JP2017074619A - Tip of soldering iron, and soldering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tip of a soldering iron capable of reducing the cleaning and replacing frequencies, and a soldering iron using the tip.SOLUTION: A tip 5 of a soldering iron comprises: a cylinder 50 having openings 511 and 512 at the front end and the rear end, and a solder hole 51 extending through in the axial direction; and a melting region 510 at an intermediate portion of the solder hole 51, for melting a solder piece Wh. An inert gas is fed to the solder hole 51 at least on the tip side of the melting region 510.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a solder iron tip for soldering a component and a soldering apparatus using the tip.

  In recent years, many electric devices are equipped with electronic circuits on which electronic components are mounted. In the electronic circuit, a terminal or wire of the electronic component is inserted into a through hole (through hole) formed in the wiring board, and a tip portion thereof is soldered to a wiring pattern (land) formed around the through hole. By doing so, mounting and fixing of electronic components and wires to the wiring board are performed. For example, Patent Document 1 discloses a soldering apparatus that performs the soldering accurately and efficiently.

  The electronic device manufacturing apparatus described in Patent Literature 1 includes a cylindrical tip. The electronic device manufacturing apparatus supplies thread solder into the cylinder in a state where the tip of a terminal (or wire) protruding from the through hole is surrounded by the inner surface of the cylinder at the tip. Then, by heating the tip, the solder is melted and the melted solder (molten solder) is evenly supplied around the terminals to solder the terminals and the lands. By using such an electronic device manufacturing apparatus, it is possible to suppress adhesion of molten solder and / or flux to unnecessary portions.

Japanese Patent No. 5184359

  In an apparatus for manufacturing an electronic device provided with a cylindrical tip, solder flux-derived deposits, that is, flux fumes may be deposited on the inner surface of the tip of the tip by repeating soldering. When the amount of accumulated flux fumes increases, it becomes difficult to supply the thread solder. For this reason, in an apparatus for manufacturing an electronic device having a cylindrical tip, the solder inner surface is cleaned to remove flux fumes accumulated on the inner surface of the tube after a certain number of times or a predetermined time of soldering. I do.

  For cleaning the inner surface of the tube, the brush is inserted into the tube, the brush is rotated and / or moved in the axial direction, and the inner surface of the tube is rubbed with the brush for cleaning. When the inner surface of the cylinder is rubbed with a brush, the flux fume may exhibit a polishing action. In this case, the inner surface of the cylinder is scraped and the inner diameter is increased. When the inner diameter of the cylinder inner surface is increased, it becomes difficult to attach solder to an accurate position on the substrate, and the soldering accuracy is lowered.

  In a conventional electronic device manufacturing apparatus, in order to suppress such a decrease in soldering accuracy, the tip is replaced every time cleaning is performed a certain number of times. Since time is required, the stop time of the soldering operation becomes long, and the efficiency of manufacturing the electronic device is lowered. Further, when the frequency of tip replacement increases, the consumption of the tip increases, and the cost of manufacturing the electronic device increases accordingly.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a solder iron tip and a soldering apparatus using the tip that reduce the frequency of cleaning and replacement and enable an accurate soldering operation over a long period of time. To do.

  In order to achieve the above object, the present invention provides a soldering iron tip that is detachably attached to a soldering iron having a heat source, and has a cylinder having an opening at the front and rear ends and a solder hole penetrating in the axial direction. The intermediate portion of the solder hole is provided with a melting region for melting a solder piece supplied from the opening at the rear end, and the inert gas is supplied to at least the front end side of the melting region of the solder hole. A gas supply unit is provided.

  According to this configuration, supplying the inert gas around the molten solder prevents the molten solder from coming into contact with oxygen in the air. Thereby, the oxidation of the flux contained in the solder is suppressed, and the generation of flux fume is suppressed.

  Thereby, the frequency of the cleaning of the tip and the replacement of the tip can be reduced, and the soldering operation can be prevented from being stopped while it is required for the cleaning of the tip and the replacement of the tip. From the above, while having a simple configuration, it is possible to suppress the occurrence of soldering defects without reducing productivity.

  The said structure WHEREIN: The said gas supply part may be provided in the front end side rather than the said fusion | melting area | region, and may be provided with the gas supply hole penetrated from the said solder hole to the outer surface of the said cylinder.

  In the above configuration, the gas supply unit is provided on the rear end side with respect to the melting region, the gas outflow hole penetrating from the solder hole to the outer surface of the cylinder, and provided on the front end side with respect to the melting region, You may have the gas supply hole penetrated to the outer surface of the said cylinder from the solder hole, and the bypass piping provided in the exterior of the said cylinder and connecting the said gas outflow hole and the said gas supply hole.

  In the above-described configuration, the gas supply unit includes an outflow recess provided on the inner surface on the rear end side of the melting region, a supply recess provided on the inner surface on the tip side of the melting region, and the thickness of the cylinder. You may have the bypass path formed inside and connecting the said inflow recessed part and the said outflow recessed part.

  In the above configuration, the gas supply unit is formed in an intermediate portion of the cylinder, reaches a front end side from the melting region of the solder hole, and has a small diameter portion having a smaller outer diameter than the rear end side and the front end side in the axial direction. And an outer tube that airtightly covers the small diameter portion, a gas outflow hole that is provided on the rear end side from the melting region of the small diameter portion and penetrates from the solder hole to the outer surface of the cylinder, and the small diameter portion A gas supply hole may be provided that is provided on the tip side of the melting region and penetrates from the solder hole to the outer surface of the cylinder.

  In the above configuration, the gas supply unit includes a slit that extends from the solder hole to the outer surface of the cylinder and extends in the axial direction from the rear end side to the front end side of the melting region, and a lid that hermetically seals the outside of the slit. You may have a member. Here, the lid member may be transparent.

  In order to achieve the above object, the present invention provides a soldering iron tip that is detachably attached to a soldering iron having a heat source, and has a cylinder having solder holes that have openings at the front and rear ends and penetrate in the axial direction. A melting region for melting a solder piece supplied from a rear end opening is provided in an intermediate portion of the solder hole, and the solder hole has a cross section through which the supplied solder piece can pass. And a second hole connected to a distal end side of the first hole. The second hole is formed of solder that flows down while the second hole is melted. You may have the cross-sectional shape which an inert gas can pass outside.

  In the above configuration, the second hole has a cross-sectional shape in which a first region that is a cross-section having the same shape as a projection surface in the flow direction of the solder melted in the melting region is accommodated inside, and the first hole The cross section of the region is circular and can contact the cross section of the second hole at at least two points. The cross sectional shape of the second hole is inscribed by the circular cross section of the first region. Sometimes, the angle formed by the tangents at two adjacent contact points may be smaller than the contact angle of the molten solder.

  The said structure WHEREIN: You may have a cross-sectional shape which piled up the circular shape larger than the cross section of the said solder piece, and the cross-sectional shape of the said 2nd hole.

  The said structure WHEREIN: As for the part adjacent to the said 2nd hole part of a said 1st hole part, the cross section by the side of a front end may be small, and the inner surface may incline.

  In the above configuration, the second hole portion may be provided with a portion having a cross section larger than a projection surface in the flow-down direction of the solder melted in the melting region on the tip side.

  The said structure WHEREIN: The said 2nd hole part may have an inclined surface where a cross section becomes small as it approaches the said fusion | melting area | region.

  In order to achieve the above object, the present invention provides a soldering iron tip that is detachably attached to a soldering iron having a heat source, and has a cylinder having solder holes that have openings at the front and rear ends and penetrate in the axial direction. A melting region for melting a solder piece supplied from an opening at a rear end is provided in an intermediate portion of the solder hole, and the solder hole has at least one groove provided on an inner surface and extending in the axial direction. You may have.

  The said structure WHEREIN: The contact part with small external shape is provided in the front-end | tip of the said cylinder, The said contact part may overlap with the said groove | channel, and the slit connected to an outer surface from the said solder hole may be formed.

  ADVANTAGE OF THE INVENTION According to this invention, the soldering iron tip which can reduce the frequency of cleaning and replacement | exchange, and the soldering iron using this ironing tip can be provided.

It is a perspective view of an example of the soldering apparatus concerning the present invention. It is sectional drawing cut | disconnected by the C1-C1 line | wire of the soldering apparatus shown in FIG. It is a perspective view of the tip concerning this invention. It is sectional drawing which cut | disconnected the tip shown in FIG. 3 in the surface along a central axis. It is a perspective view of the tip concerning this invention. It is sectional drawing which cut | disconnected the tip shown in FIG. 5 in the surface along a central axis. It is a perspective view of the tip concerning this invention. It is sectional drawing which cut | disconnected the hook tip shown in FIG. 7 in the surface along a central axis. It is a disassembled perspective view of the hook point concerning this invention. FIG. 10 is a cross-sectional view of the tip shown in FIG. 9 cut along a plane along the central axis. It is a disassembled perspective view of the hook point concerning this invention. It is sectional drawing which cut | disconnected the tip shown in FIG. 11 in the surface along a central axis. It is a disassembled perspective view of the hook point concerning this invention. It is sectional drawing which cut | disconnected the hook point shown in FIG. 12 in the surface along a central axis. It is a top view of the tip concerning this invention. It is sectional drawing which cut | disconnected the tip shown in FIG. 15 by the C2-C2 line. It is sectional drawing which cut | disconnected the tip shown in FIG. 15 by the C3-C3 line. It is an enlarged view of the other example of the 2nd hole. It is a top view of the tip concerning this invention. It is sectional drawing which cut | disconnected the tip shown in FIG. 19 by the C4-C4 line. It is sectional drawing which cut | disconnected the tip shown in FIG. 19 by the C5-C5 line. It is a top view of the tip concerning this invention. It is sectional drawing which cut | disconnected the tip shown in FIG. 22 by the C6-C6 line. It is sectional drawing which cut | disconnected the tip shown in FIG. 22 by the C7-C7 line | wire. It is a top view of the tip concerning this invention. It is sectional drawing which cut | disconnected the tip shown in FIG. 25 by the C8-C8 line. It is sectional drawing which cut | disconnected the hook tip shown in FIG. 25 by the C9-C9 line. It is a perspective view of the tip concerning this invention. It is sectional drawing which cut | disconnected the tip shown in FIG. 28 by the C10-C10 line. It is sectional drawing which cut | disconnected the tip shown in FIG. 28 by the C11-C11 line. It is sectional drawing which cut | disconnected the hook point concerning this invention by the plane containing an axis | shaft. It is sectional drawing which cut | disconnected the hook point concerning this invention in the surface orthogonal to the cut surface of FIG. 31 including an axis | shaft. It is a perspective view of the tip concerning this invention. It is sectional drawing which cut | disconnected the tip shown in FIG. 33 in the surface which follows a central axis. It is a top view of the tip concerning this invention. FIG. 36 is a cross-sectional view of the tip shown in FIG. 35 cut along a plane along the central axis. It is a perspective view of the tip concerning this invention. It is the fragmentary perspective view seen from the front end side of the heel shown in FIG. It is sectional drawing cut | disconnected along the axis | shaft of the heel shown in FIG. It is the fragmentary perspective view seen from the front end side of the hook point concerning this invention. It is sectional drawing cut | disconnected along the axis | shaft of the tip shown in FIG. It is a disassembled perspective view of the hook point concerning this invention. It is sectional drawing which cut | disconnected the tip shown in FIG. 42 in the surface along a central axis. It is a disassembled perspective view of the hook point concerning this invention. It is sectional drawing which cut | disconnected the tip shown in FIG. 44 in the surface along a central axis.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 1 is a perspective view of an example of a soldering apparatus according to the present invention. 2 is a cross-sectional view taken along line C1-C1 of the soldering apparatus shown in FIG. In FIG. 1, a part of the housing and the support portion 1 is cut to display the inside of the soldering apparatus. 1 and 2 both show a state before the thread solder is cut into solder pieces.

