WO2010046980A1 - Carriage assembly, method of producing the same, and information storing device - Google Patents

Carriage assembly, method of producing the same, and information storing device Download PDF

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Publication number
WO2010046980A1
WO2010046980A1 PCT/JP2008/069182 JP2008069182W WO2010046980A1 WO 2010046980 A1 WO2010046980 A1 WO 2010046980A1 JP 2008069182 W JP2008069182 W JP 2008069182W WO 2010046980 A1 WO2010046980 A1 WO 2010046980A1
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Prior art keywords
carriage
suspension
solder
carriage assembly
connecting portion
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PCT/JP2008/069182
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French (fr)
Japanese (ja)
Inventor
健二 小八重
則夫 海沼
由行 佐藤
敏幸 中田
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東芝ストレージデバイス株式会社
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Priority to PCT/JP2008/069182 priority Critical patent/WO2010046980A1/en
Publication of WO2010046980A1 publication Critical patent/WO2010046980A1/en

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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives

Definitions

  • the present invention relates to a carriage assembly, a manufacturing method thereof, and an information storage device, and more specifically, a suspension supporting a head, a carriage assembly in which a carriage supporting the suspension is connected, a manufacturing method thereof, and the carriage assembly.
  • the present invention relates to an information storage device.
  • a magnetic disk device that records and reproduces information includes a magnetic disk and a magnetic head for accessing the magnetic disk.
  • the magnetic head is provided on a head slider, the head slider is supported by a suspension, and the suspension is further supported by a carriage to form a carriage assembly.
  • the head slider has a floating force caused by an air fluid generated when the recording medium (magnetic disk) rotates at a high speed, and a spring pressure biased toward the recording medium by a suspension supporting the head slider.
  • the balance floats on the magnetic disk while keeping a minute gap, and data is recorded / reproduced on the magnetic disk. Therefore, high shape accuracy is required for the carriage assembly, particularly the suspension support structure.
  • Patent Documents 1 to 7 have been proposed as conventional techniques related to a method of manufacturing a carriage assembly that can be formed with high accuracy by preventing deformation in the manufacturing process.
  • the method for manufacturing a carriage assembly is a method for manufacturing a carriage assembly including a suspension that supports a head that records or reproduces information on a recording medium, and a carriage that supports the suspension.
  • the suspension and the carriage are clamped so as to be finely movable with each other in a state where solder is interposed between the connecting portion of the carriage, the solder is heated, and ultrasonic waves having a predetermined frequency are applied to the carriage. Thereafter, the suspension and the carriage are clamped immovably with each other, the solder is cooled, and the suspension and the carriage are connected by joining the solder.
  • the carriage assembly 100 is formed by attaching a suspension 112 to a plurality of arm portions 111 arranged in parallel to each other at the leading end of the carriage 110 in accordance with the arrangement interval of recording media.
  • a head slider 114 having a magnetic head 113 used for recording / reproducing information is mounted on the tip of the suspension 112.
  • the magnetic head 113 formed on the head slider 114 is electrically connected by, for example, a flexible substrate (not shown).
  • a suspension hole is formed in an attachment hole 110a formed at the tip of the carriage 110.
  • the caulking portion 112a formed at the base portion 112 is aligned and temporarily fixed in the state shown in FIG.
  • a ball 120 made of a metal having a diameter slightly larger than the inner diameter of the caulking hole 112b of the caulking portion 112a is press-fitted into the caulking hole 112b, passes through the caulking hole 112b, and then enters the carriage 110.
  • the suspension 112 is fixed.
  • the ball 120 is formed to have a slightly larger diameter than the caulking hole 112b.
  • the caulking portion 112a is pushed and widened, and the suspension 112 is caulked and fixed to the carriage 110.
  • the ball 120 is press-fitted into the caulking hole 112b, deformation due to caulking occurs. Therefore, when a ball 120 is press-fitted into the caulking hole 112b by applying ultrasonic vibration to a tool (not shown) for press-fitting the ball 120. Measures are taken to prevent the suspension 112 and the like from being deformed by reducing the stress of the suspension.
  • the caulking is performed by plastically deforming the caulking hole 112b of the suspension 112 and press-contacting the inside of the mounting hole 110a of the carriage 110.
  • the phenomenon of deformation plastic deformation
  • FIG. 9 the phenomenon of deformation
  • the suspension state of the suspension 112 to the carriage 110 deteriorates (deformation in the direction of the arrow in FIG. 9), and the flying height of the head slider 114, that is, the magnetic head 113 changes. It has a great influence on properties.
  • the special solder is bonded by applying ultrasonic waves to cause chemical bonding with the surface of the material to be bonded.
  • solder joining methods for applying ultrasonic waves have been conventionally performed by the following two methods, each having a problem.
  • the first method is a method using an ultrasonic soldering iron. In this method, there is a problem that unevenness occurs in the application of ultrasonic waves, and mass productivity is poor.
  • the second method is a method using an ultrasonic solder dip bath.
  • soldering is performed at all locations where the solder touches, it is necessary to apply a resin coating or the like to a portion where solder bonding is not performed, and there is a problem that costs increase.
  • a method for manufacturing the carriage assembly 10 according to the embodiment of the present invention will be described. First, a predetermined amount of solder 5 is placed on the connecting portion 11 of the carriage 1, the connecting portion 21 of the suspension 2, or both. In the present embodiment, the solder 5 is placed in a solder dam 15 (described later) of the connecting portion 11 of the carriage 1.
  • solder for example, “Cerasolzer”: registered trademark of Kuroda Techno Co., Ltd.
  • solder that is bonded by applying ultrasonic waves of a predetermined frequency in a heating environment and that can be dissociated by reheating is used.
  • the carriage 1 and the suspension 2 are positioned and fixed at predetermined positions so that the connecting portion 21 of the suspension 2 and the connecting portion 11 of the carriage 1 are aligned.
  • FIG. 1 only one suspension 2 is shown for simplification of the drawing.
  • the carriage 1 and the suspension 2 are fixed by being clamped by the upper clamp portion 31 and the lower clamp portion 32.
