JP2008296265A - Soldering device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a soldering device capable of performing soldering of high quality. <P>SOLUTION: The soldering device 1 includes: a heating/melting part 5 melting solder; and a tip member 8 applying vibration to the solder in a melted state fed from the heating/melting part 5. The heating/melting part 5 and the tip member 8 are closely arranged without being contacted with each other. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a soldering apparatus that attaches solder to a portion to be soldered in the form of dots, lines, or strips.

  As a method for performing soldering on ceramics or glass, which is a difficult soldering material, a method of applying ultrasonic waves to molten solder has been proposed.

  Patent Document 1 and Patent Document 2 disclose an apparatus that has a hole penetrating through a soldering iron tip to which ultrasonic waves are applied and supplies the melted solder through the hole and applies ultrasonic waves to perform soldering. .

  Further, in Patent Document 3, a linear solder is pressed onto a substrate so that the solder is dissolved and adhered to the substrate in a dotted or linear shape in advance, and ultrasonic waves are applied to the molten solder by heating the substrate. A soldering method is disclosed in which solder is deposited on a substrate in the form of dots or lines.

On the other hand, in Patent Document 4, a heated brazing iron provided with ultrasonic vibration is pressed against a solid brazing material, and the molten brazing material is supplied to the surface of the base material while holding the molten brazing material on the pressing surface side. The supply method is disclosed.
Japanese Patent No. 1506240 Japanese Utility Model Publication No. 57-191045 Japanese Patent No. 3205423 Japanese Patent No. 2691685

  An object of the present invention is to provide a soldering apparatus or a soldering method capable of high-quality soldering.

  Examples of specific problems in the prior art will be described below.

  In the case of the inventions disclosed in Patent Document 1 and Patent Document 2, ultrasonic waves also act on the melted solder in the through holes. For this reason, if the ultrasonic vibration intensity or vibration frequency slightly fluctuates, phenomena such as molten solder staying in this through-hole or being ejected vigorously occur, and solder cannot be supplied stably. There is a case. That is, since the supply amount of the melted solder and the amplitude and frequency of the ultrasonic vibration are not independent, the supply amount cannot be controlled, and there may be a situation where the soldering quality is deteriorated due to excessive or insufficient solder.

  Further, in the case of the invention disclosed in Patent Document 3, it is necessary to apply an ultrasonic wave by heating the substrate to be soldered at a temperature of, for example, 190 ° C. or higher in order to maintain the solder in a molten state. For this reason, since the solder is maintained in a dissolved state on the substrate until the ultrasonic wave is applied and completed over all the solder that has been dissolved and adhered in advance in the form of dots or lines, the solder is oxidized and welded. Defects may occur. Furthermore, patterns and components formed on the soldered substrate may be exposed to high temperatures for a long time, and thus may be seriously damaged by heat deterioration.

  Further, it is necessary to apply ultrasonic waves along the same trajectory after the solder melted in the form of dots or lines on the substrate to be soldered in advance. For example, using an operating device having X, Y, and Z axes that operate orthogonally to each other, the X and Y operating axes are parallel to the substrate, and a means for pre-dissolving and adhering solder to the Z axis and applying ultrasonic waves are applied. Consider a case in which the means are mounted apart. In this case, if a solder having a dotted or linear shape is attached to the substrate to be soldered in advance along a locus with curvature or bending, it is possible to move the means for applying ultrasonic waves along the same locus. It becomes difficult.

  Therefore, when using an XYZ triaxial drive device, the step of pre-dissolving and adhering the solder and the step of applying ultrasonic waves to the solder must be performed in separate steps. End up. In other words, first, a spot-shaped or linear melted solder is previously deposited on the substrate to be soldered by means for pre-melting and attaching the solder attached to the Z-axis. Next, it is necessary to change the ultrasonic application means to the same Z axis and move the X-Y axis along the track of the adhered solder to apply ultrasonic waves to the solder on the molten substrate. In this case, the time during which the solder is melted on the substrate becomes long, and there may occur a technical problem that causes serious quality deterioration such as a welding failure due to the oxidation of the solder and a thermal failure of a pattern or component on the substrate.

  In the case of the invention disclosed in Patent Document 4, when the solder is attached to the substrate in a continuous spot-like soldering or in the form of a wire or a strip, the temperature of the heating iron is lost as the heat of melting of the solder. As a result, the temperature of the iron falls. For this reason, the subject that a soldering defect generate | occur | produces and continuous soldering cannot be performed occurs.