  The soldering apparatus A supplies the molten solder to the land Ld of the wiring board Bd attached to the jig Gj and the terminal Nd of the electronic component Ep arranged on the wiring board Bd, and performs connection fixing. As shown in FIG. 1, the soldering apparatus A includes a support portion 1, a cutter unit 2, a drive mechanism 3, a heater unit 4 (tip tip holding portion), a solder tip end 5, and a solder feed mechanism 6. The heater unit 4 and the solder iron tip 5 form a solder iron. In the following description, for the sake of convenience, the tip of the soldering iron may be simply referred to as a tip.

  The support unit 1 includes a support wall 11 and a sliding guide 12. The support wall 11 is a plate-like wall body erected in the vertical direction. The support wall 11 plays a role as a support member of the soldering apparatus A. In the following description, the X direction, the Y direction, and the Z direction may be described. In that case, FIG. 1 is used as a reference. That is, in FIG. 1, the vertical direction along the support wall 11 is the Z direction, the direction along the support wall 11 perpendicular to the Z direction is the X direction, and the direction perpendicular to the X direction and the Z direction is the Y direction. In FIG. 1, the sliding guide 12 is fixed to the support wall 11.

  The cutter unit 2 is for cutting the thread solder W fed by the solder feeding mechanism 6 into solder pieces Wh having a predetermined length. The cutter unit 2 includes a cutter upper blade 21, a cutter lower blade 22, and a pusher pin 23 (shown in FIG. 2). The cutter lower blade 22 is fixed to the support wall 11 together with the sliding guide 12. The cutter upper blade 21 is disposed above the cutter lower blade 22 so as to be slidable in the X direction. The movement direction of the cutter upper blade 21 is regulated (guided) by the sliding guide 12. Further, the movement of the cutter upper blade 21 in the Z direction is regulated by the sliding guide 12. The pusher pin 23 is disposed inside a pin hole 212 described later of the cutter upper blade 21. The pusher pin 23 is moved in the vertical direction (direction intersecting the sliding direction of the cutter upper blade 21) by a second actuator 32 (described later) of the drive mechanism 3 (see FIG. 2).

  The cutter lower blade 22 includes a lower blade hole 221 and a gas inflow pipe 222. The lower blade hole 221 is a through-hole penetrating the cutter lower blade 22 in the Z direction, and thread solder W penetrating the upper blade hole 211 is inserted therein. The edge part of the upper end of the lower blade hole 221 is formed in a cutting blade shape. The gas inflow pipe 222 is a pipe through which the lower blade hole 221 inert gas flows into the lower blade hole 221. The gas inflow pipe 222 communicates with the lower blade hole 221 from the side surface of the cutter lower blade 22. A gas pipe Gp1 for supplying an inert gas is connected to the outside of the gas inflow pipe 222.

  Here, the inert gas is used to suppress the participation of molten solder that is a target for sharing the gas. That is, examples of the inert gas that suppresses the object from coming into contact with oxygen by supplying the inert gas include nitrogen gas, argon gas, helium gas, and carbon dioxide.

  The cutter upper blade 21 includes an upper blade hole 211 and a pin hole 212. The upper blade hole 211 is a through-hole penetrating the cutter upper blade 21 in the Z direction, and the thread solder W fed from the solder feeding mechanism 6 is inserted therein. The lower edge of the upper blade hole 211 is formed in a cutting edge shape. The pin hole 212 is provided at a position shifted in the X direction with respect to the upper blade hole 211, and penetrates the cutter upper blade 21 in the Z direction, and the pusher pin 23 is inserted therein.

  The cutter upper blade 21 is slidable in the X direction, and the upper blade hole 211 and the pin hole 212 are provided side by side in the X direction. The cutter upper blade 21 slides between a position where the upper blade hole 211 and the lower blade hole 221 overlap vertically and a position where the pin hole 212 and the lower blade hole 221 overlap vertically. Then, when the thread solder W is sent from the solder feeding mechanism 6 in a state where the upper blade hole 211 of the cutter upper blade 21 and the lower blade hole 221 of the cutter lower blade 22 overlap in the Z direction, the upper blade hole 211 is moved. The passed thread solder W is inserted into the lower blade hole 221. With the thread solder W inserted in the lower blade hole 221, the thread solder W is cut by the cutting blades of the upper blade hole 211 and the lower blade hole 221 by sliding the cutter upper blade 21 in the X direction. The

  Since the cutter upper blade 21 continues sliding after cutting the thread solder W, the lower blade hole 221 and the pin hole 212 overlap in the Z direction. When the pusher pin 23 protrudes downward in the Z direction from the pin hole 212 in a state where the pin hole 212 overlaps the lower blade hole 221, a part of the pusher pin 23 is inserted into the lower blade hole 221. When a solder piece (described later) obtained by cutting the thread solder remains at the entrance of the lower blade hole 221, the tip of the pusher pin 23 pushes the solder piece, and the solder piece falls.

  The drive mechanism 3 includes a first actuator 31 and a second actuator 32. The first actuator 31 is a drive source using fluid pressure (here, air pressure), and includes a cylinder 311 and a piston rod 312. The cylinder 311 is fixed to the cutter lower blade 22. The piston rod 312 is accommodated so as to be slidable in the axial direction of the cylinder 311, and the tip projects out of the cylinder 311. The tip of the piston rod 312 is fixed to the cutter upper blade 21.

  Air of a predetermined pressure is supplied to the cylinder 311, and the piston rod 312 is pushed out from the cylinder 311 or accommodated using air pressure. In the first actuator 31, the axis of the cylinder 311 is arranged in parallel with the X axis, and the piston rod 312 expands and contracts in the X direction by adjusting the air pressure. The cutter upper blade 21 slides in the X direction by the expansion and contraction of the piston rod 312.

  In the soldering apparatus A shown in FIG. 2, when the piston rod 312 of the first actuator 31 protrudes most from the cylinder 311, the cutter upper blade 21 is at the left end in the drawing, and the upper blade hole 211 is connected to the lower blade hole 221. It is designed to overlap vertically. Although not shown, when the piston rod 312 is housed in the cylinder 311, the cutter upper blade 21 moves to the right end in the figure, and the pin hole 212 overlaps the lower blade hole 221 vertically.

  An inert gas is supplied to the lower blade hole 221 from the gas inflow pipe 222. When the lower blade hole 221 does not overlap with the upper blade hole 211 or the pin hole 212 in the Z direction, the upper end portion is covered with the cutter upper blade 21. Thereby, the inert gas is prevented from leaking from the upper end of the lower blade hole 221. In addition, it is preferable that the contact surface of the cutter upper blade 21 and the cutter lower blade 22 can smoothly slide and that the inert gas is less likely to leak from the upper end of the lower blade hole 221.

  The second actuator 32 has substantially the same configuration as the first actuator 31. That is, a cylinder 321 and a piston rod 322 are provided. The cylinder 321 is fixed to the cutter upper blade 21. The central axis of the cylinder 321 is parallel to the Z axis. The piston rod 322 is accommodated so as to be slidable in the axial direction of the cylinder 321, and the tip projects out of the cylinder 321. A pusher pin 23 is fixed to the tip of the piston rod 322.

  The cylinder 321 of the second actuator 32 is fixed to the cutter upper blade 21 so that the piston rod 322 overlaps the pin hole 212 in the Z direction. In other words, the pusher pin 23 slides in the pin hole 212 in the axial direction by the expansion and contraction of the piston rod 322. Then, when the second actuator 32 moves and the pin hole 212 and the lower blade hole 221 overlap each other, the pusher pin 23 is inserted into the lower blade hole 221 by extending the piston rod 322. Further, the pusher pin 23 is removed from the lower blade hole 221 by accommodating the piston rod 322 in the cylinder 321. The operation of the piston rod 322 is performed by air pressure as in the first actuator 31.

  The first actuator 31 slides the cutter upper blade 21, and the second actuator 32 slides the pusher pin 23. When the first actuator 31 is driven in a state where the pusher pin 23 is inserted into the lower blade hole 221, the pusher pin 23, the cutter upper blade 21 and the cutter lower blade 22 are damaged. Therefore, the second actuator 32 operates in synchronization with the first actuator 31 and operates to extend the piston rod 322 when the pin hole 212 overlaps the lower blade hole 221 in the Z direction.

