JPH0334228U - - Google Patents
Info
- Publication number
- JPH0334228U JPH0334228U JP9471489U JP9471489U JPH0334228U JP H0334228 U JPH0334228 U JP H0334228U JP 9471489 U JP9471489 U JP 9471489U JP 9471489 U JP9471489 U JP 9471489U JP H0334228 U JPH0334228 U JP H0334228U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead terminal
- recess
- resin
- preventing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例に係る電子部品を示
す断面模式図、第２図は同電子部品のリード端子
に形成された半田流れ止め用の凹部の形状の変形
例を示す側面図、第３図は同リード端子の平面図
、第４図は第２図に示すリード端子の形状の変形
例を示す断面模式図、第５図は従来の電子部品を
示す断面模式図である。
符号の説明、１……電子部品、２……基板、３
……電極、４……リード端子、５……半田、６…
…樹脂、７，７ａ，７ａ′……半田流れ止め用の
凹部。
FIG. 1 is a schematic cross-sectional view showing an electronic component according to an embodiment of the present invention, and FIG. 2 is a side view showing a modified example of the shape of a recess for preventing solder flow formed in a lead terminal of the electronic component. FIG. 3 is a plan view of the lead terminal, FIG. 4 is a schematic cross-sectional view showing a modification of the shape of the lead terminal shown in FIG. 2, and FIG. 5 is a schematic cross-sectional view showing a conventional electronic component. Explanation of symbols, 1... Electronic component, 2... Board, 3
...electrode, 4...lead terminal, 5...solder, 6...
...Resin, 7, 7a, 7a'... Recesses for preventing solder flow.
Claims (1)
より接続された後樹脂外装されてなる電子部品に
おいて、 上記リード端子の外装部内の部分に半田流れ止
め用の凹部を形成したことを特徴とする電子部品
。[Claims for Utility Model Registration] In an electronic component in which a lead terminal is connected to an electrode formed on a board by soldering and then covered with a resin, a recess for preventing the flow of solder is provided inside the exterior of the lead terminal. An electronic component characterized by being formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9471489U JPH0334228U (en) | 1989-08-11 | 1989-08-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9471489U JPH0334228U (en) | 1989-08-11 | 1989-08-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0334228U true JPH0334228U (en) | 1991-04-04 |
Family
ID=31644027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9471489U Pending JPH0334228U (en) | 1989-08-11 | 1989-08-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0334228U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006161292A (en) * | 2004-12-02 | 2006-06-22 | Nisshin Steel Co Ltd | Swing door excellent in aesthetic appearance |
-
1989
- 1989-08-11 JP JP9471489U patent/JPH0334228U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006161292A (en) * | 2004-12-02 | 2006-06-22 | Nisshin Steel Co Ltd | Swing door excellent in aesthetic appearance |
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