JP3623703B2 - Electronic component soldering equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component soldering apparatus used when a surface mount type electronic component such as a tape carrier package or a resin mold type package is soldered and mounted on a substrate by a heat pressing method.
[0002]
[Prior art]
A method of soldering using a conventional electronic component soldering apparatus will be described with reference to the drawings. 7 is a perspective view for explaining a conventional soldering location, FIG. 8 is a cross-sectional view taken along the line AA in FIG. 7, and FIGS. 8A, 8B, and 8C show the order of soldering steps. Yes. FIG. 9 is a sectional view taken along line BB in FIG.
[0003]
First, as shown in the perspective view of FIG. 7, a substrate 12 such as a printed board is mounted on a stage, and an electronic component 13 such as a flat package type IC is conveyed onto the substrate 12 to be formed on the substrate 12. The plurality of soldering pads 12a and the plurality of soldering terminals 13a of the electronic component 13 are respectively positioned. As shown in FIG. 8A, a preliminary solder layer 111 is provided on the soldering pad 12a in advance.
[0004]
Next, as shown in FIG. 8B, the heater tool 104 installed above the electronic component 13 is lowered to simultaneously press the plurality of soldering terminals 13a against the plurality of soldering pads 12a at the same time as the heater. The tool 104 is energized and heated, the preliminary solder layer 111 is melted, and the soldering terminals 13a are fused to the soldering pads 12a.
[0005]
Next, as shown in FIG. 8C, the heater tool 104 returns to its original position even when it is raised. In this manner, the electronic component 13 is mounted on the substrate 12 by completing the soldering of the plurality of soldering terminals 13a and the plurality of soldering pads 12a at a time. A method for soldering and mounting electronic components using such a multi-point soldering method is proposed in Japanese Utility Model Laid-Open No. 61-190366, for example.
[0006]
[Problems to be solved by the invention]
In the above-described conventional soldering apparatus using a heating press using a heater tool, preliminary solder is applied to the soldering pads in advance. The preliminary solder layer is formed to have a thickness of about 50 μm using a cream solder method or a screen method. However, in actuality, a variation of about 50 ± 20 μm occurs in the thickness of the solder layer. As a result, the amount of solder on each soldering pad also varies.
[0007]
As described above, despite the variation in the thickness of the preliminary solder layer, the conventional soldering apparatus regards the amount of solder on each soldering pad as an equal amount and performs batch heating pressing with a heater tool. If there is variation in the amount of spare solder of each soldering pad, there will be places where solderability is good and places where solderability is not good, the solder connection will become unstable, and open defects will easily occur .
[0008]
In particular, when the amount of preliminary solder is small, as shown in FIG. 9, the amount of solder that is applied to the soldering terminal 13a is reduced, and it becomes difficult to form a good fillet 25, so that the reliability of solderability is lowered. There was a problem that it was easy to do.
[0009]
The present invention prevents pre-soldering with a variation in the amount of solder from being applied to the soldering pads on the substrate in advance, and prevents the connection failure during soldering by ensuring the supply of the required amount of solder. An object of the present invention is to perform highly reliable solder connection by forming a good fillet and to reduce member costs such as solder.
[0010]
[Means for Solving the Problems]
The electronic component soldering apparatus of the present invention aligns a plurality of soldering terminals of the electronic component on a plurality of soldering pads formed on the substrate, and heats a certain amount of yarn solder supplied from the solder supply mechanism. In an electronic component soldering apparatus that uses a soldering head that melts and heat-presses the soldering pad and the soldering terminal at a time, and solders the substrate and the electronic component, the soldering head includes the solder A solder guide block that guides the thread solder supplied from the supply mechanism; and a heater tool that heats and melts a certain amount of thread solder guided by the solder guide block and heats and presses the solder solder. It is connected to a pressurizing mechanism for heating and pressing, and can be moved up and down.
[0011]
In the heater tool, a solder supply hole from which a tip of the supplied yarn solder protrudes is opened at a position facing each soldering terminal of a pressing surface for heating and pressing the plurality of soldering terminals. In addition, each opening of the solder supply hole provided on the pressing surface of the heater tool is formed with a solder groove for restricting the amount of solder and the molten solder flow range when pressing the soldering terminal. The heater tool is connected to a pulse heat power source, and a certain amount of each thread solder supplied into the heater tool is heated and melted at the same time. A molten solder pool is formed at each opening of the solder supply hole.
