JP3293224B2 - Method of joining inkjet print head - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for joining ink jet print heads for joining alloy members constituting an ink jet print head.

[0002]

2. Description of the Related Art In an ink jet print head, in order to form a fine three-dimensional ink flow path, metal plates on which a fine two-dimensional pattern is formed by using techniques such as etching and electroforming are laminated and joined. Therefore, soldering and brazing are often used. Incidentally, Japanese Patent Laid-Open No. 2-1
No. 07451 and JP-A-3-142248 disclose A.
A method of performing brazing and soldering using a u-Ni-based alloy and a Pb-Sn-based alloy is disclosed. Conventionally, in this type of solder joining and brazing, a single layer of solder or brazing material is formed by plating or vapor deposition.

[0003]

The inks used in ink jet printers are often corrosive, and components and joints are required to have corrosion resistance to the ink. In the above-mentioned conventional technique, in the case of brazing using a Ni-Au alloy, there is a problem that the corrosion resistance of the joint is high, but the joining temperature is high and the thermal damage to the article to be joined is large. In the case of soldering using a Pb-Sn alloy, there is a problem that the joining temperature is low but the corrosion resistance is low.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method and an apparatus for joining an ink jet print head which can provide a joint having excellent corrosion resistance without causing a large thermal damage to an object to be joined.

[0005]

In order to achieve the above object, the present invention uses a three-layer metallized layer in which Sn is sandwiched by Au as a bonding layer. A technique for forming a bonding layer of an Au—Sn alloy as a single alloy layer on a bonding surface has not been established, and it is extremely difficult to control the composition of the bonding layer with high accuracy, which is not practical. Au-Sn
The method of inserting the alloy foil into the joint is not practical because the Au-Sn alloy is extremely fragile and difficult to process.

In the present invention, the total Sn content is 20 in the order of Au as the first metallized layer, Sn as the second metallized layer, and Au as the third metallized layer from the alloy member side.
Three metallized layers (hereinafter referred to as bonding layers) having a total thickness of 3 μm or more (hereinafter referred to as “bonding layers”) whose respective thicknesses are adjusted so as to be more than mass% and less than 40 mass% are formed, and the bonding surface is activated by an Ar beam. After the formation, they are aligned and adhered in the air, and then heated in a vacuum or an inert gas.

The thickness of the first metallized layer is adjusted to 1 μm while adjusting the thickness of the first, second and third metallized layers so that the Sn content of the entire bonding layer is more than 20 mass% and less than 40 mass%. As described above, the bonding layer having a total thickness of 3 μm or more is formed on the first and second surfaces of the alloy member and is provided for bonding.

The first metallized layer and the third metallized layer are adjusted while adjusting the thickness of the first, second and third metallized layers so that the Sn content of the entire bonding layer is more than 20 mass% and less than 40 mass%. And a bonding layer having a total thickness of 3 μm or more is formed on one of the first and second surfaces of the alloy member and is used for bonding.

Further, upon heating, after the joining surfaces are aligned, before heating in a vacuum or an inert gas, the object to be joined fixed by using resistance welding or mechanical fastening is predetermined. The jig heated and held at the temperature is pressed and heated, and after the workpiece reaches a predetermined temperature, an inert gas is blown onto the workpiece to cool the workpiece.

[0010]

The bonding layer composed of three metallized layers of Au, Sn and Au is heated to 553K or more during the bonding heating so that Sn is melted and interdiffuses with Au to form a molten layer of an Au-Sn alloy. I do. At this time, Sn diffuses into the alloy member to form a compound, so that the Sn concentration in the bonding layer is reduced and the melting point of the bonding layer is changed. 3 according to the invention
According to the bonding layer formed by the layer metallization, Au serves as a barrier layer against the diffusion of Sn, and suppresses the formation of a compound between the alloy member and Sn. By this effect, the change in the Sn concentration in the bonding layer is suppressed to a low value, and as a result, the change in the melting point of the bonding layer is also suppressed to a low value. According to the present invention, by setting the thickness of Au as the first metallized layer to 1 μm or more, the change in Sn concentration due to diffusion can be sufficiently suppressed.
When the thickness of Au as the first metallization layer is less than 1 μm, the diffusion of Sn and Au causes the Au to be formed in a short time.
Melts and loses its function as a barrier layer.

In the bonding layer having a Sn content of 20 mass% Sn or less, as described above, the melting point of the bonding layer is significantly increased due to a decrease in the Sn concentration in the bonding layer due to the formation of the compound during the heat bonding. As a result, the solder solidifies before a sufficient melt is generated at the joint, resulting in incomplete adhesion of the joint. However, when the bonding layer according to the present invention having a Sn content of more than 20 mass% and less than 40 mass% is used, the melting point of the bonding layer is lowered due to a decrease in the Sn concentration in the bonding layer due to the formation of the compound during the heat bonding, and A sufficient melt is generated in the joint to improve the adhesion of the joint.