  • the clamping force can be exerted on the entire vertical direction by inserting the block 33 with a heating mechanism between the back surfaces of the connection portion 21 of the suspension 2 (the surface not connected to the carriage 1).
  • a heating mechanism is provided to heat the solder 5.
  • the strength to clamp is set to a strength that allows the carriage 1 and the suspension 2 to slightly move each other when an ultrasonic wave having a predetermined frequency in a subsequent process is applied.
  • the thickness of the heating mechanism-equipped block 33 is the same as the distance between the back surfaces of the connecting portion 21 of the suspension 2 or the deformation due to the clamp of the arm portion 12 at the carriage tip is within the elastic deformation region. The dimensions are slightly smaller.
  • an ultrasonic wave having a predetermined frequency is applied to the carriage 1 by the ultrasonic transducer 34.
  • the ultrasonic transducer 34 caused by heat damage is applied. Breakage can be prevented.
  • the strength of clamping by the upper clamp portion 31 and the lower clamp portion 32 is increased, and the carriage 1 and the suspension 2 are fixed to each other with an immovable strength.
  • the carriage 1 and the suspension 2 are connected by solder bonding.
  • the carriage 1 and the suspension 2 are often used in a heating environment by using the solder 5 (the special solder as an example), which is often made of a material that is difficult to solder, such as an aluminum alloy or stainless steel.
  • This can be realized by applying an ultrasonic wave below. That is, since heating of the solder 5 and application of ultrasonic waves can be performed at the same time, it is possible to solve the problem of conventional ultrasonic application and solder bonding to only the necessary portions. In this way, the carriage assembly 10 according to this embodiment shown in FIG.
  • solder dams 15 are provided in the connecting portion 11 of the carriage 1 (the solder dams 15 are provided in duplicate).
  • Example of case). 4A is a plan view
  • FIG. 4B is a front sectional view. According to this configuration, after the suspension 2 and the carriage 1 that supports the suspension 2 are connected by soldering, the solder 5 at the outermost periphery can be sealed with the solder 5 at the outermost periphery. . That is, when the solder 5 at the joint is exposed inside the magnetic disk device, the solder 5 after joining is lost and becomes particles in the magnetic disk device, which can be prevented.
  • solder dam 15 located on the outermost periphery needs to be formed in a continuous peripheral wall shape (see FIG. 4A), but the inner solder dam 15 is not necessarily in a continuous peripheral wall shape. It doesn't have to be.
  • the upper end surface 15a of the solder dam 15 and the surface of the connecting portion 21 of the suspension 2 are fixed, the mounting position does not vary and the height is high. The effect that it can position accurately is also acquired.
  • shapes as shown in FIGS. 5A and 5B are also conceivable (FIG. 5A is a plan view and FIG.
  • the solder dam 15 is provided in the connecting portion 11 of the carriage 1.
  • the present invention is not limited thereto, and may be provided in the connecting portion 21 of the suspension 2. 11 and the connecting portion 21 of the suspension 2 may be provided.
  • a characteristic configuration of the carriage assembly 10 according to the present embodiment as shown in FIG. 3, a plurality of arm portions 12 are provided at the tip of the carriage 1, and a plurality of suspensions 2 are provided on the arm portions 12.
  • the arm portion 12 in the case of FIG. 3, the central arm portion in which the coupling portions 11 are provided on both the upper surface and the lower surface is located between the upper surface coupling portion 11 and the lower surface coupling portion 11.
  • a heat insulating material 16 is provided. Instead of the breaker 16, it may be formed in a cavity.
  • the carriage 1 and the suspension 2 are connected by using the solder 5 that can be dissociated by reheating. 2 is found, it is possible to remove only the suspension 2 from the carriage 1 and replace it with a non-defective suspension 2.
  • the arm portion 12 provided with the connecting portions 11 on both the upper surface and the lower surface is subjected to reheating during replacement work of the suspension 2 (for example, the upper surface side). Even with respect to the suspension 2 that does not need to be replaced (for example, the lower surface side), the connecting portion (the connecting portion 11 and the connecting portion 21 and the solder 5 at the relevant portion) is heated, and the dissociation of the joint occurs. Occurs. With respect to such a problem, an arbitrary connecting portion (the connecting portion 11 and the connecting portion) in the arm portion 12 in which the connecting portions 11 are provided on both the upper surface and the lower surface by the structure in which the heat insulating material 16 (or the cavity) is provided.
  • FIG. 21 and only the solder 5) in the corresponding part can be heated to a predetermined junction dissociation temperature, and the solution is possible.
  • FIG. 21 and only the solder 5 in the corresponding part can be heated to a predetermined junction dissociation temperature, and the solution is possible.
  • FIG. 21 and only the solder 5 in the corresponding part can be heated to a predetermined junction dissociation temperature, and the solution is possible.
  • FIG. 21 and only the solder 5 a schematic configuration of a magnetic disk device 40 is shown in FIG.
  • the housing 41 of the magnetic disk device 40 has a recording medium (magnetic disk) 42 on which information is recorded, a spindle motor 43 that rotates the magnetic disk 42, and a magnetic head 3 that faces the surface of the magnetic disk 42 in close proximity.
  • the slider 4 (see FIG.
  • the magnetic disk device 40 records information on the magnetic disk 42 using the magnetic field of the magnetic head 3 and reproduces the information recorded on the magnetic disk 42.
  • the magnetic disk device 40 includes a plurality of magnetic disks 42 (see FIG. 6), and includes a plurality of magnetic heads 3 that access information to the front and back surfaces of the plurality of magnetic disks 42, respectively. (See FIG. 3).
  • the magnetic disk device 40 is provided with a suspension 2 having a magnetic head 3 at the tip, one for each of the front and back surfaces of the magnetic disk 42, and the plurality of suspensions 2 are connected to the carriage 1.
  • the plurality of magnetic heads 3 move together is performed.
  • the mounting accuracy of the suspension 2 can be increased particularly by providing the carriage assembly 10 having high shape accuracy. Since there is no variation in the flying height of the head slider 4 which records and reproduces information by flying over the magnetic disk 42, it is possible to provide an information storage device with stable output.
  • the carriage assembly and the manufacturing method thereof according to the present embodiment it is possible to realize a carriage assembly having high shape accuracy, particularly with respect to the suspension mounting structure. Further, according to the information storage device provided with the carriage assembly, it is possible to eliminate variations in the flying height of the head slider and stabilize the output.

