JP2011077490A - Apparatus and method for mounting spherical body, spherical body-mounted substrate and electronic component-mounted substrate - Google Patents

Apparatus and method for mounting spherical body, spherical body-mounted substrate and electronic component-mounted substrate Download PDF

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Publication number
JP2011077490A
JP2011077490A JP2009293906A JP2009293906A JP2011077490A JP 2011077490 A JP2011077490 A JP 2011077490A JP 2009293906 A JP2009293906 A JP 2009293906A JP 2009293906 A JP2009293906 A JP 2009293906A JP 2011077490 A JP2011077490 A JP 2011077490A
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Prior art keywords
mounting
spherical body
mounting plate
substrate
diameter
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JP2009293906A
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Japanese (ja)
Inventor
Kazuhiko Seki
和彦 関
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Hioki EE Corp
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Hioki EE Corp
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Priority to JP2009293906A priority Critical patent/JP2011077490A/en
Publication of JP2011077490A publication Critical patent/JP2011077490A/en
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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To mount a spherical body on a circuit substrate with a complicated structure. <P>SOLUTION: A sherical body mounting apparatus includes a plurality of mounting plates 11a and 11b where insertion holes into which spherical bodies are inserted are formed, and a mounting mechanism 2 performing a moving process for moving the mounting plates 11a and 11b to a substrate 400 so that lower faces of the mounting plates 11a and 11b and a mounted face of the substrate 400 are in a facing state where they are brought close to each other or brought into contact with each other to face each other, performing a supply process for supplying the spherical body whose diameter in the facing state corresponds to a bore diameter of the insertion hole to upper faces of the mounting plates 11a and 11b, and mounting the spherical body inserted into the insertion hole on the substrate 400. The insertion holes whose bore diameters differ for the respective mounting plates 11a and 11b are formed in the respective mounting plates 11a and 11b. The mounting mechanism 2 performs the moving process and supply process for the respective mounting plates 11a and 11b and mounts a plurality of types of spherical bodies whose diameters differ in accordance with the bore diameters on one substrate 400. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、球状体を挿通させる挿通孔が形成された搭載用プレートを用いて搭載対象体に球状体を搭載する球状体搭載装置および球状体搭載方法、その球状体搭載装置または球状体搭載方法を用いて製造される球状体搭載済基板、並びにその球状体搭載済基板に電子部品が搭載された電子部品搭載済基板に関するものである。   The present invention relates to a spherical body mounting apparatus and a spherical body mounting method for mounting a spherical body on a mounting target body using a mounting plate formed with an insertion hole through which the spherical body is inserted, and the spherical body mounting apparatus or the spherical body mounting method. The present invention relates to a spherical body mounted substrate manufactured by using an electronic component, and an electronic component mounted substrate in which an electronic component is mounted on the spherical body mounted substrate.

この種の球状体搭載装置として、特開平１０−１２６０４６号公報に開示されたボールグリッドアレイの製造装置が知られている。この製造装置は、保持台、マスク、ブレード等を備え、基板に形成されているパターン上に球状体としての半田（はんだ）ボールを搭載可能に構成されている。この製造装置を用いて半田ボールの搭載を行う際には、まず、基板を保持台に保持させ、次いで、基板の上にマスクを載置する。続いて、マスクの上部に半田ボールを供給する。次いで、ブレードを水平方向（マスクの表面に沿って）に移動させることにより、マスクに形成された導入孔に半田ボールを１つずつ落とし込むと共に、余分な半田ボールをかき取る。これにより、導入孔に落とし込んだ半田ボールが基板のパターン上に搭載される。   As this type of spherical body mounting apparatus, a ball grid array manufacturing apparatus disclosed in Japanese Patent Application Laid-Open No. 10-126046 is known. This manufacturing apparatus includes a holding table, a mask, a blade, and the like, and is configured to be able to mount a solder (solder) ball as a spherical body on a pattern formed on a substrate. When solder balls are mounted using this manufacturing apparatus, first, the substrate is held on a holding table, and then a mask is placed on the substrate. Subsequently, a solder ball is supplied to the upper part of the mask. Next, by moving the blade in the horizontal direction (along the surface of the mask), the solder balls are dropped one by one into the introduction holes formed in the mask, and the excess solder balls are scraped off. Thereby, the solder ball dropped into the introduction hole is mounted on the pattern of the substrate.

特開平１０−１２６０４６号公報（第２−３頁、第１図）Japanese Patent Laid-Open No. 10-126046 (page 2-3, FIG. 1)

ところが、上記の製造装置を含む従来のこの種の球状体搭載装置には、以下の問題点がある。すなわち、従来のこの種の球状体搭載装置では、同じ口径の導入孔が形成された単一のマスクを用いて同じ大きさ（直径）の球状体を基板のパターンに搭載している。つまり、従来の球状体搭載装置では、搭載可能な球状体の大きさが１種類に限られている。一方、１つの基板上において配線パターンの密度が大きく異なる領域が存在したり、太さの異なる複数種類のリード線が半田接続される回路基板では、基板上の領域に応じて大きさの異なる球状体を搭載する必要がある。具体的には、配線パターンの密度が大きい領域では、隣接する配線パターン同士の間隔が短く、これらの配線パターン同士の短絡を防止するために、小さな球状体を搭載する必要がある。また、電源回路等が構成される基板上の領域では、太いリード線を接続するのが好ましく、このような太いリード線を確実に接続するには、大きな球状体を搭載する必要がある。しかしながら、従来の球状体搭載装置では、上記したように搭載可能な球状体の大きさが１種類に限られているため、このような複雑な構成の回路基板に対する球状体の搭載が困難なっている。   However, this type of conventional spherical body mounting apparatus including the above manufacturing apparatus has the following problems. That is, in this type of conventional spherical body mounting apparatus, a spherical body of the same size (diameter) is mounted on a substrate pattern using a single mask in which introduction holes of the same diameter are formed. That is, in the conventional spherical body mounting apparatus, the size of the spherical body that can be mounted is limited to one type. On the other hand, in a circuit board where a plurality of types of lead wires having different thicknesses exist on a single substrate, or in which a plurality of types of lead wires having different thicknesses are solder-connected, a spherical shape having a different size depending on the region on the substrate It is necessary to mount the body. Specifically, in a region where the density of wiring patterns is high, the interval between adjacent wiring patterns is short, and it is necessary to mount a small spherical body in order to prevent a short circuit between these wiring patterns. Further, it is preferable to connect a thick lead wire in a region on the substrate where a power supply circuit or the like is configured. In order to securely connect such a thick lead wire, it is necessary to mount a large spherical body. However, in the conventional spherical body mounting apparatus, since the size of the spherical body that can be mounted is limited to one kind as described above, it is difficult to mount the spherical body on the circuit board having such a complicated configuration. Yes.

本発明は、かかる問題点に鑑みてなされたものであり、複雑な構成の搭載対象体に対する球状体の搭載を実現し得る球状体搭載装置および球状体搭載方法、その球状体搭載装置または球状体搭載方法を用いて製造される球状体搭載済基板、並びにその球状体搭載済基板に電子部品が搭載された電子部品搭載済基板を提供することを主目的とする。   The present invention has been made in view of such problems, and a spherical body mounting apparatus and a spherical body mounting method, a spherical body mounting apparatus, or a spherical body that can realize mounting of a spherical body on a mounting object having a complicated configuration. A main object is to provide a spherical body mounted substrate manufactured by using the mounting method, and an electronic component mounted substrate in which an electronic component is mounted on the spherical body mounted substrate.

上記目的を達成すべく請求項１記載の球状体搭載装置は、球状体の直径に対応させて口径が規定されて当該球状体を挿通させる挿通孔が形成された搭載用プレートと、当該搭載用プレートの下面と搭載対象体の被搭載面とが互いに近接または接触して対向する対向状態となるように当該搭載用プレートおよび当該搭載対象体のいずれか一方をいずれか他方に向けて移動させる移動処理を実行すると共に前記直径が前記口径に対応する前記球状体を当該搭載用プレートの上面に供給する供給処理を当該対向状態において実行して前記挿通孔に挿通させた当該球状体を前記搭載対象体に搭載する搭載部とを備えた球状体搭載装置であって、前記搭載用プレートを複数備え、前記各搭載用プレートには、前記口径が当該各搭載用プレート毎に互いに異なる前記挿通孔が形成され、前記搭載部は、前記移動処理および前記供給処理を前記各搭載用プレート毎に実行して前記口径に対応して前記直径が互いに異なる複数種類の前記球状体を１つの前記搭載対象体に対して搭載する。   In order to achieve the above object, the spherical body mounting apparatus according to claim 1 is provided with a mounting plate in which an aperture is defined corresponding to the diameter of the spherical body and an insertion hole through which the spherical body is inserted is formed. Movement for moving one of the mounting plate and the mounting object toward the other so that the lower surface of the plate and the mounting surface of the mounting object are in close proximity to or in contact with each other The mounting the spherical body that is inserted into the insertion hole by performing a supply process in the opposite state of supplying the spherical body having the diameter corresponding to the aperture to the upper surface of the mounting plate. A spherical body mounting device including a mounting portion mounted on a target body, the device including a plurality of mounting plates, each of the mounting plates having a diameter that is different from each other for each mounting plate. The insertion portion is formed, and the mounting portion executes the movement process and the supply process for each of the mounting plates, and sets the plurality of types of the spherical bodies having different diameters corresponding to the diameter. It mounts with respect to the said two mounting target bodies.

また、請求項２記載の球状体搭載装置は、請求項１記載の球状体搭載装置において、前記搭載用プレートには、前記搭載対象体に既に搭載されている前記球状体との接触を回避するための凹部が形成されている。   The spherical body mounting apparatus according to claim 2 is a spherical body mounting apparatus according to claim 1, wherein the mounting plate avoids contact with the spherical body already mounted on the mounting target body. A concave portion is formed.

また、請求項３記載の球状体搭載装置は、請求項１または２記載の球状体搭載装置において、前記搭載部は、前記搭載用プレートを前記搭載対象体に向けて移動させる処理を前記移動処理として実行する移動機構を当該搭載用プレートの数と同数備え、前記各移動機構は、前記各搭載用プレートを個別に移動させる。   Further, the spherical body mounting apparatus according to claim 3 is the spherical body mounting apparatus according to claim 1 or 2, wherein the mounting section performs a process of moving the mounting plate toward the mounting object. As many as the number of the mounting plates, and each moving mechanism individually moves the mounting plates.

また、請求項４記載の球状体搭載装置は、請求項１から３のいずれかに記載の球状体搭載装置において、前記搭載部は、前記各搭載用プレートに一対一で割り当てられて当該割り当てられた搭載用プレートに対して前記供給処理を実行する供給機構を当該搭載用プレートの数と同数備え、前記各供給機構は、前記直径が前記割り当てられた搭載用プレートの前記口径に対応する前記球状体を当該搭載用プレートに個別に供給する。   Further, the spherical body mounting device according to claim 4 is the spherical body mounting device according to any one of claims 1 to 3, wherein the mounting portions are allocated to the mounting plates in a one-to-one relationship. The same number of supply mechanisms as the number of the mounting plates are provided for executing the supplying process on the mounting plates, and each of the supply mechanisms has the spherical shape corresponding to the diameter of the assigned mounting plate. The body is supplied individually to the mounting plate.

また、請求項５記載の球状体搭載装置は、請求項１から４のいずれかに記載の球状体搭載装置において、前記搭載部は、前記口径の小さい前記搭載用プレートに対する前記移動処理および前記供給処理を前記口径の大きい前記搭載用プレートに対する前記移動処理および前記供給処理に先立って行う。   Further, the spherical body mounting apparatus according to claim 5 is the spherical body mounting apparatus according to any one of claims 1 to 4, wherein the mounting section is configured to perform the movement process and the supply with respect to the mounting plate having a small diameter. The process is performed prior to the moving process and the supplying process for the mounting plate having a large diameter.

また、請求項６記載の球状体搭載装置は、球状体の直径に対応させて口径が規定されて当該球状体を挿通させる挿通孔が形成された搭載用プレートと、当該搭載用プレートの下面と搭載対象体の被搭載面とが互いに近接または接触して対向する対向状態となるように当該搭載用プレートおよび搭載対象体のいずれか一方をいずれか他方に向けて移動させる移動処理を実行すると共に前記直径が前記口径に対応する前記球状体を当該搭載用プレートの上面に供給する供給処理を当該対向状態において実行して前記挿通孔に挿通させた当該球状体を前記搭載対象体に搭載する搭載部とを備えた球状体搭載装置であって、前記搭載用プレートには、前記口径が互いに異なる複数種類の前記挿通孔が形成され、前記搭載部は、前記供給処理において前記口径に対応して前記直径が互いに異なる複数種類の前記球状体を当該直径が大きい順に供給して当該複数種類の球状体を１つの前記搭載対象体に対して搭載する。   The spherical body mounting device according to claim 6 is a mounting plate in which an aperture is defined corresponding to the diameter of the spherical body and an insertion hole for inserting the spherical body is formed; and a lower surface of the mounting plate; While performing a moving process of moving either the mounting plate or the mounting target toward one of the other so that the mounting surfaces of the mounting target are close to or in contact with each other and face each other. A supply process for supplying the spherical body having a diameter corresponding to the diameter to the upper surface of the mounting plate is executed in the facing state, and the spherical body inserted through the insertion hole is mounted on the mounting target body. The mounting plate is provided with a spherical body mounting device, wherein the mounting plate is formed with a plurality of types of insertion holes having different diameters, and the mounting portion is a front end in the supply process. The spherical body a plurality of types of the different diameter from one another to correspond to the diameter and sequentially supplied to the large diameter mounting the plurality of types of spherical bodies for one of the mounting object.

また、請求項７記載の球状体搭載方法は、球状体の直径に対応させて口径が規定されて当該球状体を挿通させる挿通孔が形成された搭載用プレートの下面と搭載対象体の被搭載面とが互いに近接または接触して対向する対向状態となるように当該搭載用プレートおよび当該搭載対象体のいずれか一方をいずれか他方に向けて移動させる移動処理を実行すると共に、前記直径が前記口径に対応する前記球状体を前記搭載用プレートの上面に供給する供給処理を前記対向状態において実行して前記挿通孔に挿通させた当該球状体を前記搭載対象体に搭載する球状体搭載方法であって、前記口径が前記搭載用プレート毎に互いに異なる前記挿通孔が形成された複数の当該搭載用プレート毎に前記移動処理および前記供給処理を実行して当該口径に対応して前記直径が互いに異なる複数種類の前記球状体を１つの前記搭載対象体に対して搭載する。   In addition, the spherical body mounting method according to claim 7 includes a lower surface of the mounting plate in which an aperture is defined so as to correspond to the diameter of the spherical body and an insertion hole through which the spherical body is inserted, and the mounting target body is mounted. A moving process for moving one of the mounting plate and the mounting object toward the other so that the surfaces are close to or in contact with each other and face each other, and the diameter is In the spherical body mounting method, the supply process for supplying the spherical body corresponding to the aperture to the upper surface of the mounting plate is executed in the facing state and the spherical body inserted through the insertion hole is mounted on the mounting target body. The moving process and the supplying process are performed for each of the plurality of mounting plates in which the insertion holes are formed with different diameters for each of the mounting plates. Said diameter is mounted different kinds of the spherical body with respect to one of said mounting object with each other.

