JPH0253873U - - Google Patents
Info
- Publication number
- JPH0253873U JPH0253873U JP13064488U JP13064488U JPH0253873U JP H0253873 U JPH0253873 U JP H0253873U JP 13064488 U JP13064488 U JP 13064488U JP 13064488 U JP13064488 U JP 13064488U JP H0253873 U JPH0253873 U JP H0253873U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- solder supply
- hot air
- soldering iron
- thread
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 17
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 9
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims 1
Description
第1図は本考案の一実施例を示す縦断面図であ
る。第2図は従来のはんだ付け装置を示す側面図
である。
1…はんだごて、2…はんだ供給用細管、3…
ストツパ、4…ヒーター、5…糸はんだ、6…は
んだ供給機構、7…はんだ切断シヤツタ、8…熱
風生成部、9…熱風導入管、10…開閉バルブ、
11…はんだごて下降機構、12…プリント板、
13…ランド、14…取付部品。
FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention. FIG. 2 is a side view showing a conventional soldering device. 1...Soldering iron, 2...Solder supply thin tube, 3...
Stopper, 4... Heater, 5... Thread solder, 6... Solder supply mechanism, 7... Solder cutting shutter, 8... Hot air generation section, 9... Hot air introduction pipe, 10... Open/close valve,
11...Soldering iron lowering mechanism, 12...Printed board,
13...Land, 14...Mounting parts.
Claims (1)
くはんだ供給用細管と、前記はんだ供給用細管に
糸はんだを供給する糸はんだ供給機構と、前記糸
はんだ供給機構から供給される糸はんだを切断す
るとともに前記はんだ供給用細管を密閉すること
ができる切断シヤツタと、前記はんだ供給用細管
途中に位置し前記はんだ切断シヤツタにより切断
されたはんだの落下を防止するストツパと、前記
はんだごてと前記はんだ供給用細管と前記ストツ
パを加熱するヒーターと、空気を加熱して熱風を
生成する熱風生成部と、前記熱風生成部から前記
はんだ供給用の細管上端部分に接続された熱風導
入管と、前記熱風導入管の中間に付けられた開閉
バルブと、はんだごて下降機構とを含むことを特
徴とするはんだ付け装置。 A soldering iron, a solder supply capillary that vertically passes through the center of the soldering iron, a thread solder supply mechanism that supplies thread solder to the solder supply capillary, and a thread solder supply mechanism that supplies thread solder from the thread solder supply mechanism. a cutting shutter capable of cutting and sealing the solder supply capillary; a stopper located in the middle of the solder supply capillary to prevent the solder cut by the solder cutting shutter from falling; and the soldering iron and the soldering iron. a heater that heats the solder supply thin tube and the stopper; a hot air generation section that heats air to generate hot air; a hot air introduction tube connected from the hot air generation section to the upper end portion of the solder supply thin tube; A soldering device characterized by comprising an on-off valve attached to the middle of a hot air introduction pipe and a soldering iron lowering mechanism.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13064488U JPH0253873U (en) | 1988-10-04 | 1988-10-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13064488U JPH0253873U (en) | 1988-10-04 | 1988-10-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0253873U true JPH0253873U (en) | 1990-04-18 |
Family
ID=31385998
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13064488U Pending JPH0253873U (en) | 1988-10-04 | 1988-10-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0253873U (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007129036A (en) * | 2005-11-02 | 2007-05-24 | Denso Corp | Laser soldering method |
WO2008023461A1 (en) * | 2006-08-21 | 2008-02-28 | Mitsuo Ebisawa | Soldering iron, method for manufacturing electronic apparatus by using it, amd manufacturing equipment |
JP2016215220A (en) * | 2015-05-19 | 2016-12-22 | 株式会社アンド | Soldering device |
JP2017074619A (en) * | 2015-10-16 | 2017-04-20 | 株式会社アンド | Tip of soldering iron, and soldering device |
JP2018020326A (en) * | 2016-08-01 | 2018-02-08 | 株式会社アンド | Solder treatment equipment |
-
1988
- 1988-10-04 JP JP13064488U patent/JPH0253873U/ja active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007129036A (en) * | 2005-11-02 | 2007-05-24 | Denso Corp | Laser soldering method |
JP4631656B2 (en) * | 2005-11-02 | 2011-02-16 | 株式会社デンソー | Laser soldering method |
WO2008023461A1 (en) * | 2006-08-21 | 2008-02-28 | Mitsuo Ebisawa | Soldering iron, method for manufacturing electronic apparatus by using it, amd manufacturing equipment |
JP5184359B2 (en) * | 2006-08-21 | 2013-04-17 | 満男 海老澤 | Soldering iron, method of manufacturing electronic equipment using the same, and manufacturing apparatus |
JP2013077840A (en) * | 2006-08-21 | 2013-04-25 | Mitsuo Ebisawa | Soldering iron, method of manufacturing electronic device using the same, and manufacturing apparatus |
JP2016215220A (en) * | 2015-05-19 | 2016-12-22 | 株式会社アンド | Soldering device |
JP2017074619A (en) * | 2015-10-16 | 2017-04-20 | 株式会社アンド | Tip of soldering iron, and soldering device |
JP2018020326A (en) * | 2016-08-01 | 2018-02-08 | 株式会社アンド | Solder treatment equipment |
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