JP3257665B2 - Automatic soldering equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic soldering apparatus, and more particularly, to a method of automatically transporting a substrate, applying a flux, and then jetting molten solder in a molten solder bath to mount the substrate on the substrate. The present invention relates to an automatic soldering device for soldering electric components.

[0002]

2. Description of the Related Art At present, an automatic soldering apparatus for jetting molten solder in a molten solder bath from a jet nozzle is used for automatic soldering of a mounted electric component on a substrate. The configuration of the conventional automatic soldering apparatus will be described with reference to FIG. Here, the automatic soldering device is
Flux coating device 11 for spraying flux onto substrate W
4, a preheater 129 for activating the flux applied to the substrate W, a molten solder tank 120 for jetting the molten solder 26 from the jet nozzle 124 to the back surface of the substrate W, and a substrate W between these devices. And a transfer device (not shown) for sending the same.

[0003] The preheater 129 heats and activates the flux applied to the substrate W conveyed on the preheater, thereby removing oxides on the soldering surface and removing the surface of the solder. It plays a role in lowering the tension (improving the solder wettability) and increasing the reliability of soldering.

[0004]

However, in the prior art automatic soldering apparatus, the preheating heater 129 is used.
Since the flux applied to the substrate W is heated while being transported above, the processing line is lengthened, and the apparatus is enlarged. For this reason, in a small-sized automatic soldering apparatus or the like that partially performs soldering, there is a type in which the preheater is omitted. Here, if the preheater is omitted, the device can be downsized.However, when soldering in a molten solder bath, the flux must be heated and activated. ,
It was difficult to properly activate the flux, and it was difficult to enhance the reliability of soldering.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide an automatic soldering apparatus capable of performing highly reliable soldering without using a preheater. It is in.

[0006]

In order to achieve the above object, an automatic soldering apparatus according to claim 1 automatically transports a substrate, applies a flux, and then jets molten solder in a molten solder bath. In an automatic soldering apparatus for soldering an electric component mounted on a board, the board is pre-heated by radiant heat of the solder in the molten solder bath, and the board is pre-heated by heat conduction, and the radiant heat and heat of the solder are applied. It is a technical feature that the preheating of the substrate by conduction is performed by placing the substrate on a preheating table in which a base is immersed in the molten solder bath.

The automatic soldering apparatus according to claim 2 is
Automatically transporting the board, applying the flux, and then spraying the molten solder in the molten solder bath, in an automatic soldering device for soldering the electrical components mounted on the board, the solder bath is divided into two by a partition plate The technical feature is that the substrate is preheated by the radiant heat of the solder in one of the two molten solder baths, and the other is used to solder the electric components mounted on the substrate.

In the automatic soldering apparatus according to the first aspect of the present invention, the substrate is preheated by the radiant heat of the solder in the molten solder bath, so that a preheating heater is not provided.
The flux applied to the substrate can be activated in advance. In addition, since the preliminary heating is performed by heat conduction together with the radiation heat of the solder, the substrate can be efficiently heated.
Further, the substrate is placed on a preheating table with the base immersed in the molten solder bath, and the substrate is preheated by heat conduction through the base and radiant heat from the solder in the molten solder bath.

In the automatic soldering apparatus according to the present invention, the solder bath is divided into two parts by a partition plate , one of which is filled with deteriorated solder and the substrate is preheated, and the other is filled with new solder and the substrate is filled with new solder. Since the mounted electric component can be soldered, the deteriorated solder can be effectively used.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings. FIG. 1 shows an automatic soldering apparatus 10 according to a first embodiment of the present invention. The automatic soldering apparatus 10 performs soldering by jetting molten solder from a jet nozzle 24 and a setting table 12 for setting a substrate (work) W, a flux application apparatus 14 for spraying a flux from an application port 14a. And a work take-out table 40 on which the soldered substrate W is placed, and arms 16A and 16B for transferring the work. In the solder bath 20, a preheating table 22 for preheating the substrate W to activate the flux is provided.

The configuration of the solder bath 20 will be described in more detail with reference to FIG. 2 which shows a longitudinal section of the solder bath. On the lower side of the solder bath 20, the solder 26 is placed at 240 ° C to 25 ° C.
A heater 28 for heating and melting to 5 ° C. is provided. In the solder bath 20, molten solder 26
A preheating table 22 including a base portion 22A immersed in the inside and a mounting portion 22B for mounting the substrate W is provided. The base portion 22A and the mounting portion 22B are made of a metal having high thermal conductivity, such as copper or stainless steel. The mounting portion 22B includes the base portion 22
The heat from the molten solder 26 is conducted through A,
It is directly heated by radiant heat from the solder 26.

