JPWO2013038725A1 - Inspection jig - Google Patents

Abstract

This is an inspection jig for detecting the jet state of solder under the same conditions as soldering to a substrate. In particular, an inspection plate 22 having heat resistance that does not deform due to the heat effect of solder and translucency that allows a pattern formed by solder that contacts the lower surface to be visible from the upper surface side is provided.

Description

  The present invention relates to an inspection jig used in a solder jet device.

  Conventionally, as an inspection jig used in a solder jet device, a plurality of needle bolts that can be finely moved independently in the vertical direction and a jet shape measured by these needle bolts are known (for example, Patent Document 1).

  Further, as another inspection jig used in the solder jet device, one having a measuring unit having a shape that matches the target jet shape is known in order to measure the shape of the solder in the jet state ( For example, see Patent Document 2).

  However, any of the above-described inspection jigs can only measure the shape of a part of the solder in a jet state, and cannot detect how the solder jetted onto the substrate to be soldered is hit. .

  For this reason, it is inevitable that a deviation occurs between the measurement result and the actual soldering.

JP-A-5-69121 Japanese Patent Laid-Open No. 11-340621

  An object of the present invention is to provide an inspection jig capable of detecting the contact condition of solder jetted onto a base material under the same conditions as soldering on the base material.

As a means for solving the above problems, the present invention provides:
An inspection jig for inspecting a solder jet state,
It has an inspection plate having heat resistance that does not deform due to the thermal influence of the solder, and translucency that enables inspection of the contact state of the solder to one surface from the other surface side.

  With this configuration, the state on one surface where the solder actually contacts can be detected from the other surface.

  For this reason, it is possible to accurately determine whether or not the conditions for soldering are appropriate and whether or not there is a problem in the apparatus for soldering.

  The inspection plate preferably has a reference line for judging the contact state of the solder to one surface.

  With this configuration, it is possible to easily determine whether or not the solder contact state is appropriate based on the reference line.

  The inspection plate is transported at a constant speed on the same transport path as the base material to be soldered, and the reference line preferably extends in a direction perpendicular to the transport direction.

  With this configuration, it is possible to easily determine whether or not the pattern formed by the solder contacting the inspection plate is appropriate based on the reference line.

  The inspection plate preferably has at least one measurement line that extends in a direction orthogonal to the transport direction and is formed on the transport direction side of the reference line.

  With this configuration, the leading edge of the solder pattern when the trailing edge of the solder pattern formed on the inspection plate moving at a constant speed (the edge located on the side opposite to the conveying direction) matches the reference line. Based on the positional relationship between the (edge located on the conveyance direction side) and the measurement line, it can be determined whether or not the range in which the solder contacts is appropriate.

A support frame having a first measurement part and a second measurement part;
The inspection plate held by the first measurement unit and the second measurement unit of the support plate, respectively,
The second measuring unit preferably includes a plurality of openings for guiding the jetted solder to the inspection plate.

  With this configuration, in the second measurement unit, the solder enters the opening and then contacts the inspection plate. For this reason, the properties (temperature and viscosity) of the solder can be accurately grasped from the contact state with the inspection plate.

The support frame includes a third measurement unit including a plurality of openings communicating the front and back surfaces,
It is preferable to provide a solder detection device that detects the immersion height (depth) of the solder that has entered each opening of the third measurement unit.

  With this configuration, it is possible to detect the immersion height (depth) of the solder that has entered the opening of the third measurement unit with the solder detection device, so whether or not the desired immersion height (depth) is obtained. It can be easily grasped.

  It is preferable that the solder detection device includes a plurality of measurement pins respectively disposed in the openings, and a notification unit that notifies when the measurement pins come into contact with the solder.

  With this configuration, when the measurement pin is immersed in the solder, the notification unit notifies the user, so that the user can easily grasp the immersion height of the solder.

  The measurement pin preferably includes a heater for preventing the solder from adhering.

  With this configuration, solder does not adhere to the measurement pin, and detection in a good state can always be performed.

  Further, the present invention provides an inspection jig for inspecting a solder jet state as a means for solving the above-mentioned problem, and detects the solder jet state by a pattern formed by the solder flowed. The configuration has a possible first measurement unit.

  The inspection jig configured as described above is an inspection jig for inspecting the solder jet state, and preferably has a second measuring unit capable of detecting the state of the jet pressure of the solder that has been jetted.

  In addition, the present invention is preferably an inspection jig for inspecting a jet state of solder, and has a third measurement unit capable of detecting the immersion height of the jetted solder.

  According to the present invention, since the inspection plate having heat resistance and translucency is used, the contact state of the solder that contacts one surface of the inspection plate, which could not be detected conventionally, is detected from the other surface. can do.

It is a top view which shows the outline of the soldering apparatus which concerns on 1st Embodiment. It is a front view which shows the outline of the soldering apparatus which concerns on 1st Embodiment. It is the elements on larger scale which show a part of component of the preheating apparatus of FIG. 2, and a solder jet apparatus. (A) is a top view which shows the conveying apparatus of FIG. 2, (b) is the BB sectional drawing of (a) which shows the support state of the base material by the guide block. It is a top view of the jig | tool for an inspection used with the solder jet apparatus of FIG. It is the sectional view on the AA line of FIG. (A) is a top view of the support frame of FIG. 5, (b) is the BB sectional drawing of (a). It is sectional drawing which shows the outline of the solder detection apparatus used with the jig | tool for an inspection of FIG. (A) is a top view of the jig for inspection concerning a 2nd embodiment, (b) is a BB line sectional view of (a), and (c) is a CC line sectional view of (a). (A) is a top view of the support frame of FIG. 9, (b) is a partially broken front view of (a). (A) is side surface sectional drawing of the 1st solder detection part of FIG. 7, (b) is front sectional drawing. (A) is a front view which shows the outline of the state which is conveying the base material of the soldering apparatus which concerns on 3rd Embodiment in a horizontal direction, (b) is the front which shows the state which dropped the base material from (a) FIG. (A), (b) is front sectional drawing and the top view which show the outline of the solder jet apparatus of FIG. (A) is sectional drawing which shows the outline of the jet state to the test jig | tool by the solder jet apparatus of FIG. 13, (b) is a partial top view which shows the reference line of the test plate of a test jig. (A), (b), (c) is sectional drawing which shows the outline of the jet state to the base material by the solder jet apparatus of FIG. It is a top view which shows the test | inspection plate of the test jig | tool which concerns on other embodiment.

