rice bran according to claim 1 or 2, wherein the formation of the material that is difficult to wet with solder is that the material is covered with the material that is difficult to wet with respect to the solder.

[4] The soldering iron according to any one of claims 1 to 3, wherein the cylinder has a vent hole penetrating from the outer peripheral surface to the inner peripheral surface.

[5] The method according to claim 1, further comprising heating means for melting the solder at the tip.

4. The soldering iron according to any one of 4 above.

6. The soldering iron according to claim 5, wherein the heating means is a sheathed heater wound in a coil shape on the outer peripheral surface of the cylinder.

[7] At least the inner surface of the tip portion is formed of a material that is difficult to wet with solder, has an inner diameter through which the thread solder can pass, and has a cylinder that is open at both ends, and for melting the solder at the tip portion Prepare heating means and

A method of manufacturing an electronic device, characterized in that a solder piece in a cylinder is melted at the tip by the heating means.

8. The manufacturing method according to claim 7, wherein the cylinder is relatively moved horizontally within a range overlapping the terminal in plan view while the solder piece is melted.

[9] A plurality of the terminals, a combination of a land formed on the substrate and a metal pin inserted into the land, or a land formed on the substrate, a metal pin inserted into the land, and a winding around the metal pin That are in combination with a metal wire The manufacturing method according to claim 7.

10. The manufacturing method according to claim 9, wherein the inner diameter of the cylinder is smaller than the length of the solder piece.

[1 1] A solder holding hole that is formed of a cutting blade and a receiving blade and that can accept a threaded yarn of a predetermined length is formed in at least one of them, and is soldered by being displaced relatively while rubbing each other. A cutter unit that cuts off the thread solder inserted into the hole,

Heating means for melting solder at the tip;

An electronic apparatus manufacturing apparatus comprising:

[12] The cutting blade can be advanced and retracted in one direction according to the output of the drive source, and the solder holding hole is formed in the cutting blade so as to penetrate in a direction perpendicular to the advancing and retracting direction of the cutting blade.

The receiving blade has a recess that guides the cutting blade in the advancing and retracting direction, and a solder supply hole that is aligned with the solder holding hole when the cutting blade is retracted is formed on one side, and the cutting blade is on the same side or the opposite side. The manufacturing apparatus according to claim 11, wherein a solder discharge hole that is aligned with the solder holding hole is formed during advancement, and the cylinder is placed so that a radial position coincides with the solder discharge hole.

13. The apparatus according to claim 12, wherein the receiving blade has an introduction hole for receiving a gas or a plunger at a position facing the solder discharge hole.

[14] The cutting blade is capable of rotating in accordance with the output of the drive source, and the solder holding hole is formed in the cutting blade through a diameter line perpendicular to the rotation axis of the cutting blade,

The receiving blade has a bearing portion for holding the cutting blade, and a solder supply hole that is aligned with the solder holding hole is formed on one side when the cutting blade is in a phase, and the other side is on another phase. A solder discharge hole that is aligned with the solder holding hole is formed,

12. The manufacturing apparatus according to claim 11, wherein the cylinder is placed so that a radial position thereof coincides with the solder discharge hole.

[15] The receiving blade receives gas or a plunger at a position facing the solder discharge hole. The apparatus according to claim 14, further comprising an introduction hole to be inserted.

[16] The cutting blade can advance and retreat in one direction according to the output of the drive source,

The receiving blade has a flat surface for guiding the cutting blade in the advancing and retreating direction, and the solder holding hole is formed in the receiving blade so as to penetrate in a direction perpendicular to the advancing and retreating direction of the cutting blade;

The manufacturing apparatus according to claim 11, wherein the cylinder is placed so that a radial position thereof coincides with the solder holding hole.

17. The apparatus according to claim 16, wherein the cutting blade has an introduction hole that receives a gas or a plunger at a position that can coincide with the solder holding hole.

18. The manufacturing apparatus according to claim 11, further comprising a shutter that opens and closes a rear end of the cylinder.