By irradiating the bonding surface with an Ar beam in a vacuum, fats and oils, moisture, oxide films, and the like adhering to the bonding surface are removed. Thereby, the bonding surface becomes an active surface having high bonding property, and the bonding property is improved. Positioning in the atmosphere is easier than positioning in a vacuum, and the time required for positioning can be reduced. By heating and pressurizing in a vacuum or an inert gas, the activated bonding surface is not re-contaminated, so that the bonding property is improved. After aligning the joining surfaces, fix the workpiece using spot welding or mechanical fastening before heating and pressurizing in vacuum or inert gas.
There is no displacement during joining, and the yield and work efficiency can be improved. A jig heated and held at a predetermined temperature in advance is pressed against the object to be heated and pressurized, and after the object reaches the predetermined temperature, an inert gas is blown onto the object to be cooled, thereby cooling the compound. Formation can be suppressed and the bonding strength can be improved.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the joining method of the present invention will be described below with reference to FIGS.

First, a method for forming a metallized layer on an alloy member will be described with reference to FIG. 101 is a 50 μm thick S
US304 first alloy member, 102 is 1 μm thick Ni
A metallized layer, 103 is a first metallized layer made of Au having a thickness of 2.0 μm, 104 is a second metallized layer made of Sn having a thickness of 1.8 μm, and 105 is Au having a thickness of 0.3 μm.
A third metallized layer 107 made of Au having a thickness of 2.0 μm; and a metallized layer 108 having a thickness of 1.8 μm
m, a second metallized layer made of Sn having a thickness of 0.1 m.
The third metallized layer 111 made of 3 μm Au is a second alloy member made of Ni and having a thickness of 27 μm.

The first alloy member 101 made of SUS304 is electrolessly plated with Ni-P to a thickness of 1 μm by wet plating. The thickness does not necessarily have to be 1 μm, but it is necessary that the thickness be such that all of Ni is consumed as a compound with Sn after joining. Ni-Sn compound is SUS3
The bonding strength with Ni.04 is poor, and if all of Ni is consumed as a compound with Sn after bonding, the bonding strength is extremely reduced. Next, as the first metallized layer 103, a thickness of 2.0
A μm of Au is formed by wet plating. Next, 1.8 μm thick Sn is formed as a second metallized layer 104 by wet plating. Further, Au having a thickness of 0.3 μm is formed as a third metallized layer 105 by wet plating.

The second alloy member 111 made of Ni is manufactured by electroforming. Since electroformed Ni has good bondability with the Au-Sn alloy, it is not necessary to apply Ni metallization to the bonding surface, and the first metallized layer 107 is directly 2.0 μm thick.
m of Au is formed by wet plating. Next, 1.8 μm thick Sn is formed as a second metallized layer 108 by wet plating. Further, Au having a thickness of 0.3 μm is formed as a third metallized layer 109 by wet plating. In the present invention, all the metallized layers are formed by wet plating, but the same effect can be obtained by forming all the metallized layers, or partly the metallized layer by other film forming means such as vacuum evaporation or sputtering. .

Next, regarding the change in the joint structure due to the joining,
This will be described with reference to FIGS. FIG. 2 is a diagram showing a structure of a joint in each process of joining, and FIG. 3 is a diagram showing a structure and a melting point of a joining layer in each process of joining.

Reference numeral 101 denotes a 50 μm-thick SUS304 first alloy member, and 102 denotes a 1 μm-thick N-side alloy member on the first alloy member side.
The i-metallized layer 103 has a thickness of 2.0 on the first alloy member side.
A first metallized layer made of Au having a thickness of μm, 104 is a second metallized layer made of Sn having a thickness of 1.8 μm on the first alloy member side, and 105 is an Au having a thickness of 0.3 μm on the first alloy member side.
A third metallization layer 106, a Ni-Sn intermetallic compound on the first alloy member side 107; a first metallization layer 107 of Au having a thickness of 2.0 μm on the second alloy member side 108
Is a second alloy made of 1.8 μm thick Sn on the side of the second alloy member.
The metallized layer 109 has a thickness of 0.3 μm on the second alloy member side.
m is a third metallized layer made of Au, 110 is a Ni—Sn intermetallic compound on the second alloy member side, and 111 is a thickness of 27 μm.
m is a second alloy member made of Ni, and 130 is an Au-Sn combined liquid.

The structure of the joint in each process of joining is as follows. A case where the heating rate of the temperature of the joint is as high as 20 K / s will be described.

(1) State A State A is a state in which the first alloy member 101 and the second alloy member 111 are brought into close contact with each other via a bonding layer. In this state, all layers are solid.

(2) State B State B is a state in which heating is performed from state A to just above the melting point of Sn. Second metallized layer 104 of 1.8 μm thick Sn on the first alloy member side and thickness 1.
The second metallized layer 108 of 8 μm of Sn is melted.