Here, the substrate W transported to the mounting portion 22B is heated for about 10 seconds to about 90 ° C. at which the flux is activated. The activated flux is applied to the mounted electric component R attached to the substrate W.
By removing the protruding portions of the lead wires Ra and Rb from the back surface of the substrate and the oxide film of the wiring pattern (not shown) on the back surface of the substrate, that is, removing the oxide film having a high resistance value while flipping the solder, as described later. To make it easy to solder. At the same time, the activated flux lowers the surface tension of the solder to increase the solder wettability, and makes the solder easy to adhere.

On the other hand, the jet nozzle 24 provided in the solder bath 20 is formed in a crank shape, and a rotating blade 25 for pushing up the molten solder 26 upward is provided at a lower portion. The rotary wing 25 is driven by a motor (not shown). On the other hand, a tip opening 24a is formed at the upper part of the jet nozzle 24, and the molten solder 26 pushed up by the rotary wing 25 and jetted from the tip opening 24a is used for the arms 16A and 16B shown in FIG.
Is configured to adhere to the back surface of the substrate W conveyed by. At this time, as described above, the mounting portion 22B
Is heated, the flux of the substrate W is activated, and the protruding portions of the lead wires Ra and Rb of the mounted electric component R from the back surface of the substrate and the oxide film on the wiring pattern portion on the back surface of the substrate are removed. In addition, the solder whose wettability is enhanced by the activated flux is uniformly and evenly applied to the adhered portion. Further, since the flux is activated by previously heating the substrate W, the soldering can be completed in a short time.

Here, the soldering process by the automatic soldering apparatus 10 will be described with reference to FIGS. When the operator mounts the mounting electronic component (resistor) R for unitary adjustment on the substrate W (see FIG. 2) and places the substrate W on the set table 12, the automatic soldering apparatus 10
Alternatively, the arm 16B is lowered to hold the substrate W. Then, after raising the arm once, the flux coating device 1
4 and is again lowered to the flux application device 14 side, and the flux sprayed from the application port 14 a of the flux application device 14 is applied to the substrate W. Then, after raising the arm once, it is sent to just above the preheating table 22,
The substrate W is lowered to the preheating table 22 side, and the substrate W is placed on the preheating table 22 for about 10 seconds to activate the substrate W at 90 ° C.
Preheat until

Subsequently, after raising the arm, the arm is horizontally moved to a position immediately above the jet nozzle 24. Then, after being lowered to the jet nozzle 24 side, the substrate W is transported horizontally, and the molten solder jetted from the jet nozzle 24 is applied to the back surface of the substrate, and the substrate W is applied to the substrate W as described above with reference to FIG. The lead wires Ra and Rb of the mounted electrical component R and the wiring pattern on the back surface of the board are connected by soldering. When the soldering is completed, the arm is raised and then horizontally moved to a position immediately above the work take-out table 40. Thereafter, the arm is lowered to release the grip, and the substrate W is placed on the work take-out table 40. The operator collects the board W after the soldering.

In the configuration of the first embodiment, the preheating time in the preheating table 22 is set to about 10 seconds,
Although the flux of the substrate W was raised to the activation temperature (90 ° C.), the heating time was increased by adjusting the height of the base 22A of the preheating table 22 and moving the mounting portion 22B away from or closer to the molten solder 26. Can be adjusted.

Next, a second embodiment of the present invention will be described with reference to FIG. The configuration of the automatic soldering apparatus of the second embodiment is the same as that of the first embodiment described above with reference to FIG.
And a description thereof will be omitted.

As shown in FIG. 3, a jet nozzle 2 is provided above the solder bath 20 of the automatic soldering apparatus according to the second embodiment.
A cover 30 made of a metal having good thermal conductivity and having an opening 30b is attached around the periphery of the cover 4. A mounting portion 30a for mounting the substrate W is formed on the cover 30 on the side of the flux coating device 14 shown in FIG. 1 (right side in the figure). The mounting portion 30a is heated by radiant heat from the molten solder 26.