  In order to solve this problem, there are a method of heating the iron in advance, for example, to 450 ° C. or higher, which is much higher than the melting point of the solder, and a method of increasing the heat conduction of the iron and bringing it close to a heat source such as a heater. . However, in the former case, the solder may be oxidized to cause poor welding. In the latter case, the entire iron is large and heavy. For this reason, a large amount of power is required to obtain the desired ultrasonic vibration. Furthermore, when the shape of the iron becomes complicated, multiple oscillation (resonance) frequencies appear at close frequencies, and oscillation occurs due to deformation of the iron and other shapes. Problems such as instability can also occur.

In order to achieve high-quality soldering, the soldering apparatus of the present invention includes a melting part that heats and melts unmelted solder to a temperature equal to or higher than a temperature at which the solder melts, and a vibration part that vibrates the solder. , And
The vibrating portion is applied to the object to which the solder is applied in a state where the solder is vibrated,
The melting part and the vibration part are arranged integrally so as not to contact each other,
Solder melted from the melted portion is applied to the vibrating portion.

  According to the present invention, high-quality soldering is possible.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
(First embodiment)
FIG. 1 is a schematic external view of a soldering apparatus according to the present embodiment, and FIG. 2 is a partially enlarged view of an A portion in FIG.

  In addition, in this application, a soldering apparatus means the apparatus which provides solder to a target object. Therefore, it may include a form that is a device having a function of bonding a plurality of members to be bonded by the applied solder (at least one of the plurality of members becomes an object to which the solder is applied) That function is not essential.

  The soldering device 1 includes a solder supply device 3, a preheating unit 4, a heating and melting unit 5, an ultrasonic generation unit 6, an ultrasonic horn 7, a tip member 8, a heating panel 10, and a control unit 20. And have.

  The solder 2 is a substantially continuous solder having a thread shape or a belt shape, and is wound in a coil shape. The solder 2 has, for example, a composition mainly composed of lead-free tin: Sn-3.0Ag-0.5Cu (melting point: 217 ° C. to 219 ° C.).

  In the present application, the solder functions as an adhesive that bonds a plurality of members and includes a metal. In particular, an alloy can be preferably used.

  The solder supply device 3 sends the solder 2 wound in a coil shape to the preheating unit 4.

  The preheating unit 4 is a member for heating the solder 2 to such an extent that the solid state can be maintained. The preheating unit 4 has, for example, a structure in which a heater wire is wound around a cylindrical stainless steel tube, and the solder 2 supplied into the cylinder from the solder supply device 3 is heated by the heater wire and preliminarily heated. To do.

  The heating and melting part 5 which is a melting means for melting the solder is attached to the tip of the preheating part 4 and melts the solder 2 preheated by the preheating part 4. The heating / melting part 5 may also have, for example, a structure in which a heater wire is wound around a stainless steel tube, like the preheating part 4. In this case, the stainless steel tube is hollow, and the inside of the tube becomes a solder path. In this path, the solder is heated and melted. The material of the preheating unit 4 and the heating and melting unit 5 is not limited to stainless steel, and may be any other metal, and any material may be used as long as it has good heat conduction characteristics. The heating melting part 5 corresponds to the melting part in the present invention, and unmelted solder is supplied from the preheating part 4, and the supplied solder is heated to a temperature equal to or higher than the temperature at which the solder melts. Melt the solder. The melting temperature refers to the melting point.

  The ultrasonic generator 6 is for generating ultrasonic waves for applying ultrasonic waves to the melted solder 2. The ultrasonic horn 7 is for transmitting the ultrasonic wave generated by the ultrasonic generator 6 to the tip member 8 attached to the tip of the ultrasonic horn 7.

  The tip 8 corresponds to the vibration part in the present invention. The tip member 8 is for applying an ultrasonic wave to the melted solder 2, and is disposed close to the heating and melting part 5 without contacting each other. That is, the tip member 8 and the heating / melting part 5 are not in contact with each other and are disposed apart from each other, so that the ultrasonic waves do not directly act on the melted solder in the heating / melting part 5. That is, the heating and melting part 5 is not affected by the fluctuation of the ultrasonic vibration intensity or vibration frequency. Therefore, the heat-melting part 5 can discharge a fixed amount of molten solder stably without the molten solder staying in the heat-melting part 5 or being vigorously discharged.

