WO2013038726A1 - Inspection fixture - Google Patents

Inspection fixture Download PDF

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Publication number
WO2013038726A1
WO2013038726A1 PCT/JP2012/054374 JP2012054374W WO2013038726A1 WO 2013038726 A1 WO2013038726 A1 WO 2013038726A1 JP 2012054374 W JP2012054374 W JP 2012054374W WO 2013038726 A1 WO2013038726 A1 WO 2013038726A1
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WO
WIPO (PCT)
Prior art keywords
solder
inspection
inspection jig
measurement
plate
Prior art date
Application number
PCT/JP2012/054374
Other languages
French (fr)
Japanese (ja)
Inventor
博光 奥山
Original Assignee
オムロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Priority to CN201280039411.0A priority Critical patent/CN103717339B/en
Publication of WO2013038726A1 publication Critical patent/WO2013038726A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • B23K3/0676—Conveyors therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Definitions

  • the present invention relates to an inspection jig used in a solder jet device.
  • Patent Document 1 As an inspection jig used in a solder jet device, a plurality of needle bolts that can be finely moved independently in the vertical direction and a jet shape measured by these needle bolts are known (for example, Patent Document 1).
  • any of the above-described inspection jigs can only measure the shape of a part of the solder in a jet state, and cannot detect how the solder jetted onto the substrate to be soldered is hit. . For this reason, it is inevitable that a deviation occurs between the measurement result and the actual soldering.
  • An object of the present invention is to provide an inspection jig capable of detecting a jet state of solder under the same conditions as soldering to a base material.
  • the present invention provides: An inspection jig for inspecting a solder jet state, An inspection plate having heat resistance that does not deform due to the thermal influence of the solder, and a translucency that makes the contact state of the solder to one surface visible from the other surface side; A solder detection device for detecting the immersion height of the solder; A support frame capable of holding the inspection plate and the solder detection device; It is set as the structure provided with.
  • the contact state can be detected under the same conditions as when the solder actually contacts one surface of the substrate. For this reason, it is possible to accurately determine whether or not the conditions for soldering are appropriate and whether or not there is a problem in the apparatus for soldering. In particular, it is possible to easily grasp whether or not the desired immersion height (depth) is obtained by the solder detection device.
  • the support frame is A first measurement unit that holds the inspection plate and has an opening that is exposed vertically except for a portion supported by the periphery; A second measurement unit having a plurality of openings for guiding the solder; With The solder detection device may detect the immersion height of the solder guided by each opening of the second measurement unit.
  • the inspection plate preferably has a reference line for judging the contact state of the solder to one surface.
  • This configuration makes it possible to easily determine whether or not the contact state of the solder to the inspection plate is appropriate based on the reference line.
  • the inspection plate is transported at a constant speed along the same transport path as the base material to be soldered, and the reference line preferably extends in a direction perpendicular to the transport direction.
  • the inspection plate has at least one measurement line formed on the transport direction side with respect to the reference line.
  • the leading edge of the solder pattern when the trailing edge of the solder pattern formed on the inspection plate moving at a constant speed matches the reference line. Based on the positional relationship between the (edge located on the conveyance direction side) and the measurement line, it can be determined whether or not the range in which the solder contacts is appropriate.
  • the solder detection device includes a plurality of measurement pins respectively arranged in each opening and a notification unit that notifies when the measurement pins come into contact with the solder.
  • the notification unit notifies the user, so that the user can easily grasp the immersion height of the solder.
  • the measurement pin preferably includes a heater for preventing the solder from adhering.
  • the present invention provides an inspection jig for inspecting a solder jet state as a means for solving the above-mentioned problem, and detects the solder jet state by a pattern formed by the solder flowed. It has a possible first measuring part and is formed integrally with the substrate to be soldered.
  • the present invention is preferably an inspection jig for inspecting a solder jet state, and has a solder detection unit capable of detecting the immersion height of the jetted solder.
  • the solder jetted on one surface of the inspection plate is brought into contact in the same manner as soldering to the base material.
  • the state can be inspected from the other surface, and the solder jet state can be easily determined.
  • FIG. 3A is a plan view showing the conveying apparatus of FIG. 2, and FIG. 3B is a sectional view taken along the line BB of FIG.
  • A) is a plan view of the inspection jig according to the second embodiment,
  • (b) is a cross-sectional view taken along line BB of (a), and
  • (c) is a cross-sectional view taken along line CC of (a).
  • A) is a top view of the support frame of FIG.
  • (b) is a partially broken front view of (a).
  • (A) is side surface sectional drawing of the 1st solder detection part of FIG. 5,
  • (b) is front sectional drawing. It is a top view which shows the test
  • FIG. 1 is a schematic plan view of the soldering apparatus according to the first embodiment
  • FIG. 2 is a front view thereof.
  • the soldering apparatus includes a flux application device 1, a preheating device 2, and a solder jet device 3.
  • the preheating device 2 and the solder jet device 3 are arranged in the same housing.
  • the flux coating device 1, the preheating device 2, and the solder jet device 3 include a base material B and an inspection jig 5 (FIG. 5) that are targets of soldering such as a printed circuit board by the transport device 4 (FIG. 4). It is designed to be transported.
  • the flux applying apparatus 1 is for applying a flux to the lower surface of the base material B (FIG. 4A).
  • the flux application device 1 includes a flux spray nozzle 6 and sprays and applies the flux to the lower surface of the base material B that passes therethrough.
  • the flux coating apparatus may be a foaming type instead of a spraying type.
  • the preheating device 2 is for raising the temperature of the mounting component of the base material B to a temperature suitable for soldering or a value corresponding to thermal shock (a temperature capable of dealing with the influence of temperature change due to soldering). For this reason, as shown in FIG. 3, the preheating device 2 is transported by a plurality of preheating heater units 7 arranged along the longitudinal direction on the lower side of a later-described transport path (FIG. 4A). ).
  • FIG. 3 is a partially enlarged schematic front view showing some of the components of the preheating device 2 and the solder jet device 3.
  • the solder jet device 3 includes a first jet portion 9 and a second jet portion 10 in the solder tank 8.
  • the first jet part 9 is provided with a first nozzle part 12 at the upper part of the first solder tank 11.
  • a screw (not shown) is disposed in the first solder tank 11. Power from the rotation shaft of the motor is transmitted to the rotation shaft of the screw via a belt (the motor may be directly connected to the rotation shaft of the screw. A pump can also be used.)
  • the first nozzle portion 12 has a rectangular cylindrical shape, and the upper end opening is closed by a lid body 12a (nozzle cap) in which a plurality of through holes are formed.
  • the lid body 12 a is inclined along the conveyance path of the base material B and the inspection jig 5 by the conveyance device 4.
  • the second jet part 10 is provided with a second nozzle part 14 in the upper part of the second solder tank 13.
  • a screw (not shown) that is rotated by a motor via a belt is disposed in the same manner as the first jet section 9 (as in the first jet section 9, the motor May be directly connected to the rotating shaft of the screw, or an electromagnetic induction pump can be used instead of the motor).
  • the upper end of the second nozzle portion 14 remains open, and the opening edge of the upper end is inclined along the transport path of the base material B and the inspection jig 5 (FIG. 5) by the transport device 4. Yes.
  • the motor is driven to rotate the screw, the molten solder is jetted in a rectified state through the upper opening of the second nozzle portion 14. As a result, good solder cut shaping is performed.
  • solder tank 8 the remaining solder that is jetted from the first jet part 9 and the second jet part 10 and not used for soldering is collected in the solder tank 8 and then returned to the jet parts 9 and 10.
  • the base material B (FIG. 4) and the inspection jig 5 (FIG. 5) can be transported to the flux coating device 1, the preheating device 2, and the solder jet device 3 by the transport device 4, as described above.
  • the transport device 4 transports the base material B and the inspection jig 5 (FIG. 5) into the flux coating device 1 and the inside of the flux coating device 1.
  • the carry-in conveyor 15 and the first transfer conveyor 16 are arranged in the horizontal direction, and the transfer conveyor 17 is arranged so as to gradually become higher in the transfer direction with a 1 ⁇ 2 gradient of the second transfer conveyor 18.
  • the first transfer conveyor 16 and the transfer conveyor 17 are provided with a plurality of circular rollers at predetermined intervals along the longitudinal direction on opposite surfaces of rails arranged in parallel at predetermined intervals. An operator supplies the base material B or the like on the carry-in conveyor 15 and moves it to the first transfer conveyor 16.
  • FIG. 4A which is a plan view of the transport device 4
  • the first transport conveyor 16 is driven by the chain roller 16a by a motor or the like (not shown), and the base material B and the like carried into the flux coating device 1 Is transported at a constant speed.
  • the transfer conveyor 17 has the same roller 17a as the first conveyor 16, and the base material B and the like carried out from the flux applying device 1 are transferred to the preheating device 2 via the second conveyor 18. And carry.
