JPH0392054U - - Google Patents
Info
- Publication number
- JPH0392054U JPH0392054U JP15085689U JP15085689U JPH0392054U JP H0392054 U JPH0392054 U JP H0392054U JP 15085689 U JP15085689 U JP 15085689U JP 15085689 U JP15085689 U JP 15085689U JP H0392054 U JPH0392054 U JP H0392054U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- hybrid integrated
- integrated circuit
- circuit device
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は、本考案の実施例である混成集積回路
装置を示す斜視図、第２図はその正面図、第３図
は、他の実施例である混成集積回路装置を示す正
面図、第４図は、他の実施例である混成集積回路
装置を示す正面図、第５図は、従来例である混成
集積回路装置を示す正面図である。
１……第一の回路基板、２，２′……第二の回
路基板、３，３′……第三の回路基板、４，５…
…電子部品、６，８……リード端子、６ａ，８ａ
……リード端子の先端部。
FIG. 1 is a perspective view showing a hybrid integrated circuit device according to an embodiment of the present invention, FIG. 2 is a front view thereof, and FIG. 3 is a front view showing a hybrid integrated circuit device according to another embodiment. FIG. 4 is a front view showing a hybrid integrated circuit device according to another embodiment, and FIG. 5 is a front view showing a conventional hybrid integrated circuit device. 1... First circuit board, 2, 2'... Second circuit board, 3, 3'... Third circuit board, 4, 5...
...Electronic component, 6, 8...Lead terminal, 6a, 8a
...The tip of the lead terminal.
Claims (1)
を搭載してなる混成集積回路装置において、前記
第二の回路基板２，２′の板面からほぼ垂直に導
出されたリード端子６の先端部６ａが、前記第一
の回路基板１の板面に形成された端子電極７に半
田付けされていることを特徴とする混成集積回路
装置。 A second circuit board 2, 2' is placed on the first circuit board 1.
In the hybrid integrated circuit device, the tip portion 6a of the lead terminal 6 led out almost perpendicularly from the board surface of the second circuit board 2, 2' is connected to the board surface of the first circuit board 1. A hybrid integrated circuit device characterized in that the hybrid integrated circuit device is soldered to a terminal electrode 7 formed in the .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15085689U JPH0392054U (en) | 1989-12-30 | 1989-12-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15085689U JPH0392054U (en) | 1989-12-30 | 1989-12-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0392054U true JPH0392054U (en) | 1991-09-19 |
Family
ID=31697188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15085689U Pending JPH0392054U (en) | 1989-12-30 | 1989-12-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0392054U (en) |
-
1989
- 1989-12-30 JP JP15085689U patent/JPH0392054U/ja active Pending