JPH0320876U - - Google Patents
Info
- Publication number
- JPH0320876U JPH0320876U JP8130089U JP8130089U JPH0320876U JP H0320876 U JPH0320876 U JP H0320876U JP 8130089 U JP8130089 U JP 8130089U JP 8130089 U JP8130089 U JP 8130089U JP H0320876 U JPH0320876 U JP H0320876U
- Authority
- JP
- Japan
- Prior art keywords
- connector terminal
- alloy
- connector
- soldering
- state
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims 3
- 239000000956 alloy Substances 0.000 claims 3
- 229910000734 martensite Inorganic materials 0.000 claims 2
- 238000000465 moulding Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は、本考案の表面実装コネクタ端子の側
面図、第２図はコネクタ端子を第２次成型した状
態の側面図、第３図はコネクタ端子を第１の形状
に復元させはんだ付けをした状態の側面図である
。
１……コネクタ本体、２……コネクタ端子、３
……はんだ付け面、４……ＰＷＢ、５……はんだ
ペースト。
Fig. 1 is a side view of the surface mount connector terminal of the present invention, Fig. 2 is a side view of the connector terminal after secondary molding, and Fig. 3 is a side view of the connector terminal after it is restored to its first shape and soldered. FIG. 1...Connector body, 2...Connector terminal, 3
...Soldering surface, 4...PWB, 5...Solder paste.
Claims (1)
ナイト状態からマルテンサイト状態に可逆的に変
化する合金からなり、該合金がオーステナイト状
態にあるとき、該コネクタ端子をコネクタ本体に
組み込だ場合に、コネクタ端子の先端のはんだ付
け部が、上記コネクタ本体と接合するプリント配
線基板のはんだ付け面と同一面上、または該んだ
付け面より下方に位置するように、上記コネクタ
端子を第１次成型し、上記合金を冷却してマルテ
ンサイト状態としたときに、上記コネクタ端子を
、上記はんだ付け面より上方に位置するように第
２次成型してなることを特徴とする表面実装コネ
クタ端子。 The connector terminal is made of an alloy that reversibly changes from an austenitic state to a martensitic state when cooled, and when the alloy is in the austenitic state, when the connector terminal is assembled into a connector body, the The connector terminal is first molded so that the soldering part at the tip is on the same plane as the soldering surface of the printed wiring board to be joined to the connector main body, or is located below the soldering surface, and A surface mount connector terminal characterized in that the connector terminal is second-molded so as to be located above the soldering surface when the alloy is cooled to a martensitic state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8130089U JPH0320876U (en) | 1989-07-11 | 1989-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8130089U JPH0320876U (en) | 1989-07-11 | 1989-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0320876U true JPH0320876U (en) | 1991-02-28 |
Family
ID=31627119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8130089U Pending JPH0320876U (en) | 1989-07-11 | 1989-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0320876U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4820456B1 (en) * | 2011-01-26 | 2011-11-24 | 健吾 中村 | Shoe spatula with hook for raising the tongue |
-
1989
- 1989-07-11 JP JP8130089U patent/JPH0320876U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4820456B1 (en) * | 2011-01-26 | 2011-11-24 | 健吾 中村 | Shoe spatula with hook for raising the tongue |