  • the second transfer conveyor 18 is a pair of conveyors that circulate and move on both sides of the transfer path and includes guide blocks 19 having a substantially L-shaped cross section, and gradually increases in the transfer direction with respect to the horizontal plane.
  • each guide block 19 having a substantially L-shaped cross section has a groove in the central portion of the inward leading end surface, and is aligned in a straight line when passing through the transport path, so that the guide direction on the both sides of the transport path A guide groove 20 extending in the direction is formed.
  • the guide groove 20 can hold the base material B and the protrusion 105 of the inspection jig 100 (FIG. 5) described later.
  • driving means such as a motor (not shown)
  • the base material B and the like held in the guide groove 20 are conveyed at a constant speed.
  • FIG. 5A is a plan view of the inspection jig 100 according to the second embodiment
  • FIG. 5B is a cross-sectional view taken along the line BB of FIG. 5A
  • FIG. 5C is FIG. FIG.
  • the inspection jig 100 includes a support frame 101 provided with an inspection plate 102, a first solder detection unit 103, and a second solder detection unit 104. Further, as shown in FIG. 6, the inspection jig 100 is composed of three regions of a first measurement unit 106, a second measurement unit 107, and a third measurement unit 108 from the head side in the rightward conveyance direction in the drawing. Has been.
  • FIG. 6 (a) is a plan view of the support frame 101
  • FIG. 6 (b) is a cross-sectional view taken along the line BB of FIG. 6 (a).
  • the support frame 101 is made of a plate material having a rectangular shape in plan view, and a protrusion 105 extending in the longitudinal direction is formed at the center of the side edge.
  • the support frame 101 is conveyed while being guided by the guide groove 20 of the above-described conveying device 4 through the protrusion 105.
  • a rectangular hole 109 is formed in the first measuring unit 106, and the inspection plate 102 is disposed there.
  • the support frame 101 has a shallow groove portion 101a (FIGS. 6A and 6B) formed in the width direction in the first measurement unit 106, a rectangular hole 109 is formed on the bottom surface thereof, and upper and lower surfaces communicate with each other. ing. An inspection plate 102 described later is disposed in the rectangular hole 109.
  • screw holes both end screw holes 101b and a central screw hole 101c are formed at three locations along the shallow groove portions 101a on the upper surfaces of both side walls constituting the shallow groove portions 101a.
  • a holding plate 109 a protruding into the rectangular hole 109 along both sides of the rectangular hole 109 is integrated with the bottom surface of the support frame 101.
  • the support frame 101 is formed with recesses 112 located on both sides in the width direction in the second measurement unit 107.
  • a through hole 112a is formed in a substantially central portion of each recess 112, and a measurement pin 119 of the first solder detection unit 103 to be described later can be inserted.
  • the support frame is formed with immersion confirmation portions 113 extending in the width direction at the third measurement portion 108, and through holes 113a are formed at equal intervals at three locations, and the measurement pins of the second solder detection portion 104, which will be described later, are formed. 128 can be inserted.
  • the holding claw 110 is screwed into the screw holes 101c (FIG. 10 (a)) at both ends formed at two ends on both sides of the rectangular hole 109, thereby The inspection plate 102 disposed therein is held between the holding claw 110 and the holding plate 109 a of the support frame 101.
  • the strength reduced by forming the rectangular hole 109 is screwed into the central screw holes 101b (FIG. 10A) formed in the central portions on both sides of the rectangular hole 109, respectively. And it is reinforced by the arch part 111 which spanned the center part.
  • the inspection plate 102 has a first measurement line 116, a second measurement line 115, and a reference line 117 formed in a direction orthogonal to the conveyance direction, that is, in the width direction.
  • the first measurement line 116 and the second measurement line 115 are formed by dotted lines, and the reference line 117 is formed by a solid line.
  • the reference line 117 is a first measurement line 116 and a second measurement line 115 for inspecting whether the front edge (front edge) of the solder pattern formed on the inspection plate 102 is in the correct position. Further, it is a line that becomes a measurement standard used for aligning the position of the edge (rear edge) on the rear end side of the solder pattern.
  • the first measurement line 116 if the soldering conditions jetted from the first nozzle unit 12 are appropriate, the trailing edge of the pattern formed by the solder contacting the lower surface of the inspection plate 102 matches the reference line 117.
  • the line that the leading edge is expected to reach is confirmed.
  • the second measurement line 115 is such that the trailing edge of the pattern formed by the solder contacting the lower surface of the inspection plate 102 becomes the reference line 117 if the soldering conditions jetted from the second nozzle portion 14 are appropriate. This is the line that the leading edge is expected to reach when matched.
  • the positional relationship (error) between the leading edge and the second measurement line 115 is confirmed.
  • the solder jet state can be determined by looking at the overall shape of the pattern formed on the inspection plate 102 and the state (position and inclination) of the pattern edge formed by the solder at the reference line 117. It is possible.
  • FIG. 7A is a side cross-sectional view of the first solder detection unit 103
  • FIG. 7B is a front cross-sectional view.
  • the first solder detection unit 103 includes a support base 118 and measurement pins 119 protruding from the support base 118, and each through hole 112 a formed in the recess 112 of the second measurement unit 107 of the support frame 101.
  • the support 118 is configured such that side plates 121 are disposed on both sides of the base plate 120, and an elevating plate 122 is disposed between the base plate 120 and the upper end bent portion of the side plate 121.
  • An adjusting screw 123 is screwed onto the elevating plate 122, and the elevating position of the elevating plate 122 can be adjusted by rotating the adjusting screw 123.
  • the measurement pin 119 is fixed to the elevating plate 122, extends vertically downward from the horizontal direction, and is positioned in the immersion confirmation hole 112a. Further, the measurement pin 119 is electrically connected to an LED (not shown) via the energization lead 124. The LED is electrically connected to an electrode portion (not shown) that contacts the solder in the solder tank via another current-carrying lead (not shown). And when solder contacts measurement pin 119, LED which is a report part lights up and reports.
  • the second solder detection unit 104 includes a mounting table 127 and three measurement pins 128 mounted on the mounting table 127, and the third measurement unit of the support frame 101. It is attached to 108 and is located above the immersion confirmation part 113.
  • the measurement pin 128 protrudes from the lower surface of the mounting base 127. Therefore, when the second solder detection unit 104 is attached to the support frame 101, the measurement pin 128 passes through the immersion confirmation unit 113 and is positioned in the through hole 112b.
  • the measurement pin 128 is electrically joined to a current-carrying lead / LED / solder contact electrode portion (not shown), and when the measurement pin 128 comes into contact with the solder, the LED serving as the notification portion is turned on to notify.
  • the inspection jig 100 having the above-described configuration is used as follows in order to inspect the solder jet state in the solder jet device 3.
  • the first measuring unit 106 determines the state of the solder jet device 3 and the like from the solder pattern in contact with the inspection plate 102. That is, the shape of the pattern made of solder is observed as in the first embodiment. Then, it is determined whether or not the observed shape is appropriate, and if it is determined to be inappropriate, the subsequent inspection is stopped and maintenance is performed.
  • the jet state is determined to be inappropriate, and the subsequent inspection Stop and perform maintenance. Further, it is determined from the contact state of the solder at the peripheral portion of the inspection plate 102 whether or not the soldering environment is appropriate. If bubbles or the like are generated in the peripheral portion of the inspection plate 102, it is determined that flux gas is generated and causes non-wetting when soldering to the substrate or the like.
  • the trailing edge of the pattern formed on the inspection plate 102 by the solder jetted from the first nozzle portion 12 matches the reference line 117, the leading edge and the first measurement line The positional relationship with 116 is inspected. If the position of the leading edge coincides with or substantially coincides with the first measurement line 116, it is determined that the DIP distance is appropriate, and if it does not coincide (the position is shifted, wavy, or inclined). If it is determined to be inappropriate, the subsequent inspection is stopped and the solder jet device 3 is maintained. The same process is performed on the solder jetted from the second nozzle 13.
  • the trailing edge of the pattern formed on the inspection plate 102 matches the reference line 117, the positional relationship between the leading edge and the second measurement line 115 is inspected, and the position of the leading edge becomes the second measurement line 115. If they match or almost match, it is determined that the DIP distance is appropriate, and if they do not match, it is determined that the DIP distance is inappropriate, and the subsequent inspection is stopped and the solder jet device 3 is maintained.
  • the first solder detection unit 103 determines a dipping state at the time of soldering from the position of the solder that enters each through hole 112 a formed in the bottom surface of the recess 112 of the support frame 101. That is, if the solder has penetrated to each through-hole 112a to an appropriate position, the measurement pin 119 comes into contact with the solder, and the LED serving as the notification unit is turned on to notify.