(3) Between the states B and C When the heating is further continued, the thickness of the first alloy member side becomes 2.0 μm.
First metallized layer 103 made of Au, and third metallized layer 1 made of Au having a thickness of 0.3 μm on the first alloy member side
05, a first metallized layer 107 made of Au having a thickness of 2.0 μm on the second alloy member side and a thickness of 0.1 μm on the second alloy member side.
Au from the third metallization layer 109 made of 3 μm Au
Melts into the second metallization layer 108 made of molten Sn to form the Au—Sn combined financial solution 130. Au-S
The melting point of the n-type liquid solution 130 once decreases with an increase in the Au concentration, but rises again after the Sn concentration of about 87 mass%. When the heating rate is low, the Au-Sn combined liquid 130 may coagulate. However, in the case of the present embodiment, the heating rate does not solidify because the heating rate is sufficiently high.

(4) After heating to 593K between states C and D, the temperature is maintained. A during this time
Dissolution of Au into the u-Sn combined liquid 130 proceeds.

(5) State D In this embodiment, the thickness of each metallized layer is adjusted so as to be in the state D when the dissolution of Au in the Au-Sn mixed liquid 130 is completed. Therefore, in the state D, the Au-Sn alloy liquid and the Ni metallized layer 102 having a thickness of 1 μm on the first alloy member side and the second Ni alloy member 111 having a thickness of 27 μm are provided.
Is in direct contact with

(6) Between states D and E: Au-Sn alloy liquid and 1 μm thick N on the first alloy member side
The direct contact between the i-metallized layer 102 and the 27 μm-thick second Ni alloy member 111 causes rapid formation of the Ni-Sn intermetallic compound 106 at the interface therebetween. The compound 106 also contains a small amount of Au, most of which is Ni and Sn. Due to the formation of the compound 106, the Sn concentration in the Au-Sn combined liquid 130 decreases, and the melting point of the combined liquid 130 also decreases. As a result, the fluidity of the Au-Sn combined liquid is improved, and the adhesion at the joint is improved.

(7) State E When heating from state D for about 10 s, the growth of the Ni—Sn intermetallic compound 106 causes the Sn concentration in the Au—Sn alloy solution to decrease, and the eutectic composition of the Au—Sn alloy to change. Au-20m
ass% Sn.

(8) State F By cooling the joint from the state E, a joint joined by an Au-Sn eutectic alloy having excellent strength reliability and corrosion resistance can be obtained.

(9) State E 'When the dissolution of Au in the Au-Sn combined liquid solution 130 is completed, the state does not change to state D, and if undissolved Au remains, Au
In a few seconds, the melting point of the -Sn combined liquid 130 exceeds 593K, becomes the state E ', and solid crystallization starts, and the fluidity of the Au-Sn combined liquid 130 is extremely reduced. The solidification of the Au-Sn combined liquid 130 begins before the joint is not completely adhered, so that the strength reliability of the joint is reduced.

The transition from the state D to the state E occurs in a shorter time than the transition to the state E 'is due to the growth of the Ni-Sn compound in which the transition from the state D to the state E is diffusion-controlled. On the other hand, the transition from the state D to the state E ′ is due to the dissolution of Au in the Au—Sn alloy 130.

In the state E ′, the strength reliability of the joint decreases, but in general, the higher the Au concentration, the higher the corrosion resistance of the Au—Sn alloy. May endure.

In this embodiment, the growth of the Ni—Sn compound is treated as starting from the state D. However, the growth of the Ni—Sn compound occurs slightly before the state C in practice. In this case, Sn diffuses inside the first metallized layer 103 on the first alloy member side and the first metallized layer 107 on the second alloy member side made of Au and reaches Ni,
-Form a Sn compound. Since this process is diffusion-controlled, the supply amount of Sn per unit time is extremely smaller than that between the states D and E, so that the compound growth rate is also extremely small. When the heating rate is set to 20 K / s or more as in this embodiment, Au-Sn accompanying the compound formation before state D
The change in the composition of the synthetic liquid is negligible.

Next, the joining process will be described.

Reference numeral 211 denotes a first metallized layer 103 made of Au and a second metallized layer 104 made of Sn shown in FIG.
A bonding layer 221 made of three metalized layers of a third metalized layer 105 made of Au and a first metalized layer 107 made of Au shown in FIG. A bonding layer 212 composed of three metallization layers of the three metallization layers 109;
And 222, a contaminant layer made of an oxide film, water, or an organic substance;
Numeral 30 is a bonding layer that has been melted and integrated, 300 is an Ar atom beam, 301 is a resistance welding machine, 302 is a resistance welding tip, 303 is a ground terminal, 304 is a conductive base, 30
Reference numerals 5 and 308 denote heating and pressing jigs with built-in heaters.
Is an aluminum nitride alloy member holding jig having a thickness of 0.5 mm, 307 is a coil spring, 309 is a cooling gas nozzle,
310 is a gas introduction feedthrough, 311 is an atom source, and 400 is a vacuum chamber.