  Further, since the tip member 8 and the heating and melting part 5 are arranged close to each other, the melted solder can be discharged to the side surface 11 of the tip member 8. The molten solder discharged to the side surface 11 of the tip member 8 flows between the bottom 12 and the substrate 9 along the side surface 11. That is, the molten solder discharged from the heating and melting portion 5 flows substantially coaxially with the tip member 8. The heating and melting part 5 and the tip part 8 are integrated. The substrate that is the object to which the solder is applied and the integrated structure of the heating and melting portion 5 and the tip portion 8 are relatively movable. When changing the position to which the solder is applied, either the integrated structure of the heating and melting portion 5 and the tip portion 8 or the substrate 9 may be moved. Accordingly, it is possible to apply ultrasonic waves by the tip member 8 along the same locus while adhering the melted solder in a dotted or linear shape along a locus having a curvature or a bend. For this reason, it is not necessary to maintain the solder in a molten state on the substrate 9, and the solder is not oxidized and a welding failure does not occur. Further, the pattern and parts of the substrate 9 are not exposed to a high temperature for a long time and are not seriously damaged by heat deterioration.

  In addition, since the heating and melting portion 5 and the tip member 8 are arranged close to each other, the molten solder is supplied to the tip member 8. For this reason, the temperature drop of the tip member 8 can be extremely reduced. As a result, since a mechanism for preventing the temperature drop of the tip member 8 is not required, the apparatus can be simplified by making the ultrasonic horn 7 and the tip member 8 into a light and simple rod shape such as a cylinder or a prism. It becomes. And, by making the ultrasonic horn 7 and the tip member 8 into a light and simple rod shape such as a cylinder or a prism, it becomes possible to apply ultrasonic waves with stable oscillation frequency and amplitude, and high quality soldering is possible. Become.

  Furthermore, since the tip member 8 and the heating / melting portion 5 are arranged close to each other without being in contact with each other, soldering can be performed in a short time, thereby preventing thermal deterioration of the circuit patterns and components on the substrate 9. it can. That is, as described above, the heating and melting portion 5 can flow the molten solder substantially coaxially with the tip member 8. For this reason, it is not necessary to maintain the solder in a molten state on the substrate 9, so that the solder is not oxidized and a welding failure does not occur, and the pattern and parts of the substrate 9 are seriously exposed to a high temperature for a long time. There is no such thing as a serious heat deterioration failure.

  The heating board 10 is for mounting and heating the board 9 to be soldered.

  The control unit 20 controls each part of the soldering apparatus 1. That is, the control unit 20 performs temperature control of the preheating unit 4, the heating and melting unit 5, the tip member 8, and the heating panel 10. The temperature control of the substrate 9 is performed by controlling the temperature of the heating board 10. Further, the control unit 20 performs control of the solder supply speed by the solder supply device 3, control of the amplitude and frequency of ultrasonic vibration of the ultrasonic generator 6, and drive control of the heating unit 10.

  The temperature control of each part by the control part 20 is preferably controlled as follows.

  It is preferable to control the temperature of the preheating unit 4 so that the temperature is equal to or lower than the melting point of the solder. Thereby, the solder 2 can be kept in a solid state, and the solder feeding, stopping or returning operation by the solder supply device 3 can be performed with high sensitivity.

  It is preferable to control the heating board 10 so that the temperature of the substrate 9 can be heated to be equal to or lower than the melting temperature of the solder 2. Thereby, since the solder on the board | substrate 9 returns to solid, it can reduce that a solder oxidizes on the board | substrate 9. FIG.

  It is preferable to control the temperature of the heating and melting portion 5 and the tip member 8 of the ultrasonic horn 7 to be equal to or higher than the melting temperature of the solder. As a result, the molten solder can be supplied to the bottom 12 of the tip member 8 and the narrow portion of the substrate 9, and the ultrasonic wave can be efficiently applied to the solder by maintaining the molten state of the solder. The heating and melting unit 5 compensates for the amount of heat lost to the substrate 9 during soldering by setting the temperature of the heating and melting unit 5 to be higher than the temperature of the tip member 8 of the ultrasonic horn 7. can do. Thereby, the temperature drop of the tip member 8 is suppressed, and it is possible to stably apply ultrasonic waves to the solder while maintaining a constant temperature.

