JPS63155666U - - Google Patents
Info
- Publication number
- JPS63155666U JPS63155666U JP4813687U JP4813687U JPS63155666U JP S63155666 U JPS63155666 U JP S63155666U JP 4813687 U JP4813687 U JP 4813687U JP 4813687 U JP4813687 U JP 4813687U JP S63155666 U JPS63155666 U JP S63155666U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- melted
- heat
- shrinkable resin
- discrete component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例を示す側面図、第２
図は第１図のハンダデイツプ前の状態を示す側面
図、第３図乃至第５図はそれぞれ異なる従来例を
示す側面図である。
１……熱収縮型樹脂、２……基板、３……導体
パターン、４……ハンダ、５……部品リード、６
……デイスクリート部品。
Figure 1 is a side view showing one embodiment of the present invention;
This figure is a side view showing the state before soldering in FIG. 1, and FIGS. 3 to 5 are side views showing different conventional examples. 1... Heat shrinkable resin, 2... Board, 3... Conductor pattern, 4... Solder, 5... Component lead, 6
...Discrete parts.
Claims (1)
熱収縮型樹脂を、前記デイスクリート部品のハン
ダ接合と同時に溶融し、該溶融した熱収縮型樹脂
により基板と部品リードを固定してなることを特
徴とするプリント配線板。 A heat-shrinkable resin inserted in advance into the lead of a discrete component is melted at the same time as the discrete component is soldered, and the melted heat-shrinkable resin fixes the board and the component lead. printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4813687U JPS63155666U (en) | 1987-03-31 | 1987-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4813687U JPS63155666U (en) | 1987-03-31 | 1987-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63155666U true JPS63155666U (en) | 1988-10-12 |
Family
ID=30869390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4813687U Pending JPS63155666U (en) | 1987-03-31 | 1987-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63155666U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04132704U (en) * | 1991-05-29 | 1992-12-09 | 株式会社村田製作所 | dielectric resonance device |
-
1987
- 1987-03-31 JP JP4813687U patent/JPS63155666U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04132704U (en) * | 1991-05-29 | 1992-12-09 | 株式会社村田製作所 | dielectric resonance device |