JPH0172974U - - Google Patents
Info
- Publication number
- JPH0172974U JPH0172974U JP1987169776U JP16977687U JPH0172974U JP H0172974 U JPH0172974 U JP H0172974U JP 1987169776 U JP1987169776 U JP 1987169776U JP 16977687 U JP16977687 U JP 16977687U JP H0172974 U JPH0172974 U JP H0172974U
- Authority
- JP
- Japan
- Prior art keywords
- soldering iron
- solder
- supply mechanism
- solder supply
- vicinity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 7
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案に係る半田供給機構付半田ごて
の一実施例の平面図、第２図は第１図の−断
面図、第３図は第２図の作動状態を示す断面図で
ある。
１……半田供給機構部、２……半田ごて部（半
田ごて）、１０……半田供給機構付半田ごて、２
０……糸半田（半田）。
FIG. 1 is a plan view of an embodiment of a soldering iron with a solder supply mechanism according to the present invention, FIG. 2 is a cross-sectional view taken from FIG. be. 1... Solder supply mechanism section, 2... Soldering iron section (soldering iron), 10... Soldering iron with solder supply mechanism, 2
0... Thread solder (solder).
Claims (1)
近傍に向けて線状の半田を供給する半田供給機構
を並設して構成したこと、を特徴とする半田供給
機構付半田ごて。 A soldering iron with a solder supply mechanism, characterized in that the soldering iron is configured with a solder supply mechanism that supplies linear solder to the vicinity of the melted solder portion at the tip of the soldering iron. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987169776U JPH0172974U (en) | 1987-11-06 | 1987-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987169776U JPH0172974U (en) | 1987-11-06 | 1987-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0172974U true JPH0172974U (en) | 1989-05-17 |
Family
ID=31460132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987169776U Pending JPH0172974U (en) | 1987-11-06 | 1987-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0172974U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2005000515A1 (en) * | 2003-06-26 | 2006-11-02 | ぺんてる株式会社 | Wire feeding device and wire solder |
-
1987
- 1987-11-06 JP JP1987169776U patent/JPH0172974U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2005000515A1 (en) * | 2003-06-26 | 2006-11-02 | ぺんてる株式会社 | Wire feeding device and wire solder |
| JP4609320B2 (en) * | 2003-06-26 | 2011-01-12 | ぺんてる株式会社 | Wire feeding device |
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