(1) Setting The first alloy member 101 and the second alloy member 111 are loaded into the vacuum chamber 400 and evacuated.

The first alloy member 101 has a Ni metallized layer 102 and a first metallized layer 1 made of Au shown in FIG.
03, a bonding layer 211 formed of three metallized layers of a second metallized layer 104 made of Sn and a third metallized layer 105 made of Au. The second alloy member 111 includes a first metallized layer 107 made of Au, a second metallized layer 108 made of Sn and Au shown in FIG.
A bonding layer 221 composed of three metallized layers of the third metallized layer 109 is formed. In the evacuated state, the contaminant layers 212 and 2 formed of an oxide layer and an adsorbate layer of water, an organic substance, and the like are formed on the bonding layers 211 and 221.
22 are formed.

(2) Activation Ar gas was introduced into the atom source 311 to generate Ar gas.
The contaminant layers 212 and 222 are removed using a sputtering phenomenon by the atom beam 300. By this treatment, the surfaces of the bonding layers 211 and 221 are cleaned, and become surfaces having excellent bonding and wettability.

(3) Positioning and Fixation in the Atmosphere The first alloy member 101 and the second alloy member 111 are taken out into the atmosphere, placed on the conductive base 304 grounded by the ground terminal 303, and the bonding layers 211 and 221 are removed. After opposing each other and adjusting the relative positions of the first alloy member 101 and the second alloy member 111, the first alloy member 101 and the second alloy member 111 are subjected to resistance welding using a resistance welding machine 301 and a resistance welding tip 302. The relative position of the member 111 is fixed. By this processing, subsequent processing can be continued without causing a relative position shift between the first alloy member 101 and the second alloy member 111 without using a positioning jig or the like.

(4) Preheating of the jig The first and second alloy members 101 and 111, which have been positioned and fixed, are held in the alloy member holding jig 3 in the vacuum chamber 400.
06 and evacuated once, and then an inert gas such as nitrogen or Ar is introduced. At the same time, the heating and pressurizing jigs 305 and 308 having a built-in heater are preheated to 573-593K.
To keep. In this state, the alloy member holding jig 306 is lifted from the heating and pressing jig 308 by the coil spring 307, and the heating and pressing jig 305 is lifted to a position where it does not contact the second alloy member 111. Therefore, the first alloy member 101
And the second alloy member 111 are heated and pressed jigs 305 and 30
Therefore, even if the heating and pressurizing jigs 305 and 308 are preheated to 593 K, the temperatures of the first alloy member 101 and the second alloy member 111 rise only to about 420 K, and the bonding layer 211 and 221 do not melt. Thereby, the interdiffusion between the Ni metallized layer 102 and the bonding layer 211 hardly occurs.

(5) Pressing and Heating The heating and pressing jig 305 is pressed down by using a pressing device (not shown), and the first alloy member 101 and the second alloy member 111 are pressed and brought into close contact. At this time, the coil spring 307 contracts and the alloy member holding jig 306 comes into contact with the heating / pressing jig 308, so that the heat is rapidly increased through the alloy member holding jig 306 to the first position.
The heat is transmitted to the alloy member 101 and the second alloy member 111 and rapidly heated. At the same time, since the heating / pressing jig 305 is also in contact with the second alloy member 111, heat is transmitted to the first alloy member 101 and the second alloy member 111 and rapidly heated. As a result of the heating and pressurizing, first, Sn in the bonding layers 211 and 221 is melted, and adjacent Au is melted to form an Au-Sn combined liquid. Until Au completely dissolves in the Au-Sn alloy liquid, Au functions as a barrier layer against the diffusion of Sn into the Ni metallized layer 102 and the second alloy member 111. As the concentration of Au in Sn increases, the melting point of the Au-Sn mixed liquid rises. Therefore, when the heating rate is lower than this melting rate, the melt once solidifies. However, the interdiffusion between Sn and Au proceeds during this time, and Au-
The melting point of the Sn alloy changes continuously. Heating temperature is 553
If it exceeds K, a melt is generated due to the eutectic reaction between Au and Sn, and the adhesion of the joint proceeds. Heating rate is Au-S
When the melting point is higher than the melting point of the n-alloy, Au-S
The n-alloy layer does not solidify and maintains a molten state.

When the bonding layer 411 is completely melted, the adhesion of the bonding portion is promoted, and the S—
The n is in direct contact with the Ni metallized layer 102 and the second alloy member 111 to promote the formation of a Ni—Sn compound, and the Sn concentration in the bonding layer is rapidly reduced.