また、請求項８記載の球状体搭載方法は、請求項７記載の球状体搭載方法において、前記搭載対象体に既に搭載されている前記球状体との接触を回避するための凹部が形成された前記搭載用プレートを用いて当該球状体を前記搭載対象体に搭載する。   Further, the spherical body mounting method according to claim 8 is the spherical body mounting method according to claim 7, wherein a concave portion for avoiding contact with the spherical body already mounted on the mounting target body is formed. The spherical body is mounted on the mounting target body using the mounting plate.

また、請求項９記載の球状体搭載方法は、請求項７または８記載の球状体搭載方法において、前記搭載用プレートの数と同数の移動機構を用いて、当該搭載用プレートを前記搭載対象体に向けて移動させる処理を前記移動処理として当該搭載用プレート毎に個別に実行する。   The spherical body mounting method according to claim 9 is the spherical body mounting method according to claim 7 or 8, wherein the mounting plate is attached to the mounting object by using the same number of moving mechanisms as the number of the mounting plates. The process of moving toward is performed individually for each mounting plate as the movement process.

また、請求項１０記載の球状体搭載方法は、請求項７から９のいずれかに記載の球状体搭載方法において、前記各搭載用プレートに一対一で割り当てられて当該割り当てられた搭載用プレートに対して前記供給処理を実行する供給機構を当該搭載用プレートの数と同数用いて、前記直径が前記割り当てられた搭載用プレートの前記口径に対応する前記球状体を当該搭載用プレートに個別に供給する。   The spherical body mounting method according to claim 10 is the spherical body mounting method according to any one of claims 7 to 9, wherein the spherical body mounting method is assigned to each of the mounting plates on a one-to-one basis. On the other hand, using the same number of supply mechanisms as the number of the mounting plates, the spherical bodies corresponding to the diameters of the assigned mounting plates are individually supplied to the mounting plates. To do.

また、請求項１１記載の球状体搭載方法は、請求項７から１０のいずれかに記載の球状体搭載方法において、前記口径の小さい前記搭載用プレートに対する前記移動処理および前記供給処理を前記口径の大きい前記搭載用プレートに対する前記移動処理および前記供給処理に先立って行う。   The spherical body mounting method according to claim 11 is the spherical body mounting method according to any one of claims 7 to 10, wherein the moving process and the supplying process with respect to the mounting plate having the small diameter are performed on the caliber. Prior to the moving process and the supplying process for the large mounting plate.

また、請求項１２記載の球状体搭載方法は、球状体の直径に対応させて口径が規定されて当該球状体を挿通させる挿通孔が形成された搭載用プレートの下面と搭載対象体の被搭載面とが互いに近接または接触して対向する対向状態となるように当該搭載用プレートおよび当該搭載対象体のいずれか一方をいずれか他方に向けて移動させる移動処理を実行すると共に、前記直径が前記口径に対応する前記球状体を前記搭載用プレートの上面に供給する供給処理を前記対向状態において実行して前記挿通孔に挿通させた当該球状体を前記搭載対象体に搭載する球状体搭載方法であって、前記口径が互いに異なる複数種類の前記挿通孔が形成された前記搭載用プレートを用いて前記移動処理を実行し、前記供給処理において、前記口径に対応して前記直径が互いに異なる複数種類の前記球状体を当該直径が大きい順に供給して当該複数種類の球状体を１つの前記搭載対象体に対して搭載する。   In addition, the spherical body mounting method according to claim 12 includes a lower surface of the mounting plate in which an aperture is defined so as to correspond to the diameter of the spherical body and an insertion hole through which the spherical body is inserted, and the mounting target body is mounted. A moving process for moving one of the mounting plate and the mounting object toward the other so that the surfaces are close to or in contact with each other and face each other, and the diameter is In the spherical body mounting method, the supply process for supplying the spherical body corresponding to the aperture to the upper surface of the mounting plate is executed in the facing state and the spherical body inserted through the insertion hole is mounted on the mounting target body. The moving process is performed using the mounting plate in which a plurality of types of the insertion holes having different diameters are formed, and in the supply process, the movement process is performed according to the diameter. The spherical body a plurality of types of different diameter each other sequentially supplied to the large diameter mounting the plurality of types of spherical bodies for one of the mounting object.

また、請求項１３記載の球状体搭載済基板は、請求項１から６のいずれかに記載の球状体搭載装置によって前記搭載対象体としての基板に搭載された前記球状体が溶融されて当該基板に固着されている。   The spherical body mounted substrate according to claim 13 is obtained by melting the spherical body mounted on the substrate as the mounting object by the spherical body mounting apparatus according to any one of claims 1 to 6. It is fixed to.

また、請求項１４記載の球状体搭載済基板は、請求項７または１２のいずれかに記載の球状体搭載方法によって前記搭載対象体としての基板に搭載された前記球状体が溶融されて当該基板に固着されている。   The spherical body mounted substrate according to claim 14 is obtained by melting the spherical body mounted on the substrate as the mounting object by the spherical body mounting method according to claim 7 or 12. It is fixed to.

また、請求項１５記載の電子部品搭載済基板は、請求項１３または１４記載の球状体搭載済基板に固着された前記球状体を介して接続された電子部品が当該球状体搭載済基板に搭載されている。   Further, the electronic component mounted substrate according to claim 15 is mounted on the spherical body mounted substrate by the electronic component connected via the spherical body fixed to the spherical body mounted substrate according to claim 13 or 14. Has been.

請求項１記載の球状体搭載装置、および請求項７記載の球状体搭載方法では、口径が搭載用プレート毎に互いに異なる挿通孔が形成された複数の搭載用プレート毎に移動処理および供給処理を実行して口径に対応して直径が互いに異なる複数種類の球状体を１つの搭載対象体に対して搭載する。このため、この球状体搭載装置および球状体搭載方法によれば、例えば、搭載対象体としての基板における隣接する端子同士の間隔が領域によって異なったり、接続されるリード線の太さが領域によって異なったりする複雑な構成の基板（搭載対象体）に対して、直径が互いに異なる複数種類の球状体を確実に搭載することができる。   In the spherical body mounting apparatus according to claim 1 and the spherical body mounting method according to claim 7, the movement process and the supply process are performed for each of the plurality of mounting plates in which insertion holes having different diameters are formed for each mounting plate. A plurality of types of spherical bodies having different diameters corresponding to the aperture are mounted on one mounting target body. For this reason, according to the spherical body mounting apparatus and the spherical body mounting method, for example, the distance between adjacent terminals on the substrate as the mounting target body varies depending on the region, or the thickness of the connected lead wire varies depending on the region. A plurality of types of spherical bodies having different diameters can be reliably mounted on a substrate (mounting object) having a complicated structure.

また、請求項２記載の球状体搭載装置、および請求項８記載の球状体搭載方法によれば、凹部を形成した搭載用プレートを用いることにより、搭載対象体に既に搭載されている球状体と搭載用プレートの下面との接触を確実に回避することができるため、搭載用プレートの下面と搭載対象体の被搭載面とを十分に近接または接触させることができる。したがって、この球状体搭載装置および球状体搭載方法によれば、球状体を搭載対象体に対して確実に案内して搭載することができる。   Further, according to the spherical body mounting apparatus according to claim 2 and the spherical body mounting method according to claim 8, the spherical body already mounted on the mounting object can be obtained by using the mounting plate in which the recess is formed. Since the contact with the lower surface of the mounting plate can be surely avoided, the lower surface of the mounting plate and the mounting surface of the mounting target body can be sufficiently close to or in contact with each other. Therefore, according to the spherical body mounting apparatus and the spherical body mounting method, the spherical body can be reliably guided and mounted on the mounting target body.

また、請求項３記載の球状体搭載装置、および請求項９記載の球状体搭載方法によれば、搭載用プレートの数と同数の移動機構を用いて、搭載用プレートを搭載対象体に向けて移動させる処理を移動処理として搭載用プレート毎に個別に実行することにより、例えば、複数の搭載用プレートを交換して１つの移動機構で移動させる構成と比較して、交換に要する時間分を短縮できるため、処理効率を十分に向上させることができる。   Further, according to the spherical body mounting apparatus according to claim 3 and the spherical body mounting method according to claim 9, the mounting plate is directed toward the mounting object using the same number of moving mechanisms as the number of mounting plates. By executing the moving process individually for each mounting plate as a moving process, for example, compared to a configuration in which a plurality of mounting plates are replaced and moved by a single moving mechanism, the time required for replacement is reduced. Therefore, the processing efficiency can be sufficiently improved.

また、請求項４記載の球状体搭載装置、および請求項１０記載の球状体搭載方法によれば、搭載用プレートの数と同数の供給機構を用いて、各供給機構に対して割り当てられた搭載用プレートにおける挿通孔の口径に対応する球状体を、その搭載用プレートに個別に供給することにより、例えば、１つの供給機構で複数種類の球状体を供給する構成と比較して、球状体の入れ替えに要する時間分を短縮できるため、処理効率を十分に向上させることができる。   Further, according to the spherical body mounting apparatus according to claim 4 and the spherical body mounting method according to claim 10, the mounting assigned to each supply mechanism using the same number of supply mechanisms as the number of mounting plates. By supplying a spherical body corresponding to the diameter of the insertion hole in the plate for the plate individually to the mounting plate, for example, compared with a configuration in which a single supply mechanism supplies a plurality of types of spherical bodies, Since the time required for replacement can be shortened, the processing efficiency can be sufficiently improved.

また、請求項５記載の球状体搭載装置、および請求項１１記載の球状体搭載方法では、挿通孔の口径の小さい搭載用プレートに対する移動処理および供給処理を口径の大きい搭載用プレートに対する移動処理および供給処理に先立って行う。このため、この球状体搭載装置および球状体搭載方法では、例えば、先に搭載した球状体との接触を回避するための凹部を設けるときに、その深さを後に搭載する球状体の直径よりも短く規定することができる。したがって、この球状体搭載装置および球状体搭載方法によれば、凹部の深さを確保するために搭載用プレートの厚みを必要以上に長くなる必要がないため、挿通孔の長さが球状体の直径よりも必要以上に長くなって１つの搭載箇所に複数の球状体が搭載される事態を確実に回避することができる。   Further, in the spherical body mounting apparatus according to claim 5 and the spherical body mounting method according to claim 11, the moving process and the supply process for the mounting plate having a small diameter of the insertion hole are performed as the moving process for the mounting plate having a large diameter and Prior to the supply process. For this reason, in this spherical body mounting apparatus and spherical body mounting method, for example, when providing a recess for avoiding contact with the previously mounted spherical body, the depth is larger than the diameter of the spherical body mounted later. Can be defined short. Therefore, according to the spherical body mounting apparatus and the spherical body mounting method, since it is not necessary to increase the thickness of the mounting plate more than necessary in order to secure the depth of the recess, the length of the insertion hole is It is possible to reliably avoid a situation in which a plurality of spherical bodies are mounted at one mounting location that is longer than necessary than the diameter.

また、請求項６記載の球状体搭載装置、および請求項１２記載の球状体搭載方法では、口径が互いに異なる複数種類の挿通孔が形成された搭載用プレートを用いて移動処理を実行し、供給処理において口径に対応して直径が互いに異なる複数種類の球状体を直径が大きい順に供給して複数種類の球状体を１つの搭載対象体に対して搭載する。このため、この球状体搭載装置および球状体搭載方法によれば、例えば、搭載対象体としての基板における隣接する端子同士の間隔が領域によって異なったり、接続されるリード線の太さが領域によって異なったりする複雑な構成の基板（搭載対象体）に対して、直径が互いに異なる複数種類の球状体を確実に搭載することができる。   Further, in the spherical body mounting apparatus according to claim 6 and the spherical body mounting method according to claim 12, the moving process is performed using a mounting plate in which a plurality of types of insertion holes having different diameters are formed, and the supply is performed. In the process, a plurality of types of spherical bodies having different diameters corresponding to the diameter are supplied in descending order of the diameter, and the plurality of types of spherical bodies are mounted on one mounting target body. For this reason, according to the spherical body mounting apparatus and the spherical body mounting method, for example, the distance between adjacent terminals on the substrate as the mounting target body varies depending on the region, or the thickness of the connected lead wire varies depending on the region. A plurality of types of spherical bodies having different diameters can be reliably mounted on a substrate (mounting object) having a complicated structure.

また、請求項１３，１４記載の球状体搭載済基板では、上記の球状体搭載装置または球状体搭載方法によって搭載対象体としての基板に搭載された球状体が溶融されて基板に固着されている。このため、この球状体搭載済基板では、搭載対象体としての基板が、例えば、隣接する端子同士の間隔が領域によって異なったり、接続されるリード線の太さが領域によって異なったりする複雑な構成であっても、直径が互いに異なる複数種類の球状体が各領域に確実に搭載されて、溶融された球状体（半田）が各領域（各領域に設けられた端子）に確実に固着されている。したがって、この球状体搭載済基板によれば、電子部品を実装する際に、溶融された球状体（半田）を介して電子部品の端子と基板の端子とを確実に接続させることができる。   Further, in the spherical body mounted substrate according to claims 13 and 14, the spherical body mounted on the substrate as the mounting object is melted and fixed to the substrate by the spherical body mounting apparatus or the spherical body mounting method. . For this reason, in this spherical body mounted substrate, the substrate as the mounting object has a complicated configuration in which, for example, the distance between adjacent terminals differs depending on the region, or the thickness of the lead wire to be connected varies depending on the region. Even so, multiple types of spherical bodies with different diameters are securely mounted in each region, and the molten spherical body (solder) is securely fixed to each region (terminal provided in each region). Yes. Therefore, according to this spherical body mounted substrate, when the electronic component is mounted, the terminal of the electronic component and the terminal of the substrate can be reliably connected via the molten spherical body (solder).

また、請求項１５記載の電子部品搭載済基板では、上記の球状体搭載済基板に固着された球状体を介して接続された電子部品が球状体搭載済基板に搭載されている。このため、この電子部品搭載済基板では、球状体搭載済基板における基板の各領域（各領域に設けられた端子）に溶融された球状体（半田）が確実に固着されている結果、電子部品を実装する際に、溶融された球状体（半田）を介して電子部品の端子と基板（基板に設けられた端子）とが確実に接続されている。したがって、この電子部品搭載済基板によれば、この電子部品搭載済基板を用いた製品における不良の発生を確実に防止することができる。   In the electronic component mounted substrate according to the fifteenth aspect, the electronic component connected via the spherical body fixed to the spherical body mounted substrate is mounted on the spherical body mounted substrate. Therefore, in this electronic component mounted substrate, the molten spherical body (solder) is securely fixed to each region (terminal provided in each region) of the substrate on the spherical body mounted substrate. In mounting, the terminal of the electronic component and the substrate (terminal provided on the substrate) are securely connected via the molten spherical body (solder). Therefore, according to this electronic component mounted substrate, it is possible to reliably prevent the occurrence of defects in products using this electronic component mounted substrate.