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  • Supporting Of Heads In Record-Carrier Devices (AREA)

Abstract

A method of producing a carriage assembly having high shape accuracy. The carriage assembly is provided with a suspension which supports a head for recording and playing back information in a recording medium, and also with a carriage for supporting the suspension. With solder disposed between a connecting section of the suspension and a connecting section of the carriage, the suspension and the carriage are clamped together so as to be finely movable relative to each other. Then, the solder is heated and an ultrasonic wave with a predetermined frequency is applied to the carriage. After that, the suspension and the carriage are clamped together so as not to be movable relative to each other, and then the solder is cooled to join the suspension and the carriage together by the solder.

Description

キャリッジアッセンブリとその製造方法および情報記憶装置Carriage assembly, manufacturing method thereof, and information storage device
 本発明は、キャリッジアッセンブリとその製造方法および情報記憶装置に関し、さらに詳細には、ヘッドを支持するサスペンションと、該サスペンションを支持するキャリッジとが連結されたキャリッジアッセンブリとその製造方法、および該キャリッジアッセンブリを備える情報記憶装置に関する。
 
The present invention relates to a carriage assembly, a manufacturing method thereof, and an information storage device, and more specifically, a suspension supporting a head, a carriage assembly in which a carriage supporting the suspension is connected, a manufacturing method thereof, and the carriage assembly. The present invention relates to an information storage device.
 情報の記録・再生を行う磁気ディスク装置は、磁気ディスクと、磁気ディスクにアクセスするための磁気ヘッドとを備える。磁気ヘッドはヘッドスライダに設けられ、ヘッドスライダはサスペンションによって支持され、さらにサスペンションはキャリッジによって支持されて、キャリッジアッセンブリとして形成される。
 上記構成を備えて、ヘッドスライダは、記録媒体(磁気ディスク)が高速回転することにより発生する空気流体による浮上力と、ヘッドスライダを支持するサスペンションによって記録媒体方向に付勢されるバネ圧とのバランスで、微小な間隙を保って磁気ディスク上を浮上して、磁気ディスクにデータの記録・再生を行うものである。
 したがって、キャリッジアッセンブリ、特にサスペンションの支持構造には高い形状精度が要求される。
 ここで、製造工程における変形を防止して、高精度の形成が可能なキャリッジアッセンブリの製造方法に関する従来技術として、例えば、特許文献1~7に記載された方法等が提案されている。
特開2004-127491号公報 特開2005-353224号公報 特開2007-157178号公報 特開2007-157179号公報 特開2007-213640号公報 特開2007-213742号公報 特開2008-073729号公報
A magnetic disk device that records and reproduces information includes a magnetic disk and a magnetic head for accessing the magnetic disk. The magnetic head is provided on a head slider, the head slider is supported by a suspension, and the suspension is further supported by a carriage to form a carriage assembly.
With the above-described configuration, the head slider has a floating force caused by an air fluid generated when the recording medium (magnetic disk) rotates at a high speed, and a spring pressure biased toward the recording medium by a suspension supporting the head slider. The balance floats on the magnetic disk while keeping a minute gap, and data is recorded / reproduced on the magnetic disk.
Therefore, high shape accuracy is required for the carriage assembly, particularly the suspension support structure.
Here, for example, methods described in Patent Documents 1 to 7 have been proposed as conventional techniques related to a method of manufacturing a carriage assembly that can be formed with high accuracy by preventing deformation in the manufacturing process.
JP 2004-127491 A JP 2005-353224 A JP 2007-157178 A JP 2007-157179 A Japanese Patent Laid-Open No. 2007-213640 JP 2007-213742 A JP 2008-073729 A
 本発明は、高い形状精度を有するキャリッジアッセンブリの製造方法を提供することを目的とする。
 本発明は、以下に記載するような解決手段により、前記課題を解決する。このキャリッジアッセンブリの製造方法は、記録媒体に対して情報の記録もしくは再生を行うヘッドを支持するサスペンション、および該サスペンションを支持するキャリッジを備えるキャリッジアッセンブリの製造方法であって、前記サスペンションの連結部と前記キャリッジの連結部との間に半田を介在させた状態で、該サスペンションと該キャリッジとを相互に微動可能にクランプして、該半田を加熱すると共に該キャリッジに所定周波数の超音波を印加した後、該サスペンションと該キャリッジとを相互に不動にクランプして、該半田の冷却を行い、該サスペンションと該キャリッジとを該半田の接合により連結することを要件とする。
 
An object of the present invention is to provide a method for manufacturing a carriage assembly having high shape accuracy.
The present invention solves the above-described problems by the solving means described below. The method for manufacturing a carriage assembly is a method for manufacturing a carriage assembly including a suspension that supports a head that records or reproduces information on a recording medium, and a carriage that supports the suspension. The suspension and the carriage are clamped so as to be finely movable with each other in a state where solder is interposed between the connecting portion of the carriage, the solder is heated, and ultrasonic waves having a predetermined frequency are applied to the carriage. Thereafter, the suspension and the carriage are clamped immovably with each other, the solder is cooled, and the suspension and the carriage are connected by joining the solder.
発明の効果
 本発明によれば、形状精度、特にサスペンションのキャリッジへの取り付け精度(特に、平面度)が高精度のキャリッジアッセンブリを提供することが可能となる。
 