  The driving of the first actuator 31 and the second actuator 32 is not limited to air pressure, and fluid such as oil pressure may be used. Furthermore, it is not limited to the one using a fluid, and may be one using electric power such as a motor or a solenoid. In addition, as described above, since the first actuator 31 and the second actuator 32 are driven synchronously, they are provided with an interlocking mechanism using cams, links, gears, etc., and are driven by one actuator. You may make it do.

  Next, the solder feeding mechanism 6 that supplies the thread solder W to the cutter unit 2 will be described. The solder feeding mechanism 6 supplies the thread solder W. The solder feed mechanism 6 includes a pair of feed rollers 61 and a guide tube 62. The pair of feed rollers 61 are rotatably attached to the support wall 11. The pair of feed rollers 61 feeds the thread solder downward by rotating across the side surface of the thread solder W. The pair of feed rollers 61 are biased toward each other, and the thread solder W is sandwiched by the biasing force. The length of the thread solder W fed out is measured (determined) by the rotation angle (number of rotations) of the feed roller 61.

  The guide tube 62 is a tube body that can be elastically deformed, and its upper end is disposed in the vicinity of a portion of the feed roller 61 where the thread solder W is fed out. The lower end of the guide tube 62 is provided so as to communicate with the upper blade hole 211 of the cutter upper blade 21. The lower end of the guide tube 62 moves following the sliding of the cutter upper blade 21, and the guide tube 62 has a length that is not excessively pulled or stretched within the range in which the cutter upper blade 21 slides. And has a shape.

  The heater unit 4 is a heating device that heats the tip 5 to a temperature at which the solder piece Wh obtained by cutting the thread solder W is melted. The heater unit 4 is fixed to the lower part of the cutter lower blade 22. The heater unit 4 includes a heater 41, a heater block 42, and a heater block fixing plate 43.

  The heater block 42 has a cylindrical shape, and the heater block 42 is provided with a concave portion 421 having a circular cross section for attaching the tip 5 to an end (tip) in the axial direction. The heater block 42 is provided with a solder supply hole 422 that penetrates from the center of the bottom of the recess 421 to the opposite side. The heater block 42 is fixed to the heater block fixing plate 43.

  The heater block fixing plate 43 is fixed to the lower surface of the cutter lower blade 22. The fixing hole 430 which is a through-hole provided in the flat plate-like main body portion is provided. The heater block 42 is fixed to the cutter lower blade 22 through the heater block fixing plate 43 by press-fitting the end of the heater block 42 opposite to the concave portion 421 into the fixing hole 430 of the heater block fixing plate 43. As shown in FIG. 2, the portion that is press-fitted into the fixing hole 430 of the heater block 42 has a small-diameter step, but the present invention is not limited to this, and may have a shape without a step. Good. Further, the fixing method of the heater block 42 is not limited to press-fitting. A fixing method that can fix the heater block 42 to the heater block fixing plate 43 accurately and firmly can be widely used.

  As shown in FIG. 2, in the soldering apparatus A, the heater block 42 is attached to the cutter lower blade 22 via the heater block fixing plate 43. Thereby, the lower blade hole 221 of the cutter lower blade 22 and the solder supply hole 422 of the heater block 42 communicate with each other. As described above, the inert gas is supplied to the lower blade hole 221 through the gas inflow hole 222. It is preferable that there is little leakage when this inert gas is supplied to the solder supply hole 422. Therefore, for example, a member that suppresses leakage of inert gas such as a gasket or a sealing material may be interposed.

  The heater 41 is wound around the outer periphery of the heater block 42. The heater 41 heats the heater block 42 by passing a current through the coil. The heater 41 is configured to heat the heater block 42 by induction heating. The heater 41 is not limited to heating by induction heating, and may be configured to directly convert electricity such as a heating wire into heat and heat the heater block 42.

  The tip 5 is detachably attached to the recess 421 at the tip of the heater block 42. The tip 5 is prevented from coming off by a member not shown. The tip 5 is transferred with heat from the heater 41 and melts the solder piece Wh with the heat. Therefore, the tip 5 is made of a material having high thermal conductivity, for example, a ceramic such as silicon carbide or aluminum nitride, or a metal such as tungsten.

  Here, the tip 5 which is the main part of the present invention will be described with reference to a new drawing. FIG. 3 is a perspective view of the tip according to the present invention. 4 is a cross-sectional view of the tip shown in FIG. 3 cut along a plane along the central axis. 3 shows a portion protruding from the heater block 42, and the tip 5 shown in FIG. 4 shows a state where soldering is performed. FIG. 4 also shows the substrate Bd, the land Ld provided on the surface of the substrate Bd, the electronic component Ep mounted on the substrate Bd, and the terminal Nd of the electronic component Ep.

  As shown in FIGS. 3 and 4, the tip 5 has a tube 50. The cylinder 50 has a solder hole 51 and a gas supply hole 52. As shown in FIG. 2, the cylinder 50 is a cylindrical member, and a solder hole 51 extending in the axial direction is provided in the central portion. The solder hole 51 is a through-hole having a rear end opening 511 and a front end opening 512. A portion between the opening 511 at the rear end of the solder hole 51 and the opening 512 at the tip has a melting region 510 for melting the solder piece Wh cut by the cutter unit 2.

  The gas supply hole 52 is a through hole penetrating from the solder hole 51 to the outer surface of the cylinder 50. The gas supply hole 52 is provided at the tip side of the melting region 510 in the axial direction of the cylinder 50, here, at a position close to the opening 512 at the tip. The gas supply hole 52 is connected to a gas pipe Gp2 through which an inert gas flows. The gas pipe Gp2 may be a pipe provided by branching from the gas pipe Gp1 connected to the gas inflow pipe 222, or may be a pipe provided in a separate system from the gas pipe Gp1. The same gas (inert gas) flows through the gas pipe Gp1 and the gas pipe Gp2.

  The cylinder 50 is in contact with the heater block 42 by being attached to the recess 421 of the heater block 42. As a result, the tip 5 is heated by the heater unit 4. At this time, the cylinder 50 is heated to a temperature at which at least the melting region 510 of the solder hole 51 melts the solder piece Wh (for example, about 220 ° C. or more in the case of lead-free solder).

  The tip 5 shown in FIG. 4 has a shape (tapered shape) having an inclination such that the cross-sectional area on the distal end side becomes small in the melting region 510. By having the taper shape, the solder piece Wh is guided to the center of the solder hole 51, the solder piece Wh is temporarily stopped, the solder piece Wh and the tip 5 (cylinder 50) are brought into contact, and the tip 5 (cylinder) 50) can be effectively transferred to the solder pieces Wh. The taper shape may be omitted when the solder piece Wh is melted when passing through the solder hole 51 or when the solder piece Wh stopped in contact with the terminal Nd can be reliably melted. For example, the solder hole Wh may be a through hole having a uniform cross section over the entire length, or may be a shape in which through holes having different diameters are directly connected. In the case of a structure in which through holes having different diameters are directly connected, a step is formed at the connection portion by making the tip side smaller than the rear end side, and the solder piece Wh can be temporarily stopped.

  The solder hole 51 communicates with the solder supply hole 422 by inserting and fixing the rear end of the cylinder 50 into the recess 421 of the heater block 42. At this time, a gasket, a sealing material, or the like may be interposed in order to suppress the inert gas flowing into the solder hole 51 from the solder supply hole 422 from leaking as much as possible.

  In the soldering apparatus A, the inert gas is supplied to the solder hole 51 of the tip 5 attached to the recess 421 of the heater block 42 together with the solder piece Wh from the opening 511 at the rear end. Further, the inert gas from the gas pipe Gp2 is directly supplied to the gas supply hole 52. Therefore, the inert gas directly flows into the vicinity of the opening 512 at the tip of the solder hole 51 through the gas supply hole 52.

  An operation of performing soldering by the soldering apparatus A will be described. When soldering is performed by the soldering apparatus A, the tip of the cylinder 50 is brought into contact with the land Ld of the wiring board Bd. The cylinder 50 surrounds the lands Ld and the terminals of the electronic component Ep. At this time, heat from the heater unit 4 is transmitted to the tip 5, and when the tip of the cylinder 50 comes into contact, the lands Ld and the terminals of the electronic component Ep are heated to a temperature suitable for soldering ( Preheated).

  The heater 41 may be controlled so as to always supply the same amount of heat to the tip 5, or the amount of heat is reduced while the terminals of the land Ld and the electronic component Ep are heated, and the solder piece Wh is placed on the tip 5. It may be controlled to increase the amount of heat supplied after reaching the solder hole 51. Thus, by changing the amount of heat supplied from the heater 41 to the tip 5 depending on the presence or absence of the thread solder W, it is possible to suppress the occurrence of problems due to overheating of the wiring board Bd and the electronic component Ep.

  Then, before and after the preheating by the tip 5, the solder feeding mechanism 6 feeds the thread solder W by a predetermined amount and cuts the thread solder W by the cutter unit 2. Thereby, a predetermined amount of the solder piece Wh is cut off from the thread solder W. Here, the predetermined amount is determined by the size (area, shape, etc.) of the member to be soldered, and is accurately measured by the pair of feed rollers 61. The solder piece Wh cut by the cutter unit 4 falls due to its own weight.

  The solder piece Wh may remain in the cutter unit 2 in some cases. Therefore, in the soldering apparatus A, the pusher pin 23 is inserted into the lower blade hole 221 and the solder piece Wh is reliably pushed down. The pusher pin 23 is inserted into the lower blade hole 221 every time the thread solder W is cut. However, the pusher pin 23 is attached only when a detection device such as a sensor is attached and the solder piece Wh remains. May be inserted into the lower blade hole 221.

  The solder piece Wh dropped from the lower blade hole 221 is supplied to the solder hole 51 through the solder supply hole 422. The tip 5 is heated by the heat from the heater unit 4, and the solder piece Wh is heated and melted in the melting region 510 of the solder hole 51. The melted solder piece Wh is supplied from the opening 512 at the tip to the land Ld and the terminal Nd, and the land Ld and the terminal Nd are connected (soldered).

  Depending on the size of the solder hole 51, when the solder piece Wh melts and becomes liquid, the solder hole 51 may be blocked by the solder piece Wh. In such a case, the solder hole 51 remains closed until the molten solder piece Wh flows out from the opening 512 at the tip. When the inert gas is supplied only from the opening 511 at the rear end of the solder hole 51, when the solder hole 51 is blocked, the inert gas does not reach the tip side of the molten solder piece Wh.

