JPH0357474U - - Google Patents
Info
- Publication number
- JPH0357474U JPH0357474U JP11763089U JP11763089U JPH0357474U JP H0357474 U JPH0357474 U JP H0357474U JP 11763089 U JP11763089 U JP 11763089U JP 11763089 U JP11763089 U JP 11763089U JP H0357474 U JPH0357474 U JP H0357474U
- Authority
- JP
- Japan
- Prior art keywords
- soldering iron
- suction mechanism
- iron
- hole
- chip parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の全体斜視図、第２図は第１図
Ａ部拡大図、第３図及び第４図は作業状態図であ
る。
１……はんだごて本体、２……こて先、３……
スイツチＡ、４……フイルタ、５……ホース、６
……パイプ、７ａ，７ｂ……吸取穴、８……吸着
穴、９……コード、１０……バキユームポンプ付
コントローラー、１１……スイツチＢ、１２……
貫通穴、１３……ヒーター部、１４……温度調整
用つまみ、１５ａ，１５ｂ……パツド、１６……
キバン、１７ａ，１７ｂ……はんだ、１８……チ
ツプ部品。
FIG. 1 is an overall perspective view of the present invention, FIG. 2 is an enlarged view of section A in FIG. 1, and FIGS. 3 and 4 are working state diagrams. 1...Soldering iron body, 2...Soldering iron tip, 3...
Switch A, 4...Filter, 5...Hose, 6
... Pipe, 7a, 7b ... Suction hole, 8 ... Suction hole, 9 ... Cord, 10 ... Controller with vacuum pump, 11 ... Switch B, 12 ...
Through hole, 13... Heater section, 14... Temperature adjustment knob, 15a, 15b... Pad, 16...
Kiban, 17a, 17b...Solder, 18...Chip parts.
Claims (1)
の作用を伝達する貫通穴を有したことを特徴とす
るチツプ部品取外し用はんだごて。 1. A soldering iron for removing chip parts, characterized in that the soldering iron is equipped with a suction mechanism, and has a through hole in the iron tip through which the action from the suction mechanism is transmitted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11763089U JPH0357474U (en) | 1989-10-06 | 1989-10-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11763089U JPH0357474U (en) | 1989-10-06 | 1989-10-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0357474U true JPH0357474U (en) | 1991-06-03 |
Family
ID=31665843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11763089U Pending JPH0357474U (en) | 1989-10-06 | 1989-10-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0357474U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008163964A (en) * | 2006-12-27 | 2008-07-17 | Asahi Kasei Homes Kk | Sleeve |
-
1989
- 1989-10-06 JP JP11763089U patent/JPH0357474U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008163964A (en) * | 2006-12-27 | 2008-07-17 | Asahi Kasei Homes Kk | Sleeve |