半田ボール搭載装置１の構成を示す構成図である。1 is a configuration diagram showing a configuration of a solder ball mounting device 1. 半田ボール搭載装置１の平面図である。1 is a plan view of a solder ball mounting device 1. FIG. 基板４００の平面図である。3 is a plan view of a substrate 400. FIG. 基板４００の断面図である。3 is a cross-sectional view of a substrate 400. FIG. 搭載用プレート１１ａの断面図である。It is sectional drawing of the plate 11a for mounting. 搭載用プレート１１ａにおける挿通孔８３ａの構成を示す断面図である。It is sectional drawing which shows the structure of the insertion hole 83a in the plate 11a for mounting. 搭載用プレート１１ａにおける凹部８４ａの構成を示す断面図である。It is sectional drawing which shows the structure of the recessed part 84a in the plate 11a for mounting. 搭載用プレート１１ｂの断面図である。It is sectional drawing of the plate 11b for mounting. 搭載用プレート１１ｂにおける挿通孔８３ｂの構成を示す断面図である。It is sectional drawing which shows the structure of the insertion hole 83b in the plate 11b for mounting. 搭載用プレート１１ｂにおける凹部８４ｂの構成を示す断面図である。It is sectional drawing which shows the structure of the recessed part 84b in the plate 11b for mounting. 塗布部３および吸着台５３の構成を示す構成図である。It is a block diagram which shows the structure of the application part 3 and the adsorption stand 53. FIG. マスク３１の断面図である。3 is a cross-sectional view of a mask 31. FIG. 半田ボール搭載装置１の動作を説明する第１の説明図である。FIG. 6 is a first explanatory view explaining the operation of the solder ball mounting apparatus 1. 半田ボール搭載装置１の動作を説明する第２の説明図である。FIG. 6 is a second explanatory view for explaining the operation of the solder ball mounting apparatus 1. 半田ボール搭載装置１の動作を説明する第３の説明図である。FIG. 10 is a third explanatory view for explaining the operation of the solder ball mounting apparatus 1. 半田ボール搭載装置１の動作を説明する第４の説明図である。FIG. 10 is a fourth explanatory view for explaining the operation of the solder ball mounting apparatus 1. 半田ボール搭載装置１の動作を説明する第５の説明図である。FIG. 10 is a fifth explanatory diagram for explaining the operation of the solder ball mounting apparatus 1. 半田ボール搭載装置１の動作を説明する第６の説明図である。FIG. 10 is a sixth explanatory diagram illustrating the operation of the solder ball mounting apparatus 1. 半田ボール搭載装置１の動作を説明する第７の説明図である。FIG. 10 is a seventh explanatory diagram for explaining the operation of the solder ball mounting apparatus 1; 半田ボール搭載装置１の動作を説明する第８の説明図である。FIG. 10 is an eighth explanatory view for explaining the operation of the solder ball mounting apparatus 1; 半田ボール搭載装置１の動作を説明する第９の説明図である。FIG. 10 is a ninth explanatory diagram illustrating the operation of the solder ball mounting apparatus 1. 半田ボール搭載装置１の動作を説明する第１０の説明図である。FIG. 10 is a tenth explanatory view for explaining the operation of the solder ball mounting apparatus 1. 搭載用プレート１１ｃの断面図である。It is sectional drawing of the plate 11c for mounting. 半田ボール搭載装置１０１の動作を説明する第１の説明図である。FIG. 6 is a first explanatory view illustrating the operation of the solder ball mounting apparatus 101. 半田ボール搭載装置１０１の動作を説明する第２の説明図である。FIG. 10 is a second explanatory diagram for explaining the operation of the solder ball mounting apparatus 101. 半田搭載済基板６００の構成を示す断面図である。It is sectional drawing which shows the structure of the board | substrate 600 with solder mounted. 電子部品搭載済基板７００の構成を示す断面図である。It is sectional drawing which shows the structure of the electronic component mounting board | substrate 700. FIG.

以下、球状体搭載装置、球状体搭載方法、球状体搭載済基板および電子部品搭載済基板の実施の形態について、添付図面を参照して説明する。   Hereinafter, embodiments of a spherical body mounting device, a spherical body mounting method, a spherical body mounted substrate, and an electronic component mounted substrate will be described with reference to the accompanying drawings.

最初に、図１に示す半田ボール搭載装置１の構成について説明する。半田ボール搭載装置１は、球状体搭載装置の一例であって、同図および図２に示すように、搭載機構２、塗布部３、搬送部４、検出部５および制御部６（図１参照）を備えて、球状体の一例としての微小な球状粒体である２種類の半田ボール（マイクロボール）３００ａ，３００ｂ（図６，９参照：以下、区別しないときには「半田ボール３００」ともいう）を、搭載対象体としての基板４００の端子４０１（図３，４参照）に搭載（載置）可能に構成されている。   First, the configuration of the solder ball mounting apparatus 1 shown in FIG. 1 will be described. The solder ball mounting device 1 is an example of a spherical body mounting device. As shown in FIG. 2 and FIG. 2, the mounting mechanism 2, the coating unit 3, the transport unit 4, the detection unit 5, and the control unit 6 (see FIG. 1). ) And two types of solder balls (microballs) 300a and 300b, which are minute spherical particles as an example of a spherical body (see FIGS. 6 and 9; hereinafter, also referred to as “solder ball 300” when not distinguished) Is mounted (placed) on a terminal 401 (see FIGS. 3 and 4) of a substrate 400 as a mounting object.

この場合、半田ボール３００ａは、直径Ｌ１ａ（図６参照）が４０μｍ程度の球状に構成され、半田ボール３００ｂは、直径Ｌ１ｂ（図９参照：以下、直径Ｌ１ａ，Ｌ１ｂを区別しないときには「直径Ｌ１」ともいう）が７０μｍ程度の球状に構成されている。また、基板４００は、一例として、外周側の第１領域４００ａ（図３，４参照）内において、細いリード線が接続されて直径が小さな複数の端子４０１が短い間隔で形成され、中央部の第２第２領域４００ｂ（両図参照）内において、太いリード線が接続されて第１領域４００ａ内の端子４０１よりも直径が大きな複数の端子４０１が形成されて構成されている。このため、この基板４００では、端子４０１同士の短絡を防止するために、第１領域４００ａ内に形成されている端子４０１に小さな（直径の短い）半田ボール３００ａが搭載され、太いリード線を確実に接続するために、第２領域４００ｂ内に形成されている端子４０１に大きな（直径の長い）半田ボール３００ｂが搭載される。なお、半田ボール３００ａ，３００ｂは、図２６に示すように、半田ボール搭載装置１によって基板４００の端子４０１に搭載された後に加熱溶融（リフロー処理）されて半球状（同図に示す半田３０１）となった状態で基板４００（端子４０１）に固着されて基板４００上にボールグリッドアレイ（ＢＧＡ）を構成し、これによって半田搭載済基板（球状体搭載済基板）６００が製造される。また、図２７に示すように、このようにして製造された半田搭載済基板６００には、集積回路等の電子部品７０１が搭載され、その電子部品７０１における図外の端子が半田搭載済基板６００における基板４００に固着された半田ボール３００（半田３０１）を介して基板４００の端子４０１に接続され、これによって電子部品搭載済基板７００が製造される。   In this case, the solder ball 300a has a spherical shape with a diameter L1a (see FIG. 6) of about 40 μm, and the solder ball 300b has a diameter L1b (see FIG. 9: hereinafter, “diameter L1” when the diameters L1a and L1b are not distinguished from each other). Is also formed in a spherical shape of about 70 μm. In addition, as an example, the substrate 400 has a plurality of terminals 401 with small diameters connected to each other in the first region 400a (see FIGS. 3 and 4) on the outer peripheral side, and a plurality of terminals 401 are formed at short intervals. In the second second region 400b (see both figures), a thick lead wire is connected to form a plurality of terminals 401 having a diameter larger than that of the terminal 401 in the first region 400a. For this reason, in this substrate 400, in order to prevent a short circuit between the terminals 401, a small (short diameter) solder ball 300a is mounted on the terminal 401 formed in the first region 400a, and a thick lead wire is surely provided. In order to connect to the terminal 401, a large (long diameter) solder ball 300b is mounted on the terminal 401 formed in the second region 400b. As shown in FIG. 26, the solder balls 300a, 300b are mounted on the terminals 401 of the substrate 400 by the solder ball mounting apparatus 1 and then heated and melted (reflow treatment) to form a hemisphere (solder 301 shown in FIG. 26). In this state, it is fixed to the substrate 400 (terminal 401) to form a ball grid array (BGA) on the substrate 400, whereby a solder mounted substrate (spherical substrate mounted substrate) 600 is manufactured. As shown in FIG. 27, an electronic component 701 such as an integrated circuit is mounted on the solder-mounted substrate 600 manufactured in this way, and terminals outside the figure in the electronic component 701 are connected to the solder-mounted substrate 600. Are connected to the terminals 401 of the substrate 400 via solder balls 300 (solder 301) fixed to the substrate 400, whereby the electronic component mounted substrate 700 is manufactured.

搭載機構２は、基板４００の端子４０１に半田ボール３００ａ，３００ｂを搭載する搭載処理（後述する第１搭載処理および第２搭載処理）を実行可能に構成されている。具体的には、搭載機構２は、図１，２に示すように、搭載用プレート１１ａ，１１ｂ（以下、区別しないときには「搭載用プレート１１」ともいう）、移動機構１２ａ，１２ｂ（以下、区別しないときには「移動機構１２」ともいう）、および供給除去機構１３ａ，１３ｂ（以下、区別しないときには「供給除去機構１３」ともいう）を備えて構成されている。この場合、移動機構１２ａ，１２ｂおよび供給除去機構１３ａ，１３ｂによって搭載部が構成される。   The mounting mechanism 2 is configured to be able to execute a mounting process (first mounting process and second mounting process described later) for mounting the solder balls 300a and 300b on the terminals 401 of the substrate 400. Specifically, as shown in FIGS. 1 and 2, the mounting mechanism 2 includes mounting plates 11 a and 11 b (hereinafter also referred to as “mounting plate 11” when not distinguished) and moving mechanisms 12 a and 12 b (hereinafter referred to as distinction). If not, it is also referred to as “moving mechanism 12”) and supply / removal mechanisms 13a, 13b (hereinafter also referred to as “supply removing mechanism 13” when not distinguished). In this case, a mounting portion is configured by the moving mechanisms 12a and 12b and the supply and removal mechanisms 13a and 13b.

搭載用プレート１１ａは、基板４００における第１領域４００ａに形成されている端子４０１に半田ボール３００ａを搭載する際に用いられるプレートであって、図５に示すように、薄板状に構成されている。また、搭載用プレート１１ａには、半田ボール３００ａを上面８１ａ側から下面８２ａ側に挿通させる挿通孔８３ａが形成されている。さらに、搭載用プレート１１ａには、同図に示すように、第１搭載処理の実行時において基板４００の端子４０１に塗布されているフラックス５００（図１７参照）の付着を防止するための凹部８４ａが形成されている。この場合、挿通孔８３ａの形成位置は、基板４００における第１領域４００ａの端子４０１の形成位置に対応する位置に規定され、凹部８４ａの形成位置は、基板４００における第２領域４００ｂの端子４０１の形成位置に対応する位置に規定されている。   The mounting plate 11a is a plate used when mounting the solder balls 300a on the terminals 401 formed in the first region 400a of the substrate 400, and is configured in a thin plate shape as shown in FIG. . The mounting plate 11a is formed with an insertion hole 83a for inserting the solder ball 300a from the upper surface 81a side to the lower surface 82a side. Further, as shown in the figure, the mounting plate 11a has a recess 84a for preventing the adhesion of the flux 500 (see FIG. 17) applied to the terminal 401 of the substrate 400 when the first mounting process is performed. Is formed. In this case, the formation position of the insertion hole 83 a is defined at a position corresponding to the formation position of the terminal 401 in the first region 400 a on the substrate 400, and the formation position of the recess 84 a is the position of the terminal 401 in the second region 400 b on the substrate 400. It is defined at a position corresponding to the formation position.

また、図６に示すように、搭載用プレート１１ａの厚みＬ３ａは、半田ボール３００ａの直径Ｌ１ａと同程度（この例では、４０μｍ）に規定されている。また、挿通孔８３ａの口径Ｌ２ａは、半田ボール３００ａの直径Ｌ１ａに対応させて規定されている。具体的には、口径Ｌ２ａは、半田ボール３００ａが通過可能な５０μｍ程度に規定されている。さらに、図７に示すように、凹部８４ａの口径Ｌ４ａは、基板４００の第２領域４００ｂに形成されている端子４０１の直径よりもやや長い９０μｍ程度に規定され、凹部８４ａの深さＬ５ａは、搭載用プレート１１ａの厚みＬ３ａの半分程度（この例では、２０μｍ）に規定されている。   Further, as shown in FIG. 6, the thickness L3a of the mounting plate 11a is defined to be approximately the same as the diameter L1a of the solder ball 300a (in this example, 40 μm). Further, the diameter L2a of the insertion hole 83a is defined in correspondence with the diameter L1a of the solder ball 300a. Specifically, the diameter L2a is defined to be about 50 μm through which the solder ball 300a can pass. Furthermore, as shown in FIG. 7, the diameter L4a of the recess 84a is defined to be about 90 μm, which is slightly longer than the diameter of the terminal 401 formed in the second region 400b of the substrate 400, and the depth L5a of the recess 84a is It is defined to be about half of the thickness L3a of the mounting plate 11a (in this example, 20 μm).

搭載用プレート１１ｂは、基板４００における第２領域４００ｂに形成されている端子４０１に半田ボール３００ｂを搭載する際に用いられるプレートであって、図８に示すように、薄板状に構成されている。また、搭載用プレート１１ｂには、半田ボール３００ｂを上面８１ｂ側から下面８２ｂ側に挿通させる挿通孔８３ｂ（以下、挿通孔８３ａ，８３ｂを区別しないときには「挿通孔８３」ともいう）が形成されている。さらに、搭載用プレート１１ｂには、同図に示すように、第２搭載処理の実行時において基板４００に既に搭載されている半田ボール３００ａとの接触を回避するための凹部８４ｂ（以下、凹部８４ａ，８４ｂを区別しないときには「凹部８４」ともいう）が形成されている。この場合、挿通孔８３ｂの形成位置は、基板４００における第２領域４００ｂの端子４０１の形成位置に対応する位置に規定され、凹部８４ｂの形成位置は、基板４００における第１領域４００ａの端子４０１の形成位置に対応する位置に規定されている。   The mounting plate 11b is a plate used when mounting the solder balls 300b on the terminals 401 formed in the second region 400b of the substrate 400, and is configured in a thin plate shape as shown in FIG. . The mounting plate 11b is formed with an insertion hole 83b for inserting the solder ball 300b from the upper surface 81b side to the lower surface 82b side (hereinafter also referred to as “insertion hole 83” when the insertion holes 83a and 83b are not distinguished). Yes. Further, as shown in the figure, the mounting plate 11b has a recess 84b (hereinafter referred to as a recess 84a) for avoiding contact with the solder ball 300a already mounted on the substrate 400 when the second mounting process is performed. , 84b are also referred to as “concave portions 84”). In this case, the formation position of the insertion hole 83 b is defined at a position corresponding to the formation position of the terminal 401 in the second region 400 b on the substrate 400, and the formation position of the recess 84 b is the position of the terminal 401 in the first region 400 a on the substrate 400. It is defined at a position corresponding to the formation position.