  Usually, the solder contains an additive called flux. When the flux melted by heat is combined with oxygen in the air, that is, when oxidized, it becomes a foreign substance called flux fume. Flux fume is a causative substance that degrades the tip 5 of the solder iron.

  In the tip 5 according to the present invention, even when the solder hole 51 is blocked by the molten solder piece Wh, the gas inlet hole 222 and the lower blade hole are formed on the rear end side of the solder piece Wh of the solder hole 51. Inert gas is supplied through the solder supply hole 422. Further, an inert gas is supplied to the tip side of the solder piece Wh through the gas supply hole 52. The molten solder piece Wh contains the molten flux, but by using the tip 5 according to the present invention, the molten solder piece Wh is surrounded by an inert gas until it flows out from the opening 512 at the tip. Contact with oxygen is suppressed. Therefore, generation of flux fume in the solder hole 51 is suppressed at the tip 5.

  Thereby, since the cleaning for dropping the adhering flux fume is unnecessary or the frequency can be reduced, the time for stopping the soldering operation for cleaning can be eliminated or reduced.

  In addition, since the tip 5 of the present invention suppresses the generation of flux fume in the solder hole 51, it is not necessary to replace the tip 5 or the replacement frequency can be reduced. Thereby, consumption of the tip can be reduced, and time for stopping the soldering operation for replacing the tip can be eliminated or reduced.

  From the above, by using the tip 5 according to the present invention, it is possible to improve the workability of the soldering operation by eliminating or reducing the frequency of cleaning and replacement of the tip. Further, it is possible to suppress the inner diameter from being changed due to the solder hole 51 being scraped or by the flux fume adhering to the inner surface by the cleaning operation. Thereby, by using the tip of the soldering iron according to the present invention, it is possible to perform accurate soldering for a long time.

(Second Embodiment)
Another example of the solder iron tip according to the present invention will be described with reference to the drawings. FIG. 5 is a perspective view of the tip according to the present invention. 6 is a cross-sectional view of the tip shown in FIG. 5 cut along a plane along the central axis. The tip 5A shown in FIGS. 5 and 6 has the same configuration as the tip 5 shown in FIGS. 3 and 4 except that the gas supply unit 53 is different. Therefore, in fact, the same part as the tip 5 of the tip 5A according to the present embodiment is given the same reference numeral, and detailed description thereof is omitted. Moreover, FIG. 5 has shown the part protruded from the heater block 42 similarly to FIG. FIG. 6 also shows the substrate Bd, the land Ld, the electronic component Ep, and the terminal Nd as in FIG.

  As shown in FIGS. 5 and 6, the tip 5 </ b> A includes a gas supply unit 53. The gas supply unit 53 includes a gas outflow hole 531, a gas supply hole 532, and a bypass pipe 533. The gas outflow hole 531 is a through-hole penetrating from the solder hole 51 to the outer surface. The gas outflow hole 531 is provided on the rear end side of the melting region 510 in the axial direction of the cylinder 50. The gas supply hole 532 is a through hole having the same configuration as that of the gas supply hole 52, and is provided at the tip side of the melting region 510 in the axial direction of the cylinder 50, here, at a position close to the opening 512 at the tip. ing. The bypass pipe 533 is a pipe body that can circulate an inert gas. Both ends of the bypass pipe 533 are connected to a gas outflow hole 531 and a gas supply hole 532, respectively.

  Like the tip 5, the tip 5 </ b> A is attached to the recess of the heater block 42, so that an inert gas is supplied from the solder supply hole 422 together with the solder piece Wh. As shown in FIG. 6, in the tip 5A, when the solder piece Wh is melted in the melting region 510 and the solder hole 51 is closed, the inert gas flowing from the opening 511 at the rear end, not shown, The gas is diverted to the gas outflow hole 531. Then, the gas flows out from the gas supply hole 532 to the vicinity of the opening 512 at the tip of the solder hole 51 through the bypass pipe 533. Even if the molten solder piece Wh closes the solder hole 51 on the front end side from the melting region 510, the inert gas can be supplied to the rear end side and the front end side of the molten solder piece Wh, so that contact with oxygen is suppressed. be able to. Thereby, in the tip 5A, generation | occurrence | production of the flux fume by the oxidation of a flux inside the solder hole 51 can be suppressed.

  Other features are the same as in the first embodiment.

  The tip 5A according to the present invention is configured to supply the inert gas supplied from the opening at the rear end to the vicinity of the opening 512 at the tip of the solder hole 51 using the gas supply unit 53. By using the tip 5A according to the present invention, it is possible to omit the gas pipe (the gas pipe Gp2 in FIGS. 1 and 2) for supplying the inert gas directly to the tip of the soldering apparatus A. is there. By using the tip 5A according to the present invention, the configuration of the soldering apparatus A can be simplified. The tip of the soldering iron described in the following embodiments is also used in a soldering apparatus in which a gas pipe for supplying an inert gas directly to the tip is omitted.

(Third embodiment)
Still another example of the solder iron tip according to the present invention will be described with reference to the drawings. FIG. 7 is a perspective view of the tip according to the present invention. FIG. 8 is a cross-sectional view of the tip shown in FIG. 7 cut along a plane along the central axis. The tip 5B shown in FIGS. 7 and 8 has the same configuration as the tip 5A shown in FIGS. 5 and 6 except that the gas supply unit 53b is different from the gas supply unit 53. Therefore, in fact, the same part as the tip 5A of the tip 5B according to the present embodiment is given the same reference numeral, and detailed description thereof is omitted. FIG. 7 shows a portion protruding from the heater block 42 as in FIG. FIG. 8 also shows the substrate Bd, the land Ld, the electronic component Ep, and the terminal Nd as in FIG.

  As shown in FIGS. 7 and 8, the tip 5B includes a gas supply unit 53b. The gas supply unit 53 b includes a gas outflow recess 534, a gas supply recess 535, a bypass path 536, and a lid member 537.

  The gas outflow recess 534 is provided on the rear end side of the melting region 510 in the axial direction of the cylinder 50, similarly to the gas outflow hole 531. The gas outflow recess 534 has a through hole penetrating from the solder hole 51 to the outer surface. A lid member 537 is airtightly attached to the opening on the outer surface side of the through hole. Similarly to the gas supply hole 532, the gas supply recess 535 is provided at the tip side of the melting region 510 in the axial direction of the cylinder 50, here, at a position close to the opening 512 at the tip. The gas supply recess 535 has a through hole penetrating from the solder hole 51 to the outer surface. A lid member 537 is airtightly attached to the opening on the outer surface side of the through hole.

  The bypass path 536 is a recessed hole formed in the thick part of the cylinder 50 and has an opening on the tip side. The bypass passage 536 passes between the opening of the gas supply recess 535 facing the solder hole 51 and the lid member 537. Further, the bypass passage 536 is connected between the opening facing the solder hole 51 of the gas outflow recess 534 and the lid member 537. The lid member 537 is a member for suppressing leakage of the inert gas from the gas outflow recess 534 and the gas supply recess 535 to the outside. The lid member 537 is press-fitted in order to hermetically close the openings on the outer surface side of the through holes of the gas outflow recess 534 and the gas supply recess 535, but is not limited thereto. For example, a screw-in type lid may be used.

  In the gas supply unit 53 b, the inert gas that has flowed in from the opening 511 at the rear end (not shown) is branched into the gas outflow recess 534. Then, the gas flows out from the gas supply recess 545 to the vicinity of the opening 512 at the tip of the solder hole 51 through the bypass 536. The tip 5B of the present embodiment can supply an inert gas to the rear end and the front end of the melting region 50 without forming a pipe through which the gas flows outside the cylinder 50. Other features are the same as those in the first to second embodiments.

  In the tip 5B according to the present embodiment, the gas outflow recess 534 and the gas supply recess 535 are configured to close the through hole with the lid member 537. This is a material and manufacturing reason for forming the tip 5B, and may be a structure in which a recess that does not penetrate from the solder hole 51 to the outer surface is formed and the recess is connected. At this time, when the bypass path 536 can also be configured such that no opening is formed at the tip, the gas outflow recess 534 and the gas supply recess 535 may be communicated without forming an opening at the tip.

(Fourth embodiment)
Still another example of the solder iron tip according to the present invention will be described with reference to the drawings. FIG. 9 is an exploded perspective view of the tip according to the present invention. FIG. 10 is a cross-sectional view of the tip shown in FIG. 9 cut along a plane along the central axis. The tip 5C shown in FIGS. 9 and 10 has the same configuration as the tip 5A shown in FIGS. 5 and 6 except that the gas supply unit 54 is different from the gas supply unit 53. Therefore, in fact, the same part as the tip 5A of the tip 5C according to the present embodiment is given the same reference numeral, and detailed description thereof is omitted. FIG. 9 shows a portion protruding from the heater block 42 as in FIG. FIG. 10 also shows the substrate Bd, the land Ld, the electronic component Ep, and the terminal Nd as in FIG.

  As shown in FIGS. 9 and 10, the tip 5 </ b> C includes a gas supply unit 54. The gas supply unit 54 includes a small diameter portion 541, an outer tube 542, a gas outflow hole 543, and a gas supply hole 544. The small-diameter portion 541 is a part of the cylinder 50c and has an outer diameter smaller than other parts of the cylinder 50c. The small diameter portion 541 is formed so as to extend from the rear end side to the front end side with respect to the melting region 510 in the axial direction of the cylinder 50c. That is, the melting region 510 is provided so as to be accommodated in the small diameter portion 541 in the axial direction of the cylinder 50c.

  The outer tube 542 is a tube surrounding the small diameter portion 541. The outer tube 542 is in airtight contact with the front end side and the rear end side of the small diameter portion 541 of the cylinder 50c. Thus, the outer tube 542 covers the outer surface of the small diameter portion 541 in an airtight manner. The gas outflow hole 543 is a through hole penetrating from the solder hole 51 to the outer surface of the small diameter portion 541. The gas outflow hole 543 is provided on the rear end side of the melting region 510 in the axial direction of the cylinder 50c. The gas supply hole 544 is a through hole that penetrates from the solder hole 51 to the outer surface of the small diameter portion 541. The gas supply hole 544 is provided on the tip side of the melting region 510 in the axial direction of the cylinder 50c.