In this embodiment, the heating rate is 20
If K / sec or more, the Sn concentration in the bonding layer becomes Au-S
Joining is completed before the composition becomes lower than the n-eutectic composition of 20 mass%, and a strong and airtight joint can be obtained. The heating temperature may be 573 to 593K, which is slightly higher than the eutectic point of 553K of the Au-Sn-based alloy, so that thermal damage to the first alloy member 101 and the second alloy member 111 can be reduced. Can be. The optimum value of the heating and pressurizing time is obtained in advance by an experiment.

(6) Cooling After heating and pressing for a predetermined time, the heating and pressing jig 305 is pulled up and separated from the second alloy member 111. At this time, the coil spring 3
07 elongates and raises the alloy member holding jig 306, so that the first alloy member 1 is removed from the heating and pressing jigs 305 and 308.
The flow of heat into the first and second alloy members 111 is reduced.
Next, an inert gas such as Ar or N ₂ is sprayed onto the bonding layer 230 integrated with the first alloy member 101 and the second alloy member 111 through the gas introduction feed-through 310 and the cooling gas nozzle 309 to rapidly cool the bonding portion. Is done. By this rapid cooling, the growth of the Ni—Sn compound layer formed at the interface between the bonding layer 230, the Ni metallization layer 102, and the second alloy member 111 can be suppressed, and a strong and airtight bonding portion can be obtained. be able to.

(7) Removal The first alloy member 101 and the second alloy member 111 are removed from the vacuum chamber 400, and the joining is completed. The first alloy member 101 and the second alloy member 111 are integrated with the bonding layer 2
30 are firmly joined.

In the case of this embodiment, the heating rate is 20 K /
If it is smaller than sec, the Sn concentration in the bonding layer becomes lower than the Au-Sn eutectic composition of 20 mass% before the bonding layer is completely integrated after melting. as a result,
Since the melting point of the bonding layer sharply rises and the bonding layer solidifies while the integration of the bonding layer is incomplete, a strong and airtight bonded portion cannot be obtained. However, when the composition of the bonding layer is different from that in this embodiment, the heating rate is not necessarily required to be 20 K / sec or more.

In this embodiment, the Sn concentration of the bonding layer is set to 23 ma.
ss%, but the Sn concentration exceeds 20 mass%
If it is less than mass%, good bonding is possible. In this range, when the Sn concentration in the bonding layer decreases due to the formation of the Ni-Sn compound as described above, the bonding layer composition approaches the eutectic composition, and the bonding layer melting point decreases. As a result, there is enough time for the bonding layer to melt and be integrated during the heating and pressing, and a strong and airtight bonding portion can be obtained.
On the other hand, when the bonding layer composition is 20 mass% or less and 40 mass%
In the case of s% or more, when the Sn concentration decreases, the melting point of the bonding layer rapidly increases, and there is no time to melt and integrate the bonding layer. As a result, bonding defects such as voids and unbonded portions occur in the bonded portion, and the bonding strength and airtightness are reduced.

In this embodiment, the bonding layer is made of an Au--Sn alloy. However, if the melting point of the bonding layer changes due to the change of the bonding layer composition during bonding, the melting point of the alloy decreases during bonding. By setting the composition, a good joint can be obtained in the same manner as in this embodiment.

In this embodiment, the two alloy members are the first alloy member and the second alloy member. However, any number of alloy members can be laminated and joined by repeating the joining process according to the present invention. Further, by repeating the positioning process and the fixing process by resistance welding, the positioning and fixing of three or more alloy members can be performed, and the heating and joining can be performed at once.

Next, another embodiment according to the joining method of the present invention will be described with reference to FIGS.

First, a method for forming a metallized layer on an alloy member will be described.

Reference numeral 101 denotes a 50 μm thick SUS304 first alloy member, 102 denotes a 1 μm thick Ni metallized layer,
501 is a first metallized layer made of 1.15 μm thick Au, 502 is a second metallized layer made of Sn 1.8 μm thick, 503 is a third metallized layer made of 1.15 μm thick Au, 111 is This is a Ni second alloy member having a thickness of 27 μm.

The 1st alloy member 101 made of SUS304 is electrolessly plated by Ni-P with a thickness of 1 μm by wet plating. The thickness does not necessarily have to be 1 μm, but it is necessary that the thickness be such that all of Ni is consumed as a compound with Sn after joining. Ni-Sn compound is SUS3
The bonding strength with Ni.04 is poor, and if all of Ni is consumed as a compound with Sn after bonding, the bonding strength is extremely reduced. Next, a first metallized layer 501 having a thickness of 1.1
Au of 5 μm is formed by wet plating. Next, as the second metallization layer 502, 1.8 μm thick Sn is formed by wet plating. Further, Au having a thickness of 1.15 μm is formed as a third metallization layer 503 by wet plating. The second Ni alloy member 111 is manufactured by electroforming. Since electroformed Ni has good bondability with the Au-Sn alloy, it is not necessary to perform Ni metallization on the bonding surface.