DESCRIPTION OF SYMBOLS 1 ... Flux application apparatus 2 ... Preheating apparatus 3 ... Solder jet apparatus 4 ... Conveyance apparatus 5 ... Inspection jig 6 ... Flux spray nozzle 7 ... Preheating heater unit 8 ... Solder tank 9 ... 1st jet part 10 ... 2nd jet part DESCRIPTION OF SYMBOLS 11 ... 1st solder tank 12 ... 1st nozzle part 13 ... 2nd solder tank 14 ... 2nd nozzle part 15 ... Loading conveyor 16 ... 1st conveyance conveyor 17 ... Transfer conveyor 18 ... 2nd conveyance conveyor 19 ... Guide block 20 ... Guide groove 21 ... Support frame 22 ... Inspection plate 22a ... First inspection plate 22b ... Second inspection plate 22c ... Immersion check plate 23 ... Projection 24 ... First measurement part 25 ... Second measurement part 26 ... 3rd measurement part 27 ... 1st recessed part 28 ... 2nd recessed part 29a, 29b ... 1st opening part 30a, 30b ... 2nd opening part 31 ... 1st measurement line 32 ... 2nd measurement line 33 ... reference line 4 ... Solder detecting device 35 ... electrode portion 36 ... LED
37 ... Measuring pin 38 ... First support arm 39 ... Second support arm 40 ... Support plate 100 ... Inspection jig 101 ... Support frame 102 ... Inspection plate 103 ... First solder detection unit 104 ... Second solder detection unit 105 ... Projection part 106 ... First measurement part 107 ... Second measurement part 108 ... Third measurement part 109 ... Rectangular hole 110 ... Holding claw 111 ... Arch part 112 ... Recess 112a ... Through hole 113 ... Immersion confirmation part 115 ... First 2 measurement lines 116 ... first measurement line 117 ... reference line 119 ... measurement pin 120 ... base plate 121 ... side plate 122 ... elevating plate 123 ... adjustment screw 124 ... energization lead 126 ... electrode portion 127 ... mounting base 128 ... measurement pin 201 ... Flux application device 202 ... Preheating device 203 ... Solder jet device 204 ... Conveying device 205 ... Inspection jig 20 DESCRIPTION OF SYMBOLS ... Solder tank 207 ... Jet nozzle 208 ... Jet pump 209 ... Middle plate 210 ... Partition plate 211 ... Pump region 212 ... Jet region 213 ... Jet nozzle stand 214 ... Lid 215 ... Waste nozzle 216 ... Rectangular frame part 217 ... Reflux passage 218: Pump housing 219: Support base 220 ... Pump screw 220a ... Middle plate fin opening 221 ... Belt conveyor 222 ... Support rail 223 ... Arm member 201 ... Flux application device 202 ... Preheating device 203 ... Solder jet device 204 ... Conveying device 205 DESCRIPTION OF SYMBOLS ... Inspection jig 206 ... Solder tank 207 ... Jet nozzle 208 ... Jet pump 209 ... Middle plate 210 ... Partition plate 211 ... Pump region 212 ... Jet region 213 ... Jet nozzle stand 214 ... Lid 215 ... Waste disposal nozzle 216 ... Rectangular Frame portion 217 ... recirculation passage 218 ... pump Jing 219 ... support stand 220 ... pump screw 221 ... belt conveyor 222 ... support rail 223 ... arm member 224 ... guide rail 225 ... moving rail 226 ... support frame 227 ... inspection plate 228 ... measurement part 229 ... recess 230 ... rectangular hole 231 ... Inclined surface 232 ... Reference frame

Embodiments according to the present invention will be described below with reference to the accompanying drawings.
In the following description, terms indicating specific directions and positions (for example, terms including “up”, “down”, “side”, “end”) are used as necessary. Is for facilitating understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of these terms.
Further, the following description is merely illustrative in nature and is not intended to limit the present invention, its application, or its use.

(First embodiment)
FIG. 1 is a schematic plan view of the soldering apparatus according to the first embodiment, and FIG. 2 is a front view thereof. The soldering apparatus includes a flux application device 1, a preheating device 2, and a solder jet device 3. In particular, the preheating device 2 and the solder jet device 3 are arranged in the same housing. Then, the flux coating device 1, the preheating device 2, and the solder jet device 3 have a base material B and an inspection jig 5 (FIG. 5) (FIG. 5) that are targets of soldering such as a printed circuit board by the transport device 4 (FIG. 4). The inspection jig 100 (FIG. 9) is transported.
In addition, you may arrange | position the flux application | coating apparatus 1, the preheating apparatus 2, and the solder jet apparatus 3 in the same housing.

  As shown in FIGS. 1 and 2, the flux application device 1 is for applying a flux to the lower surface of a base material B (FIGS. 4A and 4B). For this reason, the flux application device 1 includes a flux spray nozzle 6 and sprays and applies the flux to the lower surface of the base material B that passes therethrough. In addition, although the flux application | coating apparatus has illustrated the spray type, a foaming type may be sufficient.

  The preheating device 2 is for raising the temperature of the mounting component of the base material B to a temperature suitable for soldering or a value corresponding to thermal shock (a temperature capable of dealing with the influence of temperature change due to soldering). For this reason, as shown in FIG. 3, the preheating device 2 is transported by a plurality of preheating heater units 7 arranged along the longitudinal direction on the lower side of a later-described transport path (FIG. 4A). ).

  FIG. 3 is a partially enlarged schematic front view showing some of the components of the preheating device 2 and the solder jet device 3. In particular, the solder jet device 3 includes a first jet portion 9 and a second jet portion 10 in the solder tank 8.