  As shown in FIGS. 9 and 10, the heel 5C is kept airtight with the outside by the small diameter portion 541, the outer tube 542, and the adjacent portions on the front end side and the rear end side of the small diameter portion 541 of the cylinder 50c. A sagging gap is formed. The gas outflow hole 543 and the gas supply hole 544 connect the gap and the solder hole 51, and the inert gas diverted from the gas outflow hole 543 passes through the gap from the gas supply hole 544 to the solder hole 51. It flows in the vicinity of the opening 512 at the tip.

  The tip 5C is easy to manufacture because it can be manufactured without joining or the like of fine members. Other features are the same as those in the first to third embodiments.

  In the tip 5C, a gap is formed around the entire circumference of the small diameter portion 541. In the tip 5C shown in FIGS. 9 and 10, the gas outflow holes 543 and the gas supply holes 544 are provided one by one, but a plurality of them may be provided in the circumferential direction.

(Fifth embodiment)
Still another example of the solder iron tip according to the present invention will be described with reference to the drawings. FIG. 11 is an exploded perspective view of the tip according to the present invention. FIG. 12 is a cross-sectional view of the tip shown in FIG. 11 cut along a plane along the central axis. The tip 5D shown in FIGS. 11 and 12 has the same configuration as the tip 5A shown in FIGS. 5 and 6 except that the gas supply unit 55 is different from the gas supply unit 53. Therefore, in fact, the same part as the tip 5A of the tip 5D according to the present embodiment is given the same reference numeral, and detailed description thereof is omitted. Further, FIG. 11 shows a portion protruding from the heater block 42 as in FIG. FIG. 12 also shows the substrate Bd, land Ld, electronic component Ep, and terminal Nd as in FIG.

  As shown in FIGS. 11 and 12, the tip 5 </ b> D includes a gas supply unit 55. The gas supply unit 55 includes a slit 551 and a lid member 552. As shown in FIG. 12, the slit 551 penetrates from the solder hole 51 to the outer surface of the cylinder 50d. The slit 551 is a long hole extending in the axial direction from the rear end side to the front end side of the melting region 510. In other words, in the axial direction of the cylinder 50d, the melting region 510 is formed at a position overlapping the portion where the slit 551 is formed.

  The lid member 552 airtightly closes the opening on the outer surface side of the cylinder 50d of the slit 551. As shown in FIG. 12, the lid member 552 is attached so as to close a part of the slit 551 in the radial direction of the cylinder 50 d. The amount of protrusion of the lid member 552 in the direction of the solder hole 51 is set to be shorter than the length of the slit 551 in the radial direction. Accordingly, when the lid member 552 is attached to the slit 551, the slit 551 becomes a groove that is recessed radially outward from the inner peripheral surface of the solder hole 51, and the groove formed by the slit 551 is parallel to the melting region 510 of the solder hole 51. Serves as a bypass channel. That is, in the gas supply unit 55, the inert gas flowing in from the rear end opening 511 (not shown) is divided into a groove formed by the slit 551 on the rear end side of the melting region 510, and the opening at the front end of the solder hole 51. It flows out to the vicinity of 512.

  The width of the slit 551 will be described. Since the melted solder is a liquid having a high surface tension, it does not flow into a narrow gap or is difficult to flow in. Therefore, the width of the slit 551 is determined based on the surface tension at the time of melting of the solder to be used, and has such a width that the molten solder does not flow.

  The lid member 552 is attached to the slit 551 in such a manner that the through hole 5521 is formed on the same axis between the through hole 553 formed so as to face the slit 551 and the locking hole 554. The lid member 552 is fitted into the slit 551 so as to overlap with each other, and the pin P is pushed in from the through hole 553 to the insertion locking hole 554. Attachment of the lid member by the pin P may be performed at a plurality of locations. Moreover, you may use an adhesive agent etc. together. Of course, the attachment of the lid member 552 to the slit 551 is not limited to the above attachment method, and a conventionally known method such as screwing or band fastening can be used. However, the lid member 552, the slit 551, and the solder hole can be used. A method of attaching the lid member 552 in a detachable manner is desirable in that the cleaning inside 51 is possible.

  Thus, since the tip 5D only includes the slit 551 and the lid member 552 that covers the slit 551, the structure is simple, and the manufacturing cost can be reduced. Other features are the same as those in the first to third embodiments.

  Further, if the lid member 552 is made of a transparent material, the melted state of the solder pieces Wh in the solder holes 51, dirt on the inner peripheral wall, and the like can be observed from the outside by visual observation or a camera. In addition, since the inert gas always flows in the groove formed by the slit 551, the occurrence of fogging of the inner surface of the lid member 552 due to the flux fume when the solder piece Wh is melted is suppressed, and the solder piece Wh is melted. It can be observed from outside including the process of going. The transparent material that can be used for the lid member 552 is not particularly limited as long as the material has heat resistance (preferably at a temperature of 300 ° C. or higher). For example, heat-resistant glass, transparent mica, transparent ceramics (YAG ceramics), single crystal sapphire Is mentioned.

(Sixth embodiment)
Still another example of the solder iron tip according to the present invention will be described with reference to the drawings. FIG. 13 is an exploded perspective view of the tip according to the present invention. FIG. 14 is a cross-sectional view of the tip shown in FIG. 13 cut along a plane along the central axis. The tip 5E shown in FIGS. 13 and 14 has the same configuration as the tip 5A shown in FIGS. 5 and 6 except that the gas supply unit 56 is different from the gas supply unit 53. Therefore, in fact, the same part as the tip 5A of the tip 5E according to the present embodiment is denoted by the same reference numeral, and detailed description thereof is omitted. FIG. 13 shows a portion protruding from the heater block 42 as in FIG. FIG. 14 also shows the substrate Bd, the land Ld, the electronic component Ep, and the terminal Nd as in FIG.

  As shown in FIGS. 13 and 14, the tip 5 </ b> E includes a gas supply unit 56. The gas supply unit 56 includes a flat surface portion 501a of an arcuate cylindrical portion 501 formed at the distal end portion of the tube 50e, a slit 561, and a lid member 562. As shown in FIG. 14, the slit 561 penetrates from the solder hole 51 to the outer surface of the flat surface portion 501 a of the circular arc tubular portion 501. The slit 561 is a long hole extending in the axial direction from the rear end side to the front end side of the melting region 510. In other words, in the axial direction of the cylinder 50e, the melting region 510 is formed at a position overlapping the portion where the slit 561 is formed.

  The lid member 562 has substantially the same planar shape as the planar portion 501a of the circular arc tubular portion 501, and airtightly closes the opening on the outer surface side of the planar portion 501a of the slit 561. As shown in FIG. 14, the lid member 562 is attached so as to be in close contact with the flat surface portion 501 a of the circular arc tubular portion 501. The slit 561 serves as a bypass channel parallel to the melting region 510 of the solder hole 51. That is, in the gas supply unit 56, the inert gas flowing in from the rear end opening 511 (not shown) is diverted to the slit 561 on the rear end side of the melting region 510, and the opening 512 at the front end of the solder hole 51. It flows out in the vicinity.

  The width of the slit 561 is determined based on the surface tension at the time of melting of the solder to be used and has a width that does not allow the molten solder to flow in, as in the embodiment shown in FIGS. .

  The lid member 562 is attached to the flat surface portion 501a of the circular arc tubular portion 501 through the diagonally formed locking holes 502 and 503 of the flat surface portion 501a and through holes 5621 formed diagonally on the cover member 562. 5622 are overlapped, and the pin P is inserted into the through holes 5621 and 5622, respectively, and pushed into the locking holes 502 and 503. The attachment of the lid member 562 to the flat surface portion 501a is not limited to the attachment method, and a conventionally known method such as sticking with an adhesive, screwing, or band fastening can be used.

  In this way, since the tip 5E only has the lid member 562 attached to the flat surface portion 501a of the arc-shaped cylindrical portion 501, the structure is simple and the manufacturing cost can be reduced. Other features are the same as those in the first to third embodiments.

Similarly to the embodiment shown in FIGS. 11 and 12, if the lid member 562 is made of a transparent material, the molten state of the solder pieces Wh in the solder holes 51 and the dirt on the inner peripheral wall can be visually observed or a camera can be used. It can be observed from the outside. Further, since the inert gas always flows in the slit 561, the occurrence of fogging of the inner surface of the lid member 562 due to the flux fume is suppressed when the solder piece Wh is melted, and the solder piece Wh is melted. It can be observed from the outside including the process. As the transparent material that can be used for the lid member 552, the exemplified material of the above embodiment can be used here.

(Seventh embodiment)
Still another example of the solder iron tip according to the present invention will be described with reference to the drawings. FIG. 15 is a plan view of the tip according to the present invention. 16 is a cross-sectional view of the tip shown in FIG. 15 taken along line C2-C2. FIG. 17 is a cross-sectional view taken along line C3-C3 of the heel shown in FIG.

  The tip 7 </ b> A shown in FIGS. 15, 16, and 17 has a cylinder 70. The cylinder 70 has the same configuration as the cylinder 50 of the tip 5, and a solder hole 71 extending in the axial direction is provided at the center portion.

  Like the tip 5, the tip 7 </ b> A is attached to the recess 421 of the heater block 42 and receives heat from the heater block 42. Then, the solder piece Wh supplied from the opening (not shown) at the rear end is melted in the melting region 710, and the molten solder piece Wh is supplied to the outside from the opening 712 at the front end.

  The solder hole 71 includes a first hole 72 that extends in the axial direction from an opening (not shown) at the rear end, and a second hole 73 that communicates with the front end side of the first hole 71. The first hole 72 includes a melting region 710 that melts the solder piece Wh supplied in the vicinity of the end on the tip side. The melting region 710 has the same configuration as the melting region 710 of the cylinder 50, and the tip side is formed in a thin taper shape. The first hole 72 has a cylindrical shape having a circular cross section larger than the cross sectional shape of the cross section cut along a plane orthogonal to the axis of the solder piece Wh. By making the cross section of the first hole 72 larger than the cross section of the solder piece Wh in this way, the solder piece Wh falls smoothly to the melting region 710 without stopping in the middle.

