JPH03142248A - Manufacture of ink-jet printing head - Google Patents
Manufacture of ink-jet printing headInfo
- Publication number
- JPH03142248A JPH03142248A JP28151589A JP28151589A JPH03142248A JP H03142248 A JPH03142248 A JP H03142248A JP 28151589 A JP28151589 A JP 28151589A JP 28151589 A JP28151589 A JP 28151589A JP H03142248 A JPH03142248 A JP H03142248A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric element
- laminate
- layer
- bonding
- metallic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000007641 inkjet printing Methods 0.000 title 1
- 239000000463 material Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 11
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 7
- 239000000956 alloy Substances 0.000 claims abstract description 7
- 229910009083 Sn—Zn—Sb Inorganic materials 0.000 claims abstract description 3
- 229910052751 metal Inorganic materials 0.000 claims description 38
- 239000002184 metal Substances 0.000 claims description 38
- 238000005219 brazing Methods 0.000 claims description 20
- 230000008018 melting Effects 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 1
- 230000004907 flux Effects 0.000 abstract description 16
- 239000011800 void material Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 12
- 239000010408 film Substances 0.000 description 7
- 238000007740 vapor deposition Methods 0.000 description 4
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229910002059 quaternary alloy Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は圧電素子によりインクの充満した圧力室に圧力
を加え、その圧力により射出口からインク滴を記録紙に
射出するインクジェット印字ヘッドの製造方法に関する
。Detailed Description of the Invention [Industrial Application Field] The present invention applies pressure to a pressure chamber filled with ink using a piezoelectric element, and uses the pressure to eject ink droplets from an ejection port onto recording paper. Regarding the method.
［従来技術］
この種のインクジェット印字ヘッドでは、圧電素子の振
動を金属振動板に伝達するため圧電素子と金属板とを接
合する必要がある。この接合面は圧電素子に電圧信号を
印加する電極面を兼ねることが好ましく、はんだ接合が
多く用いられる。特開昭５８−１２７６６号公報には、
金属薄膜が蒸着された圧電素子とはんだメツキが施され
た金属板とを積層した構造のインクジェット印字ヘッド
が開示されている。[Prior Art] In this type of inkjet print head, it is necessary to bond the piezoelectric element and the metal plate in order to transmit the vibration of the piezoelectric element to the metal diaphragm. This bonding surface preferably also serves as an electrode surface for applying a voltage signal to the piezoelectric element, and solder bonding is often used. In JP-A-58-12766,
An inkjet print head is disclosed that has a structure in which a piezoelectric element on which a metal thin film is vapor-deposited and a metal plate on which solder plating is laminated.
従来のこの種のはんだ接合方法は、第２図に示す様に、
圧電素子１の金属蒸着薄膜３と金属振動板２のはんだ層
４１とを接合面とし、接合面にフラックスを塗布して両
者を密着し、金属振動板２の下方からヒータで加熱して
はんだ層４１を溶融させ、接合する方法であった。This type of conventional soldering method, as shown in Figure 2,
The metal vapor-deposited thin film 3 of the piezoelectric element 1 and the solder layer 41 of the metal diaphragm 2 are used as bonding surfaces, and flux is applied to the bonding surfaces to bond them together, and the metal diaphragm 2 is heated from below with a heater to form a solder layer. 41 was melted and joined.
接合面にフラックスを塗布するのは次の理由による。圧
電素子１のキュリー点は３１５℃〜３４０℃と比較的低
いため、はんだ層４１には上記キユリー点以下の温度で
溶融する低融点の共晶はんだ合金を用いる必要がある。The reason for applying flux to the joint surfaces is as follows. Since the Curie point of the piezoelectric element 1 is relatively low at 315° C. to 340° C., it is necessary to use a low melting point eutectic solder alloy for the solder layer 41 that melts at a temperature below the Curie point.
低融点はんだを接合面全体に行き渡らせ、はんだ層４１
をできるだけ薄くし、かつ、ボイド（空隙）４２を生じ
ないようにするためには、はんだの濡れ性を向上させる
フラックスの使用が不可欠と考えられたからである。The low melting point solder is spread over the entire joint surface to form a solder layer 41.
This is because it was considered essential to use a flux that improves the wettability of solder in order to make it as thin as possible and to prevent voids 42 from forming.
［発明が解決しようとする課題］
しかしながら、フラックスを使用すると接合後のフラッ
クスの除去が問題になる。[Problems to be Solved by the Invention] However, when flux is used, removal of the flux after bonding becomes a problem.