[0012]
The solder guide block is characterized in that a solder guide hole through which the thread solder is passed is formed at a position facing each solder supply hole of the heater tool, and the solder guide block is provided with the solder guide block. A plurality of air introduction holes connected to each of the solder guide holes, and the air introduction holes air blow the molten solder remaining in the solder supply holes of the heater tool after soldering. And a receiving tray for storing the air blown molten solder is movably attached below the heater tool.
[0013]
In addition, a plurality of the solder supply mechanisms are installed according to the number of soldering terminals of the electronic component, and a certain amount of thread solder is sent out from each solder supply mechanism,
In addition, the solder supply mechanism and the soldering head are connected by a plurality of flexible guide tubes for passing each supplied thread solder, and the solder supply mechanism includes the thread solder The solder is supplied so that the tip of the wire is slightly protruding from the pressing surface of the heater tool, and the solder for detecting the amount of yarn solder protruding slightly from the pressing surface of the heater tool A plurality of detection mechanisms are installed on the soldering head in accordance with the position of each solder supply hole of the heater tool, and the solder detection mechanism uses an optical sensor, and its optical axis is the heater tool. It is installed so as to be parallel to the pressing surface.
[0014]
In addition, a solder detection mechanism for detecting the amount of the molten solder pool formed in the solder supply hole opening of the heater tool slightly protruding from the pressing surface is aligned with the position of each solder supply hole of the heater tool. It is characterized in that a plurality of soldering heads are installed, and the air introduction hole formed in the solder guide block is connected to a precision regulator that controls the air pressure in the air introduction hole positively or negatively by an input signal. Each air introduction hole is provided with a precision regulator, and a signal from the solder detection mechanism for detecting the amount of molten solder accumulated on the pressing surface of the heater tool is sent to the precision regulator. When the amount of molten solder pool is large, the air introduction hole is depressurized to pull back the molten solder, and when it is small, the molten solder is pressurized to extrude the molten solder. And controlling the amount of Ri.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a diagram showing a first embodiment of an electronic component soldering apparatus according to the present invention. FIG. 1 (a) is a front view and FIG. 1 (b) is a side view. 2 and FIG. 3 are partial enlarged views of FIG. 1, respectively. FIG. 2 (a) is an enlarged sectional view of a portion A, FIG. 2 (b) is an enlarged sectional view of a portion B, and FIG. It is a bottom view of the heater tool in an enlarged view.
[0016]
First, an apparatus configuration in the electronic component soldering apparatus of the present invention will be described. As shown in FIG. 1, the apparatus melts the solder supply mechanism 1 that supplies the thread solder 11, the stage 8 that holds the substrate 12 and the electronic component 13 that are members to be soldered, and the supplied thread solder 11. The soldering head 14 having the heater tool 4 that heats and presses the soldering member is configured as a main part.
[0017]
The solder supply mechanism 1 includes a reel 15 around which the thread solder 11 is wound, and also includes a pair of feed rollers 16 that rotate while sandwiching the thread solder 11 drawn from the reel 15. The feeding amount of the thread solder 11 is controlled by the amount. A plurality of pairs of reels 15 and feed rollers 16 are provided in accordance with the number of solder pads on the substrate 12 that is a member to be soldered and the number of solder terminals of the electronic component 13.
[0018]
Next, the soldering head 14 will be described. The soldering head 14 is integrally formed with a solder guide block 2 that guides the thread solder 11 supplied from the solder supply mechanism 1 to a melting point, and a heater tool 4 that heats and melts the thread solder 11 and heats and presses the soldered portion. It is configured. The soldering head 14 is attached to a pressurizing mechanism 5 such as a cylinder fixed to the casing 18 and can move up and down to press the heater tool 4 against the soldered portion.
[0019]
The solder guide block 2 is made of an insulating heat resistant material such as ceramic. The heater tool 4 is made of a titanium material having high thermal conductivity and high hardness. A flexible guide tube 17 such as Teflon is connected between the solder supply mechanism 1 and the soldering head 14, and the thread solder 11 is sent from the solder supply mechanism 1 to the soldering head 14 using the inside of the tube as a guide. ing.
[0020]
Further, the soldering head 14 has a flexible pipe 24 from the air removing mechanism 3 provided with a valve or the like in order to remove the molten solder remaining in the solder supply hole of the heater tool 4 after soldering by air blowing. Connected to the solder guide block 2, a pulse heat power source 6 for instantaneously heating the heater tool 4 is connected to the heater tool 4. Further, a solder detection mechanism 7 for detecting the supply amount of the thread solder supplied to the lower end portion of the heater tool 4 is provided immediately below the heater tool 4.
