JPS63295057A - Solder coating device - Google Patents
Solder coating deviceInfo
- Publication number
- JPS63295057A JPS63295057A JP12818387A JP12818387A JPS63295057A JP S63295057 A JPS63295057 A JP S63295057A JP 12818387 A JP12818387 A JP 12818387A JP 12818387 A JP12818387 A JP 12818387A JP S63295057 A JPS63295057 A JP S63295057A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- substrate
- excess
- solder coating
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 41
- 239000011248 coating agent Substances 0.000 title claims abstract description 20
- 238000000576 coating method Methods 0.000 title claims abstract description 20
- 239000000919 ceramic Substances 0.000 claims abstract description 15
- 238000005476 soldering Methods 0.000 claims abstract description 15
- 229920001971 elastomer Polymers 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims abstract description 7
- 239000007921 spray Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 16
- 230000004907 flux Effects 0.000 abstract description 5
- 238000007664 blowing Methods 0.000 abstract description 3
- 229920002379 silicone rubber Polymers 0.000 abstract description 3
- 239000004945 silicone rubber Substances 0.000 abstract description 3
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- 239000007789 gas Substances 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は回路基板の導体部のはんだコーティングに係り
、特にセラミック基板に好ａなはんだコーティング装置
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to solder coating of conductor portions of circuit boards, and particularly to a solder coating apparatus suitable for ceramic substrates.
配＃基板にはんだ付けする方法は、例えば特開〜昭６１
−２２２６７号公報に記載されているようなフ二−ンル
ダーリング装置で、行なわれている。しかし、この方法
でははんだの付着量が過剰となり、また、スルーホール
穴の中のはんだは、そのまま穴ずまりとなるため、はん
だの５すい膜を形成するには、このままでは使用できな
い。また、はじめからはんだコーティングを主眼とした
装置も公知ではあるが、現在提案実用化したものは、エ
ポキシ樹脂やフェノール樹脂をベースとしたプリント基
板用のものであり、セラミック基板への配退かされてい
ない。ここでプリント基板用のはんだコーティング装置
を述べてお（と、はんだを溶融した槽の中に７ラツクス
を塗布したプリント基板を垂直に浸漬して後数秒後に引
き上げ始めるこの時にはんだの溶融槽上に熱風を吹きつ
け表面およびスルーホール穴内の過剰なはんだを吹き落
す方法が実用化している。The method of soldering to the wiring board is described, for example, in Japanese Patent Application Laid-open No.
This is carried out using a fin-rudering device as described in Japanese Patent No. 22267. However, in this method, the amount of solder deposited is excessive, and the solder in the through-hole remains as a hole, so it cannot be used as is to form a five-layer film of solder. In addition, although there are already known devices that were originally intended for solder coating, the ones that have been proposed and put into practical use are for printed circuit boards based on epoxy resins and phenolic resins, and they are not suitable for ceramic substrates. Not yet. Here, we will describe a solder coating device for printed circuit boards (a printed circuit board coated with 7 lux is dipped vertically into a bath containing molten solder, and after a few seconds it begins to be pulled up. A method of blowing off excess solder on the surface and in the through-holes by blowing hot air has been put into practical use.
しかし、上記のプリント基板用のコーティング装置でセ
ラミック基板をコーティングＩ、ようと丁−るとプリヒ
ート機能が付滑していないために、セラミックに急激な
熱ストレスが加わり、クラックや、破損の原因となる。However, when coating a ceramic board with the above-mentioned printed circuit board coating equipment, the preheating function does not slip, causing sudden thermal stress to be applied to the ceramic, causing cracks and damage. Become.
またプリント基板のようにたとえば５００ｍｍ Ｘ ５
００ｍｍの大面積で処理できなイセラミック基板は最大
でも１００ｍｒｌＬ×１００ｒＩＬｒｎ程でありプリン
ト基板用はんだコーティング装置では作業効率が悪い。Also, like a printed circuit board, for example, 500mm x 5
Iceramic substrates that cannot be processed with a large area of 00 mm are about 100 mrlL x 100rILrn at the maximum, and the work efficiency is poor in solder coating equipment for printed circuit boards.
そこで本発明の装置は、はんだ付け作業効率のよいフロ
ーソルダリング装置をペースとしてその前後を改良し、
セラミック基板用のはんだコーティング装置とした。Therefore, the device of the present invention improves the front and back of the flow soldering device, which has high soldering work efficiency, and
This is a solder coating device for ceramic substrates.