また、図９に示すように、搭載用プレート１１ｂの厚みＬ３ｂは、半田ボール３００ｂの直径Ｌ１ｂと同程度（この例では、７０μｍ）に規定されている。また、挿通孔８３ｂの口径Ｌ２ｂは、半田ボール３００ｂの直径Ｌ１ｂに対応させて規定されている。具体的には、口径Ｌ２ｂは、半田ボール３００ｂが通過可能な９０μｍ程度に規定されている。さらに、図１０に示すように、搭載用プレート１１ｂにおける凹部８４ｂの口径Ｌ４ｂおよび深さＬ５ｂは、半田ボール３００ａの直径Ｌ１ａよりもやや長い５０μｍ程度に規定されている。   Further, as shown in FIG. 9, the thickness L3b of the mounting plate 11b is defined to be approximately the same as the diameter L1b of the solder ball 300b (70 μm in this example). Further, the diameter L2b of the insertion hole 83b is defined in correspondence with the diameter L1b of the solder ball 300b. Specifically, the diameter L2b is defined as about 90 μm through which the solder ball 300b can pass. Furthermore, as shown in FIG. 10, the diameter L4b and the depth L5b of the recess 84b in the mounting plate 11b are defined to be about 50 μm, which is slightly longer than the diameter L1a of the solder ball 300a.

移動機構１２ａ，１２ｂは、制御部６の制御に従って搭載用プレート１１ａ，１１ｂを基板４００に向けてそれぞれ移動させる移動処理を実行する。この場合、移動機構１２ａは、図２に示すように、待機位置Ｐ１ａと基板４００に半田ボール３００ａを搭載する第１搭載処理が実行される第１搭載位置Ｐ２ａとの間で搭載用プレート１１ａを移動させる。また、移動機構１２ｂは、同図に示すように、待機位置Ｐ１ｂと基板４００に半田ボール３００ｂを搭載する第２搭載処理が実行される第２搭載位置Ｐ２ｂとの間で搭載用プレート１１ｂを移動させる。このように、この半田ボール搭載装置１では、搭載用プレート１１の数と同数（この例では、２つ）の移動機構１２を備えて搭載機構２が構成されており、１つの移動機構１２が１つの搭載用プレート１１を基板４００に向けて個別に移動させる処理を移動処理として実行する。つまり、搭載機構２は、搭載用プレート１１毎に移動処理を実行する。   The movement mechanisms 12 a and 12 b execute a movement process for moving the mounting plates 11 a and 11 b toward the substrate 400 under the control of the control unit 6. In this case, as shown in FIG. 2, the moving mechanism 12a moves the mounting plate 11a between the standby position P1a and the first mounting position P2a where the first mounting process for mounting the solder ball 300a on the substrate 400 is performed. Move. Further, as shown in the figure, the moving mechanism 12b moves the mounting plate 11b between the standby position P1b and the second mounting position P2b where the second mounting process for mounting the solder ball 300b on the substrate 400 is executed. Let Thus, in this solder ball mounting apparatus 1, the mounting mechanism 2 is configured to include the same number (two in this example) of moving mechanisms 12 as the number of mounting plates 11, and one moving mechanism 12 includes A process of individually moving one mounting plate 11 toward the substrate 400 is executed as a movement process. That is, the mounting mechanism 2 performs a movement process for each mounting plate 11.

供給除去機構１３ａ，１３ｂは、図２に示すように、半田ボール３００を収容可能な供給器９１と、柔軟性を有するスキージ９２と、供給器９１およびスキージ９２を搭載用プレート１１の上面８１に沿って移動させる移動機構９３とを備えてそれぞれ構成され、制御部６の制御に従って供給処理および除去処理を実行する。この場合、供給除去機構１３ａは、図１８に示すように、基板４００の表面４０２と搭載用プレート１１ａの下面８２ａとが互いに近接または接触して対向する状態（以下、「対向状態」ともいう）において、半田ボール３００ａが収容されている供給器９１を搭載用プレート１１ａの上面８１ａに沿って移動させることにより、上面８１ａに半田ボール３００ａを分散しつつ供給する処理を供給処理として実行する。また、供給除去機構１３ａは、同図に示すように、スキージ９２を搭載用プレート１１ａの上面８１ａに沿って移動させることにより、供給器９１によって供給された半田ボール３００ａのうちの余剰な（挿通孔８３ａに挿通されなかった）半田ボール３００ａを払い落とす処理を除去処理として実行する。   As shown in FIG. 2, the supply / removal mechanisms 13 a and 13 b include a feeder 91 that can accommodate the solder balls 300, a flexible squeegee 92, and the feeder 91 and the squeegee 92 on the upper surface 81 of the mounting plate 11. And a moving mechanism 93 that moves along the control unit 6 and performs supply processing and removal processing according to the control of the control unit 6. In this case, as shown in FIG. 18, the supply / removal mechanism 13a is in a state where the surface 402 of the substrate 400 and the lower surface 82a of the mounting plate 11a face each other close to or in contact with each other (hereinafter also referred to as “opposing state”). , The supply unit 91 in which the solder balls 300a are accommodated is moved along the upper surface 81a of the mounting plate 11a, whereby the process of supplying the solder balls 300a to the upper surface 81a while being dispersed is executed as the supply process. Further, as shown in the figure, the supply / removal mechanism 13a moves the squeegee 92 along the upper surface 81a of the mounting plate 11a, so that the surplus (insertion) of the solder balls 300a supplied by the supply device 91 is inserted. The process of removing the solder ball 300a (not inserted through the hole 83a) is executed as the removal process.

また、供給除去機構１３ｂは、図２１に示すように、基板４００の表面４０２と搭載用プレート１１ｂの下面８２ｂと対向状態において、半田ボール３００ｂが収容されている供給器９１を搭載用プレート１１ｂの上面８１ｂに沿って移動させることにより、上面８１ｂに半田ボール３００ｂを分散しつつ供給する処理を供給処理として実行する。また、供給除去機構１３ｂは、同図に示すように、スキージ９２を搭載用プレート１１ｂの上面８１ｂに沿って移動させることにより、供給器９１によって供給された半田ボール３００ｂのうちの余剰な（挿通孔８３ｂに挿通されなかった）半田ボール３００ｂを払い落とす処理を除去処理として実行する。このように、この半田ボール搭載装置１では、各搭載用プレート１１に一対一で割り当てられてその搭載用プレート１１に対して供給処理を実行する供給除去機構１３を搭載用プレート１１の数と同数備えて搭載機構２が構成されており、各供給除去機構１３が、割り当てられた搭載用プレート１１の口径Ｌ２に対応する直径Ｌ１の半田ボール３００をその搭載用プレート１１に個別に供給する処理を供給処理として実行する。つまり、搭載機構２は、搭載用プレート１１毎に供給処理を実行する。   Further, as shown in FIG. 21, the supply / removal mechanism 13b uses the supply device 91 in which the solder balls 300b are accommodated in the mounting plate 11b in a state where the surface 402 of the substrate 400 faces the lower surface 82b of the mounting plate 11b. By moving along the upper surface 81b, the process of supplying the solder balls 300b while dispersing them on the upper surface 81b is executed as the supply process. Further, as shown in the figure, the supply / removal mechanism 13b moves the squeegee 92 along the upper surface 81b of the mounting plate 11b, so that the excess (insertion) of the solder balls 300b supplied by the supply device 91 is inserted. The process of removing the solder ball 300b (which has not been inserted into the hole 83b) is executed as the removal process. As described above, in this solder ball mounting apparatus 1, the same number of supply removal mechanisms 13 that are assigned to each mounting plate 11 in a one-to-one manner and execute the supply process for the mounting plate 11 are the same as the number of mounting plates 11. The mounting mechanism 2 is configured, and each supply and removal mechanism 13 individually supplies the mounting plate 11 with solder balls 300 having a diameter L1 corresponding to the diameter L2 of the allocated mounting plate 11. Execute as a supply process. That is, the mounting mechanism 2 executes the supply process for each mounting plate 11.

塗布部３は、図２に示すように、基板４００が供給される供給位置Ｐ３と第２搭載位置Ｐ２ｂとの間に配設されて基板４００の端子４０１にフラックス５００（図１１参照）を塗布する塗布処理を実行する。具体的には、塗布部３は、同図に示すように、マスク３１、供給機構３２およびスキージ３３を備えて構成されている。マスク３１は、図１２に示すように、基板４００の端子４０１の形成部分に対応する部分に挿通孔３１ａが形成されている。この場合、マスク３１は、塗布処理が実行される塗布位置Ｐ４（図２参照）に基板４００が搬送されたときに、図外の駆動機構によって基板４００の表面（被搭載面）４０２側に移動させられて、基板４００の表面４０２における端子４０１の形成部分（フラックス５００の塗布対象部分）を除く部分を覆う。供給機構３２は、塗布位置Ｐ４に基板４００が搬送されたときに、マスク３１の上にフラックス５００を供給する。スキージ３３は、駆動機構によってマスク３１の表面に沿って移動させられることにより、基板４００の表面に供給されたフラックス５００を引き伸ばす。   As shown in FIG. 2, the coating unit 3 is disposed between the supply position P3 to which the substrate 400 is supplied and the second mounting position P2b, and applies a flux 500 (see FIG. 11) to the terminal 401 of the substrate 400. The coating process is executed. Specifically, the application unit 3 includes a mask 31, a supply mechanism 32, and a squeegee 33 as shown in FIG. As shown in FIG. 12, the mask 31 has an insertion hole 31 a in a portion corresponding to a portion where the terminal 401 is formed on the substrate 400. In this case, the mask 31 is moved to the surface (mounting surface) 402 side of the substrate 400 by a driving mechanism (not shown) when the substrate 400 is transferred to the application position P4 (see FIG. 2) where the application process is performed. Thus, a portion excluding a portion where the terminal 401 is formed (a portion where the flux 500 is applied) on the surface 402 of the substrate 400 is covered. The supply mechanism 32 supplies the flux 500 onto the mask 31 when the substrate 400 is transported to the application position P4. The squeegee 33 is moved along the surface of the mask 31 by the driving mechanism, thereby stretching the flux 500 supplied to the surface of the substrate 400.

搬送部４は、図２に示すように、供給位置Ｐ３と第２搭載位置Ｐ２ｂとを結ぶ搬送経路Ｒに沿って基板４００を搬送する。この場合、搬送部４は、図１，２に示すように、第１搬送機構４１、第２搬送機構４２および第３搬送機構４３を備えて構成され、搬送経路Ｒを複数（例えば、３つ）に分割した各分割経路（例えば、後述する第１経路Ｒ１、第２経路Ｒ２および第３経路Ｒ３）に沿って、各搬送機構４１〜４３が基板４００をそれぞれ搬送する。   As shown in FIG. 2, the transport unit 4 transports the substrate 400 along a transport path R that connects the supply position P3 and the second mounting position P2b. In this case, as illustrated in FIGS. 1 and 2, the transport unit 4 includes a first transport mechanism 41, a second transport mechanism 42, and a third transport mechanism 43, and includes a plurality of (for example, three) transport routes R. ), Each of the transport mechanisms 41 to 43 transports the substrate 400 along each of the divided paths (for example, a first path R1, a second path R2, and a third path R3 described later).

第１搬送機構４１は、図２に示すように、供給位置Ｐ３と引き渡し位置Ｐ５とを結ぶ第１経路Ｒ１（搬送経路Ｒの一部）に沿って基板４００を搬送する第１搬送処理を実行する。具体的には、第１搬送機構４１は、ステージ５１、レール５２、吸着台５３および移動機構５４を備えて構成されている。ステージ５１は、第１経路Ｒ１に沿って配設されたレール５２上を移動機構５４によって移動させられる。吸着台５３は、ステージ５１の上に固定されて、載置（供給）された吸着対象体としての基板４００を吸着して保持する。   As shown in FIG. 2, the first transport mechanism 41 performs a first transport process for transporting the substrate 400 along a first path R1 (part of the transport path R) connecting the supply position P3 and the delivery position P5. To do. Specifically, the first transport mechanism 41 includes a stage 51, a rail 52, a suction stand 53, and a moving mechanism 54. The stage 51 is moved by the moving mechanism 54 on the rail 52 arranged along the first path R1. The suction stand 53 is fixed on the stage 51 and sucks and holds the substrate 400 as a suction target body placed (supplied).

第２搬送機構４２は、図２に示すように、引き渡し位置Ｐ５と受け渡し位置Ｐ６とを結ぶ第２経路Ｒ２（搬送経路Ｒの一部）に沿って基板４００を搬送する第２搬送処理を実行する。具体的には、第２搬送機構４２は、同図に示すように、吸着部６１および移動機構６２を備えて構成されている。吸着部６１は、基板４００を保持する。移動機構６２は、吸着部６１を上下動させると共に、第２経路Ｒ２に沿って吸着部６１を移動させる。   As shown in FIG. 2, the second transport mechanism 42 performs a second transport process for transporting the substrate 400 along a second path R2 (a part of the transport path R) connecting the transfer position P5 and the transfer position P6. To do. Specifically, the second transport mechanism 42 includes a suction unit 61 and a moving mechanism 62 as shown in FIG. The adsorption unit 61 holds the substrate 400. The moving mechanism 62 moves the suction portion 61 up and down and moves the suction portion 61 along the second path R2.

第３搬送機構４３は、図２に示すように、受け渡し位置Ｐ６と第２搭載位置Ｐ２ｂとを結ぶ第３経路Ｒ３（搬送経路Ｒの一部）に沿って基板４００を搬送する第２搬送処理を実行する。具体的には、第３搬送機構４３は、ステージ７１、レール７２、吸着台７３、移動機構７４および補正機構７５を備えて構成されている。ステージ７１は、第３経路Ｒ３に沿って配設されたレール７２上を移動機構７４によって移動させられる。吸着台７３は、上記した第１搬送機構４１の吸着台５３と同様に構成されて、上面に載置された基板４００を吸着して保持する。補正機構７５は、吸着台７３の下部に配設されて、吸着台７３を上下方向に貫通する中心軸を中心として吸着台７３を回動させることにより、検出部５による後述する検出処理の結果に基づいて、吸着台７３によって保持されている基板４００の位置ずれを補正する補正処理を実行する。   As shown in FIG. 2, the third transport mechanism 43 transports the substrate 400 along a third path R3 (a part of the transport path R) connecting the delivery position P6 and the second mounting position P2b. Execute. Specifically, the third transport mechanism 43 includes a stage 71, a rail 72, a suction stand 73, a moving mechanism 74, and a correction mechanism 75. The stage 71 is moved by the moving mechanism 74 on the rail 72 disposed along the third route R3. The suction stand 73 is configured in the same manner as the suction stand 53 of the first transport mechanism 41 described above, and sucks and holds the substrate 400 placed on the upper surface. The correction mechanism 75 is disposed below the suction table 73 and rotates the suction table 73 around a central axis that penetrates the suction table 73 in the vertical direction. As a result of detection processing described later by the detection unit 5. Based on the above, a correction process for correcting the positional deviation of the substrate 400 held by the suction table 73 is executed.