  The molten solder becomes spherical when no external pressure or the like is applied. In the solder iron tip 7A according to the present invention, the molten solder piece Wh flows down the solder hole 71, and the solder hole 71 extends in the vertical direction. Therefore, the solder piece Wh melted in the melting region 710 of the solder hole 71 has a shape obtained by extending a spherical shape in the vertical direction. And since molten solder has high surface tension, it is hard to flow into a narrow part.

  Utilizing such a property of the molten solder, the second hole 73 has a first region 731 having the same cross-sectional shape as the axial projection surface of the molten solder piece Wh, and the first region 731 and the radial direction. And a second region 732 connected to the second region 732.

  In the second hole 73 of the tip 7A of the present embodiment, the cross-sectional shape of the first region 731 is an ellipse (circular), and the cross-sectional shape of the second hole 73 is a rectangular shape larger than that of the first region 731. . The length of the cross section of the second hole 73 in the longitudinal direction is longer than the long diameter of the cross section of the first region 731. A portion outside the first region 731 of the rectangular cross section of the second hole 73 is a second region 732.

  When the tip 7A is accurately attached and the soldering apparatus A is operating stably, the solder hole 71 extends in the vertical direction, and the solder piece Wh is formed in the melting region 710 of the first hole 72. Since it is guided by the taper, it flows down the center of the solder hole 71. At this time, gravity and surface tension act on the melted solder piece Wh, so that the molten solder piece Wh flows down in the second hole 73 without being displaced from the first region 731.

  When the solder piece Wh melted in the melting region 710 flows into the second hole 73, it flows down through the first region 731 to the opening 712 at the tip. That is, the first region 731 of the second hole 73 is closed with the molten solder piece Wh. At this time, since the molten solder piece Wh does not flow into the second region 732, the inert gas supplied from the opening at the rear end causes the molten solder piece Wh to block the first region 731 of the second hole 73. However, it flows into the vicinity of the opening 712 at the tip through the second region 732.

  In this way, the second hole 73 is provided on the radially outer side of the first region 731 and the first region 731 where the solder piece Wh flows when the solder piece Wh is melted. By forming the region 732, it is possible to allow the inert gas to flow into the opening 712 at the tip even when the solder piece Wh is melted. Thereby, it can suppress that the solder piece Wh contacts oxygen in the tip 7A, and generation | occurrence | production of a flux fume can be suppressed.

  The second hole 73 will be described in more detail with reference to the drawings. FIG. 18 is an enlarged view of another example of the second hole. The cross section of the second hole 73 shown in FIG. 18 has a rectangular shape inscribed by an ellipse that is a cross section of the first region 731. In the cross section of the second hole portion 73 that is in contact with the cross section of the first region 731, the tangent lines at adjacent contacts are referred to as a line 733 and a line 734.

  The molten solder has a large surface tension, that is, a contact angle is large. Therefore, if the inner angle formed by the adjacent surfaces among the surfaces in contact with the second hole 73 is smaller than the contact angle, the molten solder cannot move to the corner portion side any more. That is, among the points where the cross section of the second hole 73 and the cross section of the first region 731 come into contact, the angle θ formed by the lines 733 and 734, which are tangents at adjacent contacts, is greater than the contact angle of the molten solder. Is smaller, the molten solder does not enter before the contact point.

  The cross-sectional shape of the second hole 73 is configured to be in contact with the cross section of the first region 731 at two or more points, and the contact of the solder in which the angle formed by the tangent line of the cross section of the first region 731 from two adjacent points is melted By making the shape having an angle smaller than the angle, it is possible to form the second hole 73 including the second region 732 in which the inflow of the molten solder piece Wh is suppressed.

  In the present embodiment, a rectangular shape is shown as the cross-sectional shape of the second hole 73, but the shape is not limited to this, and a shape that satisfies the above-described conditions (for example, a triangle, a diamond, a star) Etc.) can be widely adopted.

  As described above, the tip 7 </ b> A of the present embodiment changes the cross-sectional shape of the solder hole 71, so that even when the molten solder piece Wh stays in the middle of the solder hole 71, the inert gas is melted into the melting region 710. Rather than the opening 712 at the tip. Thereby, the tip 7A of the present invention is easy to manufacture and can suppress the generation and adhesion of flux fumes in the solder hole 71 over a long period of time.

(Eighth embodiment)
Still another example of the solder iron tip according to the present invention will be described with reference to the drawings. FIG. 19 is a plan view of the tip according to the present invention. 20 is a cross-sectional view of the heel shown in FIG. 19 taken along line C4-C4. 21 is a cross-sectional view of the tip shown in FIG. 19 taken along line C5-C5. The tip 7B according to the present embodiment has the same configuration as the tip 7A except that the configuration of the melting region 710 is different. Therefore, substantially the same parts are denoted by the same reference numerals, and detailed description of the same parts is omitted.

  As shown in FIGS. 19, 20, and 21, the tip 7 </ b> B has a step formed in the melting region 710 provided on the tip end side of the first hole 72 of the solder hole 71. Since the step is provided in this way, the dropped solder piece Wh once stops at the step, so that it is possible to effectively heat the solder piece Wh.

  Other features are the same as in the seventh embodiment.

(Ninth embodiment)
Still another example of the solder iron tip according to the present invention will be described with reference to the drawings. FIG. 22 is a plan view of the tip according to the present invention. FIG. 23 is a cross-sectional view of the tip shown in FIG. 22 taken along line C6-C6. 24 is a cross-sectional view of the tip shown in FIG. 22 taken along line C7-C7. The tip 7C according to the present embodiment has the same configuration as the tip 7A except that the configuration of the first hole 72c is different. Therefore, substantially the same parts are denoted by the same reference numerals, and detailed description of the same parts is omitted.

  The tip 7C includes a first hole 72c and a second hole 73. The second hole 73 has a first region 731 and a second region 732. The cross section cut by a plane orthogonal to the axis of the second hole 73 has a size that protrudes from the circular cross section of the first hole 72c. The first hole 72c has a shape in which a first region 721 having a circular cross section and a second region 722 having a cross section protruding from the cross section of the first region 721 are combined. That is, the second region 722 of the first hole 72 c and the second region 732 of the second hole 73 are provided so as to communicate with each other.

  In other words, a hole having the same cross section as that of the second hole portion 73 passes through the tip 7C in the axial direction of the cylinder 70, and the rear end side of the melting region 710 is closer to the cross section of the solder piece Wh. Also, a hole having a large circular cross section is formed so as to partially overlap with the penetrating hole.

  By being formed in this way, the second region 722 of the first hole 72c and the second region 732 of the second hole 73 are communicated. Thereby, even when the solder piece Wh melted in the melting region 710 remains in the middle of the solder hole 71, the inert gas can be sent to the vicinity of the opening 712 at the tip rather than the melting region 710. Thereby, the tip 7C of the present embodiment has a simple structure and can suppress the generation of flux fume.

(10th Embodiment)
Still another example of the solder iron tip according to the present invention will be described with reference to the drawings. FIG. 25 is a plan view of the tip according to the present invention. FIG. 26 is a cross-sectional view of the tip shown in FIG. 25 taken along line C8-C8. 27 is a cross-sectional view of the heel shown in FIG. 25 taken along line C9-C9. The tip 7D according to the present embodiment has the same configuration as the tip 7C except that the configuration of the melting region 710 is different. Therefore, substantially the same parts are denoted by the same reference numerals, and detailed description of the same parts is omitted.

  As shown in FIGS. 25, 26, and 27, the tip 7 </ b> D has a step formed in a melting region 710 provided on the tip side of the first region 721 of the first hole 72 c of the solder hole 71. Since the step is provided in this way, the dropped solder piece Wh once stops at the step, so that it is possible to effectively heat the solder piece Wh.

  Other features are the same as in the ninth embodiment.

(Eleventh embodiment)
Still another example of the solder iron tip according to the present invention will be described with reference to the drawings. FIG. 28 is a perspective view of a heel according to the present invention. 29 is a cross-sectional view of the tip shown in FIG. 28 taken along line C10-C10. 30 is a cross-sectional view of the tip shown in FIG. 28 taken along line C11-C11. The tip 7E according to the present embodiment has the same configuration as the tip 7C except that the shape of the second hole 73e is different. Therefore, substantially the same parts are described with the same reference numerals, and detailed descriptions of the same parts are omitted.

  As shown in FIG. 28, FIG. 29, and FIG. 30, the tube 70e of the tip 7E includes a second hole 73e. The second hole 73e has a cross-sectional shape in which a circular cross section having the same outer diameter as that of the first region 721 of the first hole 72c is overlapped in addition to the first region 731 and the second region 732 on the distal end side of the melting region 710. It has become. The second hole 73e includes a third region 733 having a shape obtained by cutting a cylindrical shape along a plane parallel to the axis. The third region 733 is formed in a tapered shape having a large cross section on the tip side of the melting region 710.

  With such a configuration, the solder hole 71e is widened on the tip side of the melting region 710, so that the melted solder piece Wh can quickly flow down to the opening 712 at the tip. Other features are the same as in the ninth embodiment.

(Twelfth embodiment)
Still another example of the solder iron tip according to the present invention will be described with reference to the drawings. FIG. 31 is a sectional view of the tip according to the present invention cut along a plane including an axis. 32 is a cross-sectional view of the tip according to the present invention cut along a plane that includes the shaft and is orthogonal to the cut plane of FIG. 31. The tip 7F according to the present embodiment has the same configuration as the tip 7E except that the configuration of the melting region 710 is different. Therefore, substantially the same parts are denoted by the same reference numerals, and detailed description of the same parts is omitted.

  As shown in FIGS. 31 and 32, the tip 7F has a step formed in a melting region 710 provided on the tip side of the first region 721 of the first hole 72c of the solder hole 71f. Further, a step is formed between the melting region 710 and the second hole 73e. Since the step is provided in this way, the dropped solder piece Wh once stops at the step, so that it is possible to effectively heat the solder piece Wh.

  Other features are the same as in the eleventh embodiment.

