JPS6183072U - - Google Patents
Info
- Publication number
- JPS6183072U JPS6183072U JP16876784U JP16876784U JPS6183072U JP S6183072 U JPS6183072 U JP S6183072U JP 16876784 U JP16876784 U JP 16876784U JP 16876784 U JP16876784 U JP 16876784U JP S6183072 U JPS6183072 U JP S6183072U
- Authority
- JP
- Japan
- Prior art keywords
- lead wires
- printed circuit
- circuit board
- slit
- bored
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007493 shaping process Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例のプリント基板によ
りリード線を整形、固定した状態を示す平面図、
第２図は同実施例のプリント基板の平面図、第３
図は第１図に示すＡ−Ａ′部分の断面図、第４図
は従来のプリント基板にリード線を整形、固定し
た状を示す平面図である。
６…基板、６ａ…スリツト、７…リード線、８
…発熱部品、９…電子部品、１０…接着剤。
FIG. 1 is a plan view showing a state in which lead wires are shaped and fixed by a printed circuit board according to an embodiment of the present invention;
Figure 2 is a plan view of the printed circuit board of the same embodiment, Figure 3 is a plan view of the printed circuit board of the same embodiment.
The figure is a sectional view taken along the line A-A' shown in FIG. 1, and FIG. 4 is a plan view showing a state in which lead wires are shaped and fixed to a conventional printed circuit board. 6... Board, 6a... Slit, 7... Lead wire, 8
...heat generating component, 9...electronic component, 10...adhesive.
Claims (1)
板において、リード線屈曲部にリード線整形用ス
リツトを穿設してなるプリント基板。 A printed circuit board on which lead wires are arranged along with various parts, and in which a slit for shaping the lead wires is bored in the bent portion of the lead wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16876784U JPS6183072U (en) | 1984-11-06 | 1984-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16876784U JPS6183072U (en) | 1984-11-06 | 1984-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6183072U true JPS6183072U (en) | 1986-06-02 |
Family
ID=30726528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16876784U Pending JPS6183072U (en) | 1984-11-06 | 1984-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6183072U (en) |
-
1984
- 1984-11-06 JP JP16876784U patent/JPS6183072U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6183072U (en) | ||
| JPS60194367U (en) | printed wiring board | |
| JPH0418474U (en) | ||
| JPS61192479U (en) | ||
| JPS6249271U (en) | ||
| JPS6390802U (en) | ||
| JPH0456374U (en) | ||
| JPS6389281U (en) | ||
| JPS6245868U (en) | ||
| JPS63155698U (en) | ||
| JPS63192622U (en) | ||
| JPH0241474U (en) | ||
| JPS6294688U (en) | ||
| JPS5842902U (en) | Resistor structure of hybrid integrated circuit | |
| JPS61207019U (en) | ||
| JPS61188362U (en) | ||
| JPS62197895U (en) | ||
| JPS6349252U (en) | ||
| JPH01137550U (en) | ||
| JPS6244406U (en) | ||
| JPS6212978U (en) | ||
| JPS62177049U (en) | ||
| JPS6320453U (en) | ||
| JPS61102033U (en) | ||
| JPS61183577U (en) |