Effects of the Invention According to the present invention, it is possible to provide a carriage assembly with high accuracy in shape accuracy, in particular, accuracy in mounting a suspension to a carriage (in particular, flatness).
本発明の実施形態に係るキャリッジアッセンブリの製造方法を説明するための概略図である。It is the schematic for demonstrating the manufacturing method of the carriage assembly which concerns on embodiment of this invention. 本発明の実施形態に係るキャリッジアッセンブリの製造方法を説明するための概略図である。It is the schematic for demonstrating the manufacturing method of the carriage assembly which concerns on embodiment of this invention. 本発明の実施形態に係るキャリッジアッセンブリの例を示す概略図である。It is the schematic which shows the example of the carriage assembly which concerns on embodiment of this invention. 図4Aおよび図4Bは、本発明の実施形態に係るキャリッジアッセンブリの半田ダムの例を示す概略図である。4A and 4B are schematic views showing examples of solder dams of the carriage assembly according to the embodiment of the present invention. 図5Aおよび図5B本発明の実施形態に係るキャリッジアッセンブリの半田ダムの他の例を示す概略図である。5A and 5B are schematic views showing another example of a solder dam of the carriage assembly according to the embodiment of the present invention. 本発明の実施形態に係る情報記憶装置の例を示す概略図である。It is the schematic which shows the example of the information storage device which concerns on embodiment of this invention. 従来の実施形態に係るキャリッジアッセンブリの製造方法を説明するための概略図である。It is the schematic for demonstrating the manufacturing method of the carriage assembly which concerns on the conventional embodiment. 従来の実施形態に係るキャリッジアッセンブリの製造方法を説明するための概略図である。It is the schematic for demonstrating the manufacturing method of the carriage assembly which concerns on the conventional embodiment. 従来の実施形態に係るキャリッジアッセンブリの製造方法における課題を説明するための概略図である。It is the schematic for demonstrating the subject in the manufacturing method of the carriage assembly which concerns on the conventional embodiment.
 まず、従来のキャリッジアッセンブリの製造方法について説明する。
 従来は、かしめによってキャリッジとサスペンションとを接合していた。ここで、図7、図8を用いて、従来のキャリッジアッセンブリ100の全体構成について説明する。キャリッジアセンブリ100は、キャリッジ110の先端において、記録媒体の配置間隔に合わせて互いに平行に複数個配置されるアーム部111に、サスペンション112を取り付けて形成される。サスペンション112の先端には情報の記録・再生に用いられる磁気ヘッド113を備えたヘッドスライダ114が搭載されている。なお、ヘッドスライダ114に形成されている磁気ヘッド113は、例えばフレキシブル基板(不図示)によって電気的な接続が行われる。
 続いて、従来のキャリッジアッセンブリ100の製造方法、すなわち、キャリッジ110にサスペンション112を固定して取り付ける方法の概略として、図7に示すように、キャリッジ110の先端に形成された取り付け孔110aに、サスペンション112の基部に形成されたかしめ部112aを位置合わせして、図8に示す状態で仮固定する。次いで、同図に示すようにかしめ部112aのかしめ孔112bの内径よりもわずかに大径に形成された金属からなるボール120をかしめ孔112bに圧入し、かしめ孔112bを通過させてキャリッジ110にサスペンション112を固定する。ボール120はかしめ孔112bよりもわずかに大径に形成されており、かしめ孔112bをボール120が通過する際にかしめ部112aが押し広げられ、サスペンション112がキャリッジ110にかしめ固定される。なお、ボール120をかしめ孔112bに圧入する際には、かしめによる変形が生じるため、ボール120を圧入するツール(不図示)に超音波振動を作用させ、ボール120をかしめ孔112bに圧入する際の応力を低減させるようにして、サスペンション112等に変形が生じないようにする対策が採られている。
 しかし、上記に例示される従来のキャリッジアッセンブリの製造方法において、かしめはサスペンション112のかしめ孔112bを塑性変形させ、キャリッジ110の取り付け孔110a内部に圧接することにより接合するものであるため、本来、図8に示す形状となるべきところが、かしめを実施することによって、図9に示す形状のように変形(塑性変形)してしまう現象が発生する。このように、サスペンション112のキャリッジ110への取り付け状態(特に、平面度)が悪化すること(図9中の矢印方向への変形)によって、ヘッドスライダ114すなわち磁気ヘッド113の浮上量が変化し、特性に大きな影響を及ぼす。
 ここで、上記の変形を防止するため、かしめを用いずに接着により接合する方法が考えられる。先行技術として、接合時の変形防止を解決課題とする技術ではないが、半田を用いたキャリッジとサスペンションとの接合方法も開示されている(特開平9-73745号公報)。
 しかしながら、通常、キャリッジやサスペンションにはアルミニウム合金やステンレス鋼といった半田付けが困難な材料が用いられることが多く、合金化が必要な通常の半田(例えば、錫-鉛、錫-銀、錫-銀-銅、等)では接合できない。
 このため化学結合によって接合する特殊半田(例「セラソルザー」:黒田テクノ株式会社登録商標)を用いる方法も考えられる。当該特殊半田は、半田接合を行う際、超音波を与えて被接合材料表面との化学結合を起こすことによって接合が行われるものである。しかし、このような超音波を印加する半田接合方法は、従来、以下の2つの方法によって行われ、それぞれに課題があった。第1の方法は、超音波半田コテを用いる方法である。この方法では、超音波のかかり方にムラが発生し、また量産性が悪いという課題があった。また、第2の方法として、超音波半田ディップ槽を用いる方法である。この方法では、半田が触れた場所すべてに半田付けされてしまうため、半田接合を行わない部位に樹脂コーティング等を施す必要があり、コストがかかるという課題があった。
 続いて、本発明の実施形態に係るキャリッジアッセンブリ10の製造方法について説明する。