  • the measurement pin 128 comes into contact with the solder and the LED is lit.
  • the inspection plate 102 having the first measurement line 116, the second measurement line 115, and the reference line 117 is used.
  • the inspection plate 102 may be configured as follows.
  • a measurement auxiliary line can be added.
  • measurement auxiliary lines are formed at equal intervals, and the line shape is changed for each equal number, thereby measuring the conveyance speed of the inspection jig or responding to a freely changed DIP distance. can do.
  • the DIP distance is incompatible with the ideal value, the DIP distance at that time can also be accurately measured, so that the adjustment work can be easily performed based on the measured value.
  • the reference line can be formed not only in the direction orthogonal to the transport direction but also in the direction along the transport direction. According to this, the change amount of the solder pattern formed on the inspection plate 102 can be easily determined.
  • the positional relationship between the leading edge and the first measurement line 116 or the second measurement line 115 is determined.
  • the reference line and the measurement line may be reversed. That is, when the front edge of the solder pattern matches the reference line, the positional relationship with each measurement line on the rear edge may be inspected.
  • the present invention is not necessarily limited thereto. Needless to say, the present invention may be applied to the case of inspecting the jet state of the molten solder jetted from the nozzle.
  • the inspection jig 5 according to the present invention can be used for inspection of a solder jet state in a solder jet apparatus such as lead-containing / lead-free solder.

Abstract

An inspection fixture for detecting the state of the jet flow of a solder under the same conditions as with soldering with respect to a base material. In particular, this inspection fixture is equipped with: an inspection plate (102) which is heat resistant and thus is not deformed by the thermal effect of the solder, and which is translucent and thus enables the state of the contact of the solder with one surface to be visually recognized from the other surface; solder detection devices (103, 104) which detect the dipping height of the solder; and a support frame (101) capable of holding the inspection plate (102) and the solder detection devices (103, 104).

Description

検査用治具Inspection jig
　本発明は、半田噴流装置で使用する検査用治具に関するものである。 The present invention relates to an inspection jig used in a solder jet device.
　従来、半田噴流装置に用いる検査用治具として、垂直方向に独立して微動可能な複数本の指針ボルトを備え、これら指針ボルトによって噴流形状を測定するようにしたものが公知である（例えば、特許文献１参照）。 Conventionally, as an inspection jig used in a solder jet device, a plurality of needle bolts that can be finely moved independently in the vertical direction and a jet shape measured by these needle bolts are known (for example, Patent Document 1).
　また、半田噴流装置に用いる他の検査用治具として、噴流状態にある半田の形状を測定するために、目標となる噴流形状に合致した形状を有する測定部を備えたものが公知である（例えば、特許文献２参照）。 Further, as another inspection jig used in the solder jet device, one having a measuring unit having a shape that matches the target jet shape is known in order to measure the shape of the solder in the jet state ( For example, see Patent Document 2).
　しかしながら、前記いずれの検査用治具であっても、噴流状態にある半田の一部の形状を測定できるだけであり、半田付けの対象となる基板等に噴流する半田がどの様に当たっているかを検出できない。このため、測定結果と、実際に半田付けした場合との間にズレが生じることは避けられない。 However, any of the above-described inspection jigs can only measure the shape of a part of the solder in a jet state, and cannot detect how the solder jetted onto the substrate to be soldered is hit. . For this reason, it is inevitable that a deviation occurs between the measurement result and the actual soldering.
特開平５－６９１２１号公報JP-A-5-69121 特開平１１－３４０６２１号公報Japanese Patent Laid-Open No. 11-340621
　本発明は、基材に対して半田付けするのと同じ条件で、半田の噴流状態を検出することのできる検査用治具を提供することを課題とする。 An object of the present invention is to provide an inspection jig capable of detecting a jet state of solder under the same conditions as soldering to a base material.
　本発明は、前記課題を解決するための手段として、
　半田の噴流状態を検査するための検査用治具であって、
　前記半田による熱影響により変形しない耐熱性と、一方の面への半田の接触状態を、他方の面側から視認可能とする透光性とを有する検査用プレートと、
　半田の浸漬高さを検出する半田検出装置と、
　前記検査用プレート及び前記半田検出装置を保持可能な支持フレームと、
を備えた構成としたものである。 As a means for solving the above problems, the present invention provides:
An inspection jig for inspecting a solder jet state,
An inspection plate having heat resistance that does not deform due to the thermal influence of the solder, and a translucency that makes the contact state of the solder to one surface visible from the other surface side;
A solder detection device for detecting the immersion height of the solder;
A support frame capable of holding the inspection plate and the solder detection device;
It is set as the structure provided with.
　この構成により、実際に半田が基材の一方の面に接触するのと同じ条件で、その接触状態を検出することができる。このため、半田付けのための条件が適切であるか否か、半田付けのための装置に問題がないか否か等を的確に判断することが可能となる。特に、半田検出装置により所望の浸漬高さ（深さ）であるか否かを容易に把握することができる。 With this configuration, the contact state can be detected under the same conditions as when the solder actually contacts one surface of the substrate. For this reason, it is possible to accurately determine whether or not the conditions for soldering are appropriate and whether or not there is a problem in the apparatus for soldering. In particular, it is possible to easily grasp whether or not the desired immersion height (depth) is obtained by the solder detection device.
　前記支持フレームは、
　　前記検査用プレートを保持し、周縁の支持する部分を除いて上下に露出させる開口部を有する第１測定部と、
　　半田を導くための複数の開口部を有する第２測定部と、
を備え、
　前記半田検出装置は、前記第２測定部の各開口部によって導かれた半田の浸漬高さを検出するようにすればよい。
　また、前記検査用プレートは、一方の面への半田の接触状態を判断するための基準線を有するのが好ましい。 The support frame is
A first measurement unit that holds the inspection plate and has an opening that is exposed vertically except for a portion supported by the periphery;
A second measurement unit having a plurality of openings for guiding the solder;
With
The solder detection device may detect the immersion height of the solder guided by each opening of the second measurement unit.
The inspection plate preferably has a reference line for judging the contact state of the solder to one surface.
　この構成により、検査用プレートへの半田の接触状態が適切なものであるのか否かを、基準線に基づいて容易に判断することができる。 This configuration makes it possible to easily determine whether or not the contact state of the solder to the inspection plate is appropriate based on the reference line.
　前記検査用プレートは、半田付けされる基材と同一搬送経路を一定速度で搬送されるものであり、前記基準線は、搬送方向に直交する方向に延びているのが好ましい。 The inspection plate is transported at a constant speed along the same transport path as the base material to be soldered, and the reference line preferably extends in a direction perpendicular to the transport direction.
　この構成により、検査用プレートに接触する半田によって形成される模様が適切なものであるのか否かの判断を基準線に基づいて容易に判断することができる。 With this configuration, it is possible to easily determine whether or not the pattern formed by the solder contacting the inspection plate is appropriate based on the reference line.
　前記検査用プレートは、前記基準線よりも搬送方向側に形成される少なくとも１本の測定線を有するのが好ましい。 It is preferable that the inspection plate has at least one measurement line formed on the transport direction side with respect to the reference line.
　この構成により、一定速度で移動する検査用プレートに形成される半田の模様の後縁（搬送方向とは逆側に位置する縁）が基準線と合致した時点での、半田の模様の前縁（搬送方向側に位置する縁）と測定線との位置関係に基づいて、半田が接触する範囲が適切なものであるのか否かを判断することができる。 With this configuration, the leading edge of the solder pattern when the trailing edge of the solder pattern formed on the inspection plate moving at a constant speed (the edge located on the side opposite to the conveying direction) matches the reference line. Based on the positional relationship between the (edge located on the conveyance direction side) and the measurement line, it can be determined whether or not the range in which the solder contacts is appropriate.
　前記半田検出装置は、各開口部にそれぞれ配置される複数の測定ピンと、測定ピンが半田と接触することにより報知する報知部とを備えるのが好ましい。 It is preferable that the solder detection device includes a plurality of measurement pins respectively arranged in each opening and a notification unit that notifies when the measurement pins come into contact with the solder.
　この構成により、測定ピンが半田に浸漬すると、報知部によって報知されるので、ユーザは容易に半田の浸漬高さを把握することができる。 With this configuration, when the measurement pin is immersed in the solder, the notification unit notifies the user, so that the user can easily grasp the immersion height of the solder.
　前記測定ピンは、半田が付着することを防止するためのヒータを備えるのが好ましい。 The measurement pin preferably includes a heater for preventing the solder from adhering.
　この構成により、測定ピンに半田が付着することがなく、常に良好な状態での検出を行うことができる。 With this configuration, solder does not adhere to the measurement pin, and detection can always be performed in a good state.