はんだ接合後には接合面の周辺に溢れたフラックスが固
着し、微細なインク通路を埋めてしまう。After soldering, the flux that overflows around the joint surface sticks and fills the minute ink passages.
また、フラックスには、例えば塩化アンモニウム、塩化
亜鉛、フッ化水素酸等の無機系塩類・酸類といった腐食
性のものが多く含有されているため、フラックスが残っ
てしまうと接合部に腐食が起こり、接合強度を損ってし
まう。Additionally, flux contains many corrosive substances such as inorganic salts and acids such as ammonium chloride, zinc chloride, and hydrofluoric acid, so if flux remains, corrosion will occur in the joints. This will reduce the bonding strength.
このフラックスを除去するため、はんだ接合された部品
を加熱し溶剤で洗い流すという工程を何度も繰り返す必
要があった。To remove this flux, it was necessary to repeat the process of heating the soldered parts and washing them away with solvent many times.
また、フラックスを用いても低融点はんだが接合面の全
面に薄く均一に行き渡らないこともあり、圧電素子１と
金属振動板２との密着性に対する信頼度が必ずしも十分
とはいえないという問題点があった。In addition, even when flux is used, the low melting point solder may not be spread thinly and uniformly over the entire bonding surface, so there is a problem that the reliability of the adhesion between the piezoelectric element 1 and the metal diaphragm 2 is not necessarily sufficient. was there.
本発明は上記の問題点を解決するためになされたもので
あり、その目的とするところは、接合後の除去処置が面
倒なフラックスを用いることなく、圧電素子と金属板と
の信頼性の高い金属ろう材による接合を可能とするイン
クジェット印字ヘッドの製造方法を提供することにある
。The present invention has been made to solve the above problems, and its purpose is to provide a highly reliable bond between a piezoelectric element and a metal plate without using flux, which is troublesome to remove after bonding. An object of the present invention is to provide a method for manufacturing an inkjet print head that enables bonding using a metal brazing material.
［課題を解決するための手段］
上記の目的を達成するため、本発明では、金属板と圧電
素子とを接合した構造を有するインクジェット印字ヘッ
ドの製造方法において、金属薄膜が蒸着された圧電素子
と金属板との間にろう材層を介在させて積層密着し、そ
の積層物に熱及び超音波振動を加えることにより前記ろ
う材層を溶融し金属板と圧電素子とを接合するようにし
たことを特徴とするインクジェット印字ヘッドの製造方
法が提供される。[Means for Solving the Problems] In order to achieve the above object, the present invention provides a method for manufacturing an inkjet print head having a structure in which a metal plate and a piezoelectric element are bonded. The piezoelectric element is bonded to the metal plate by interposing a brazing metal layer between the piezoelectric element and the metal plate, and applying heat and ultrasonic vibration to the laminate to melt the brazing metal layer. A method of manufacturing an inkjet print head is provided.
［作用］
上記の方法によれば、ろう材層を有する積層物に超音波
振動を加えることにより、金属板へのキャビテーション
作用によって金属板表面の酸化皮膜を物理的に破壊する
ため、ろう材は金属板表面に均一に拡散する。また、同
時に超音波振動によって、ろう材中の気泡が脱泡されろ
う材中にボイドが生じることを防ぐ。[Effect] According to the above method, by applying ultrasonic vibration to a laminate having a brazing material layer, the oxide film on the surface of the metal plate is physically destroyed by cavitation action on the metal plate, so that the brazing material is Diffuses uniformly on the metal plate surface. Furthermore, at the same time, the ultrasonic vibrations remove bubbles in the brazing material, thereby preventing voids from forming in the brazing material.
［実施例］
以下、本発明を具体化した一実施例を図面を参照して説
明する。[Example] Hereinafter, an example embodying the present invention will be described with reference to the drawings.
第１図はインクジェット印字ヘッドの圧電素子積層物及
び接合装置を示す断面図である。FIG. 1 is a sectional view showing a piezoelectric element laminate and a bonding device of an inkjet print head.