The first jet part 9 is provided with a first nozzle part 12 at the upper part of the first solder tank 11. A screw (not shown) is disposed in the first solder tank 11. Power from the motor rotation shaft is transmitted to the rotation shaft of the screw via a belt (the motor may be directly connected to the rotation shaft of the screw. A pump can also be used.)
The first nozzle portion 12 has a rectangular cylindrical shape, and the upper end opening is closed by a lid body 12a (nozzle cap) in which a plurality of through holes are formed. The lid body 12 a is inclined along the conveyance path of the base material B and the inspection jig 5 by the conveyance device 4. Then, when the motor is driven, the screw rotates through the belt, and the molten solder ascends the first nozzle portion 12 and jets in a turbulent state upward from each through hole formed in the lid body 12a. It has become. Thereby, the wettability of the solder with the base material B is ensured.

The second jet part 10 is provided with a second nozzle part 14 in the upper part of the second solder tank 13. In the second solder tank 13, a screw (not shown) that is rotated by a motor via a belt is disposed in the same manner as the first jet section 9 (as in the first jet section 9, the motor May be directly connected to the rotating shaft of the screw, or an electromagnetic induction pump can be used instead of the motor).
Then, the upper end of the second nozzle portion 14 remains open, and the opening edge of the upper end is inclined along the transport path of the base material B and the inspection jig 5 (FIG. 5) by the transport device 4. Yes. When the motor is driven to rotate the screw, the molten solder is jetted in a rectified state through the upper opening of the second nozzle portion 14. As a result, good solder cut shaping is performed.

  The remaining solder jetted from the first jet section 9 and the second jet section 10 and not used for soldering is collected in the solder bath 8 and then returned to the jet sections 9 and 10.

  As described above, the flux coating device 1, the preheating device 2, and the solder jet device 3 are supplied to the base material B (FIG. 4) or the inspection jig 5 (FIG. 5) (the inspection jig 100 (FIG. 9) by the conveying device 4. )) Can be transported.

  As shown in FIG. 1, the transport device 4 transports the base material B and the inspection jig 5 (FIG. 5) into the flux coating device 1 and the inside of the flux coating device 1. A first conveyor 16, a transfer conveyor 17 for transferring from the flux application device 1 to the preheating device 2, and a second conveyor 18 for conveying the preheating device 2 and the solder jet device 3. ing.

  The carry-in conveyor 15 and the first conveyor 16 are arranged in the horizontal direction, and the transit conveyor 17 is arranged so as to gradually become higher in the conveyance direction with a 1/2 gradient of the second conveyor 18. The first transfer conveyor 16 and the transfer conveyor 17 are provided with a plurality of circular rollers at predetermined intervals along the longitudinal direction on opposite surfaces of rails arranged in parallel at predetermined intervals. Then, the worker supplies the base material B or the like onto the carry-in conveyor 15 and moves it to the first transport conveyor 16.

  As shown in FIG. 4A, which is a plan view of the transport device 4, the first transport conveyor 16 is driven by the chain roller 16a by a motor or the like (not shown), and the base material B and the like carried into the flux coating device 1 Is transported at a constant speed. In addition, the transfer conveyor 17 has the same roller 17a as the first conveyor 16, and the base material B and the like carried out from the flux applying device 1 are transferred to the preheating device 2 via the second conveyor 18. And carry.

  The second transfer conveyor 18 is a pair of conveyors that circulate and move on both sides of the transfer path and includes guide blocks 19 having a substantially L-shaped cross section, and gradually increases in the transfer direction with respect to the horizontal plane. Are arranged as follows.

The plurality of guide blocks 19 are integrated with each conveyor, and support the base material B as shown in FIG.
That is, each guide block 19 having a substantially L-shaped cross section has a groove in the central portion of the inward leading end surface, and is aligned in a straight line when passing through the transport path, so that the guide direction on the both sides of the transport path A guide groove 20 extending in the direction is formed. The guide groove 20 can hold the base material B and the protrusion 23 of the inspection jig 5 (FIG. 5) described later. When the conveyor is driven by driving means such as a motor (not shown), the base material B and the like held in the guide groove 20 are conveyed at a constant speed.

  FIG. 5 is a plan view of the inspection jig 5 used in the solder jet device, and FIG. 6 is a cross-sectional view taken along line AA of FIG. The inspection jig 5 is for inspecting the solder jet state in the solder bath 8 (FIG. 1), and includes a support frame 21 and two inspection plates 22 supported by the support frame 21. (First inspection plate 22a, second inspection plate 22b) and an immersion confirmation plate 22c. In addition, the inspection jig 5 includes three regions of a first measurement unit 24, a second measurement unit 25, and a third measurement unit 26 in order from the top side in the transport direction.

  FIG. 7A is a plan view of the support frame 21, and FIG. 7B is a cross-sectional view taken along line BB. The support frame 21 is made of a material excellent in heat resistance such as fiber reinforced plastic in a rectangular shape in plan view. On both side portions of the support frame 21, ridge portions 23 extending in the longitudinal direction are formed. The support frame 21 is supported by the roller 16a of the carry-in conveyor 15 and the first transport conveyor 16, and the guide groove 20 of the guide block 19 of the second transport conveyor 18, and transports the protrusion 23 at a constant speed by driving the conveyor. It has come to be.

  As shown in FIG. 6, the support frame 21 has a first recess 27 formed from the upper surface side in the first measurement unit 24, and a rectangular hole 27 a is formed on the bottom surface thereof so that the upper and lower sides communicate with each other. A first inspection plate 22a is disposed in the first recess 27, and the side edge portion is sandwiched between a plurality of pressing pieces (not shown). On the lower surface side of the support frame 21, an inclined surface 27 b that gradually spreads outward from the inner edge of the rectangular hole 27 a is formed, and an expanded relief recess 27 c is formed.

  As shown in FIG. 6, the support frame 21 has a second recess 28 a formed in the second measurement unit 25 adjacent to the first recess 27 from the upper surface side of the support frame 21. A second inspection plate 22b is disposed in the second recess 28a, and the side edge portion is sandwiched by a plurality of pressing pieces (not shown) similarly to the first inspection plate 22a. Three first openings 29a and five second openings 30a are formed on the bottom surface of the second recess 28a, respectively. On the bottom side of the support frame 21, escape recesses 30 c that are further expanded are formed around the five second openings 30 a.