[0021]
Further, the stage 8 holds a substrate 12 that is a member to be soldered and the electronic component 13 that is pre-positioned on the substrate 12, moves forward to a position where soldering is performed, and retreats to the original position after soldering. It has the structure provided with moving mechanisms 9, such as a cylinder for performing.
[0022]
Next, with reference to FIG. 2, a detailed portion in the vicinity of the heating pressing portion in the soldering head will be described with FIG. In the solder guide block 2, a plurality of solder guide holes 2 a connected to the respective flexible guide tubes 17 and guiding the thread solder 11 are provided penetrating in the vertical direction, and further, a hollow connected to the flexible pipe 24 of the air supply mechanism 3. A manifold portion 19 is provided. A plurality of air introduction holes 3a branched from the hollow manifold portion 19 are connected to the solder guide holes 2a, respectively.
[0023]
On the other hand, the heater tool 4 is made of a rectangular rod-shaped titanium material of about 2 mm × 2 mm, and electrodes connected to a pulse heat power source are provided at both ends. In the heater tool 4, solder supply holes 4 a are provided so as to penetrate the solder guide blocks 2 corresponding to the solder guide holes 2 a opened in the solder guide block 2. The pressing surface 20 refers to the lower surface of the heater tool 4.
[0024]
Then, as shown in FIG. 3, a solder groove 4b having a width and a depth substantially equal to the diameter (0.8 to 1.2 mm) of the solder supply hole 4a is formed in each opening of the solder supply hole 4a. Has been. These solder grooves 4b are formed by fine processing, and a plurality of the solder grooves 4b are continuously formed and arranged corresponding to the soldering positions of the soldering pads 12a on the substrate 12 and the soldering terminals 13a of the electronic component 13. The solder groove 4b is provided to define the amount of molten solder and the molten solder flow range when the solder is melted.
[0025]
Next, a solder detection mechanism for setting the solder supply amount will be described. The solder detection mechanism 7 uses an optical sensor such as an optical fiber, detects the protruding amount of the thread solder supplied by slightly protruding from the pressing surface 20 of the heater tool 4, and sends the signal to the solder supply mechanism 1 for soldering. It is for controlling the supply amount. The optical axis 21 of the sensor is installed so as to be parallel to the pressing surface 20 of the heater tool 4 and slightly below the pressing surface 20, and at the same time, to pass directly below the solder guide hole 2a and the solder groove 4b. Installed.
[0026]
In the solder detection mechanism 7, as in the above-described solder supply mechanism 1, the same number of solder pads 12 a on the substrate 12 and solder terminals 13 a of the electronic component 13 are aligned with the positions of the respective solder grooves 4 b. Are installed.
[0027]
Next, the operation of the above-described electronic component soldering apparatus according to the present invention will be described with reference to FIGS. First, the reel 15 on which the yarn solder 11 containing wire having a wire diameter of 0.5 to 0.6 mm is wound is set in the solder supply mechanism 1. The thread solder 11 is sandwiched between a pair of feed rollers 16 and fed by a set amount by the rotation of the feed rollers 16.
[0028]
The fed solder wire 11 has a flexible guide tube 17 having an inner diameter of 0.8 to 1.2 mm, a solder guide hole 2a having the same inner diameter opened in the solder guide block 2, and further having the same inner diameter opened in the heater tool 4. Via the solder supply hole 4a, the tip is sent to a position where it slightly protrudes from the pressing surface 20 of the heater tool 4.
[0029]
The amount of protrusion of the thread solder 11 from the pressing surface 20 is detected by the optical sensor of the solder detection mechanism 7. That is, when the pop-out amount reaches the set amount of 0.2 to 0.5 mm, a signal from the optical sensor is sent to the control device, and the feeding operation of the solder supply mechanism 1 is stopped.
[0030]
Next, the pulse heat power supply 6 is activated, the heater tool 4 is heated to about 300 ° C., and the amount of thread solder 11 in the solder supply hole 4a provided in the heater tool 4 and the amount of protrusion from the solder supply hole 4a is melted. A pool of molten solder is formed in the solder groove 4 b of the heater tool 4.