予め分極処理が施されたセラミック系の圧電素子１１の
表面には、スパッタリングにより金属蒸着膜１３が形成
されている。蒸着する金属にはクロム、ニッケル、スズ
などが用いられる。一方、金属振動板１２の圧電素子１
１との接合面には、Ｐｂ−Ｓｎ−Ｚｎ−Ｓｂ合金から成
るろう材層１４が形成されている。上記合金は、通常の
はんだにＺｎ及びｓｂを加えて４元系合金としたもので
、本実施例では、旭硝子社製の商品名セラソルザを用い
た。このセラソルザは、濡れ性が良いという特性を有し
ており、フラックスを用いずに使用することができるも
のである。A metal vapor deposition film 13 is formed by sputtering on the surface of the ceramic piezoelectric element 11 which has been subjected to polarization treatment in advance. The metals used for vapor deposition include chromium, nickel, and tin. On the other hand, the piezoelectric element 1 of the metal diaphragm 12
A brazing material layer 14 made of a Pb-Sn-Zn-Sb alloy is formed on the joint surface with 1. The above alloy is a quaternary alloy made by adding Zn and sb to ordinary solder, and in this example, Cerasolza, a trade name manufactured by Asahi Glass Co., Ltd., was used. This Cerasolzer has good wettability and can be used without using flux.
これら圧電素子１１．金属蒸着膜１３．ろう材層１４．
及び金属振動板１２から構成される圧電素子積層物１０
を接合する接合方法について説明する。超音波振動発生
装置付ホットプレート１５には、ヒータ１５ａが設けら
れるとともに超音波振動発生部１６が接続されており、
該発生部１６は超音波振動発振器１７に接続されている
。このホットプレート１５上に積層物１０を設置させ、
さらにその上に加圧装置１８を載置する。この加圧装置
１８は、分極された圧電素子１１を破壊しない程度の圧
力が加えられるように設定されている。また、ホットプ
レート１５の加熱温度は、圧電素子のキュリー点３１５
℃〜３４０℃より低く、Ｐｂ−５ｎ−Ｚｎ−８ｂ合金（
セラソルザ）の溶融温度１７０℃〜２４０℃（４元素の
成分比により異なる）よりも高い温度に設定されている
。These piezoelectric elements 11. Metal vapor deposition film 13. Brazing material layer 14.
and a piezoelectric element laminate 10 composed of a metal diaphragm 12
The joining method for joining will be explained. The hot plate 15 with an ultrasonic vibration generator is provided with a heater 15a and is connected to an ultrasonic vibration generator 16.
The generator 16 is connected to an ultrasonic vibration oscillator 17. The laminate 10 is placed on this hot plate 15,
Furthermore, a pressurizing device 18 is placed on top of it. This pressurizing device 18 is set to apply a pressure that does not destroy the polarized piezoelectric element 11. Further, the heating temperature of the hot plate 15 is set to 315, the Curie point of the piezoelectric element.
℃ ~ lower than 340℃, Pb-5n-Zn-8b alloy (
The temperature is set higher than the melting temperature of 170° C. to 240° C. (varies depending on the component ratio of the four elements) of Cerasolza).
次に、本実施例における作用を説明する。上記の超音波
振動発生装置付ホットプレート１５上に、ろう材層１４
を予め介在させた圧電素子積層物１０を設置し、さらに
その上に加圧装置１８を載置する。すると、積層物１０
にホットプレート１５からの熱が伝わり、ろう材層１４
は加熱溶融される。他方、金属振動板１２及び金属蒸着
膜１３の接合面には、ホットプレート１５からの超音波
振動が与えられ、接合面表面の酸化皮膜が物理的に破壊
される現象が生じる。溶融されたろう材ｐｂ−Ｓｎ−Ｚ
ｎ−８ｂ合金はその特性である濡れ性の良さ、接合面の
酸化皮膜が破壊され除去されたこと、及び超音波振動が
ろう材にも伝わり拡散作用が生じることという３つの要
因により、接合面全体に充分に拡散し、かつ冷却後強力
な接合力を呈するよう接合面内部の金属分子間に作用す
る。Next, the operation of this embodiment will be explained. A brazing metal layer 14 is placed on the hot plate 15 with the ultrasonic vibration generator.
A piezoelectric element laminate 10 with a laminate 10 interposed in advance is installed, and a pressurizing device 18 is placed on top of the piezoelectric element laminate 10. Then, the laminate 10
The heat from the hot plate 15 is transferred to the brazing material layer 14.
is heated and melted. On the other hand, the ultrasonic vibration from the hot plate 15 is applied to the joint surface of the metal diaphragm 12 and the metal vapor deposited film 13, causing a phenomenon in which the oxide film on the surface of the joint surface is physically destroyed. Melted brazing filler metal pb-Sn-Z
N-8B alloy has three factors: its good wettability, the oxide film on the joint surface is destroyed and removed, and the ultrasonic vibration is transmitted to the brazing material, causing a diffusion effect. It diffuses sufficiently throughout the entire body and acts between metal molecules inside the bonding surface so as to exhibit strong bonding force after cooling.