　また、本発明は、前記課題を解決するための手段として、半田の噴流状態を検査するための検査用治具であって、噴流させた半田によって形成される模様により、半田の噴流状態を検出可能な第１測定部を有し、半田付けされる基板と一体型に形成した構成としてある。 Further, the present invention provides an inspection jig for inspecting a solder jet state as a means for solving the above-mentioned problem, and detects the solder jet state by a pattern formed by the solder flowed. It has a possible first measuring part and is formed integrally with the substrate to be soldered.
　また、本発明は、半田の噴流状態を検査するための検査用治具であって、噴流させた半田の浸漬高さを検出可能な半田検出部を有することが好ましい。 Further, the present invention is preferably an inspection jig for inspecting a solder jet state, and has a solder detection unit capable of detecting the immersion height of the jetted solder.
　本発明によれば、耐熱性及び透光性を有する検査用プレートを使用したので、基材に対して半田付けするのと同様にして検査用プレートの一方の面に噴流させた半田を接触させ、その状態を他方の面から検査することができ、半田の噴流状態を容易に判断することが可能となる。 According to the present invention, since the inspection plate having heat resistance and translucency is used, the solder jetted on one surface of the inspection plate is brought into contact in the same manner as soldering to the base material. The state can be inspected from the other surface, and the solder jet state can be easily determined.
本実施形態に係る半田付け装置の概略を示す平面図である。It is a top view which shows the outline of the soldering apparatus which concerns on this embodiment. 本実施形態に係る半田付け装置の概略を示す正面図である。It is a front view which shows the outline of the soldering apparatus which concerns on this embodiment. 図２の予熱装置と半田噴流装置の構成部品の一部を示す部分拡大図である。It is the elements on larger scale which show a part of component of the preheating apparatus of FIG. 2, and a solder jet apparatus. （ａ）は図２の搬送装置を示す平面図、（ｂ）はそのガイドブロックによる基材の支持状態を示す（ａ）のＢ－Ｂ線断面図である。FIG. 3A is a plan view showing the conveying apparatus of FIG. 2, and FIG. 3B is a sectional view taken along the line BB of FIG. （ａ）は第２実施形態に係る検査用治具の平面図、（ｂ）は（ａ）のＢ－Ｂ線断面図、（ｃ）は（ａ）のＣ－Ｃ線断面図である。(A) is a plan view of the inspection jig according to the second embodiment, (b) is a cross-sectional view taken along line BB of (a), and (c) is a cross-sectional view taken along line CC of (a). （ａ）は図５の支持フレームの平面図、（ｂ）は（ａ）の部分破断正面図である。(A) is a top view of the support frame of FIG. 5, (b) is a partially broken front view of (a). （ａ）は図５の第１半田検出部の側面断面図、（ｂ）は正面断面図である。(A) is side surface sectional drawing of the 1st solder detection part of FIG. 5, (b) is front sectional drawing. 他の実施形態に係る検査用治具の検査用プレートを示す平面図である。It is a top view which shows the test | inspection plate of the test jig | tool which concerns on other embodiment.
　１…フラックス塗布装置
　２…予熱装置
　３…半田噴流装置
　４…搬送装置
　６…フラックス噴霧ノズル
　７…予熱ヒータユニット
　８…半田槽
　９…第１噴流部
　１０…第２噴流部
　１１…第１半田槽
　１２…第１ノズル部
　１３…第２半田槽
　１４…第２ノズル部
　１５…搬入コンベア
　１６…第１搬送コンベア
　１７…乗継コンベア
　１８…第２搬送コンベア
　１９…ガイドブロック
　２０…ガイド溝
　１００…検査用治具
　１０１…支持フレーム
　１０２…検査用プレート
　１０３…第１半田検出部（半田検出装置）
　１０４…第２半田検出部（半田検出装置）
　１０５…突条部
　１０６…第１測定部
　１０７…第２測定部
　１０８…第３測定部
　１０９…矩形孔
　１１０…保持爪
　１１１…アーチ部
　１１２…凹所
　１１２ａ…貫通孔
　１１２ｂ…貫通孔
　１１３…浸漬確認部
　１１５…第２測定線
　１１６…第１測定線
　１１７…基準線
　１１８…支持台
　１１９…測定ピン
　１２０…ベースプレート
　１２１…サイドプレート
　１２２…昇降プレート
　１２３…調整ネジ
　１２４…通電リード
　１２７…取付台
　１２８…測定ピン DESCRIPTION OF SYMBOLS 1 ... Flux application apparatus 2 ... Preheating apparatus 3 ... Solder jet apparatus 4 ... Conveyance apparatus 6 ... Flux spray nozzle 7 ... Preheating heater unit 8 ... Solder tank 9 ... 1st jet part 10 ... 2nd jet part 11 ... 1st solder tank DESCRIPTION OF SYMBOLS 12 ... 1st nozzle part 13 ... 2nd solder tank 14 ... 2nd nozzle part 15 ... Loading conveyor 16 ... 1st conveyance conveyor 17 ... Transfer conveyor 18 ... 2nd conveyance conveyor 19 ... Guide block 20 ... Guide groove 100 ... Inspection Jig 101 ... Support frame 102 ... Inspection plate 103 ... First solder detector (solder detector)
104 ... 2nd solder detection part (solder detection apparatus)
DESCRIPTION OF SYMBOLS 105 ... Projection part 106 ... 1st measurement part 107 ... 2nd measurement part 108 ... 3rd measurement part 109 ... Rectangular hole 110 ... Holding claw 111 ... Arch part 112 ... Recess 112a ... Through-hole 112b ... Through-hole 113 ... Immersion Confirmation part 115 ... 2nd measurement line 116 ... 1st measurement line 117 ... Reference line 118 ... Support stand 119 ... Measurement pin 120 ... Base plate 121 ... Side plate 122 ... Lifting plate 123 ... Adjustment screw 124 ... Current supply lead 127 ... Mounting stand 128 ... Measuring pin
　以下、本発明に係る実施形態を添付図面に従って説明する。
　なお、以下の説明では、必要に応じて特定の方向や位置を示す用語（例えば、「上」、「下」、「側」、「端」を含む用語）を用いるが、それらの用語の使用は図面を参照した発明の理解を容易にするためであって、それらの用語の意味によって本発明の技術的範囲が限定されるものではない。
　また、以下の説明は、本質的に例示に過ぎず、本発明、その適用物、あるいは、その用途を制限することを意図するものではない。 Embodiments according to the present invention will be described below with reference to the accompanying drawings.
In the following description, terms indicating specific directions and positions (for example, terms including “up”, “down”, “side”, “end”) are used as necessary. Is for facilitating understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of these terms.
Further, the following description is merely illustrative in nature and is not intended to limit the present invention, its application, or its use.
　図１は、第１実施形態に係る半田付け装置の概略平面図、図２は、その正面図を示す。この半田付け装置は、フラックス塗布装置１、予熱装置２及び半田噴流装置３を備えている。特に、前記予熱装置２と前記半田噴流装置３とは同一ハウジング内に配置されている。そして、フラックス塗布装置１、予熱装置２及び半田噴流装置３には、搬送装置４（図４）によってプリント基板等の半田付けの対象となる基材Ｂや検査用治具５（図５）が搬送されるようになっている。
　なお、同一ハウジング内にフラックス塗布装置１、予熱装置２及び半田噴流装置３を配置してもよい。 FIG. 1 is a schematic plan view of the soldering apparatus according to the first embodiment, and FIG. 2 is a front view thereof. The soldering apparatus includes a flux application device 1, a preheating device 2, and a solder jet device 3. In particular, the preheating device 2 and the solder jet device 3 are arranged in the same housing. The flux coating device 1, the preheating device 2, and the solder jet device 3 include a base material B and an inspection jig 5 (FIG. 5) that are targets of soldering such as a printed circuit board by the transport device 4 (FIG. 4). It is designed to be transported.
In addition, you may arrange | position the flux application | coating apparatus 1, the preheating apparatus 2, and the solder jet apparatus 3 in the same housing.
　フラックス塗布装置１は、図２に示すように、基材Ｂ（図４（ａ））の下面にフラックスを塗布するためのものである。このため、フラックス塗布装置１は、フラックス噴霧ノズル６を備え、通過する基材Ｂの下面にフラックスを噴霧して塗布する。なお、フラックス塗布装置は、噴霧式でなく、発泡式でも良い。 As shown in FIG. 2, the flux applying apparatus 1 is for applying a flux to the lower surface of the base material B (FIG. 4A). For this reason, the flux application device 1 includes a flux spray nozzle 6 and sprays and applies the flux to the lower surface of the base material B that passes therethrough. Note that the flux coating apparatus may be a foaming type instead of a spraying type.