In the automatic soldering apparatus according to the second embodiment, the substrate W coated with the flux by the flux coating apparatus 14 shown in FIG. 1 is mounted on the mounting portion 30a and heated to 90 ° C. As a result, the flux is activated, the protruding portions of the lead wires Ra and Rb of the mounted electric component R from the back surface of the substrate, and the oxide film of the wiring pattern on the back surface of the substrate are removed. The solder having enhanced wettability is uniformly and uniformly applied to the adhered portion. Further, also in this embodiment, since the flux is activated by heating the substrate W in advance, the soldering can be completed in a short time.

Next, an automatic soldering apparatus according to a third embodiment of the present invention will be described with reference to FIG.
The configuration of the automatic soldering apparatus of the second embodiment is the same as that of the first embodiment described above with reference to FIG. 1 except for the solder bath 20, so that the description will be omitted with reference to FIG.

As shown in FIG. 4, the solder bath 20 of the automatic soldering apparatus according to the third embodiment is separated by a partition plate 32 into an A solder bath 20A and a B solder bath 20B. In 20A, soldering is performed by the jet nozzle 24, and in the B solder bath 20B, the substrate W is brought close to the surface of the solder 26, and the flux is preheated by radiant heat from the solder. That is, in the above-described second embodiment, the cover 30 on which the substrate W is placed is heated by the radiant heat from the solder, but in the third embodiment, the substrate W is directly heated by the radiant heat from the solder 26.

Here, an A solder bath 20 for soldering
When the solder 26 is heated in A, the solder surface is oxidized to form a film. The worker scoops the deteriorated solder 26 containing the oxide film and transfers it to the B solder tank 20B side. Therefore, in the configuration of the third embodiment, the deteriorated solder can be effectively used.

[0027]

As described above, in the automatic soldering apparatus according to the first aspect, since the substrate is preheated by the radiant heat of the solder in the molten solder bath, the substrate is applied to the substrate without providing a heater for preheating. The flux can be pre-activated. Therefore, the oxide film on the soldered portion is removed, and the solder wettability of the portion is increased, so that the solder can be evenly and evenly applied, and the reliability of the soldering can be improved. Further, since the flux is activated by heating the substrate in advance, the soldering can be completed in a short time. In addition, since the preliminary heating is performed by heat conduction together with the radiation heat of the solder, the substrate can be efficiently heated. Further, the substrate can be placed on a preheating table in which the base is immersed in the molten solder bath, and the substrate can be preheated by heat conduction through the base and radiant heat from the solder in the molten solder bath.

In the automatic soldering apparatus according to the present invention, the solder bath is divided into two parts by a partition plate , one of which is filled with degraded solder and the substrate is preheated, and the other is filled with new solder and the substrate is filled with new solder. Since the mounted electric component can be soldered, the deteriorated solder can be effectively used.

[Brief description of the drawings]

FIG. 1 is a perspective view of an automatic soldering apparatus according to a first embodiment of the present invention.

FIG. 2 is a longitudinal sectional view of a solder bath of the automatic soldering apparatus according to the first embodiment.

FIG. 3 is a longitudinal sectional view of a solder bath of the automatic soldering apparatus according to the second embodiment.

FIG. 4 is a longitudinal sectional view of a solder bath of the automatic soldering apparatus according to the third embodiment.

FIG. 5 is a configuration diagram of an automatic soldering apparatus according to the related art.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Automatic soldering apparatus 14 Flux coating apparatus 16A, 16B Arm 20 Solder tank 22 Preheating table 22B Base 24 Jet nozzle 26 Solder 30 Cover 32 Partition board W Board

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 3/34 B23K 1/08 B23K 31/02 310

Claims (2)

(57) [Claims] 1. An automatic soldering apparatus for automatically transporting a substrate, applying a flux, and then jetting molten solder in a molten solder bath to solder an electric component mounted on the substrate. Preheating the substrate by radiant heat of the solder, preheating the substrate by heat conduction, preheating the substrate by the radiant heat of the solder and heat conduction, the preheating table with a base immersed in the molten solder bath An automatic soldering apparatus characterized by performing by placing a substrate. Wherein automatically transporting the substrate, after the application of the flux, by jets of molten solder of the molten solder bath, in an automatic soldering apparatus for soldering an electrical component mounted on the substrate, partition the solder bath 2 is divided by the plate, the substrate is preheated by solder radiant heat bisected one molten solder bath, the automatic soldering apparatus, characterized in that soldering electrical components mounted on the board by the other.