JPS63192622U - - Google Patents
Info
- Publication number
- JPS63192622U JPS63192622U JP8214287U JP8214287U JPS63192622U JP S63192622 U JPS63192622 U JP S63192622U JP 8214287 U JP8214287 U JP 8214287U JP 8214287 U JP8214287 U JP 8214287U JP S63192622 U JPS63192622 U JP S63192622U
- Authority
- JP
- Japan
- Prior art keywords
- electrode lead
- circuit board
- printed circuit
- soldering
- mounting foot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 2
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 2
Landscapes
- Coils Or Transformers For Communication (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Television Scanning (AREA)
Description
第１図ａ，ｂは加熱後の本考案の第１の実施例
の説明図、第２図ａ，ｂは加熱前の本考案の第１
の実施例の説明図、第３図はａ，ｂはプリント基
板に実装された状態の本考案の第１の実施例の説
明図、第４図は本考案の第２の実施例の斜視図、
第５図は第４図の実施例がプリント基板に実装さ
れた状態の模式説明図、第６図は従来の電気部品
がプリント基板に実装された状態の説明図である
。
１……プリント基板、３，６……孔部、４，４
ａ……電極リード、５，５ａ……実装用足部、７
……電気部品。
Figures 1a and b are explanatory diagrams of the first embodiment of the present invention after heating, and Figures 2a and b are illustrations of the first embodiment of the present invention before heating.
3 is an explanatory diagram of the first embodiment of the present invention mounted on a printed circuit board, and FIG. 4 is a perspective view of the second embodiment of the present invention. ,
FIG. 5 is a schematic explanatory diagram of the embodiment shown in FIG. 4 mounted on a printed circuit board, and FIG. 6 is an explanatory diagram of a conventional electrical component mounted on a printed circuit board. 1... Printed circuit board, 3, 6... Hole, 4, 4
a...electrode lead, 5, 5a...foot for mounting, 7
……Electrical component.
Claims (1)
るいは電極リードおよび実装用足部が挿入され、
半田付けされることにより該プリント基板に実装
される電気部品において、 該電極リードおよび／または実装用足部が該半
田付けの熱により屈折する形状記憶合金で構成さ
れることを特徴とする電気部品。[Scope of Claim for Utility Model Registration] An electrode lead or an electrode lead and a mounting foot are inserted into a hole provided in a printed circuit board,
An electrical component mounted on the printed circuit board by soldering, wherein the electrode lead and/or the mounting foot are made of a shape memory alloy that bends due to the heat of the soldering. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8214287U JPS63192622U (en) | 1987-05-30 | 1987-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8214287U JPS63192622U (en) | 1987-05-30 | 1987-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63192622U true JPS63192622U (en) | 1988-12-12 |
Family
ID=30934524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8214287U Pending JPS63192622U (en) | 1987-05-30 | 1987-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63192622U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07246861A (en) * | 1994-03-10 | 1995-09-26 | Mitsubishi Electric Corp | Safety device for vehicle |
-
1987
- 1987-05-30 JP JP8214287U patent/JPS63192622U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07246861A (en) * | 1994-03-10 | 1995-09-26 | Mitsubishi Electric Corp | Safety device for vehicle |