検出部５は、第３搬送機構４３の吸着台７３に保持されている基板４００の表面を撮像する図外のカメラを備えて構成されて、図２に示すように、受け渡し位置Ｐ６と第１搭載位置Ｐ２ａとの間の所定位置（同図に示す検出位置Ｐ７）に配設されている。この場合、検出部５は、基板４００の撮像画像を画像解析することにより、基板４００を上下方向に貫通する中心軸を中心とする基板４００の回転方向の位置ずれを検出する検出処理を実行する。   The detection unit 5 includes a camera (not shown) that captures an image of the surface of the substrate 400 held on the suction platform 73 of the third transport mechanism 43. As shown in FIG. It is disposed at a predetermined position (detection position P7 shown in the figure) between the mounting position P2a. In this case, the detection unit 5 performs a detection process of detecting a positional deviation in the rotation direction of the substrate 400 around the central axis penetrating the substrate 400 in the vertical direction by analyzing the captured image of the substrate 400. .

制御部６は、搭載機構２、塗布部３、搬送部４および検出部５を制御して、基板４００の端子４０１に半田ボール３００を搭載させる。   The control unit 6 controls the mounting mechanism 2, the coating unit 3, the transport unit 4, and the detection unit 5 to mount the solder ball 300 on the terminal 401 of the substrate 400.

次に、半田ボール搭載装置１を用いて、半田ボール３００ａ，３００ｂを基板４００に搭載する方法（球状体搭載方法）、およびその際の半田ボール搭載装置１の動作について、図面を参照して説明する。なお、初期状態では、図２に示すように、搬送部４における第１搬送機構４１のステージ５１が供給位置Ｐ３に位置し、搬送部４における第３搬送機構４３のステージ７１が受け渡し位置Ｐ６に位置しているものとする。また、供給位置Ｐ３に位置している第１搬送機構４１の吸着台５３に図外の基板供給装置によって基板４００が供給（載置）されるものとする。   Next, a method for mounting the solder balls 300a and 300b on the substrate 400 using the solder ball mounting apparatus 1 (spherical body mounting method) and the operation of the solder ball mounting apparatus 1 at that time will be described with reference to the drawings. To do. In the initial state, as shown in FIG. 2, the stage 51 of the first transport mechanism 41 in the transport section 4 is located at the supply position P3, and the stage 71 of the third transport mechanism 43 in the transport section 4 is at the delivery position P6. Assume that it is located. Further, it is assumed that the substrate 400 is supplied (placed) on the suction platform 53 of the first transport mechanism 41 located at the supply position P3 by a substrate supply device (not shown).

この半田ボール搭載装置１では、開始操作がされたときに、制御部６が搬送部４の第１搬送機構４１に対して第１搬送処理を実行させる。この第１搬送処理では、第１搬送機構４１の吸着台５３が、供給（載置）された基板４００を保持する。続いて、移動機構５４が、図１３に示すように、ステージ５１を第１経路Ｒ１に沿って配設されたレール５２上を移動させる。次いで、移動機構５４は、ステージ５１が塗布位置Ｐ４に位置した時点でその移動を停止させる。   In the solder ball mounting apparatus 1, when the start operation is performed, the control unit 6 causes the first transport mechanism 41 of the transport unit 4 to execute the first transport process. In the first transport process, the suction table 53 of the first transport mechanism 41 holds the supplied (mounted) substrate 400. Subsequently, as shown in FIG. 13, the moving mechanism 54 moves the stage 51 on the rail 52 arranged along the first path R1. Next, the moving mechanism 54 stops the movement when the stage 51 is positioned at the application position P4.

続いて、制御部６は、塗布部３に対して塗布処理を実行させる。この塗布処理では、塗布部３のマスク３１が図外の駆動機構によって基板４００の表面側に移動させられる（図１１参照）。この際に、基板４００における端子４０１の形成部分を除く部分が覆われる。次いで、塗布部３の供給機構３２がマスク３１の上にフラックス５００を供給する。続いて、スキージ３３が図外の駆動機構によってマスク３１（基板４００の表面）に沿って移動させられる。これにより、フラックス５００がマスク３１の挿通孔３１ａを通って基板４００の端子４０１に塗布される。   Subsequently, the control unit 6 causes the coating unit 3 to perform a coating process. In this coating process, the mask 31 of the coating unit 3 is moved to the surface side of the substrate 400 by a driving mechanism (not shown) (see FIG. 11). At this time, the portion of the substrate 400 excluding the portion where the terminal 401 is formed is covered. Next, the supply mechanism 32 of the application unit 3 supplies the flux 500 onto the mask 31. Subsequently, the squeegee 33 is moved along the mask 31 (the surface of the substrate 400) by a driving mechanism (not shown). Thus, the flux 500 is applied to the terminal 401 of the substrate 400 through the insertion hole 31a of the mask 31.

次いで、第１搬送機構４１の移動機構５４が、ステージ５１を引き渡し位置Ｐ５に向けて移動させ、ステージ５１が引き渡し位置Ｐ５に位置した時点でその移動を停止させる。これにより、供給位置Ｐ３と引き渡し位置Ｐ５とを結ぶ第１経路Ｒ１に沿って基板４００が第１搬送機構４１によって搬送される。   Next, the moving mechanism 54 of the first transport mechanism 41 moves the stage 51 toward the delivery position P5, and stops the movement when the stage 51 is located at the delivery position P5. As a result, the substrate 400 is transported by the first transport mechanism 41 along the first path R1 connecting the supply position P3 and the delivery position P5.

続いて、制御部６は、搬送部４の第２搬送機構４２に対して第２搬送処理を実行させる。この第２搬送処理では、第２搬送機構４２の移動機構６２が、図１４に示すように、引き渡し位置Ｐ５の上方に吸着部６１を移動させる。次いで、移動機構６２は、吸着部６１を下降させることにより、第１搬送機構４１の吸着台５３によって保持されている基板４００に対して吸着部６１を近接（接触）させる。続いて、制御部６が、吸着台５３による基板４００の吸着を解除させる。これにより、吸着部６１によって基板４００が吸着されて、基板４００が第１搬送機構４１から第２搬送機構４２に引き渡される。次いで、移動機構６２は、吸着部６１を上昇させた後に、第２経路Ｒ２に沿って吸着部６１を移動させて受け渡し位置Ｐ６の上方に位置させる。続いて、移動機構６２は、吸着部６１を下降させることにより、搬送部４における第３搬送機構４３の吸着台７３の上面に基板４００を載置する。これにより、引き渡し位置Ｐ５と受け渡し位置Ｐ６とを結ぶ第２経路Ｒ２に沿って基板４００が第２搬送機構４２によって搬送される。   Subsequently, the control unit 6 causes the second transport mechanism 42 of the transport unit 4 to execute the second transport process. In the second transport process, the moving mechanism 62 of the second transport mechanism 42 moves the suction portion 61 above the delivery position P5 as shown in FIG. Next, the moving mechanism 62 lowers the suction unit 61 to bring the suction unit 61 close to (contact with) the substrate 400 held by the suction table 53 of the first transport mechanism 41. Subsequently, the control unit 6 releases the suction of the substrate 400 by the suction stand 53. As a result, the substrate 400 is adsorbed by the adsorption unit 61, and the substrate 400 is transferred from the first conveyance mechanism 41 to the second conveyance mechanism 42. Next, the moving mechanism 62 raises the suction portion 61 and then moves the suction portion 61 along the second path R2 to be positioned above the delivery position P6. Subsequently, the moving mechanism 62 lowers the suction unit 61 to place the substrate 400 on the upper surface of the suction platform 73 of the third transport mechanism 43 in the transport unit 4. As a result, the substrate 400 is transported by the second transport mechanism 42 along the second path R2 connecting the delivery position P5 and the delivery position P6.

また、第１搬送機構４１の移動機構５４は、基板４００が第１搬送機構４１から第２搬送機構４２に引き渡された時点で、図１５に示すように、ステージ５１を引き渡し位置Ｐ５から供給位置Ｐ３に移動（初期位置に復帰）させる。   Further, the moving mechanism 54 of the first transport mechanism 41 moves the stage 51 from the delivery position P5 to the supply position as shown in FIG. 15 when the substrate 400 is delivered from the first transport mechanism 41 to the second transport mechanism 42. Move to P3 (return to initial position).

次いで、制御部６は、搬送部４の第３搬送機構４３に対して第３搬送処理を実行させる。この第３搬送処理では、第３搬送機構４３の吸着台７３が、第２搬送機構４２によって載置された基板４００を吸着して保持し、移動機構７４が、図１５に示すように、ステージ７１を第３経路Ｒ３に沿って配設されたレール７２上を移動させる。続いて、移動機構７４は、同図に示すように、ステージ７１が検出位置Ｐ７に位置した時点でその移動を停止させる。   Next, the control unit 6 causes the third transport mechanism 43 of the transport unit 4 to execute the third transport process. In the third transport process, the suction table 73 of the third transport mechanism 43 sucks and holds the substrate 400 placed by the second transport mechanism 42, and the moving mechanism 74 moves the stage as shown in FIG. 71 is moved on the rail 72 arranged along the third route R3. Subsequently, as shown in the figure, the moving mechanism 74 stops the movement when the stage 71 is located at the detection position P7.

次いで、制御部６は、検出部５に対して検出処理を実行させる。この検出処理では、検出部５は、第３搬送機構４３の吸着台７３によって保持されている基板４００を吸着台７３の上方から撮像して、その撮像画像を画像解析することにより、基板４００を上下方向に貫通する中心軸を中心とする回転方向の基板４００の位置ずれを検出する。   Next, the control unit 6 causes the detection unit 5 to execute detection processing. In this detection process, the detection unit 5 captures the substrate 400 held by the suction platform 73 of the third transport mechanism 43 from above the suction platform 73 and analyzes the captured image to thereby analyze the substrate 400. A positional shift of the substrate 400 in the rotation direction about the central axis penetrating in the vertical direction is detected.

続いて、制御部６は、第３搬送機構４３の補正機構７５に対して補正処理を実行させる。この補正処理では、補正機構７５は、検出部５による検出処理の結果に基づき、吸着台７３を上下方向に貫通する中心軸を中心として吸着台７３を回動させることにより、吸着台７３によって保持されている基板４００の位置ずれを補正する。   Subsequently, the control unit 6 causes the correction mechanism 75 of the third transport mechanism 43 to perform correction processing. In this correction process, the correction mechanism 75 is held by the suction stand 73 by rotating the suction stand 73 about the central axis that penetrates the suction stand 73 in the vertical direction based on the result of the detection process by the detection unit 5. The positional deviation of the substrate 400 is corrected.

次いで、第３搬送機構４３の移動機構７４が、図１６に示すように、ステージ７１を第１搭載位置Ｐ２ａに向けて移動させ、ステージ７１が第１搭載位置Ｐ２ａに位置した時点でその移動を停止させる。これにより、受け渡し位置Ｐ６と第１搭載位置Ｐ２ａとを結ぶ第３経路Ｒ３に沿って基板４００が第３搬送機構４３によって搬送される。また、制御部６は、第３搬送処理の開始から所定時間が経過した時点で、同図に示すように、第２搬送機構４２に対して吸着部６１を引き渡し位置Ｐ５近傍の位置に移動（初期位置に復帰）させる。   Next, as shown in FIG. 16, the moving mechanism 74 of the third transport mechanism 43 moves the stage 71 toward the first mounting position P2a, and when the stage 71 is positioned at the first mounting position P2a, the movement is performed. Stop. As a result, the substrate 400 is transported by the third transport mechanism 43 along the third route R3 connecting the delivery position P6 and the first mounting position P2a. In addition, when a predetermined time has elapsed from the start of the third transport process, the control unit 6 moves the suction unit 61 to a position near the delivery position P5 with respect to the second transport mechanism 42 as shown in FIG. Return to the initial position).

続いて、制御部６は、搭載機構２に対して第１搭載処理を開始させる。この第１搭載処理では、搭載機構２の移動機構１２ａが、移動処理を実行する。この場合、移動機構１２ａは、図１６に示すように、待機位置Ｐ１ａから第１搭載位置Ｐ２ａの上方に向けて搭載用プレート１１ａを移動させる。次いで、移動機構１２ａは、図１７に示すように、第１搭載位置Ｐ２ａに搬送されている基板４００における端子４０１の形成位置と搭載用プレート１１ａにおける挿通孔８３ａおよび凹部８４ａの形成位置とが一致するように位置合わせしつつ基板４００の表面４０２に対して搭載用プレート１１ａの下面８２ａが近接（接触）するまで搭載用プレート１１ａを移動（下降）させる。この場合、搭載用プレート１１ａに挿通孔８３ａおよび凹部８４ａが形成されているため、端子４０１に塗布されているフラックス５００の搭載用プレート１１ａへの付着が防止される。   Subsequently, the control unit 6 causes the mounting mechanism 2 to start the first mounting process. In the first mounting process, the moving mechanism 12a of the mounting mechanism 2 executes the moving process. In this case, as shown in FIG. 16, the moving mechanism 12a moves the mounting plate 11a from the standby position P1a toward the upper side of the first mounting position P2a. Next, as shown in FIG. 17, in the moving mechanism 12a, the formation position of the terminal 401 on the substrate 400 being transported to the first mounting position P2a matches the formation position of the insertion hole 83a and the recess 84a in the mounting plate 11a. The mounting plate 11a is moved (lowered) until the lower surface 82a of the mounting plate 11a approaches (contacts) the front surface 402 of the substrate 400 while being aligned. In this case, since the insertion hole 83a and the recess 84a are formed in the mounting plate 11a, adhesion of the flux 500 applied to the terminal 401 to the mounting plate 11a is prevented.

続いて、搭載機構２の供給除去機構１３ａが、供給処理および除去処理を実行する。具体的には、供給除去機構１３ａは、図１８に示すように、半田ボール３００ａが収容されている供給器９１を搭載用プレート１１ａの上面８１ａに沿って移動させる。この際に、供給器９１から放出された半田ボール３００ａが搭載用プレート１１ａの上面８１ａに分散しつつ供給される。また、供給された半田ボール３００ａの一部が、挿通孔８３ａを挿通して端子４０１に塗布されているフラックス５００の上に搭載される。   Subsequently, the supply / removal mechanism 13a of the mounting mechanism 2 executes a supply process and a removal process. Specifically, as shown in FIG. 18, the supply removal mechanism 13a moves the supply device 91 in which the solder balls 300a are accommodated along the upper surface 81a of the mounting plate 11a. At this time, the solder balls 300a discharged from the supplier 91 are supplied while being dispersed on the upper surface 81a of the mounting plate 11a. In addition, a part of the supplied solder ball 300a is mounted on the flux 500 applied to the terminal 401 through the insertion hole 83a.

次いで、供給除去機構１３ａは、図１８に示すように、スキージ９２を搭載用プレート１１ａの上面８１ａに沿って移動させる。この際に、供給器９１によって供給された半田ボール３００ａのうちの余剰な（挿通孔８３ａに挿通されなかった）半田ボール３００ａがスキージ９２によって掻き寄せられて、搭載用プレート１１ａの縁部から図外の回収容器に払い落とされる。これにより、余剰な半田ボール３００ａが搭載用プレート１１ａから除去される。続いて、供給除去機構１３ａは、供給器９１およびスキージ９２を待機位置Ｐ１ｃ（図２０参照）に移動させる。   Next, the supply / removal mechanism 13a moves the squeegee 92 along the upper surface 81a of the mounting plate 11a as shown in FIG. At this time, surplus solder balls 300a (not inserted through the insertion holes 83a) of the solder balls 300a supplied by the supply device 91 are scraped by the squeegee 92 and are drawn from the edge of the mounting plate 11a. It is wiped off to the outside collection container. Thereby, the excessive solder ball 300a is removed from the mounting plate 11a. Subsequently, the supply removal mechanism 13a moves the supply device 91 and the squeegee 92 to the standby position P1c (see FIG. 20).

