JP3205423B2 - Soldering method and equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for soldering a linear brazing material to a printed circuit board or the like.

[0002]

2. Description of the Related Art Conventionally, point brazing and linear soldering for attaching a lead wire of a transparent circuit of a panel heater or a liquid crystal panel to a panel heater or a liquid crystal panel on which a transparent electrode (heating film) is deposited on a heat-resistant substrate surface of glass, ceramic or the like. It has been known that brazing is performed using an ultrasonic solder pen. The method of performing linear brazing using this ultrasonic soldering pen is to apply an ultrasonic vibration from the tip of the nozzle to exude solder while moving the ultrasonic soldering pen on a printed circuit board while soldering a solder such as brazing alloy. It is to be attached.

[0003]

However, in the above conventional example, it is difficult to always keep the amount of the brazing alloy leached from the nozzle of the ultrasonic solder pen constant, so that uniformity of quality cannot be maintained. was there. When an ultrasonic solder pen is used, it is troublesome to remove the adhered solder from a pot in which fine parts such as nozzles and nozzle guides are installed after the work is completed. If the thermal efficiency of the brazing filler metal decreases, the flowability of the brazing filler metal deteriorates, causing the nozzle to be clogged.

[0004]

In order to solve the above-mentioned problems, the method of the present invention comprises a method of forming a solder on a substrate 8.
The linear brazing material 2 is sequentially sent out and pressed onto the upper surface of the substrate 8.
In the method of brazing by contacting , both the substrate 8 and the linear brazing material 2 or the substrate 8 are heated in advance, and the linear filter is heated.
By cormorants the tip of the timber 2 is pressed against the upper surface of the substrate 8 or pressed against movement, on the point-like or linear or to the belt-like substrate 8
The I solder became dissolved or semi molten state is deposited, that the depositing dissolving the adhered solder 2a on 8 surface of the substrate by applying ultrasonic vibration at a high temperature that the said adhesion solder 2a reaches the melting point of the solder Features. The apparatus of the present invention for use in the above method is attached to the worktable 15, the plate 7 for placing a substrate 8 for soldering, relatively flat along the surface of the substrate 8 with respect to the plate 7 Moving in the direction and supplying the linear brazing material 2
The holder 4 that presses and attaches the front end of the wire 2 to the surface of the substrate 8, the ultrasonic vibration device 11 that applies ultrasonic vibration to the attached brazing material, and the linear brazing material 2 that is pressed against the surface of the substrate 8
The substrate 8 is attached to the linear brazing material 2 so that the
Preheated to a temperature close to the melting point of
To the melting point of the brazing material during the application of the ultrasonic vibration.
And a heating device for performing a heating operation.

[0005]

[Action] is heated by a heating device provided in linear brazing material 2 and the plate 7 or braze supply holder 4 both or substrate 8 of the substrate 8 to the vicinity of the melting point of the brazing material, the linear brazing material 2 substrate 8 The linear brazing material 2 and the substrate 8 are relatively planarly moved while being pressed upward, and are drawn in a crayon shape.
By applying ultrasonic waves to the upper solder 2a by the ultrasonic vibration device 11, the solder is melted and adhered in a point-like or linear manner, and soldering is performed. For this reason, a constant amount of accurate brazing can always be realized corresponding to the diameter of the linear brazing material 2.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIG.
As shown in FIG. 1, a linear brazing material 2 made of a brazing alloy such as lead, zinc, tin, etc. wound around
The linear brazing material 2 is continuously fed through a feed roller 3 installed in the vicinity, and inserted into the heating holder 4.

The heating holder 4 is provided with a hole 6 through which the brazing material 2 is inserted, and has a hollow inside. The heating holder 4 has a heater (not shown) for heating the linear brazing material 2 which is inserted and moved. Alternatively, it is provided on the outer peripheral surface. The heater passes the linear brazing material 2 passing at a slight speed through the heating holder,
For example, it is preheated to a temperature of about 130 ° C.

On the other hand, on a preheating plate 7 containing a heater (not shown), a substrate 8 made of glass, ceramic or other heat-resistant material is mounted so as to be movable back and forth and left and right. As a result, it is preheated to around the melting point of the linear brazing material 2 (for example, around 190 ° C.). The linear brazing material 2 descending from the tip end of the heating holder 4 by the feeding operation of the feeding drum 1 is moved at a speed of 30 mm / sec while being pressed against the surface of the substrate 8 as shown in FIG. Make a line. The linear brazing material 2 drawn on the substrate 8 adheres to the upper surface of the substrate 8 in a molten or semi-dissolved state to form the adhered solder 2a. In this case, it is possible to heat only one of the linear brazing material 2 and the substrate 8 to melt the linear brazing material 2 on the substrate 8. In order to adhere to both, it is desirable to heat both together as described above. In the case where the solder 2a is formed in a dot shape instead of a linear shape, the brazing material 2 only needs to be pressed against the substrate 8, and the relative movement after the pressing of the brazing material 2 and the substrate 8 is not necessarily required.