(13th Embodiment)
Still another example of the solder iron tip according to the present invention will be described with reference to the drawings. FIG. 33 is a perspective view of a heel according to the present invention. FIG. 34 is a cross-sectional view of the tip shown in FIG. 33 cut along a plane along the central axis. FIG. 33 shows a portion protruding from the heater block 42. FIG. 34 also shows the substrate Bd, the land Ld, the electronic component Ep, and the terminal Nd.

  The tip 8 shown in FIGS. 33 and 34 has a tube 80. The cylinder 80 has the same configuration as the cylinder 50 of the tip 5, and has a solder hole 81 extending in the axial direction at the center portion and a groove 82 formed on the inner surface of the solder hole 81.

  Like the tip 5, the tip 8 is attached to the recess 421 of the heater block 42 and receives heat from the heater block 42. Then, the solder piece Wh supplied from the opening (not shown) at the rear end is melted in the melting region 810, and the molten solder piece Wh is supplied to the outside through the opening 812 at the front end.

  The solder hole 81 is provided through the center of the cylinder 80 in the axial direction. The solder hole 81 has a melting region 810 at an intermediate portion. Similar to the solder hole 81, the groove 82 penetrates the cylinder 80 in the axial direction. As a result, the groove 82 serves as a bypass flow path parallel to the melting region 810 of the solder hole 81. That is, the inert gas flowing in from the opening at the rear end (not shown) is divided into the groove 82 on the rear end side of the melting region 810 and flows out in the vicinity of the opening 812 at the front end of the solder hole 81.

  The width of the groove 82 will be described. Since the melted solder is a liquid having a high surface tension, it does not flow into a narrow gap or is difficult to flow in. Therefore, the width of the slit is determined based on the surface tension at the time of melting of the solder to be used, and has a width that does not allow the molten solder to flow.

  Thereby, even when the solder piece Wh melted in the melting region 810 stays in the middle of the solder hole 81, the inert gas can be sent to the vicinity of the opening 812 at the front end rather than the melting region 810. It can suppress that the molten solder piece Wh contacts oxygen. Thereby, the tip 7C of the present embodiment has a simple structure and can suppress the generation of flux fume.

  In addition, since the tip 8 has a configuration in which a groove 82 formed along the solder hole 81 is simply provided, it can be manufactured by processing an existing tip.

  In addition, although the tip 8 of this embodiment is described as an example in which one groove 82 is provided in the circumferential direction, the present invention is not limited to this. For example, the structure provided with two or more in the circumferential direction may be sufficient. Furthermore, it does not have to be parallel to the axis of the cylinder 80. For example, a configuration may be adopted in which the inner surface of the solder hole 81 extends spirally.

(14th Embodiment)
Still another example of the solder iron tip according to the present invention will be described with reference to the drawings. FIG. 35 is a plan view of the tip according to the present invention. FIG. 36 is a cross-sectional view of the tip shown in FIG. 35 cut along a plane along the central axis. FIG. 36 also shows the substrate Bd, the land Ld, the electronic component Ep, and the terminal Nd. The tip 8A of the present embodiment has the same configuration as the tip 8 except that the groove 82a of the cylinder 80a is different. Therefore, the same reference numerals are given to the substantially same parts as the tip 8 and detailed description of the same parts is omitted.

  As shown in FIGS. 35 and 36, the heel 8A has a groove 82a. A total of two grooves 82 a are formed so as to be opposite positions across the central axis of the solder hole 81. The tip 8A has a configuration in which the inner diameter of the solder hole 81 does not change, and the solder piece Wh is heated and melted when passing through the solder hole 81.

  In such a configuration, the solder piece Wh is not completely melted until it reaches a certain distance from the portion where the melting of the solder piece Wh begins. Therefore, the groove 82a has a predetermined depth from the front end of the cylinder 80a toward the rear end. Here, the predetermined depth is deeper than the depth from the opening 812 at the tip of the solder hole 81 at the position where the melted solder piece Wh is melted to close the solder hole 81. By having the groove 82a having such a depth, even if the molten solder piece Wh closes the solder hole 81, the groove 82a reaches the rear end side of the solder hole 81 closed by the molten solder piece Wh. Therefore, it is possible to supply the inert gas to the solder hole 81 in the vicinity of the opening 812 at the tip through the groove 82a.

  In addition, since the groove 82a does not reach the rear end side of the flange 8A, even when heat is transmitted from the heater block 42, stress concentration due to thermal distortion is less likely to occur, and deterioration or breakage due to temperature change does not occur. Hard to occur.

  Other features are the same as in the thirteenth embodiment.

(Fifteenth embodiment)
Still another example of the solder iron tip according to the present invention will be described with reference to the drawings. FIG. 37 is a perspective view of a heel according to the present invention. FIG. 38 is a partial perspective view seen from the tip side of the heel shown in FIG. 39 is a cross-sectional view taken along the axis of the tip shown in FIG. FIG. 39 also shows the substrate Bd, the land Ld, the electronic component Ep, and the terminal Nd. The tip 8B of the present embodiment has the same configuration as the tip 8 except that the groove 82b of the cylinder 80b is different. Therefore, the same reference numerals are given to the substantially same parts as the tip 8 and detailed description of the same parts is omitted.

  As shown in FIGS. 37, 38, and 39, the heel 8B includes a tube 80b. A solder hole 81b is formed at the center of the cylinder 80b and penetrates in the axial direction, and a groove 82b provided on the inner surface of the solder hole 81b. A contact portion 83 having a smaller cross section than the cylinder 80b is formed at the tip of the cylinder 80b. The contact portion 83 is provided with a slit 84 communicating with the groove 82b in the axial direction.

  When the soldering tip 8B is soldered, the contact portion 83 comes into contact with a soldering target such as the land Ld. In the tip 8B, the contact portion 83 having a smaller cross-sectional area than the cylinder 80b contacts the land Ld. Therefore, even when an electronic component is disposed in the vicinity of the land Ld on the board Bd, The land Ld and the terminal Nd can be preheated without contacting the parts.

  Further, at the tip 8B, an inert gas is ejected from the slit 84 formed in the contact portion 83 toward the periphery of the substrate Bd. Accordingly, since inert gas is supplied around the molten solder piece Wh supplied to the substrate Bd (land Ld), oxygen is prevented from coming into contact with the molten solder piece Wh supplied to the land Ld. can do.

(Sixteenth embodiment)
Still another example of the solder iron tip according to the present invention will be described with reference to the drawings. FIG. 40 is a partial perspective view seen from the tip side of the heel according to the present invention. 41 is a cross-sectional view taken along the tip axis shown in FIG. FIG. 40 also shows the substrate Bd, the land Ld, the electronic component Ep, and the terminal Nd. The tip 8C of the present embodiment has the same configuration as the tip 8B except that the shape of the contact portion 83c formed at the tip of the cylinder 80c is different. Therefore, the same reference numerals are given to the substantially same parts as the tip 8B, and detailed description of the same parts is omitted.

  As shown in FIGS. 40 and 41, the tip 8C includes a cylinder 80c. A solder hole 81c formed in the center of the cylinder 80c and penetrating in the axial direction, and a groove 82c provided on the inner surface of the solder hole 81c are provided. In addition, a contact portion 83c having a smaller cross section than the cylinder 80c, more specifically, a semi-cylindrical shape, is formed at the tip of the cylinder 80c. The contact portion 83c is provided with a slit 84c communicating with the groove 82c in the axial direction.

  When the soldering tip 8C is soldered, the contact portion 83c comes into contact with a soldering target such as the land Ld. In the tip 8C, the semi-cylindrical contact portion 83c is in contact with the land Ld, so that the tip 8B is brought into contact with the electronic component even when the electronic component is disposed in the vicinity of the land Ld on the substrate Bd. The land Ld and the terminal Nd can be preheated without any problems. In addition, since the contact area of the contact portion 83c with the land Ld is larger in the tip 8C than in the tip 8B shown in FIGS. 35 to 37, the land Ld can be preheated more quickly.

  In addition, at the tip 8C, in the same manner as the above-described tip 8B, an inert gas is blown out from the slit 84c and the groove 82c formed in the contact portion 83c toward the periphery of the substrate Bd. Accordingly, since inert gas is supplied around the molten solder piece Wh supplied to the substrate Bd (land Ld), oxygen is prevented from coming into contact with the molten solder piece Wh supplied to the land Ld. can do.

(Other)
(First example)
Another example of the solder iron tip will be described with reference to the drawings. FIG. 42 is an exploded perspective view of the tip. FIG. 43 is a cross-sectional view of the tip shown in FIG. 42 cut along a plane along the central axis. The tip 9A shown in FIGS. 42 and 43 has the same configuration as the tip 5 shown in FIGS. 3 and 4 except that the tip 9A does not have the gas pipe Gp2 and the gas supply hole 52. Therefore, in fact, the same reference numerals are given to the same portions as the tip 5 of the tip 9A according to the present embodiment, and detailed description thereof is omitted. FIG. 42 shows a portion protruding from the heater block 42 as in FIG. FIG. 43 also shows the substrate Bd, the land Ld, the electronic component Ep, and the terminal Nd as in FIG.

  As shown in FIGS. 42 and 43, a slit 91 is formed in the tube 90a of the tip 9A. The slit 91 penetrates from the solder hole 51 to the outer surface of the cylinder 90a, and extends in the axial direction from the rear end side to the front end side with respect to the melting region 510. In other words, the melting region 510 is formed at a position overlapping the portion where the slit 91 is formed in the axial direction of the cylinder 90a.

  On the other hand, the lid member 92 has the same shape as the space of the slit 91 and is attached so as to block the entire slit 91 as shown in FIG. Thus, the surface of the lid member 92 that faces the solder hole 51 is flush with the inner peripheral surface of the solder hole 51.

  The lid member 92 is attached to the slit 91 in such a manner that the through hole 921 formed in the lid member 92 is on the same axis between the through hole 93 and the locking hole 94 formed so as to face each other with the slit 91 therebetween. The lid member 92 is fitted into the slit 91 so as to overlap with each other, and the pin P is pushed in from the through hole 93 to the insertion locking hole 94. The lid member 92 may be attached by the pin P at a plurality of locations. Moreover, you may use an adhesive agent etc. together. Of course, the attachment of the lid member 92 to the slit 91 is not limited to the above attachment method, and a conventionally known method such as screwing or banding can be used. A method of attaching the lid member 92 in a detachable manner is desirable in that the cleaning inside 51 is possible.