次いで、移動機構１２ａが、図１９に示すように、搭載用プレート１１ａを上方に移動させた後に、待機位置Ｐ１ａに移動させる。以上により、基板４００の第１領域４００ａに形成されている端子４０１（端子４０１に塗布されているフラックス５００）への半田ボール３００ａの搭載が終了する。   Next, as shown in FIG. 19, the moving mechanism 12a moves the mounting plate 11a upward and then moves it to the standby position P1a. Thus, the mounting of the solder ball 300a on the terminal 401 (flux 500 applied to the terminal 401) formed in the first region 400a of the substrate 400 is completed.

次いで、搬送部４における第３搬送機構４３の移動機構７４が、図２０に示すように、ステージ７１を第２搭載位置Ｐ２ｂに向けて移動させ、ステージ７１が第２搭載位置Ｐ２ｂに位置した時点でその移動を停止させる。   Next, when the moving mechanism 74 of the third transport mechanism 43 in the transport unit 4 moves the stage 71 toward the second mounting position P2b as shown in FIG. 20, the stage 71 is positioned at the second mounting position P2b. To stop the movement.

続いて、制御部６は、搭載機構２に対して第２搭載処理を開始させる。この第２搭載処理では、搭載機構２の移動機構１２ｂが、移動処理を実行する。この場合、移動機構１２ｂは、図２０に示すように、待機位置Ｐ１ｂから第１搭載位置Ｐ２ｂの上方に向けて搭載用プレート１１ｂを移動させる。次いで、移動機構１２ｂは、第１搭載位置Ｐ２ｂに搬送されている基板４００における端子４０１の形成位置と搭載用プレート１１ｂにおける挿通孔８３ｂおよび凹部８４ｂの形成位置とが一致するように位置合わせしつつ基板４００の表面４０２に対して搭載用プレート１１ｂの下面８２ｂが近接（接触）するまで搭載用プレート１１ｂを移動（下降）させる。この場合、搭載用プレート１１ｂに凹部８４ｂが形成されているため、図２１に示すように、基板４００に既に搭載されている半田ボール３００ａと搭載用プレート１１ｂとの接触が回避されて、搭載用プレート１１ｂの下面８２ｂと基板４００の表面４０２とを十分に近接（または接触）する。   Subsequently, the control unit 6 causes the mounting mechanism 2 to start the second mounting process. In the second mounting process, the moving mechanism 12b of the mounting mechanism 2 executes the moving process. In this case, as shown in FIG. 20, the moving mechanism 12b moves the mounting plate 11b from the standby position P1b to above the first mounting position P2b. Next, the moving mechanism 12b aligns so that the formation positions of the terminals 401 on the substrate 400 conveyed to the first mounting position P2b coincide with the formation positions of the insertion holes 83b and the recesses 84b in the mounting plate 11b. The mounting plate 11b is moved (lowered) until the lower surface 82b of the mounting plate 11b approaches (contacts) the surface 402 of the substrate 400. In this case, since the recess 84b is formed in the mounting plate 11b, contact between the solder ball 300a already mounted on the substrate 400 and the mounting plate 11b is avoided as shown in FIG. The lower surface 82b of the plate 11b and the surface 402 of the substrate 400 are sufficiently close (or in contact).

続いて、搭載機構２の供給除去機構１３ｂが、供給処理および除去処理を実行する。具体的には、供給除去機構１３ｂは、図２１に示すように、半田ボール３００ｂが収容されている供給器９１を搭載用プレート１１ｂの上面８１ｂに沿って移動させる。この際に、供給器９１から放出された半田ボール３００ｂが搭載用プレート１１ｂの上面８１ｂに分散しつつ供給される。また、供給された半田ボール３００ｂの一部が、挿通孔８３ｂを挿通して端子４０１に塗布されているフラックス５００の上に搭載される。   Subsequently, the supply / removal mechanism 13b of the mounting mechanism 2 executes a supply process and a removal process. Specifically, as shown in FIG. 21, the supply / removal mechanism 13b moves the supply device 91 in which the solder balls 300b are accommodated along the upper surface 81b of the mounting plate 11b. At this time, the solder balls 300b discharged from the supplier 91 are supplied while being dispersed on the upper surface 81b of the mounting plate 11b. In addition, a part of the supplied solder ball 300b is mounted on the flux 500 applied to the terminal 401 through the insertion hole 83b.

次いで、供給除去機構１３ｂは、図２１に示すように、スキージ９２を搭載用プレート１１ｂの上面８１ｂに沿って移動させる。この際に、供給器９１によって供給された半田ボール３００ｂのうちの余剰な（挿通孔８３ｂに挿通されなかった）半田ボール３００ｂがスキージ９２によって掻き寄せられて、搭載用プレート１１ｂの縁部から図外の回収容器に払い落とされる。これにより、余剰な半田ボール３００ｂが搭載用プレート１１ｂから除去される。続いて、供給除去機構１３ｂは、供給器９１およびスキージ９２を待機位置Ｐ１ｄ（図２０参照）に移動させる。   Next, the supply / removal mechanism 13b moves the squeegee 92 along the upper surface 81b of the mounting plate 11b as shown in FIG. At this time, excessive solder balls 300b (not inserted into the insertion holes 83b) of the solder balls 300b supplied by the supply device 91 are scraped by the squeegee 92 and are drawn from the edge of the mounting plate 11b. It is wiped off to the outside collection container. Thereby, the excessive solder ball 300b is removed from the mounting plate 11b. Subsequently, the supply removal mechanism 13b moves the supply device 91 and the squeegee 92 to the standby position P1d (see FIG. 20).

次いで、移動機構１２ｂが、搭載用プレート１１ｂを上方に移動させた後に、待機位置Ｐ１ｂに移動させる。以上により、基板４００の第２領域４００ｂに形成されている端子４０１（端子４０１に塗布されているフラックス５００）への半田ボール３００ｂの搭載が終了して、図２２に示すように、基板４００における全ての端子４０１への半田ボール３００の搭載が完了する。   Next, the moving mechanism 12b moves the mounting plate 11b upward and then moves it to the standby position P1b. Thus, the mounting of the solder balls 300b on the terminals 401 (flux 500 applied to the terminals 401) formed in the second region 400b of the substrate 400 is completed, and as shown in FIG. The mounting of the solder balls 300 to all the terminals 401 is completed.

ここで、例えば、この半田ボール搭載装置１とは逆に、第２搭載処理を実行した後に第１搭載処理を実行する構成では、先に搭載した大径の半田ボール３００ｂとの接触を回避するための凹部８４ａの深さＬ５ａを深く規定する必要がある。このため、この構成では、凹部８４ａの深さＬ５ａを確保するために第１搭載処理に用いる搭載用プレート１１ａの厚みＬ３ａを半田ボール３００ａの直径Ｌ１ａと比較して必要以上に長く規定しなければならないこととなる。この場合、厚みＬ３ａを長く規定することに伴って挿通孔８３ａも直径Ｌ１ａと比較して必要以上に長くなり、第１搭載処理の実行時に複数の半田ボール３００ａが挿通孔８３ａに入り込んで、１つの端子４０１に複数の半田ボール３００ａが搭載されるおそれがある。これに対して、この半田ボール搭載装置１では、搭載機構２が、第１搭載処理を実行した後に第２搭載処理を実行して、小径の半田ボール３００ａを搭載した後に大径の半田ボール３００ｂを搭載する。つまり、この半田ボール搭載装置１では、搭載機構２が、口径の小さい挿通孔８３ａが形成されている搭載用プレート１１ａに対する移動処理および供給処理を口径の大きい挿通孔８３ｂが形成されている搭載用プレート１１ｂに対する移動処理および供給処理に先立って行う。このため、この半田ボール搭載装置１では、搭載用プレート１１の厚みに起因する搭載処理時の不都合を解消することが可能となっている。   Here, for example, in contrast to the solder ball mounting apparatus 1, in the configuration in which the first mounting process is performed after the second mounting process is performed, contact with the previously mounted large-diameter solder ball 300b is avoided. Therefore, it is necessary to define the depth L5a of the concave portion 84a for the purpose. For this reason, in this configuration, the thickness L3a of the mounting plate 11a used for the first mounting process in order to ensure the depth L5a of the recess 84a must be defined longer than necessary compared to the diameter L1a of the solder ball 300a. It will not be. In this case, as the thickness L3a is defined to be longer, the insertion hole 83a is also longer than necessary as compared with the diameter L1a, and a plurality of solder balls 300a enter the insertion hole 83a when the first mounting process is performed. There is a possibility that a plurality of solder balls 300 a are mounted on one terminal 401. On the other hand, in this solder ball mounting apparatus 1, the mounting mechanism 2 executes the second mounting process after executing the first mounting process, and after mounting the small diameter solder ball 300a, the large diameter solder ball 300b. Is installed. That is, in this solder ball mounting apparatus 1, the mounting mechanism 2 performs the moving process and the supply process for the mounting plate 11a in which the insertion hole 83a having a small diameter is formed, and the mounting mechanism in which the insertion hole 83b having a large diameter is formed. Prior to the movement process and the supply process for the plate 11b. For this reason, in this solder ball mounting apparatus 1, it is possible to eliminate inconvenience at the time of mounting processing due to the thickness of the mounting plate 11.

次いで、半田ボール３００ａ，３００ｂの搭載が完了した基板４００が、図外の取り出し装置によって第３搬送機構４３の吸着台７３からストック場所に移動される。続いて、第３搬送機構４３の移動機構７４が、ステージ７１を第２搭載位置Ｐ２ｂから受け渡し位置Ｐ６に移動（初期位置に復帰）させる。   Next, the substrate 400 on which mounting of the solder balls 300a and 300b is completed is moved from the suction platform 73 of the third transport mechanism 43 to the stock location by a take-out device (not shown). Subsequently, the moving mechanism 74 of the third transport mechanism 43 moves the stage 71 from the second mounting position P2b to the delivery position P6 (returns to the initial position).

一方、制御部６は、上記した搭載処理が実行されている間に、図１６に示すように、次の基板４００に対する第１搬送処理を第１搬送機構４１に開始させ、次いで、その基板４００に対する塗布処理を塗布部３に実行させる。つまり、この半田ボール搭載装置１では、塗布処理を搭載処理と並行して行うことが可能となっている。このため、第３搬送機構４３の吸着台７３（ステージ７１）が受け渡し位置Ｐ６において長時間待機させられることなく、次の基板４００が吸着台７３に載置される。したがって、この半田ボール搭載装置１では、１つの基板４００当たりの処理時間を十分に短縮することができる結果、生産性を十分に向上させることが可能となっている。以下、制御部６は、搭載機構２、塗布部３、搬送部４および検出部５に対して上記の各処理を実行させることにより、基板４００に対する半田ボール３００ａ，３００ｂの搭載を連続して行う。   On the other hand, the control unit 6 causes the first transport mechanism 41 to start the first transport process for the next substrate 400, as shown in FIG. The coating unit 3 is caused to execute a coating process for the above. That is, in this solder ball mounting apparatus 1, the coating process can be performed in parallel with the mounting process. Therefore, the next substrate 400 is placed on the suction platform 73 without the suction platform 73 (stage 71) of the third transport mechanism 43 being kept on standby for a long time at the delivery position P6. Therefore, in this solder ball mounting apparatus 1, it is possible to sufficiently shorten the processing time per one substrate 400, and as a result, it is possible to sufficiently improve productivity. Hereinafter, the control unit 6 continuously mounts the solder balls 300a and 300b on the substrate 400 by causing the mounting mechanism 2, the coating unit 3, the transport unit 4 and the detection unit 5 to perform the above-described processes. .

なお、半田ボール３００ａ，３００ｂの搭載が完了した基板４００は、図外の取り出し装置によって取り出されて、図外の搭載状態検査装置に搬送され、搭載状態検査装置によって半田ボール３００が過不足なく搭載されているか否かの搭載状態検査が行われる。この場合、搭載状態検査において不良と判別された基板４００は、不良品のストック場所に搬送される。また、搭載状態検査において良好と判別された基板４００は、図外のリフロー処理装置に搬送され、そのリフロー処理装置によってリフロー処理（溶融処理）が実行されることにより、図２６に示すように、基板４００の端子４０１に搭載された各半田ボール３００が溶融されて半球状（同図に示す半田３０１）となった状態で、端子４０１に固着する。また、固着された半田３０１によって基板４００上にボールグリッドアレイ（ＢＧＡ）が構成される。以上により、同図に示すように、半田搭載済基板（球状体搭載済基板）６００が製造される。次いで、半田搭載済基板６００は、図外の電子部品搭載装置に搬送され、続いて、電子部品搭載装置によって半田搭載済基板６００に電子部品７０１が搭載される。次いで、例えばリフロー処理により、半田搭載済基板６００における基板４００の端子４０１に固着された半田ボール３００（半田３０１）が溶融されることで、搭載された電子部品７０１における図外の端子が、溶融された半田ボール３００（半田３０１）を介して基板４００の端子４０１に接続される。これにより、図２７に示すように、電子部品搭載済基板７００が製造される。   The substrate 400 on which mounting of the solder balls 300a and 300b is completed is taken out by an unillustrated take-out device and transported to an unshown mount state inspection device, and the solder ball 300 is loaded without excess or deficiency by the mount state inspection device. A mounting state inspection is performed to determine whether or not it has been performed. In this case, the substrate 400 determined to be defective in the mounting state inspection is transported to the stock location of the defective product. Further, the substrate 400 determined to be good in the mounting state inspection is transported to a reflow processing apparatus (not shown), and reflow processing (melting processing) is performed by the reflow processing apparatus, as shown in FIG. Each solder ball 300 mounted on the terminal 401 of the substrate 400 is melted into a hemispherical shape (solder 301 shown in the figure) and is fixed to the terminal 401. Further, a ball grid array (BGA) is formed on the substrate 400 by the solder 301 fixed thereto. As described above, as shown in the figure, the solder mounted substrate (spherical substrate mounted substrate) 600 is manufactured. Next, the solder-mounted substrate 600 is transferred to an electronic component mounting device (not shown), and then the electronic component 701 is mounted on the solder-mounted substrate 600 by the electronic component mounting device. Next, the solder ball 300 (solder 301) fixed to the terminal 401 of the board 400 in the solder-mounted board 600 is melted by, for example, reflow processing, so that the terminals outside the figure in the mounted electronic component 701 are melted. The solder balls 300 (solder 301) are connected to the terminals 401 of the substrate 400. Thereby, as shown in FIG. 27, the electronic component mounted substrate 700 is manufactured.