  The higher the temperature of the heating and melting portion 5 is, the more the heat lost to the substrate 9 during soldering can be compensated, and the temperature drop of the tip member 8 can be effectively suppressed. However, when the heating and melting unit 5 and the preheating unit 4 are configured by, for example, winding the heater around the same stainless steel tube and changing the temperature, the temperature of the preheating unit 4 increases due to heat conduction, and the preheating unit Solder melts in the tube 4. In this case, the solder feeding / stopping / returning operation may be slow. Therefore, a configuration may be adopted in which the heat-melting portion 5 and the preheating portion 4 are separated and a heat insulating material or the like is disposed therebetween.

  In the soldering apparatus 1 of the present embodiment, for example, the temperature of the preheating unit 4 and the substrate 9 heated by the heating panel 10 is set to be 200 ° C. or less, for example, equal to or lower than the melting temperature of the solder 2. To control. Then, the temperatures of the heating and melting portion 5 and the tip member 8 of the ultrasonic horn 7 are controlled so that, for example, the respective temperatures equal to or higher than the melting temperature of the solder are 350 ° C. and 250 ° C.

  Next, the soldering method by the soldering apparatus 1 of this embodiment is demonstrated.

  The solder supply device 3 sends the solder 2 wound in a coil shape to the preheating unit 4 continuously or intermittently. The solder 2 supplied to the preheating unit 4 is heated to such an extent that the preheating unit 4 can maintain a solid state.

  The solder 2 heated by the preheating unit 4 is melted in the heating and melting unit 5 and discharged. The molten solder is supplied to the side surface 11 of the tip member 8 disposed in close proximity to the heating and melting portion 5 without contacting each other.

  The melted solder flows along the side surface 11 toward the bottom 12 of the tip member 8 and the substrate 9. The melted solder that has flowed in the direction of the bottom portion 12 of the tip member 8 and the substrate 9 is applied with ultrasonic waves from the tip member 8 and is soldered on the substrate 9 in the form of dots or lines. In addition, the soldering apparatus 1 and the heating board 10 may be attached to an operating shaft made up of an XYZ axis (not shown), and one or both of them may be moved.

As described above, according to the soldering apparatus 1 of the present embodiment in which the tip member 8 and the heating and melting portion 5 are disposed in close proximity to each other, the following effects can be obtained.
1. Since the heating and melting part 5 and the tip member 8 are not in contact with each other, the preheating part 4 and the heating and melting part 5 are not affected by the ultrasonic waves. Thereby, a fixed amount of melted solder can be supplied to the tip member 8, and a certain amount of soldering is possible.
2. Since the heating and melting portion 5 and the tip member 8 are disposed close to each other, it is not necessary to hold the solder 9 in advance on the substrate 9 in a state where the solder is dissolved. This makes it possible to perform soldering with high reliability by preventing solder oxidation and thermal deterioration of patterns and circuit components on the substrate.
3. Since the heating and melting portion 5 and the tip member 8 are arranged close to each other, molten solder is supplied to the tip member 8, and a temperature drop of the tip member 8 can be prevented. Thereby, it becomes possible to make an ultrasonic wave act stably on molten solder, and high quality soldering is attained.
4). The temperature drop of the tip member 8 can be prevented. This eliminates the need for a mechanism for preventing the temperature drop of the tip member 8, so that the apparatus can be simplified by making the ultrasonic horn 7 and the tip member 8 into a light and simple rod shape such as a cylinder or a prism. It becomes.
5. The ultrasonic horn 7 and the tip member 8 can be made into a light and simple rod shape such as a cylinder or a prism. As a result, it is possible to apply an ultrasonic wave having a stable oscillation frequency and amplitude, and high-quality soldering is possible.
(Second Embodiment)
FIG. 3 is a schematic external view of the soldering apparatus of the present embodiment, and FIG. 4 is a partially enlarged view in which a portion B in FIG. 3 is enlarged.

  In the first embodiment, the heating and melting portion 5 is provided as the melting means at the tip portion of the preheating portion 4. On the other hand, the melting means of the soldering apparatus 100 of this embodiment includes a soldering iron 51. Since other basic configurations, temperature settings, and the like are the same as those of the soldering apparatus 1 of the first embodiment, detailed description thereof is omitted. The same components as those in the first embodiment will be described using the reference numerals used in the first embodiment.

  The heating and melting part 5 is disposed at a position where it does not contact the tip member 8 as in the first embodiment. For this reason, since it is not influenced by the ultrasonic wave, a fixed amount of solder in a dissolved state can be supplied to the tip member 8, and a certain amount of soldering is possible.