　予熱装置２は、基材Ｂの実装部品を半田付けに適した温度又は熱衝撃対応値（半田による温度変化の影響に対応可能な温度）まで昇温させるためのものである。このため、予熱装置２は、図３に示すように、後述する搬送経路の下方側に長手方向に沿って配置した複数の予熱ヒータユニット７により、搬送される基材Ｂ（図４（ａ））を加熱する。 The preheating device 2 is for raising the temperature of the mounting component of the base material B to a temperature suitable for soldering or a value corresponding to thermal shock (a temperature capable of dealing with the influence of temperature change due to soldering). For this reason, as shown in FIG. 3, the preheating device 2 is transported by a plurality of preheating heater units 7 arranged along the longitudinal direction on the lower side of a later-described transport path (FIG. 4A). ).
　なお、図３は、予熱装置２と半田噴流装置３の構成部品の一部を示す部分拡大概略正面図である。特に、この半田噴流装置３は、半田槽８内に第１噴流部９と第２噴流部１０とを備えている。 FIG. 3 is a partially enlarged schematic front view showing some of the components of the preheating device 2 and the solder jet device 3. In particular, the solder jet device 3 includes a first jet portion 9 and a second jet portion 10 in the solder tank 8.
　第１噴流部９は、第１半田槽１１の上部に第１ノズル部１２を設けたものである。第１半田槽１１内には、図示しないスクリューが配置されている。前記スクリューの回転軸には、ベルトを介してモータの回転軸からの動力が伝達されるようになっている（モータはスクリューの回転軸に直結してもよい。また、モータに代えて電磁誘導ポンプを使用することもできる。）。
　そして、前記第１ノズル部１２は、矩形筒状で、上端開口は複数の貫通孔が形成された蓋体１２ａ（ノズルキャップ）で閉鎖されている。蓋体１２ａは、搬送装置４による基材Ｂや検査用治具５の搬送経路に沿って傾斜している。そして、モータを駆動すると、ベルトを介してスクリューが回転し、溶融した半田が第１ノズル部１２を上昇し、蓋体１２ａに形成した各貫通孔から上方へと乱流状態で噴流するようになっている。これにより、基材Ｂでの半田の濡れ性が確保される。 The first jet part 9 is provided with a first nozzle part 12 at the upper part of the first solder tank 11. A screw (not shown) is disposed in the first solder tank 11. Power from the rotation shaft of the motor is transmitted to the rotation shaft of the screw via a belt (the motor may be directly connected to the rotation shaft of the screw. A pump can also be used.)
The first nozzle portion 12 has a rectangular cylindrical shape, and the upper end opening is closed by a lid body 12a (nozzle cap) in which a plurality of through holes are formed. The lid body 12 a is inclined along the conveyance path of the base material B and the inspection jig 5 by the conveyance device 4. Then, when the motor is driven, the screw rotates through the belt, and the molten solder ascends the first nozzle portion 12 and jets in a turbulent state upward from each through hole formed in the lid body 12a. It has become. Thereby, the wettability of the solder with the base material B is ensured.
　第２噴流部１０は、第２半田槽１３の上部に第２ノズル部１４を設けたものである。第２半田槽１３内には、前記第１噴流部９と同様に、モータによりベルトを介して回転するスクリュー（図示せず）が配置されている（前記第１噴流部９と同様に、モータはスクリューの回転軸に直結してもよい。また、モータに代えて電磁誘導ポンプを使用することもできる。）。
　そして、前記第２ノズル部１４は、上端が開口したままであり、搬送装置４による基材Ｂや検査用治具５（図５）の搬送経路に沿って上端の開口縁部が傾斜している。そして、モータを駆動してスクリューを回転させると、第２ノズル部１４の上方開口部を介して溶融した半田が整流状態で噴流するようになっている。これにより、良好な半田切れ整形がなされる。 The second jet part 10 is provided with a second nozzle part 14 in the upper part of the second solder tank 13. In the second solder tank 13, a screw (not shown) that is rotated by a motor via a belt is disposed in the same manner as the first jet section 9 (as in the first jet section 9, the motor May be directly connected to the rotating shaft of the screw, or an electromagnetic induction pump can be used instead of the motor).
Then, the upper end of the second nozzle portion 14 remains open, and the opening edge of the upper end is inclined along the transport path of the base material B and the inspection jig 5 (FIG. 5) by the transport device 4. Yes. When the motor is driven to rotate the screw, the molten solder is jetted in a rectified state through the upper opening of the second nozzle portion 14. As a result, good solder cut shaping is performed.
　なお、第１噴流部９及び第２噴流部１０から噴流し、半田付けに利用されなかった残りの半田は、半田槽８に回収された後、各噴流部９，１０へと還流する。 Note that the remaining solder that is jetted from the first jet part 9 and the second jet part 10 and not used for soldering is collected in the solder tank 8 and then returned to the jet parts 9 and 10.
　フラックス塗布装置１、予熱装置２及び半田噴流装置３には、前述したように搬送装置４によって基材B（図４）や検査用治具５(図５)を搬送できるようになっている。 As described above, the base material B (FIG. 4) and the inspection jig 5 (FIG. 5) can be transported to the flux coating device 1, the preheating device 2, and the solder jet device 3 by the transport device 4, as described above.
　図１に示すように、搬送装置４は、基材Ｂや検査用治具５（図５）を、フラックス塗布装置１に搬入するための搬入コンベア１５と、フラックス塗布装置１内を搬送するための第１搬送コンベア１６と、フラックス塗布装置１から予熱装置２に受け渡すための乗継コンベア１７と、予熱装置２及び半田噴流装置３内を搬送するための第２搬送コンベア１８と、を備えている。 As shown in FIG. 1, the transport device 4 transports the base material B and the inspection jig 5 (FIG. 5) into the flux coating device 1 and the inside of the flux coating device 1. A first conveyor 16, a transfer conveyor 17 for transferring from the flux application device 1 to the preheating device 2, and a second conveyor 18 for conveying the preheating device 2 and the solder jet device 3. ing.
　搬入コンベア１５、第１搬送コンベア１６は水平方向に配置され、乗継コンベア１７は前記第２搬送コンベア１８の１／２の勾配で搬送方向に向かって徐々に高くなるように配置されている。そして、前記第１搬送コンベア１６，乗継コンベア１７は所定間隔で平行に配置したレールの対向面に、長手方向に沿って所定間隔で複数の円形ローラを設けてある。作業者が搬入コンベア１５上に基材Ｂ等を供給し、第一搬送コンベア１６へと移動させる。 The carry-in conveyor 15 and the first transfer conveyor 16 are arranged in the horizontal direction, and the transfer conveyor 17 is arranged so as to gradually become higher in the transfer direction with a ½ gradient of the second transfer conveyor 18. The first transfer conveyor 16 and the transfer conveyor 17 are provided with a plurality of circular rollers at predetermined intervals along the longitudinal direction on opposite surfaces of rails arranged in parallel at predetermined intervals. An operator supplies the base material B or the like on the carry-in conveyor 15 and moves it to the first transfer conveyor 16.
　搬送装置４の平面図である図４（ａ）に示すように、第１搬送コンベア１６は、チェーンローラ１６ａが図示しないモータ等によって回転駆動し、フラックス塗布装置１に搬入された基材Ｂ等を一定速度で搬送する。また、乗継コンベア１７も第１搬送コンベア１６と同様なローラ１７ａを有する構成となっており、フラックス塗布装置１から搬出された基材Ｂ等を第２搬送コンベア１８を介して予熱装置２へと搬送する。 As shown in FIG. 4A, which is a plan view of the transport device 4, the first transport conveyor 16 is driven by the chain roller 16a by a motor or the like (not shown), and the base material B and the like carried into the flux coating device 1 Is transported at a constant speed. In addition, the transfer conveyor 17 has the same roller 17a as the first conveyor 16, and the base material B and the like carried out from the flux applying device 1 are transferred to the preheating device 2 via the second conveyor 18. And carry.
　第２搬送コンベア１８は、搬送経路の両側でそれぞれ循環移動し、かつ、断面略Ｌ字形状のガイドブロック１９を備えた一対のコンベアからなり、水平面に対して搬送方向に向かって徐々に高くなるように配置されている。 The second transfer conveyor 18 is a pair of conveyors that circulate and move on both sides of the transfer path and includes guide blocks 19 having a substantially L-shaped cross section, and gradually increases in the transfer direction with respect to the horizontal plane. Are arranged as follows.
　複数のガイドブロック１９は各コンベアに一体化され、図４（ｂ）に示すように、基材Ｂを支持する。
　すなわち、断面略Ｌ字形状の各ガイドブロック１９は、内向する先端面の中央部分に溝部を有し、これが搬送経路を通過するとき一直線に整列することにより、搬送経路の両側面に、搬送方向に延びるガイド溝２０を形成する。前記ガイド溝２０は、基材Ｂや、後述する検査用治具１００（図５）の突条部１０５を保持可能となっている。そして、コンベアを図示しないモータ等の駆動手段で駆動させると、ガイド溝２０に保持された基材Ｂ等が一定速度で搬送される。 The plurality of guide blocks 19 are integrated with each conveyor, and support the base material B as shown in FIG.