The first openings 29a are circular through-holes provided at equal intervals at three locations in the width direction of the bottom surface of the second recess 28a. The lower side of the first opening 29 a is configured by a conical surface whose inner diameter dimension gradually increases toward the lower surface of the support frame 21. Thus, the jetted solder is guided to the central portion by the conical surface and comes into contact with the second inspection plate 22b in the first opening 29a. Then, by observing from above the second inspection plate 22b, it is possible to determine the surface pressure of the solder that contacts the second inspection plate 22b.
That is, when the surface pressure is large, the color becomes dark, and when the surface pressure is small, the color becomes whitish. Therefore, it can be determined at a glance whether the surface pressure is appropriate. In addition, the inclination angle of the conical surface with respect to the horizontal plane is set to a first set value (for example, 35 degrees) so that stagnation and flux gas are less likely to occur in the solder flowing into the first opening 29a.
The reason why the first opening 29a is a circular through hole is that the jet surface pressure is adjusted (as in the longitudinal direction of the second opening 30a) because of the portion (soldering masking portion) that is not to be soldered. This is to make it possible to confirm a jet surface pressure state, a jet flow state, and an immersion state for a portion where it is difficult to provide a portion. However, the inner diameter of the through-hole is configured to have a maximum surface pressure increase size.

The second opening 30a is a long hole that extends in the longitudinal direction of the support frame 21 and has a substantially rectangular shape in plan view provided at five locations in the width direction. The four corners of the second opening 30a are formed in an arc shape. On the lower side of the second opening 30 a, a tapered surface is formed that gradually spreads outward toward the lower surface of the support frame 21. Since the four corners of the second opening 30a are formed in an arc shape, it is possible to determine the difference in the viscosity and hardness of the solder by looking at the flow state there.
That is, it can be determined that the viscosity is low if the solder is close to the arc edge, and it can be determined that the viscosity is high if the solder is away.
Note that the angle of the tapered surface of the second opening 30a is preferably set to a second set value (for example, 45 degrees) that is less affected by the viscosity and surface tension of the solder.

  As shown in FIG. 6, the support frame 21 includes a third recess 28b, a first opening 29b, a second opening 30b, and an escape recess 30d having the same shape as the second measurement unit 25 in the third measurement unit 26. Are formed respectively. An immersion confirmation plate 22c is disposed in the third recess 28b, and the side edge is sandwiched by a plurality of pressing pieces (not shown) like the first inspection plate 22a.

As shown in FIG. 6, the inner diameter dimension (measuring hole inner diameter dimension) at the upper opening of the first opening 29b and the second opening 30b is a through hole formed in the base material B to be soldered. The surface pressure state of the solder is set to a value that can be substantially reproduced. However, since there are differences in surface properties such as the formation of copper foil on the surface of the substrate, the inner diameter of the first opening 29b is preferably determined as follows.
That is, when the inner diameter dimension of the first opening 29b is smaller than a certain value, the influence of the surface tension of the solder itself appears when the solder enters. For this reason, it is preferable to set a value that is not easily affected by such surface tension.
If the inner diameter of the first opening 29b is larger than a certain value, the turbulence of the jet surface pressure directly affects the contact state with the inspection plate 22, and appropriate inspection cannot be performed. For this reason, it is preferable to set the value so that solder disturbance is unlikely to occur.

The inspection plate 22 (first inspection plate 22a, second inspection plate 22b) has a substantially rectangular shape in plan view that can be arranged in each of the measurement units 24 and 25. Further, the inspection plate 22 has translucency that allows a pattern formed by contact of the solder jetted to the lower surface thereof to be visible from above, and heat resistance that does not deform depending on the temperature of the molten solder. (For example, Tempax) is used. Furthermore, the thickness dimension of the immersion confirmation plate 22c is the same as the thickness dimension of the base material B such as a substrate to be actually soldered.
The position (height) at which the lower surface of the inspection plate 22 moves coincides with the position (height) at which the lower surface of the base material B to be soldered moves. Therefore, according to the inspection jig 5, it is possible to detect the solder jet state under the same conditions as in the case of actually soldering the base material B.

  As shown in FIG. 5, the first inspection plate 22 a includes a first measurement line 31, a second measurement line 32, and a reference line 33 in a direction orthogonal to the conveyance direction of the inspection jig 5, that is, in the width direction. Are formed respectively.

Here, the first measurement line 31 and the second measurement line 32 are formed by dotted lines, and the reference line 33 is formed by a solid line.
The reference line 33 is the first measurement line 31 and the second measurement line 32, and inspects whether or not the front edge (front edge) of the solder pattern formed on the first inspection plate 22a is in the correct position. Therefore, it is a line that becomes a measurement standard used to align the position of the rear edge (rear edge) of the solder pattern.
In the first measurement line 31, if the soldering conditions jetted from the first nozzle portion 12 are appropriate, the trailing edge of the pattern formed by the solder contacting the lower surface of the first inspection plate 22 a becomes the reference line 33. This is the line that the leading edge is expected to reach when matched. When the trailing edge of the pattern formed by the solder matches the reference line 33, the positional relationship (error) between the leading edge and the first measurement line 31 is confirmed.
Further, if the soldering conditions jetted from the second nozzle portion 14 are appropriate, the second measurement line 32 has a reference line whose trailing edge is a pattern formed by solder contacting the lower surface of the first inspection plate 22a. This is the line that the leading edge is expected to reach when 33 is met. When the trailing edge of the pattern formed by the solder matches the reference line 33, the positional relationship (error) between the leading edge and the second measurement line 32 is confirmed. Then, by looking at the overall shape of the pattern formed on the inspection plate 22 and the state (position and inclination) of the pattern formed by the solder at the reference line 33, the solder jet state can be determined. It has become.

  The second inspection plate 22b held by the second measurement unit 25 sees the pattern formed by the solder that contacts the first opening 29a and the second opening 30a formed in the support frame 21. Used for.