  The lid member 92 is made of a transparent material. Thereby, the molten state of the solder piece Wh in the solder hole 51, the dirt on the inner peripheral wall, and the like can be observed from the outside by visual observation or a camera. The transparent material that can be used for the lid member 92 is not particularly limited as long as the material has heat resistance (preferably at a temperature of 300 ° C. or higher). For example, heat-resistant glass, transparent mica, transparent ceramics (YAG ceramics), single crystal sapphire, etc. Is mentioned.

(Second example)
Still another example of the solder iron tip will be described with reference to the drawings. FIG. 44 is an exploded perspective view of the tip. FIG. 45 is a cross-sectional view of the tip shown in FIG. 44 cut along a plane along the central axis. The tip 9B shown in FIGS. 44 and 45 has the same configuration as the tip 5 shown in FIGS. 3 and 4 except that the tip 9B does not have the gas pipe Gp2 and the gas supply hole 52. Therefore, in fact, the same part as the tip 5 is denoted by the same reference numeral and a detailed description thereof is omitted in the tip 9B according to the present embodiment. FIG. 44 shows a portion protruding from the heater block 42 as in FIG. FIG. 45 also shows the substrate Bd, land Ld, electronic component Ep, and terminal Nd, as in FIG.

  As shown in FIGS. 44 and 45, the tip 9B is formed with an arcuate cylindrical portion 901 at the tip of the tube 90b, and a plurality of the tips 9B at equal intervals in a direction parallel to the central axis of the tip 9B. Through-holes 95 are formed. As shown in FIG. 45, the through-hole 95 penetrates from the solder hole 51 to the outer surface of the flat surface portion 901 a of the arcuate cylindrical portion 901. The region where the through hole 95 is formed is a region from the rear end side to the front end side of the melting region 510.

  The lid member 96 has substantially the same planar shape as the planar portion 901a of the circular arc tubular portion 901, and airtightly closes the openings on the outer surface side of the planar portions 501a of the plurality of through holes 95. As shown in FIG. 45, the lid member 96 is attached so as to be in close contact with the flat surface portion 901a of the circular arc tubular portion 901.

  The arc member 901 of the lid member 96 is attached to the flat surface portion 901a in the through holes 961, diagonally formed in the lid member 96 in the locking holes 97, 98 formed diagonally in the flat surface portion 901a. 962 is overlapped, and the pin P is inserted into the through holes 961 and 962 and pushed into the locking holes 97 and 98, respectively. Note that the attachment of the lid member 96 to the flat portion 901a is not limited to the attachment method, and a conventionally known method such as sticking with an adhesive, screwing, or banding can be used.

  Similarly to the embodiment shown in FIGS. 42 and 43, the lid member 96 is made of a transparent material, so that the molten state of the solder pieces Wh in the solder holes 51, the dirt on the inner peripheral wall, etc. can be visually observed or a camera. It can be observed from outside. As the transparent material that can be used for the lid member 96, the material exemplified in the first example can also be used here.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to this content. The embodiments of the present invention can be variously modified without departing from the spirit of the invention. For example, the tip of the soldering iron of the present invention is generally manufactured by drilling a hole in the center from a cylindrical material, but each piece was processed into a shape divided into two at the central axis. Later, they can be combined into a cylindrical shape. That is, after drilling holes and grooves in the shape divided by the C6-C6 line or the C7-C7 line in FIG. 22, they are combined into a cylindrical shape, and the tip is manufactured so that the outer periphery is fixed. . According to such a manufacturing method of the tip, not only the processing of the groove portion is easy, but the inner surface can be easily cleaned with a brush or the like after being disassembled into two.

A Soldering device 1 Support section 11 Wall body 12 Sliding guide 2 Cutter unit 21 Cutter upper blade 211 Upper blade hole 212 Pin hole 22 Cutter lower blade 221 Lower blade hole 23 Pusher pin 3 Drive mechanism 31 First actuator 311 Cylinder 312 Piston Rod 32 Second actuator 321 Cylinder 322 Piston rod 4 Heater unit 41 Heater 42 Heater block 421 Recess 422 Solder supply hole 43 Heater block fixing plate 430 Through hole 5, 5A to 5E Tip 51 Solder hole 510 Melting region 511 Opening at rear end 512 Opening 52 at the tip 52 Gas supply hole 53, 53b Gas supply part 531 Gas outflow hole 532 Gas supply hole 533 Bypass piping 534 Gas outflow recess 535 Gas supply recess 536 Bypass path 537 Cover member 54 Gas supply part 541 Small Portion 542 Outer tube 543 Gas outlet hole 544 Gas supply hole 55 Gas supply portion 551 Slit 552 Lid member 56 Gas supply portion 561 Slit 562 Lid member 6 Solder feed mechanism 61 Feed roller 62 Guide tube 7A-7F Tip 70 Tube 71 Solder hole 710 Melting region 72 First hole 721 First region 722 Second region 73 First hole 731 First region 732 Second region 8, 8A-8C Tip 80 cylinder 81 Solder holes 9A, 9b Tip 90a, 90b Tube 91 Slit 92 Lid member 95 Through-hole 96 Lid member 901 Arc cylindrical portion 901a Flat surface W Solder Wh Solder piece Bd Wiring board Ep Electronic component Ld Land Nd Terminal

Claims (17)

A soldering iron tip detachably attached to a soldering iron having a heat source,
A cylinder having solder holes penetrating in the axial direction with openings at the front and rear ends;
In the middle part of the solder hole, a melting region for melting the solder piece supplied from the rear end opening is provided,
A tip of a soldering iron provided with a gas supply part for supplying an inert gas to at least a tip side of the solder hole from the melting region.   2. The tip of the soldering iron according to claim 1, wherein the gas supply part is provided on a tip side with respect to the melting region and includes a gas supply hole penetrating from the solder hole to an outer surface of the cylinder. The gas supply unit
A gas outflow hole provided on the rear end side of the melting region and penetrating from the solder hole to the outer surface of the cylinder;
A gas supply hole provided on the tip side of the melting region and penetrating from the solder hole to the outer surface of the cylinder;
The tip of the soldering iron according to claim 1, further comprising a bypass pipe that is provided outside the cylinder and communicates the gas outflow hole and the gas supply hole. The gas supply unit
An outflow recess provided on the inner surface on the rear end side of the melting region;
A supply recess provided on the inner surface on the tip side of the melting region;
2. The soldering iron tip according to claim 1, further comprising a bypass passage formed inside the wall of the cylinder and communicating the inflow recess and the outflow recess. The gas supply unit
Formed in an intermediate portion of the cylinder, reaches the tip side from the melting region of the solder hole, and has a small diameter portion having a smaller outer diameter than the rear end side and the tip side in the axial direction;
An outer tube that hermetically covers the small diameter portion;
A gas outflow hole provided on the rear end side of the melted region of the small diameter portion and penetrating from the solder hole to the outer surface of the small diameter portion;
The tip of the soldering iron according to claim 1, further comprising a gas supply hole provided on a tip side of the melting area of the small diameter portion and penetrating from the solder hole to an outer surface of the small diameter portion. The gas supply unit
A slit that extends from the solder hole to the outer surface of the cylinder and extends in the axial direction from the rear end side to the front end side of the melting region;
The tip of the soldering iron according to claim 1, further comprising a lid member that hermetically seals an outer surface of the slit.   The tip of the soldering iron according to claim 6, wherein the lid member is transparent. A soldering iron tip detachably attached to a soldering iron having a heat source,
A cylinder having solder holes penetrating in the axial direction with openings at the front and rear ends,
In the middle part of the solder hole, a melting region for melting the solder piece supplied from the rear end opening is provided,
The solder hole is
A first hole having a cross section through which a supplied solder piece can pass;
A second hole connected to the tip side of the first hole,
The second hole portion is a tip of a soldering iron having a cross-sectional shape through which an inert gas can pass outside the solder that is melted and flows down. The second hole has a cross-sectional shape in which a first region that is a cross-section of the same shape as a projection surface in the flow direction of the solder melted in the melting region is accommodated inside,
The cross section of the first region is circular, and can be in contact with the cross section of the second hole at at least two points;
The cross-sectional shape of the second hole is a shape in which the angle formed by the tangents at two adjacent contact points is smaller than the contact angle of the molten solder when the circular cross-section of the first region is inscribed. The tip of the soldering iron according to claim 8.   The solder hole according to claim 8 or 9, wherein the first hole portion has a cross-sectional shape in which a circular shape larger than a cross-section of the solder piece and a cross-sectional shape of the second hole portion are overlapped. Tip.   The tip of the soldering iron according to any one of claims 8 to 10, wherein a portion of the first hole portion adjacent to the second hole portion has a small cross section on the tip side and an inner surface is inclined.   The part according to any one of claims 8 to 11, wherein the second hole portion is provided with a portion having a cross section larger than a projection surface in a flow-down direction of the solder melted in the melting region on a distal end side. The tip of the soldering iron.   The tip of the soldering iron according to claim 12, wherein the second hole portion has an inclined surface whose cross section becomes smaller as it approaches the melting region. A soldering iron tip detachably attached to a soldering iron having a heat source,
A cylinder having solder holes penetrating in the axial direction with openings at the front and rear ends,
In the middle part of the solder hole, a melting region for melting the solder piece supplied from the rear end opening is provided,
The solder hole is a tip of a solder iron provided with at least one groove provided on the inner surface and extending in the axial direction. A contact portion having a small outer shape is provided at the tip of the cylinder,
The tip of the soldering iron according to claim 14, wherein the contact portion overlaps with the groove and is formed with a slit communicating with the outer surface from the solder hole. A tip according to any one of claims 1 to 3 and 15,
A soldering apparatus comprising: a tip holding portion having a heat source that heats the tip while the tip is detachable. The tip of claim 2;
The tip is detachable, and has a tip holding part having a heat source for heating the tip, and a gas pipe connected to the outside of the gas supply hole and directly supplying an inert gas. Soldering device.