JPH03101364U - - Google Patents

Info

Publication number
JPH03101364U
JPH03101364U JP811790U JP811790U JPH03101364U JP H03101364 U JPH03101364 U JP H03101364U JP 811790 U JP811790 U JP 811790U JP 811790 U JP811790 U JP 811790U JP H03101364 U JPH03101364 U JP H03101364U
Authority
JP
Japan
Prior art keywords
soldering
solder
opening
guiding
blower pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP811790U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP811790U priority Critical patent/JPH03101364U/ja
Publication of JPH03101364U publication Critical patent/JPH03101364U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の実施例を示した概略構成図、
第２図は別の実施例に係るガイドパイプ１の縦断
面図、第３図は半田供給装置の他の実施例の半田
Ｈのガイドパイプ１の一部破断斜視図、第４図は
従来の半田供給装置の要部を表した外観図である
。 図中、１……ガイドパイプ（案内手段）、２，
５……送風管、３……案内管、４……連結部材、
６……送風口、７……送風手段、１０……ストツ
カ、１５……コテ先端、Ｈ……半田、ｆ……フラ
ツクス煙である。 FIG. 1 is a schematic configuration diagram showing an embodiment of the present invention;
FIG. 2 is a longitudinal sectional view of a guide pipe 1 according to another embodiment, FIG. 3 is a partially cutaway perspective view of the guide pipe 1 for solder H in another embodiment of the solder supply device, and FIG. 4 is a conventional guide pipe 1. FIG. 2 is an external view showing the main parts of the solder supply device. In the figure, 1... guide pipe (guiding means), 2,
5... Air pipe, 3... Guide pipe, 4... Connecting member,
6...Blower port, 7...Blower means, 10...Stocker, 15...Solder tip, H...Solder, f...Flux smoke.

Claims (1)

【実用新案登録請求の範囲】 半田付け用の半田を半田コテに対して供給する
半田供給装置であつて、 前記半田を前記半田コテに向けて案内する案内
手段の開口部の周縁に、送風手段に接続される送
風管を配設し、 半田付け動作時に前記送風管を介して送風する
ことにより、 前記案内手段の開口部においてフラツクスが固
化して付着することを防止したことを特徴とする
半田供給装置。[Scope of Claim for Utility Model Registration] A solder supply device for supplying solder for soldering to a soldering iron, comprising an air blowing means at the periphery of an opening of a guiding means for guiding the solder toward the soldering iron. A soldering device characterized in that a blower pipe connected to the guide means is provided, and by blowing air through the blower pipe during the soldering operation, flux is prevented from solidifying and adhering at the opening of the guide means. Feeding device.
JP811790U 1990-02-01 1990-02-01 Pending JPH03101364U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP811790U JPH03101364U (en) 1990-02-01 1990-02-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP811790U JPH03101364U (en) 1990-02-01 1990-02-01

Publications (1)

Publication Number Publication Date
JPH03101364U true JPH03101364U (en) 1991-10-22

Family

ID=31511759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP811790U Pending JPH03101364U (en) 1990-02-01 1990-02-01

Country Status (1)

Country Link
JP (1) JPH03101364U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018103255A (en) * 2016-12-28 2018-07-05 アズビル株式会社 Solder material supply machine

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59220283A (en) * 1983-05-30 1984-12-11 Fujitsu Ltd Wire bonding device
JPS6066496A (en) * 1983-09-22 1985-04-16 松下電器産業株式会社 Method of connecting substrate both-side circuit
JPH02147162A (en) * 1988-11-29 1990-06-06 Shin Meiwa Ind Co Ltd Soldering method in automatic soldering apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59220283A (en) * 1983-05-30 1984-12-11 Fujitsu Ltd Wire bonding device
JPS6066496A (en) * 1983-09-22 1985-04-16 松下電器産業株式会社 Method of connecting substrate both-side circuit
JPH02147162A (en) * 1988-11-29 1990-06-06 Shin Meiwa Ind Co Ltd Soldering method in automatic soldering apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018103255A (en) * 2016-12-28 2018-07-05 アズビル株式会社 Solder material supply machine

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