  The immersion confirmation plate 22c has a substantially rectangular shape in a plan view that can be arranged on the third measuring unit 26, and is made of a material having translucency and heat resistance, similar to the inspection plate 22. However, through holes through which the measurement pins 37 can be inserted are formed at positions corresponding to the openings 29b and 30b of the third measurement unit 26 described below.

  As shown in FIG. 6, in the third measurement unit 26, a solder detection device 34 is disposed above the immersion confirmation plate 22c.

  FIG. 8 is a cross-sectional view showing an outline of the solder detection device 34 used in the inspection jig 5. The solder detection device 34 includes an electrode unit 35, a plurality of LEDs 36 (Light Emitting Diodes), and a plurality of measurement pins 37. Each measurement pin 37 is provided with a heater (not shown) so that it is possible to prevent solder from being attached by heating. The electrode part 35 is provided on at least the lower surface of the third measurement part 26 region. The LED 36 is electrically connected to the electrode portion 35 via the first support arm 38 and is electrically connected to each measurement pin 37 via the second support arm 39. Each measurement pin 37 is disposed corresponding to each opening 29b (30b) formed in the inspection jig 5, and is fixed to a support plate 40 having a rectangular plate shape in plan view. The lower end of each measuring pin 37 is arranged at a position flush with the upper surface of the inspection jig 5. For this reason, if the lower end of each measuring pin 37 comes into contact with the molten solder that has risen in each opening 29b (30b), the LED 36, which is a notification unit, is turned on and notified by conducting with the electrode unit 35. .

  Next, a method for inspecting the solder jet state in the solder jet device 3 having the above-described configuration will be described.

  First, when the inspection jig 5 is carried from the carry-in conveyor 15 shown in FIG. 1 to the first conveyance conveyor 16, the inspection jig 5 is conveyed by the first conveyance conveyor 16, and then transferred to the second conveyance conveyor 18 via the transfer conveyor 17. Be transported. The inspection jig 5 is conveyed at a constant speed in the solder jet device 3 by the second conveyor 18, and a pattern is formed on the first inspection plate 22 a by the solder jetted from the first nozzle portion 12.

  Therefore, the shape of the pattern formed by this solder is observed. Then, it is determined whether or not the observed shape is appropriate, and if it is determined to be inappropriate, the subsequent inspection is stopped and maintenance is performed. Whether or not the shape is appropriate may be determined by how much the shape is deformed with respect to the reference shape (rectangular shape). In this case, if the reference shape is displayed in advance on the first inspection plate 22a by a frame line, the determination becomes easier.

  Further, when the trailing edge of the solder pattern formed on the first inspection plate 22a matches the reference line 33, the positional relationship between the leading edge and the first measurement line 31 is inspected. If the position of the leading edge coincides with or substantially coincides with the first measurement line 31, it is determined that the DIP distance (dipping distance) is appropriate, and if it does not coincide (the position is shifted, wavy or inclined) If so, the subsequent inspection is stopped and the solder jet device 3 is maintained.

  Similarly, the solder is jetted from the second nozzle 14 to form the first opening 29a and the second opening 30a of the second inspection plate 22b in the second measurement section 25 of the inspection jig 5. Based on the pattern, the solder jet state is detected as follows.

In the first opening 29a, it is determined whether or not the jet state is appropriate from the state of the solder in contact with the circular opening.
That is, when the solder is not in contact with the entire surface in the first opening 29a or even if it is determined that the jet pressure is small from the density, it is determined that the jet state is inappropriate, and the subsequent inspection Stop and perform maintenance. Further, it is determined whether or not the soldering environment is appropriate based on the contact state of the solder at the peripheral portion of the first opening 29a. For example, if bubbles or the like are generated in the peripheral portion of the first opening 29a, it can be determined that flux gas is generated and causes wetness when soldering to the substrate or the like.

In the second opening 30a, the opening area is larger than that of the first opening 29a, so that the surface pressure due to the solder is prevented from being concentrated, and the molten solder is used when the lower surface of the base material is actually soldered. It is possible to check the spread range.
That is, the contact state of the solder in the second opening 30a (whether or not contact is made over the entire range of the second opening 30a), in particular, the contact state in the arc portions of the four corners is determined. In addition, the shade of the color where the solder is in contact is determined. Further, the generation state of bubbles in the arc portions at the four corners is determined. It can be seen whether or not a soldering failure occurs when soldering to the base material in the solder contact state. Then, the jet pressure at which the solder acts on the base material can be determined based on the shade of the color where the solder is in contact. According to this, it is possible to determine whether or not the soldering state can be further improved. Further, if bubbles are generated in the arc portion, it can be determined that flux gas is generated and causes non-wetting when soldering to a substrate or the like.

Then, the immersion state at the time of soldering is judged from the position of the solder which invades each of the first opening 29b and the second opening 30b of the immersion confirmation plate 22c.
That is, if the solder has penetrated to the respective openings 29b and 30b to an appropriate position, the measurement pin 37 comes into contact with the solder, and the LED 36 serving as a notification unit is lit to notify.

  In particular, since the shape of the first opening 29b is circular, the solder enters with the jet pressure acting evenly, and the surface tension of the solder becomes uniform. The first openings 29b are arranged at equal intervals at three locations in the width direction. For this reason, it is possible to accurately grasp the entire soldering state when the base material B is actually soldered.

  In addition, you may make it arrange | position in arbitrary positions by adjusting the lower end position of the measurement pin 37 to an up-down direction. In this case, if the position is made different for each measurement location (for example, the lower limit position, the intermediate position, and the upper limit position), the immersion height (depth) of the solder is determined depending on which LED 36 is lit. This is preferable in that it becomes possible.

(Second Embodiment)
In the second embodiment, the configuration of the soldering apparatus is the same as the configuration according to the first embodiment, and only the configuration of the inspection jig 100 is different.

  9A is a plan view of the inspection jig 100 according to the second embodiment, FIG. 9B is a cross-sectional view taken along the line BB of FIG. 9A, and FIG. 9C is FIG. It is a CC sectional view taken on the line of FIG. The inspection jig 100 includes a support frame 101 provided with an inspection plate 102, a first solder detection unit 103, and a second solder detection unit 104. In addition, as shown in FIG. 10, the inspection jig 100 (FIG. 9) includes a first measurement unit 106, a second measurement unit 107, and a third measurement unit 108 from the leading side in the conveyance direction facing right in the drawing. It consists of two areas.