As shown in FIG. 3, an ultrasonic vibration is applied by an ultrasonic vibrator 11 to the solder 2a adhered in a linear shape on the substrate 8 while the preheating plate 7 heats the solder 2a to the melting point. 2a is ultrasonically soldered to the surface of the substrate 8. The ultrasonic vibration device 11 may be an existing device in which a horn 13 and a chip 14 are connected to the distal end side of the ultrasonic vibrator 12 in the axial direction to generate ultrasonic vibration of, for example, about 10 KHz to 100 MHZ. As shown in FIG. 4, when the ultrasonic vibration is applied by setting the gap d between the tip of the chip 14 of the ultrasonic vibration device 11 and the surface of the substrate to about 50 μm to 200 μm, the adhered solder 2 a becomes the substrate 8. Above, it is shaped linearly and dissolves and adheres without the need for an antioxidant.

In the above embodiment, the process of attaching the brazing material 2 on the substrate 8 and the process of welding the adhered solder 2a to the surface of the substrate 8 are described as separate processes, but the linear brazing material 2 comes into contact with the substrate 8. The tip 14 of the ultrasonic vibration device 11 can be made to approach and be immediately adjacent to the tip, so that the brazing material can be attached and melted almost simultaneously. Further, as described below, both the brazing material supply device and the ultrasonic vibration device have a single support frame (FIG. 5).
) Can be configured as a single device.

FIG. 5 shows an ultrasonic soldering apparatus (robot) for carrying out the method of the present invention. A movable table 17 which is guided by a linear guide 16 in the front-rear direction on a work table 15 is provided. The preheating plate 7 is mounted on the table 17 and the substrate 8 is mounted on the upper surface of the preheating plate 7.

A gate-shaped holder frame 18 is erected at the left and right ends of the work table 15.
The horizontal rod 19 is provided with a slider 21 that is driven in a horizontal direction along a linear guide 20.
A feed drum 1 for feeding the linear brazing material 2, a feed roller 3, a heating holder 4 and an ultrasonic vibration device 11 are attached to the front of the device, and move in the left-right direction together with the slider 21. The heating holder 4 is provided with a heating device 22, and both the heating holder 4 and the ultrasonic vibration device 11 are attached to the slider 21 so as to be able to move up and down.
Reference numeral 23 denotes an operation panel that projects forward of the work table 15, and is used to set horizontal movement of the table 17 and the slider 21, set up and down the heating holder 4 and the ultrasonic vibration device 11, and stop and start the operation. In addition, the soldering method of the present invention can also be applied to circuits on various substrates having fine shapes and to the attachment of preliminary solder, and its use is extensive.

[0013]

According to the present invention as described above, accurate point brazing at a diameter corresponding to the diameter of the linear brazing material is possible, and a constant amount of brazing at a width corresponding to the diameter of the brazing material is always possible. By adhering the material on the substrate in advance, it is possible to perform brazing with an accurate shape or amount, and to maintain uniformity in quality. In addition, the present invention can be performed by combining existing devices having a simple structure, so that problems such as troublesome post-processing such as removal of adhered solder and failure of fine parts, etc., which were observed when using an ultrasonic soldering pen, have been solved and workability has been improved. , The economy is improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a partially enlarged view showing a linear brazing operation.

FIG. 3 is a perspective view showing an embodiment of the present invention.

FIG. 4 is a partially enlarged view showing a cavitation operation.

FIG. 5 is an overall perspective view showing an example of the device of the present invention.

[Explanation of symbols]

 2 Linear brazing material 2a Adhered solder 4 Heating holder 7 Preheating plate 8 Substrate 11 Ultrasonic vibration device 15 Work table

──────────────────────────────────────────────────続 き Continuing on the front page (72) Kengo Nakano 2-18-18 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd. (72) Tadaharu Tachibana 2-1-2 Marunouchi, Chiyoda-ku, Tokyo Asahi Glass (56) References JP-A-57-10293 (JP, A) JP-A-63-157475 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 3/34 B23K 1/06 B23K 31/02 H05K 3/10 H05K 3/24

Claims (2)

(57) [Claims] 1. A linear solder made of solder on a substrate (8).
The material (2) is sequentially sent out and pressed on the upper surface of the substrate (8).
In the method of brazing by contacting, the substrate (8)
And the substrate (8) are heated in advance , and the leading end of the linear brazing material (2) is pressed against or moved to the upper surface of the substrate (8) . As a result, the substrate (8) is dissolved or semi-dissolved in a dot, line, or band shape on the substrate (8).
And the I solder is deposited, of solder to said adhesion solder (2a)
A soldering method in which the attached solder (2a) is dissolved and attached to the surface of the substrate (8) by applying ultrasonic vibration at a high temperature reaching the melting point . 2. A mounted on the work table (15), the plate (7) for placing the substrate (8) for soldering, along the surface of the substrate (8) relative to the plate (7) relative to move in the planar direction, to supply linear brazing material (2)
Pressing the tip of twisted brazing material (2) to the surface of substrate (8)
The holder (4) to be attached to, ultra the brazing material adhering
Ultrasonic vibration device (11) for applying ultrasonic vibration and linear filter
When the filler material (2) is pressed against the surface of the substrate (8),
The substrate (8) is preheated to a temperature near the melting point of the linear brazing material (2) so as to adhere to the substrate (8), and adheres to the substrate (8).
Of the brazing material during the application of the ultrasonic vibration
A soldering device comprising a heating device for heating to reach the melting point .