このように、この半田ボール搭載装置１および球状体搭載方法では、口径が搭載用プレート１１毎に互いに異なる挿通孔８３が形成された複数の搭載用プレート１１毎に移動処理および供給処理を実行して口径に対応して直径が互いに異なる複数種類の半田ボール３００を１つの基板４００に対して搭載する。このため、この半田ボール搭載装置１および球状体搭載方法によれば、隣接する端子４０１同士の間隔が領域によって異なったり、接続されるリード線の太さが領域によって異なったりする複雑な構成の基板４００に対して、直径Ｌ１（大きさ）が互いに異なる複数種類の半田ボール３００を確実に搭載することができる。   Thus, in this solder ball mounting apparatus 1 and the spherical body mounting method, the movement process and the supply process are executed for each of the plurality of mounting plates 11 in which the insertion holes 83 having different diameters are formed for each mounting plate 11. A plurality of types of solder balls 300 having different diameters corresponding to the diameter are mounted on one substrate 400. For this reason, according to this solder ball mounting apparatus 1 and the spherical body mounting method, the board | substrate of the complicated structure from which the space | interval of adjacent terminals 401 changes with areas, or the thickness of the lead wire connected changes with areas. With respect to 400, a plurality of types of solder balls 300 having different diameters L1 (sizes) can be reliably mounted.

また、この半田ボール搭載装置１によれば、搭載用プレート１１ｂに凹部８４ｂを形成したことにより、基板４００に既に搭載されている半田ボール３００ａと搭載用プレート１１ｂの下面８２ｂとの接触を確実に回避することができるため、搭載用プレート１１ｂの下面８２ｂと基板４００の表面４０２とを十分に近接（または接触）させることができる。したがって、この半田ボール搭載装置１によれば、半田ボール３００ｂを端子４０１に対して確実に案内して搭載することができる。   Further, according to the solder ball mounting apparatus 1, the concave portion 84b is formed in the mounting plate 11b, so that the contact between the solder ball 300a already mounted on the substrate 400 and the lower surface 82b of the mounting plate 11b is ensured. Since this can be avoided, the lower surface 82b of the mounting plate 11b and the surface 402 of the substrate 400 can be brought sufficiently close (or in contact). Therefore, according to the solder ball mounting apparatus 1, the solder ball 300b can be reliably guided and mounted on the terminal 401.

また、この半田ボール搭載装置１によれば、移動機構１２を搭載用プレート１１の数と同数備え、各移動機構１２が各搭載用プレート１１を個別に移動させることにより、例えば、複数の搭載用プレート１１を交換して１つの移動機構１２で移動させる構成と比較して、交換に要する時間分を短縮できるため、処理効率を十分に向上させることができる。   In addition, according to the solder ball mounting apparatus 1, the same number of moving mechanisms 12 as the number of mounting plates 11 are provided, and each moving mechanism 12 moves each mounting plate 11 individually. Compared with a configuration in which the plate 11 is replaced and moved by one moving mechanism 12, the time required for replacement can be shortened, so that the processing efficiency can be sufficiently improved.

また、この半田ボール搭載装置１によれば、供給除去機構１３を搭載用プレート１１の数と同数備え、各供給除去機構１３が割り当てられた搭載用プレート１１における挿通孔８３の口径に対応する半田ボール３００をその搭載用プレート１１に個別に供給することにより、例えば、１つの供給除去機構１３で複数種類の半田ボール３００を供給する構成と比較して、半田ボール３００の入れ替えに要する時間分を短縮できるため、処理効率を十分に向上させることができる。   Further, according to the solder ball mounting apparatus 1, the same number of supply / removal mechanisms 13 as the number of mounting plates 11 are provided, and the solder corresponding to the diameter of the insertion hole 83 in the mounting plate 11 to which each supply / removal mechanism 13 is assigned. By supplying the balls 300 individually to the mounting plate 11, for example, compared to a configuration in which a plurality of types of solder balls 300 are supplied by one supply / removal mechanism 13, the time required for replacing the solder balls 300 is reduced. Since it can be shortened, the processing efficiency can be sufficiently improved.

また、この半田ボール搭載装置１では、搭載機構２が、挿通孔８３の口径の小さい搭載用プレート１１ａに対する移動処理および供給処理を口径の大きい搭載用プレート１１ｂに対する移動処理および供給処理に先立って行う。このため、この半田ボール搭載装置１では、例えば、先に搭載した半田ボール３００ａとの接触を回避するための凹部８４ｂを設けるときに、その深さＬ５ｂを後に搭載する半田ボール３００ｂの直径Ｌ１ｂよりも短く規定することができる。したがって、この半田ボール搭載装置１によれば、凹部８４ｂの深さＬ５ｂを確保するために搭載用プレート１１ｂの厚みＬ３ｂを必要以上に長くなる必要がないため、挿通孔８３ｂの長さが半田ボール３００ｂの直径Ｌ１ｂよりも必要以上に長くなって１つの端子４０１に複数の半田ボール３００が搭載される事態を確実に回避することができる。   Further, in this solder ball mounting apparatus 1, the mounting mechanism 2 performs the moving process and the supplying process for the mounting plate 11a having the small diameter of the insertion hole 83 prior to the moving process and the supplying process for the mounting plate 11b having the large diameter. . For this reason, in this solder ball mounting apparatus 1, for example, when the recess 84b for avoiding contact with the solder ball 300a previously mounted is provided, the depth L5b is greater than the diameter L1b of the solder ball 300b to be mounted later. Can also be defined short. Therefore, according to this solder ball mounting device 1, since it is not necessary to increase the thickness L3b of the mounting plate 11b more than necessary in order to ensure the depth L5b of the recess 84b, the length of the insertion hole 83b is the solder ball. It is possible to reliably avoid a situation in which a plurality of solder balls 300 are mounted on one terminal 401 because it is longer than necessary than the diameter L1b of 300b.

また、この半田搭載済基板６００では、上記の半田ボール搭載装置１（球状体搭載方法）によって基板４００に搭載された半田ボール３００が溶融されて基板４００に固着されている。このため、この半田搭載済基板６００では、基板４００が、例えば、隣接する４０１同士の間隔が領域によって異なったり、接続されるリード線の太さが領域によって異なったりする複雑な構成であっても、直径が互いに異なる複数種類の半田ボール３００が各領域に確実に搭載されて、溶融された半田ボール３００（半田３０１）が各領域に設けられた端子４０１に確実に固着されている。したがって、この半田搭載済基板６００によれば、電子部品を実装する際に、溶融された半田ボール３００（半田３０１）を介して電子部品の端子と基板４００の端子４０１とを確実に接続させることができる。   In the solder mounted substrate 600, the solder ball 300 mounted on the substrate 400 is melted and fixed to the substrate 400 by the solder ball mounting apparatus 1 (spherical body mounting method). For this reason, even if this board | substrate 400 with this solder mounting board | substrate 600 has the complicated structure where the space | interval of adjacent 401 differs by area | region, for example, or the thickness of the lead wire connected changes with area | regions. A plurality of types of solder balls 300 having different diameters are securely mounted in each region, and the molten solder ball 300 (solder 301) is securely fixed to the terminal 401 provided in each region. Therefore, according to this solder mounted substrate 600, when the electronic component is mounted, the terminal of the electronic component and the terminal 401 of the substrate 400 are securely connected via the molten solder ball 300 (solder 301). Can do.

また、この電子部品搭載済基板７００では、上記の半田搭載済基板６００の基板４００に固着された半田ボール３００（半田３０１）を介して接続された電子部品７０１が半田搭載済基板６００に搭載されている。このため、この電子部品搭載済基板７００では、半田搭載済基板６００における基板４００の各領域に設けられた端子４０１に溶融された半田ボール３００（半田３０１）が確実に固着されている結果、電子部品７０１を実装する際に、半田ボール３００（半田３０１）を介して電子部品７０１の端子と基板４００の端子４０１とが確実に接続されている。したがって、この電子部品搭載済基板７００によれば、この電子部品搭載済基板７００を用いた製品における不良の発生を確実に防止することができる。   In the electronic component mounted substrate 700, the electronic component 701 connected via the solder balls 300 (solder 301) fixed to the substrate 400 of the solder mounted substrate 600 is mounted on the solder mounted substrate 600. ing. For this reason, in this electronic component mounted substrate 700, the molten solder balls 300 (solder 301) are securely fixed to the terminals 401 provided in the respective regions of the substrate 400 in the solder mounted substrate 600. When the component 701 is mounted, the terminals of the electronic component 701 and the terminals 401 of the substrate 400 are securely connected via the solder balls 300 (solder 301). Therefore, according to the electronic component mounted substrate 700, it is possible to reliably prevent the occurrence of defects in products using the electronic component mounted substrate 700.

なお、上記した搭載用プレート１１ａ，１１ｂに代えて、図２３に示す搭載用プレート１１ｃを用いることもできる。この搭載用プレート１１ｃには、同図に示すように、口径が互いに異なる複数種類の挿通孔８３（例えば、大径の挿通孔８３ｃ、および小径の挿通孔８３ｄ）が形成されている。この搭載用プレート１１ｃを備えた半田ボール搭載装置１０１、およびこの半田ボール搭載装置１０１を用いる球状体搭載方法では、図２４に示すように、基板４００の表面４０２と搭載用プレート１１ｃの下面８２ｃとの対向状態において、まず、供給除去機構１３ｂが、大径の半田ボール３００ｃを搭載用プレート１１ｃの上面８１ｃに供給する供給処理を実行すると共に、不要な半田ボール３００ｃを除去する除去処理を実行する。次いで、図２５に示すように、供給除去機構１３ａが小径の半田ボール３００ｄを搭載用プレート１１ｃの上面８１ｃに供給する供給処理を実行すると共に、不要な半田ボール３００ｄを除去する除去処理を実行する。つまり、搭載機構２は、各挿通孔８３ｃ，８３ｄの口径に対応して直径Ｌが互いに異なる複数種類の半田ボール３００ｃ，３００ｄをその直径Ｌ１が大きい順に供給して複数種類の半田ボール３００ｃ，３００ｄを１つの基板４００に対して搭載する。このため、この半田ボール搭載装置１０１、およびこの半田ボール搭載装置１０１を用いる球状体搭載方法においても、隣接する端子４０１同士の間隔が領域によって異なったり、接続されるリード線の太さが領域によって異なったりする複雑な構成の基板４００に対して、直径Ｌ１（大きさ）が互いに異なる複数種類の半田ボール３００を確実に搭載することができる。   Note that a mounting plate 11c shown in FIG. 23 may be used instead of the mounting plates 11a and 11b. As shown in the figure, the mounting plate 11c has a plurality of types of insertion holes 83 (for example, a large diameter insertion hole 83c and a small diameter insertion hole 83d) having different diameters. In the solder ball mounting apparatus 101 provided with the mounting plate 11c and the spherical body mounting method using the solder ball mounting apparatus 101, as shown in FIG. 24, the surface 402 of the substrate 400, the lower surface 82c of the mounting plate 11c, First, the supply / removal mechanism 13b executes a supply process for supplying the large-diameter solder ball 300c to the upper surface 81c of the mounting plate 11c and a removal process for removing the unnecessary solder ball 300c. . Next, as shown in FIG. 25, the supply / removal mechanism 13a executes supply processing for supplying the small-diameter solder balls 300d to the upper surface 81c of the mounting plate 11c, and also performs removal processing for removing unnecessary solder balls 300d. . In other words, the mounting mechanism 2 supplies a plurality of types of solder balls 300c and 300d by supplying a plurality of types of solder balls 300c and 300d having different diameters L in descending order corresponding to the diameters of the respective insertion holes 83c and 83d. Are mounted on one substrate 400. For this reason, also in this solder ball mounting apparatus 101 and the spherical body mounting method using this solder ball mounting apparatus 101, the interval between adjacent terminals 401 differs depending on the area, or the thickness of the lead wire to be connected depends on the area. A plurality of types of solder balls 300 having different diameters L1 (sizes) can be reliably mounted on the substrate 400 having a different and complicated configuration.

また、第１搭載処理を実行した後に第２搭載処理を実行して小径の半田ボール３００ａを搭載した後に大径の半田ボール３００ｂを搭載する構成例、つまり、挿通孔８３ａの口径が小さい搭載用プレート１１ａに対する移動処理および供給処理を挿通孔８３ｂの口径が大きい搭載用プレート１１ｂに対する移動処理および供給処理に先立って行う構成例について上記したが、半田ボール３００ａ，３００ｂの直径Ｌ１ａ，Ｌ１ｂの差が少ない（半田ボール３００ａ，３００ｂの大きさの差が少ない）ときには、この順番を逆にした構成、つまり挿通孔８３ｂの口径が大きい搭載用プレート１１ｂに対する移動処理および供給処理を挿通孔８３ａの口径が小さい搭載用プレート１１ａに対する移動処理および供給処理に先立って行う構成を採用することもできる。   Further, a configuration example in which the second mounting process is performed after the first mounting process is performed to mount the small-diameter solder ball 300a and then the large-diameter solder ball 300b is mounted, that is, the mounting hole 83a has a small diameter. Although the configuration example in which the movement process and the supply process with respect to the plate 11a are performed prior to the movement process and the supply process with respect to the mounting plate 11b having the large diameter of the insertion hole 83b has been described above, the difference between the diameters L1a and L1b of the solder balls 300a and 300b is described. When the number is small (the difference in size between the solder balls 300a and 300b is small), the structure in which the order is reversed, that is, the moving process and the supply process for the mounting plate 11b having a large diameter of the insertion hole 83b is performed. Adopted a configuration that is performed prior to the movement process and supply process for the small mounting plate 11a. Rukoto can also.

また、２つの移動機構１２ａ，１２ｂを備えて、各移動機構１２ａ，１２ｂが各搭載用プレート１１ａ，１１ｂをそれぞれ個別に移動させる構成例について上記したが、搭載用プレート１１ａ，１１ｂを手動または自動で交換することによって１つの移動機構１２で各搭載用プレート１１ａ，１１ｂを移動させる構成を採用することもできる。また、２つの供給除去機構１３ａ，１３ｂを備えて、各供給除去機構１３ａ，１３ｂが半田ボール３００ａ，３００ｂをそれぞれ個別に供給する構成例について上記したが、半田ボール３００ａ，３００ｂを入れ替えることよって１つの供給除去機構１３で各半田ボール３００ａ，３００ｂを供給する構成を採用することもできる。   Further, the configuration example in which the two moving mechanisms 12a and 12b are provided and the moving mechanisms 12a and 12b individually move the mounting plates 11a and 11b has been described above. However, the mounting plates 11a and 11b are manually or automatically moved. It is also possible to adopt a configuration in which the mounting plates 11a and 11b are moved by a single moving mechanism 12 by exchanging them. Further, the configuration example in which the two supply / removal mechanisms 13a and 13b are provided and the respective supply / removal mechanisms 13a and 13b individually supply the solder balls 300a and 300b has been described above. However, by replacing the solder balls 300a and 300b, 1 A configuration in which each of the solder balls 300a and 300b is supplied by one supply / removal mechanism 13 may be employed.

また、１つの基板４００に直径Ｌ１が互いに異なる２種類の半田ボール３００ａ，３００ｂを搭載する例について上記したが、挿通孔８３の口径（保持対象の半田ボール３００の直径Ｌ１）が互いに異なる３つ以上の搭載用プレート１１を備えて、直径Ｌ１が互いに異なる３種類以上の半田ボール３００を１つの基板４００に搭載する構成を採用することもできる。   In addition, the example in which two types of solder balls 300a and 300b having different diameters L1 are mounted on one substrate 400 has been described above. However, the diameters of the insertion holes 83 (the diameters L1 of the solder balls 300 to be held) are different from each other. A configuration in which the mounting plate 11 is provided and three or more kinds of solder balls 300 having different diameters L1 are mounted on one substrate 400 may be employed.