 まず、キャリッジ1の連結部11もしくはサスペンション2の連結部21またはその両方に所定量の半田5を載置する。本実施形態では、キャリッジ1の連結部11の半田ダム15(後述)内に半田5を載置している。当該半田5として、加熱環境下において、所定周波数の超音波を印加することにより接合され、また、再加熱によって接合の解離が可能な半田(例「セラソルザー」:黒田テクノ株式会社登録商標)を用いる。
 次いで、図1に示すように、サスペンション2の連結部21と前記キャリッジ1の連結部11とを合わせるようにして、キャリッジ1とサスペンション2とを所定位置に位置決めして固定する。なお、図1では、図の簡略化のため、一つのサスペンション2のみを図示している。
 本実施形態においては、図2に示すように、上部クランプ部31と下部クランプ部32とによってクランプしてキャリッジ1とサスペンション2とを固定する。このとき、サスペンション2の連結部21の裏面(キャリッジ1と連結されない側の面)同士の間に加熱機構付ブロック33を挿入することによって、クランプ力を上下方向の全体に及ぼすことが可能となると共に、加熱機構を備えて、半田5の加熱が可能となる。
 ここで、クランプする強さは、後工程における所定周波数の超音波が印加されたときに、キャリッジ1とサスペンション2とが相互に微動可能な強さに設定する。
 また、加熱機構付ブロック33の厚さは、前記のサスペンション2の連結部21の裏面同士の間の距離に対して、同寸法、もしくはキャリッジ先端のアーム部12のクランプによる変形が弾性変形領域内となる若干小さい寸法とする。
 次いで、加熱機構付ブロック33によって半田5を所定温度まで加熱した状態で、超音波振動子34によってキャリッジ1に所定周波数の超音波を印加する。図2のように、加熱箇所(連結部11)から遠い位置(後端部13)において、キャリッジ1に超音波振動子34から超音波印加を行うことによって、熱害による超音波振動子34の破損を防止することができる。
 次いで、上部クランプ部31と下部クランプ部32によってクランプする強さを強めて、キャリッジ1とサスペンション2とを相互に不動な強さで固定する。
 その状態で、加熱機構付ブロック33による加熱を停止して、半田5を所定温度まで冷却する。
 以上の一連の工程によって、キャリッジ1とサスペンション2とが半田接合によって連結される。
 上記の方法によれば、アルミニウム合金やステンレス鋼といった半田付けが困難な材料が用いられることが多いキャリッジ1とサスペンション2との接合を、半田5(一例として前記特殊半田)を用いて、加熱環境下で超音波印加を行なうことによって実現することができる。すなわち、半田5の加熱と超音波印加を同時に行うことができるため、従来の課題であった安定した超音波印加と、必要部のみへの半田接合の解決が可能となる。
 このようにして、図3に示す本実施形態に係るキャリッジアッセンブリ10が製造される。
 ここで、本実施形態に係るキャリッジアッセンブリ10に特徴的な構成として、図4A、図4Bに示すように、キャリッジ1の連結部11に半田ダム15が設けられる(半田ダム15を二重に設ける場合の例)。なお、図4Aは平面図であり、図4Bは正面断面図である。
 この構成によれば、サスペンション2と、これを支持するキャリッジ1とが半田接合によって連結された後、少なくとも最外周の半田ダム15によって、接合部の半田5の密封が可能となる効果が得られる。すなわち、接合部の半田5が磁気ディスク装置内部で露出すると、接合後の半田5の欠落が発生して磁気ディスク装置内のパーティクルとなるため、その防止を図ることができる。この効果を得るために、少なくとも最外周に位置する半田ダム15は連続する周壁状(図4A参照)に形成される必要があるが、それよりも内方の半田ダム15は必ずしも連続する周壁状でなくても構わない。
 上記効果に加えて、半田ダム15の上端面15aとサスペンション2の連結部21の表面(キャリッジ1と連結される側の面)とが接した状態で固定すれば、取り付け位置に関してバラツキがなく高精度に位置決めすることができるという効果も得られる。
 なお、半田ダム15の構成に関する変形例として、図5A、図5Bに示すような形状も考えられる(図5Aは平面図であり、図5Bは正面断面図である)。このように半田ダム15を複数個所設けた場合、その半田量の増減に対応させることが可能となるため、半田量によるウェイトバランスの調整が可能となる効果が得られる。
 上記の通り、本実施形態では、半田ダム15をキャリッジ1の連結部11に設けたが、これに限定されず、サスペンション2の連結部21に設ける構成としてもよく、また、キャリッジ1の連結部11とサスペンション2の連結部21との両方に設ける構成としてもよい。
 また、本実施形態に係るキャリッジアッセンブリ10に特徴的な構成として、図3に示すように、キャリッジ1の先端に複数のアーム部12が設けられて、当該アーム部12に複数のサスペンション2が設けられる構造において、上面および下面の両面に連結部11が設けられるアーム部12(図3の場合、中央のアーム部)は、上面の連結部11と下面の連結部11との間の位置に、断熱材16が設けられる。なお、断絶材16に代えて、空洞に形成してもよい。
 ここで、前述のように、本実施形態では再加熱によって接合の解離が可能な半田5を用いてキャリッジ1とサスペンション2との連結が行われており、製造工程中の特性検査等において、サスペンション2に関わる不良が発見された場合に、当該サスペンション2のみをキャリッジ1から取り外して、良品のサスペンション2に交換することができる。
 しかし、図3で示す中央のアーム部12のように、上面および下面の両面に連結部11が設けられるアーム部12は、サスペンション2(例えば上面側)の交換作業時における再加熱の際に、交換の必要が無いサスペンション2(例えば下面側)に対しても、その連結部(連結部11と連結部21、および当該箇所の半田5)が加熱されてしまい、接合の解離が起こってしまう課題が生じる。
 このような課題に対して、上記の断熱材16(もしくは空洞)が設けられる構造によって、上面および下面の両面に連結部11が設けられるアーム部12における任意の連結部(連結部11と連結部21、および当該箇所の半田5)のみを所定の接合解離温度まで加熱することが可能となるため、その解決が可能となる。
 続いて、本発明の実施形態に係る情報記憶装置について説明する。
 情報記憶装置の一例として、磁気ディスク装置40の概略構成を図6に示す。磁気ディスク装置40のハウジング41には、情報が記録される記録媒体(磁気ディスク)42、磁気ディスク42を回転させるスピンドルモータ43、磁気ディスク42の表面に近接して対向する磁気ヘッド3を有するヘッドスライダ4(図3参照)、ヘッドスライダ4が先端に接着されたサスペンション2、サスペンション2がキャリッジ1の先端に連結され、アーム軸44を中心に磁気ディスク42上を面に沿って移動するキャリッジアセンブリ10、キャリッジアセンブリ10を駆動するボイスコイルモータ45、および磁気ディスク装置40の動作を制御する制御回路46が収容されている。磁気ディスク装置40は、磁気ヘッド3の磁場を使って磁気ディスク42に情報を記録し、磁気ディスク42に記録された情報を再生するものである。
 なお、この磁気ディスク装置40には、複数の磁気ディスク42が搭載されており(図6参照)、それら複数の磁気ディスク42の表裏面それぞれに対して情報アクセスを行う複数の磁気ヘッド3が備えられている(図3参照)。すなわち、磁気ディスク装置40には、磁気ディスク42の表裏面それぞれに対して1つずつ、先端に磁気ヘッド3が設けられたサスペンション2が備えられており、それら複数のサスペンション2がキャリッジ1に連結されることによって、複数の磁気ヘッド3が一体的に移動する動作が行われる。
 上記の構成を備える本実施形態に係る情報記憶装置(磁気ディスク装置40)によれば、高い形状精度を有するキャリッジアッセンブリ10を備えることによって、特にサスペンション2の取り付け精度の高精度化が図られ、磁気ディスク42上を浮上して情報の記録・再生を行うヘッドスライダ4の浮上量のバラツキがなくなるため、出力の安定した情報記憶装置を提供することが可能となる。
 以上説明した通り、本実施形態に係るキャリッジアッセンブリとその製造法によれば、特にサスペンションの取り付け構造に関して、高い形状精度を有するキャリッジアッセンブリの実現が可能となる。
 また、当該キャリッジアッセンブリを備える情報記憶装置によれば、ヘッドスライダの浮上量のバラツキをなくし、出力を安定化することが可能となる。
 
