JPS63111263U - - Google Patents

Info

Publication number
JPS63111263U
JPS63111263U JP1987001659U JP165987U JPS63111263U JP S63111263 U JPS63111263 U JP S63111263U JP 1987001659 U JP1987001659 U JP 1987001659U JP 165987 U JP165987 U JP 165987U JP S63111263 U JPS63111263 U JP S63111263U
Authority
JP
Japan
Prior art keywords
soldering
soldered
soldering iron
solder
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987001659U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987001659U priority Critical patent/JPS63111263U/ja
Publication of JPS63111263U publication Critical patent/JPS63111263U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の半田コテの側面図、第２図は
コテ先の平面図、第３図はコテ先の側面図、第４
図はコテ先の底面図、第５図は使用状態の断面図
、第６図はコテ先からＩＣを取外すための取外装
置の一例を示す側面図、第７図は同底面図、第８
図は取外装置の他例を示す断面図、第９図は磁石
の取付状態の他の実施例を示す断面図、第１０図
はフラツトパツケージＩＣの断面図、第１１図は
同平面図、第１２図は従来の半田コテの側面図で
ある。 １１……半田コテ、１２……コテ先、１３……
加熱部、１４……凹部、１５……磁石。 Fig. 1 is a side view of the soldering iron of the present invention, Fig. 2 is a plan view of the soldering iron tip, Fig. 3 is a side view of the soldering iron tip, and Fig. 4 is a side view of the soldering iron of the present invention.
The figure is a bottom view of the soldering iron tip, FIG. 5 is a sectional view of the soldering iron tip, FIG.
The figure is a sectional view showing another example of the removal device, FIG. 9 is a sectional view showing another example of the magnet attachment state, FIG. 10 is a sectional view of a flat package IC, and FIG. 11 is a plan view of the same. , FIG. 12 is a side view of a conventional soldering iron. 11...Soldering iron, 12...Soldering iron tip, 13...
Heating section, 14... recess, 15... magnet.

Claims (1)

【実用新案登録請求の範囲】 コテ先の一端部を被半田付け部材の平面形状に
見合う平面形状に形成し、該一端部側で前記被半
田付け部材の半田付け部を加熱して、該半田付け
部の半田を溶かすようにした半田コテにおいて、 前記コテ先の一端部には、半田付け部の半田を
溶かされた被半田付け部材を吸着する磁石を設け
たことを特徴とする半田コテ。[Claims for Utility Model Registration] One end of the soldering iron tip is formed into a planar shape that matches the planar shape of the component to be soldered, and the soldering portion of the component to be soldered is heated on the side of the one end to solder the soldering part. 1. A soldering iron configured to melt solder in a soldering part, characterized in that one end of the soldering iron tip is provided with a magnet that attracts a member to be soldered to which the solder in the soldering part has been melted.
JP1987001659U 1987-01-09 1987-01-09 Pending JPS63111263U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987001659U JPS63111263U (en) 1987-01-09 1987-01-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987001659U JPS63111263U (en) 1987-01-09 1987-01-09

Publications (1)

Publication Number Publication Date
JPS63111263U true JPS63111263U (en) 1988-07-16

Family

ID=30779777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987001659U Pending JPS63111263U (en) 1987-01-09 1987-01-09

Country Status (1)

Country Link
JP (1) JPS63111263U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53124860A (en) * 1977-04-08 1978-10-31 Hitachi Ltd Pincette in use of magnet
JPS582548A (en) * 1981-06-29 1983-01-08 Toshiba Corp Air conditioner
JPS582548U (en) * 1981-06-26 1983-01-08 松下電器産業株式会社 solar water heater

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53124860A (en) * 1977-04-08 1978-10-31 Hitachi Ltd Pincette in use of magnet
JPS582548U (en) * 1981-06-26 1983-01-08 松下電器産業株式会社 solar water heater
JPS582548A (en) * 1981-06-29 1983-01-08 Toshiba Corp Air conditioner

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