[0031]
Next, the soldering pressing operation between the substrate and the electronic component will be described with reference to FIGS. 1, 2, and 3 and FIGS. 4 and 5. FIG. 4A, 4B, 4C, and 4D are diagrams showing soldering operations in the order of steps, and each uses an enlarged cross-sectional view of part A in FIG. FIG. 5 is an AA enlarged sectional view of FIG.
[0032]
First, the stage 8 moves to a predetermined position under the soldering head 14 by the action of the moving mechanism 9. This state is shown in FIG. At this time, the soldering pads 12a of the substrate 12 and the soldering terminals 13a of the electronic component 13 are positioned and held in advance on the stage 8 before being moved. And the board | substrate 12 used here does not perform preliminary soldering at all, or uses what was applied very thinly even if it performed.
[0033]
At this time, the heater tool 4 is heated by the pulse heat power source 6, and the melted portion heated and melted at the tip of the thread solder 11 leaves the thread solder portion, and hangs down in the solder supply hole 4 a to form the melted solder 11 a. Form a puddle. As shown in FIGS. 4 (a) and 5, most of the molten solder 11a stays in the solder supply hole 4a and the solder groove 4b, and its lower end is slightly from the pressing surface 20 of the heater tool 4. It stays due to surface tension in the protruding state.
[0034]
Next, after the movement of the stage 8 is completed, the soldering head 14 is lowered at a speed of 5 to 10 mm / sec by the action of the pressurizing mechanism 5. Then, the soldering pads 12a of the substrate 12 and the soldering terminals 13a of the electronic component 13 which are placed on the stage 8 and previously coated with a soldering medium such as flux are applied with appropriate pressure (50 to 100 g × number of terminals). Press to solder. This state is shown in FIG.
[0035]
At the time of this pressing, the molten solder 11a flows into the solder groove 4b around the solder supply hole 4a of the pressing surface 20, and a sufficient amount of solder is supplied to the soldering pad 12a and the soldering terminal 13a together with the solder activation action by the flux. Is done. After a certain time (2 to 4 seconds) has passed in this pressed state, the soldering is completed. Thereafter, the soldering head 14 is raised and the stage 8 is retracted. At this time, a part of the molten solder 11a remains as residual molten solder 11b in the solder supply hole 4a. This state is shown in FIG.
[0036]
Here, a large amount of air is supplied from the air supply mechanism 3 into the solder guide block 2, and this air flows from the hollow manifold portion 19 into the solder guide hole 2 a via the air introduction hole 3 a, and further the solder supply of the heater tool 4. It blows out from the hole 4a. Then, the residual molten solder 11b remaining in the solder supply hole 4a is blown out. This state is shown in FIG.
[0037]
It is necessary to take measures to prevent solder scattering such as a cover or a tray so that the residual molten solder 11b that has popped out is not scattered around by this air blowing. As a means for this, there is provided a mechanism in which the receiving tray 22 is attached to the moving mechanism 23 and the stage 8 is retracted, and then the receiving tray 22 is advanced directly below the heater tool 4 to collect the residual solder that has jumped out and retract. Thereafter, the operation of the pulse heat power supply 6 is stopped, the heater tool 4 enters a cooling state, and the soldering operation for one cycle is completed.
[0038]
Next, a second embodiment of the present invention will be described with reference to the drawings. 6A and 6B are diagrams showing a device configuration according to the second embodiment, in which FIG. 6A is a front view and FIG. 6B is a side view. Since the basic configuration of the present embodiment is not different from that of the first embodiment described above, the description of the same components will be omitted and only different portions will be described.
[0039]
In the first embodiment, as a method of controlling the supply amount of solder, the length of the thread solder protruding from the pressing surface of the heater tool is detected by an optical sensor, and this length falls within the set range amount. Each solder supply hole was controlled by a solder supply mechanism, and the length until the tip of the melted and separated thread solder jumped out from the pressing surface by a set amount was set as one cycle of the solder supply amount, and the roller was fed.
[0040]
On the other hand, in the second embodiment, the thickness of the solder pool where the solder melted by the heating of the heater tool has jumped out of the pressing surface of the heater tool is detected by an optical sensor, and the pressing surface of the heater tool is detected. An optimum amount of molten solder can be supplied.
[0041]
As shown in FIG. 6, in the apparatus configuration of the present embodiment, the air introduction holes 3a connected to the solder guide holes 2a provided in the solder guide block 2A are directly extended inside the solder guide block 2A. The flexible piping 24a is connected to each precision regulator 10 at the tip. That is, one precision regulator 10 is connected by piping to one air introduction hole 3a. The precision regulator 10 has a function of automatically controlling the positive / negative pressure of the air pressure in the pipe in a very small amount by an external input signal.