In the present invention, all the metallized layers are formed by wet plating. However, the same effect can be obtained by forming all the metallized layers or partially forming the metallized layer by other film forming means such as vacuum evaporation or sputtering. Is obtained.

Next, the joining process will be described.

Reference numerals 212 and 222 denote contaminant layers made of an oxide film, water, or an organic substance; 430, a bonding layer formed by melting; 300, an Ar atom beam; 301, a resistance welding machine;
302 is a resistance welding tip, 303 is a ground terminal, 304
Is a conductive base, 305 and 308 are heating and pressing jigs with built-in heaters, 306 is a 0.5 mm thick aluminum nitride alloy member holding jig, 307 is a coil spring, 30
9 is a cooling gas nozzle, 310 is a gas introduction feedthrough, 311 is an atom source, and 400 is a vacuum chamber.

(1) Setting The first alloy member 101 and the second alloy member 111 are loaded into the vacuum chamber 400 and evacuated.

The first alloy member 101 has a Ni metallized layer 102 and a first metallized layer 5 made of Au shown in FIG.
A bonding layer 411 is formed of three metallized layers, that is, a second metallized layer 502 made of Sn and Sn and a third metallized layer 503 made of Au. In the state of being evacuated, on the bonding layer 411 and the second alloy member 111,
Contaminant layer 2 consisting of an oxide layer and a layer of adsorbed substances such as water and organic substances
12 and 222 are formed.

(2) Activation Ar gas was introduced into the atom source 311 to generate Ar gas.
The contaminant layers 212 and 222 are removed using a sputtering phenomenon by the atom beam 300. By this treatment, the surfaces of the bonding layer 411 and the second alloy member 111 are cleaned, and the bonding layer 411 and the surface of the second alloy member 111 are rich in bonding property and wettability.

(3) Positioning and Fixation in the Atmosphere The first alloy member 101 and the second alloy member 111 are taken out into the atmosphere, placed on the conductive base 304 grounded by the ground terminal 303, and the bonding layer 411 and the second The alloy members 111 are opposed to each other, the relative positions of the first alloy member 101 and the second alloy member 111 are adjusted and then brought into close contact with each other, and resistance welding is performed by using a resistance welding machine 301 and a resistance welding tip 302 to form the first alloy member 101 And the relative position of the second alloy member 111 is fixed. By this processing, the first alloy member 101 and the second alloy member 1 can be used without using a positioning jig or the like.
Subsequent processing can be continued without causing a shift in the relative position 11.

(4) Preheating of the jig The first and second alloy members 101 and 111, which have been positioned and fixed, are held in the alloy member holding jig 3 in the vacuum chamber 400.
06 and evacuated once, and then an inert gas such as nitrogen or Ar is introduced. At the same time, the heating and pressurizing jigs 305 and 308 having a built-in heater are preheated to 573-593K.
To keep. In this state, the alloy member holding jig 306 is lifted from the heating and pressing jig 308 by the coil spring 307, and the heating and pressing jig 305 is lifted to a position where it does not contact the second alloy member 111. Therefore, the first alloy member 101
And the second alloy member 111 are heated and pressed jigs 305 and 30
Therefore, even if the heating and pressurizing jigs 305 and 308 are preheated to 593 K, the temperatures of the first alloy member 101 and the second alloy member 111 rise only to about 420 K, and the bonding layer 411 does not melt. Thereby, the interdiffusion between the Ni metallized layer 102 and the bonding layer 411 hardly occurs.

(5) Pressing and Heating The heating and pressing jig 305 is pressed down using a pressing device (not shown), and the first alloy member 101 and the second alloy member 111 are pressed and brought into close contact with each other. At this time, the coil spring 307 contracts and the alloy member holding jig 306 comes into contact with the heating / pressing jig 308, so that the heat is rapidly increased through the alloy member holding jig 306 to the first position.
The heat is transmitted to the alloy member 101 and the second alloy member 111 and rapidly heated. At the same time, the heating and pressing jig 305 is also used for the second alloy member 1.
Since it is in contact with 11, the heat is transmitted to the first alloy member 101 and the second alloy member 111 and is rapidly heated. As a result of the heating and pressurization, first, Sn in the bonding layer 411 is melted, and the adjacent Au is melted to form an Au-Sn combined liquid. In the present embodiment, Au as the first and second metallized layers adjacent to Sn has the same thickness, and until the Au is completely dissolved in the Au-Sn alloy solution, the Ni metallized layer 1 of Sn is used.
02 and functions as a barrier layer against diffusion into the second alloy member 111. As the concentration of Au in Sn increases, the melting point of the Au-Sn mixed liquid increases, so that when the heating rate is lower than the melting point increasing rate, the melt once solidifies. However, during this time, the interdiffusion between Sn and Au proceeds, and the melting point of the Au—Sn alloy changes continuously. When the heating temperature exceeds 553K, a melt is generated by the eutectic reaction of Au and Sn, and the adhesion of the joint proceeds. When the heating rate is higher than the melting point rate of the Au-Sn alloy, the Au-Sn alloy layer does not solidify and maintains a molten state.