上記のようなセラミック基板に対応したはんだコーティ
ング装置を実現するために前述したような一般のフロー
ソルダリング装置を前提にしてフラックス塗布、プリヒ
ート、フローソルダーの工程をそのまま使用することで
はんだ付け作業の効率を向上することにして、その７０
−ソルダーの直後に過剰なはんだを除去するために次の
装置を取り付けた。まず表面の過剰なはんだを耐熱性の
よ（・ゴム状のスキージでかき取るこの時同時ｖｃ基−
板の上面もしくは上面下面の両面にはんだを溶融する温
度をもった液体もしくは気体を吹きつけてスルーホール
大円の過剰なはんだを吹き飛ばす。In order to realize a solder coating device that is compatible with ceramic substrates as described above, the soldering work can be completed by using the flux application, preheating, and flow soldering processes as they are on the premise of the general flow soldering device described above. Deciding to improve efficiency, part 70
- Installed the following equipment to remove excess solder immediately after soldering. First, scrape off the excess solder on the surface with a heat-resistant rubber squeegee.
Excess solder in large circles of through holes is blown off by spraying liquid or gas at a temperature that melts the solder on both the upper and lower surfaces of the plate.
このような方法で表面およびスルーホール大円に均一な
膜厚のはんだコーティングを施すことができる。With this method, it is possible to apply a solder coating of uniform thickness to the surface and the large circle of the through hole.
上記の方法においてゴムスキージは例えば、シリコーン
ゴムのような耐熱性の良い材料で且つセラミック基板面
の数ｍμ〜数十ｍμの凹凸に追従できるやわらかさをも
つものであればよい。また同時に吹きつける高温気体あ
るいは液体は、気体の場合は空気もしくは窒素ガスのよ
うな不活性ガスでもよい。液体の場合はシリコンオイル
やグリセリンのような熱分解しにくく沸点の高いオイル
で良い。なおはんだコート後は基板を冷却する工程と、
フラックス残渣やオイル残渣を洗浄する工程が盛装であ
る。In the above method, the rubber squeegee may be made of a material with good heat resistance, such as silicone rubber, and is soft enough to follow irregularities of several microns to several tens of microns on the surface of the ceramic substrate. The high temperature gas or liquid that is simultaneously blown may be air or an inert gas such as nitrogen gas. If it is a liquid, an oil that is difficult to thermally decompose and has a high boiling point, such as silicone oil or glycerin, may be used. After coating with solder, there is a process of cooling the board,
The process of cleaning flux and oil residues is the process of cleaning.
以下本発明の一実施例を第１図、第２図にょつ説明する
。はんだコートを必要とする基板１を図１の断面図のよ
うに矢印方向に定速移動させつつ発泡式の７ラクサー５
でブランクスを塗布した。An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. While moving the board 1 that requires solder coating at a constant speed in the direction of the arrow as shown in the cross-sectional view of FIG.
I applied the blank.
ついでプリヒータ２で基板温度を１２０℃に加熱後２４
０℃に温度ＰＡ繁を行なったフロ一式のはんだ槽４では
んだ付けを行なった。しかる後に本発明のシリコーンゴ
ム５Ｖｃより基板表面の過剰なはんだを取り除きつつノ
ズル６にて２５０〜２５０℃に加熱した空気を吹きつけ
た。その結果第２図に示すように均一な（約３〜７μｍ
）のはんだコートの膜を形成できた。Then, after heating the substrate temperature to 120℃ with preheater 2,
Soldering was carried out in a solder bath 4 of a flow set, which was heated to 0°C. Thereafter, while removing excess solder from the surface of the substrate using silicone rubber 5Vc of the present invention, air heated to 250 to 250 DEG C. was blown through a nozzle 6. As a result, as shown in Figure 2, a uniform (approximately 3 to 7 μm)
) was able to form a solder coat film.