[0042]
Next, the operation of the present embodiment having such a structure will be described. First, the solder solder 11 is fed by a predetermined length by the action of the solder supply mechanism 1. The feed amount is determined only by the rotation amount of the feed roller 16, and the feedback control by the optical sensor as described in the first embodiment is not performed. In this way, the thread solder 11 sent into the solder supply hole 4a of the heater tool 4 is melted by the heating of the heater tool 4, and slightly protrudes from the pressing surface 20 of the heater tool 4 as shown in FIG. In this state, a solder pool of the molten solder 11a is formed.
[0043]
Next, the solder accumulation amount of the molten solder 11a is detected by the solder detection mechanism 7 using an optical sensor installed so that the optical axis is located directly below the solder supply hole 4a. This detection of the amount of accumulated solder is performed by an optical sensor installed so that the optical axis is positioned at the position where the amount of protrusion from the pressing surface 20 of the heater tool 4 is set.
[0044]
When the amount of accumulated solder in the molten solder 11a is detected by a signal from the solder detection mechanism 7 more than the set amount, a feedback is applied to the precision regulator 10 to generate a negative pressure in the air introduction hole 3a, and the solder The operation of pulling back the molten solder 11a into the supply hole 4a is performed. The arrangement of the air introduction holes 3a is the same as that shown in FIG.
[0045]
Further, when the amount of molten solder 11a detected is less than the set amount, feedback is also applied to the precision regulator 10 to generate a positive pressure in the air introduction hole 3a, and the molten solder 11a from the solder supply hole 4a. The operation to push out is performed. As described above, by controlling the amount of molten solder 11a to be a predetermined amount, the optimum amount of molten solder 11a can be supplied to the tip of the heater tool 4.
[0046]
Thereafter, the soldering head 14 is lowered in a state where the amount of the molten solder 11a becomes an optimum amount, and the substrate 12 and the electronic component 13 are pressed and soldered. Subsequent operations are the same as those in the first embodiment.
[0047]
【The invention's effect】
As described above, the effects of the electronic component soldering apparatus according to the present invention are as follows. First, it is possible to prevent a connection failure during soldering, particularly an open failure, and to form a good fillet. This means that reliable soldering connection can be performed with high throughput. The second effect is that preliminary soldering to the soldering pads on the board is not necessary or even if used, the member cost can be reduced by making the preliminary solder thickness very thin.
[0048]
The reason why they can be achieved is that an appropriate amount of molten solder is supplied to a position facing the soldering terminal of the heater tool pressing surface during heating pressing, and the supply mechanism for supplying the appropriate amount is soldered. This is because a plurality of individual solder terminals are provided for each terminal, so that a plurality of solder terminals can be connected by one operation of the soldering head.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a soldering apparatus according to a first embodiment of the present invention, in which FIG. 1 (a) is a front view and FIG. 2 (b) is a side view.
2 is a partially enlarged view of FIG. 1. FIG. 2 (a) is an enlarged view of part A, and FIG. 2 (b) is an enlarged view of part B.
FIG. 3 is a partially enlarged view of FIG. 1 and a bottom view of the heater tool.
FIG. 4 is a diagram illustrating a soldering operation in the first embodiment in the order of steps (a), (b), (c), and (d).
5 is an AA enlarged cross-sectional view of FIG. 4. FIG.
6A and 6B are configuration diagrams of a soldering apparatus according to a second embodiment of the present invention, in which FIG. 6A is a front view and FIG. 6B is a side view.
FIG. 7 is a perspective view illustrating a conventional soldering method.
FIGS. 8A and 8B are cross-sectional views taken along line AA in FIG. 7, and FIGS. 8A, 7B, and 8C are diagrams illustrating soldering operations in order of steps.