First, a conventional method for manufacturing a carriage assembly will be described.
Conventionally, the carriage and the suspension are joined by caulking. Here, the overall configuration of the conventional carriage assembly 100 will be described with reference to FIGS. The carriage assembly 100 is formed by attaching a suspension 112 to a plurality of arm portions 111 arranged in parallel to each other at the leading end of the carriage 110 in accordance with the arrangement interval of recording media. A head slider 114 having a magnetic head 113 used for recording / reproducing information is mounted on the tip of the suspension 112. The magnetic head 113 formed on the head slider 114 is electrically connected by, for example, a flexible substrate (not shown).
Subsequently, as an outline of a conventional method of manufacturing the carriage assembly 100, that is, a method of fixing and attaching the suspension 112 to the carriage 110, as shown in FIG. 7, a suspension hole is formed in an attachment hole 110a formed at the tip of the carriage 110. The caulking portion 112a formed at the base portion 112 is aligned and temporarily fixed in the state shown in FIG. Next, as shown in the figure, a ball 120 made of a metal having a diameter slightly larger than the inner diameter of the caulking hole 112b of the caulking portion 112a is press-fitted into the caulking hole 112b, passes through the caulking hole 112b, and then enters the carriage 110. The suspension 112 is fixed. The ball 120 is formed to have a slightly larger diameter than the caulking hole 112b. When the ball 120 passes through the caulking hole 112b, the caulking portion 112a is pushed and widened, and the suspension 112 is caulked and fixed to the carriage 110. When the ball 120 is press-fitted into the caulking hole 112b, deformation due to caulking occurs. Therefore, when a ball 120 is press-fitted into the caulking hole 112b by applying ultrasonic vibration to a tool (not shown) for press-fitting the ball 120. Measures are taken to prevent the suspension 112 and the like from being deformed by reducing the stress of the suspension.
However, in the conventional method of manufacturing a carriage assembly exemplified above, the caulking is performed by plastically deforming the caulking hole 112b of the suspension 112 and press-contacting the inside of the mounting hole 110a of the carriage 110. Where the shape shown in FIG. 8 is to be formed, the phenomenon of deformation (plastic deformation) occurs as shown in FIG. 9 by caulking. As described above, the suspension state of the suspension 112 to the carriage 110 (particularly flatness) deteriorates (deformation in the direction of the arrow in FIG. 9), and the flying height of the head slider 114, that is, the magnetic head 113 changes. It has a great influence on properties.
Here, in order to prevent the above-described deformation, a method of joining by adhesion without using caulking is conceivable. As a prior art, a technique for preventing deformation at the time of joining is not a solution, but a joining method of a carriage and a suspension using solder is also disclosed (Japanese Patent Laid-Open No. 9-73745).
However, materials that are difficult to solder such as aluminum alloy and stainless steel are usually used for carriages and suspensions, and ordinary solders that require alloying (eg, tin-lead, tin-silver, tin-silver) are often used. -Copper, etc.) cannot be joined.
For this reason, a method using a special solder (for example, “Cerasolzer”: registered trademark of Kuroda Techno Co., Ltd.) joined by chemical bonding is also conceivable. The special solder is bonded by applying ultrasonic waves to cause chemical bonding with the surface of the material to be bonded. However, such solder joining methods for applying ultrasonic waves have been conventionally performed by the following two methods, each having a problem. The first method is a method using an ultrasonic soldering iron. In this method, there is a problem that unevenness occurs in the application of ultrasonic waves, and mass productivity is poor. The second method is a method using an ultrasonic solder dip bath. In this method, since soldering is performed at all locations where the solder touches, it is necessary to apply a resin coating or the like to a portion where solder bonding is not performed, and there is a problem that costs increase.
Next, a method for manufacturing the carriage assembly 10 according to the embodiment of the present invention will be described.
First, a predetermined amount of solder 5 is placed on the connecting portion 11 of the carriage 1, the connecting portion 21 of the suspension 2, or both. In the present embodiment, the solder 5 is placed in a solder dam 15 (described later) of the connecting portion 11 of the carriage 1. As the solder 5, solder (for example, “Cerasolzer”: registered trademark of Kuroda Techno Co., Ltd.) that is bonded by applying ultrasonic waves of a predetermined frequency in a heating environment and that can be dissociated by reheating is used. .
Next, as shown in FIG. 1, the carriage 1 and the suspension 2 are positioned and fixed at predetermined positions so that the connecting portion 21 of the suspension 2 and the connecting portion 11 of the carriage 1 are aligned. In FIG. 1, only one suspension 2 is shown for simplification of the drawing.
In the present embodiment, as shown in FIG. 2, the carriage 1 and the suspension 2 are fixed by being clamped by the upper clamp portion 31 and the lower clamp portion 32. At this time, the clamping force can be exerted on the entire vertical direction by inserting the block 33 with a heating mechanism between the back surfaces of the connection portion 21 of the suspension 2 (the surface not connected to the carriage 1). At the same time, a heating mechanism is provided to heat the solder 5.
Here, the strength to clamp is set to a strength that allows the carriage 1 and the suspension 2 to slightly move each other when an ultrasonic wave having a predetermined frequency in a subsequent process is applied.
The thickness of the heating mechanism-equipped block 33 is the same as the distance between the back surfaces of the connecting portion 21 of the suspension 2 or the deformation due to the clamp of the arm portion 12 at the carriage tip is within the elastic deformation region. The dimensions are slightly smaller.
Next, in a state where the solder 5 is heated to a predetermined temperature by the block 33 with a heating mechanism, an ultrasonic wave having a predetermined frequency is applied to the carriage 1 by the ultrasonic transducer 34. As shown in FIG. 2, by applying ultrasonic waves from the ultrasonic transducer 34 to the carriage 1 at a position (rear end portion 13) far from the heating location (connecting portion 11), the ultrasonic transducer 34 caused by heat damage is applied. Breakage can be prevented.
Next, the strength of clamping by the upper clamp portion 31 and the lower clamp portion 32 is increased, and the carriage 1 and the suspension 2 are fixed to each other with an immovable strength.
In this state, heating by the heating mechanism-equipped block 33 is stopped, and the solder 5 is cooled to a predetermined temperature.
Through the series of steps described above, the carriage 1 and the suspension 2 are connected by solder bonding.
According to the above method, the carriage 1 and the suspension 2 are often used in a heating environment by using the solder 5 (the special solder as an example), which is often made of a material that is difficult to solder, such as an aluminum alloy or stainless steel. This can be realized by applying an ultrasonic wave below. That is, since heating of the solder 5 and application of ultrasonic waves can be performed at the same time, it is possible to solve the problem of conventional ultrasonic application and solder bonding to only the necessary portions.
In this way, the carriage assembly 10 according to this embodiment shown in FIG. 3 is manufactured.
Here, as a characteristic configuration of the carriage assembly 10 according to the present embodiment, as shown in FIGS. 4A and 4B, solder dams 15 are provided in the connecting portion 11 of the carriage 1 (the solder dams 15 are provided in duplicate). Example of case). 4A is a plan view, and FIG. 4B is a front sectional view.
According to this configuration, after the suspension 2 and the carriage 1 that supports the suspension 2 are connected by soldering, the solder 5 at the outermost periphery can be sealed with the solder 5 at the outermost periphery. . That is, when the solder 5 at the joint is exposed inside the magnetic disk device, the solder 5 after joining is lost and becomes particles in the magnetic disk device, which can be prevented. In order to obtain this effect, at least the solder dam 15 located on the outermost periphery needs to be formed in a continuous peripheral wall shape (see FIG. 4A), but the inner solder dam 15 is not necessarily in a continuous peripheral wall shape. It doesn't have to be.
In addition to the above effect, if the upper end surface 15a of the solder dam 15 and the surface of the connecting portion 21 of the suspension 2 (surface on the side connected to the carriage 1) are fixed, the mounting position does not vary and the height is high. The effect that it can position accurately is also acquired.
In addition, as a modification regarding the structure of the solder dam 15, shapes as shown in FIGS. 5A and 5B are also conceivable (FIG. 5A is a plan view and FIG. 5B is a front sectional view). When a plurality of solder dams 15 are provided in this way, it is possible to cope with an increase / decrease in the amount of solder, so that the effect of adjusting the weight balance by the amount of solder can be obtained.
As described above, in the present embodiment, the solder dam 15 is provided in the connecting portion 11 of the carriage 1. However, the present invention is not limited thereto, and may be provided in the connecting portion 21 of the suspension 2. 11 and the connecting portion 21 of the suspension 2 may be provided.
As a characteristic configuration of the carriage assembly 10 according to the present embodiment, as shown in FIG. 3, a plurality of arm portions 12 are provided at the tip of the carriage 1, and a plurality of suspensions 2 are provided on the arm portions 12. In the structure, the arm portion 12 (in the case of FIG. 3, the central arm portion) in which the coupling portions 11 are provided on both the upper surface and the lower surface is located between the upper surface coupling portion 11 and the lower surface coupling portion 11. A heat insulating material 16 is provided. Instead of the breaker 16, it may be formed in a cavity.
Here, as described above, in the present embodiment, the carriage 1 and the suspension 2 are connected by using the solder 5 that can be dissociated by reheating. 2 is found, it is possible to remove only the suspension 2 from the carriage 1 and replace it with a non-defective suspension 2.
However, like the central arm portion 12 shown in FIG. 3, the arm portion 12 provided with the connecting portions 11 on both the upper surface and the lower surface is subjected to reheating during replacement work of the suspension 2 (for example, the upper surface side). Even with respect to the suspension 2 that does not need to be replaced (for example, the lower surface side), the connecting portion (the connecting portion 11 and the connecting portion 21 and the solder 5 at the relevant portion) is heated, and the dissociation of the joint occurs. Occurs.
With respect to such a problem, an arbitrary connecting portion (the connecting portion 11 and the connecting portion) in the arm portion 12 in which the connecting portions 11 are provided on both the upper surface and the lower surface by the structure in which the heat insulating material 16 (or the cavity) is provided. 21 and only the solder 5) in the corresponding part can be heated to a predetermined junction dissociation temperature, and the solution is possible.
Subsequently, an information storage device according to an embodiment of the present invention will be described.
As an example of the information storage device, a schematic configuration of a magnetic disk device 40 is shown in FIG. The housing 41 of the magnetic disk device 40 has a recording medium (magnetic disk) 42 on which information is recorded, a spindle motor 43 that rotates the magnetic disk 42, and a magnetic head 3 that faces the surface of the magnetic disk 42 in close proximity. The slider 4 (see FIG. 3), the suspension 2 with the head slider 4 bonded to the tip, and the suspension 2 are connected to the tip of the carriage 1 and move along the surface about the arm shaft 44 on the magnetic disk 42. 10, a voice coil motor 45 that drives the carriage assembly 10, and a control circuit 46 that controls the operation of the magnetic disk device 40 are housed. The magnetic disk device 40 records information on the magnetic disk 42 using the magnetic field of the magnetic head 3 and reproduces the information recorded on the magnetic disk 42.
The magnetic disk device 40 includes a plurality of magnetic disks 42 (see FIG. 6), and includes a plurality of magnetic heads 3 that access information to the front and back surfaces of the plurality of magnetic disks 42, respectively. (See FIG. 3). That is, the magnetic disk device 40 is provided with a suspension 2 having a magnetic head 3 at the tip, one for each of the front and back surfaces of the magnetic disk 42, and the plurality of suspensions 2 are connected to the carriage 1. As a result, an operation in which the plurality of magnetic heads 3 move together is performed.
According to the information storage device (magnetic disk device 40) according to the present embodiment having the above-described configuration, the mounting accuracy of the suspension 2 can be increased particularly by providing the carriage assembly 10 having high shape accuracy. Since there is no variation in the flying height of the head slider 4 which records and reproduces information by flying over the magnetic disk 42, it is possible to provide an information storage device with stable output.
As described above, according to the carriage assembly and the manufacturing method thereof according to the present embodiment, it is possible to realize a carriage assembly having high shape accuracy, particularly with respect to the suspension mounting structure.
Further, according to the information storage device provided with the carriage assembly, it is possible to eliminate variations in the flying height of the head slider and stabilize the output.