本発明によれば一般の７０一式はんだ付けラインの一部
に過剰なはんだを除去する耐熱スキージゴムとスルーホ
ール大円のはんだを除去する高温ガスか液体の噴出ノズ
ルを設置すれば良（、新りに専用の装置を準備する必要
はない。さらに、従来、セラミック基板用のはんだコー
ティング装置は温泉され″〔いなかったが、不発明によ
り、セラミック基板にダメージをあたえることな（しか
も作業住良くはんだコートを施すことが可能となもなお
本発明によれば、セラミック基板のみならず、プリント
基板等の別材料をペースとした回路板にもはんだコート
を施すことが可能であり、両面にはんだコートする時は
、２回に分けてコーティングすることも可能である。According to the present invention, it is only necessary to install a heat-resistant squeegee rubber to remove excess solder and a high-temperature gas or liquid jet nozzle to remove solder from a large circle of through-holes in a part of a general 70-set soldering line. There is no need to prepare a dedicated device for soldering.Furthermore, in the past, solder coating equipment for ceramic substrates has not been hot-springed. However, according to the present invention, it is possible to apply a solder coat not only to a ceramic board but also to a circuit board made of another material such as a printed circuit board, and it is possible to apply a solder coat to both sides. When applying the coating, it is also possible to apply the coating in two parts.
第１図は本発明によるはんだコーティング装置の一実施
例を示す断面図、第２図は第１図に示す装置によりはん
だコートしたセラミック基板の断面構造を示す断面図で
ある。
１・・・セラミック基板
２・・・プリヒーター
５・・・フラックス塗布装置（フラクサー）４・・・は
んだ！（フローソルダー）
５・・・スキージFIG. 1 is a cross-sectional view showing an embodiment of a solder coating apparatus according to the present invention, and FIG. 2 is a cross-sectional view showing the cross-sectional structure of a ceramic substrate coated with solder by the apparatus shown in FIG. 1...Ceramic board 2...Preheater 5...Flux applicator (fluxer) 4...Solder! (Flow solder) 5... Squeegee
Claims (1)
トを行なうために、一般のフローソルダリング装置で基
板表面とスルーホール部にはんだ付け後ただち過剰な表
面はんだを除去するための耐熱性の高いゴムスキージと
、スルーホール穴内の過剰なはんだを除去するための高
温液体もしくは気体を吹きつけるノズルを配したことを
特徴とするはんだコーティング装置。1. In order to coat a ceramic board with through holes with solder, a heat-resistant rubber squeegee and a heat-resistant rubber squeegee are used to remove excess surface solder immediately after soldering on the board surface and through-hole area using a general flow soldering machine. , a solder coating device characterized by being equipped with a nozzle that sprays high-temperature liquid or gas to remove excess solder inside the through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12818387A JPS63295057A (en) | 1987-05-27 | 1987-05-27 | Solder coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12818387A JPS63295057A (en) | 1987-05-27 | 1987-05-27 | Solder coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63295057A true JPS63295057A (en) | 1988-12-01 |
Family
ID=14978487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12818387A Pending JPS63295057A (en) | 1987-05-27 | 1987-05-27 | Solder coating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63295057A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03211788A (en) * | 1990-01-16 | 1991-09-17 | Tokyo Print Kogyo Kk | Method of manufacturing printed wiring board |
| JPH04163990A (en) * | 1990-10-29 | 1992-06-09 | Metsuku Kk | Improved soldering method |
| JPH05343835A (en) * | 1992-06-04 | 1993-12-24 | Metsuku Kk | Method and apparatus for finishing of coating solder |
| WO2003053628A1 (en) * | 2001-12-20 | 2003-07-03 | Honeywell Advanced Circuits, Inc. | Scavenging system and method |
| US6840425B2 (en) * | 2000-05-31 | 2005-01-11 | Ttm Advanced Circuits, Inc. | Scavenging system |
-
1987
- 1987-05-27 JP JP12818387A patent/JPS63295057A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03211788A (en) * | 1990-01-16 | 1991-09-17 | Tokyo Print Kogyo Kk | Method of manufacturing printed wiring board |
| JPH04163990A (en) * | 1990-10-29 | 1992-06-09 | Metsuku Kk | Improved soldering method |
| JPH05343835A (en) * | 1992-06-04 | 1993-12-24 | Metsuku Kk | Method and apparatus for finishing of coating solder |
| US6840425B2 (en) * | 2000-05-31 | 2005-01-11 | Ttm Advanced Circuits, Inc. | Scavenging system |
| WO2003053628A1 (en) * | 2001-12-20 | 2003-07-03 | Honeywell Advanced Circuits, Inc. | Scavenging system and method |
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