When the bonding layer 411 is completely melted, the adhesion of the bonding portion is promoted, and the S—
The n is in direct contact with the Ni metallized layer 102 and the second alloy member 111 to promote the formation of a Ni—Sn compound, and the Sn concentration in the bonding layer is rapidly reduced. In the case of the present embodiment, if the heating rate is 20 K / sec or more, the Sn concentration in the bonding layer is 20 mass, which is the Au-Sn eutectic composition.
% Before the joining is completed, and a strong and airtight joint can be obtained. The heating temperature is Au-S
Slightly higher than the eutectic point of the n-type alloy, 553K5
The temperature may be set to 73 to 593K, so that thermal damage to the first alloy member 101 and the second alloy member 111 can be reduced. The optimum value of the heating and pressurizing time is obtained in advance by an experiment.

(6) Cooling After heating and pressing for a predetermined time, the heating and pressing jig 305 is pulled up and separated from the second alloy member 111. At this time, the coil spring 3
07 elongates and raises the alloy member holding jig 306, so that the first alloy member 1 is removed from the heating and pressing jigs 305 and 308.
The flow of heat into the first and second alloy members 111 is reduced.
Next, an inert gas such as Ar or N ₂ is sprayed onto the bonding layer 430 integrated with the first alloy member 101 and the second alloy member 111 through the gas introduction feed-through 310 and the cooling gas nozzle 309 to rapidly cool the bonded portion. Is done. By this rapid cooling, the growth of the Ni—Sn compound layer formed at the interface between the bonding layer 430 and the Ni metallization layer and the second alloy member 111 can be suppressed, and a strong and airtight bonding portion can be obtained. Can be.

(7) Removal The first alloy member 101 and the second alloy member 111 are removed from the vacuum chamber 400, and the joining is completed. The first alloy member 101 and the second alloy member 111 are integrated with the bonding layer 4
30 are firmly joined.

In the case of this embodiment, the heating rate was 20 K /
If it is smaller than sec, the bonding layer is completely integrated after melting, and the Sn concentration in the bonding layer is Au-Sn.
It becomes lower than the eutectic composition of 20 mass%. As a result, the melting point of the bonding layer sharply rises and the bonding layer solidifies while the adhesion of the bonding layer is incomplete, so that a strong and airtight bonded portion cannot be obtained. However, when the composition of the bonding layer is different from that in this embodiment, the heating rate is not necessarily 20 K / sec.
There is no need to do this.

In this embodiment, the Sn concentration of the bonding layer is set to 23 ma.
ss%, but the Sn concentration exceeds 20 mass%
If it is less than mass%, good bonding is possible. In this range, when the Sn concentration in the bonding layer decreases due to the formation of the Ni-Sn compound as described above, the bonding layer composition approaches the eutectic composition, and the bonding layer melting point decreases. As a result, there is enough time for the bonding portion to completely adhere after the bonding layer is melted during the heating and pressurization, and a strong and airtight bonding portion can be obtained. On the other hand, when the composition of the bonding layer is 20 mass% or less and 40 mass% or more, when the Sn concentration decreases, the melting temperature of the bonding layer rapidly increases, and there is no time to completely bond the bonding portion. As a result, bonding defects such as voids and unbonded portions occur in the bonded portion, and the bonding strength and airtightness are reduced.

In the present embodiment, the bonding layer is made of an Au—Sn alloy. However, if the bonding layer has a melting point that changes due to a change in the bonding layer composition during bonding, the melting point of the alloy decreases during bonding. By setting the composition, a good joint can be obtained in the same manner as in this embodiment.

In this embodiment, the two alloy members, the first alloy member and the second alloy member, are used. However, by repeating the joining process according to the present invention, any number of alloy members can be laminated and joined. Further, by repeating the positioning process and the fixing process by resistance welding, the positioning and fixing of three or more alloy members can be performed, and the heating and joining can be performed at once.

[0068]

According to the present invention, the thickness is 10 microns to 5 microns.
An object to be bonded consisting of a combination of a SUS304 plate of 0 micron and a thin plate made of Ni is cleaned with an argon atom beam in a vacuum using a bonding layer consisting of three metallized layers of Au, Sn, and Au, and then air. Aligning and fixing the position inside, then pressurizing and heating in vacuum or in an inert gas, joining with excellent corrosion resistance without thermally damaging the SUS304 plate and the electroformed Ni plate It can be performed.

[Brief description of the drawings]

FIG. 1 is a view for explaining an embodiment relating to a metallized layer forming method of a bonding method according to the present invention.

FIG. 2 is a diagram illustrating a joint structure in each joining process of an example according to the joining method of the present invention.

FIG. 3 is a diagram illustrating the structure and melting point of an Au—Sn combined liquid layer in each joining process of an example according to the joining method of the present invention.