That is, each guide block 19 having a substantially L-shaped cross section has a groove in the central portion of the inward leading end surface, and is aligned in a straight line when passing through the transport path, so that the guide direction on the both sides of the transport path A guide groove 20 extending in the direction is formed. The guide groove 20 can hold the base material B and the protrusion 105 of the inspection jig 100 (FIG. 5) described later. When the conveyor is driven by driving means such as a motor (not shown), the base material B and the like held in the guide groove 20 are conveyed at a constant speed.
　図５（ａ）は第２実施形態に係る検査用治具１００の平面図、図５（ｂ）は図５（ａ）のＢ－Ｂ線断面図、図５（ｃ）は図５（ａ）のＣ－Ｃ線断面図である。そして、この検査用治具１００は、支持フレーム１０１に、検査用プレート１０２と、第１半田検出部１０３と、第２半田検出部１０４と備えた構成である。また、検査用治具１００は、図６に示すように、図中右向きの搬送方向の先頭側から、第１測定部１０６、第２測定部１０７及び第３測定部１０８の３つの領域で構成されている。 5A is a plan view of the inspection jig 100 according to the second embodiment, FIG. 5B is a cross-sectional view taken along the line BB of FIG. 5A, and FIG. 5C is FIG. FIG. The inspection jig 100 includes a support frame 101 provided with an inspection plate 102, a first solder detection unit 103, and a second solder detection unit 104. Further, as shown in FIG. 6, the inspection jig 100 is composed of three regions of a first measurement unit 106, a second measurement unit 107, and a third measurement unit 108 from the head side in the rightward conveyance direction in the drawing. Has been.
　図６（ａ）は支持フレーム１０１の平面図であり、図６（ｂ）は図６（ａ）のＢ－Ｂ線断面図である。この支持フレーム１０１は、平面視矩形状の板材からなり、側縁部中央には長手方向に延びる突条部１０５が形成されている。支持フレーム１０１は、突条部１０５を、前述の搬送装置４のガイド溝２０にガイドされて搬送される。第１測定部１０６には、矩形孔１０９が形成され、そこには検査用プレート１０２が配置されている。 6 (a) is a plan view of the support frame 101, and FIG. 6 (b) is a cross-sectional view taken along the line BB of FIG. 6 (a). The support frame 101 is made of a plate material having a rectangular shape in plan view, and a protrusion 105 extending in the longitudinal direction is formed at the center of the side edge. The support frame 101 is conveyed while being guided by the guide groove 20 of the above-described conveying device 4 through the protrusion 105. A rectangular hole 109 is formed in the first measuring unit 106, and the inspection plate 102 is disposed there.
　支持フレーム１０１は、第１測定部１０６において幅方向に浅溝部１０１ａ（図６（ａ），図６（ｂ））が形成され、その底面には矩形孔１０９が形成され、上下面が連通している。そして、矩形孔１０９には、後述する検査用プレート１０２が配置される。また、浅溝部１０１ａを構成する両側壁上面には、浅溝部１０１ａに沿って３箇所ずつネジ孔（両端部ネジ孔１０１ｂ、中央部ネジ孔１０１ｃ）が形成されている。支持フレーム１０１の底面には、矩形孔１０９の両側部に沿って矩形孔１０９内に突出する保持プレート１０９ａが一体化されている。 The support frame 101 has a shallow groove portion 101a (FIGS. 6A and 6B) formed in the width direction in the first measurement unit 106, a rectangular hole 109 is formed on the bottom surface thereof, and upper and lower surfaces communicate with each other. ing. An inspection plate 102 described later is disposed in the rectangular hole 109. In addition, screw holes (both end screw holes 101b and a central screw hole 101c) are formed at three locations along the shallow groove portions 101a on the upper surfaces of both side walls constituting the shallow groove portions 101a. A holding plate 109 a protruding into the rectangular hole 109 along both sides of the rectangular hole 109 is integrated with the bottom surface of the support frame 101.
　支持フレーム１０１は、第２測定部１０７において、幅方向の両側に位置する凹所１１２がそれぞれ形成されている。各凹所１１２のほぼ中央部分には貫通孔１１２ａがそれぞれ形成され、後述する第１半田検出部１０３の測定ピン１１９が挿通可能となっている。 The support frame 101 is formed with recesses 112 located on both sides in the width direction in the second measurement unit 107. A through hole 112a is formed in a substantially central portion of each recess 112, and a measurement pin 119 of the first solder detection unit 103 to be described later can be inserted.
　支持フレームは、第３測定部１０８において、幅方向に延びる浸漬確認部１１３が形成され、そこには３箇所に等間隔で貫通孔１１３ａが形成され、後述する第２半田検出部１０４の測定ピン１２８が挿通可能となっている。 The support frame is formed with immersion confirmation portions 113 extending in the width direction at the third measurement portion 108, and through holes 113a are formed at equal intervals at three locations, and the measurement pins of the second solder detection portion 104, which will be described later, are formed. 128 can be inserted.
　図５（ｂ）に示すように、矩形孔１０９の両側両端部の２箇所にそれぞれ形成した両端部ネジ孔１０１ｃ（図１０（ａ））に保持爪１１０をネジ止めすることにより、矩形孔１０９内に配置する検査用プレート１０２は、前記保持爪１１０と支持フレーム１０１の保持プレート１０９ａとの間に保持されている。 As shown in FIG. 5 (b), the holding claw 110 is screwed into the screw holes 101c (FIG. 10 (a)) at both ends formed at two ends on both sides of the rectangular hole 109, thereby The inspection plate 102 disposed therein is held between the holding claw 110 and the holding plate 109 a of the support frame 101.
　図５（ｃ）に示すように、矩形孔１０９を形成することにより低下した強度は、矩形孔１０９の両側中央部にそれぞれ形成した中央部ネジ孔１０１ｂ（図１０（ａ））にネジ止めされ、かつ、中央部を掛け渡したアーチ部１１１によって補強されている。 As shown in FIG. 5C, the strength reduced by forming the rectangular hole 109 is screwed into the central screw holes 101b (FIG. 10A) formed in the central portions on both sides of the rectangular hole 109, respectively. And it is reinforced by the arch part 111 which spanned the center part.
　検査用プレート１０２は、前記第１実施形態と同様、その搬送方向に対して直交する方向すなわち幅方向に、第１測定線１１６、第２測定線１１５及び基準線１１７がそれぞれ形成されている。 As in the first embodiment, the inspection plate 102 has a first measurement line 116, a second measurement line 115, and a reference line 117 formed in a direction orthogonal to the conveyance direction, that is, in the width direction.
　ここでは、第１測定線１１６及び第２測定線１１５が点線で形成され、基準線１１７が実線で形成されている。基準線１１７は、第１測定線１１６及び第２測定線１１５で、検査用プレート１０２に形成される半田の模様の前端側の縁（前縁）が正しい位置にあるか否かを検査するために、半田の模様の後端側の縁（後縁）の位置を合わせるために使用する測定基準となるラインである。第１測定線１１６は、第１ノズル部１２から噴流される半田付け条件が適正であれば、検査用プレート１０２の下面に接触する半田によって形成される模様の後縁が基準線１１７に合致したときに、前縁が到達すると予想されるラインである。半田によって形成される模様の後縁が基準線１１７に合致したときに、前縁と第１測定線１１６との位置関係（誤差）で確認する。また、第２測定線１１５は、第２ノズル部１４から噴流される半田付け条件が適正であれば、検査用プレート１０２の下面に接触する半田によって形成される模様の後縁が基準線１１７に合致したときに、前縁が到達すると予想されるラインである。半田によって形成される模様の後縁が基準線１１７に合致したときに、前縁と第２測定線１１５との位置関係（誤差）で確認する。そして、検査用プレート１０２に形成される模様の全体形状や、基準線１１７での半田によって形成される模様の縁の状態（位置や傾き）を見ることで、半田の噴流状態を判断することが可能となっている。 Here, the first measurement line 116 and the second measurement line 115 are formed by dotted lines, and the reference line 117 is formed by a solid line. The reference line 117 is a first measurement line 116 and a second measurement line 115 for inspecting whether the front edge (front edge) of the solder pattern formed on the inspection plate 102 is in the correct position. Further, it is a line that becomes a measurement standard used for aligning the position of the edge (rear edge) on the rear end side of the solder pattern. In the first measurement line 116, if the soldering conditions jetted from the first nozzle unit 12 are appropriate, the trailing edge of the pattern formed by the solder contacting the lower surface of the inspection plate 102 matches the reference line 117. Sometimes it is the line that the leading edge is expected to reach. When the trailing edge of the pattern formed by the solder matches the reference line 117, the positional relationship (error) between the leading edge and the first measurement line 116 is confirmed. Further, the second measurement line 115 is such that the trailing edge of the pattern formed by the solder contacting the lower surface of the inspection plate 102 becomes the reference line 117 if the soldering conditions jetted from the second nozzle portion 14 are appropriate. This is the line that the leading edge is expected to reach when matched. When the trailing edge of the pattern formed by the solder matches the reference line 117, the positional relationship (error) between the leading edge and the second measurement line 115 is confirmed. The solder jet state can be determined by looking at the overall shape of the pattern formed on the inspection plate 102 and the state (position and inclination) of the pattern edge formed by the solder at the reference line 117. It is possible.