Claims (6)

  1.  記録媒体に対して情報の記録もしくは再生を行うヘッドを支持するサスペンション、および該サスペンションを支持するキャリッジを備えるキャリッジアッセンブリの製造方法であって、
     前記サスペンションの連結部と前記キャリッジの連結部との間に半田を介在させた状態で、該サスペンションと該キャリッジとを相互に微動可能にクランプして、該半田を加熱すると共に該キャリッジに所定周波数の超音波を印加した後、
     該サスペンションと該キャリッジとを相互に不動にクランプして、該半田の冷却を行い、該サスペンションと該キャリッジとを該半田の接合により連結すること
    を特徴とするキャリッジアッセンブリの製造方法。
    A suspension for supporting a head for recording or reproducing information on a recording medium, and a method for manufacturing a carriage assembly including a carriage for supporting the suspension,
    In a state where solder is interposed between the suspension connecting portion and the carriage connecting portion, the suspension and the carriage are clamped so as to be finely movable with each other, the solder is heated, and a predetermined frequency is applied to the carriage. After applying the ultrasonic wave of
    A method for manufacturing a carriage assembly, wherein the suspension and the carriage are clamped immovably to each other, the solder is cooled, and the suspension and the carriage are connected by joining the solder.
  2.  記録媒体に対して情報の記録もしくは再生を行うヘッドを支持するサスペンションと、該サスペンションを支持するキャリッジとが、半田接合により連結され、
     前記サスペンションの連結部、もしくは前記キャリッジの連結部の少なくとも一方に、連結後における前記半田の密封が可能な半田ダムが設けられること
    を特徴とするキャリッジアッセンブリ。
    A suspension that supports a head that records or reproduces information on a recording medium and a carriage that supports the suspension are connected by solder bonding,
    A carriage assembly, wherein a solder dam capable of sealing the solder after the connection is provided in at least one of the connection part of the suspension or the connection part of the carriage.
  3.  前記サスペンションが複数設けられ、
     前記サスペンションが連結される複数のアーム部が前記キャリッジの先端に設けられ、
     前記アーム部のうち、上面および下面の両面に連結部が設けられる該アーム部は、該上面の連結部と該下面の連結部との間の位置に、断熱材もしくは空洞が設けられること
    を特徴とする請求項2記載のキャリッジアッセンブリ。
    A plurality of the suspensions are provided,
    A plurality of arm portions to which the suspension is connected are provided at the tip of the carriage,
    Among the arm portions, the arm portions provided with connection portions on both the upper surface and the lower surface are provided with a heat insulating material or a cavity at a position between the connection portions on the upper surface and the connection portions on the lower surface. The carriage assembly according to claim 2.
  4.  前記半田は、加熱環境下で、所定周波数の超音波を印加することにより接合可能となること
    を特徴とする請求項2または請求項3記載のキャリッジアッセンブリ。
    4. The carriage assembly according to claim 2, wherein the solder can be joined by applying an ultrasonic wave having a predetermined frequency under a heating environment.
  5.  前記サスペンションと前記キャリッジとは、連結部の再加熱により解離可能な半田接合によって連結されていること
    を特徴とする請求項2~4のいずれか一項記載のキャリッジアッセンブリ。
    The carriage assembly according to any one of claims 2 to 4, wherein the suspension and the carriage are connected to each other by solder joint that can be dissociated by reheating the connecting portion.
  6.  請求項2~5のいずれか一項に記載のキャリッジアッセンブリを備える情報記憶装置。
     