また、複数の半田ボール搭載装置を用いて直径Ｌ１が互いに異なる複数種類の半田ボール３００を基板４００に搭載する搭載方法（球状体搭載方法）を採用することもできる。この球状体搭載方法では、例えば、２台の半田ボール搭載装置を用いて上記した半田ボール３００ａ，３００ｂを１つの基板４００に搭載するときには、１台の半田ボール搭載装置に対して搭載用プレート１１ａを用いた移動処理および供給処理を実行させて半田ボール３００ａを基板４００に搭載させ、他の１台の半田ボール搭載装置に対して搭載用プレート１１ｂを用いた移動処理および供給処理を実行させて半田ボール３００ｂを基板４００に搭載させる（つまり、２つの半田ボール搭載装置を用いて搭載用プレート１１毎に移動処理および供給処理を実行させる）。この球状体搭載方法においても、上記の半田ボール搭載装置１による搭載処理と同様の効果を実現することができる。   In addition, a mounting method (spherical body mounting method) in which a plurality of types of solder balls 300 having different diameters L1 are mounted on the substrate 400 using a plurality of solder ball mounting devices may be employed. In this spherical body mounting method, for example, when mounting the above-described solder balls 300a and 300b on one substrate 400 using two solder ball mounting apparatuses, the mounting plate 11a is mounted on one solder ball mounting apparatus. The solder ball 300a is mounted on the substrate 400 by executing the moving process and the supplying process using, and the moving process and the supplying process using the mounting plate 11b are executed for the other solder ball mounting apparatus. The solder balls 300b are mounted on the substrate 400 (that is, the movement process and the supply process are executed for each mounting plate 11 using two solder ball mounting apparatuses). Also in this spherical body mounting method, the same effect as the mounting process by the solder ball mounting apparatus 1 can be realized.

さらに、搭載用プレート１１を搭載対象体としての基板４００に向けて移動させる処理を移動処理として実行する例について上記したが、これとは逆に、搭載用プレート１１に向けて基板４００を移動させる処理を移動処理として実行する構成を採用することもできる。   Further, the example in which the process for moving the mounting plate 11 toward the substrate 400 as the mounting target is executed as the movement process has been described above. On the contrary, the substrate 400 is moved toward the mounting plate 11. It is also possible to employ a configuration in which the process is executed as a movement process.

１，１０１ 半田ボール搭載装置
２ 搭載機構
１１ａ〜１１ｃ 搭載用プレート
１２ａ，１２ｂ 移動機構
１３ａ，１３ｂ 供給除去機構
８２ａ〜８２ｃ 下面
８３ａ〜８３ｄ 挿通孔
８４ａ，８４ｂ 凹部
３００ａ〜３００ｄ 半田ボール
３０１ 半田
４００ 基板
４０１ 端子
４０２ 表面
６００ 半田搭載済基板
７００ 電子部品搭載済基板
７０１ 電子部品
Ｌ１ａ，Ｌ１ｂ 直径 DESCRIPTION OF SYMBOLS 1,101 Solder ball mounting apparatus 2 Mounting mechanism 11a-11c Mounting plate 12a, 12b Movement mechanism 13a, 13b Supply removal mechanism 82a-82c Lower surface 83a-83d Insertion hole 84a, 84b Recessed part 300a-300d Solder ball 301 Solder 400 Substrate 401 Terminal 402 Surface 600 Solder mounted substrate 700 Electronic component mounted substrate 701 Electronic component L1a, L1b Diameter

Claims (15)

球状体の直径に対応させて口径が規定されて当該球状体を挿通させる挿通孔が形成された搭載用プレートと、当該搭載用プレートの下面と搭載対象体の被搭載面とが互いに近接または接触して対向する対向状態となるように当該搭載用プレートおよび当該搭載対象体のいずれか一方をいずれか他方に向けて移動させる移動処理を実行すると共に前記直径が前記口径に対応する前記球状体を当該搭載用プレートの上面に供給する供給処理を当該対向状態において実行して前記挿通孔に挿通させた当該球状体を前記搭載対象体に搭載する搭載部とを備えた球状体搭載装置であって、
前記搭載用プレートを複数備え、
前記各搭載用プレートには、前記口径が当該各搭載用プレート毎に互いに異なる前記挿通孔が形成され、
前記搭載部は、前記移動処理および前記供給処理を前記各搭載用プレート毎に実行して前記口径に対応して前記直径が互いに異なる複数種類の前記球状体を１つの前記搭載対象体に対して搭載する球状体搭載装置。 A mounting plate having an aperture defined to correspond to the diameter of the spherical body and having an insertion hole through which the spherical body is inserted, and the lower surface of the mounting plate and the mounted surface of the mounting target body are close to or in contact with each other Then, a movement process for moving one of the mounting plate and the mounting target body toward either one of the mounting plate and the mounting target is performed, and the spherical body whose diameter corresponds to the aperture is A spherical body mounting apparatus comprising: a mounting portion that mounts the spherical body, which is supplied to the upper surface of the mounting plate, in the facing state and is inserted through the insertion hole into the mounting target body. And
A plurality of mounting plates;
Each mounting plate is formed with the insertion hole having a different diameter for each mounting plate,
The mounting unit performs the movement process and the supply process for each mounting plate, and applies a plurality of types of the spherical bodies having different diameters corresponding to the aperture to one mounting target body. A spherical body mounting device. 前記搭載用プレートには、前記搭載対象体に既に搭載されている前記球状体との接触を回避するための凹部が形成されている請求項１記載の球状体搭載装置。   The spherical body mounting device according to claim 1, wherein the mounting plate has a recess for avoiding contact with the spherical body already mounted on the mounting target body. 前記搭載部は、前記搭載用プレートを前記搭載対象体に向けて移動させる処理を前記移動処理として実行する移動機構を当該搭載用プレートの数と同数備え、
前記各移動機構は、前記各搭載用プレートを個別に移動させる請求項１または２記載の球状体搭載装置。 The mounting portion includes the same number of moving mechanisms as the number of mounting plates, the moving mechanism performing a process of moving the mounting plate toward the mounting object as the moving process,
The spherical body mounting device according to claim 1, wherein each moving mechanism moves each mounting plate individually. 前記搭載部は、前記各搭載用プレートに一対一で割り当てられて当該割り当てられた搭載用プレートに対して前記供給処理を実行する供給機構を当該搭載用プレートの数と同数備え、
前記各供給機構は、前記直径が前記割り当てられた搭載用プレートの前記口径に対応する前記球状体を当該搭載用プレートに個別に供給する請求項１から３のいずれかに記載の球状体搭載装置。 The mounting portion includes a supply mechanism that is assigned to each of the mounting plates on a one-to-one basis and that performs the supply process on the assigned mounting plate, as many as the number of the mounting plates
4. The spherical body mounting device according to claim 1, wherein each of the supply mechanisms individually supplies the spherical body having the diameter corresponding to the diameter of the allocated mounting plate to the mounting plate. 5. . 前記搭載部は、前記口径の小さい前記搭載用プレートに対する前記移動処理および前記供給処理を前記口径の大きい前記搭載用プレートに対する前記移動処理および前記供給処理に先立って行う請求項１から４のいずれかに記載の球状体搭載装置。   The said mounting part performs the said movement process with respect to the said mounting plate with a small diameter, and the said supply process prior to the said movement process with respect to the said mounting plate with a large diameter, and the said supply process. The spherical body mounting apparatus described in 1. 球状体の直径に対応させて口径が規定されて当該球状体を挿通させる挿通孔が形成された搭載用プレートと、当該搭載用プレートの下面と搭載対象体の被搭載面とが互いに近接または接触して対向する対向状態となるように当該搭載用プレートおよび搭載対象体のいずれか一方をいずれか他方に向けて移動させる移動処理を実行すると共に前記直径が前記口径に対応する前記球状体を当該搭載用プレートの上面に供給する供給処理を当該対向状態において実行して前記挿通孔に挿通させた当該球状体を前記搭載対象体に搭載する搭載部とを備えた球状体搭載装置であって、
前記搭載用プレートには、前記口径が互いに異なる複数種類の前記挿通孔が形成され、
前記搭載部は、前記供給処理において前記口径に対応して前記直径が互いに異なる複数種類の前記球状体を当該直径が大きい順に供給して当該複数種類の球状体を１つの前記搭載対象体に対して搭載する球状体搭載装置。 A mounting plate having an aperture defined in correspondence with the diameter of the spherical body and having an insertion hole through which the spherical body is inserted, and the lower surface of the mounting plate and the mounted surface of the mounting target are close to or in contact with each other Then, a movement process for moving one of the mounting plate and the mounting target body toward either one of the mounting plate and the mounting target is performed, and the spherical body whose diameter corresponds to the aperture is A spherical body mounting apparatus comprising: a mounting portion that mounts the spherical body that is inserted into the insertion hole by performing supply processing to be supplied to the upper surface of the mounting plate in the facing state; ,
The mounting plate is formed with a plurality of types of insertion holes having different diameters.
The mounting unit supplies a plurality of types of spherical bodies having different diameters corresponding to the diameter in the supply process in order of increasing diameter, and the plurality of types of spherical bodies are supplied to one mounting target body. A spherical body mounting device. 球状体の直径に対応させて口径が規定されて当該球状体を挿通させる挿通孔が形成された搭載用プレートの下面と搭載対象体の被搭載面とが互いに近接または接触して対向する対向状態となるように当該搭載用プレートおよび当該搭載対象体のいずれか一方をいずれか他方に向けて移動させる移動処理を実行すると共に、前記直径が前記口径に対応する前記球状体を前記搭載用プレートの上面に供給する供給処理を前記対向状態において実行して前記挿通孔に挿通させた当該球状体を前記搭載対象体に搭載する球状体搭載方法であって、
前記口径が前記搭載用プレート毎に互いに異なる前記挿通孔が形成された複数の当該搭載用プレート毎に前記移動処理および前記供給処理を実行して当該口径に対応して前記直径が互いに異なる複数種類の前記球状体を１つの前記搭載対象体に対して搭載する球状体搭載方法。 A facing state in which the lower surface of the mounting plate in which an aperture is defined corresponding to the diameter of the spherical body and an insertion hole through which the spherical body is inserted and the mounted surface of the mounting target object are close to or in contact with each other The mounting plate and the mounting object are moved so that either one of the mounting plate and the mounting target body is moved toward the other, and the spherical body whose diameter corresponds to the aperture is formed on the mounting plate. A spherical body mounting method of mounting the spherical body that is inserted into the insertion hole by performing supply processing to be supplied to the upper surface in the facing state, on the mounting target body,
A plurality of types in which the diameters are different from each other according to the diameter by executing the moving process and the supplying process for each of the plurality of mounting plates in which the insertion holes are formed differently for each of the mounting plates. A spherical body mounting method in which the spherical body is mounted on one mounting target body. 前記搭載対象体に既に搭載されている前記球状体との接触を回避するための凹部が形成された前記搭載用プレートを用いる請求項７記載の球状体搭載方法。   The spherical body mounting method according to claim 7, wherein the mounting plate in which a concave portion for avoiding contact with the spherical body already mounted on the mounting object is used. 前記搭載用プレートの数と同数の移動機構を用いて、当該搭載用プレートを前記搭載対象体に向けて移動させる処理を前記移動処理として当該搭載用プレート毎に個別に実行する請求項７または８記載の球状体搭載方法。   9. The process of moving the mounting plate toward the mounting object using the same number of moving mechanisms as the number of mounting plates is individually executed for each mounting plate as the moving process. The spherical body mounting method described. 前記各搭載用プレートに一対一で割り当てられて当該割り当てられた搭載用プレートに対して前記供給処理を実行する供給機構を当該搭載用プレートの数と同数用いて、前記直径が前記割り当てられた搭載用プレートの前記口径に対応する前記球状体を当該搭載用プレートに個別に供給する請求項７から９のいずれかに記載の球状体搭載方法。   A mounting mechanism that is assigned to each mounting plate on a one-to-one basis and that performs the supply process on the allocated mounting plate is used in the same number as the number of the mounting plates, and the mounting is performed with the diameter being allocated. The spherical body mounting method according to claim 7, wherein the spherical body corresponding to the diameter of the mounting plate is individually supplied to the mounting plate. 前記口径の小さい前記搭載用プレートに対する前記移動処理および前記供給処理を前記口径の大きい前記搭載用プレートに対する前記移動処理および前記供給処理に先立って行う請求項７から１０のいずれかに記載の球状体搭載方法。   11. The spherical body according to claim 7, wherein the moving process and the supplying process for the mounting plate having a small diameter are performed prior to the moving process and the supplying process for the mounting plate having a large diameter. Mounting method. 球状体の直径に対応させて口径が規定されて当該球状体を挿通させる挿通孔が形成された搭載用プレートの下面と搭載対象体の被搭載面とが互いに近接または接触して対向する対向状態となるように当該搭載用プレートおよび当該搭載対象体のいずれか一方をいずれか他方に向けて移動させる移動処理を実行すると共に、前記直径が前記口径に対応する前記球状体を前記搭載用プレートの上面に供給する供給処理を前記対向状態において実行して前記挿通孔に挿通させた当該球状体を前記搭載対象体に搭載する球状体搭載方法であって、
前記口径が互いに異なる複数種類の前記挿通孔が形成された前記搭載用プレートを用いて前記移動処理を実行し、
前記供給処理において、前記口径に対応して前記直径が互いに異なる複数種類の前記球状体を当該直径が大きい順に供給して当該複数種類の球状体を１つの前記搭載対象体に対して搭載する球状体搭載方法。 A facing state in which the lower surface of the mounting plate in which an aperture is defined corresponding to the diameter of the spherical body and an insertion hole through which the spherical body is inserted and the mounted surface of the mounting target object are close to or in contact with each other The mounting plate and the mounting object are moved so that either one of the mounting plate and the mounting target body is moved toward the other, and the spherical body whose diameter corresponds to the aperture is formed on the mounting plate. A spherical body mounting method of mounting the spherical body that is inserted into the insertion hole by performing supply processing to be supplied to the upper surface in the facing state, on the mounting target body,
The movement process is performed using the mounting plate in which a plurality of types of the insertion holes having different diameters are formed,
In the supply process, a plurality of types of the spherical bodies having different diameters corresponding to the diameter are supplied in order of increasing diameter, and the plurality of types of spherical bodies are mounted on one mounting target body. Body mounting method. 請求項１から６のいずれかに記載の球状体搭載装置によって前記搭載対象体としての基板に搭載された前記球状体を溶融して当該基板に固着させた球状体搭載済基板。   A spherical body mounted substrate in which the spherical body mounted on the substrate as the mounting object is melted and fixed to the substrate by the spherical body mounting apparatus according to claim 1. 請求項７から１２のいずれかに記載の球状体搭載方法によって前記搭載対象体としての基板に搭載された前記球状体を溶融して当該基板に固着させた球状体搭載済基板。   A spherical body mounted substrate in which the spherical body mounted on the substrate as the mounting object is melted and fixed to the substrate by the spherical body mounting method according to claim 7. 請求項１３または１４記載の球状体搭載済基板に固着された前記球状体を介して接続された電子部品が当該球状体搭載済基板に搭載されている電子部品搭載済基板。   15. An electronic component mounted substrate, wherein an electronic component connected via the spherical body fixed to the spherical body mounted substrate according to claim 13 or 14 is mounted on the spherical body mounted substrate.
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