  The soldering iron 51 is disposed in close proximity to the tip member 8 without contacting each other, and the solder 2 supplied from the heating and melting part 5 is melted and supplied to the side surface 11 of the tip member 8. In other words, the soldering iron 51 is disposed at a position where the molten solder can be poured substantially coaxially with the tip member 8.

The soldering apparatus 100 of the present embodiment having the above configuration can obtain the same operational effects as those of the first embodiment.
(Shape of melting means and tip member)
It is preferable that the melting means and the tip member 8 in the first and second embodiments have a shape that allows the molten solder to easily flow between the bottom portion 12 of the tip member 8 and the substrate 9 without stagnation. An example of the shape of such melting means and tip member will be described with reference to FIGS.

  FIG. 5 is an external perspective view of the tip portion of an example of the heat melting portion. By making the heating and melting part 5 into a cylindrical shape and further having a shape in which the tip portion is cut obliquely, solder can be easily poured into the side groove 8a formed in the side surface 11 of the tip member 8 described later.

  FIG. 6 is an external perspective view of an example of the tip portion of the soldering iron. By forming the guide groove 51 a on the upper surface 52 of the soldering iron 51, it becomes easy to guide the molten solder to the side groove 8 a formed on the side surface 11 of the tip member 8.

  FIG. 7 is an external perspective view of the tip member 8. By forming a groove 11 a connected to the bottom 12 facing the heating board 10 on the side surface 11, the molten solder supplied from the heating and melting portion 5 or the soldering iron 51 is transferred to the bottom 12 of the tip member 8 and the substrate 9. Can be induced during.

  The cross-sectional shapes of the side surface groove 8a and the guide groove 51a are not particularly limited, and may be V-shaped or semicircular as illustrated.

It is a typical external view of the soldering apparatus in the 1st Embodiment of this invention. It is the partially expanded view which expanded the A section in FIG. It is a typical external view of the soldering apparatus in the 2nd Embodiment of this invention. It is the partially expanded view which expanded the B section in FIG. It is an external appearance perspective view of an example of the front-end | tip part of the heat melting part of this invention. It is an external appearance perspective view of an example of the front-end | tip part of the soldering iron of this invention. It is an external appearance perspective view of an example of the tip member of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Soldering apparatus 2 Solder 4 Preheating part 5 Heating and melting part 6 Ultrasonic wave generation part 8 Tip member 9 Substrate 10 Heating board

Claims (11)

A melting part that heats and melts unmelted solder to a temperature equal to or higher than the temperature at which the solder melts; and
A vibrating part that vibrates the solder;
Have
The vibrating portion is applied to the object to which the solder is applied in a state where the solder is vibrated,
The melting part and the vibration part are arranged integrally so as not to contact each other,
A soldering apparatus, wherein solder melted from the melting part is applied to the vibration part.   2. The soldering apparatus according to claim 1, wherein the melting portion is disposed at a position where molten solder is supplied to a side surface of the vibrating portion facing the object.   The soldering apparatus according to claim 1, wherein the melting portion includes a hollow solder path, and the solder is heated and melted in the hollow solder path.   The soldering apparatus according to claim 1, wherein a guide groove for guiding the molten solder toward the vibrating portion is formed in the melting portion.   The soldering apparatus according to claim 2, wherein a side groove for guiding the solder supplied from the melting part to a surface facing the object is formed on the side surface of the vibration part.   6. A preheating unit that heats unmelted solder to a temperature lower than a temperature at which the solder is melted, and the solder is supplied from the preheating unit to the melting unit. The soldering apparatus as described in.   The soldering apparatus according to claim 1, further comprising: an ultrasonic wave generation unit that generates an ultrasonic wave; and an ultrasonic horn that transmits the ultrasonic wave generated by the ultrasonic wave generation unit to the vibration unit.   The soldering apparatus according to claim 1, wherein a temperature of the melting part is higher than a temperature of the vibration part. Soldering is performed by melting solder in a melting part that heats the solder to a temperature equal to or higher than the temperature at which the solder melts, and applying the solder to the object while applying vibration to the solder melted by heating in the melting part. A method,
Solder is applied while the melting portion and the vibration portion are integrally moved relative to the object in a state where the melting portion and the vibration portion are not in contact with each other. How to solder.   The soldering method according to claim 9, wherein the solder is applied while heating the object to a temperature lower than a temperature at which the solder melts.   The soldering method according to claim 9 or 10, wherein a temperature of the melting part is higher than a temperature of the vibration part.

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