また、ろう材層１４内に発生しがちな気泡は、ろう材層
１４に伝達される超音波振動の脱泡作用により、接合部
外部へ除去されるのでボイドも生じない。従って、フラ
ックスを用いることなく圧電素子１１と金属振動板１２
とを強力に接合することができる。In addition, air bubbles that tend to occur in the brazing material layer 14 are removed to the outside of the joint by the defoaming effect of the ultrasonic vibrations transmitted to the brazing material layer 14, so that no voids occur. Therefore, the piezoelectric element 11 and the metal diaphragm 12 can be connected without using flux.
and can be strongly bonded.
［発明の効果］
以上詳述したことから明らかなように、本発明によれば
、フラックスを用いることなく圧電素子と金属板との信
頼性の高い金属ろう材による接合が可能となる。[Effects of the Invention] As is clear from the detailed description above, according to the present invention, a piezoelectric element and a metal plate can be joined with a highly reliable metal brazing material without using flux.
第１図は本発明のインクジェット印字ヘッドの圧電素子
積層物及び接合装置を示す断面図、第２図は従来のはん
だ接合方法を示す断面図である。
図中、１０は圧電素子積層物、１１は圧電素子、１２は
金属振動板、１３は金属蒸着膜、１４はろう材層、１５
は超音波振動発生装置付ホットプレート、１５ａはヒー
タ、１６は超音波振動発生部、１７は超音波発振器であ
る。FIG. 1 is a sectional view showing a piezoelectric element laminate and a bonding device for an inkjet print head according to the present invention, and FIG. 2 is a sectional view showing a conventional solder bonding method. In the figure, 10 is a piezoelectric element laminate, 11 is a piezoelectric element, 12 is a metal diaphragm, 13 is a metal vapor deposition film, 14 is a brazing material layer, 15
15a is a heater, 16 is an ultrasonic vibration generator, and 17 is an ultrasonic oscillator.
Claims (1)
ジェット印字ヘッドの製造方法において、金属薄膜が蒸
着された圧電素子と金属板との間にろう材層を介在させ
て積層密着し、 その積層物に熱及び超音波振動を加えることにより前記
ろう材層を溶融し、金属板と圧電素子とを接合するよう
にしたことを特徴とするインクジェット印字ヘッドの製
造方法。 ２、前記ろう材層はＰｂ−Ｓｎ−Ｚｎ−Ｓｂ合金から成
る請求項１記載のインクジェット印字ヘッドの製造方法
。[Claims] 1. In a method for manufacturing an inkjet print head having a structure in which a metal plate and a piezoelectric element are bonded, a brazing material layer is interposed between the piezoelectric element on which a metal thin film is deposited and the metal plate. A method for manufacturing an inkjet print head, characterized in that the metal plate and the piezoelectric element are bonded by laminating the metal plate in close contact with each other, and melting the brazing material layer by applying heat and ultrasonic vibration to the laminate. 2. The method of manufacturing an inkjet print head according to claim 1, wherein the brazing material layer is made of a Pb-Sn-Zn-Sb alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28151589A JPH03142248A (en) | 1989-10-27 | 1989-10-27 | Manufacture of ink-jet printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28151589A JPH03142248A (en) | 1989-10-27 | 1989-10-27 | Manufacture of ink-jet printing head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03142248A true JPH03142248A (en) | 1991-06-18 |
Family
ID=17640258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28151589A Pending JPH03142248A (en) | 1989-10-27 | 1989-10-27 | Manufacture of ink-jet printing head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03142248A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7141917B2 (en) * | 1999-08-27 | 2006-11-28 | Product Systems Incorporated | Indium or tin bonded acoustic transducer systems |
| WO2010046980A1 (en) * | 2008-10-23 | 2010-04-29 | 東芝ストレージデバイス株式会社 | Carriage assembly, method of producing the same, and information storing device |
-
1989
- 1989-10-27 JP JP28151589A patent/JPH03142248A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7141917B2 (en) * | 1999-08-27 | 2006-11-28 | Product Systems Incorporated | Indium or tin bonded acoustic transducer systems |
| WO2010046980A1 (en) * | 2008-10-23 | 2010-04-29 | 東芝ストレージデバイス株式会社 | Carriage assembly, method of producing the same, and information storing device |
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