  10A is a plan view of the support frame 101, and FIG. 10B is a cross-sectional view taken along line BB in FIG. 10A. The support frame 101 is made of a plate material having a rectangular shape in plan view, and a protrusion 105 extending in the longitudinal direction is formed at the center of the side edge. The support frame 101 is conveyed while being guided by the guide groove 20 of the above-described conveying device 4 through the protrusion 105. A rectangular hole 109 is formed in the first measuring unit 106, and the inspection plate 102 is disposed there.

  In the support frame 101, a shallow groove portion 101a (FIGS. 10A and 10B) is formed in the width direction in the first measurement unit 106, a rectangular hole 109 is formed on the bottom surface thereof, and the upper and lower surfaces communicate with each other. ing. An inspection plate 102 described later is disposed in the rectangular hole 109. In addition, screw holes (both end screw holes 101b and a central screw hole 101c) are formed at three locations along the shallow groove portions 101a on the upper surfaces of both side walls constituting the shallow groove portions 101a. A holding plate 109 a protruding into the rectangular hole 109 along both sides of the rectangular hole 109 is integrated with the bottom surface of the support frame 101.

  The support frame 101 is formed with recesses 112 located on both sides in the width direction in the second measurement unit 107. A through hole 112a is formed in a substantially central portion of each recess 112, and a measurement pin 119 of the first solder detection unit 103 to be described later can be inserted.

  The support frame is formed with immersion confirmation portions 113 extending in the width direction at the third measurement portion 108, and through holes 113a are formed at equal intervals at three locations, and the measurement pins of the second solder detection portion 104, which will be described later, are formed. 128 can be inserted.

  As shown in FIG. 9B, the rectangular holes 109 are fixed by screwing the holding claws 110 into the both-end screw holes 101c (FIG. 10A) formed at the two ends on both sides of the rectangular hole 109, respectively. The inspection plate 102 disposed therein is held between the holding claw 110 and the holding plate 109 a of the support frame 101.

  As shown in FIG. 9 (c), the strength reduced by forming the rectangular hole 109 is screwed into the central screw holes 101b (FIG. 10 (a)) formed in the central portions on both sides of the rectangular hole 109, respectively. And it is reinforced by the arch part 111 which spanned the center part.

  As in the first embodiment, the inspection plate 102 has a first measurement line 116, a second measurement line 115, and a reference line 117 formed in a direction orthogonal to the transport direction, that is, in the width direction. Of course, the role of each line is the same as that of the first embodiment.

FIG. 11A is a side cross-sectional view of the first solder detection unit 103, and FIG. 11B is a front cross-sectional view. The first solder detection unit 103 includes measurement pins 119 protruding from the lifting plate 122, one for each through hole 112a formed in the recess 112 of the second measurement unit 107 of the support frame 101. Is provided.
In the first solder detection unit 103, side plates 121 are disposed on both sides of the base plate 120, and an elevating plate 122 is disposed between the base plate 120 and the upper bent portion of the side plate 121. An adjusting screw 123 is screwed onto the elevating plate 122, and the elevating position of the elevating plate 122 can be adjusted by rotating the adjusting screw 123.
The measurement pin 119 is fixed to the elevating plate 122, extends vertically downward from the horizontal direction, and is positioned in the immersion confirmation hole 112a. Further, the measurement pin 119 is electrically connected to an LED (not shown) via the energization lead 124. The LED is electrically connected to an electrode portion (not shown) that contacts the solder in the solder tank via another current-carrying lead (not shown). And when solder contacts measurement pin 119, LED which is a report part lights up and reports.

  As shown in FIG. 9 (c), the second solder detection unit 104 includes an attachment base 127 and three measurement pins 128 attached to the attachment base 127, and the third measurement part of the support frame 101. It is attached to 108 and is located above the immersion confirmation part 113. The measurement pin 128 protrudes from the lower surface of the mounting base 127. Therefore, when the second solder detection unit 104 is attached to the support frame 101, the measurement pin 128 passes through the immersion confirmation unit 113 and is positioned in the through hole 112b. The measurement pin 128 is electrically joined to a current-carrying lead / LED / solder contact electrode portion (not shown), and when the measurement pin 128 comes into contact with the solder, the LED, which is a notification portion, is turned on and notified.

  The inspection jig 100 having the above-described configuration is used in the following manner to inspect the solder jet state in the solder jet device 3.

As in the first embodiment, the first measuring unit 106 determines the state of the solder jet device 3 and the like from the solder pattern in contact with the inspection plate 102.
That is, the shape of the pattern made of solder is observed as in the first embodiment. Then, it is determined whether or not the observed shape is appropriate, and if it is determined to be inappropriate, the subsequent inspection is stopped and maintenance is performed.

As in the first embodiment, when the trailing edge of the pattern formed on the inspection plate 102 by the solder jetted from the first nozzle portion 12 matches the reference line 117, the leading edge and the first measurement line Check the positional relationship with 1116. If the position of the leading edge coincides with or substantially coincides with the first measurement line 116, it is determined that the DIP distance is appropriate, and if it does not coincide (the position is shifted, wavy, or tilted). If it is determined to be inappropriate, the subsequent inspection is stopped and the solder jet device 3 is maintained.
The same process is performed on the solder jetted from the second nozzle 13.
That is, when the trailing edge of the pattern formed on the inspection plate 102 matches the reference line 117, the positional relationship between the leading edge and the second measurement line 115 is inspected, and the position of the leading edge becomes the second measurement line 115. If they match or almost match, it is determined that the DIP distance is appropriate, and if they do not match, it is determined that the DIP distance is inappropriate, and the subsequent inspection is stopped and the solder jet device 3 is maintained.

The first solder detection unit 103 determines a dipping state at the time of soldering from the position of the solder that enters each through hole 112 a formed in the bottom surface of the recess 112 of the support frame 101.
That is, if the solder has penetrated to each through-hole 112a to an appropriate position, the measurement pin 119 comes into contact with the solder, and the LED serving as the notification unit is turned on to notify.
Similarly, in the second solder detection unit 104, if the solder has entered the appropriate position in the through hole 112b formed in the support frame 101, the measurement pin 128 contacts the solder, and the LED serving as the notification unit lights up. To inform you.

