JPH0231148U - - Google Patents
Info
- Publication number
- JPH0231148U JPH0231148U JP10906988U JP10906988U JPH0231148U JP H0231148 U JPH0231148 U JP H0231148U JP 10906988 U JP10906988 U JP 10906988U JP 10906988 U JP10906988 U JP 10906988U JP H0231148 U JPH0231148 U JP H0231148U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- electronic component
- diameter
- package
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案のリード構造を有する電子部品
の斜視図、第２図はそのリード部分の拡大斜視図
、第３図はリード部分の拡大正面図、第４図は本
考案の他の実施例のリード部分の拡大斜視図、第
５図はリード部分の拡大正面図である。
１……電子部品、２……パツケージ、３，３Ａ
……リード、４……印刷配線基板、５……半田付
けランド。
Fig. 1 is a perspective view of an electronic component having the lead structure of the present invention, Fig. 2 is an enlarged perspective view of the lead portion thereof, Fig. 3 is an enlarged front view of the lead portion, and Fig. 4 is another embodiment of the present invention. FIG. 5 is an enlarged perspective view of an example lead portion, and FIG. 5 is an enlarged front view of the lead portion. 1...Electronic parts, 2...Package, 3,3A
...Lead, 4...Printed wiring board, 5...Soldering land.
Claims (1)
付けランドに接触して半田付けされるリードを備
える電子部品において、該リードの先端を梯形、
半円径、半楕円径、又は多角形に形成したことを
特徴とする電子部品のリード構造。 In an electronic component having a lead that protrudes from a package and is soldered in contact with a soldering land of a printed wiring board, the tip of the lead is shaped like a trapezoid,
A lead structure for an electronic component characterized by having a semicircular diameter, a semielliptical diameter, or a polygonal shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10906988U JPH0231148U (en) | 1988-08-22 | 1988-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10906988U JPH0231148U (en) | 1988-08-22 | 1988-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0231148U true JPH0231148U (en) | 1990-02-27 |
Family
ID=31344982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10906988U Pending JPH0231148U (en) | 1988-08-22 | 1988-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231148U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020035947A (en) * | 2018-08-31 | 2020-03-05 | 日本航空電子工業株式会社 | Soldering component |
-
1988
- 1988-08-22 JP JP10906988U patent/JPH0231148U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020035947A (en) * | 2018-08-31 | 2020-03-05 | 日本航空電子工業株式会社 | Soldering component |