9 is a sectional view taken along line BB in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Solder supply mechanism 2, 2A Solder guide block 2a Solder guide hole 3 Air supply mechanism 3a Air introduction hole 4 Heater tool 4a Solder supply hole 4b Solder groove 5 Pressurization mechanism 6 Pulse heat power supply 7 Solder detection mechanism 8 Stage 9 Moving mechanism 10 Precision regulator 11 Thread solder 11a Molten solder 11b Residual molten solder 12 Substrate 12a Solder pad 13 Electronic component 13a Solder terminal 14 Solder head 15 Reel 16 Feed roller 17 Flexible guide tube 18 Housing 19 Hollow manifold portion 20 Press surface 21 Light Shaft 22 Receptacle 23 Movement mechanism 24, 24a Flexible piping 25 Fillet 104 Heater tool 111 Spare solder layer

Claims (15)

A plurality of soldering terminals of an electronic component are respectively aligned on a plurality of soldering pads formed on a substrate, and a predetermined amount of yarn solder supplied from a solder supply mechanism is heated and melted, and the plurality of soldering pads In an electronic component soldering apparatus that uses a soldering head that heats and presses a soldering terminal at a time to perform soldering between the substrate and the electronic component, the soldering head is a yarn supplied from the solder supply mechanism. A solder guide block that guides solder, and a heater tool that heats and melts a certain amount of yarn solder guided by the solder guide block and heat-presses the soldering terminal, and further pressurizes the heat-press An electronic component soldering apparatus characterized by being connected to a mechanism and capable of moving up and down. The heater tool is characterized in that a solder supply hole through which a tip of the supplied thread solder protrudes is opened at a position facing each soldering terminal of a pressing surface for heating and pressing the plurality of soldering terminals. The electronic component soldering apparatus according to claim 1. Solder grooves are formed in each opening portion of the solder supply hole provided on the pressing surface of the heater tool to regulate the amount of molten solder and the molten solder flow range when the soldering terminal is pressed. The electronic component soldering apparatus according to claim 2. The heater tool is connected to a pulse heat power source, and a certain amount of each thread solder supplied into the heater tool is heated and melted at the same time, and the melted thread solder is separated from each other and each solder supply hole of the heater tool is separated. 2. The electronic component soldering apparatus according to claim 1, wherein a molten solder pool is formed in the opening. 2. The electronic component soldering apparatus according to claim 1, wherein the solder guide block has a solder guide hole through which thread solder passes at a position facing each solder supply hole of the heater tool. The solder guide block has a plurality of air introduction holes that are respectively connected to the solder guide holes in the solder guide block, and these air introduction holes are in the solder supply holes of the heater tool after soldering. 2. The electronic component soldering apparatus according to claim 1, wherein the electronic component soldering apparatus is connected to an air supply mechanism for air blowing the remaining molten solder. 2. The electronic component soldering apparatus according to claim 1, wherein a receiving tray for storing the molten solder remaining in the solder supply hole of the heater tool after air blowing is attached to the lower side of the heater tool so as to be movable back and forth. 2. The electronic component soldering apparatus according to claim 1, wherein a plurality of the solder supply mechanisms are installed in accordance with the number of soldering terminals of the electronic component, and a predetermined amount of thread solder is sent out from each solder supply mechanism. 2. The electronic component soldering apparatus according to claim 1, wherein the solder supply mechanism and the soldering head are connected by a plurality of flexible guide tubes for allowing each supplied thread solder to pass therethrough. 2. The electronic component soldering apparatus according to claim 1, wherein the solder supply mechanism supplies the thread solder so that the tip of the thread solder comes to a position slightly protruding from the pressing surface of the heater tool. A plurality of solder detection mechanisms for detecting the amount of each thread solder slightly protruding from the pressing surface of the heater tool are installed in the soldering head in accordance with the position of each solder supply hole of the heater tool. The electronic component soldering apparatus according to claim 1. 12. The electronic component soldering apparatus according to claim 11, wherein the solder detection mechanism uses an optical sensor and is installed so that an optical axis thereof is parallel to the heater tool pressing surface. A solder detection mechanism for detecting an amount of the molten solder pool formed in the opening of the solder supply hole of the heater tool slightly protruding from the pressing surface is soldered in accordance with the position of each solder supply hole of the heater tool. 2. The electronic component soldering device according to claim 1, wherein a plurality of the electronic component soldering devices are installed on the head. The plurality of air introduction holes formed in the solder guide block and connected to the solder guide holes are connected to a precision regulator that controls the air pressure in the air introduction hole positively or negatively by an input signal. The electronic component soldering apparatus according to claim 1, further comprising a precision regulator. A signal from the solder detection mechanism for detecting the accumulated amount of molten solder formed on the pressing surface of the heater tool is sent to the precision regulator, and when there is a large amount of molten solder, the air introduction hole is decompressed to melt the molten solder. 2. The electronic component soldering apparatus according to claim 1, wherein the amount of molten solder accumulated is controlled by pulling back the solder and, if less, pressurizing and extruding the molten solder.

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