(Third embodiment)
FIG. 12 shows a soldering apparatus according to the third embodiment. This soldering apparatus includes a flux application device 201, a preheating device 202, and a solder jet device 203, as in the first embodiment. The flux application device 201, the preheating device 202, and the solder jet device 203 are configured to transport the base material B and the inspection jig 205 to be soldered, such as a printed circuit board, by the transport device 204. .

  The flux applying apparatus 201 is for applying flux to a member to be soldered such as a substrate. The flux application device 201 is provided so that it can be moved up and down independently, and when the flux is applied to the base material B, it rises to a soldering position described later. (Some types do not move up and down.)

  The preheating device 202 is for raising the temperature of the substrate or the like to a temperature suitable for soldering. Similarly to the flux application device 201, the preheating device 202 is also provided so that it can be moved up and down independently, and when the substrate B is preheated, it rises to the soldering position. (Some types do not move up and down.)

  As shown in FIG. 13, the solder jet device 203 includes a jet nozzle 207 and a jet pump 208 for jetting solder from the jet nozzle 207 in a solder tank 206.

  The solder tank 206 has a substantially rectangular parallelepiped shape with an upper surface opened, and the inside is divided into two vertically by an intermediate plate 209. The upper space divided into two by the intermediate plate 209 is divided by a partition plate 210 made of punching metal into a pump region 211 where the jet pump 208 is disposed and a jet region 212 where solder is jetted. The middle plate 209 is formed with a rectangular opening on the jet region side, and a rectangular cylindrical jet nozzle base 213 (FIG. 14A) protrudes upward from the edge of the opening. The upper opening of the jet nozzle base 213 is closed with a lid 214. A jet nozzle 207 and a scraping nozzle 215 are integrated with the lid 214.

  The jet nozzle 207 is composed of a rectangular cylindrical body arranged in a 3 × 3 matrix. In particular, as shown in FIG. 15, a rectangular frame portion 216 that protrudes further upward and is widened to both ends is provided at the upper end portion of the rectangular tubular body of the jet nozzle 207, and the outer peripheral surface of the jet nozzle 207 is rectangular. Between the frame portion 216, passages (reflux passages 217) located at both ends are formed. In such a jet nozzle 207, the molten solder from the solder tank 206 rises up the rectangular cylindrical body in a state where the upper end opening of the rectangular frame 216 is covered with the base material, and the lower surface of the base material etc. After contact, it is refluxed to the solder bath 206 via the reflux passage 217.

As shown in FIG. 13, the scraping nozzle 215 is configured by a rectangular cylindrical body similar to the jet nozzle 207, and is arranged in two rows so that the longitudinal direction thereof is along the width direction of the solder tank 206. The scraping nozzle 215 serves to discharge the solder scraps in the jet nozzle base 213 in advance before starting the soldering operation.
That is, the scrap ejection jet cleans the solder in the jet nozzle base 213 by simultaneously ejecting and ejecting solder scrap from the scrap nozzle 215 and the jet nozzle 207.

  As shown in FIG. 13, the jet pump 208 is directed upward from a rectangular cylindrical pump housing 218 formed so as to surround the middle plate fin opening 220a formed in the pump region 211 of the middle plate 209 of the solder tank 206. It is attached to the extended support base 219. The jet pump 208 is constituted by a motor, and its rotation shaft is connected to a pump screw 220 positioned in the pump housing 218. Thereby, if the jet pump 208 is rotationally driven, the pump screw 220 is rotated by the rotation of the rotating shaft. Then, the solder flows by the rotation of the pump screw 220 and is ejected upward through the jet nozzle 207.

  As shown in FIG. 12, belt conveyors 221 are arranged at the inlet and the outlet of the soldering apparatus, respectively. In addition, a transfer device 204 is disposed in the upper part of the soldering device.

  The conveying device 204 includes a pair of support rails 222 arranged at a predetermined interval in the width direction, a plurality of (here, three) arm members 223 rotatably provided on the support rails 222, and a lower side from the support rails 222. And a pair of guide rails 224 provided so as to be able to move up and down along a guide shaft extending in the direction.

  The arm member 223 is substantially L-shaped and is rotatably connected to the support rail 222 at the upper end side. An intermediate portion of the arm member 223 is rotatably connected to a moving rail 225 disposed on the lower side of the support rail 222.

  The guide rail 224 includes a groove extending in the longitudinal direction on the lower edge side of the opposing surface, and supports the substrate and the inspection jig 205 so as to be slidable. Further, the guide rail 224 is moved up and down by an unillustrated driving device such as a motor to an upper conveying position and a lower soldering position, respectively.

  When the moving rail 225 is moved by a solenoid or the like (not shown), the arm member 223 can be rotated in synchronization. For this reason, the substrate and the inspection jig 205 can be pressed at the tip of the horizontal portion on the lower end side of the arm member 22 and sequentially conveyed along the guide rail 224 by a predetermined pitch.

  As shown in FIG. 14, the inspection jig 205 is for inspecting the solder jet state in the solder bath 206, and includes a support frame 226 and an inspection plate 227 supported by the support frame 226. It consists of

  The support frame 226 is made of a material having excellent heat resistance, such as fiber reinforced plastic, having a rectangular shape in plan view, and protrusions extending in the longitudinal direction are formed on both sides. Further, the support frame 226 is slidable along the guide rail 224 by supporting the protrusions in the grooves of the guide rail 224. A measurement unit 228 is formed on the upper surface of the support frame 226. The measurement unit 228 is formed in a rectangular frame shape in plan view and can hold the inspection plate 227.

  The measurement unit 228 communicates with the upper and lower surfaces through a plurality of rectangular holes 230 formed in the bottom surface of the recess 229. Each rectangular hole 230 (upper end opening) is formed so as to surround the jet nozzle 207 (rectangular frame portion 216). An inclined surface 231 that gradually spreads outward from the inner edge of the rectangular hole 230 is formed on the lower surface side of the support frame 226 at the bottom of the recess 229.