　図７（ａ）は、第１半田検出部１０３の側面断面図であり、図７（ｂ）は正面断面図である。この第１半田検出部１０３は、支持台１１８と、この支持台１１８から突出する測定ピン１１９とで構成され、前記支持フレーム１０１の第２測定部１０７の凹所１１２に形成した各貫通孔１１２ａに対して１つずつ設けられている。
　支持台１１８は、ベースプレート１２０の両側にサイドプレート１２１を配置し、ベースプレート１２０と、サイドプレート１２１の上端屈曲部との間に昇降プレート１２２を配置したものである。昇降プレート１２２には調整ネジ１２３が螺合されており、この調整ネジ１２３を回転させることにより昇降プレート１２２の昇降位置を調整できるようになっている。
　測定ピン１１９は、昇降プレート１２２に固定され、水平方向から鉛直下方へと延びて浸漬確認穴１１２ａ内に位置している。また、測定ピン１１９は、通電リード１２４を介して図示しないＬＥＤに電気接続されている。ＬＥＤは図示しない他の通電リードを介して半田槽内の半田に接触する図示していない電極部と電気接続されている。そして、測定ピン１１９に半田が接触することにより、報知部であるＬＥＤが点灯して報知するようになっている。 FIG. 7A is a side cross-sectional view of the first solder detection unit 103, and FIG. 7B is a front cross-sectional view. The first solder detection unit 103 includes a support base 118 and measurement pins 119 protruding from the support base 118, and each through hole 112 a formed in the recess 112 of the second measurement unit 107 of the support frame 101. One for each.
The support 118 is configured such that side plates 121 are disposed on both sides of the base plate 120, and an elevating plate 122 is disposed between the base plate 120 and the upper end bent portion of the side plate 121. An adjusting screw 123 is screwed onto the elevating plate 122, and the elevating position of the elevating plate 122 can be adjusted by rotating the adjusting screw 123.
The measurement pin 119 is fixed to the elevating plate 122, extends vertically downward from the horizontal direction, and is positioned in the immersion confirmation hole 112a. Further, the measurement pin 119 is electrically connected to an LED (not shown) via the energization lead 124. The LED is electrically connected to an electrode portion (not shown) that contacts the solder in the solder tank via another current-carrying lead (not shown). And when solder contacts measurement pin 119, LED which is a report part lights up and reports.
　第２半田検出部１０４は、図５（ｃ）に示すように、取付台１２７と、この取付台１２７に装着された３つの測定ピン１２８とで構成され、前記支持フレーム１０１の第３測定部１０８に取り付けられて浸漬確認部１１３の上方に位置している。測定ピン１２８は、取付台１２７の下面から突出している。このため、測定ピン１２８は、第２半田検出部１０４を支持フレーム１０１に取り付けた場合には、前記浸漬確認部１１３を貫通して貫通孔１１２ｂ内に位置している。測定ピン１２８は、図示していない通電リード・ＬＥＤ・半田接触用電極部と電気接合され、測定ピン１２８が半田に接触することにより、報知部であるＬＥＤが点灯して報知する。 As shown in FIG. 5 (c), the second solder detection unit 104 includes a mounting table 127 and three measurement pins 128 mounted on the mounting table 127, and the third measurement unit of the support frame 101. It is attached to 108 and is located above the immersion confirmation part 113. The measurement pin 128 protrudes from the lower surface of the mounting base 127. Therefore, when the second solder detection unit 104 is attached to the support frame 101, the measurement pin 128 passes through the immersion confirmation unit 113 and is positioned in the through hole 112b. The measurement pin 128 is electrically joined to a current-carrying lead / LED / solder contact electrode portion (not shown), and when the measurement pin 128 comes into contact with the solder, the LED serving as the notification portion is turned on to notify.
　前記構成の検査用治具１００は、半田噴流装置３に於ける半田の噴流状態を検査するために次のようにして利用される。 The inspection jig 100 having the above-described configuration is used as follows in order to inspect the solder jet state in the solder jet device 3.
　第１測定部１０６では、前記第１実施形態と同様に、検査用プレート１０２に接触する半田の模様から半田噴流装置３の状態等を判断する。
　すなわち、前記第１実施形態と同様に、半田による模様の形状を観察する。そして、観察した形状が適切なものであるか否かを判断し、不適切であると判断すれば、その後の検査を中止してメンテナンスを行う。 As in the first embodiment, the first measuring unit 106 determines the state of the solder jet device 3 and the like from the solder pattern in contact with the inspection plate 102.
That is, the shape of the pattern made of solder is observed as in the first embodiment. Then, it is determined whether or not the observed shape is appropriate, and if it is determined to be inappropriate, the subsequent inspection is stopped and maintenance is performed.
　具体的には、噴流が基板搬送方向全面に接触していないか、接触していてもその濃淡から噴流圧が小さいと判断される場合、噴流状態が不適切であると判断し、その後の検査を中止してメンテナンスを行う。また、検査プレート１０２の周縁部分での半田の接触状態から半田付けの環境が適切であるか否かを判断する。検査プレート１０２の周縁部分に気泡等が発生していれば、フラックスガスが発生し、基板等に半田付けする際、不濡の原因となると判断する。 Specifically, if it is determined that the jet flow is not in contact with the entire surface in the substrate transport direction or the jet pressure is small from the density even though it is in contact, the jet state is determined to be inappropriate, and the subsequent inspection Stop and perform maintenance. Further, it is determined from the contact state of the solder at the peripheral portion of the inspection plate 102 whether or not the soldering environment is appropriate. If bubbles or the like are generated in the peripheral portion of the inspection plate 102, it is determined that flux gas is generated and causes non-wetting when soldering to the substrate or the like.
　そして、前記第１実施形態と同様に、第１ノズル部１２から噴流された半田によって検査用プレート１０２に形成される模様の後縁が基準線１１７と合致したとき、前縁と第１測定線１１６との位置関係を検査する。前縁の位置が第１測定線１１６に合致あるいはほぼ合致していれば、ＤＩＰ距離が適切であると判断し、合致していなければ（位置がずれたり、波打ったり、傾いたりしていれば）、不適切であると判断し、その後の検査を中止して半田噴流装置３のメンテナンスを行う。
　また、第２ノズル１３から噴流された半田についても同様の処理を行う。
　すなわち、検査用プレート１０２に形成される模様の後縁が基準線１１７と合致したとき、前縁と第２測定線１１５との位置関係を検査し、前縁の位置が第２測定線１１５に合致あるいはほぼ合致していれば、ＤＩＰ距離が適切であると判断し、合致していなければ不適切であると判断し、その後の検査を中止して半田噴流装置３のメンテナンスを行う。 As in the first embodiment, when the trailing edge of the pattern formed on the inspection plate 102 by the solder jetted from the first nozzle portion 12 matches the reference line 117, the leading edge and the first measurement line The positional relationship with 116 is inspected. If the position of the leading edge coincides with or substantially coincides with the first measurement line 116, it is determined that the DIP distance is appropriate, and if it does not coincide (the position is shifted, wavy, or inclined). If it is determined to be inappropriate, the subsequent inspection is stopped and the solder jet device 3 is maintained.
The same process is performed on the solder jetted from the second nozzle 13.
That is, when the trailing edge of the pattern formed on the inspection plate 102 matches the reference line 117, the positional relationship between the leading edge and the second measurement line 115 is inspected, and the position of the leading edge becomes the second measurement line 115. If they match or almost match, it is determined that the DIP distance is appropriate, and if they do not match, it is determined that the DIP distance is inappropriate, and the subsequent inspection is stopped and the solder jet device 3 is maintained.
　第１半田検出部１０３では、支持フレーム１０１の凹所１１２の底面に形成した貫通孔１１２ａ内にそれぞれ侵入する半田の位置から半田付けする際の浸漬状態を判断する。
　すなわち、各貫通孔１１２ａに半田が適正な位置まで侵入していれば、測定ピン１１９が半田に接触し、報知部であるＬＥＤが点灯して報知する。 The first solder detection unit 103 determines a dipping state at the time of soldering from the position of the solder that enters each through hole 112 a formed in the bottom surface of the recess 112 of the support frame 101.