    An information storage device comprising the carriage assembly according to any one of claims 2 to 5.
PCT/JP2008/069182 2008-10-23 2008-10-23 Carriage assembly, method of producing the same, and information storing device WO2010046980A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2008/069182 WO2010046980A1 (en) 2008-10-23 2008-10-23 Carriage assembly, method of producing the same, and information storing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2008/069182 WO2010046980A1 (en) 2008-10-23 2008-10-23 Carriage assembly, method of producing the same, and information storing device

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Publication Number Publication Date
WO2010046980A1 true WO2010046980A1 (en) 2010-04-29

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012238350A (en) * 2011-05-11 2012-12-06 Tdk Corp Head support mechanism
JP2016177857A (en) * 2015-03-20 2016-10-06 Tdk株式会社 Magnetic head device
JP2016177856A (en) * 2015-03-20 2016-10-06 Tdk株式会社 Magnetic head device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03142248A (en) * 1989-10-27 1991-06-18 Brother Ind Ltd Manufacture of ink-jet printing head
JP2005509236A (en) * 2001-11-05 2005-04-07 シーゲイト テクノロジー エルエルシー Load beam attachment attached to the actuator arm

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03142248A (en) * 1989-10-27 1991-06-18 Brother Ind Ltd Manufacture of ink-jet printing head
JP2005509236A (en) * 2001-11-05 2005-04-07 シーゲイト テクノロジー エルエルシー Load beam attachment attached to the actuator arm

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012238350A (en) * 2011-05-11 2012-12-06 Tdk Corp Head support mechanism
US8780501B2 (en) 2011-05-11 2014-07-15 Tdk Corporation Head support mechanism with counter balance and centroid adjustment pads
JP2016177857A (en) * 2015-03-20 2016-10-06 Tdk株式会社 Magnetic head device
JP2016177856A (en) * 2015-03-20 2016-10-06 Tdk株式会社 Magnetic head device

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