  The inspection plate 227 has a substantially rectangular shape in plan view that can be arranged in each measurement unit 228, and uses a heat-resistant material (for example, Tempax) that does not deform depending on the temperature of solder to be jetted. . A reference line is formed in a lattice shape on the inspection plate 227, and a portion corresponding to the jet nozzle 207 (rectangular frame portion 216) is formed in a size surrounding the rectangular nozzle portion 216 (see FIG. Hereinafter, this reference line is referred to as a reference frame 232).

  Next, a method for inspecting the jet state in the soldering apparatus having the above configuration will be described.

  The inspection jig 205 is carried into the soldering apparatus by the belt conveyor 221. The inspection jig 205 carried into the soldering apparatus is guided on both sides by the guide rail 224 and is conveyed at a constant speed by the conveying device 204. Then, after the inspection jig 205 is conveyed to the solder jet device 203, the guide rail 224 is lowered to the soldering position.

In the solder jet device 203, molten solder is ejected upward from the jet nozzle 207 by driving the jet pump 208. For this reason, when the inspection jig 205 is lowered to the soldering position, the solder in the jet comes into contact with the lower surface of the inspection plate 227. At this time, the pattern formed on the lower surface of the inspection plate 227 by solder is visible from the upper surface side because the inspection plate 227 has translucency. Therefore, whether or not the solder jet device 203 is to be maintained is determined based on the shape of the pattern formed on the inspection plate 227 by the solder with respect to the reference frame 232.
That is, if the solder pattern protrudes from the reference frame 232, the next point can be determined based on the extent of the protrusion. If the protrusion of the pattern is uniform, the gap dimension between the tip opening of the jet nozzle 207 and the lower surface of the inspection plate 227 is not within the set range, or the jet nozzle 207 is warped or the like. Judgment can be made.
Further, if the pattern outline is disturbed, it can be determined that there is a possibility that the tip of the jet nozzle 207 is scratched, distorted, or contaminated. .
Furthermore, when the solder detection units 103 and 104 according to the second embodiment are added, it is possible to check immersion.

  In addition, this invention is not limited to the structure described in the said embodiment, A various change is possible.

  In the first and second embodiments, the first and second measurement lines 31 and 116, the second measurement lines 32 and 115, and the reference lines 33 and 117 are used as the inspection plates 22 and 102. It can also be configured as follows.

That is, as shown in FIG. 16, a measurement auxiliary line can be added. In this case, measurement auxiliary lines are formed at equal intervals, and the line shape is changed for each equal number, thereby measuring the conveyance speed of the inspection jig or responding to a freely changed DIP distance. can do.
In addition, when the DIP distance is incompatible with the ideal value, the DIP distance at that time can also be accurately measured, so that the adjustment work can be easily performed based on the measured value.
Furthermore, the reference line can be formed not only in the direction orthogonal to the transport direction but also in the direction along the transport direction. According to this, the change amount of the solder pattern formed on the inspection plate 102 can be easily determined. In addition, there is an advantage that the influence on the solder jet of the guide block 19 of the second conveyor 18 can be easily measured.

In the first and second embodiments, when the trailing edge of the solder pattern formed on the inspection plates 22a and 102 matches the reference lines 33 and 117, the leading edge and the first measurement lines 31 and 115 or Although the positional relationship with the second measurement lines 32 and 116 is inspected, the reference line and the measurement line may be reversed.
That is, when the front edge of the solder pattern matches the reference line, the positional relationship with each measurement line on the rear edge may be inspected.
In short, in order to be able to inspect the jet state of the solder, it is only necessary to form a line capable of discriminating the distance between the front edge and the rear edge in addition to the shape and inclination of the front and rear edges of the solder pattern. Further, if an accurate inspection is not necessary, the measurement line or the like may not be formed.

  In the above-described embodiment, the case where the present invention is applied to a solder layer having a wide opening has been described. However, the present invention is not necessarily limited thereto. Needless to say, the present invention may be applied to the case of inspecting the jet state of the molten solder jetted from the nozzle.

  The inspection jig 5 according to the present invention can be used for inspection of a solder jet state in a solder jet apparatus such as lead-containing / lead-free solder.

Claims (11)

An inspection jig for inspecting a solder jet state,
An inspection comprising an inspection plate having heat resistance that does not deform due to the heat effect of the solder, and translucency that enables inspection of the contact state of the solder to one surface from the other surface side. Jig.   The inspection jig according to claim 1, wherein the inspection plate has a reference line for determining a contact state of the solder to one surface.   3. The inspection plate is transported at a constant speed along the same transport path as a base material to be soldered, and the reference line extends in a direction orthogonal to the transport direction. The inspection jig described in 1.   The inspection jig according to claim 2 or 3, wherein the inspection plate has at least one measurement line formed on the transport direction side with respect to the reference line. A support frame having a first measurement part and a second measurement part;
The inspection plate held by the first measurement unit and the second measurement unit of the support frame, respectively,
5. The inspection jig according to claim 1, wherein the second measurement unit includes a plurality of openings for guiding the jetted solder to the inspection plate. 6. The support frame includes a third measurement unit including a plurality of openings communicating the front and back surfaces,
The inspection jig according to claim 5, further comprising a solder detection device that detects an immersion height of the solder that has entered each opening of the third measurement unit.   7. The inspection treatment according to claim 6, wherein the solder detection device includes a plurality of measurement pins respectively disposed in the openings, and a notification unit that notifies when the measurement pins come into contact with the solder. Ingredients.   The inspection jig according to claim 7, wherein the measurement pin includes a heater for preventing adhesion of solder. An inspection jig for inspecting a solder jet state,
An inspection jig comprising a first measuring unit capable of detecting a solder jet state by a pattern formed by jetted solder. An inspection jig for inspecting a solder jet state,
The inspection jig according to claim 9, further comprising a second measurement unit capable of detecting a state of a jet pressure of the solder that has been jetted. An inspection jig for inspecting a solder jet state,
The jig according to claim 9 or 10, further comprising a third measuring unit capable of detecting the immersion height of the jetted solder.

Images