That is, if the solder has penetrated to each through-hole 112a to an appropriate position, the measurement pin 119 comes into contact with the solder, and the LED serving as the notification unit is turned on to notify.
　第２半田検出部１０４においても同様に、半田が支持フレーム１０１に形成した貫通孔１１２ｂ内の適正な位置に侵入していれば、測定ピン１２８が半田に接触し、ＬＥＤが点灯する。 Similarly, in the second solder detection unit 104, if the solder has entered an appropriate position in the through hole 112b formed in the support frame 101, the measurement pin 128 comes into contact with the solder and the LED is lit.
　なお、本発明は、前記実施形態に記載された構成に限定されるものではなく、種々の変更が可能である。 In addition, this invention is not limited to the structure described in the said embodiment, A various change is possible.
　前記第１及び第２実施形態では、検査用プレート１０２として、第１測定線１１６、第２測定線１１５及び基準線１１７を形成したものを使用したが、次のように構成することもできる。 In the first and second embodiments, the inspection plate 102 having the first measurement line 116, the second measurement line 115, and the reference line 117 is used. However, the inspection plate 102 may be configured as follows.
　すなわち、図８に示すように、測定補助線を追加することもできる。この場合、測定補助線は、等間隔で形成し、等本数ごとに線形状を変更することで、検査用治具の搬送速度を測定したり、自由に変更したＤＩＰ距離に対して対応したりすることができる。
　また、ＤＩＰ距離が理想とする値から不適合である場合、そのときのＤＩＰ距離も的確に計測できるので、その計測値に基づいて調整作業を容易に行うことができる。
　さらに、基準線は、搬送方向に直交する方向だけでなく、搬送方向に沿った方向にも形成することもできる。これによれば、検査用プレート１０２に形成される半田の模様の変化量をも簡単に判断できる。その上、第２搬送コンベア１８のガイドブロック１９のはんだ噴流への影響も計測しやすくなるという利点がある。 That is, as shown in FIG. 8, a measurement auxiliary line can be added. In this case, measurement auxiliary lines are formed at equal intervals, and the line shape is changed for each equal number, thereby measuring the conveyance speed of the inspection jig or responding to a freely changed DIP distance. can do.
In addition, when the DIP distance is incompatible with the ideal value, the DIP distance at that time can also be accurately measured, so that the adjustment work can be easily performed based on the measured value.
Furthermore, the reference line can be formed not only in the direction orthogonal to the transport direction but also in the direction along the transport direction. According to this, the change amount of the solder pattern formed on the inspection plate 102 can be easily determined. In addition, there is an advantage that the influence on the solder jet of the guide block 19 of the second conveyor 18 can be easily measured.
　また、前記実施形態では、検査用プレート１０２等に形成される半田の模様の後縁が基準線１１７と合致したとき、前縁と第１測定線１１６又は第２測定線１１５との位置関係を検査するようにしたが、基準線と測定線とを逆としてもよい。
　すなわち、半田の模様の前縁が基準線に合致したとき、後縁の各測定線との位置関係を検査するようにしてもよい。
　要するに、半田の噴流状態を検査できるように、半田の模様の前縁及び後縁の形状、傾きのほか、前縁と後縁の距離等を判別可能な線が形成されていればよい。また、正確な検査が必要でなければ、測定線等は形成されていなくても構わない。 In the embodiment, when the trailing edge of the solder pattern formed on the inspection plate 102 or the like matches the reference line 117, the positional relationship between the leading edge and the first measurement line 116 or the second measurement line 115 is determined. Although the inspection is performed, the reference line and the measurement line may be reversed.
That is, when the front edge of the solder pattern matches the reference line, the positional relationship with each measurement line on the rear edge may be inspected.
In short, in order to be able to inspect the jet state of the solder, it is only necessary to form a line capable of discriminating the distance between the front edge and the rear edge in addition to the shape and inclination of the front and rear edges of the solder pattern. Further, if an accurate inspection is not necessary, the measurement line or the like may not be formed.
　前述の実施形態では、開口の広い半田層に適用する場合について説明したが、必ずしもこれに限らず、例えば、基材の特定の１箇所にスポット的に半田付けする必要がある場合に、１本のノズルから噴流する溶融半田の噴流状態を検査する場合に適用してもよいこと勿論である。 In the above-described embodiment, the case where the present invention is applied to a solder layer having a wide opening has been described. However, the present invention is not necessarily limited thereto. Needless to say, the present invention may be applied to the case of inspecting the jet state of the molten solder jetted from the nozzle.
　本発明に係る検査用治具５は、鉛入り・鉛フリー半田等、半田噴流装置での半田の噴流状態の検査に使用することができる。 The inspection jig 5 according to the present invention can be used for inspection of a solder jet state in a solder jet apparatus such as lead-containing / lead-free solder.

Claims (9)

  1. 　半田の噴流状態を検査するための検査用治具であって、
    　前記半田による熱影響により変形しない耐熱性と、一方の面への半田の接触状態を、他方の面側から視認可能とする透光性とを有する検査用プレートと、
    　半田の浸漬高さを検出する半田検出装置と、
    　前記検査用プレート及び前記半田検出装置を保持可能な支持フレームと、
    を備えたことを特徴とする検査用治具。     An inspection jig for inspecting a solder jet state,
    An inspection plate having heat resistance that does not deform due to the thermal influence of the solder, and a translucency that makes the contact state of the solder to one surface visible from the other surface side;
    A solder detection device for detecting the immersion height of the solder;
    A support frame capable of holding the inspection plate and the solder detection device;
    An inspection jig characterized by comprising:
  2. 　前記支持フレームは、
    　　前記検査用プレートを保持し、周縁の支持する部分を除いて上下に露出させる開口部を有する第１測定部と、
    　　半田を導くための複数の開口部を有する第２測定部と、
    を備え、
    　前記半田検出装置は、前記第２測定部の各開口部によって導かれた半田の浸漬高さを検出することを特徴とする請求項１に記載の検査用治具。     The support frame is
    A first measurement unit that holds the inspection plate and has an opening that is exposed vertically except for a portion supported by the periphery;
    A second measurement unit having a plurality of openings for guiding the solder;
    With
    The inspection jig according to claim 1, wherein the solder detection device detects the immersion height of the solder guided by each opening of the second measurement unit.
  3. 　前記検査用プレートは、一方の面への半田の接触状態を判断するための基準線を有することを特徴とする請求項１又は２に記載の検査用治具。 3. The inspection jig according to claim 1, wherein the inspection plate has a reference line for judging a contact state of the solder to one surface.
  4. 　前記検査用プレートは、半田付けされる基材と同一搬送経路を一定速度で搬送されるものであり、前記基準線は、搬送方向に直交する方向に延びていることを特徴とする請求項３に記載の検査用治具。 The inspection plate is transported at a constant speed along the same transport path as the base material to be soldered, and the reference line extends in a direction orthogonal to the transport direction. The inspection jig described in 1.
  5. 　前記検査用プレートは、前記基準線よりも搬送方向側に形成される少なくとも１本の測定線を有することを特徴とする請求項４に記載の検査用治具。 5. The inspection jig according to claim 4, wherein the inspection plate has at least one measurement line formed on the transport direction side of the reference line.
  6. 　前記半田検出装置は、各開口部にそれぞれ配置される複数の測定ピンと、測定ピンが半田と接触することにより報知する報知部とを備えたことを特徴とする請求項１から５のいずれか１項に記載の検査用治具。 6. The solder detection apparatus according to claim 1, further comprising: a plurality of measurement pins respectively disposed in the openings, and a notification unit that notifies the measurement pins when they contact the solder. Inspection jig according to item.
  7. 　前記測定ピンは、半田が付着することを防止するためのヒータを備えたことを特徴とする請求項６に記載の検査用治具。 The inspection jig according to claim 6, wherein the measuring pin includes a heater for preventing the solder from adhering.
  8. 　半田の噴流状態を検査するための検査用治具であって、
    　噴流させた半田によって形成される模様により、半田の噴流状態を検出可能な第１測定部を有し、半田付けされる基板と一体型に形成したことを特徴とする検査用治具。     An inspection jig for inspecting a solder jet state,
    An inspection jig having a first measurement unit capable of detecting a jet state of solder by a pattern formed by jetted solder and formed integrally with a substrate to be soldered.
  9. 　半田の噴流状態を検査するための検査用治具であって、
    　噴流させた半田の浸漬高さを検出可能な半田検出部を有することを特徴とする請求項８に記載の検査用治具。     An inspection jig for inspecting a solder jet state,
    The inspection jig according to claim 8, further comprising a solder detection unit capable of detecting an immersion height of the jetted solder.
PCT/JP2012/054374 2011-09-12 2012-02-23 Inspection fixture WO2013038726A1 (en)

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