FIG. 4 is a view for explaining an embodiment according to the joining method of the present invention.

FIG. 5 is a diagram illustrating an example of a method for forming a metallized layer in a bonding method according to the present invention.

FIG. 6 is a view for explaining an embodiment according to the joining method of the present invention.

[Explanation of symbols]

101 is a first alloy member made of SUS304 having a thickness of 50 μm,
102 is a Ni metallized layer having a thickness of 1 μm, 103 is a first metallized layer made of Au having a thickness of 2.0 μm, 104 is a second metallized layer made of Sn having a thickness of 1.8 μm, 10
5 is a third metallization layer made of Au having a thickness of 0.3 μm,
106 is a Ni—Sn intermetallic compound on the first alloy member side;
07 is a first metallized layer of Au having a thickness of 2.0 μm on the second alloy member side, and 108 is a first metallized layer having a thickness of 1.2 μm on the second alloy member side.
A second metallized layer made of 8 μm Sn;
A third metallized layer made of Au having a thickness of 0.3 μm on the alloy member side; 110, a Ni—Sn intermetallic compound on the second alloy member side; 111, a Ni alloy member having a thickness of 27 μm;
Is Au-Sn alloy liquid, 300 is Ar atom beam, 3
01 is a resistance welding machine, 302 is a resistance welding tip, 303 is a ground terminal, 304 is a conductive base, 305 and 308 are heating and pressing jigs with built-in heaters, and 306 is 0.5 m thick
m, an aluminum nitride alloy member holding jig; 307, a coil spring; 309, a cooling gas nozzle; 310, a gas introduction feedthrough; 311, an atom source; 400, a vacuum chamber; 411, a bonding layer; Is a first metallized layer made of Au having a thickness of 1.15 μm, and 502 is a Sn metal having a thickness of 1.8 μm.
The second metallized layer 503 having a thickness of 1.15 μm
Is a third metallized layer made of Au.

──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Yuji Furuya 1060 Takeda, Katsuta-shi, Ibaraki Prefecture Inside Hitachi Koki Co., Ltd. Government Satoshi Kiribata Hiroshi (56) References JP-A-54-148533 (JP, A) JP-A-62-70051 (JP, A) JP-A-4-339657 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) B41J 2/16

Claims (6)

(57) [Claims] 1. A member for joining a first surface of a first alloy member of a plurality of alloy members constituting an ink jet print head to a second surface of a second alloy member, wherein the first surface and the second surface of the alloy member are provided. Of the first metallized layer, Sn as the second metallized layer, and A as the third metallized layer on at least one of the surfaces from the base material side.
The three metallized layers are formed in the order of u, the first surface and the second surface are arranged to face each other, the relative positions of the first surface and the second surface are adjusted, and then the first and second surfaces are brought into close contact with each other. A method for joining an ink-jet printhead, wherein the first and second alloy members are joined by heating to a temperature of 553 K or higher without melting the alloy member to melt the three metallized layers. 2. The thickness of each of the first, second and third metallized layers is adjusted so that the Sn content in the entire three metallized layers is 20 ma.
The thickness of the first metallized layer is set to more than ss% and less than 40 mass%, and the thickness of the first metallized layer is 1 μm or more, and the total thickness of the three metallized layers is 3 μm or more.
2. The method according to claim 1, wherein the bonding is performed on the second surface. 3. The thickness of each of the first, second and third metallized layers is adjusted so that the Sn content of the entire three metallized layers is 20 ma.
More than ss% and less than 40 mass%, and the first metallized layer and the third metallized layer have the same thickness, and the three-layer metallized layer has a total thickness of 3 μm or more. 2. The method according to claim 1, wherein the first surface is formed on one of the second surfaces and is provided for bonding.
2. The method for bonding an inkjet print head according to claim 1 . 4. After activating the first surface of the first alloy member and the second surface of the second alloy member with an Ar beam, the relative positions of the first surface and the second surface are adjusted in the atmosphere. After that, the first and second layers are placed in a vacuum or an inert gas.
And is heated to a temperature above 553K to melt the three layers metallized layer without melting the alloy member, according to claim 1, wherein the joining the first and second alloy member
Joining method of the ink jet printhead. 5. A three-layer metallizing method in which a jig heated and held at a predetermined temperature in advance is adjusted to a relative position and then pressed against the first and second alloy members brought into close contact with each other and heated to a temperature of 553K or more. 5. The ink-jet printing method according to claim 4, wherein the layer is melted, and after the first and second alloy members reach a predetermined temperature, an inert gas is blown onto the first and second alloy members to cool them. Printhead joining method. 6. After the relative positions of the first surface of the first alloy member and the second surface of the second alloy member are adjusted, the first alloy member and the first alloy member are connected to each other by heating or by mechanical fastening before heating. 5. The method according to claim 4, wherein the two alloy members are fixed.